Radiator for semiconductor

Abstract

The invention relates to the field of semiconductor radiators, and discloses a radiator for semiconductors, which comprises a support, a plurality of radiating fins are arranged at the bottom of the support, a radiating fan is arranged at the top of the support, connecting rods are rotatably arranged on one side of the front surface and one side of the back surface of the support, and knobs penetrate through the front surfaces of the connecting rods. An auxiliary structure is arranged on one side of the two connecting rods, the auxiliary structure comprises a shell, a ventilation groove is formed in the shell, and an air collection groove is formed in one side of the inner wall of the shell. When the shell is opened, a part of wind power generated by the cooling fan is borrowed through the choke plate, so that the cooling bottom plate discharges wind to assist the cooling fins in rapidly dissipating heat, secondary heat dissipation is carried out to assist in accelerating the heat dissipation speed, one shell has two purposes, and the working modes can be freely switched according to conditions.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor radiators, in particular to a radiator used for semiconductors. Background Art

[0002] The patent application with application announcement number CN203351580U includes: a heat sink, characterized in that: the heat sink is provided with heat dissipation plates above and below, the heat sink and the heat dissipation plates are hollow structures connected, the heat dissipation plates are provided with round tubes connected with the hollow structure, the round tubes are provided with medium tubes and exhaust pipes, the medium tubes are used to inject cooling medium into the hollow structure, and the exhaust pipes are used to discharge the gas in the hollow structure. The advantages are: a semiconductor heat sink with such a structure has the advantages of better heat dissipation effect and convenient use.

[0003] In the prior art including the above-mentioned patents, commonly used semiconductor heat sinks need to be equipped with fans in addition to the heat sink body to assist in heat dissipation. The fan rotates to discharge the heat absorbed by the heat sink to the outside, but the suction force of the fan is limited after all and cannot bring out much heat. The suction force will also suck dust and flying debris into the heat sink. Due to the narrow space inside the heat sink, dust is easily attached. After a lot of dust accumulates, the heat dissipation effect of the heat sink will be affected. Even if it is manually disassembled and cleaned later, it will take a long time. Summary of the invention

[0004] The problem to be solved by the present invention is that the temperature of the heat sink in the semiconductor heat sink is relatively high, the heat dissipation efficiency of a single fan is low, and dust is easily attached to the heat sink, which affects the heat dissipation performance.

[0005] In order to solve the above technical problems, the technical solution of the present invention is: a heat sink for semiconductors, comprising a support, a plurality of heat dissipation fins are arranged at the bottom of the support, a heat dissipation fan is arranged at the top of the support, connecting rods are rotatably arranged on one side of the front and back sides of the support, a knob is passed through the front side of the connecting rod, and auxiliary structures are arranged on one side of the two connecting rods; The auxiliary structure includes an outer shell, a ventilation slot is provided inside the outer shell, an air collecting slot is provided on one side of the inner wall of the outer shell, a plurality of air guide slots are radially provided around the air collecting slot, and an air inlet is fixedly connected to one side of the ventilation slot.

[0006] Preferably, a moving block is slidably provided on the top of the shell, a limiting screw passes through the top of the moving block, a movable cover is fixedly provided on one side of the moving block, a through groove is opened on one side of the bottom of the movable cover, and the through groove is adapted to one of the ventilation slots.

[0007] Preferably, a connecting pipe is fixedly connected to the bottom of the inner wall of the shell, inclined blocks are fixedly provided at the dead corners inside the shell, and L-shaped sliding grooves are provided on the front and back of the inner wall of the shell.

[0008] Preferably, a wind block plate is fixedly provided on the top of the inner wall of the shell, the wind block plate is telescopic, and fixing screws penetrate the front and rear sides of the top of the wind block plate.

[0009] Preferably, a cleaning tube runs through the interior of the heat dissipation fin, a stabilizing frame is fixedly provided on one side of the support, the stabilizing frame is adapted to the cleaning tube, and the outer diameter of the cleaning tube is the same as the inner diameter of the movable cover.

