Integrated electronic module with laminated bridge assembly

Abstract

The invention relates to an integrated electronic module with a stacked bridge assembly. An integrated electronic module assembly may include a substrate, conductive regions including on opposing surfaces of the substrate, and a laminate bridge assembly. The laminate bridge assembly may include a dielectric material forming a planar region and a respective leg defining a cavity region, the respective leg including at least one respective interlayer interconnect. The laminate bridge assembly may also include a conductive layer defining at least one respective pad region that is electrically coupled to the at least one respective interlayer interconnect. The laminate bridge assembly may be electrically and mechanically coupled with the substrate, the substrate including a first surface and an opposing second surface, the first surface including a respective conductive region, the at least one respective interlayer interconnect electrically coupled to the respective conductive region, and the at least one respective interlayer interconnect electrically coupled to the respective conductive region. The opposing second surface includes respective conductive regions forming terminals of the integrated electronic module assembly.

Description

Technical Field

[0001] The present disclosure relates to electronic device packaging and, more particularly, but not limited to, to integrated electronic modules having laminated bridge assemblies. Background Art

[0002] Electronic device packaging has experienced a continuing trend towards miniaturization and integration of complex functionality into compact form factors. For example, mobile consumer devices now integrate a variety of radios, sensors, processors, storage modules, and other components into thin and lightweight integrated circuit packages. Emerging applications in wearable technology and the Internet of Things (IoT) often involve the integration of complex electronics constrained by very small footprints. The automotive industry also continues to adopt more electronics to achieve advanced safety, efficiency, and comfort.

[0003] However, the increase in component integration and density presents various challenges. Miniaturization involves reducing the available area on a printed circuit board or other substrate for component placement. Simply reducing the footprint of a component can have a negative impact on manufacturing costs, yield, and reliability. Summary of the invention

[0004] Three-dimensional integration technology can make better use of available volume to increase the density of electrical packaging. For example, three-dimensional integration can involve vertically stacking components or substrates to increase density without the need for a larger footprint associated with electronic device packaging. Three-dimensional integration of electronic device packaging can include electrical interconnections between one or more layers or substrates in the stack. The inventors have recognized that there may be difficulties in providing reliable interconnections in three-dimensional integrated electronic packaging. In one method, the interconnection can be inserted between the lower and upper layers of the substrate and connected to the substrate to provide mechanical support or electrical connection. It may be difficult to accurately align or place the structure that provides such interconnection, which may result in low yield, expensive manufacturing process or one or more of structural limitations, such as minimum spacing between layers or minimum cross-sectional area of ​​the interconnection. For example, it may be difficult to achieve planarity at the interface where the interconnection mates. In one method, solder or other materials can be used to fill gaps caused by poor planarity or poor fit. However, such solder joints may present other challenges, such as poor reliability or easy flow through other areas, such as under components.

[0005] Among other things, the inventors have recognized that providing substrate-to-substrate or inter-layer interconnections (or both) using layers or substrates in a stack may help address one or more of these difficulties. As described herein, a laminate bridge assembly may include one or more interconnections to facilitate stacking or three-dimensional integration of components within an integrated electronic device package. Using the components or related techniques herein in an integrated electronic package may provide one or more of the following: increased mechanical strength, improved electrical connection elasticity, reduced electrical connection resistance, reduced electrical connection noise, enhanced planarity between interconnections, increased interconnect height to width ratio, or reduced connection size, or a combination thereof.

[0006] In one example, an integrated electronic module assembly may include: a substrate including conductive regions on opposite surfaces of the substrate and a laminated bridge assembly. The laminated bridge assembly may include a dielectric material forming a planar region and corresponding legs defining a cavity region, the corresponding legs including at least one corresponding interlayer interconnect. The laminated bridge assembly may also include a conductive layer defining at least one corresponding pad region electrically coupled to the at least one corresponding interlayer interconnect. The laminated bridge assembly may be electrically and mechanically coupled to the substrate, the substrate including a first surface and an opposite second surface, the first surface including corresponding conductive regions, the at least one corresponding interlayer interconnect electrically coupled to the corresponding conductive regions, the opposite second surface including corresponding conductive regions forming terminals of the integrated electronic module assembly.

[0007] In one example, an integrated electronic module assembly may include: a substrate including conductive regions on opposite surfaces of the substrate and a laminated bridge assembly. The laminated bridge assembly may include a dielectric material forming a planar region and corresponding legs defining a cavity region, the corresponding legs including at least one corresponding interlayer interconnect. The laminated bridge assembly may also include a conductive layer defining at least one corresponding pad region electrically coupled to the at least one corresponding interlayer interconnect. The laminated bridge assembly may be electrically and mechanically coupled to the substrate, wherein the integrated electronic module assembly provides a switching converter, wherein the laminated bridge assembly may be electrically and mechanically coupled to an inductor used as an energy storage device.

[0008] In one example, a method of manufacturing an integrated circuit module may include placing a laminate bridge assembly on a substrate. The laminate bridge assembly may include a dielectric material that forms a planar region and corresponding legs that define a cavity region, the corresponding legs including at least one corresponding interlayer interconnect. The laminate bridge assembly may also include a conductive layer that defines at least one corresponding pad region that is electrically coupled to the at least one corresponding interlayer interconnect. The method may also include electrically and mechanically coupling the laminate bridge assembly to the substrate, wherein the substrate includes a conductive region that is electrically coupled to at least one corresponding interlayer interconnect. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In the accompanying drawings, which may not be drawn to scale, the same numerals may describe substantially similar components throughout one or more views. The same numerals with different letter suffixes may represent different instances of substantially similar components. The accompanying drawings are generally described by way of example and not limitation.

[0010] Figure 1 is an exploded view of an example including an integrated electronic module assembly.

[0011] Figure 2A is a cross-sectional view of an illustrative example including a laminate bridge assembly.

[0012] Figure 2B Yes Figure 2A A top view of an illustrative example of a laminated bridge assembly.

[0013] Figure 2C Yes Figure 2A A bottom view of an illustrative example of a laminated bridge assembly.

[0014] Figure 3A is a cross-sectional view of an illustrative example including a laminate bridge assembly.

[0015] Figure 3B Yes Figure 3A A cross-sectional view of an illustrative example of a laminated bridge assembly.

[0016] Figure 3C Yes Figure 3A A cross-sectional view of an illustrative example of a laminated bridge assembly.

[0017] Figure 4 is a cross-sectional view of an illustrative example including an integrated electronic module assembly.

[0018] Figure 5 is a cross-sectional view of an illustrative example including an integrated electronic module assembly.

[0019] Figure 6 is a cross-sectional view of an illustrative example including an integrated electronic module assembly.

[0020] Figure 7 is a perspective view of an illustrative example that includes an integrated electronics module assembly and an environment in which the integrated electronics module assembly may be used.

[0021] Figure 8 is an exploded view of an example including an integrated electronic module assembly.

[0022] Fig. 9 is a diagram illustrating an example of a method for manufacturing an integrated electronic module assembly.

