Sensor and electronic device

Abstract

The invention provides a sensor and an electronic device, the sensor comprises a substrate and a housing covering the substrate, the substrate and the housing enclose to form an accommodating cavity, the accommodating cavity is internally provided with a vibration assembly, an MEMS chip and an integrated chip assembly, the MEMS chip and the integrated chip assembly are in signal connection, and the integrated chip assembly is in signal connection with the substrate; the MEMS chip is installed on the substrate, the MEMS chip and the substrate define a rear cavity, the vibration assembly comprises a supporting piece and a sensing film installed on the supporting piece, the supporting piece is installed on the substrate, the supporting piece, the sensing film and the substrate define a vibration cavity, a channel is formed in the substrate, and the two ends of the channel are communicated with the rear cavity and the vibration cavity respectively. According to the sensor, the MEMS chip and the vibration assembly can be horizontally arranged on the substrate, and compared with the mode that the MEMS chip and the vibration assembly are stacked in the vertical direction, the height of the sensor is reduced, and the light and thin design is achieved.

Description

Technical Field

[0001] The present invention relates to the field of sensor technology, and in particular to a sensor and electronic equipment. Background Art

[0002] For sensors that need to monitor vibration, the vibration component senses external changes and vibrates, which in turn causes changes in the pressure in the chamber. The MEMS chip can sense the pressure changes and thus monitor external vibrations. However, the current sensors with vibration monitoring functions are relatively tall, making it difficult to meet the market's demand for miniaturization.

[0003] In view of this, it is necessary to provide a new sensor and electronic device to solve or at least alleviate the above technical defects. Summary of the invention

[0004] In view of the above problems, the present invention provides a sensor and an electronic device, aiming to solve the technical problem of high sensor height in the related art.

[0005] According to some embodiments of the present invention, the present invention provides a sensor, including a substrate and a shell covering the substrate, the substrate and the shell forming a accommodating cavity, the accommodating cavity is provided with a vibration component, and a signal-connected MEMS chip and an integrated chip component, the integrated chip component is signal-connected to the substrate; the MEMS chip is installed on the substrate and is formed with the substrate to form a back cavity, the vibration component includes a support member and a sensing film installed on the support member, the support member is installed on the substrate, the support member, the sensing film, and the substrate form a vibration cavity, a channel is formed in the substrate, and the two ends of the channel are respectively connected to the back cavity and the vibration cavity.

[0006] In one embodiment, the sensor further includes a bracket, wherein the bracket is disposed above the vibration component, the integrated chip component is disposed on the bracket, the bracket cooperates with the sensing membrane to form a sound cavity, the accommodating cavity includes a front cavity and the rear cavity, and the sound cavity is connected to the front cavity.

[0007] In one embodiment, a through hole is provided on the bracket, and the through hole connects the acoustic cavity and the front cavity.

[0008] In one embodiment, there are a plurality of through holes, and the plurality of through holes are arranged at intervals around the periphery of the integrated chip component.

[0009] In one embodiment, the bracket includes a supporting plate and a side panel arranged around the supporting plate, there is a space between the supporting plate and the sensing membrane, the integrated chip component is arranged on the supporting plate, the supporting plate is arranged on the vibration component, the supporting plate, the side panel and the sensing membrane cooperate to form the sound cavity, and the through hole is arranged on the side panel or the supporting plate.

[0010] In one embodiment, the bracket includes a bearing panel and support plates arranged on opposite sides of the bearing panel, there is a space between the bearing plate and the sensing film, the integrated chip component is arranged on the bearing panel, the support plate is arranged on the vibration component, and the bearing panel, the two support plates, and the sensing film cooperate to form the sound cavity with an opening.

[0011] In one embodiment, a heat dissipation hole is provided at a position of the bracket facing the integrated chip assembly, and the heat dissipation hole is communicated with the acoustic cavity.

[0012] In one embodiment, the integrated chip component is disposed on the sensing film.

