Device for adsorbing wafer

Abstract

The invention discloses a device for adsorbing a wafer, and relates to the technical field of wafer production. The device for adsorbing the wafer comprises a platform and a shell fixedly connected to the top of the platform, and further comprises a mounting seat fixed below the platform; and the driving mechanism is arranged below the mounting seat. According to the device for adsorbing the wafer, the wafer can be conveniently grabbed and adsorbed; during adsorption, damage to the wafer caused by too large negative pressure can be avoided, and meanwhile, in the adsorption process, the sealing performance of the negative pressure mechanism can be conveniently detected, and the adsorption effect is ensured; when the negative pressure mechanism leaks, the rotation drive is stopped, meanwhile, friction speed reduction can be conducted on the first rotating shaft, the wafer stops rotating, the wafer is prevented from falling off in the rotating process, friction speed reduction treatment can be conducted on the first rotating shaft after wafer production is completed, and therefore the ring part and the wafer can be rapidly stopped, and the production efficiency is improved. The wafer production quality and efficiency can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer production, and in particular to a device for adsorbing wafers. Background Art

[0002] During the process of gluing or cleaning, the wafer needs to be adsorbed by the suction cup and rotated. It is difficult to clamp the wafer whose two end faces need to be etched, especially for the wafer with only 3 to 5 mm clamping space on the edge. It is extremely difficult to clamp it firmly under high-speed rotation. At the same time, when the adsorption device leaks, the adsorption force will become smaller. At this time, it is not easy to be discovered in time, making it easy for the wafer to detach under high-speed rotation, resulting in damage to the wafer. Moreover, after the gluing or cleaning is completed, when the power of the rotation drive is disconnected, the wafer will continue to rotate for a period of time due to inertia, thereby affecting the production efficiency of the wafer. Summary of the invention

[0003] The object of the present invention is to provide a device for adsorbing wafers to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a device for adsorbing wafers, comprising a platform and a shell fixedly connected to the top of the platform, and further comprising:

[0005] A mounting base, fixed below the platform;

[0006] A driving mechanism is disposed below the mounting seat, and a first rotating shaft is connected to the driving mechanism for driving the first rotating shaft to rotate, wherein the upper end of the first rotating shaft penetrates into the housing;

[0007] A second rotating shaft, sleeved on a side wall of the first rotating shaft and fixed to the side wall of the first rotating shaft through a stop ring;

[0008] a ring portion, sleeved on the side wall of the second rotating shaft and fixed to the side wall of the second rotating shaft through a plurality of ribs;

[0009] Two adsorption parts are fixed on the top of the ring part, and a negative pressure groove is opened on the top of each adsorption part;

[0010] A first seal is disposed in the second rotating shaft and sleeved on a side wall of the first rotating shaft;

[0011] A second seal is sleeved on the side wall of the first rotating shaft and is arranged in the mounting seat, the second seal is provided with an opening, and a spring sheet is arranged in the opening;

[0012] The negative pressure mechanism is arranged on the side wall of the mounting seat and is used to generate negative pressure in the negative pressure groove.

[0013] Preferably, the negative pressure mechanism comprises:

[0014] A first pipeline is arranged between the first rotating shaft and the mounting seat and is arranged in an annular shape;

[0015] An air inlet connector, disposed on a side wall of the mounting seat and connected to the first pipeline;

[0016] A main pipe is disposed in the first rotating shaft and is connected to the first pipeline through a plurality of air inlet branch pipes, and the upper end of the main pipe is disposed through the top of the first rotating shaft;

[0017] A second pipeline is disposed in the second rotating shaft and is connected to the main pipeline;

[0018] The third pipeline is arranged in each of the ribs and is connected to the bottom of the negative pressure groove through the air outlet. One end of the third pipeline away from the air outlet is connected to the second pipeline.

[0019] Preferably, the driving mechanism comprises:

[0020] A protective sheath fixedly mounted on a side wall of the mounting seat;

[0021] A rotary drive is fixed below the protective sheath, and an output end of the rotary drive is fixed to the lower end of the first rotating shaft through a coupling;

[0022] The bearing is arranged in the mounting seat and fixedly sleeved on the side wall of the first rotating shaft.