[0023] Fig.10 is a block diagram that includes an example of a machine on which one or more portions of the present disclosure may be implemented. DETAILED DESCRIPTION

[0024] In general, the present subject matter may include structures and techniques related to stacking and connecting electronic components in a compact manner. Such structures may include or use a laminate bridge assembly including layered dielectric and conductive materials. The laminate bridge assembly may be placed on a substrate and may define an open cavity area in which a component may be placed. The legs of the laminate bridge may include vertical interconnects to conductively couple signals between layers. Pad areas may be included on the surface of the laminate bridge to allow components to be mounted and connected through the interconnects. By aligning the pad areas, multiple components may be stacked vertically to form a high-density three-dimensional package. A modular approach using a laminate bridge may help to efficiently utilize vertical space, packaging more components in a smaller footprint.

[0025] Figure 1 is an exploded view of an example of an integrated electronic module assembly 100. Figure 1 In the example of FIG. 1 , the integrated electronic module assembly 100 may include a substrate 102 , a laminate bridge assembly 104 , and passive components 106 .

[0026] The substrate 102 defines opposite sides, including a first surface 112 and a second surface 114. One or more electronic components may be mounted (e.g., electrically and / or mechanically coupled) on one or more of the first surface 112 or the second surface 114. In one example, there may be a plurality of components, such as in the region 110 mounted on the first surface 112 or the second surface 114 or both. Figure 1 As shown, the various components in region 110 may be mounted to one or more conductive regions of first surface 112 or second surface 114 or both.

[0027] The substrate 102 may include one or more of a ceramic substrate, a polymer material (e.g., a glass epoxy laminate, such as an FR-4 substrate), or another material (e.g., another substance having one or more of insulating or dielectric properties). The conductive areas of the substrate 102 may include one or more of traces, pads, vias, or other conductive elements for routing signals and / or power around the substrate 102.

[0028] The laminated bridge component 104 may include a planar region 126 and one or more corresponding legs, such as may include leg 122A and leg 122B. The planar region 126 and the legs may include a dielectric material 120. The dielectric material 120 is generally continuous between the planar region 126 and the legs, such as may include a planar region 126 and one or more corresponding legs, the legs being mechanically connected through the dielectric material 120 or defined by the dielectric material 120. In one example, the dielectric materials 120 including the planar region 126 and the one or more corresponding legs may be mechanically connected to each other, such as using an adhesive or other mechanical bonding agent. The dielectric material 120 may include one or more of a polymer, a resin (e.g., a FR-4 substrate), or a ceramic. For example, the dielectric material 120 may include a fiber-reinforced material to increase strength.

[0029] The dielectric material 120 may define a cavity region 130. The cavity region 130 may be defined by one or more legs and a top planar region 126. The cavity region 130 may provide a space to mount one or more of a plurality of components in the region 110.

[0030] The laminated bridge component 104 may include one or more conductive pad areas, such as pad 140A, pad 140B, pad 1404C, or pad 140D. At least one corresponding pad area may be configured to be electrically coupled to one or more components, such as passive component 106. In one example, at least one corresponding pad area may be located on the top side of the planar region 126 (e.g., the side of the planar region 126 away from the substrate 102). In one example, at least one corresponding pad area may be located on the bottom side of the planar region 126 (e.g., the side of the planar region 126 close to the substrate 102). In one example, at least one corresponding pad area may be located on the top side and the bottom side of the planar region 126.

[0031] The laminated bridge assembly 104 may include one or more interlayer interconnects, such as interconnect 142A, interconnect 142B, interconnect 142C, and interconnect 142D. At least one interlayer interconnect may be located in one or more legs. For example, interconnect 142A and interconnect 142B may be located in leg 122B, and interconnect 142C and interconnect 142D may be located in leg 122A. The at least one interlayer interconnect may be composed of one or more through-hole structures (e.g., cavities formed by removing a portion of dielectric material 120, such as by machining or chemical etching), which have been filled and / or plated with a conductive material (e.g., copper) or a conductive block (e.g., a block of conductive material, such as copper), which has been positioned on or within a leg.

[0032] At least one interlayer interconnect may be electrically coupled to a corresponding pad region in at least one corresponding pad region. For example, interconnect 142A may be electrically coupled to pad 140A, interconnect 142B may be electrically coupled to chassis 140B, interconnect 142C may be electrically coupled to pad 140C, and interconnect 142D may be electrically coupled to pad 140D.

[0033] The integrated electronic module assembly 100 may include any number of interconnects, for example, may include one interconnect, two interconnects, three interconnects, four interconnects, five or more interconnects, 10 or more interconnects, 50 or more interconnects, 250 or more interconnects, or 1000 or more interconnects.

[0034] The laminated bridge component 104 can be electrically and / or mechanically coupled to the substrate 102. The laminated bridge component 104 can be mounted on the substrate 102 using one or more of solder, adhesive (e.g., conductive adhesive, non-conductive adhesive, or both), etc. The substrate 102 may include at least one corresponding conductive region for coupling to the laminated bridge component 104, for example, it may include a conductive region 144A, a conductive region 144B, a conductive region 144C, and a conductive region 144D. The interconnect 142A may be electrically coupled to the conductive region 144A, the interconnect 142B may be electrically coupled to this conductive region 144B, the interconnect 142C may be electrically coupled to this conductive region 144C, and the interconnect 142D may be electrically coupled to this conductive region 144D. At least one corresponding conductive region may be configured to be aligned with a portion of the corresponding interlayer interconnect positioned toward the substrate 102 in at least one interlayer interconnect (e.g., at the bottom of the leg).

[0035] At least one corresponding conductive region may be electrically coupled to one or more components on substrate 102. At least one corresponding conductive region may be coupled to one or more terminals on substrate 102, which may allow coupling to one or more other packages and / or devices, for example.

[0036] In one example, the electrical coupling between the substrate 102 and the laminate bridge assembly 104 (e.g., via solder, conductive adhesive, etc.) may also provide some or all of the mechanical coupling between the substrate 102 and the laminate bridge assembly 104. For example, solder electrically connecting at least one corresponding conductive region to at least one interlayer interconnect may also mechanically couple the substrate 102 to the laminate bridge assembly 104. In one example, an additional adhesive or method (e.g., adhesive, heat-induced bonding, etc.) may be used to connect the substrate 102 to the laminate bridge assembly 104.

[0037] The dielectric material 120 may include one or more holes 128, for example, which may allow sealants and / or coatings (e.g., overmolding materials, conformal coatings, etc.) to penetrate the cavity area 130. One or more portions of the integrated electronic module assembly 100 may include a sealant or coating, for example, which may include the cavity area 130. The sealant may provide one or more of increased mechanical and / or electrical integrity of the integrated electronic module assembly 100, increased and / or more uniform heat dissipation of the integrated electronic module assembly 100, water resistance, etc.

[0038] Passive components 106 may include, for example, capacitors, resistors, or inductors. In one example, multiple passive components may be installed on the laminated bridge component 104. Passive components may all be of the same type, or passive components may be of different types (e.g., one or more inductors and one or more capacitors). In one example, one or more non-passive components (e.g., active components, such as transistors or integrated circuits (ICs), etc.) may be installed on the laminated bridge component 104 as a substitute or supplement for one or more passive components. Passive component 106 may be installed on the laminated bridge component 104 and may be electrically coupled to at least one corresponding pad area. Passive component 106 may be coupled to substrate 102 via laminated bridge component 104, for example, may include coupling via at least one corresponding pad area, at least one interlayer interconnect, and at least one respective conductive region.

