Terminal pin inserting machine and pin inserting method
By using thermal imaging components and thermal deformation components in the terminal pin machine, the thermal stress status of the terminal is monitored and adjusted in real time, the plugging problem caused by thermal stress concentration in the prior art is solved, and the terminal plugging with high accuracy and high reliability is achieved.
Patent Information
- Application Number
- CN202510384053.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2025-04-29
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing terminal plugging technology lacks real-time monitoring and feedback mechanism for thermal stress status, which leads to thermal stress concentration during the bending process, resulting in microcracks or fatigue fractures, affecting the interpolation accuracy and reliability.
A terminal pin machine is designed, using thermal imaging components to collect thermal image data of the terminal in real time, dynamically adjust the working temperature of the heating component through the control system, and calculate the correction amount of the bending gap in combination with the thermodynamic model, and drive the thermal deformation component to adjust the width of the bending gap to optimize the thermal stress distribution and plug-in state of the terminal.
Through real-time monitoring and dynamic adjustment of thermal stress state, the quality and reliability of terminal plugging are significantly improved, the deformation impact is reduced, and the matching accuracy between the terminal and the base is ensured to reach ±0.05mm.
Smart Images

Figure CN119905879A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of terminals, and in particular to a terminal pin insertion machine and a pin insertion method. Background Art
[0002] As electronic devices develop towards miniaturization and high density, terminal pins, as core components of circuit connections, have a direct impact on the performance stability of electronic products due to their plug-in accuracy and reliability. In the fields of automotive electronics, consumer electronics, and industrial control, terminal pins need to achieve high-strength conductive connections at millimeter-level sizes, especially in scenarios such as high-voltage connectors for new energy vehicles and miniaturized PCB boards. The matching accuracy between the terminal and the base must be as high as ±0.05mm. Terminal materials (such as phosphor bronze and copper alloys) are prone to microcracks or fatigue fractures due to thermal stress concentration during the bending process, further exacerbating the difficulty of process control.
[0003] In order to ensure production efficiency, existing terminal pin technologies mostly use a combination of mechanical crimping and hot pressing processes, which heats the terminal at a fixed temperature and then crimps it to the base. However, this type of technology has significant defects: the heating temperature and the bending gap are both preset fixed values and cannot be dynamically adjusted according to the real-time crimping status. Specifically, factors such as differences in the thermal expansion coefficient of the terminal material and ambient temperature fluctuations will cause the actual thermal stress distribution to deviate from the ideal state, and the existing technology lacks a real-time monitoring and feedback mechanism for the thermal stress state during the crimping process, and can only set process parameters through empirical values. For example, in the automotive connector pin scenario, due to the terminal thickness deviation (±0.02mm) or the base slot tolerance, hot pressing and bending under fixed parameters can easily produce local overstress, resulting in increased contact resistance or decreased mechanical strength after the terminal is plugged in.
[0004] In view of this, it is necessary to improve the terminal plugging equipment technology in the prior art to solve the technical problem that thermal compression deformation is easy to occur during the terminal plugging process. Summary of the invention
[0005] The object of the present invention is to provide a terminal pin insertion machine and a pin insertion method to solve the above technical problems.
[0006] To achieve this object, the present invention adopts the following technical solutions: A terminal pin insertion machine comprises a conveying base, the conveying base is used to drive a circuit base to be conveyed along its conveying path, and a terminal bending mechanism and a plug-in mechanism are arranged oppositely on two sides of the conveying base; The terminal bending mechanism comprises a main frame, a bending cavity is arranged in the middle of the main frame, a bottom plate is arranged at the bottom of the bending cavity, and a heating component is built in the bottom plate; a bending component is movably connected to the main frame, a first driving member for driving the bending component to swing is arranged at one end of the bending component, and the other end extends into the bending cavity and cooperates with the bottom plate to form a bending gap; A thermally controlled deformation component is provided between the bottom plate and the main frame, and the thermally controlled deformation component is used to change its height according to the temperature of the heating component to change the width of the bending gap; The plug-in mechanism includes a crimping assembly for pressing the terminal into the circuit base, and a thermal imaging assembly arranged on one side of the crimping assembly, the thermal imaging assembly being used to obtain thermal image data of the terminal during the pressing process; Also included is a control system, which is used to control the working temperature of the heating component according to the thermal image data.
[0007] Optionally, the crimping assembly includes a first fixed block, the first fixed block is provided with a sliding groove, a first crimping block is slidably arranged in the sliding groove, a second driving member is provided at the upper end of the first crimping block, and a plurality of first crimping protrusions arranged side by side are provided at the lower end of the first crimping block, and an avoidance groove is formed between two adjacent first crimping protrusions; wherein, transition inclined surfaces are respectively provided on both sides of the lower end of the first crimping block.
[0008] Optionally, the plug-in mechanism further comprises a base plate and two sets of auxiliary pressing mechanisms, and the two sets of auxiliary pressing mechanisms are respectively arranged on both sides of the crimping assembly; The base plate is provided with a slide rail along a first direction, the auxiliary pressing mechanism comprises a fixedly connected mounting block and a slider, the slider is slidably connected to the slide rail, a second crimping block is provided on a side of the mounting block close to the crimping assembly, a notch groove is provided on a side of the mounting block away from the crimping assembly, and a first pin is provided at a preset position of the notch groove; The base plate is also provided with a third driving member and a second fixing block, the driving end of the third driving member is provided with a second pin shaft, a transmission rod is provided between the first pin shaft and the second pin shaft, and both ends of the transmission rod are respectively provided with arched grooves, and the first pin shaft and the second pin shaft are respectively accommodated in the corresponding arched grooves; The second fixing block is provided with a third pin shaft, and a shaft hole is opened at a preset position of the transmission rod, and the transmission rod is rotatably connected to the third pin shaft through the shaft hole, so that the transmission rod swings around the third pin shaft; Wherein, the distance between the first pin shaft and the third pin shaft is much smaller than the distance between the second pin shaft and the third pin shaft.
[0009] Optionally, a feeding mechanism is further provided on one side of the terminal bending mechanism, the feeding mechanism comprises a channel component for conveying the terminal blank, and a shaping component for adjusting the position of the terminal blank is provided at the first end of the channel component; The second end of the channel assembly is provided with a clamping claw assembly for clamping the terminal, and a linear module for driving the clamping claw assembly to move along the second direction.