[0013] In one embodiment, the vibration component further includes a mass member, which is disposed on the sensing film and located in the vibration cavity, and the integrated chip component is disposed on a side of the sensing film away from the mass member.

[0014] In one embodiment, the sensing film includes a flexible circuit board, the flexible circuit board is provided with an integrated pad, the integrated chip component is connected to the flexible circuit board signal through the integrated pad, and a conductive column is provided in the support member, and the conductive column electrically connects the flexible circuit board and the substrate.

[0015] In one embodiment, the integrated chip component includes a voice processing chip and an ASIC chip. The vibration component, the voice processing chip, and the ASIC chip are stacked in sequence. The ASIC chip is signal-connected to the MEMS chip. The ASIC chip and the voice processing chip are respectively signal-connected to the substrate.

[0016] In one embodiment, the sensor further includes a thermal insulation adhesive layer, and the thermal insulation adhesive layer wraps the ASIC chip and the voice processing chip.

[0017] According to some embodiments of the present invention, the present invention provides an electronic device, comprising any one of the above sensors.

[0018] In the technical solution of the present application, a channel is provided inside the substrate, and the channel is connected to the back cavity and the vibration cavity respectively, so that the air pressure change signal generated by the vibration component can be transmitted to the MEMS chip through the channel and received by the MEMS chip, and finally the vibration signal is received and monitored. This embodiment can horizontally arrange the MEMS chip and the vibration component on the substrate, which is conducive to reducing the height of the sensor and realizing a lightweight design compared to stacking the MEMS chip and the vibration component in the vertical direction.

[0019] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0021] Figure 1 A schematic diagram of the structure of a sensor according to some embodiments of the present invention;

[0022] Figure 2 for Figure 1 A schematic diagram of a part of the structure;

[0023] Figure 3 A schematic diagram of the structure of a sensor bracket and an integrated chip assembly of some embodiments of the present invention;

[0024] Figure 4 A schematic diagram of the structure of a sensor bracket, an integrated chip assembly and a vibration assembly of some embodiments of the present invention;

[0025] Figure 5 Another schematic diagram of the structure of a sensor according to some embodiments of the present invention;

[0026] Figure 6 is another structural schematic diagram of a sensor according to some embodiments of the present invention;

[0027] Figure 7 Another partial structural schematic diagram of the sensor according to some embodiments of the present invention.

[0028] The reference numerals in the specific implementation manner are as follows:

[0029] 100. Sensor;

[0030] 1. Substrate; 2. Shell; 3. Accommodating cavity; 31. Rear cavity; 32. Front cavity; 4. Channel; 5. Integrated chip assembly; 51. ASIC chip; 52. Voice processing chip; 6. MEMS chip; 61. Sensitive film; 62. Matrix; 7. Vibration assembly; 71. Inductive film; 72. Support member; 73. Mass member; 8. Bracket; 81. Load-bearing plate; 82. Side panel; 83. Through hole; 84. Load-bearing panel; 85. Support plate; 86. Opening; 9. Acoustic cavity; 10. Vibration cavity; 11. Conductive column. DETAILED DESCRIPTION

[0031] The following embodiments of the technical solution of the present invention are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and are therefore only used as examples, and cannot be used to limit the protection scope of the present invention.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the terms "including" and "having" in the specification and claims of the present invention and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions.

[0033] In the description of the embodiments of the present invention, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present invention, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0034] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0035] In the description of the embodiments of the present invention, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0036] In the description of the embodiments of the present invention, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0037] In the description of the embodiments of the present invention, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention.

[0038] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0039] There are many types of sensors, such as acoustic sensors, optical sensors, and vibration sensors. Acoustic sensors monitor air pressure signals through acoustic holes, optical sensors monitor by monitoring light, and vibration sensors monitor by receiving external vibration signals.

[0040] As people's needs increase day by day, the demand for miniaturization and thinness of sensor products is also increasing. However, current vibration sensors generally have the problem of being too high.