[0039] In one example, the passive component 106 may include a first terminal 152 and a second terminal 154. The first terminal 152 may be coupled to one or more of the pads 140A or 140B. The second terminal 154 may be coupled to one or more of the pads 140C or 140D. Using more than one pad area to couple to a single terminal of the passive component 106 may increase current capacity or reduce heat concentration, as a specific location of the substrate 102 and / or the laminate bridge component 104.

[0040] In one example, the integrated electronic module assembly 100 may include a switching converter (e.g., an alternating current (AC)-direct current (DC) converter, a DC-AC converter, a DC-DC converter (e.g., a buck converter, a boost converter, or a buck-boost converter)). The passive component 106 may be used as an energy storage device for the switching converter. For example, the passive component 106 may include an inductor used as an energy storage inductor for the switching converter.

[0041] Figure 2A is a cross-sectional view of an illustrative example of a laminated bridge assembly. Figure 2A In the example shown, the laminate bridge assembly 104 includes two pad regions, pad 140A and pad 140C. Figure 2A It is shown that the laminated bridge component 104 can be composed of one or more layers of dielectric material. One or more layers of dielectric material can include a first layer 232 and a second layer 234. The first layer can be located on top of the second layer and can be mechanically bonded to the first layer, such as using an adhesive. One or more layers can include one or more conductive components, such as one or more traces, one or more pads, one or more plugs, or one or more filled and / or plated through holes 202. There can be one or more conductive components forming pads 140A and another one or more conductive components forming pads 140C. One or more conductive components can form interconnect 142A. One or more conductive components can form interconnect 142C. In one example, interconnect 142A and interconnect 142C can be formed at least in part by through hole 202.

[0042] Interconnect 142A may include one or more vias 202 on first layer 232 that are electrically coupled to one or more vias 202 on second layer 234. In this way, interconnect 142A may span layers 232 and 234 and connect pad 140A to the portion of interconnect 142A at the bottom of pin 122B.

[0043] Interconnect 142C may include one or more vias 202 on first layer 232 that are electrically coupled to one or more vias 202 on second layer 234. In this way, interconnect 142C may span layers 232 and 234 and connect pad 140C to the portion of interconnect 142C at the bottom of pin 122A.

[0044] The through holes 202 may be one or more of circular through holes, oval through holes (e.g., longer in one dimension than another), strip-shaped through holes, etc. The through holes 202 may all be configured the same, or one or more of the through holes 202 may be configured differently than the other through holes 202.

[0045] Each leg can include a portion of dielectric material 120 and a portion including conductive features. In one example, one or more of dielectric material 120 or conductive features can provide mechanical structure to the leg and / or laminate bridge assembly 104. In one example, the combined effect of dielectric material 120 and conductive features in the leg and / or planar region 126 can provide structure to the leg and / or laminate bridge assembly 104.

[0046] Each leg can have a width 212 and a height 214. Each leg can have the same width 212 and height 214, or the legs can differ in one or more aspects (e.g., different heights, different widths, etc.). The ratio of the height 214 of the leg to the width 212 of the leg can affect one or more of the height of the planar area 126 above the substrate 102, or how wide the substrate 102 must be to accommodate the laminate bridge assembly 104. In an example, the ratio of the height of one or more legs to the corresponding width of the leg can meet or exceed 1:1, 2:1, 3:1, 4:1, 5:1, 6:1, 8:1, or 10:1. The length of the leg can also be greater than the width 212. In an example, the width 212 can be defined as the smaller of the width 212 and the length of the leg (e.g., the narrowest dimension of the leg orthogonal to the height 214).

[0047] Figure 2B Yes Figure 2A 1 is a top view of an illustrative example of a laminated bridge assembly 104 . Figure 2B It is shown that at least one corresponding pad area can be constructed by plating on one or more through holes 202. The size and shape of the at least one corresponding pad area can be connected with one or more components (such as passive components 106). The area of ​​the at least one corresponding pad area can be selected to help reduce the connection resistance between the at least one respective pad area and the connected component (for example, a larger area can be selected if space allows.)

[0048] Figure 2A and Figure 2B As shown, at least one interlayer interconnect can be configured to manage resistance (e.g., reduce interconnect resistance), such as by increasing the cross-sectional area of ​​at least one interlayer interconnect. For example, the first layer 232 can include a two-dimensional arrangement of through holes 202 (e.g., multiple rows and columns of through holes 202, at least 3 through holes 202 across a two-dimensional area, etc.) to increase the cross-sectional area of ​​the conductive material comprising at least one interlayer interconnect in the first layer 232. The second layer 234 can include a one-dimensional arrangement of through holes 202 (e.g., at least 2 through holes 202 on an approximate line along the length of the leg) to increase the cross-sectional area of ​​at least one interlayer interconnect in the second layer 234. In one example, the second layer 234 can include a two-dimensional arrangement of through holes 202.

[0049] Figure 2C Yes Figure 2A A bottom view of an illustrative example of a laminated bridge assembly. Figure 2C In the example of FIG. 1 , the bottom of interconnect 142A can be plated to produce a corresponding conductive region 242A, which can be configured to couple with conductive region 144A. The bottom of interconnect 142C can be plated to produce a corresponding conductive region 242C, which can be configured to couple with conductive region 144C.

[0050] Figure 2C It is shown that at least one corresponding conductive area and / or at least one interlayer interconnection may include a structure other than a circular through-hole structure. For example, the conductive area may define a rectangular strip, for example defined by a length 224. The length 224 of a given interlayer interconnection may be selected to provide one or more of a specified resistance, a specified heat dissipation, or a specified current carrying capacity. In one example, the length of the power node interlayer interconnection may be greater than the length of the control node interlayer interconnection. In one example, the length of the power node interlayer interconnection may exceed the length of the control node connection by 50%, 100%, 200%, 300%, 400%, 600%, or 800%. In one example, the current carrying capacity of the power node interlayer interconnection may be greater than the length of the control node interlayer interconnection.

[0051] In one example, the laminated bridge component 104 may include only a single layer of dielectric, or the laminated bridge component 104 may include more than two layers of dielectric. For example, the laminated bridge component 104 may include three, four, five, six, seven, or eight or more layers. The layers may be distributed between the planar region 126 and the legs in any manner, for example, including all layers except one layer in the legs, all layers except two layers in the legs, etc.

[0052] FIG. 3A to FIG. 3C A series of potential operations in the process of manufacturing the laminate bridge assembly 104 is shown.

[0053] Figure 3A is a cross-sectional view of an example of a laminated bridge assembly intermediate 304. The intermediate 304 can be manufactured using techniques and materials similar to printed circuit board (PCB) manufacturing, where one or more dielectric layers (e.g., glass epoxy or other core or prepreg layers) are stacked and cured, and have conductive metallization to provide conductive areas. For example, Figure 3A The laminated bridge assembly intermediate 304 may include a first layer 232, a second layer 234, a third layer 336, and a fourth layer 338. The first layer 232 and the fourth layer 338 may be thinner layers (e.g., prepreg layers) that may wrap the conductors and may be plated, while the second layer 234 and the third layer 336 may be thicker core layers that fill the space between the first layer 232 and the fourth layer 338 and provide structural support. Figure 3A In the example of FIG. 1 , at least one interlayer interconnect can be constructed using a solid copper block. As an alternative or in addition to the copper block, at least one interlayer interconnect can also include other conductive features, such as through holes. At least one corresponding pad area and at least one corresponding conductive area can be electrically connected to the corresponding solid copper block.