[0010] Optionally, a loading conveyor belt for loading the circuit base is further provided at one end of the conveying path, and a transfer assembly is provided between the loading conveyor belt and the conveying base; The transfer assembly includes a fourth driving member and a transfer plate arranged at the driving end of the fourth driving member, and the transfer plate is used for caching and transporting the circuit base.
[0011] Optionally, it further comprises a pressing mechanism arranged behind the plug-in mechanism, the pressing mechanism comprising a guide column assembly and a lifting assembly, and a pressing head assembly is arranged at the driving end of the lifting assembly; The pressure head assembly is slidably connected to the guide column assembly, a spring assembly is sleeved on the guide column assembly, and a protrusion is arranged at the lower end of the pressure head assembly.
[0012] Optionally, a plurality of positioning assemblies are arranged along the conveying path, the positioning assemblies comprising a fixed seat, the fixed seat being hinged with a telescopic cylinder, one end of a piston rod of the telescopic cylinder being rotatably connected to a first rotating shaft body, and the first rotating shaft body being connected to a positioning block; One side of the positioning block is provided with a positioning groove for clamping the circuit base, and the other side is provided with a second rotating shaft body, and the positioning block is rotated on the conveying base through the second rotating shaft body; Wherein, the telescopic cylinder operates to drive the positioning block to rotate around the second rotating shaft.
[0013] The present invention also provides a pin insertion method of a terminal pin insertion machine, which is applied to the terminal pin insertion machine as described above, and the pin insertion method specifically comprises the following steps: The circuit base is conveyed to the plug-in station along the conveying path by the conveying base, and the first driving member is started to drive the bending assembly to swing. When the heating assembly is heated to a preset temperature, the terminal is hot-pressed and bent through the bending gap. The thermal control deformation assembly adjusts the bottom plate height based on the initial temperature so that the bending gap reaches a reference width. Establish a thermal stress simulation model based on the material parameters and geometric dimensions of the terminal, generate benchmark thermal stress distribution parameters and set the thermal imaging monitoring area; In the process of the crimping assembly pressing the terminal into the circuit base, the thermal image data of the terminal is collected in real time by the thermal imaging assembly, and multi-dimensional feature analysis is performed on the thermal image data; According to the analysis results of the thermal image data, the working temperature of the heating component is dynamically adjusted through the control system, and the correction amount of the bending gap is calculated in combination with the thermodynamic model, and the thermal control deformation component is driven to change the bottom plate height to optimize the width of the bending gap; The terminals are continuously crimped based on the adjusted temperature parameters and bending gap width, and the thermal stress simulation model is updated after a preset number of crimpings to iteratively optimize the mapping relationship between the temperature control parameters and the bending gap correction amount.
[0014] Optionally, during the process of the crimping assembly pressing the terminal into the circuit base, the thermal image data of the terminal is collected in real time by the thermal imaging assembly, and a multi-dimensional feature analysis is performed on the thermal image data, specifically including: The infrared thermal spectrum image during the terminal crimping process is collected by the thermal imaging component at a preset sampling frequency, and the thermal spectrum image is transmitted to the image processing module of the control system; Perform spatial domain analysis on the collected thermal spectrum images, identify the temperature distribution characteristics of the terminal surface through convolutional neural networks, and extract local hot spot areas where the temperature gradient is greater than the preset threshold; Based on the time series, the thermal spectrum image of the hot spot area is analyzed in the time domain, the heat diffusion time series matrix is constructed, and the change value of the heat flow rate of each hot spot area is calculated; Perform spectrum analysis on the change value of heat flow rate, extract high-frequency fluctuation components in the thermal spectrum image through fast Fourier transform, and calculate the energy distribution of high-frequency fluctuation components; The results of spatial domain analysis, time domain analysis and spectrum analysis are integrated to generate a thermal stress distribution characteristic diagram of the terminal, and the thermal stress distribution characteristic diagram is input into the thermodynamic simulation model of the control system.
[0015] Optionally, the method dynamically adjusts the working temperature of the heating component through the control system according to the analysis result of the thermal image data, calculates the correction amount of the bending gap in combination with the thermodynamic model, and drives the thermal control deformation component to change the bottom plate height to optimize the width of the bending gap, specifically including: Based on the thermal stress distribution characteristic diagram, the thermal stress deviation value of each area of the terminal is calculated through the thermodynamic simulation model of the control system, and the temperature compensation requirement parameters are generated; According to the temperature compensation requirement parameters, the temperature adjustment amount of the heating component is calculated by the PID control algorithm, and the temperature adjustment amount is converted into a power control signal of the heating component; Based on the adjusted temperature parameters, the correction amount of the bending gap is calculated through the thermodynamic simulation model, and the displacement control instructions of the thermal control deformation component are generated in combination with the material properties of the terminal; The displacement control instruction is transmitted to the thermal control deformation component, and the thermal control deformation component is driven to change the height of the bottom plate so that the width of the bending gap reaches the optimized target value; The width change of the bending gap is monitored in real time, and the temperature parameters of the heating component and the displacement control instructions of the thermal control deformation component are adjusted through the feedback control loop until the thermal stress distribution meets the preset threshold range.
[0016] Compared with the prior art, the present invention has the following beneficial effects: the conveying base drives the circuit base to be conveyed along its conveying path to the position of the plug-in mechanism, and at the same time, the first driving member drives the bending assembly to swing so as to hot-press and bend the terminal in the bending gap, and then the bent terminal is placed above the card slot of the circuit base, and the plug-in mechanism is operated, and the terminal is plugged and pressed into the card slot through the crimping assembly, and at the same time, the thermal imaging assembly obtains the thermal image data of the terminal during the pressing process, and the thermal stress distribution state of the terminal is judged based on the thermal image data, so as to adjust the working temperature of the heating assembly to control the working temperature of the heating assembly, and change the height of the thermal control deformation assembly according to the temperature of the heating assembly, and push the bottom plate to rise to change the width of the bending gap, so as to fine-tune the arc and thermal stress distribution of the terminal being pressed, thereby optimizing the crimping state, reducing the influence of terminal deformation during the pressing process, and improving the quality of terminal plugging, thereby providing a high-quality terminal pin insertion machine. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0018] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.