[0041] After careful research, the inventor found that in the relevant technology, compared with acoustic sensors, for sensors that need to monitor vibration signals, it is generally necessary to set up an additional vibration component in the sensor's accommodating cavity. When receiving external vibrations, the vibration component will vibrate, driving the air in the sensor to vibrate, thereby causing the air pressure in the sensor's accommodating cavity to change. The pressure here mainly refers to the air pressure. The MEMS chip can sense the change in air pressure and thus play a role in monitoring external vibration signals. However, the additional vibration component in the accommodating cavity requires a large space, resulting in a large volume of the sensor, which is difficult to meet the market's demand for miniaturization. After further research, the applicant found that in order to enable the MEMS chip to promptly sense the changes in air pressure caused by the vibration of the vibration component, the MEMS chip is generally vertically stacked above the vibration component, and an air vent is opened between the vibration component and the MEMS chip for airflow to pass through. Then, this stacking method makes the height of the sensor large, which is difficult to meet the market's increasing demand for thinness.

[0042] To this end, the applicant provides a sensor.

[0043] Reference Figure 1 and Figure 2 According to some embodiments of the present invention, the present invention provides a sensor 100, including a substrate 1 and a shell 2 covered on the substrate 1, the substrate 1 and the shell 2 are surrounded to form a accommodating cavity 3, the accommodating cavity 3 is provided with a vibration component 7, and a signal-connected MEMS chip 6 and an integrated chip component 5, the integrated chip component 5 is signal-connected to the substrate 1; the MEMS chip 6 is installed on the substrate 1 and is surrounded with the substrate 1 to form a back cavity 31, the vibration component 7 includes a support member 72 and a sensing film 71 installed on the support member 72, the support member 72 is installed on the substrate 1, the support member 72, the sensing film 71, and the substrate 1 are surrounded to form a vibration cavity 10, a channel 4 is formed in the substrate 1, and the two ends of the channel 4 are respectively connected to the back cavity 31 and the vibration cavity 10.

[0044] The sensor 100 may be a vibration sensor in particular. The substrate 1 may be a printed circuit board, a wiring layer and a copper foil are arranged inside the substrate 1, a pad is arranged on the surface of the substrate 1, the integrated chip assembly 5 is connected to the substrate 1 through the pad to realize the transmission of the electrical signal, and in a specific embodiment, the integrated chip assembly 5 may be connected to the pad through a gold wire. The housing 2 refers to the shell part of the sensor 100, the housing 2 is covered on the substrate 1 to form a substantially sealed accommodating cavity 3 with the substrate 1, the vibration assembly 7 includes a support member 72 and a sensing film 71 arranged on the support member 72, the sensing film 71 may be a diaphragm, the support member 72 may be the supporting part of the vibration assembly 7, generally an annular side enclosure, the support member 72, the sensing film 71, and the substrate 1 are surrounded to form a cavity, called a vibration cavity 10, this cavity is substantially isolated from the accommodating cavity 3, and there is no airflow between the two. The substrate 1 is formed with a first opening at the position where the vibration assembly 7 is arranged. The MEMS chip 6 is arranged on the substrate 1, and is surrounded by the substrate 1 to form a cavity, which is generally referred to as the back cavity 31. Specifically, the MEMS chip 6 includes a base 62 and a sensitive film 61 arranged on the base 62. The base 62 is installed on the substrate 1, and the sensitive film 61, the base 62 and the substrate 1 are together surrounded to form the back cavity 31. The substrate 1 is formed with a second opening at the position where the MEMS chip 6 is arranged. The substrate 1 is provided with a channel 4. The channel 4 is formed in the substrate 1 and is connected. The two ends of the channel 4 are respectively the first opening and the second opening, so that the vibration cavity 10 and the back cavity 31 can be connected through the channel 4. When the sensor 100 is vibrated, the sensing film 71 of the vibration component 7 can vibrate, driving the air pressure in the receiving cavity 3 in the vibration cavity 10 to change. The changed air pressure signal is transmitted to the MEMS chip 6 through the channel 4. The MEMS chip 6 receives the change in air pressure and converts it into an electrical signal and transmits it to the integrated chip component 5. The integrated chip component 5 realizes the monitoring of the external vibration signal through calculation and processing, or transmits it to the external circuit for monitoring. It should also be noted that in the sensor 100, the accommodating chamber 3 can be divided into a front chamber 32 and a rear chamber 31. In the present application, the rear chamber 31 refers to a part of the space formed by the MEMS chip 6 and the substrate 1. The part without the rear chamber 31 can be called the front chamber 32. Of course, it should be noted that the front chamber 32 referred to in the present application does not include the vibration chamber 10 and the sound chamber 9. In the above embodiment of the present invention, by arranging a channel 4 inside the substrate 1, the channel 4 is connected to the rear chamber 31 and the vibration chamber 10 respectively, so that the air pressure change signal generated by the vibration component 7 can be transmitted to the MEMS chip 6 through the channel 4 and sensed and received by the MEMS chip 6, and finally the vibration signal is received and monitored. This embodiment can arrange the MEMS chip 6 and the vibration component 7 on the substrate 1 in the horizontal direction, which is conducive to reducing the height of the sensor 100 and realizing a lightweight design compared to stacking the MEMS chip 6 and the vibration component 7 in the vertical direction.It should be noted that, in the embodiments of the present application, the vertical direction refers to a direction perpendicular to the substrate 1 , such as. Figure 1 As shown by the middle arrow A, the horizontal direction refers to the direction parallel to the extension direction of the substrate 1, that is, the direction perpendicular to the arrow A.