[0054] Figure 3A It is shown that the laminated bridge assembly intermediate 304 can be made with a dielectric layer having a uniform footprint throughout the assembly so that the dielectric material 120 does not initially include the cavity 130. In another example, the dielectric material 120 can form a cavity, but it may not match the size and / or shape of the final cavity 130. The laminated bridge assembly intermediate 304 can be manufactured at least in part using a layered manufacturing process. For example, one or more layers including one or more traces, one or more pads, one or more through holes, etc. can be placed on another layer, and the other layer has one or more traces, one or more pads. Between placing one or more layers and / or after placing all layers, one or more through holes can be filled or plated and / or other electrical connections can be made between layers. Conductive plugs can be inserted at any point in the manufacturing process. The construction process of the pad 140A can share one or more similarities with the printed circuit board manufacturing process.

[0055] Figure 3B Yes Figure 3A A cross-sectional view of an example of a laminated bridge assembly intermediate 304 . Figure 3B A portion 360 of dielectric material 120 is shown, which may be removed from laminate bridge assembly intermediate 304 during a portion of the manufacturing process. Removing portion 360 of dielectric material 120 may result in dielectric material 120 defining cavity region 130. Portion 360 may be removed by machining (e.g., milling, drilling, cutting, etc.), chemical etching, laser ablation, water jetting, etc. There may be a tradeoff where the volume of portion 360 is inversely proportional to the stiffness of the finished laminate bridge assembly 104. Thus, a wider leg defined by dielectric material 120 results in a smaller cavity region 130, but with greater stiffness due to more dielectric material remaining in each leg, such as around the corresponding interlayer interconnect in the leg. The individual legs may be formed by removing dielectric material between the individual legs.

[0056] Figure 3C is a cross-sectional view of an example of a laminated bridge assembly 104, the laminated bridge assembly being composed of Figure 3A The laminated bridge assembly intermediate 304 is derived. Figure 3C The display portion 360 has been removed and the dielectric material of layers 234 , 336 , and 338 defines the cavity region 130 . Figure 3CAs shown, after the dielectric material is removed, a portion of one or more dielectric layers may remain. This portion of dielectric material may include material surrounding the legs of the laminated bridge assembly 104. For example, the first portion 234A of the second layer 234 may surround the interconnect 142A, and the second portion 234C of the second layer 234 may surround the interconnect 142C. The first portion 336A of the third layer 336 may surround the interconnect 142A, and the second portion 336C of the third layer 336 may surround the interconnect 142C. The first portion 338A of the fourth layer 338 may surround the interconnect 142A, and the second portion 338C of the fourth layer 338 may surround the interconnect 1425C.

[0057] The portion of dielectric material remaining in the leg can provide structural support for the leg, for example, can help maintain the planarity of the leg. The portion of dielectric material remaining on the leg can contact one or more interlayer interconnects on one or more sides, for example, can include completely surrounding one or more interlayer interconnects.

[0058] In one example, all material from one or more layers may be removed. For example, all material from one or more of the second layer 234, the third layer 336, or the fourth layer 338 may be removed. The remaining interlayer interconnects may support the first layer 232 and provide structure for the laminated bridge assembly 104. In this example, the second layer 234, the third layer 336, and the fourth layer 338 may provide one or more of structural support or mold form for manufacturing the interlayer interconnects, but once the interlayer interconnects are manufactured, only the interlayer interconnects may be strong enough to support the laminated bridge assembly 104.

[0059] In one example, the cavity region 130 can be defined by a dielectric material of a layer without removing material after assembling two or more layers. For example, the laminated bridge assembly intermediate 304 can include the laminated bridge assembly 104. For example, the dielectric material of these layers can be manufactured to define a corresponding portion of the cavity region 130 corresponding to the layer, such as by processing or initially forming a dielectric layer. One or more combinations of the above methods can be used. For example, before processing the laminated bridge assembly intermediate 304, one or more layers can define a portion of the cavity region 130. After removing the portion 360, one or more steps can be performed. For example, a layer can be added and / or an area can be plated.

[0060] Figure 4 is a cross-sectional view of an illustrative example of an integrated electronic module assembly 100. Figure 4In the example of FIG. 1 , the laminate bridge assembly 104 includes corresponding conductive areas for electrically interconnecting electrical components on the opposite surface of the planar region 126. The passive component 106 can be coupled on a first surface of the planar region 126 opposite the cavity region 130. The component 412 can be coupled on a second surface of the planar region 126 within the cavity region 130. There can be one or more additional components on one or more of the first surface or the second surface. Figure 4 Also shown, one or more components 410 may be mounted between the passive component 106 and the planar region 126 , such as may be connected to the first surface of the laminate bridge component 104 .

[0061] Figure 5 is a cross-sectional view of an illustrative example of an integrated electronic module assembly 100. Figure 5 In the example of, in the cavity area 130, there can be a metal block 570 attached to the surface of the laminated bridge assembly 104. The metal block 570 can be configured to diffuse or dissipate one or more of the heat, which can include, for example, heat from one or more of the passive components 106, multiple components in the area 110, or another component in and / or near the integrated electronic module assembly 100. The metal block 570 can be made of copper, aluminum, or another metal. In one example, the metal block 570 can be replaced with a non-metallic thermally conductive material, such as graphite, graphene, or ceramic. In one example, the size and shape of the metal block 570 can be suitable for mounting around one or more components on the substrate 102 and / or the laminated bridge assembly 104. In one example, 570 can be embedded or partially embedded in the laminated bridge assembly 104, which can include, for example, embedding the metal block 570 in the planar area 126 (e.g., removing a portion of the planar area 126 and placing the metal block 570 in the removed portion).

[0062] In one example, the laminate bridge assembly 104 may include a metal region 572 that is not electrically coupled to another component. The metal region 572 may be configured to diffuse or dissipate one or more of heat, which may include heat from one or more of the passive component 106, multiple components in the region 110, or another component in and / or near the integrated electronic module assembly 100. The metal region 572 may be in addition to or in place of the metal block 570. The metal region 572 may be placed near the center of the planar region 126 and may be composed of one or more blocks, filled and / or plated through holes, or plated areas. The metal region 572 may be placed near the metal block 570, for example, to help conduct heat between the passive component 106 and the cavity region 130. In one example, the metal region 572 may be electrically coupled to the metal block 570, for example, to improve thermal conduction between the metal block 570 and the metal region 572.

[0063] Figure 6is a cross-sectional view of an illustrative example including an integrated electronic module assembly 100 . Figure 6 As shown, the integrated electronic module assembly 100 may include a first substrate 102A, a first laminate bridge assembly 104A, a second substrate 102B, and a second laminate bridge assembly 104B, generally showing a "stackable" or modular configuration. The first substrate 102A and the second substrate 102B may be configured similarly to the substrate 102 described above, or one or both may differ in one or more aspects. The first laminate bridge assembly 104A and the second laminate bridge assembly 104B may be configured similarly to the laminate bridge assembly 104 described above, or one or both may differ in one or more aspects. Figure 6 It is shown that the first laminate bridge assembly 104A can be configured to receive the second substrate 102B. The second substrate 102B can be mounted on the first laminate bridge assembly 104A, for example, by a plurality of solder bumps 610B. The first substrate 102A can also include a plurality of solder bumps 610A for mounting the integrated electronic module assembly 100 on another chip.