[0019] Figure 1 This is a schematic diagram of the overall structure of the terminal pin insertion machine of the first embodiment of the present invention; Figure 2 It is a front view structural schematic diagram of the plug-in mechanism of the terminal pin insertion machine of the first embodiment of the present invention; Figure 3 This is a schematic diagram of the axial structure of the plug-in mechanism of the terminal pin insertion machine of the first embodiment of the present invention; Figure 4 This is a schematic diagram of the exploded structure of the auxiliary pressing mechanism of the terminal pin insertion machine of the first embodiment; Figure 5It is a structural schematic diagram of the crimping part of the plug-in mechanism of the terminal pin insertion machine of the first embodiment of the present invention; Figure 6 It is a structural schematic diagram of the terminal bending mechanism of the terminal pin insertion machine of the first embodiment of the present invention; Figure 7 It is a front view structural schematic diagram of the terminal bending mechanism of the terminal pin insertion machine of the first embodiment of the present invention; Figure 8 It is a structural schematic diagram of the pressing mechanism of the terminal pin insertion machine of the first embodiment of the present invention; Fig. 9 It is a schematic structural diagram of the conveying base of the terminal pin insertion machine of the first embodiment of the present invention.
[0020] Illustrations: conveying base 100, conveying path 110, terminal bending mechanism 200, plug-in mechanism 300, bending gap 201, main frame 210, bending cavity 220, bottom plate 230, bending assembly 240, first driving member 250, thermal control deformation assembly 260, crimping assembly 310, thermal imaging assembly 320, first fixing block 311, first crimping block 312, second driving member 313, first crimping protrusion 314, transition slope 315, base plate 330, auxiliary pressing mechanism 340, slide rail 331, mounting block 341, slider 342, second crimping block 343 , notched groove 344, a first pin shaft 345, a third driving member 332, a second fixed block 333, a second pin shaft 334, a transmission rod 335, an arched groove 336, a third pin shaft 337, a feeding mechanism 400, a channel assembly 410, a shaping assembly 420, a feeding conveyor belt 500, a transfer assembly 600, a pressing mechanism 700, a guide column assembly 710, a lifting assembly 720, a pressure head assembly 730, a raised portion 731, a positioning assembly 120, a fixed seat 121, a telescopic cylinder 122, a first rotating shaft body 123, a positioning block 124, a positioning groove 125, and a second rotating shaft body 126. DETAILED DESCRIPTION
[0021] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.
[0023] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.
[0024] Embodiment 1: Combination Figures 1 to 9 As shown, an embodiment of the present invention provides a terminal pin insertion machine, including a conveying base 100, the conveying base 100 is used to drive the circuit base to be conveyed along its conveying path 110, and the two sides of the conveying base 100 are oppositely provided with a terminal bending mechanism 200 and a plugging mechanism 300; It should be noted that this symmetrical layout design can achieve the bending and plugging of the terminal at the same station, thereby improving production efficiency. The conveying path 110 of the conveying base 100 needs to be precisely matched with the action sequence of the bending mechanism and the plugging mechanism 300 to ensure that the terminal can be accurately aligned with the plugging position of the circuit base after bending.
[0025] The terminal bending mechanism 200 includes a main frame 210, a bending cavity 220 is arranged in the middle of the main frame 210, a bottom plate 230 is arranged at the bottom of the bending cavity 220, and a heating component (not shown in the figure) is built in the bottom plate 230; a bending component 240 is movably connected to the main frame 210, and one end of the bending component 240 is provided with a first driving member 250 for driving the bending component 240 to swing, and the other end extends into the bending cavity 220 and cooperates with the bottom plate 230 to form a bending gap 201.
[0026] The bending assembly 240 is driven by a first driving member 250 (such as a servo motor or a cylinder) to press the terminal into the bending cavity 220 through a swinging motion.
[0027] The bending gap 201 is formed by the gap between the bending assembly 240 and the bottom plate 230, and its width determines the curvature of the terminal bending. The heating assembly adjusts the plastic deformation capacity of the terminal by controlling the temperature to ensure that the terminal will not break or be excessive during the bending process.
[0028] A thermally controlled deformation component 260 is arranged between the base plate 230 and the main frame 210, and the thermally controlled deformation component 260 is used to change its height according to the temperature of the heating component to change the width of the bending gap 201; the plug-in mechanism 300 includes a crimping component 310 for pressing the terminal into the circuit base, and a thermal imaging component 320 arranged on one side of the crimping component 310, and the thermal imaging component 320 is used to obtain thermal image data of the terminal during the pressing process.
[0029] The thermal control deformation component 260 is a core component for realizing dynamic adjustment of the bending gap 201, and its working principle is as follows: Temperature response: The thermally controlled deformation component 260 can deform according to the temperature change of the heating component, which is usually manifested as thermal expansion or thermal contraction.
[0030] Height adjustment: The height of the bottom plate 230 is changed by deformation, thereby adjusting the width of the bending gap 201. For example, when the temperature rises, the thermal control deformation component 260 expands, pushing the bottom plate 230 up, reducing the bending gap 201; conversely, when the temperature drops, the thermal control deformation component 260 contracts, the bottom plate 230 drops, and the bending gap 201 increases.
[0031] Dynamic optimization: Combined with the feedback of the control system, the thermally controlled deformation component 260 can adjust the bending gap 201 in real time to ensure that the curvature of the terminal bending and the thermal stress distribution reach the optimal state.
[0032] The terminal pin insertion machine also includes a control system, which is used to control the working temperature of the heating component according to the thermal image data.
[0033] The control system is the core control unit of the entire equipment, and its working principle is as follows: Data acquisition and processing: Receive the thermal image data transmitted by the thermal imaging component 320, and extract the temperature distribution characteristics of the terminal through the image processing algorithm.
[0034] Temperature control: Dynamically adjust the operating temperature of the heating component based on the analysis results of the thermal image data. For example, when it is detected that the local temperature of the terminal is too high, the heating power is reduced; when the temperature is too low, the heating power is increased.
[0035] Closed-loop feedback: Through the coordinated work of the thermally controlled deformation component 260 and the heating component, closed-loop control of the bending gap 201 and the temperature is achieved to ensure the quality of the terminal bending and plugging.
[0036] It should be noted that the thermally controlled deformation component 260 in this solution can be a shape memory alloy, such as nickel-titanium alloy, which can undergo controllable hard deformation at a specific temperature and is suitable for high-precision gap adjustment.
[0037] Structural design of thermal control deformation component 260 Multilayer lamination structure: It is composed of multiple layers of cemented carbide sheets, which produce overall deformation through thermal expansion to ensure uniform and stable deformation; a thermistor or thermocouple is embedded in the thermal control deformation component 260 to monitor temperature changes in real time and feed back to the control system to achieve precise control. Rigid support frame: A rigid support frame is set outside the thermal control deformation component 260 to limit its lateral deformation, ensure that the deformation direction is limited to the vertical direction, and avoid floating of the terminal during the bending process.