[0045] Reference Figure 1 In one embodiment, the integrated chip assembly 5 includes a voice processing chip 52 and an ASIC chip 51. The vibration assembly 7, the voice processing chip 52, and the ASIC chip 51 are stacked in sequence. The ASIC chip 51 is connected to the MEMS chip 6 by signal. The ASIC chip 51 and the voice processing chip 52 are respectively connected to the substrate 1 by signal. The integrated chip assembly 5 may include an ASIC chip 51 and a voice processing chip 52. The MEMS chip 6 converts the received sound pressure signal into an electrical signal and transmits it to the ASIC chip 51. The ASIC chip 51 processes the received signal sent by the MEMS chip 6 and sends it to the voice processing chip 52 for processing. This embodiment has a high degree of integration, realizes localized processing of signals, and reduces the risk of signal interference caused by long-distance signal propagation.

[0046] Reference Figure 1 and Figure 2 In one embodiment, the sensor 100 also includes a bracket 8, which is arranged above the vibration component 7, and the integrated chip component 5 is arranged on the bracket 8. The bracket 8 cooperates with the sensing membrane 71 to form a sound cavity 9, and the accommodating cavity 3 includes a front cavity 32 and a rear cavity 31, and the sound cavity 9 is connected to the front cavity 32.

[0047] The main function of the bracket 8 is to provide a support position for the integrated chip assembly 5. Considering the requirements of the horizontal size of the sensor 100, the horizontal size of the sensor 100 is not too large by stacking the vibration assembly 7 and the integrated chip assembly 5. The bracket 8 can be directly installed on the support member 72, or it can be installed at the position where the sensing film 71 is connected to the support member 72. The bracket 8 is generally fixed. Of course, the bracket 8 is generally not installed on the vibration part of the sensing film 71. The bracket 8 cooperates with the sensing film 71 to form a sound cavity 9. This sound cavity 9 is not closed, but is connected to the front cavity 32 of the accommodating cavity 3. That is, the sound cavity 9 between the sensing film 71 and the bracket 8 is not connected to the outside world. Then, when the sensing film 71 receives the vibration signal and vibrates, the sensing film 71 will compress the gas in the sound cavity 9 when it vibrates toward the sound cavity 9. If the design here is closed, the internal air pressure will increase due to the reduction of the volume of the sound cavity 9, so it will be subject to greater resistance, affecting the sensitivity and accuracy of the vibration. Therefore, it is designed here that the sound cavity 9 is connected to the front cavity 32 so that the air pressure in the sound cavity 9 is balanced. In addition, the applicant also needs to specially explain that the bracket 8 in this embodiment is essentially different from the mounting frame in the related art in which the MEMS chip 6 is arranged on the mounting frame and the MEMS chip 6 is stacked with the vibration component 7. Because the mounting frame in the scheme of stacking the MEMS chip 6 and the vibration component 7 is adopted, an air vent is provided at the position of the sensing membrane 71 facing the mounting frame, so that the air pressure change signal generated by the vibration of the sensing membrane 71 can be received by the sensitive membrane 61 of the MEMS chip 6 through the air vent. In order to improve the sensitivity and accuracy of monitoring, in addition to the air vent, the mounting frame and the sensing membrane 71 are relatively sealed, that is, not connected to the accommodating chamber 3. And the air vent is provided to connect to the MEMS chip 6, rather than to the front chamber 32 of the accommodating chamber 3 in this application. There are essential differences in the technical solutions and inventive concepts of the two.