[0023] Preferably, it also includes:

[0024] A pressure detection mechanism, disposed on the side wall of the first rotating shaft, for detecting the pressure in the main pipe;

[0025] The pressure detection mechanism comprises:

[0026] A fixed pipe, fixed to the side wall of the first rotating shaft and connected to the main pipe;

[0027] A first reset mechanism is disposed at the end of the fixed tube, and a piston is connected to the first reset mechanism to guide and reset the movement of the piston, and the piston is inserted in the fixed tube;

[0028] A support plate, fixed to the side wall of the fixed tube;

[0029] A pointer, which rotates on the side wall of the support plate through a rotating rod;

[0030] An arc-shaped scale plate is fixed to the top of the fixed tube through a fixing block, so that the pointer can slide on the side wall of the arc-shaped scale plate;

[0031] An identification component, disposed on the side wall of the pointer, for identifying the scale indicated by the pointer;

[0032] The driving assembly is arranged on the side wall of the rotating rod and is used for driving the rotating rod to rotate.

[0033] Preferably, the first reset mechanism comprises:

[0034] Two first T-shaped guide rods fixed to the ends of the fixed tube;

[0035] A sliding block, sleeved on the side wall of the first T-shaped guide rod and fixed to the end of the piston through a connecting rod;

[0036] Two first elastic members are sleeved on the side walls of the first T-shaped guide rod, and the first elastic members are located between the sliding block and the fixed tube.

[0037] Preferably, the identification component comprises:

[0038] The visual sensor is fixed to the side wall of the pointer through an L-shaped block.

[0039] Preferably, the driving assembly comprises:

[0040] A gear fixedly sleeved on the side wall of the rotating rod;

[0041] The moving mechanism is arranged on the side wall of the support plate, and the first moving mechanism is connected with a rack for moving the rack, and the rack is meshed with the gear.

[0042] Preferably, the moving mechanism comprises:

[0043] Two guide rods are fixed to the side wall of the support plate through a connecting block, and one end of the guide rod away from the connecting block is fixedly connected to a stopper;

[0044] Two sliding blocks are sleeved on the side walls of the two guide rods and fixed on the side walls of the racks, and the racks are fixed on the top of the sliding blocks through connecting plates.

[0045] Preferably, it also includes:

[0046] A speed reduction mechanism, disposed above the mounting seat, for reducing speed of the first rotating shaft;

[0047] The deceleration mechanism comprises:

[0048] A fixing plate, fixed above the mounting seat;

[0049] A second reset mechanism is arranged on the side wall of the fixed plate, and an arc-shaped friction plate is connected to the second reset mechanism to guide and reset the movement of the friction plate;

[0050] An electromagnet, fixed to the side wall of the fixing plate and electrically connected to the visual sensor;

[0051] The iron block is fixed to the side wall of the friction plate and is arranged opposite to the electromagnet.

[0052] Preferably, the second reset mechanism comprises:

[0053] Two second T-shaped guide rods are inserted into the side wall of the fixing plate and fixed to the side wall of the friction plate;

[0054] Two second elastic members are sleeved on the side walls of the two second T-shaped guide rods, and the second elastic members are located between the fixing plate and the friction plate.

[0055] Compared with the prior art, the present invention has the following beneficial effects:

[0056] (1) This device for adsorbing wafers is provided with a negative pressure mechanism, etc. When the wafer needs to be adsorbed, the wafer is first placed on the adsorption part at the top of the ring part, and then the air inlet connector is connected to the pipeline of the external negative pressure device, so that the air can be exhausted. At this time, the air in the negative pressure tank can be exhausted through the air outlet, the second pipeline, the main pipeline, the air inlet branch pipeline and the first pipeline, so that negative pressure is formed in the negative pressure tank, so that the wafer can be grasped and adsorbed, making the adsorption more convenient and quick. In addition, the adsorption part is a symmetrical structure to ensure the balance of grasping. Then, the rotary drive is started, and the rotation of the rotary drive drives the first rotating shaft to rotate through the coupling, so that the second rotating shaft and the ring part can be driven to rotate through the stop ring, and then the wafer can be driven to rotate. At the same time, glue or cleaning liquid can be sprayed in the shell.