[0038] The working principle of the present invention is as follows: the conveying base 100 drives the circuit base to be conveyed along its conveying path 110 to the position of the plug-in mechanism 300, and at the same time, the first driving member 250 drives the bending component 240 to swing, so as to hot-press and bend the terminal in the bending gap 201, and then put the bent terminal into the card slot above the circuit base, and the plug-in mechanism 300 is operated, and the terminal is inserted and pressed into the card slot through the crimping component 310, and at the same time, the thermal imaging component 320 obtains the thermal image data of the terminal during the pressing process, and judges the thermal stress distribution state of the terminal based on the thermal image data, thereby adjusting the working temperature of the heating component to control the working temperature of the heating component, and changing the height of the thermal control deformation component 260 according to the temperature of the heating component, pushing the bottom plate 230 to rise to change the width of the bending gap 201, thereby fine-tuning the arc and thermal stress distribution of the terminal being pressed, thereby optimizing the crimping state, reducing the influence of terminal deformation during the pressing process, and improving the quality of terminal plugging, providing a high-quality terminal pin insertion machine.
[0039] In this embodiment, the crimping assembly 310 includes a first fixed block 311, the first fixed block 311 is provided with a sliding groove, a first crimping block 312 is slidably arranged in the sliding groove, a second driving member 313 is provided at the upper end of the first crimping block 312, and a plurality of first crimping protrusions 314 arranged side by side are provided at the lower end of the first crimping block 312, and an avoidance groove is formed between two adjacent first crimping protrusions 314; wherein, transition inclined surfaces 315 are respectively provided on both sides of the lower end of the first crimping block 312.
[0040] It should be noted that the second driving member 313 drives the first crimping block 312 to move downward along the sliding groove, and the first crimping protrusion 314 is aligned with the terminal body; the transition slope 315 contacts the side of the terminal, and corrects the horizontal position of the terminal through the guiding action of the slope to ensure that the terminal body is aligned with the slot of the circuit base.
[0041] The first crimping protrusion 314 applies vertical downward pressure to the terminal body to press the terminal body into the slot, while avoiding the elastic protrusion or other structures around the slot to avoid mechanical interference during the crimping process.
[0042] After the crimping is completed, the second driving member 313 drives the first crimping block 312 to rise and reset, preparing for the next crimping cycle. Avoidance groove design: The clearance design of the avoidance groove solves the interference problem between the terminal and the surrounding structure of the card slot when the terminal is pressed in, avoiding damage to the circuit base during the crimping process. Transition slope 315 guides: ensures the positioning of the terminal, reduces the position deviation during the crimping process, and improves the plug-in yield.
[0043] In this embodiment, the plug-in mechanism 300 also includes a base plate 330 and two sets of auxiliary pressing mechanisms 340, and the two sets of auxiliary pressing mechanisms 340 are respectively arranged on both sides of the crimping assembly 310; the base plate 330 is provided with a slide rail 331 along the first direction, and the auxiliary pressing mechanism 340 includes a fixedly connected mounting block 341 and a slider 342, and the slider 342 is slidably connected to the slide rail 331, and a second crimping block 343 is provided on one side of the mounting block 341 close to the crimping assembly 310, and a notch groove 344 is provided on one side of the mounting block 341 away from the crimping assembly 310, and a first pin shaft 345 is provided at a preset position of the notch groove 344.
[0044] A third driving member 332 and a second fixed block 333 are also provided on the base plate 330. A second pin shaft 334 is provided at the driving end of the third driving member 332. A transmission rod 335 is provided between the first pin shaft 345 and the second pin shaft 334. Arched grooves 336 are respectively provided at both ends of the transmission rod 335. The first pin shaft 345 and the second pin shaft 334 are respectively accommodated in the corresponding arched grooves 336; a third pin shaft 337 is provided on the second fixed block 333. An axial hole is provided at a preset position of the transmission rod 335. The transmission rod 335 is rotatably connected to the third pin shaft 337 through the axial hole, so that the transmission rod 335 swings around the third pin shaft 337; wherein, the spacing from the first pin shaft 345 to the third pin shaft 337 is much smaller than the spacing from the second pin shaft 334 to the third pin shaft 337.
[0045] It should be noted that the third driving member 332 pushes the second pin shaft 334 to move in a linear direction, and the second pin shaft 334 transmits the motion through the arched groove 336 of the transmission rod 335 .
[0046] Lever amplification mechanism: The transmission rod 335 swings around the third pin 337. Since the distance (L1) from the first pin 345 to the third pin 337 is much smaller than the distance (L2) from the second pin 334 to the third pin 337, a torque amplification effect with a lever ratio of L2 / L1 is formed (for example, L2=51L2=5L1, then the output force is amplified 5 times).
[0047] The swing of the transmission rod 335 drives the mounting block 341 to move horizontally along the slide rail 331 through the first pin 345, and the second crimping block 343 is then pushed toward the crimping assembly 310, applying additional lateral pressure to the elastic protrusion area of the terminal. The main crimping assembly 310 (first crimping block 312) is vertically pressed into the terminal body; the auxiliary pressing mechanism 340 (second crimping block 343) applies horizontal pressure to overcome the resistance of the elastic protrusion and ensure that the terminal is completely inserted into the slot.
[0048] Reset stage: The third driving member 332 retracts, and the transmission rod 335 swings in the opposite direction, driving the second crimping block 343 to return to the initial position. Lever force amplification design: Through the lever principle of the transmission rod 335, the input force of the third driving member 332 is amplified to solve the problem of high pressure required in the elastic protrusion area, avoid the use of high-power driving elements, and reduce energy consumption. Adaptability of the arched groove 336: The arched grooves 336 at both ends of the transmission rod 335 allow the first pin 345 and the second pin 334 to adapt to position changes during movement to avoid the mechanism from getting stuck.
[0049] As an example of the advantages of this solution, the timing of the main crimping and the auxiliary crimping is as follows: The main crimping assembly 310 (first crimping block 312) first presses the terminal body into the slot; the auxiliary pressing mechanism 340 (second crimping block 343) then applies lateral pressure to the elastic raised area to ensure that the terminal is fully locked.
[0050] Complementary movement direction: the main crimping is vertical, and the auxiliary crimping is horizontal, forming a multi-dimensional crimping force to avoid terminal deformation or slot damage caused by unidirectional pressure.
[0051] In summary, this solution proposes corresponding solutions to the following technical difficulties of the existing technology, which are analyzed as follows: 1. Difficulty in crimping the elastic protrusion of the circuit base: The elastic protrusion of the circuit base slot requires a large crimping force to deform it and clamp the terminal.