[0010] Preferably, the bottom of the cleaning tube is arranged in a straight line with a plurality of rotating rings equidistantly, the rotating rings are provided with air holes fixedly connected to the cleaning tube, and the outside of the rotating rings is fixedly connected to a cleaning head in a circular array.

[0011] Preferably, a sealing piece is fixedly provided on one side of the top of the support, a heat dissipation base plate is provided at the bottom of the support, a plurality of air outlet pipes are arrayed on the top of the heat dissipation base plate, and a connecting pipe is fixedly connected to one side of the heat dissipation base plate.

[0012] Compared with the prior art, the technical solution of the present invention has the following advantages: (1) The support is provided with a shell that can be switched into two forms. The shell can clean the dust in the gaps of the heat sink fins in a closed state. When the shell is in an open state, the shell can borrow part of the wind force generated by the heat sink fan through the wind baffle plate, so that the heat sink bottom plate can discharge air to assist the heat sink fins to dissipate heat quickly, and perform secondary heat dissipation to accelerate the heat dissipation speed, so that one shell can be used for two purposes, and the working mode can be freely switched according to actual conditions. The shell is provided with an air collecting slot inside, which can better introduce the air discharged by the heat sink fan into the ventilation slot when the shell is in a closed state. When the shell is in a closed state, it can be connected to the cleaning pipe. After being connected together, the large wind force gathered will be ejected from the cleaning head to the outside through the cleaning pipe, and the ejected wind force will drive the rotating ring to rotate, so that the dust in the gaps between the heat sink fins can be cleaned without dead ends, and the dust can be cleaned up to avoid long-term use of dust accumulation affecting the overall heat dissipation effect of the radiator; (2) A heat dissipation base plate is provided at the bottom of the support. When the outer shell is normally open, the wind baffle can be extended and opened to intercept a part of the wind force, and the wind force is then transported to the bottom of the heat dissipation fins and discharged upward. Compared with the fan relying on its own suction and the active heat dissipation of the heat dissipation fins, the bottom diversion can make the heat dissipation fan more efficient and the temperature of the heat dissipation fins drop faster, thereby improving the heat dissipation effect of the radiator. A blocking block is provided on one side of the connecting pipe on one side of the heat dissipation base plate. The connecting pipe will only be opened when the connecting pipe on the outer shell is connected to it. When the connecting pipe is detached from the connecting pipe, the connecting pipe will become closed again. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a front view schematic diagram of the heat dissipation fin structure of the present invention; Figure 3 This is a schematic diagram of the closed shell structure of the present invention; Figure 4 This is a schematic diagram of the connecting rod structure of the present invention; Figure 5 It is a schematic diagram of the auxiliary structure of the present invention; Figure 6 This is a schematic diagram of the air inlet structure of the present invention; Figure 7 It is a left side schematic diagram of the housing structure of the present invention; Figure 8 It is a bottom view schematic diagram of the housing structure of the present invention; Fig. 9 This is a schematic diagram of the cleaning tube structure of the present invention; Fig.10 This is a schematic diagram of the structure of the rotating ring of the present invention; Fig.11 This is an enlarged schematic diagram of the structure at A of the present invention; Fig.12 This is a schematic diagram of the heat dissipation base structure of the present invention; Fig.13 It is a schematic diagram of the internal structure of the shell of the present invention.

[0014] In the figure: 1. heat dissipation fin; 2. knob; 3. auxiliary structure; 301. fixing screw; 302. wind baffle; 303. shell; 304. movable cover; 305. moving block; 306. limit screw; 307. air guide slot; 308. air inlet; 309. tilting block; 310. connecting pipe; 311. air collecting slot; 312. slide slot; 313. ventilation slot; 4. heat dissipation fan; 5. cleaning pipe; 6. connecting rod; 7. sealing piece; 8. support; 9. stabilizing frame; 10. heat dissipation base plate; 11. air outlet pipe; 12. connecting pipe; 13. rotating ring; 14. cleaning head. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0016] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. "Include" or "comprise" and other similar words used in the present disclosure mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and other similar words are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0017] like Figures 1 to 13 As shown, a heat sink for semiconductors provided by the present invention comprises a support 8, a plurality of heat dissipation fins 1 are provided at the bottom of the support 8, a heat dissipation fan 4 is provided at the top of the support 8, a connecting rod 6 is rotatably provided on one side of the front and back sides of the support 8, a knob 2 is passed through the front side of the connecting rod 6, and an auxiliary structure 3 is provided on one side of the two connecting rods 6; The auxiliary structure 3 includes an outer shell 303, a ventilation slot 313 is provided inside the outer shell 303, a wind collecting slot 311 is provided on one side of the inner wall of the outer shell 303, a plurality of air guide slots 307 are radially provided around the wind collecting slot 311, and an air inlet 308 is fixedly connected to one side of the ventilation slot 313.

