Module provided with elastic wave device and method for manufacturing same

Abstract

The present invention discloses a module provided with an elastic wave device and a method for manufacturing the same, the module comprising: a module substrate on which two or more electronic devices are mounted, a part of the two or more electronic devices serving as a device chip functioning as an elastic wave device; a first sealing part provided on the module substrate and sealing the electronic device other than a device chip functioning as an elastic wave device; a second sealing part provided on the module substrate and sealing a device chip functioning as an elastic wave device; the second sealing part comprises thermosetting resin with insulating property and thermal conductivity; the first sealing part contains a thermosetting resin having insulating properties, and the fluidity of the resin of the first sealing part before curing is higher than that of the resin of the second sealing part.

Description

Technical Field

[0001] The present invention relates to an electronic module and a manufacturing method thereof. In the module, among two or more electronic devices mounted on a module substrate, at least one electronic device has the function of an elastic wave device. Background Art

[0002] In a module in which a chip device having a part of two or more electronic devices as an elastic wave device functioning as an elastic wave device is mounted on a module substrate, it is necessary to ensure an internal space under the device chip (bare chip) constituting the elastic wave device by making a cavity in the sealing resin, and on the other hand, for other electronic devices, it is necessary to allow the sealing resin to penetrate under these electronic devices as a bottom filler.

[0003] In Patent Document 1, an elastic wave device and other electronic devices are first covered with a single resin, and then the portion of the resin covering the elastic wave device is cured. Next, the portion of the resin covering the electronic devices other than the elastic wave device is temporarily softened to form a bottom filler, and then the portion covering the electronic devices other than the elastic wave device is thermally cured.

[0004] Prior art document: Japanese Patent Laid-Open No. 2023-28625. Summary of the invention

[0005] The main problem to be solved by the present invention is to appropriately form a plurality of modules having the above-mentioned structure from an integrated substrate on which electronic components are mounted without arbitrarily increasing the number of steps.

[0006] In order to achieve the above object, the present invention provides a module with an elastic wave device. The module includes: A module substrate having two or more electronic devices mounted thereon, wherein a portion of the electronic devices serve as device chips that function as elastic wave devices; a first sealing portion provided between the module substrate and the device chip functioning as an elastic wave device, and sealing the electronic device other than the device chip functioning as an elastic wave device; and a second sealing portion, provided between the module substrate and the device chip functioning as an elastic wave device, and sealing the device chip functioning as an elastic wave device; wherein, when the module substrate is observed from a direction perpendicular to the mounting surface of the electronic device, a formation area of ​​the first sealing portion does not overlap with a formation area of ​​the second sealing portion; The second sealing portion includes a thermosetting resin having insulating properties; The first sealing portion includes an insulating thermosetting resin, and the resin of the first sealing portion has higher fluidity than the resin of the second sealing portion before curing.

[0007] In some embodiments of the present invention, one side of a device chip that functions as an elastic wave device has a functional element including an IDT electrode and a bump connected to the functional element, and the device chip is mounted on the module substrate by using the bump to form a gap between the one side of the device chip that functions as an elastic wave device and the mounting surface of the module substrate; and the gap is set as an internal space isolated from the outside by the second sealing portion.

[0008] In some embodiments of the present invention, the first sealing portion includes a first resin portion and a second resin portion, the second resin portion being composed of a resin different from the resin constituting the first resin portion; wherein the second resin portion seals the electronic device other than the device chip functioning as an elastic wave device; and when the module substrate is observed from a direction perpendicular to the mounting surface of the electronic device, a formation area of ​​the second resin portion does not overlap with a formation area of ​​the first resin portion.

[0009] In some embodiments, the resin constituting the first sealing portion contains a filler, and the content of the filler is greater than the content of the filler contained in the resin constituting the second sealing portion.

[0010] In some embodiments, the first sealing portion covers the entire electronic device except for the device chip functioning as the elastic wave device, and enters between these electronic components and the mounting surface of the module substrate, with a portion thereof serving as an underfill.

[0011] In some embodiments, the device chip that functions as an elastic wave device specifically comprises a functional surface, a back surface opposite to the functional surface, and a side surface connecting the back surface and the functional surface. The second sealing portion covers the back surface and the side surface of the device chip that functions as an elastic wave device, and enters between the functional surface and the mounting surface of the module substrate at the edge of the functional surface, performs full-circle sealing around the center of the device chip that functions as an elastic wave device, and forms an internal space on the inner side of the edge of the functional surface.