[0048] By providing a bracket 8 for supporting the integrated chip assembly 5, the structure of the sensor 100 is made more compact. In addition, the acoustic cavity 9 is connected to the front cavity 32 to reduce the vibration resistance of the sensing membrane 71 and improve the sensitivity and accuracy of monitoring.

[0049] The specific embodiments of the structure of the bracket 8 include at least the following two:

[0050] Reference Figure 3 In the first embodiment, the bracket 8 includes a carrying plate 81 and a side panel 82 arranged around the carrying plate 81. There is a space between the carrying plate 81 and the sensing membrane 71. The integrated chip component 5 is arranged on the carrying plate 81, and the support plate 85 is arranged on the vibration component 7. The carrying plate 81, the side panel 82 and the sensing membrane 71 cooperate to form a sound cavity 9, and the through hole 83 is arranged on the side panel 82 or the carrying plate 81.

[0051] The side panel 82 can be a cylindrical side panel or a square side panel, and the supporting plate 81 plays a supporting role. The integrated chip component 5 is arranged on the supporting plate 81. The side panel 82 is arranged on the supporting member 72 or the sensing membrane 71. The side panel 82 and the supporting plate 81 of the bracket 8 form an opening. The bracket 8 is open and covers the sensing membrane 71 downward to form a sound cavity 9. A through hole 83 can be set on the side panel 82 or the supporting plate 81 to connect the sound cavity 9 with the front cavity 32. In this way, when the sensing membrane 71 vibrates, it can be ensured that the air pressure in the sound cavity 9 is balanced with the front cavity 32.

[0052] Reference Figure 3 In one embodiment, there are multiple through holes 83 , and the multiple through holes 83 are arranged at intervals around the periphery of the integrated chip component 5 .

[0053] Regarding the number of through holes 83, one or more through holes 83 may be provided, and all through holes 83 may be provided on the side panels 82, or all through holes 83 may be provided on the carrier plate 81, or a part of through holes 83 may be provided on the carrier plate 81, and the other part of through holes 83 may be provided on the side panels 82. In order to connect the sound cavity 9 and the front cavity 32, the through holes 83 provided on the carrier plate 81 are not provided at the position where the integrated chip assembly 5 is installed, but may be arranged at intervals around the outer periphery of the integrated chip assembly 5. Providing multiple through holes 83 may make the airflow between the sound cavity 9 and the front cavity 32 flow faster, so as to balance the air pressure in the sound cavity 9.

[0054] Reference Figure 4 In the second embodiment, the bracket 8 includes a bearing panel 84 and support plates 85 arranged on opposite sides of the bearing panel 84, there is a space between the bearing panel 84 and the sensing film 71, the integrated chip assembly 5 is arranged on the bearing panel 81, the support plate 85 is arranged on the vibration assembly 7, and the bearing panel 84, the two support plates 85, and the sensing film 71 cooperate to form a sound cavity 9 with an opening 86. In this embodiment, the bracket 8 itself is not a closed shape. Specifically, the bracket 8 includes a bearing panel 84 and support plates 85 arranged on opposite sides of the support panel. The two support plates 85 are respectively connected to the support member 72. The bearing panel 84, the two support plates 85, and the sensing film 71 cooperate to form a sound cavity 9 with an opening 86. The specific number of the openings 86 can be two, and the two openings 86 are arranged opposite to each other. The sound cavity 9 is connected to the front cavity 32 through the opening 86 to achieve air pressure balance in the sound cavity 9. In this example, no additional through hole 83 may be provided.