[0052] The solution of this scheme is to achieve a high-pressure connection effect with a smaller driving force through the lever force amplification design of the auxiliary pressing mechanism 340.
[0053] 2. Traditional vertical crimping may cause the terminal to not be fully inserted due to insufficient pressure, or damage the card slot due to excessive pressure.
[0054] The solution of this scheme is: horizontal lateral pressure and vertical crimping form a combined force to disperse stress concentration and protect the card slot structure.
[0055] In this embodiment, a feeding mechanism 400 is also provided on one side of the terminal bending mechanism 200, and the feeding mechanism 400 includes a channel component 410 for conveying the terminal blank, and a shaping component 420 for adjusting the position of the terminal blank is provided at the first end of the channel component 410; a clamping jaw component for clamping the terminal, and a linear module (not shown in the figure) for driving the clamping jaw component to move along the second direction are provided at the second end of the channel component 410.
[0056] The terminal blank enters the channel assembly 410 through a vibrating plate or a conveyor belt and moves to the shaping station along a preset path. The shaping assembly 420 adjusts the posture of the terminal to ensure that the terminal is aligned with the bending gap 201 of the bending mechanism. The claw assembly grabs the corrected terminal, and the linear module drives the clamping claw to move along the second direction to accurately place the terminal at the entrance position of the bending gap 201.
[0057] In this embodiment, a loading conveyor belt 500 for loading the circuit base is also provided at one end of the conveying path 110, and a transfer assembly 600 is provided between the loading conveyor belt 500 and the conveying base 100; the transfer assembly 600 includes a fourth driving member and a transfer plate arranged at the driving end of the fourth driving member, and the transfer plate is used for caching and conveying the circuit base.
[0058] The feeding conveyor belt 500 transports the circuit base to the transfer station, and the sensor detects the in-position signal. Buffering: The transfer plate receives and caches multiple circuit bases to avoid the rhythm conflict between the conveying base 100 and the feeding conveyor belt 500. Transfer: The fourth drive member drives the transfer plate to move and transfer the circuit base to the starting position of the conveying base 100 to ensure alignment with the conveying path 110. Timing synchronization: The transfer action is linked with the start and stop signals of the conveying base 100 to achieve seamless connection.
[0059] In this embodiment, the terminal pin insertion machine also includes a pressing mechanism 700 arranged behind the plug-in mechanism 300, and the pressing mechanism 700 includes a guide column assembly 710 and a lifting assembly 720. The driving end of the lifting assembly 720 is provided with a pressing head assembly 730; the pressing head assembly 730 is slidably connected to the guide column assembly 710, and a spring assembly is sleeved on the guide column assembly 710. The lower end of the pressing head assembly 730 is provided with a protrusion 731.
[0060] The lifting assembly 720 drives the pressing head assembly 730 to press down, and the protrusion 731 contacts the plugged terminal.
[0061] Pressure holding stage: The pressure head assembly 730 continuously applies pressure (5-10 seconds), and the spring assembly absorbs the overload pressure to prevent damage to the terminal or circuit base.
[0062] Uniform stress distribution: The multi-point contact design of the protrusion 731 evenly distributes the pressure to the contact surface between the terminal and the slot, eliminating local stress concentration.
[0063] Reset return stroke: After the pressure maintenance is completed, the lifting assembly 720 lifts the pressure head assembly 730, and the spring assembly assists in rapid reset.
[0064] In this embodiment, several groups of positioning components 120 are arranged along the conveying path 110, and the positioning components 120 include a fixed seat 121, and the fixed seat 121 is hinged with a telescopic cylinder 122, one end of the piston rod of the telescopic cylinder 122 is rotatably connected to a first rotating shaft body 123, and the first rotating shaft body 123 is connected to a positioning block 124; one side of the positioning block 124 is provided with a positioning groove 125 for clamping the circuit base, and the other side is provided with a second rotating shaft body 126, and the positioning block 124 is rotated on the conveying base 100 through the second rotating shaft body 126; wherein, the telescopic cylinder 122 operates to drive the positioning block 124 to rotate around the second rotating shaft body 126.
[0065] When the circuit base is transported to the target station, the sensor sends a signal to start the telescopic cylinder 122. The telescopic cylinder 122 contracts, and pulls the positioning block 124 to rotate around the second rotating shaft 126 through the first rotating shaft 123, so that the positioning groove 125 is stuck in the edge of the circuit base. The limiting surface of the positioning groove 125 blocks the circuit base from moving further, achieving precise positioning.
[0066] Release and reset: After the plugging is completed, the telescopic cylinder 122 extends, driving the positioning block 124 to rotate in the opposite direction, releasing the circuit base to continue conveying.
[0067] Embodiment 2: The present invention also provides a pin insertion method of a terminal pin insertion machine, which is applied to the terminal pin insertion machine of the first embodiment. The pin insertion method specifically comprises the following steps: S1, the circuit base is transported to the plug-in station along the transport path 110 by the transport base 100, and the first driving member 250 is started to drive the bending assembly 240 to swing. When the heating assembly is heated to a preset temperature, the terminal is hot-pressed and bent through the bending gap 201. The thermal control deformation assembly 260 adjusts the height of the bottom plate 230 based on the initial temperature so that the bending gap reaches a reference width; The conveying base 100 is driven by a motor to accurately convey the circuit base along a preset path to the plug-in station to ensure that the terminal plug-in position is aligned with the bending mechanism. The first driving member 250 (such as a servo motor or a cylinder) drives the bending assembly 240 to swing, so that one end of the bending assembly 240 enters the bending cavity 220 and forms a bending gap with the bottom plate 230.
[0068] Heating and hot pressing bending: The heating component heats up to a preset temperature (e.g., 120-150°C) to locally heat the terminal, reducing its yield strength for easier bending. The thermally controlled deformation component 260 adjusts the height of the bottom plate 230 according to the initial temperature so that the bending gap reaches a reference width (e.g., 0.8-1.2mm) to ensure that the curvature of the terminal bending is consistent.
[0069] S2, establishing a thermal stress simulation model based on the material parameters and geometric dimensions of the terminal, generating benchmark thermal stress distribution parameters and setting the thermal imaging monitoring area; Material parameter input: Input the material properties (such as elastic modulus and thermal expansion coefficient of copper alloy) and geometric dimensions (such as thickness 0.3mm and width 2.5mm) of the terminal.