[0057] (2) This device for adsorbing wafers is provided with a detection mechanism, etc., so that when the wafers are adsorbed, negative pressure is also generated in the main pipe. At the same time, under the action of the negative pressure, the piston can slide inward along the fixed pipe. At the same time, the sliding block is driven by the connecting rod to move along the first T-shaped guide rod, and the first elastic member is compressed. Moreover, when the sliding block moves, the connecting plate can drive the rack to move in the direction close to the connecting block, thereby pushing the gear and the rotating rod to rotate clockwise and driving the pointer to rotate. At this time, the size of the negative pressure can be determined by detecting the scale on the arc-shaped scale plate indicated by the pointer through the visual sensor. When the negative pressure requirement is reached, the air extraction operation is stopped, thereby avoiding damage to the wafer caused by excessive negative pressure and ensuring the adsorption effect. Moreover, during the adsorption process, the sealing of the entire negative pressure mechanism can be determined by observing whether the scale of the arc-shaped scale plate indicated by the pointer becomes smaller through the visual sensor, thereby ensuring the adsorption effect.

[0058] (3) This device for adsorbing wafers is provided with a deceleration mechanism, etc. When the visual sensor detects that the scale of the arc-shaped scale plate indicated by the pointer becomes smaller, it indicates that the negative pressure mechanism has a leak. At this time, the rotation drive is stopped. At the same time, the electromagnet is powered off and the iron block is no longer adsorbed. The friction plate can be abutted against the side wall of the first rotating shaft under the action of the second elastic member, and the first rotating shaft can be frictionally decelerated, so that the second rotating shaft and the ring part can be quickly decelerated and stopped, thereby stopping the rotation of the wafer, avoiding the wafer from falling during the rotation process due to insufficient adsorption force, thereby ensuring the production quality of the wafer. Moreover, after the wafer production is completed, the first rotating shaft can also be frictionally decelerated, so that the ring part and the wafer can be quickly stopped, thereby improving the production efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0060] Figure 2 It is a partial cross-sectional structural schematic diagram of the present invention;

[0061] Figure 3 It is a structural schematic diagram of the driving mechanism in the present invention;

[0062] Figure 4 It is a structural schematic diagram of the negative pressure mechanism in the present invention;

[0063] Figure 5 It is a structural schematic diagram of the negative pressure mechanism in the present invention from another perspective;

[0064] Figure 6 It is a schematic cross-sectional structure diagram of the second rotating shaft, the ring portion and the rib portion in the present invention;

[0065] Figure 7 It is a schematic diagram of the structure of the detection mechanism and the speed reduction mechanism in the present invention;

[0066] Figure 8 for Figure 2 A schematic diagram of the enlarged structure at A in the middle;

[0067] Fig. 9 for Figure 7 A schematic diagram of the enlarged structure at B in the middle;

[0068] Fig.10 for Figure 8 Schematic diagram of the enlarged structure at point C in the middle.

[0069] In the figure: 1, platform; 201, first pipeline; 202, air inlet branch pipe; 203, air inlet joint; 204, main pipe; 205, second pipeline; 206, third pipeline; 207, air outlet; 301, protective sheath; 302, rotary drive; 303, bearing; 304, coupling; 401, fixed pipe; 402, piston; 403, support plate; 404, rotating rod; 405, pointer; 406, fixed block; 407, arc scale plate; 501, L-shaped block; 502, visual sensor; 601, fixed plate; 602, friction plate; 603, iron block; 604, Electromagnet; 701, second T-shaped guide rod; 702, second elastic member; 801, first T-shaped guide rod; 802, sliding block; 803, connecting rod; 804, first elastic member; 901, gear; 902, rack; 1001, connecting block; 1002, guide rod; 1003, slider; 1004, stopper; 1005, connecting plate; 11, mounting seat; 12, first rotating shaft; 13, second rotating shaft; 14, stop ring; 15, rib portion; 16, ring portion; 17, adsorption portion; 18, first seal; 19, negative pressure groove; 20, second seal; 21, opening; 22, housing. DETAILED DESCRIPTION

[0070] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0071] See also Figure 1-Figure 10 The present invention provides a device for adsorbing wafers, comprising a platform 1 and a housing 22 fixedly connected to the top of the platform 1, and further comprising:

[0072] The mounting base 11 is fixed below the platform 1 .