[0012] The present invention also provides a method for manufacturing a module, wherein the module is equipped with two or more electronic devices, and a part of the two or more electronic devices becomes a functional device chip as an elastic wave device, the method comprising: Mounting step: mounting the electronic device in a constituent region of each module of at least an aggregate substrate serving as a module substrate; Sealing step: forming a first sealing portion and a second sealing portion in each constituent region of each module, wherein the first sealing portion seals the electronic device other than the device chip functioning as an elastic wave device, and the second sealing portion seals the device chip functioning as an elastic wave device; In the sealing process, when the module substrate is observed from a direction perpendicular to the mounting surface of the electronic device, a formation area of ​​the first sealing portion does not overlap with a formation area of ​​the second sealing portion, the second sealing portion includes an insulating and thermally conductive thermosetting resin, the first sealing portion includes an insulating and thermosetting resin, and the resin of the first sealing portion has higher fluidity than the resin of the second sealing portion before curing.

[0013] In some embodiments, in the sealing process, a sealing component is prepared for each constituent area of ​​each of the modules, and the sealing component consists of the following parts: a second part, the second part is composed of a thermosetting resin serving as the second sealing part, the resin has insulating properties and has high thermal conductivity; and a first part, the first part is composed of a thermosetting resin serving as the first sealing part, the resin has insulating properties and has higher fluidity before curing than the resin constituting the second sealing part; then, for each constituent area of ​​each of the modules, the first part of the sealing component is covered with the electronic devices other than the device chip serving as the elastic wave device function, and the second part of the sealing component is covered with the device chip serving as the elastic wave device function, so that the sealing component is stacked on the collective substrate that has undergone the mounting process; then, the collective substrate and the sealing component are pressed together at a preset temperature.

[0014] In some embodiments, the manufacturing method further comprises a molding step of the sealing component: preparing a mold, the mold comprising: a first mold and another mold forming a pair with the first mold, the first mold having a plurality of formation areas for the sealing member, and each of the formation areas being provided with a first filling portion filled with a resin constituting the first portion and a second filling portion filled with a resin constituting the second portion; For each of the formation regions, after one of the first filling portion and the second filling portion is filled with the resin, the other of the first filling portion and the second filling portion is filled with the resin; The mold is closed at a preset temperature so that the sealing components corresponding to the number of the forming areas are formed simultaneously.

[0015] In some embodiments, as the one side mold, a recess formed in the one side mold is used as the forming area, and a partition wall rising from the bottom of the recess toward an entrance is used to separate the first filling part and the second filling part, and the height of the partition wall is made smaller than the distance between the bottom of the recess and the entrance.

[0016] According to the present invention, a module having a specific structure can be produced by mounting electronic components on a module substrate as an aggregate substrate, positioning a resin constituting a first encapsulation portion and a resin constituting a second encapsulation portion on the module substrate, and subjecting the positioned processing object to heat treatment so that a device chip functioning as an elastic wave device is encapsulated by the second encapsulation portion and other electronic components are encapsulated by the first encapsulation portion, thereby producing a module having the above structure. In this way, a plurality of modules having the above structure can be appropriately produced from an aggregate substrate on which two or more electronic components are mounted without increasing the number of steps. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0018] Figure 1 is a cross-sectional structural diagram of a module (first embodiment) according to an embodiment of the present invention; Figure 2 yes Figure 1 The cross-sectional structure diagram of the AA line position; Figure 3 is a structural diagram of an example of a resonator on a functional surface of a device chip of the elastic wave device in the first embodiment; Figure 4 is a structural diagram showing an example of a circuit formed on a functional surface of a device chip constituting an elastic wave device in the first embodiment; Figure 5 is a cross-sectional structural diagram of a module (second embodiment) according to an embodiment of the present invention; Figure 6 This is a structural diagram of a state where electronic components are mounted on the module substrate of the first embodiment. Figure 8 A view of the module substrate as viewed from the BB line in FIG. Figure 7 The sealing components constituting the first embodiment are arranged and held on one side of the base film. Figure 8 A view of the module substrate as viewed from the CC line in FIG. Figure 8is a structural diagram of the sealing process of the first embodiment; Fig. 9 is a structural diagram of the molding process of the above-mentioned sealing component; Fig.10 It is a structural diagram of the molding process of the above-mentioned sealing component.