[0070] Simulation model construction: The thermal-mechanical coupling model of the terminal is established through finite element analysis (FEA) to simulate the thermal stress distribution during bending and crimping.
[0071] Benchmark parameter generation: Calculate the thermal stress distribution curve of the terminal under ideal conditions as a reference for subsequent optimization.
[0072] Monitoring area setting: Based on the simulation results, the key monitoring areas (such as the terminal root and the bending part) of the thermal imaging component 320 are determined to ensure that the temperature and stress data of the key parts are accurately collected.
[0073] S3, when the crimping assembly 310 presses the terminal into the circuit base, the thermal imaging assembly 320 collects thermal image data of the terminal in real time, and performs multi-dimensional feature analysis on the thermal image data; The thermal imaging component 320 collects infrared thermal spectrum images during the terminal crimping process at a high frequency (eg, 100 Hz) to obtain temperature distribution data of the terminal.
[0074] Spatial domain analysis: Identify the temperature gradient on the terminal surface through image processing algorithms (such as convolutional neural networks) and extract local hot spot areas (temperature gradient > 15℃ / mm²).
[0075] Time domain analysis: Construct the heat diffusion timing matrix, calculate the change value of the heat flow rate in the hot spot area, and analyze the thermal conduction characteristics of the terminal.
[0076] Spectral analysis: Perform fast Fourier transform (FFT) on the change value of heat flow rate, extract high-frequency fluctuation components (>50Hz), and identify abnormal thermal stress fluctuations.
[0077] S4, dynamically adjusting the working temperature of the heating component through the control system according to the analysis result of the thermal image data, and calculating the correction amount of the bending gap in combination with the thermodynamic model, driving the thermal control deformation component 260 to change the height of the bottom plate 230 to optimize the width of the bending gap; According to the analysis results of the thermal image data, the temperature adjustment amount of the heating component (such as ±5°C) is calculated through the PID control algorithm, and the heating power is adjusted in real time. Based on the thermodynamic model, the correction amount of the bending gap (such as ±0.05mm) is calculated, and the thermal control deformation component 260 is driven to change the height of the bottom plate 230 to optimize the bending gap width.
[0078] Closed-loop control: Through the feedback control loop, the bending gap and temperature parameters are monitored in real time to ensure that the curvature of the terminal bending and the thermal stress distribution are in the optimal state.
[0079] S5, continuously crimping the terminals based on the adjusted temperature parameters and bending gap width, and updating the thermal stress simulation model after a preset number of crimpings, and iteratively optimizing the mapping relationship between the temperature control parameters and the bending gap correction amount.
[0080] Under the optimized temperature and gap parameters, the terminals are continuously crimped to ensure the consistent plug-in quality of each terminal. After a certain number of crimps (e.g. 50 times), the actual thermal stress data is collected and compared with the simulation model.
[0081] Model update: Use algorithms such as transfer learning to optimize the weight parameters of the thermal stress simulation model to improve the prediction accuracy of the model. Based on the updated model, regenerate the mapping relationship between the temperature control parameters and the bending gap correction amount to achieve continuous optimization.
[0082] In this embodiment, it is specifically described that S3 specifically includes: S31, collecting infrared thermal spectrum images during the terminal crimping process at a preset sampling frequency through the thermal imaging component 320, and transmitting the thermal spectrum images to an image processing module of the control system; The thermal imaging component 320 (such as an infrared thermal imager) collects infrared thermal images in the terminal crimping process in real time at a high sampling frequency (such as 100 Hz) to obtain the temperature distribution data of the terminal. The collected thermal images are transmitted to the image processing module of the control system through a high-speed communication interface (such as Ethernet or USB3.0) to ensure the real-time and integrity of the data. During the transmission process, the thermal images are denoised and calibrated to eliminate environmental interference and sensor errors.
[0083] S32, performing spatial domain analysis on the acquired thermal spectrum image, identifying the temperature distribution characteristics of the terminal surface through a convolutional neural network, and extracting local hot spot areas where the temperature gradient is greater than a preset threshold; The collected thermal spectrum images are analyzed in the spatial domain, and the temperature distribution characteristics of the terminal surface are identified through intelligent algorithms (such as convolutional neural network models), and local hot spot areas with temperature gradients greater than a preset threshold are extracted.
[0084] S33, performing time domain analysis on the thermal spectrum image of the hot spot area based on the time series, constructing a heat diffusion time series matrix, and calculating the heat flow rate change value of each hot spot area; Based on the time series, the thermal spectrum image of the hot spot area is analyzed in the time domain, the heat diffusion time series matrix is constructed, and the change value of the heat flow rate of each hot spot area is calculated.
[0085] Time series construction: Arrange the thermal spectrum images of the hot spot area in chronological order to construct the heat diffusion time series matrix.
[0086] Heat flow rate calculation: Calculate the temperature change (ΔT) between adjacent time points.
[0087] The heat flow rate (Q) is calculated according to the heat conduction formula Q=k⋅A⋅(ΔT / d), where k is the thermal conductivity of the material, A is the area of the hot spot, and d is the heat conduction distance.
[0088] Change value analysis: Analyze the changing trend of heat flow rate and identify abnormal fluctuations (such as sudden increase or decrease).
[0089] S34, performing spectrum analysis on the heat flow rate change value, extracting high-frequency fluctuation components in the thermal spectrum image by fast Fourier transform, and calculating energy distribution of the high-frequency fluctuation components; The spectrum analysis of the heat flow rate change is performed, the high-frequency fluctuation components in the thermal spectrum image are extracted by fast Fourier transform, and the energy distribution of the high-frequency fluctuation components is calculated.
[0090] Fast Fourier Transform (FFT): Convert the heat flow rate change value from the time domain to the frequency domain to generate a spectrum diagram.
[0091] High-frequency fluctuation extraction: Identify the fluctuation components in the spectrum graph that are higher than a preset frequency (such as 50Hz) and analyze their amplitude and phase.
[0092] Energy distribution calculation: Calculate the energy density of high-frequency fluctuation components and evaluate their impact on the terminal thermal stress distribution.
[0093] S35, integrating the results of the spatial domain analysis, the time domain analysis and the spectrum analysis to generate a thermal stress distribution characteristic diagram of the terminal, and inputting the thermal stress distribution characteristic diagram into a thermodynamic simulation model of the control system.
[0094] The results of spatial domain analysis, time domain analysis and spectrum analysis are integrated to generate a thermal stress distribution characteristic diagram of the terminal, and the thermal stress distribution characteristic diagram is input into the thermodynamic simulation model of the control system.