[0064] The modular integrated electronic module assembly 100 can allow a user to adjust or scale one or more capabilities (e.g., output rating, processing power) of the system, such as by adding additional stacked modules. This can allow the capabilities to be adjusted or scaled without requiring newly designed or manufactured chips.

[0065] The first substrate 102A and the first laminate bridge component 104A can form a first integrated module component 100A. The second substrate 102B and the second laminate bridge component 104B can form a second integrated module component 100B. The configuration of the pad area on the first integrated module component 100A can be configured to allow the second integrated module component 100B to be stacked on the first integrated module component 100A. The first integrated module component 100A and the second integrated module component 100B can form an integrated electronic module component 100 together. In one example, the second integrated module component 100B can also have a configuration of a pad area that allows additional integrated module components to be stacked on the second integrated component 100B. In one example, the stacking can include three integrated electronic module components, four integrated electronic components, five integrated electronic module components, or six or more integrated electronic module components. The integrated electronic module component 100, including two or more integrated module components, can be connected to the outside of the integrated electronic module component 100 only through a plurality of solder bumps 610A.

[0066] The first integrated module assembly 100A may include a first plurality of components in the region 110A. The second integrated module assembly 100B may include a second plurality of circuit components in the region 110B. The first plurality of components in the region 110A may be mounted on one or more of the first substrate 102A or the first laminated bridge assembly 104A. The second plurality of circuit components in the region 110B may be mounted on one or more of the second substrate 102B or the second laminated bridge assembly 104B.

[0067] In one example, the second substrate 102B can be omitted, and the second laminated bridge component 104B can be configured to be mounted directly on the first laminated bridge component 104A. The first laminated bridge component 104A may include a configuration of a pad area to allow the second laminated bridge component 104B to be stacked on the first laminated bridge component 104A. The first laminated bridge component 104A can provide electrical and mechanical interconnection between the second laminated bridge component 104B and the first substrate 102A. In one example, the second laminated bridge component 104B may also have a configuration of a pad area that allows additional laminated bridges to be stacked on the second laminated bridge component 104B. In one example, the stack may include three laminated bridge components, four laminated bridge components, five laminated bridge components, or six or more laminated bridge components.

[0068] In one example, the integrated electronic module assembly 100 may include two or more substrates and two or more laminated bridge assemblies, but each bridge assembly may not have a corresponding substrate. For example, a stack forming the integrated electronic module assembly 100 may include two bridge assemblies between substrates, or a stack may end with two bridge assemblies without an intermediate substrate.

[0069] Figure 7 is a perspective view of an illustrative example of an integrated electronic module assembly 100 and an environment in which the integrated electronic module assembly may be used. Figure 7 In the example shown, the integrated electronic module assembly 100 has been one or more of overmolded or encapsulated to form a package, and the substrate 102 is not shown. Figure 7 It is shown that the integrated electronic module assembly 100 can be configured to receive an integrated circuit chip 702 (e.g., a chip scale package or other integrated circuit package) on a surface of the substrate opposite the cavity region 130. The integrated circuit chip 702 can be a chip that is optionally installed after the integrated electronic module assembly 100 leaves the manufacturing facility. For example, the integrated circuit chip 702 can be an optional chip for upgrading the integrated electronic module assembly 100. In one example, the integrated electronic module assembly 100 is a multi-purpose device, and the integrated circuit chip 702 is selected to achieve the desired function of the combined integrated electronic module assembly 100 and the integrated circuit chip 702 assembly.

[0070] In one example, the integrated circuit chip 702 may include one or more discrete components (e.g., resistors, capacitors, transistors, etc.) as an alternative or in addition to the integrated circuit assembly. For example, the integrated circuit chip 702 may include a substrate, and the one or more integrated circuit chips and the one or more discrete components are mounted on the substrate. The integrated circuit chip 702 may be a stand-alone module that may be separate from the integrated electronic module assembly 100 or work together with the integrated electronic assembly 100.

[0071] In one example, the integrated electronic module assembly 100 may include an integrated circuit chip electrically and mechanically coupled to corresponding conductive regions of the laminate bridge assembly 104 on a surface of the laminate bridge assembly 104 within the cavity region 130 .

[0072] Figure 8 is an exploded perspective view of an example including an integrated electronic module assembly 100 . Figure 8 It is shown that there may be a leg 122C and a leg 122D. The legs may not need to be parallel to one or more other legs, arranged at the perimeter of the planar area 126, or extend through the entire planar area 126. For example, leg 122D is not parallel to legs 122A and 122B. Leg 122C is not arranged on the perimeter of the planar area 126. Legs 122C and 122D do not cover the entire length of the planar area 126.

[0073] One or more legs may not include inter-layer interconnections and may be used only for one or more of mechanical support or heat dissipation. One or more legs may be positioned, sized, and shaped to surround one or more of the plurality of components in region 110. In one example, a leg may include a bend and / or curve. There may be any number of legs, for example, one leg, two legs, three legs, four legs, five legs, or six legs or more.

[0074] In one example, two or more legs can be configured to include electrical components electrically and mechanically connected between the legs. For example, a set of one or more input or output capacitors can be placed horizontally between two appropriately spaced legs. The capacitors can be connected to a single terminal on either side, which can result in an effective capacitance equal to the sum of all capacitor values ​​coupled between the two legs.

[0075] In one example, the integrated electronic module assembly 100 can be configured differently. For example, one or more legs can be on the substrate 102. One or more of the at least one interlayer interconnect can be included in the legs on the substrate 102. In one example, all legs are on the substrate 102, and the laminate bridge assembly 104 is a flat dielectric material 120. In this example, the dielectric of the substrate 102 can define the cavity area 130. The substrate 102 with legs can be manufactured similar to the laminate bridge assembly 104 described above, or can be different in one or more aspects.

[0076] Fig. 9 is a diagram showing an example of a method 900 for manufacturing a portion of an integrated electronic module assembly. At 905, a laminate bridge assembly may be placed on a substrate. The laminate bridge assembly may include a dielectric material that may form a planar region and corresponding legs that define a cavity region, and the corresponding legs may include at least one corresponding interlayer interconnect. The laminate bridge assembly may include a conductive layer that may define at least one corresponding pad region that is electrically coupled to at least one respective interlayer interconnect. At 910, the laminate bridge assembly may be electrically and mechanically coupled to a substrate, wherein the substrate may include a conductive region that is electrically coupled to at least one corresponding interlayer interconnect. The order of steps shown does not imply a limitation on the order in which the steps are performed. In one example, two or more steps may be performed simultaneously or at least partially simultaneously.

[0077] At step 905, the laminate bridge component may be the laminate bridge component 104, and the substrate may be the substrate 102. In one example, the method 900 may further include placing a passive component (such as the passive component 106) on the planar region. The method 900 may further include electrically and mechanically coupling the passive component to the planar region, for example, may include coupling an active component to at least one corresponding pad region.