[0055] In one embodiment, a heat dissipation hole is provided at a position of the bracket 8 facing the integrated chip assembly 5 , and the heat dissipation hole is communicated with the acoustic cavity 9 .

[0056] The heat dissipation holes, like the aforementioned through holes 83, can be through holes set on the bracket 8. There may be no essential difference in structure, but the functions are different. Specifically, the heat dissipation holes can be set at the position where the integrated chip assembly 5 is installed on the bracket 8, that is, on the carrier panel 84 or the carrier plate 81, so that the heat dissipated by the integrated chip assembly 5 can directly enter the sound cavity 9 through the heat dissipation holes, and then be conducted to the back cavity 31 through the channel 4. Of course, the heat dissipated by the integrated chip assembly 5 will also be directly dissipated into the front cavity 32, which can reduce the temperature difference on both sides of the sensitive membrane 61 of the MEMS chip 6, balance the thermal pressure on both sides, and play a role in reducing thermal noise. It should also be noted here that the aforementioned through holes 83 can also play a role in heat conduction. Specifically, the heat in the front cavity 32 can enter the sound cavity 9 through the through holes 83, and then be transferred to the back cavity 31 through the channel 4.

[0057] Reference Figure 5 In one embodiment, the integrated chip component 5 is disposed on the sensing film 71 .

[0058] Regarding the installation method of the integrated chip assembly 5, the aforementioned setting of the bracket 8 is an embodiment. In other embodiments, the integrated chip assembly 5 can also be directly set on the sensing film 71, and the integrated chip assembly 5 can play the role of the mass member 73, adjust the vibration frequency, and improve the monitoring sensitivity. This design not only saves the use of the bracket 8, but also does not need to set up an additional mass member 73 for the vibration assembly 7, reducing the use of accessories.

[0059] Reference Figure 6 Of course, in one embodiment, a mass member 73 may also be provided, the mass member 73 is provided on the sensing film 71, and the mass member 73 is located in the vibration cavity 10, and the integrated chip assembly 5 is provided on the side of the sensing film 71 away from the mass member 73. In this case, the integrated chip assembly 5 can also play the role of the mass member 73.

[0060] Reference Figure 7 In one embodiment, the sensing film 71 includes a flexible circuit board, the flexible circuit board is provided with an integrated pad, the integrated chip assembly 5 is connected to the flexible circuit board signal through the integrated pad, and a conductive column 11 is provided in the support member 72, and the conductive column 11 electrically connects the flexible circuit board and the substrate 1. The flexible circuit board is a circuit board made of flexible material. The pads on the integrated chip assembly 5 are soldered to the integrated pads of the flexible circuit board by flip-chip method. A via hole is provided in the support member 72, and a conductive column 11 is provided in the via hole. The conductive column 11 electrically connects the pads on the substrate 1 and the flexible circuit board. In this way, the integrated chip assembly 5 can be electrically connected to the substrate 1 through the flexible circuit board, eliminating the use of gold wire. Because the sensing film 71 will vibrate during use, the gold wire connection is easy to loosen, and the connection through the pad can improve the reliability of the connection.

[0061] In one embodiment, the sensor 100 further includes a heat-insulating adhesive layer, which wraps the ASIC chip 51 and the voice processing chip 52. The heat-insulating adhesive can be coated on the voice processing chip 52 and the ASIC chip 51 to form a layer of heat-insulating adhesive layer, which mainly plays a role of heat insulation, reducing the influence of the heat emitted by the ASIC chip 51 and the voice processing chip 52 on the thermal noise of the MEMS chip 6.

