High-speed switching printed circuit board with surface shielding structure

Abstract

The invention belongs to the field of printed board design, and discloses a high-speed switching printed circuit board with a surface layer shielding structure, the high-speed switching printed circuit board comprises a plurality of wiring layers, and a middle shielding layer is arranged between two adjacent wiring layers. The middle shielding layer comprises a middle layer substrate, a copper laying grounding layer is arranged on the middle layer substrate, and a grounding via hole and a signal via hole which penetrate from the top layer to the bottom layer are formed in the high-speed switching printed circuit board. According to the high-speed switching printed circuit board, switching between the high-speed printed circuit board connector and the high-speed wire is met, the problem that the high-speed printed circuit board connector cannot be directly connected with the high-speed wire is solved, meanwhile, effective transmission and shielding of high-speed signals are guaranteed, crosstalk between signal differential pairs can be effectively reduced, and the reliability of the high-speed switching printed circuit board is improved. The impedance consistency of the welding position of the high-speed differential wire is improved, and the high-speed signal transmission performance of a product is effectively improved.

Description

Technical Field

[0001] The invention belongs to the field of microwave electronic equipment interconnection, relates to the field of printed circuit board design, and specifically relates to a high-speed transfer printed circuit board with a surface shielding structure. Background Art

[0002] At present, due to the pin packaging characteristics, it is difficult for high-speed printed circuit board connectors to form interconnections with high-speed flexible cables. High-speed printed circuit board connectors often use PCBs to achieve interconnection signal transmission. Due to the rigid interconnection between the two, the cost is high in actual use and it is difficult to achieve flexible distribution. In addition, there is a problem of crosstalk between differential pairs on the printed circuit board, which seriously affects the transmission performance of high-speed signals. At the same time, due to the large amount of metal at the welding position, the impedance often fluctuates greatly. Summary of the invention

[0003] In order to solve the technical problem of low high-speed signal transmission performance caused by crosstalk between differential pairs on a printed circuit board, the present invention discloses a high-speed transfer printed circuit board with a surface shielding structure, wherein the high-speed transfer printed circuit board includes multiple routing layers, and an intermediate shielding layer is provided between two adjacent routing layers.

[0004] The intermediate shielding layer includes a middle substrate, a copper-clad grounding layer is provided on the middle substrate, and the high-speed switching printed circuit board is provided with grounding vias and signal vias penetrating from the top layer to the bottom layer.

[0005] Furthermore, the intermediate shielding layer includes a first intermediate shielding layer and a second intermediate shielding layer, the first intermediate shielding layer is located between the top routing layer and the second intermediate shielding layer in the routing layer, and the first intermediate shielding layer provides a reference return ground for the differential routing of the top routing layer.

[0006] The second intermediate shielding layer is located between the first intermediate shielding layer and the bottom wiring layer in the wiring layer, and the second intermediate shielding layer provides a reference return ground for the differential wiring of the bottom wiring layer.

[0007] Furthermore, copper is removed from a position on the copper-clad grounding layer of the first intermediate shielding layer corresponding to the connector pin package pad of the top wiring layer to form a non-copper-clad area.

[0008] Furthermore, the top wiring layer includes a first wiring layer substrate, on which a connector pin package pad, a connector ground pad, a first high-speed differential wiring, a first wire welding pad and a first wire ground pad are provided.

[0009] The bottom wiring layer includes a second wiring layer substrate, on which a second high-speed differential wiring, a second wire welding pad and a second wire grounding pad are arranged.

[0010] Furthermore, the first wire grounding pad is connected to at least one first shielding shell welding pad, and the second wire grounding pad is connected to at least one second shielding shell welding pad.

[0011] Furthermore, a ground isolation line is also provided on the second wiring layer substrate.

[0012] Furthermore, the connector pin packaging pad is connected to the high-speed printed circuit board connector by welding, and the connector grounding pad is welded to the connector grounding pin.

[0013] The first wire welding pad is connected to the connector pin through the first high-speed differential routing and the connector pin packaging pad to achieve high-speed signal transmission, and the first wire grounding pad is connected to the connector grounding pin through the grounding via, the intermediate shielding layer and the connector grounding pad to achieve grounding continuity.

[0014] The second wire welding pad is connected to the connector pin through the second high-speed differential routing, the signal via and the connector pin package pad to achieve high-speed signal transmission, and the second wire grounding pad is connected to the connector grounding pin connector through the grounding via, the intermediate shielding layer and the connector grounding pad to achieve grounding continuity.