[0073] The driving mechanism is disposed below the mounting seat 11 , and the driving mechanism is connected to the first rotating shaft 12 for driving the first rotating shaft 12 to rotate. The upper end of the first rotating shaft 12 penetrates into the housing 22 .

[0074] The second rotating shaft 13 is sleeved on the side wall of the first rotating shaft 12 and fixed to the side wall of the first rotating shaft 12 through a stop ring 14. The stop ring 14 is fixedly connected to the first rotating shaft 12 and clamped with the second rotating shaft 13 to achieve circumferential fixation between the first rotating shaft 12 and the second rotating shaft 13.

[0075] The ring portion 16 is sleeved on the side wall of the second rotating shaft 13 and fixed to the side wall of the second rotating shaft 13 through a plurality of ribs 15. The plurality of ribs 15 are evenly spaced around the second rotating shaft 13 to ensure structural strength and rotational balance.

[0076] Two adsorption parts 17 are fixed on the top of the ring part 16, and a negative pressure groove 19 is opened on the top of each adsorption part 17. The adsorption part 17 is an arc-shaped structure, and the negative pressure groove 19 is a strip-shaped structure.

[0077] The first seal 18 is disposed in the second rotating shaft 13 and sleeved on the side wall of the first rotating shaft 12 .

[0078] The second seal 20 is sleeved on the side wall of the first rotating shaft 12 and is arranged in the mounting seat 11. An opening 21 is opened on the second seal 20. The opening 21 is similar to a V-shape, and a spring sheet is arranged in the opening 21, so that the second seal 20 has elastic deformation, which helps the second seal 20 to abut against the outer wall of the first rotating shaft 12 to achieve effective sealing. The second seal 20 can be positioned in the axial direction by using a cover, a retaining ring or other structures to crimp it onto the end face of the mounting seat 11.

[0079] The negative pressure mechanism is arranged on the side wall of the mounting seat 11 and is used to generate negative pressure in the negative pressure groove 19, which can realize the grabbing and adsorption of the wafer, making the adsorption more convenient and quick. During adsorption, it is convenient to control the size of the negative pressure to avoid damage to the wafer caused by excessive negative pressure. At the same time, during the adsorption process, it is convenient to detect the sealing of the negative pressure mechanism to ensure the adsorption effect. When the negative pressure mechanism leaks, the rotation drive 302 is shut down. At the same time, the first rotating shaft 12 can be frictionally decelerated, so that the second rotating shaft 13 and the ring part 16 can be quickly decelerated and stopped, and then the wafer stops rotating, so as to avoid the wafer falling during the rotation process due to insufficient adsorption force, and ensure the production quality of the wafer. Moreover, after the wafer production is completed, the first rotating shaft 12 can also be frictionally decelerated, so that the ring part 16 and the wafer can be quickly stopped, which can improve the production efficiency of the wafer.

[0080] See also Figure 4-Figure 6 , Figure 8 and Fig.10 , negative pressure mechanisms include:

[0081] The first pipeline 201 is disposed between the first rotating shaft 12 and the mounting seat 11 and is arranged in a ring shape.

[0082] The air inlet connector 203 is disposed on the side wall of the mounting base 11 and communicated with the first pipeline 201 .

[0083] The main pipe 204 is disposed in the first rotating shaft 12 and is connected to the first pipeline 201 through a plurality of air intake branch pipes 202 . The upper end of the main pipe 204 passes through the top of the first rotating shaft 12 .

[0084] The second pipeline 205 is disposed in the second rotating shaft 13 and communicated with the main pipeline 204 .

[0085] The third pipeline 206 is arranged in each rib 15 and is connected to the bottom of the negative pressure groove 19 through the air outlet 207. The end of the third pipeline 206 away from the air outlet 207 is connected to the second pipeline 205. When the wafer needs to be adsorbed, the wafer is first placed on the adsorption part 17 at the top of the ring part 16, and then the air inlet connector 203 is connected to the pipeline of the external negative pressure equipment, so that the air extraction operation can be performed. At this time, the air in the negative pressure groove 19 can be extracted through the air outlet 207, the second pipeline 205, the main pipe 204, the air inlet branch pipe 202 and the first pipeline 201, so that negative pressure is formed in the negative pressure groove 19, so that the wafer can be grasped and adsorbed, making the adsorption more convenient and quick. In addition, the adsorption part 17 is a symmetrical structure to ensure the grasping balance. Considering the weight reduction and adsorption effect of the suction cup, the number of air outlets 207 or ribs 15 is set to six, but the number can also be other.