[0062] According to some embodiments of the present invention, the present invention provides an electronic device, including any of the above-mentioned sensors 100. The electronic device may be a smart wearable device, such as a headset, a computer, a mobile phone, a tablet, a bracelet or a ring, etc. Since the electronic device includes all the technical solutions of the above-mentioned embodiments of the sensor 100, it at least has all the beneficial effects brought by all the above-mentioned technical solutions, which will not be described one by one here.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and specification of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A sensor, characterized in that: The invention comprises a substrate and a shell covering the substrate, wherein the substrate and the shell are arranged to form a containing cavity, wherein a vibration component, a signal-connected MEMS chip and an integrated chip component are arranged in the containing cavity, and the integrated chip component is connected to the substrate by signal; the MEMS chip is mounted on the substrate and is arranged to form a back cavity with the substrate, the vibration component comprises a support member and a sensing film mounted on the support member, the support member is mounted on the substrate, the support member, the sensing film and the substrate are arranged to form a vibration cavity, a channel is formed in the substrate, and the two ends of the channel are respectively connected to the back cavity and the vibration cavity.

2. The sensor according to claim 1, characterized in that The sensor also includes a bracket, which is arranged above the vibration component. The integrated chip component is arranged on the bracket. The bracket cooperates with the sensing membrane to form a sound cavity. The accommodating cavity includes a front cavity and a rear cavity. The sound cavity is connected to the front cavity.

3. The sensor according to claim 2, characterized in that The bracket is provided with a through hole, and the through hole communicates with the acoustic cavity and the front cavity.

4. The sensor according to claim 3, characterized in that There are multiple through holes, and the multiple through holes are arranged at intervals around the periphery of the integrated chip component.

5. The sensor according to claim 3, characterized in that The bracket includes a supporting plate and a side panel arranged around the supporting plate, there is a space between the supporting plate and the sensing membrane, the integrated chip component is arranged on the supporting plate, the side panel is arranged on the vibration component, the supporting plate, the side panel and the sensing membrane cooperate to form the sound cavity, and the through hole is arranged on the side panel or the supporting plate.

6. The sensor according to claim 2, characterized in that The bracket includes a bearing panel and support plates arranged on opposite sides of the bearing panel, there is a space between the bearing plate and the sensing film, the integrated chip component is arranged on the bearing panel, and the support plate is arranged on the vibration component. The bearing panel, the two support plates, and the sensing film cooperate to form the sound cavity with an opening.

7. The sensor according to claim 2, characterized in that A heat dissipation hole is provided at a position of the bracket facing the integrated chip assembly, and the heat dissipation hole is communicated with the acoustic cavity.

8. The sensor according to claim 1, characterized in that The integrated chip component is arranged on the sensing film.

9. The sensor according to claim 1, characterized in that The vibration component further comprises a mass member, which is arranged on the sensing film and located in the vibration cavity, and the integrated chip component is arranged on a side of the sensing film away from the mass member.

10. The sensor according to claim 8 or 9, characterized in that The sensing film comprises a flexible circuit board, the flexible circuit board is provided with an integrated pad, the integrated chip assembly is connected to the flexible circuit board signal through the integrated pad, and a conductive column is provided in the support member, the conductive column electrically connects the flexible circuit board and the substrate.

11. The sensor according to any one of claims 1 to 9, characterized in that The integrated chip component includes a voice processing chip and an ASIC chip. The vibration component, the voice processing chip and the ASIC chip are stacked in sequence. The ASIC chip is signal-connected to the MEMS chip. The ASIC chip and the voice processing chip are respectively signal-connected to the substrate.

12. The sensor according to claim 11, characterized in that The sensor further comprises a heat-insulating adhesive layer, and the heat-insulating adhesive layer wraps the ASIC chip and the voice processing chip.

13. An electronic device, characterized in that: The electronic device comprises the sensor of any one of claims 1 to 12.

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