[0015] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above-mentioned technical solutions adopted in the embodiments of this specification include at least the following: the high-speed transfer printed circuit board of the present invention satisfies the transfer between the high-speed printed circuit board connector and the high-speed wire, solves the problem that the high-speed printed circuit board connector cannot be directly connected to the high-speed wire, and at the same time ensures the effective transmission and shielding of high-speed signals, can effectively reduce the crosstalk between signal differential pairs, improve the impedance consistency of the high-speed differential wire welding position, and effectively improve the high-speed signal transmission performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of a first intermediate shielding layer of an intermediate shielding layer of a high-speed switching printed circuit board disclosed in an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of a second intermediate shielding layer of an intermediate shielding layer of a high-speed transfer printed circuit board disclosed in an embodiment of the present invention;

[0019] Figure 3 A schematic diagram of a top wiring layer disclosed in an embodiment of the present invention;

[0020] Figure 4 A schematic diagram of a bottom wiring layer disclosed in an embodiment of the present invention;

[0021] Among them, 10, middle layer substrate; 11, copper-plated ground layer; 12, non-copper-plated area; 20, top routing layer; 201, first routing layer substrate; 202, connector pin package pad; 203, connector ground pad; 204, first high-speed differential routing; 205, first wire welding pad; 206, first wire ground pad; 207, first shielding shell welding pad; 30, bottom routing layer; 301, second routing layer substrate; 303, second high-speed differential routing; 304, second wire welding pad; 305, second wire ground pad; 306, second shielding shell welding pad; 307, ground isolation line; 50, signal via; 40, ground via. DETAILED DESCRIPTION

[0022] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0023] The following describes the implementation methods of the present application through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than a partial embodiment. The present application can also be implemented or applied through other different specific implementation methods, and the various details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features of the embodiments can be combined with each other in the absence of conflict. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0024] The embodiment of the present invention discloses a high-speed transfer printed circuit board with a surface shielding structure, wherein the high-speed transfer printed circuit board includes a plurality of routing layers, an intermediate shielding layer is provided between two adjacent routing layers, and the plurality of routing layers and at least one intermediate shielding layer are superimposed to form the high-speed transfer printed circuit board. For example, when there are two routing layers in the high-speed transfer printed circuit board, there is one intermediate shielding layer, and when there are n routing layers, there are n-1 intermediate shielding layers.

[0025] Among them, see Figure 1 and Figure 2As shown, the intermediate shielding layer includes a middle substrate 10, and a copper grounding layer 11 is provided on the middle substrate 10. Figures 1 to 4 As shown, the high-speed transfer printed circuit board is provided with ground vias 50 and signal vias 40 that penetrate from the top layer to the bottom layer.

[0026] Further, see Figure 1 and Figure 2 As shown, the intermediate shielding layer includes a first intermediate shielding layer and a second intermediate shielding layer. The first intermediate shielding layer is located between the top routing layer 20 and the second intermediate shielding layer in the routing layer. The first intermediate shielding layer provides a reference return ground for the differential routing of the top routing layer 20.

[0027] The second intermediate shielding layer is located between the first intermediate shielding layer and the bottom wiring layer 30 in the wiring layer, and the second intermediate shielding layer provides a reference return ground for the differential wiring of the bottom wiring layer 30 .

[0028] Furthermore, since the pads, solder, pins, etc. at the welding position of the top wiring layer 20 may have a sudden change in impedance, see Figure 1 As shown, copper is removed from a position on the first intermediate shielding layer corresponding to the connector pin package pad 202 of the top wiring layer 20 to form a non-copper area 12 to compensate for the characteristic impedance of the welding position.

[0029] Further, see Figure 3 As shown, the top wiring layer 20 includes a first wiring layer substrate 201, on which a connector pin package pad 202, a connector ground pad 203, a first high-speed differential wiring 204, a first wire welding pad 205 and a first wire ground pad 206 are provided. Figure 4 As shown, the bottom wiring layer 30 includes a second wiring layer substrate 301 , on which a second high-speed differential wiring 303 , a second wire welding pad 304 and a second wire grounding pad 305 are provided.