[0078] Fig.10is a block diagram of an example of a machine 1000 on which one or more portions of the present disclosure may be implemented. As described herein, an example may include logic or multiple components or mechanisms in the machine 1000, or may be operated by it. A circuit (e.g., a processing circuit) is a collection of circuits implemented in a tangible entity of the machine 1000, including hardware (e.g., simple circuits, gates, logic, etc.). Circuit members may become flexible over time. A circuit includes members that can perform specified operations individually or in combination when operated. In one example, the hardware of the circuit may be invariably designed to perform a specific operation (e.g., hardwired). In one example, the hardware of the circuit may include variably connected physical components (e.g., execution units, transistors, simple circuits, etc.), including physically modified machine-readable media (e.g., magnetic, electrical, movable placement of invariant aggregated particles, etc.) to encode instructions for a specific operation. When connecting physical components, the underlying electrical characteristics of the hardware components change, for example, from an insulator to a conductor, or vice versa. Instructions enable embedded hardware (e.g., an execution unit or loading mechanism) to create members of a circuit in hardware through variable connections to perform a portion of a specific operation when in operation. Thus, in one example, the machine-readable medium element is part of a circuit, or is communicatively coupled to other components of a circuit when the device is running. In one example, any physical component can be used in multiple members of multiple circuits. For example, under operation, an execution unit can be used in a first circuit of a first circuit at one point in time and reused by a second circuit in the first circuit or a third circuit in the second circuit at a different time. The following are other examples of these components of machine 1000.

[0079] In alternative embodiments, the machine 1000 may be run as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, the machine 1000 may be run as a server machine, a client machine, or both in a server-client network environment. In one example, the machine 1000 may act as a peer machine in a peer-to-peer (P2P) (or other distributed) network environment. The machine 1000 may be a personal computer (PC), a tablet computer, a set-top box (STB), a personal digital assistant (PDA), a mobile phone, a network device, a network router, a switch or a bridge, or any machine capable of executing instructions (sequentially or otherwise) specifying the actions to be taken by the machine. In addition, although only a single machine is shown, the term "machine" should also be deemed to include any machine collection that executes a set (or multiple sets) of instructions individually or jointly to perform any one or more of the methods discussed herein, such as cloud computing, software as a service (SaaS), and other computer cluster configurations.

[0080] The machine (e.g., computer system) 1000 may include a hardware processor 1002 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a hardware processor core, or any combination thereof), a main memory 1004, a static memory (e.g., for firmware, microcode, basic input output (BIOS), unified extensible firmware interface (UEFI), etc.) 1006, and a mass storage 1008 (e.g., a hard drive, a tape drive, flash memory, or other block device), some or all of which may communicate with each other via an interconnect (e.g., a bus) 1030. The machine 1000 may also include a display unit 1010, an alphanumeric input device 1012 (e.g., a keyboard), and a user interface (UI) navigation device 1014 (e.g., a mouse). In one example, the display unit 1010, the input device 1012, and the UI navigation device 1014 may be a touch screen display. The machine 1000 may also include a storage device (e.g., a drive unit) 1008, a signal generating device 1018 (e.g., a speaker), a network interface device 1020, and one or more sensors 1016, such as a global positioning system (GPS) sensor, a compass, an accelerometer, or other sensors. The machine 1000 may include an output controller 1028, such as a serial (e.g., universal serial bus (USB), parallel or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection to communicate or control one or more peripheral devices (e.g., printers, card readers, etc.).

[0081] The registers of the processor 1002, main memory 1004, static memory 1006, or mass storage 1008 may be or include a machine-readable medium 1022 on which is stored one or more sets of data structures or instructions 1024 (e.g., software) embodying or used by any one or more of the techniques or functions described herein. The instructions 1024 may also reside, completely or at least partially, within any register of the processor 1002, main memory 1004, static memory 1006, or mass storage 1008 during execution of the instructions 1024 by the machine 1000. In one example, one or any combination of the hardware processor 1002, main memory 1004, static memory 1006, or mass storage 1008 may constitute the machine-readable medium 1022. Although the machine-readable medium 1022 is illustrated as a single medium, the term "machine-readable medium" may include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) configured to store one or more instructions 1024.

[0082] The term "machine-readable medium" may include any medium capable of storing, encoding or carrying instructions executed by the machine 1000 and causing the machine 1000 to perform any one or more of the techniques of the present disclosure, or any medium capable of storing, encrypting or carrying data structures used by or associated with these instructions. Non-limiting examples of machine-readable media may include solid-state memory, optical media, magnetic media, and signals (e.g., radio frequency signals, other photon-based signals, sound signals, etc.). In one example, a non-transitory machine-readable medium includes a machine-readable medium having a plurality of particles with a constant (e.g., stationary) mass, and is therefore a composition of matter. Therefore, a non-transitory machine-readable medium is a machine-readable medium that does not include transient propagating signals. Specific examples of non-transitory machine-readable media may include: non-volatile memory, such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices; disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

[0083] In one example, information stored on the machine-readable medium 1022 or otherwise provided may represent instructions 1024, such as the instructions 1024 themselves or a format from which the instructions 1024 may be derived. Such formats from which the instructions 1024 may be derived may include source code, encoded instructions (e.g., in compressed or encrypted form), packaged instructions (e.g., divided into multiple packets), etc. The information representing the instructions 1024 in the machine-readable medium 1022 may be processed by the processing circuitry into instructions to implement any of the operations discussed herein. For example, deriving the instructions 1024 from the information (e.g., processed by the processing circuitry) may include: compiling (e.g., from source code, object code, etc.), interpreting, loading, organizing (e.g., dynamically or statically linking), encoding, decoding, encrypting, decrypting, packaging, unpacking, or otherwise manipulating the information into instructions 1024.

[0084] In one example, derivation of instructions 1024 may include assembly, compilation, or interpretation of information (e.g., by processing circuitry) to create instructions 1024 from some intermediate or pre-processed format provided by machine-readable medium 1022. When provided in multiple parts, the information may be combined, unpacked, and modified to create instructions 1024. For example, the information may exist in multiple compressed source code packages (or object code, or binary executable code, etc.) on one or more remote servers. The source code packages may be encrypted when transmitted over the network, decrypted, decompressed, assembled (e.g., linked) as necessary, and compiled or interpreted on the local machine (e.g., compiled into a library, a stand-alone executable file, etc.) and then executed by the local machine.

[0085] The instructions 1024 may also be transmitted or received over a transmission medium via the network interface device 1020 over a communication network 1026 using any of a variety of transmission protocols (e.g., frame relay, Internet Protocol (IP), transmission control protocol (TCP), user datagram protocol (UDP), hypertext transfer protocol (HTTP), etc.). Example communication networks may include a local area network (LAN), a wide area network (WAN), a packet data network (e.g., the Internet), a LoRa / LoRaWAN or satellite communication network, a mobile phone network (e.g., a cellular network such as a network that complies with the 3G, 4G LTE / LTE-a, or 5G standards), a plain old telephone (POTS) network, and a wireless data network (e.g., a wireless network known as a Wi-Fi network). The Institute of Electrical and Electronics Engineers (IEEE) 802.11 family of standards, the IEEE 802.15.4 family of standards, peer-to-peer (P2P) networks, etc. In one example, the network interface device 1020 may include one or more physical jacks (e.g., Ethernet, coaxial cable, or telephone jacks) or one or more antennas to connect to the communication network 1026. In one example, the network interface device 1020 may include multiple antennas to wirelessly communicate using at least one of single-input multiple-output (SIMO), multiple-input multiple-input (MIMO), or multiple-input single-output (MISO) technology. The term "transmission medium" should be taken to include any intangible medium that can store, encode, or carry instructions executed by the machine 1000, including digital or analog communication signals or other intangible media to facilitate the communication of such software. Transmission media are machine-readable media.