[0019] The following are the descriptions of the reference numerals: X: propagation direction; y: direction perpendicular to the mounting surface; W: processing object; z: movable direction; 1: module; 2: module substrate; 2a: mounting surface; 3: electronic device; 3a: semiconductor device; 3b: passive component; 3c: bonding wire; 4: device chip; 4a: functional surface; 4b: back surface; 4c: side surface; 4d: edge; 5, 5a, 5b: resonator; 5c: IDT electrode; 5d: reflector; 5e: electrode finger; 5f: bus bar; 5g: electrode finger; 5h: bus bar; 6: wiring; 7: circuit; 8: signal input and output terminal; 9: ground terminal; 10: bump; 11: internal space; 12: first sealing portion; 120: first resin portion; 121: second resin portion; 12a: bottom filler; 12b: resin; 13: second sealing portion; 13a: resin; 14: assembly substrate; 14a: constituting area; 14b: spacing area; 14c: insertion part; 16: sealing component; 16a: first part; 16b: second part; 17: base film; 17a: insertion part; 18: gap; 19: forming mold; 19a: one mold; 19b: positioning pin; 19c: other mold; 20: mold; 21: one mold; 21a: forming area; 21b: first filling part; 21c: second filling part; 21d: supporting part; 21e: recessed part; 21f: partition wall; 21g: bottom; 21h: entrance; 22: other mold. DETAILED DESCRIPTION

[0020] In order to more clearly understand the purpose, technical solutions and advantages of the present application, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments.

[0021] Unless otherwise defined, the technical terms or scientific terms involved in this application shall have the general meaning understood by people with general skills in the technical field to which this application belongs. The words "one", "a", "the", "these" and the like in this application do not indicate a quantitative limitation, and they may be singular or plural. The terms "include", "comprise", "have" and any variants thereof involved in this application are intended to cover non-exclusive inclusions; for example, a process, method and system, product or device comprising a series of steps or modules (units) is not limited to the listed steps or modules (units), but may include unlisted steps or modules (units), or may include other steps or modules (units) inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" may mean: A exists alone, A and B exist at the same time, and B exists alone. Generally, the character " / " indicates that the objects associated with each other are in an "or" relationship. The terms "first", "second", "third", etc. in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0022] The following is based on Figures 1 to 10 , typical embodiments of the present invention are described.

[0023] First, mainly based on Figures 1 to 5 , a module 1 involved in one embodiment of the present invention is described.

[0024] The module 1 of this embodiment includes a device chip 4 that enables some of the two or more electronic devices 3 mounted on the module substrate 2 to function as elastic wave devices.

[0025] The elastic wave device is suitable for use as a frequency filter in mobile communication equipment and the like.

[0026] Typically, the module 1 is used as a power amplifier module integrated duplexer (PAMiD for short).

[0027] Electronic devices 3 other than device chip 4 functioning as an elastic wave device typically include semiconductor devices functioning as power amplifiers, low noise amplifiers, switches, etc., and passive components functioning as resistors, capacitors, coils, etc.

[0028] The device chip 4 has one surface as a functional element including an IDT electrode, typically a functional surface 4 a on which a resonator 5 is formed.

[0029] The device chip 4 has a circuit 7 on the functional surface 4a, and the circuit 7 includes wiring 6 that connects the resonators 5 to each other and wiring 6 that can connect the resonators 5 to the outside. Figure 1 and Figure 2 In the figure, the description of wiring 6 is omitted.

[0030] Typically, the resonator 5 and the wiring 6 can be formed of a conductive metal film formed by photolithography and etching.

[0031] The device chip 4 has the function of propagating elastic waves. Typically, the device chip 4 uses lithium tantalate or lithium niobate as a piezoelectric body. In addition, in other embodiments, the device chip 4 can also be formed by stacking these piezoelectric bodies on a support body such as sapphire, silicon, alumina, spinel, quartz or glass.

[0032] Typically, the device chip 4 is in a plate shape, which may be a quadrilateral with a side length of 0.5 mm to 1 mm and a thickness of 0.15 mm to 0.2 mm.

[0033] Figure 3 An example of a resonator 5 formed on a functional surface 4a of a device chip 4 is shown. The resonator 5 has an IDT electrode 5c and a reflector 5d, which is formed in a manner of sandwiching the IDT electrode 5c. The IDT electrode 5c is composed of an electrode pair, each of which connects one end side of a plurality of electrode fingers 5e through a bus bar 5f, and the plurality of electrode fingers 5e are arranged in parallel so that the length direction of the electrode fingers 5e intersects with the propagation direction x of the elastic wave. The reflector 5d connects the ends of a plurality of electrode fingers 5g through a bus bar 5h, and the plurality of electrode fingers 5g are arranged in parallel so that the length direction of the electrode fingers 5g intersects with the propagation direction x of the elastic wave.