[0095] Feature fusion: Weighted fusion of the hot spot area in the spatial domain, the heat flow rate change value in the time domain, and the high-frequency fluctuation energy in the spectrum domain. Generate a comprehensive thermal stress distribution feature map to reflect the overall thermal stress state of the terminal.
[0096] In this embodiment, it is specifically described that step S4 specifically includes: S41, based on the thermal stress distribution characteristic diagram, calculating the thermal stress deviation value of each area of the terminal through the thermodynamic simulation model of the control system, and generating the temperature compensation requirement parameter; The thermal stress distribution characteristic diagram is input into the thermodynamic simulation model to compare the actual thermal stress with the benchmark thermal stress distribution curve.
[0097] Calculate the thermal stress deviation value (Δσ) of each area using the formula: Δσ=σactual−σbenchmark.
[0098] According to the thermal stress deviation value, a temperature compensation demand parameter (such as ΔT_req) is generated to guide the temperature adjustment of the heating component.
[0099] The compensation requirement parameter is proportional to the deviation value, and the formula is: ΔTreq=k⋅Δσ; where k is the thermal stress-temperature compensation coefficient of the material.
[0100] S42, calculating the temperature adjustment amount of the heating component through a PID control algorithm according to the temperature compensation requirement parameter, and converting the temperature adjustment amount into a power control signal of the heating component; S43, based on the adjusted temperature parameters, the correction amount of the bending gap is calculated by the thermodynamic simulation model, and the displacement control instruction of the thermal control deformation component 260 is generated in combination with the material properties of the terminal; According to the adjusted temperature parameters, the correction amount (Δd) of the bending gap is calculated by the thermodynamic simulation model: Δd=α⋅ΔTadj⋅L.
[0101] Where α is the thermal expansion coefficient of the material and L is the initial width of the bending gap.
[0102] Displacement command generation: Combined with the material properties of the terminal (such as elastic modulus, yield strength), a displacement control command (Δh) of the thermal control deformation component 260 is generated: Δh=Δd / tan θ, wherein θ is the swing angle of the bending assembly 240 .
[0103] S44, transmitting the displacement control instruction to the thermal control deformation component 260, driving the thermal control deformation component 260 to change the height of the bottom plate 230, so that the width of the bending gap reaches the optimized target value; The displacement control command (Δh) is transmitted to the driving unit of the thermal control deformation component 260 through the control bus. The thermal control deformation component 260 (such as piezoelectric ceramics or shape memory alloy) changes the height of the bottom plate 230 according to the command and adjusts the width of the bending gap.
[0104] Gap optimization: By real-time monitoring of the width of the bending gap, ensure that it reaches the optimized target value (such as 0.8-1.2mm).
[0105] S45, monitor the change in the width of the bending gap in real time, and adjust the temperature parameters of the heating component and the displacement control instructions of the thermal control deformation component 260 through a feedback control loop until the thermal stress distribution meets the preset threshold range.
[0106] The width change of the bending gap is monitored in real time by the displacement sensor, and the data is fed back to the control system. According to the monitoring data, the temperature parameters of the heating component and the displacement control instructions of the thermal control deformation component 260 are adjusted.
[0107] Through the closed-loop control loop, ensure that the thermal stress distribution meets the preset threshold range (such as ±5%). When the thermal stress distribution reaches the target range, stop adjusting and enter the next working cycle.
[0108] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A terminal pin insertion machine, characterized in that: The conveying base (100) is used to drive the circuit base to be conveyed along its conveying path (110), and a terminal bending mechanism (200) and a plug-in mechanism (300) are arranged oppositely on two sides of the conveying base (100); The terminal bending mechanism (200) comprises a main frame (210), a bending cavity (220) is arranged in the middle of the main frame (210), a bottom plate (230) is arranged at the bottom of the bending cavity (220), and a heating component is built in the bottom plate (230); a bending component (240) is movably connected to the main frame (210), one end of the bending component (240) is provided with a first driving member (250) for driving the bending component (240) to swing, and the other end extends into the bending cavity (220) and cooperates with the bottom plate (230) to form a bending gap (201); A thermally controlled deformation component (260) is provided between the bottom plate (230) and the main frame (210), and the thermally controlled deformation component (260) is used to change its height according to the temperature of the heating component, so as to change the width of the bending gap (201); The plug-in mechanism (300) comprises a crimping assembly (310) for pressing a terminal into a circuit base, and a thermal imaging assembly (320) arranged on one side of the crimping assembly (310), wherein the thermal imaging assembly (320) is used to obtain thermal image data of the terminal during the pressing process; Also included is a control system, which is used to control the working temperature of the heating component according to the thermal image data.
2. The terminal pin insertion machine according to claim 1, characterized in that: The crimping assembly (310) comprises a first fixed block (311), the first fixed block (311) is provided with a sliding groove, a first crimping block (312) is slidably arranged in the sliding groove, a second driving member (313) is provided at the upper end of the first crimping block (312), a plurality of first crimping protrusions (314) arranged side by side are provided at the lower end of the first crimping block (312), and an avoidance groove is formed between two adjacent first crimping protrusions (314); wherein transition inclined surfaces (315) are respectively provided on both sides of the lower end of the first crimping block (312).
3. The terminal pin insertion machine according to claim 2, characterized in that: The plug-in mechanism (300) further comprises a base plate (330) and two sets of auxiliary pressing mechanisms (340), wherein the two sets of auxiliary pressing mechanisms (340) are respectively arranged on two sides of the crimping assembly (310); The base plate (330) is provided with a slide rail (331) along a first direction, the auxiliary pressing mechanism (340) comprises a fixedly connected mounting block (341) and a slider (342), the slider (342) being slidably connected to the slide rail (331), a side of the mounting block (341) close to the crimping assembly (310) is provided with a second crimping block (343), a side of the mounting block (341) away from the crimping assembly (310) is provided with a notch groove (344), and a first pin shaft (345) is provided at a preset position of the notch groove (344); The base plate (330) is further provided with a third driving member (332) and a second fixing block (333); a driving end of the third driving member (332) is provided with a second pin shaft (334); a transmission rod (335) is provided between the first pin shaft (345) and the second pin shaft (334); arched grooves (336) are respectively provided at both ends of the transmission rod (335); the first pin shaft (345) and the second pin shaft (334) are respectively accommodated in corresponding arched grooves (336); A third pin shaft (337) is provided on the second fixing block (333), and a shaft hole is provided at a preset position of the transmission rod (335), and the transmission rod (335) is rotatably connected to the third pin shaft (337) through the shaft hole, so that the transmission rod (335) swings around the third pin shaft (337); The distance between the first pin shaft (345) and the third pin shaft (337) is much smaller than the distance between the second pin shaft (334) and the third pin shaft (337).