[0086] Additional Notes and Examples

[0087] Example 1 is an integrated electronic module assembly, comprising: a substrate including conductive areas on opposite surfaces of the substrate; and a laminated bridge assembly, the laminated bridge assembly comprising: a dielectric material, the dielectric material forming a planar area and corresponding legs defining a cavity area, the corresponding legs including at least one corresponding interlayer interconnect; and a conductive layer, the conductive layer defining at least one corresponding pad area, the pad area being electrically coupled to the at least one corresponding interlayer interconnect; wherein the laminated bridge assembly is electrically and mechanically coupled to the substrate, the substrate including a first surface and an opposite second surface, the first surface including corresponding conductive areas, the at least one corresponding interlayer interconnect being electrically coupled to the corresponding conductive areas, and the opposite second surface including corresponding conductive areas forming terminals of the integrated electronic module assembly.

[0088] In Example 2, the subject matter of Example 1 may optionally include: wherein the at least one corresponding inter-layer interconnect comprises a via structure or a metal block, the via structure or the metal block being mechanically supported by the dielectric material.

[0089] In Example 3, the subject matter of any one or more of Examples 1-2 may optionally include at least one passive component electrically and mechanically coupled to the at least one corresponding pad region.

[0090] In Example 4, the subject matter of Example 3 can optionally include: wherein the at least one passive component is located on a surface of the dielectric material opposite the cavity region.

[0091] In Example 5, the subject matter of any one or more of Examples 1-4 optionally includes: wherein the configuration of at least one corresponding pad area is arranged to allow one or more laminate bridge components to be stacked on each other to provide electrical and mechanical interconnection between the one or more laminate bridge components and the substrate.

[0092] In Example 6, the subject matter of any one or more of Examples 1-5 optionally includes: wherein the configuration of the at least one corresponding pad area is arranged to allow one or more integrated electronic module assemblies to be stacked on each other to provide electrical and mechanical interconnection between the one or more integrated electronic assemblies.

[0093] In Example 7, the subject matter of any one or more of Examples 1-6 may optionally include: wherein a ratio of a height of the respective leg to a width of the respective leg exceeds 4:1.

[0094] In Example 8, the subject matter of any one or more of Examples 1-7 can optionally include wherein the planar region defines at least one hole to allow a sealant or coating to penetrate the cavity region.

[0095] In Example 9, the subject matter of any one or more of Examples 1-8 may optionally include wherein the laminate bridge assembly includes respective conductive regions configured to electrically interconnect electrical components on opposing surfaces.

[0096] In Example 10, the subject matter of Example 9 can optionally include an integrated circuit package electrically and mechanically coupled to a corresponding conductive region of the laminate bridge assembly in the cavity region.

[0097] In Example 11, the subject matter of any one or more of Examples 9-10 may optionally include: a second laminate assembly electrically and mechanically coupled to a corresponding conductive region of the laminate bridge assembly in the cavity region.

[0098] In Example 12, the subject matter of any one or more of Examples 1-11 may optionally include: wherein the planar region is shaped to fit around respective components mounted on the substrate.

[0099] In Example 13, the subject matter of any one or more of Examples 1-12 may optionally include: wherein a length of a power node inter-layer interconnection is greater than a length of a control node inter-layer interconnection.

[0100] In Example 14, the subject matter of any one or more of Examples 1-13 may optionally include: a metal block attached to a surface of the laminate bridge assembly in the cavity region, the metal block configured to dissipate heat.

[0101] Example 15 is an integrated electronic module assembly, comprising: a substrate; and a laminated bridge assembly, the laminated bridge assembly comprising: a dielectric material, the dielectric material forming a planar area and corresponding legs defining a cavity area, the corresponding legs including at least one corresponding interlayer interconnect; and a conductive layer, the conductive layer defining at least one corresponding pad area, the pad area being electrically coupled to the at least one corresponding interlayer interconnect; wherein the laminated bridge assembly is electrically and mechanically coupled to the substrate, wherein the integrated electronic module assembly provides a switching converter, wherein the laminated bridge assembly is electrically and mechanically coupled to serve as an inductor of an energy storage device.

[0102] In Example 16, the subject matter of Example 15 can optionally include: an integrated circuit package electrically and mechanically coupled to the laminate bridge assembly, wherein the integrated circuit package is located in the cavity region, wherein the inductor is located on a surface of the laminate bridge assembly opposite the cavity region.

[0103] Example 17 is a method for manufacturing an integrated circuit module assembly, the method comprising: placing a laminate bridge assembly on a substrate, the laminate bridge assembly comprising: a dielectric material, the dielectric material forming a planar area and corresponding legs defining a cavity area, the corresponding legs comprising at least one corresponding interlayer interconnect; and a conductive layer, the conductive layer defining at least one corresponding pad area, the pad area being electrically coupled to the at least one corresponding interlayer interconnect; and electrically and mechanically coupling the laminate bridge assembly to the substrate, wherein the substrate comprises a conductive area electrically coupled to at least one corresponding interlayer interconnect.

[0104] In Example 18, the subject matter of Example 17 optionally includes: placing a passive component on the planar region; and electrically and mechanically coupling the passive component to the planar region, including electrically coupling the passive component to the at least one corresponding pad region.

[0105] In Example 19, the subject matter of any one or more of Examples 17-18 can optionally include forming the respective legs by removing dielectric material between the respective legs.

[0106] In Example 20, the subject matter of Example 19 can optionally include: wherein forming the respective legs by removing dielectric material comprises removing the dielectric material by machining.

[0107] Example 21 is at least one machine-readable medium comprising instructions that, when executed by a processing circuit, cause the processing circuit to perform operations to implement any of Examples 1-20.

[0108] Example 22 is a device including the device of implementing any one of Examples 1 to 20.

[0109] Example 23 is a system implementing any one of Examples 1 to 20.

[0110] Example 24 is a method of implementing any one of Examples 1 to 20.

[0111] Each of the non-limiting aspects described above may stand alone or in various permutations or combinations with one or more of the other aspects or other subject matter described in this document.

[0112] The above detailed description includes reference to the accompanying drawings that form a part of the detailed description. The accompanying drawings show specific embodiments in which the present invention can be put into practice by way of illustration. These embodiments are also generally referred to as "examples". These examples may include elements other than those shown or described. However, the inventors also consider examples that only provide the shown or described elements. In addition, the inventors also consider examples of any combination or permutation of those elements (or one or more aspects thereof) shown or described, whether with respect to a specific example (or one or more aspects thereof) or with respect to other examples (or one or more aspects thereof) shown or described herein.