[0034] Figure 4 1 is a conceptual example of a circuit 7 provided on a device chip 4. Reference numeral 5a denotes a resonator 5 connected in series between the signal input / output terminals 8, reference numeral 5b denotes a resonator 5 connected in parallel between the signal input / output terminals 8, and reference numeral 9 denotes a ground terminal. The number and arrangement of the resonators 5 may be changed as required. That is, by Figure 4 The circuit 7 constitutes a ladder-type filter.

[0035] The device chip 4 thus configured has bumps 10 on the functional surface 4a. The bumps 10 protrude from the functional surface 4a. The bumps 10 are made of conductive metal and are typically formed at corners or edges of the functional surface 4a of the device chip 4. The bases of the bumps 10 are fixed to the wiring 6.

[0036] The device chip 4 is mounted on the mounting surface 2a of the electronic device 3 in the module substrate 2 using the bumps 10. Typically, the mounting is performed by fixing the protruding ends of the bumps 10 to wiring (not shown) on the mounting surface 2a by ultrasonic welding or the like. The functional surface 4a of the device chip 4 faces the mounting surface 2a of the module substrate 2, and a gap determined by the protruding size of the bumps 10 is formed between the functional surface 4a and the mounting surface 2a.

[0037] The device chip 4 thus mounted is sealed between the module substrate 2 and a second sealing portion 13 described later. The second sealing portion 13 forms the gap as an internal space 11 isolated from the outside. Functional elements are located in the internal space 11.

[0038] Thus, the module 1 of this embodiment includes an elastic wave device in a part thereof, and the elastic wave device is constituted by the device chip 4 described above as a bare chip.

[0039] The module 1 includes a first sealing portion 12 and a second sealing portion 13 on the mounting surface 2 a.

[0040] The first sealing portion 12 seals the electronic device 3 located on the module substrate 2 . The electronic device 3 is a portion other than the device chip 4 that functions as the elastic wave device.

[0041] The second sealing portion 13 seals the device chip 4 located on the module substrate 2 , and the device chip 4 functions as the elastic wave device.

[0042] The first sealing portion 12 and the second sealing portion 13 are formed so as to extend in a direction y perpendicular to the mounting surface 2a of the electronic device 3 (see Figure 1 ) When observing the module substrate 2, the formation area of ​​the first sealing portion 12 does not overlap with the formation area of ​​the second sealing portion 13.

[0043] In the example shown in the figure, the first sealing portion 12 and the second sealing portion 13 have substantially the same thickness in a direction perpendicular to the mounting surface 2a. The first sealing portion 12 covers the entire mounting region of the electronic device 3 other than the device chip 4 functioning as an elastic wave device and a certain range around it, and the second sealing portion 13 covers the entire mounting region of the device chip 4 functioning as an elastic wave device and a certain range around it.

[0044] Furthermore, the first sealing portion 12 and the second sealing portion 13 cover the mounting surface 2 a of the module substrate 2 in an integrated state without forming a gap therebetween.

[0045] The second sealing portion 13 is made of a thermosetting resin 13 a which has insulating properties and high thermal conductivity.

[0046] On the other hand, the first sealing portion 12 is made of a thermosetting resin 12 b which has insulating properties and has higher fluidity before curing than the resin constituting the second sealing portion 13 .

[0047] Specifically, the first sealing portion 12 covers Figure 1 The semiconductor device denoted by reference numeral 3a and the passive components denoted by reference numeral 3b are entirely filled, and also enter between these components and the mounting surface 2a of the module substrate 2, with a part of them serving as the underfill 12a.

[0048] On the other hand, the second sealing portion 13 covers the back surface 4b of the device chip 4 opposite to the functional surface 4a, and the side surface 4c connecting the back surface 4b and the functional surface 4a, and enters between the functional surface 4a and the mounting surface 2a at the edge of the functional surface 4a, and performs full circumferential sealing around the center of the device chip 4 ( Figure 1 , Figure 2 ), the above-mentioned internal space 11 is formed on the inner side of the edge of the functional surface 4a.

[0049] The module 1 of this embodiment has the above-mentioned structure. First, on the collective substrate 14 (see Figure 6 ) is mounted with an electronic device 3, and on the module substrate 2, a processing object W (reference workpiece / Figure 8 ) is subjected to heat treatment, so that the device chip 4 functioning as an elastic wave device can be sealed by the second sealing portion 13, and the other electronic devices 3 can be sealed by the first sealing portion 12, thereby generating a module 1 having the above-mentioned structure. Therefore, a plurality of modules 1 having the above-mentioned structure can be generated from the above-mentioned processing object W without arbitrarily increasing the number of steps.