[0086] See also Figure 3 , Figure 8 and Fig.10 , the driving mechanism includes:

[0087] The protective sheath 301 is fixedly mounted on the side wall of the mounting seat 11 .

[0088] The rotary drive 302 is fixed below the protective sheath 301 , and the output end of the rotary drive 302 is fixed to the lower end of the first rotating shaft 12 through a coupling 304 .

[0089] The bearing 303 is arranged in the mounting seat 11 and fixedly sleeved on the side wall of the first rotating shaft 12. The rotary drive 302 is started. The rotation of the rotary drive 302 drives the first rotating shaft 12 to rotate through the coupling 304, thereby driving the second rotating shaft 13 and the ring portion 16 to rotate through the stop ring 14, and then driving the wafer to rotate. At the same time, glue or cleaning liquid can be sprayed in the outer shell 22.

[0090] See also Figure 7 and Fig.10 In this embodiment, the device for adsorbing the wafer further includes:

[0091] The pressure detection mechanism is disposed on the side wall of the first rotating shaft 12 and is used to detect the pressure in the main pipe 204 .

[0092] Pressure testing agencies include:

[0093] The fixed pipe 401 is fixed to the side wall of the first rotating shaft 12 and communicated with the main pipe 204 .

[0094] The first reset mechanism is disposed at the end of the fixed tube 401 , and a piston 402 is connected to the first reset mechanism for guiding and resetting the movement of the piston 402 . The piston 402 is inserted in the fixed tube 401 .

[0095] The support plate 403 is fixed to the side wall of the fixed tube 401 .

[0096] The pointer 405 is rotated on the side wall of the support plate 403 via the rotating rod 404 .

[0097] The arc-shaped scale plate 407 is fixed to the top of the fixed tube 401 through the fixing block 406 , so that the pointer 405 can slide on the side wall of the arc-shaped scale plate 407 .

[0098] The identification component is arranged on the side wall of the pointer 405 and is used to identify the scale indicated by the pointer 405 .

[0099] The driving component is arranged on the side wall of the rotating rod 404, and is used to drive the rotating rod 404 to rotate. When the wafer is adsorbed, negative pressure will also be generated in the main pipe 204. At the same time, under the action of the negative pressure, the piston 402 can slide inward along the fixed tube 401. At the same time, the driving component drives the rotating rod 404 to rotate clockwise, and drives the pointer 405 to rotate. At this time, the size of the negative pressure can be determined by detecting the scale on the arc scale plate 407 indicated by the pointer 405 through the identification component. When the negative pressure requirement is reached, the vacuum operation is stopped, thereby avoiding damage to the wafer caused by excessive negative pressure and ensuring the adsorption effect. In addition, during the adsorption process, the sealing of the entire negative pressure mechanism can be determined by observing whether the scale of the arc scale plate 407 indicated by the pointer 405 becomes smaller through the identification component, thereby ensuring the adsorption effect.

[0100] See also Fig. 9 , the first reset mechanism comprises:

[0101] Two first T-shaped guide rods 801 are fixed to the ends of the fixed tube 401 .

[0102] The sliding block 802 is sleeved on the side wall of the first T-shaped guide rod 801 and fixed to the end of the piston 402 through a connecting rod 803 .

[0103] Two first elastic members 804 are sleeved on the side walls of the first T-shaped guide rod 801 . The first elastic members 804 can be springs and are located between the sliding block 802 and the fixed tube 401 . The two ends of the first elastic members 804 are fixed to the sliding block 802 and the fixed tube 401 respectively.

[0104] See also Fig. 9 , the identification components include:

[0105] The visual sensor 502 is fixed to the side wall of the pointer 405 through the L-shaped block 501, and plays a guiding and resetting role for the movement of the piston 402.

[0106] See also Figure 1 , the drive components include:

[0107] The gear 901 is fixedly sleeved on the side wall of the rotating rod 404 .

[0108] The moving mechanism is arranged on the side wall of the support plate 403, and the first moving mechanism is connected with a rack 902 for moving the rack 902. The rack 902 is meshed with the gear 901. The rack 902 is driven to move by the first moving mechanism, thereby pushing the gear 901 and the rotating rod 404 to rotate clockwise.