[0113] In the event of an inconsistency in usage between this document and any document incorporated by reference, the usage in this document shall control.

[0114] In this document, the terms "a" or "an" are common in patent documents and are used to include one or more, independent of any other instances or uses of "at least one" or "one or more." In this document, the term "or" is used to refer to a non-exclusive or, such that "A or B" includes "A but not B," "B but not A," and "A and B," unless otherwise noted. In this document, the terms "including" and "wherein" are used as synonyms for the respective terms "comprising" and "wherein." In addition, in the following claims, the terms "including" and "comprising" are open-ended, that is, systems, devices, articles, compositions, preparations, or methods that include other elements in addition to the elements listed after the term in the claim are still deemed to fall within the scope of the claim. In addition, in the following claims, the terms "first," "second," and "third," etc. are used merely as labels and are not intended to impose numerical requirements on their objects.

[0115] The method examples described herein may be implemented at least in part by a machine or computer. Some examples may include a computer-readable medium or a machine-readable medium encoded with instructions, which may be operable to configure an electronic device to perform the method described in the above examples. The implementation of this method may include code, such as microcode, assembly language code, high-level language code, etc. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Such instructions may be read and executed by one or more processors to implement the execution of operations including, for example, methods. Instructions may be in any suitable form, such as, but not limited to, source code, compiled code, interpreted code, executable code, static code, dynamic code, etc.

[0116] Furthermore, in one example, the code may be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, such as during execution or otherwise. Examples of such tangible computer-readable media may include, but are not limited to, hard disks, removable disks, removable optical disks (e.g., compact disks and digital video disks), cassettes, memory cards or sticks, random access memory (RAM), read-only memory (ROM), etc.

[0117] The above description is intended to be illustrative rather than limiting. For example, the above examples (or one or more aspects thereof) may be used in combination with each other. Other embodiments may be used, such as those available to a person of ordinary skill in the art after reading the above description. The abstract is provided to allow the reader to quickly determine the nature of the technical disclosure. The premise of submitting this document is that this document shall not be used to interpret or limit the scope or meaning of the claims. In addition, in the above detailed description, various features may be combined together to simplify the disclosure. This should not be interpreted as meaning that unclaimed public features are essential to any claim. On the contrary, the subject matter of the present invention may lie in the partial features of a particular disclosed embodiment. Therefore, the following claims are incorporated into the detailed description as examples or embodiments, each claim exists independently as a separate embodiment, and it is conceivable that these embodiments can be combined with each other in various combinations or arrangements. The scope of the present invention should be determined with reference to the attached claims and the full scope of equivalents enjoyed by these claims.

Claims

1. An integrated electronic module assembly, comprising: a substrate including conductive regions on opposing surfaces of the substrate; and A laminated bridge assembly, the laminated bridge assembly comprising: a dielectric material forming the planar region and respective legs defining the cavity region, the respective legs comprising at least one respective interlayer interconnect; and a conductive layer defining at least one corresponding pad region electrically coupled to the at least one corresponding inter-layer interconnect; Wherein, the laminate bridge assembly is electrically and mechanically coupled to the substrate, the substrate includes a first surface and an opposite second surface, the first surface includes corresponding conductive areas, the at least one corresponding interlayer interconnect is electrically coupled to the corresponding conductive areas, and the opposite second surface includes corresponding conductive areas forming terminals of the integrated electronic module assembly.

2. The integrated electronic module assembly of claim 1, wherein the at least one respective inter-layer interconnect comprises a via structure or a metal block, the via structure or the metal block being mechanically supported by the dielectric material.

3. The integrated electronic module assembly of claim 1, comprising at least one passive component electrically and mechanically coupled to the at least one corresponding pad area.

4. The integrated electronic module assembly of claim 3, wherein the at least one passive component is located on a surface of the dielectric material opposite the cavity region.

5. The integrated electronic module assembly of claim 1, wherein the configuration of the at least one corresponding pad area is arranged to allow one or more laminate bridge assemblies to be stacked on top of each other to provide electrical and mechanical interconnection between the one or more laminate bridge assemblies and the substrate.

6. The integrated electronic module assembly of claim 1, wherein the configuration of the at least one corresponding pad area is arranged to allow one or more integrated electronic module assemblies to be stacked on top of each other to provide electrical and mechanical interconnection between the one or more integrated electronic assemblies.

7. The integrated electronic module assembly of claim 1, wherein a ratio of a height of the respective leg to a width of the respective leg exceeds 4:

1.

8. The integrated electronic module assembly of claim 1, wherein the planar region defines at least one aperture to allow a sealant or coating to penetrate the cavity region.

9. The integrated electronic module assembly of claim 1, wherein the laminate bridge assembly includes respective conductive regions configured to electrically interconnect electrical components on opposing surfaces.

10. The integrated electronic module assembly of claim 9, comprising an integrated circuit package electrically and mechanically coupled to a corresponding conductive region of the laminate bridge assembly in the cavity region.

11. The integrated electronic module assembly of claim 9, comprising a second laminate assembly electrically and mechanically coupled to a corresponding conductive region of the laminate bridge assembly in the cavity region.

12. The integrated electronic module assembly of claim 1, wherein the planar region is shaped to fit around various components mounted on the substrate.

13. The integrated electronic module assembly of claim 1, wherein a length of the power node inter-layer interconnection is greater than a length of the control node inter-layer interconnection.

14. The integrated electronic module assembly of claim 1, comprising a metal block attached to a surface of the laminate bridge assembly in the cavity region, the metal block being configured to dissipate heat.

15. An integrated electronic module assembly comprising: substrate; and A laminated bridge assembly, the laminated bridge assembly comprising: a dielectric material forming the planar region and respective legs defining the cavity region, the respective legs comprising at least one respective interlayer interconnect; and a conductive layer defining at least one corresponding pad region electrically coupled to the at least one corresponding inter-layer interconnect; wherein the laminate bridge assembly is electrically and mechanically coupled to the substrate, wherein the integrated electronic module assembly provides a switching converter, and wherein the laminate bridge assembly is electrically and mechanically coupled to function as an inductor for an energy storage device.

16. The integrated electronic module assembly of claim 15, comprising an integrated circuit package electrically and mechanically coupled to the laminate bridge assembly, wherein the integrated circuit package is located in the cavity region, and wherein the inductor is located on a surface of the laminate bridge assembly opposite the cavity region.

17. A method of manufacturing an integrated circuit module assembly, the method comprising: Placing a laminate bridge assembly on a substrate, the laminate bridge assembly comprising: a dielectric material forming the planar region and respective legs defining the cavity region, the respective legs comprising at least one respective interlayer interconnect; and a conductive layer defining at least one corresponding pad region electrically coupled to the at least one corresponding inter-layer interconnect; and The laminate bridge assembly is electrically and mechanically coupled to the substrate, wherein the substrate includes a conductive region electrically coupled to at least one corresponding interlayer interconnect.

18. The method according to claim 17, comprising: placing passive components on the planar area; and Electrically and mechanically coupling the passive component to the planar region includes electrically coupling the passive component to the at least one corresponding pad region.

19. The method of claim 17, comprising forming the respective legs by removing dielectric material between the respective legs.

20. The method of claim 19, wherein forming the respective legs by removing dielectric material comprises removing the dielectric material by machining.

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