[0050] Furthermore, secondly, in the above-mentioned heat treatment, when forming the first sealing portion 12, the fluidity of the resin 12b constituting the first sealing portion 12 in the softened state before curing is improved, and the resin 12b is more likely to enter as the underfill 12a between the electronic device 3 other than the device chip 4 functioning as an elastic wave device and the mounting surface 2a of the module substrate 2. In addition, when there is an electronic device 3 connected to the module substrate 2 via a bonding wire 3c, when forming the first sealing portion 12, the external force acting on the bonding wire 3c by the resin 12b can be reduced, thereby suppressing the positional deviation of the bonding wire 3c.

[0051] In addition, thirdly, in the above-mentioned heat treatment, although the resin 12b constituting the first sealing portion 12 has the above-mentioned fluidity, the resin 13a constituting the second sealing portion 13 can be made not to have such fluidity, thereby enabling the resin 13a constituting the second sealing portion 13 to enter between the device chip 4 functioning as an elastic wave device and the mounting surface 2a of the module substrate 2 without losing the above-mentioned internal space 11.

[0052] Fourthly, since second sealing portion 13 is made of resin 13 a having high thermal conductivity, heat generated during operation of device chip 4 functioning as an elastic wave device can be efficiently released to the outside by second sealing portion 13 .

[0053] As the resin 12 b constituting the first sealing portion 12 , a material is generally used which is temporarily softened at a first temperature higher than room temperature and is cured by maintaining the first temperature or by increasing the temperature to a second temperature higher than the first temperature.

[0054] On the other hand, the resin 13 a constituting the second sealing portion 13 is generally made of a material that temporarily softens at the first temperature higher than room temperature and cures by maintaining the first temperature or raising the temperature to a second temperature higher than the first temperature.

[0055] The first temperature is set to be applicable to both the resin 12b constituting the first sealing portion 12 and the resin 13a constituting the second sealing portion 13. The second temperature is set to be applicable to both the resin 12b constituting the first sealing portion 12 and the resin 13a constituting the second sealing portion 13.

[0056] In addition, a filler made of a material with high thermal conductivity may be added to the resin 13a constituting the second sealing portion 13, and the content thereof may be in the range of 70 wt% to 90 wt%. Typically, the filler is composed of granules with a diameter of about 10 μm.

[0057] Specifically, an epoxy resin containing a filler or a phenolic resin containing a filler can be used to form the resin 13a of the second sealing portion 13. Typically, silicon dioxide, aluminum oxide, or aluminum nitride can be used as the filler.

[0058] The fluidity of the resin 12 b constituting the first sealing portion 12 and the resin 13 a constituting the second sealing portion 13 varies depending on the type of resin, the type of filler, and the content of the filler. The content of the filler is a major factor affecting the fluidity.

[0059] By using a resin containing more of the filler as the resin 13a constituting the second sealing portion 13 than the resin 12b constituting the first sealing portion 12, the fluidity of the resin 13a constituting the second sealing portion 13 can be lower than the fluidity of the resin 12b constituting the first sealing portion 12 at the first temperature.

[0060] More specifically, as the resin 12 b constituting the first sealing portion 12 , a high-fluidity resin: A730 series manufactured by Sumitomo Bakelite Co., Ltd. is preferred.

[0061] As the resin 13 a constituting the second sealing portion 13 , it is preferable to use a low-flowability and high-heat-dissipating resin: KE-G1250 series manufactured by Kyocera Corporation.

[0062] However, the resin 12 b constituting the first sealing portion 12 and the resin 13 a constituting the second sealing portion 13 only need to have the above-described properties, and are not limited to the above-described two specific resins.

[0063] Figure 5 A partial modification example of the structure of the module 1 described above is shown.

[0064] In this example, the first sealing portion 12 is composed of a first resin portion 120 and a second resin portion 121 composed of a resin 12 c different from the resin 12 b constituting the first resin portion 120 .

[0065] The resin 12 c is also thermosetting and insulating like the resin 12 b , and has higher fluidity before curing than the resin 13 a constituting the second sealing portion 13 .

[0066] Furthermore, regarding the electronic device 3 other than the device chip 4 functioning as the elastic wave device, the electronic device 3 other than the electronic device 3 sealed by the first resin portion 120 on the module substrate 2 is sealed by the second resin portion 121 .

[0067] At the same time, the second resin portion 121 is formed so as not to overlap with a formation region of the first resin portion 120 when the module substrate 2 is viewed from a direction y perpendicular to the mounting surface 2 a of the electronic device 3 .

[0068] In this case, the resin 12b constituting the first resin portion 120 can be optimized to be a resin suitable for suppressing the positional deviation of the bonding wire 3c, and the resin 12c constituting the second resin portion 121 can be optimized to be a resin suitable for forming the underfill 12a.