[0109] See also Fig. 9 , the mobile mechanism includes:

[0110] The two guide rods 1002 are fixed to the side wall of the support plate 403 through the connecting block 1001 , and a stopper 1004 is fixedly connected to one end of the guide rod 1002 away from the connecting block 1001 .

[0111] The two sliders 1003 are sleeved on the side walls of the two guide rods 1002 and fixed on the side walls of the rack 902. The rack 902 is fixed to the top of the sliding block 802 through the connecting plate 1005. Under the action of negative pressure, the piston 402 can slide inward along the fixed tube 401. At the same time, the sliding block 802 is driven to move along the first T-shaped guide rod 801 through the connecting rod 803. The first elastic member 804 is compressed, and when the sliding block 802 moves, it can drive the rack 902 to move toward the connecting block 1001 through the connecting plate 1005.

[0112] See also Figure 7 and Fig.10 In this embodiment, the device for adsorbing the wafer further includes:

[0113] The speed reduction mechanism is disposed above the mounting seat 11 and is used to reduce the speed of the first rotating shaft 12 .

[0114] The reduction mechanism includes:

[0115] The fixing plate 601 is fixed on the top of the mounting seat 11 .

[0116] The second reset mechanism is disposed on the side wall of the fixed plate 601 , and is connected to an arc-shaped friction plate 602 for guiding and resetting the movement of the friction plate 602 .

[0117] The electromagnet 604 is fixed to the side wall of the fixing plate 601 and is electrically connected to the visual sensor 502 .

[0118] The iron block 603 is fixed to the side wall of the friction plate 602 and is arranged opposite to the electromagnet 604. When the visual sensor 502 detects that the scale of the arc scale plate 407 indicated by the pointer 405 becomes smaller, it indicates that the negative pressure mechanism has a leak. At this time, the rotation drive 302 is shut down. At the same time, the electromagnet 604 is powered off and no longer adsorbs the iron block 603. The friction plate 602 can be abutted against the side wall of the first rotating shaft 12 under the action of the second reset mechanism, and the first rotating shaft 12 can be frictionally decelerated, so that the second rotating shaft 13 and the ring portion 16 can be quickly decelerated and stopped, thereby stopping the rotation of the wafer, avoiding the wafer from falling during rotation due to insufficient adsorption force, thereby ensuring the production quality of the wafer. Moreover, after the wafer production is completed, the first rotating shaft 12 can also be frictionally decelerated, so that the ring portion 16 and the wafer can be quickly stopped, which can improve the production efficiency of the wafer.

[0119] See also Figure 7 , the second reset mechanism comprises:

[0120] The two second T-shaped guide rods 701 are inserted into the side wall of the fixing plate 601 and fixed to the side wall of the friction plate 602 .

[0121] Two second elastic members 702 are sleeved on the side walls of the two second T-shaped guide rods 701. The second elastic members 702 can be springs, and the second elastic members 702 are located between the fixed plate 601 and the friction plate 602. The two ends of the second elastic member 702 are respectively fixed to the fixed plate 601 and the friction plate 602, which guide and reset the movement of the friction plate 602. During normal rotation, the electromagnet 604 is energized to attract the iron block 603, so that the friction plate 602 is separated from the first rotating shaft 12, and at the same time, the second elastic member 702 is compressed.

[0122] Working principle: During use, when the wafer needs to be adsorbed, first place the wafer on the adsorption part 17 at the top of the ring part 16, then connect the air inlet connector 203 to the pipeline of the external negative pressure equipment, so that the vacuum operation can be performed. At this time, the air in the negative pressure tank 19 can be extracted through the air outlet 207, the second pipeline 205, the main pipeline 204, the air inlet branch pipe 202 and the first pipeline 201, so that negative pressure is formed in the negative pressure tank 19, so that the wafer can be grasped and adsorbed, making the adsorption more convenient and quick, and the adsorption part 17 is a symmetrical structure to ensure the grasping balance, and then, start the rotary drive 302, the rotation of the rotary drive 302 drives the first rotating shaft 12 to rotate through the coupling 304, so that the second rotating shaft 13 and the ring part 16 can be driven to rotate through the stop ring 14, and then the wafer can be driven to rotate, and at the same time, glue or cleaning liquid can be sprayed in the outer shell 22.