4. The terminal pin insertion machine according to claim 1, characterized in that: A feeding mechanism (400) is also provided on one side of the terminal bending mechanism (200), the feeding mechanism (400) comprising a channel component (410) for conveying terminal blanks, and a shaping component (420) for adjusting the position of the terminal blanks is provided at the first end of the channel component (410); The second end of the channel assembly (410) is provided with a clamping claw assembly for clamping the terminal, and a linear module for driving the clamping claw assembly to move along the second direction.
5. The terminal pin insertion machine according to claim 1, characterized in that: A loading conveyor belt (500) for loading a circuit base is also provided at one end of the conveying path (110), and a transfer assembly (600) is provided between the loading conveyor belt (500) and the conveying base (100); The transfer assembly (600) comprises a fourth driving member and a transfer plate arranged at a driving end of the fourth driving member, the transfer plate being used for caching and transporting the circuit base.
6. The terminal pin insertion machine according to claim 1, characterized in that: It also comprises a pressing mechanism (700) arranged behind the plug-in mechanism (300), the pressing mechanism (700) comprising a guide column assembly (710) and a lifting assembly (720), and a pressing head assembly (730) is arranged at the driving end of the lifting assembly (720); The pressing head assembly (730) is slidably connected to the guide column assembly (710); a spring assembly is sleeved on the guide column assembly (710); and a protrusion (731) is provided at the lower end of the pressing head assembly (730).
7. The terminal pin insertion machine according to claim 6, characterized in that: A plurality of groups of positioning assemblies (120) are arranged along the conveying path (110), the positioning assemblies (120) comprising a fixed seat (121), the fixed seat (121) being hingedly connected to a telescopic cylinder (122), one end of a piston rod of the telescopic cylinder (122) being rotatably connected to a first rotating shaft body (123), the first rotating shaft body (123) being connected to a positioning block (124); A positioning groove (125) for clamping the circuit base is provided on one side of the positioning block (124), and a second rotating shaft (126) is provided on the other side, and the positioning block (124) is rotated on the conveying base (100) via the second rotating shaft (126); The telescopic cylinder (122) operates to drive the positioning block (124) to rotate around the second rotating shaft (126).
8. A method for inserting a terminal pin of a terminal inserting machine, characterized in that: Applied to the terminal pin insertion machine according to any one of claims 1 to 7, the pin insertion method specifically comprises the following steps: The circuit base is transported to the plug-in station along the transport path (110) by the transport base (100), and the first driving member (250) is started to drive the bending component (240) to swing, and when the heating component is heated to a preset temperature, the terminal is hot-pressed and bent through the bending gap (201), and the thermally controlled deformation component (260) adjusts the height of the bottom plate (230) based on the initial temperature so that the bending gap (201) reaches a reference width; Establish a thermal stress simulation model based on the material parameters and geometric dimensions of the terminal, generate benchmark thermal stress distribution parameters and set the thermal imaging monitoring area; During the process of the crimping component (310) pressing the terminal into the circuit base, thermal image data of the terminal is collected in real time by the thermal imaging component (320), and multi-dimensional feature analysis is performed on the thermal image data; According to the analysis results of the thermal image data, the operating temperature of the heating component is dynamically adjusted through the control system, and the correction amount of the bending gap (201) is calculated in combination with the thermodynamic model, and the thermal control deformation component (260) is driven to change the height of the bottom plate (230) to optimize the width of the bending gap (201); The terminals are continuously crimped based on the adjusted temperature parameters and the width of the bending gap (201), and the thermal stress simulation model is updated after a preset number of crimpings to iteratively optimize the mapping relationship between the temperature control parameters and the bending gap (201) correction amount.
9. The pin insertion method of the terminal pin insertion machine according to claim 8, characterized in that: During the process of the crimping assembly (310) pressing the terminal into the circuit base, thermal image data of the terminal is collected in real time by the thermal imaging assembly (320), and multi-dimensional feature analysis is performed on the thermal image data, specifically including: Collecting infrared thermal spectrum images during the terminal crimping process at a preset sampling frequency through a thermal imaging component (320), and transmitting the thermal spectrum images to an image processing module of a control system; Perform spatial domain analysis on the collected thermal spectrum images, identify the temperature distribution characteristics of the terminal surface through convolutional neural networks, and extract local hot spot areas where the temperature gradient is greater than the preset threshold; Based on the time series, the thermal spectrum image of the hot spot area is analyzed in the time domain, the heat diffusion time series matrix is constructed, and the change value of the heat flow rate of each hot spot area is calculated; Perform spectrum analysis on the change value of heat flow rate, extract high-frequency fluctuation components in the thermal spectrum image through fast Fourier transform, and calculate the energy distribution of high-frequency fluctuation components; The results of spatial domain analysis, time domain analysis and spectrum analysis are integrated to generate a thermal stress distribution characteristic diagram of the terminal, and the thermal stress distribution characteristic diagram is input into the thermodynamic simulation model of the control system.
10. The pin insertion method of the terminal pin insertion machine according to claim 9, characterized in that: The method comprises dynamically adjusting the working temperature of the heating component through a control system according to the analysis result of the thermal image data, calculating the correction amount of the bending gap (201) in combination with a thermodynamic model, and driving the thermal control deformation component (260) to change the height of the bottom plate (230) to optimize the width of the bending gap (201), specifically comprising: Based on the thermal stress distribution characteristic diagram, the thermal stress deviation value of each area of the terminal is calculated through the thermodynamic simulation model of the control system, and the temperature compensation requirement parameters are generated; According to the temperature compensation requirement parameters, the temperature adjustment amount of the heating component is calculated by the PID control algorithm, and the temperature adjustment amount is converted into a power control signal of the heating component; Based on the adjusted temperature parameters, a correction amount of the bending gap (201) is calculated through a thermodynamic simulation model, and a displacement control instruction of the thermally controlled deformation component (260) is generated in combination with the material properties of the terminal; Transmitting the displacement control instruction to the thermal control deformation component (260), driving the thermal control deformation component (260) to change the height of the bottom plate (230) so that the width of the bending gap (201) reaches an optimized target value; The width change of the bending gap (201) is monitored in real time, and the temperature parameter of the heating component and the displacement control instruction of the thermal control deformation component (260) are adjusted through a feedback control loop until the thermal stress distribution meets a preset threshold range.