[0069] Next, mainly based on Figures 6 to 10 , a method for manufacturing the module 1 having the above-mentioned structure is described.

[0070] That is, this manufacturing method is for manufacturing a module 1 on which two or more electronic devices 3 are mounted and a device chip 4 in which a part of the electronic devices 3 functions as an elastic wave device.

[0071] The manufacturing method includes at least the following steps.

[0072] (Installation process) The mounting step is a step of mounting the electronic device 3 in each of the constituent regions 14a of each of the modules 1 in the collective substrate 14 of the module substrate 2 constituting the module 1 (see Figure 6 ).

[0073] exist Figure 6 In the figure, the inner side of the quadrilateral indicated by the dotted line is the above-mentioned structural area 14a, and the spacing area 14b is set between each structural area 14a, and the spacing area 14b is in a grid shape. In the subsequent process, the collective substrate 14 is cut in the spacing area 14b to generate a plurality of modules 1.

[0074] In each configuration region 14 a , a device chip 4 as one elastic wave device and three other electronic devices 3 are mounted.

[0075] (Sealing process) The sealing process is to form a first sealing portion 12 and a second sealing portion 13 in the constituent area 14a of each module 1. The first sealing portion 12 is used to encapsulate other electronic devices 3 except the device chip 4 functioning as an elastic wave device, and the second sealing portion 13 is used to encapsulate the device chip 4 functioning as an elastic wave device.

[0076] In the sealing step, a sealing member 16 is prepared for each component area 14a of each module 1. The sealing member 16 is composed of the following parts: The second part 16b is composed of a thermosetting resin 13a, which has insulating properties and high thermal conductivity; The first portion 16a is composed of a thermosetting resin 12b, which has insulating properties and has a higher fluidity before curing than the resin 13a constituting the second sealing portion 13 (see Figure 7 ).

[0077] Furthermore, for each component region 14a of each module 1, the first portion 16a of the sealing member 16 covers the electronic device 3 other than the device chip 4 functioning as the elastic wave device, and the second portion 16b of the sealing member 16 covers the device chip 4 functioning as the elastic wave device, and the sealing member 16 is laminated on the collective substrate 14 (see Figure 8 ).

[0078] Then, after the lamination, the collective substrate 14 and the sealing member 16 are pressed together at a predetermined temperature (refer to Figure 8 ).

[0079] By adopting this method, a plurality of modules 1 having the above-mentioned structure can be produced from the above-mentioned collective substrate 14 that has undergone the above-mentioned mounting step without adding additional steps.

[0080] In the example shown in the figure, the sealing member 16 has a quadrangular plate shape and has substantially the same size as the above-mentioned configuration area 14 a.

[0081] The first portion 16a and the second portion 16b are also in a plate shape, and one side of the first portion 16a is fixedly connected to one side of the second portion 16b, whereby the sealing member 16 as a whole is in a quadrilateral plate shape.

[0082] In the example shown in the figure, a number of sealing members 16 corresponding to the number of the above-mentioned constituent regions 14a and a base film 17 having a function of temporarily fixing the sealing members 16 are prepared, and a plurality of sealing members 16 are arranged on the base film 17 with gaps 18 between adjacent sealing members 16. The gaps 18 are in a lattice shape and substantially match the above-mentioned spacing regions 14b (see Figure 7 ).

[0083] In the example shown in the figure, a positioning pin 19b (see FIG. 1 ) formed in one mold 19a constituting the molding mold 19 is used. Figure 8 ), the pin insertion portion 14c formed in the assembly substrate 14 (refer to Figure 6 ), and the pin insertion portion 17a formed in the base film 17 (refer to Figure 7 ), the collective substrate 14 mounted with the electronic device 3 is positioned on the base film 17 holding the sealing component 16 in the above-mentioned one mold 19a, and the molding mold 19 is closed in this state, thereby performing the above-mentioned pressing.

[0084] Specifically, the sealing member 16 is held on the base film 17 in a state where one side of the sealing member 16 is bonded or lightly bonded to one side of the base film 17. The base film 17 is positioned in the mold of one mold 19a in a state where the holding side of the sealing member 16 faces the side of the other mold 19c. On the other hand, the assembly substrate 14 is positioned in the mold of one mold 19a in a manner that the mounting surface 2a of the electronic device 3 faces one side of the base film 17. At the same time, by aligning the pins 19b, the molding die 19 is moved in the movable direction z (refer to Figure 8 ), in each of the above-mentioned constituent regions 14a, the second portion 16b of the sealing member 16 is located in front of (directly below in the illustrated example) the device chip 4 that becomes the elastic wave device, and the first portion 16a of the sealing member 16 is located in front of (directly below in the illustrated example) the remaining electronic devices 3. By closing the mold of the molding die 19, the above-mentioned first sealing portion 12 and the above-mentioned second sealing portion 13 are appropriately formed on the collective substrate 14 in each of the above-mentioned constituent regions 14a. Then, the molding die 19 is opened, the base film 17 is peeled off from the collective substrate 14 side, and the two are separated, thereby obtaining the processing object W, in which each of the constituent regions 14a is respectively used as a module 1.