[0123] When the wafer is adsorbed, negative pressure is also generated in the main pipe 204. At the same time, under the action of the negative pressure, the piston 402 can slide inward along the fixed pipe 401. At the same time, the sliding block 802 is driven to move along the first T-shaped guide rod 801 through the connecting rod 803, and the first elastic member 804 is compressed. When the sliding block 802 moves, the rack 902 can be driven to move toward the connecting block 1001 through the connecting plate 1005, so that the gear 901 and the rotating rod 404 can be pushed to rotate. Rotate clockwise and drive the pointer 405 to rotate. At this time, the size of the negative pressure can be determined by detecting the scale on the arc-shaped scale plate 407 indicated by the pointer 405 through the visual sensor 502. When the negative pressure requirement is reached, the vacuum operation is stopped to avoid damage to the wafer due to excessive negative pressure and ensure the adsorption effect. In addition, during the adsorption process, the sealing of the entire negative pressure mechanism can be determined by observing whether the scale of the arc-shaped scale plate 407 indicated by the pointer 405 becomes smaller through the visual sensor 502 to ensure the adsorption effect.

[0124] Furthermore, when the visual sensor 502 detects that the scale of the arc-shaped scale plate 407 indicated by the pointer 405 becomes smaller, it indicates that the negative pressure mechanism has a leak. At this time, the rotary drive 302 is shut down. At the same time, the electromagnet 604 is powered off and no longer adsorbs the iron block 603. The friction plate 602 can be abutted against the side wall of the first rotating shaft 12 under the action of the second elastic member 702, and the first rotating shaft 12 can be frictionally decelerated, so that the second rotating shaft 13 and the ring portion 16 can be quickly decelerated and stopped, thereby stopping the rotation of the wafer, avoiding the wafer from falling during rotation due to insufficient adsorption force, thereby ensuring the production quality of the wafer. Moreover, after the wafer production is completed, the first rotating shaft 12 can also be frictionally decelerated, so that the ring portion 16 and the wafer can be quickly stopped, thereby improving the production efficiency of the wafer.

Claims

1. A device for adsorbing wafers, comprising a platform (1) and a housing (22) fixedly connected to the top of the platform (1), characterized in that: Also includes: A mounting seat (11) fixed below the platform (1); A driving mechanism is arranged below the mounting seat (11), and the driving mechanism is connected to a first rotating shaft (12) for driving the first rotating shaft (12) to rotate, wherein the upper end of the first rotating shaft (12) penetrates into the housing (22); A second rotating shaft (13) is sleeved on the side wall of the first rotating shaft (12) and fixed to the side wall of the first rotating shaft (12) via a stop ring (14); A ring portion (16) is sleeved on the side wall of the second rotating shaft (13) and fixed to the side wall of the second rotating shaft (13) through a plurality of ribs (15); Two adsorption parts (17) are fixed on the top of the ring part (16), and a negative pressure groove (19) is provided on the top of each adsorption part (17); A first seal (18) is disposed in the second rotating shaft (13) and sleeved on the side wall of the first rotating shaft (12); A second seal (20) is sleeved on the side wall of the first rotating shaft (12) and is disposed in the mounting seat (11); an opening (21) is formed on the second seal (20), and a spring sheet is disposed in the opening (21); The negative pressure mechanism is arranged on the side wall of the mounting seat (11) and is used to generate negative pressure in the negative pressure groove (19).

2. The device for adsorbing wafers according to claim 1, characterized in that: The negative pressure mechanism comprises: A first pipeline (201) is arranged between the first rotating shaft (12) and the mounting seat (11) and is arranged in an annular shape; An air inlet connector (203) is arranged on a side wall of the mounting seat (11) and is in communication with the first pipeline (201); A main pipe (204) is arranged in the first rotating shaft (12) and is connected to the first pipeline (201) through a plurality of air intake branch pipes (202), and the upper end of the main pipe (204) is arranged to pass through the top of the first rotating shaft (12); A second pipeline (205) is disposed in the second rotating shaft (13) and is in communication with the main pipeline (204); The third pipeline (206) is arranged in each of the ribs (15) and is connected to the bottom of the negative pressure groove (19) through the air outlet (207); one end of the third pipeline (206) away from the air outlet (207) is connected to the second pipeline (205).