[0018] A moving block 305 is slidably provided on the top of the housing 303 , a limiting screw 306 passes through the top of the moving block 305 , a movable cover 304 is fixedly provided on one side of the moving block 305 , a through groove is provided on one side of the bottom of the movable cover 304 , and the through groove is adapted to one of the ventilation grooves 313 .

[0019] The bottom of the inner wall of the outer shell 303 is fixedly connected with a connecting pipe 310, and the dead corners inside the outer shell 303 are fixedly provided with tilting blocks 309. The front and back sides of the inner wall of the outer shell 303 are provided with L-shaped sliding grooves 312. The tilting blocks 309 can cooperate with the air guide grooves 307 to gather wind into the air collecting grooves 311.

[0020] A wind blocking plate 302 is fixedly provided on the top of the inner wall of the housing 303 . The wind blocking plate 302 is telescopic, and fixing screws 301 penetrate the front and rear sides of the top of the wind blocking plate 302 .

[0021] A cleaning tube 5 runs through the interior of the heat dissipation fin 1 , and a stabilizing frame 9 is fixedly provided on one side of the support 8 . The stabilizing frame 9 is adapted to the cleaning tube 5 , and the outer diameter of the cleaning tube 5 is the same as the inner diameter of the movable cover 304 .

[0022] The bottom of the cleaning tube 5 is arranged with a plurality of rotating rings 13 in a straight line and at equal intervals. The rotating rings 13 are provided with air holes, which are fixedly connected to the cleaning tube 5. The outside of the rotating rings 13 is fixedly connected with a cleaning head 14 in a circular array.

[0023] A sealing piece 7 is fixedly provided on one side of the top of the support 8, a heat dissipation base plate 10 is provided at the bottom of the support 8, a plurality of air outlet pipes 11 are arrayed on the top of the heat dissipation base plate 10, and a connecting pipe 12 is fixedly connected to one side of the heat dissipation base plate 10.

[0024] The working principle and use process of the present invention are as follows: when the user needs to perform auxiliary heat dissipation during normal use of the heat dissipation fins 1, the user can first rotate and loosen the knob 2, and after loosening, rotate the housing 303 with the rotation connection between the connecting rod 6 and the support 8 as the center of the circle, and the housing 303 is rotated and opened 90 degrees. After opening, the knob 2 is rotated and tightened to allow the slide groove 312 in the housing 303 to move along the connecting rod 6. After moving to the final position, the housing 303 is vertical and the connecting pipe 310 at the bottom is connected to the connecting pipe 12, and the blocking block on one side of the connecting pipe 12 is pushed open, so that the connecting pipe 310 and the connecting pipe 12 are connected. After the fins 308 are connected to each other, the fixing screws 301 are rotated and loosened. After loosening, the air blocking plate 302 is pulled out and tightened again. Then the cooling fan 4 can be started normally. After the cooling fan 4 is started, the temperature in the cooling fin 1 will be discharged outward. The wind force generated by the cooling fan 4 will be intercepted and blocked by the air blocking plate 302. A part of the blocked wind force will be introduced into the housing 303 and into the air inlet 308. At this time, since the movable cover 304 is in a closed state, one of the ventilation slots 313 is in a closed state. The airflow entering the air inlet 308 will be discharged from the other ventilation slot 313. The wind will enter the heat dissipation base plate 10 and finally be discharged outward from the air outlet pipe 11. The discharged wind can accelerate the discharge of the heat of the heat dissipation fins 1 themselves. In conjunction with the heat dissipation fan 4, heat dissipation can be performed more efficiently. After long-term use, there is a lot of dust remaining in the gaps of the heat dissipation fins 1, which affects the heat dissipation efficiency. The shell 303 can be rotated back to just above the support 8 and covered downward. At the same time, the blocking piece 7 will block the connecting pipe 310. At this time, the movable cover 304 on the other side of the shell 303 will be just above the cleaning pipe 5. Then loosen the limit screw 306 and push the moving block downward. 305, while the movable cover 304 is docked with the cleaning tube 5, the through groove on the back of the movable cover 304 is connected with the ventilation groove 313 on the other side of the shell 303. At this time, the wind force generated by the heat dissipation fan 4 will be collected by the wind collecting groove 311 and transported to the cleaning tube 5. With the input of wind force, the rotating ring 13 arranged on the cleaning tube 5 will be filled with strong wind force. When the wind force is compressed and discharged outward from the cleaning head 14, it will drive the rotating ring 13 to rotate to form a rotating airflow. In this way, the dust in the gap of the heat dissipation fin 1 can be quickly cleaned over a large area through the rotating airflow to prevent the dust from affecting the heat dissipation effect.