[0085] (Molding process) In addition, the manufacturing method of the present embodiment further includes a step of molding the sealing member 16 .

[0086] In the molding step, a mold 20 is prepared, and the mold 20 includes: a mold 21 and a mold 22 (see Fig. 9 ). The one mold 21 has a plurality of forming regions 21a for the sealing member 16, and each of the forming regions 21a is provided with a first filling portion 21b filled with a resin constituting the first portion 16a (i.e., a resin 12b constituting the first sealing portion 12), and a second filling portion 21c filled with a resin constituting the second portion 16b (i.e., a resin 13a constituting the second sealing portion 13).

[0087] Next, for each of the formation regions 21a, after the first filling portion 21b is filled with the resin constituting the first portion 16a, the second filling portion 21c is filled with the resin constituting the second portion 16b. Alternatively, for each of the formation regions 21a, after the second filling portion 21c is filled with the resin constituting the second portion 16b, the first filling portion 21b is filled with the resin constituting the first portion 16a.

[0088] Next, the mold is closed at a preset temperature to simultaneously form the sealing members 16 corresponding to the number of the forming areas 21 a.

[0089] After the above-mentioned molding, the mold is opened, and typically, the support portion 21d of the sealing member 16 remaining on one side of the mold 21 is lifted up using a tool such as an ejector pin (not shown in the figure), and the floating sealing member 16 is captured using a known vacuum chuck (not shown in the figure) and arranged on a known conveying frame with a chuck (not shown in the figure). Then, the conveying frame is positioned on the above-mentioned base film 17, and the clamping of the sealing member 16 is released, so that a plurality of sealing members 16 are arranged on the base film 17 in the above-mentioned manner (refer to Figure 7 ).

[0090] In addition, in the present embodiment, as the one side mold 21, a recess 21e formed in the one side mold 21 is used as the forming area 21a, and a partition wall 21f rising from the bottom 21g of the recess 21e toward the entrance 21h is used to separate the first filling part 21b and the second filling part 21c, and a height of the partition wall 21f is made smaller than a distance between the bottom 21g of the recess 21e and the entrance 21h.

[0091] When such a one-side mold 21 is used, the resin constituting the first portion 16a and the resin constituting the second portion 16b can be introduced into the partition wall 21f by closing the mold 20, and the two resins thus introduced can be integrated into one another on the partition wall 21f. Fig.10 ). Thus, the sealing member 16 having a rectangular plate shape as a whole can be appropriately formed, wherein the sealing member 16 has a first portion 16a and a second portion 16b which are both plate-shaped, and one side of the first portion 16a and one side of the second portion 16b are fixedly connected.

[0092] The expressions and terms used in the present invention are for illustrative purposes only and should not be considered as limiting. The use of "include", "have", "have", "include" and their variations as used herein means including the following listed items, their equivalents and additional items.

[0093] The term "embodiment" in this application refers to a specific feature, structure or characteristic described in conjunction with the embodiment that can be included in at least one embodiment of the present application. The appearance of this phrase in various locations in the specification does not necessarily mean the same embodiment, nor does it mean that it is mutually exclusive with other embodiments and is independent or optional. It is clearly or implicitly understood by those of ordinary skill in the art that the embodiments described in this application can be combined with other embodiments without conflict.

[0094] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of patent protection. It should be pointed out that, for a person of ordinary skill in the art, several variations, corrections and improvements can be made without departing from the concept of the present application, and these all belong to the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the attached claims.

Claims

1. A module having an elastic wave device, characterized in that: include: A module substrate, wherein two or more electronic devices are mounted on the module substrate, and a part of the electronic devices are used as functional device chips of elastic wave devices; A first sealing portion, provided on the module substrate, sealing the electronic device other than the device chip functioning as an elastic wave device; as well as A second sealing portion, disposed on the module substrate, sealing a device chip functioning as an elastic wave device; wherein, when the module substrate is observed from a direction perpendicular to the mounting surface of the electronic device, a formation area of ​​the first sealing portion does not overlap with a formation area of ​​the second sealing portion; The second sealing portion includes a thermosetting resin having insulating properties; The first sealing portion includes an insulating thermosetting resin, and the resin of the first sealing portion has higher fluidity before curing than the resin of the second sealing portion.