3. The device for adsorbing wafers according to claim 1, characterized in that: The driving mechanism comprises: A protective sheath (301) fixedly sleeved on a side wall of the mounting seat (11); A rotary drive (302) is fixed below the protective sheath (301), and an output end of the rotary drive (302) is fixed to the lower end of the first rotating shaft (12) via a coupling (304); The bearing (303) is arranged in the mounting seat (11) and is fixedly sleeved on the side wall of the first rotating shaft (12).

4. The device for adsorbing wafers according to claim 1, characterized in that: Also includes: a pressure detection mechanism, arranged on a side wall of the first rotating shaft (12), and used for detecting the pressure in the main pipe (204); The pressure detection mechanism comprises: A fixed pipe (401), fixed to the side wall of the first rotating shaft (12) and connected to the main pipe (204); A first reset mechanism is arranged at the end of the fixed tube (401), and a piston (402) is connected to the first reset mechanism for guiding the movement and resetting the piston (402), and the piston (402) is inserted in the fixed tube (401); A support plate (403) fixed to a side wall of the fixed tube (401); A pointer (405) is rotated on the side wall of the support plate (403) via a rotating rod (404); The arc-shaped scale plate (407) is fixed to the top of the fixed tube (401) through a fixed block (406), so that the pointer (405) can slide on the side wall of the arc-shaped scale plate (407); An identification component, arranged on a side wall of the pointer (405), and used for identifying the scale indicated by the pointer (405); The driving assembly is arranged on the side wall of the rotating rod (404) and is used to drive the rotating rod (404) to rotate.

5. The device for adsorbing wafers according to claim 4, characterized in that: The first reset mechanism comprises: Two first T-shaped guide rods (801) fixed to the ends of the fixed tube (401); A sliding block (802) is sleeved on the side wall of the first T-shaped guide rod (801) and fixed to the end of the piston (402) through a connecting rod (803); Two first elastic members (804) are sleeved on the side walls of the first T-shaped guide rod (801), and the first elastic members (804) are located between the sliding block (802) and the fixed tube (401).

6. The device for adsorbing wafers according to claim 4, characterized in that: The identification component comprises: The visual sensor (502) is fixed to the side wall of the pointer (405) through an L-shaped block (501).

7. The device for adsorbing wafers according to claim 5, characterized in that: The drive assembly comprises: A gear (901) is fixedly sleeved on a side wall of the rotating rod (404); The moving mechanism is arranged on the side wall of the support plate (403), and the first moving mechanism is connected with a rack (902) for moving the rack (902), and the rack (902) is meshed with the gear (901).

8. The device for adsorbing wafers according to claim 7, characterized in that: The moving mechanism comprises: Two guide rods (1002) are fixed to the side wall of the support plate (403) through a connecting block (1001), and one end of the guide rod (1002) away from the connecting block (1001) is fixedly connected to a stopper (1004); The two sliding blocks (1003) are sleeved on the side walls of the two guide rods (1002) and fixed to the side walls of the rack (902). The rack (902) is fixed to the top of the sliding block (802) through a connecting plate (1005).

9. The device for adsorbing wafers according to claim 6, characterized in that: Also includes: A speed reduction mechanism, arranged above the mounting seat (11), and used for reducing the speed of the first rotating shaft (12); The deceleration mechanism comprises: A fixing plate (601) fixed above the mounting seat (11); A second reset mechanism is arranged on the side wall of the fixed plate (601), and the second reset mechanism is connected to an arc-shaped friction plate (602) for guiding the movement and resetting the friction plate (602); An electromagnet (604) fixed to a side wall of the fixing plate (601) and electrically connected to the visual sensor (502); The iron block (603) is fixed to the side wall of the friction plate (602) and is arranged opposite to the electromagnet (604).

10. The device for adsorbing wafers according to claim 9, characterized in that: The second reset mechanism comprises: Two second T-shaped guide rods (701) are inserted into the side wall of the fixing plate (601) and fixed to the side wall of the friction plate (602); The two second elastic members (702) are sleeved on the side walls of the two second T-shaped guide rods (701), and the second elastic members (702) are located between the fixing plate (601) and the friction plate (602).

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