[0025] The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present invention.

Claims

1. A heat sink for a semiconductor, comprising a support (8), characterized in that: A plurality of heat dissipation fins (1) are provided at the bottom of the support (8), a heat dissipation fan (4) is provided at the top of the support (8), connecting rods (6) are rotatably provided on one side of the front and back sides of the support (8), a knob (2) passes through the front side of the connecting rod (6), and auxiliary structures (3) are provided on one side of the two connecting rods (6); The auxiliary structure (3) comprises an outer shell (303), a ventilation slot (313) is provided inside the outer shell (303), an air collecting slot (311) is provided on one side of the inner wall of the outer shell (303), a plurality of air guide slots (307) are radially provided around the air collecting slot (311), and an air inlet (308) is fixedly connected to one side of the ventilation slot (313).

2. A heat sink for semiconductor according to claim 1, characterized in that: A moving block (305) is slidably provided on the top of the housing (303), a limiting screw (306) passes through the top of the moving block (305), a movable cover (304) is fixedly provided on one side of the moving block (305), a through groove is provided on one side of the bottom of the movable cover (304), and the through groove is adapted to one of the ventilation grooves (313).

3. A heat sink for semiconductor according to claim 2, characterized in that: A connecting pipe (310) is fixedly connected to the bottom of the inner wall of the shell (303), a tilting block (309) is fixedly provided at each dead corner inside the shell (303), and an L-shaped sliding groove (312) is provided on the front and back of the inner wall of the shell (303).

4. A heat sink for semiconductor according to claim 3, characterized in that: A wind blocker (302) is fixedly provided on the top of the inner wall of the housing (303); the wind blocker (302) is telescopic, and fixing screws (301) penetrate the front and rear sides of the top of the wind blocker (302).

5. A heat sink for semiconductor according to claim 1, characterized in that: A cleaning tube (5) passes through the interior of the heat dissipation fin (1), a stabilizing frame (9) is fixedly provided on one side of the support (8), the stabilizing frame (9) is adapted to the cleaning tube (5), and the outer diameter of the cleaning tube (5) is the same as the inner diameter of the movable cover (304).

6. A heat sink for semiconductor according to claim 5, characterized in that: The bottom of the cleaning tube (5) is provided with a plurality of rotating rings (13) arranged equidistantly in a straight line, the rotating ring (13) is provided with air holes, the air holes are fixedly connected to the cleaning tube (5), and the outside of the rotating ring (13) is fixedly connected to a cleaning head (14) in a circular array.

7. A heat sink for semiconductor according to claim 1, characterized in that: A sealing plate (7) is fixedly provided on one side of the top of the support (8), a heat dissipation base plate (10) is provided on the bottom of the support (8), a plurality of air outlet pipes (11) are arranged in an array on the top of the heat dissipation base plate (10), and a connecting pipe (12) is fixedly connected to one side of the heat dissipation base plate (10).

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