2. The module having an elastic wave device according to claim 1, characterized in that: A device chip that functions as an elastic wave device has a functional element including an IDT electrode and a bump connected to the functional element on one side thereof, and the device chip is mounted on the module substrate by using the bump so that a gap is formed between the one side of the device chip that functions as an elastic wave device and the mounting surface of the module substrate; The second sealing portion serves to make the gap an internal space isolated from the outside.

3. The module having an elastic wave device according to claim 1, characterized in that: The first sealing portion includes a first resin portion and a second resin portion, wherein the second resin portion is composed of a resin different from a resin constituting the first resin portion; wherein the second resin portion seals the electronic device other than the device chip functioning as an elastic wave device; Furthermore, when the module substrate is viewed from a direction perpendicular to the mounting surface of the electronic device, a formation region of the second resin portion does not overlap with a formation region of the first resin portion.

4. The module having an elastic wave device according to claim 1, characterized in that: The resin constituting the first sealing portion contains a filler, and the content of the filler is larger than the content of the filler contained in the resin constituting the second sealing portion.

5. The module having an elastic wave device according to claim 1, characterized in that: The first sealing portion covers the entire electronic device except for the device chip functioning as the elastic wave device, enters between these electronic components and the mounting surface of the module substrate, and partially serves as an underfill.

6. The module having an elastic wave device according to claim 1, characterized in that: The device chip that functions as an elastic wave device specifically includes a functional surface, a back surface opposite to the functional surface, and a side surface connecting the back surface and the functional surface. The second sealing portion covers the back surface and side surfaces of the device chip that functions as an elastic wave device, and enters between the functional surface and the mounting surface of the module substrate at the edge of the functional surface, performs full-circle sealing around the center of the device chip that functions as an elastic wave device, and forms an internal space on the inner side of the edge of the functional surface.

7. A method for manufacturing a module, wherein the module is equipped with two or more electronic devices, and a part of the electronic devices are used as functional device chips of elastic wave devices, the method comprising: Mounting step: mounting the electronic device in a constituent region of each module of at least an aggregate substrate serving as a module substrate; Sealing step: forming a first sealing portion and a second sealing portion in each constituent region of each module, wherein the first sealing portion seals the electronic device other than the device chip functioning as an elastic wave device, and the second sealing portion seals the device chip functioning as an elastic wave device; In the sealing process, when the module substrate is observed from a direction perpendicular to the mounting surface of the electronic device, a formation area of ​​the first sealing portion does not overlap with a formation area of ​​the second sealing portion, the second sealing portion includes an insulating and thermosetting resin, and the first sealing portion includes an insulating and thermosetting resin, and the resin of the first sealing portion has higher fluidity than the resin of the second sealing portion before curing.

8. The manufacturing method according to claim 7, characterized in that: In the sealing step, a sealing member is prepared for each constituent region of each module, the sealing member comprising: a second portion, the second portion being composed of a thermosetting resin as the second sealing portion, the resin having insulating properties; and a first portion, the first portion being composed of a thermosetting resin as the first sealing portion, the resin having insulating properties and having higher fluidity before curing than the resin constituting the second sealing portion; Next, for each constituent region of each module, the first portion of the sealing member covers the electronic device other than the device chip functioning as the elastic wave device, and the second portion of the sealing member covers the device chip functioning as the elastic wave device, and the sealing member is laminated on the collective substrate after the mounting step; Then, the collective substrate and the sealing component are pressed together at a preset temperature.

9. The manufacturing method according to claim 8, characterized in that: Also included is a molding process of the sealing component: preparing a mold, the mold comprising: a first mold and another mold forming a pair with the first mold, the first mold having a plurality of formation areas for the sealing member, and each of the formation areas being provided with a first filling portion filled with a resin constituting the first portion and a second filling portion filled with a resin constituting the second portion; For each of the formation regions, after one of the first filling portion and the second filling portion is filled with the resin, the other of the first filling portion and the second filling portion is filled with the resin; The mold is closed at a preset temperature so that the sealing components corresponding to the number of the forming areas are formed simultaneously.

10. The manufacturing method according to claim 9, characterized in that: As the one mold, a recess formed in the one mold is used as the forming area, and a partition wall rising from the bottom of the recess toward an entrance is used to separate the first filling part and the second filling part, and the height of the partition wall is made smaller than the distance between the bottom of the recess and the entrance.

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