[0030] Further, see Figure 3 As shown, at least one first shielding shell welding pad 207 is connected to the first wire grounding pad 206. In a specific implementation, the number of the second wire grounding pads 305 needs to correspond to the number of differential line groups, and a first shielding shell welding pad 207 is provided between the two groups of differential lines to achieve shielding isolation. When in use, a metal shielding shell can be welded on the first wire grounding pad 206 to achieve shielding between each pair of differential high-speed wires.

[0031] Further, see Figure 4As shown, at least one second shielding shell welding pad 306 is connected to the second conductor grounding pad 305. In a specific implementation, the number of second conductor grounding pads 305 needs to correspond to the number of differential line groups, and a second shielding shell welding pad 306 is provided between each group of differential lines to achieve shielding isolation. When in use, a metal shielding shell can be welded on the second conductor grounding pad 305 to achieve shielding between each pair of differential high-speed conductors. Figure 4 As shown, a ground isolation line 307 is also provided on the second wiring layer substrate 301 .

[0032] Specifically, the first routing layer substrate 201 and the second routing layer substrate 301 both use a substrate with low dielectric loss angle properties, and when used in combination with a shielding structure, they can achieve signal transmission performance that exceeds the conventional usage rate of the original substrate; the connector pin packaging pad 202 needs to match the connector pin; the connector grounding pad 203 needs to match the connector grounding pin to meet the welding of the high-speed printed board connector and the high-speed transfer printed circuit board; the first wire welding pad 205 and the second wire welding pad 304 both need to match the size of the high-speed flexible cable connected to them, and the first wire grounding pad 206 and the second wire grounding pad 305 both need to match the shielding layer of the high-speed flexible cable to meet the welding of the high-speed flexible cable and the high-speed printed circuit board.

[0033] Furthermore, the connector pin packaging pad 202 is connected to the high-speed printed circuit board connector by welding, and the connector ground pad 203 is welded to the connector ground pin.

[0034] The first wire welding pad 205 is connected to the connector pin through the first high-speed differential trace 204 and the connector pin packaging pad 202 to achieve high-speed signal transmission, and the first wire grounding pad 206 is connected to the connector grounding pin through the grounding via 50, the intermediate shielding layer and the connector grounding pad 203 to achieve grounding continuity.

[0035] The second wire welding pad 304 is connected to the connector pin through the second high-speed differential trace 303, the signal via 40 and the connector pin package pad 202 to achieve high-speed signal transmission, and the second wire grounding pad 305 is connected to the connector grounding pin connector through the grounding via 50, the intermediate shielding layer and the connector grounding pad 203 to achieve grounding continuity.

[0036] The high-speed transfer printed circuit board of the present invention satisfies the transfer between the high-speed printed circuit board connector and the high-speed wire, and at the same time ensures the effective transmission and shielding of the high-speed signal, can effectively reduce the crosstalk between the signal differential pairs, improve the impedance consistency of the high-speed differential wire welding position, and effectively improve the high-speed signal transmission performance of the product.

[0037] Obviously, those skilled in the art should understand that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the embodiments of the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-speed transfer printed circuit board with a surface shielding structure, the high-speed transfer printed circuit board comprising a plurality of routing layers, characterized in that: An intermediate shielding layer is provided between two adjacent routing layers, the intermediate shielding layer comprising a middle-layer substrate (10), a copper-clad grounding layer (11) is provided on the middle-layer substrate (10), and a grounding via (50) and a signal via (40) are provided on the high-speed switching printed circuit board, which penetrate from the top layer to the bottom layer.

2. The high-speed transfer printed circuit board with a surface shielding structure according to claim 1, characterized in that: The intermediate shielding layer comprises a first intermediate shielding layer and a second intermediate shielding layer, the first intermediate shielding layer is located between a top wiring layer (20) and the second intermediate shielding layer in the wiring layer, and the first intermediate shielding layer provides a reference return ground for differential wiring of the top wiring layer (20); The second intermediate shielding layer is located between the first intermediate shielding layer and the bottom wiring layer (30) in the wiring layer, and the second intermediate shielding layer provides a reference return ground for the differential wiring of the bottom wiring layer (30).

3. The high-speed transfer printed circuit board with a surface shielding structure according to claim 2, characterized in that: Copper is removed from a position on the copper-clad grounding layer (11) of the first intermediate shielding layer corresponding to the connector pin package pad (202) of the top wiring layer (20) to form a non-copper-clad area (12).

4. The high-speed transfer printed circuit board with a surface shielding structure according to claim 2, characterized in that: The top wiring layer (20) comprises a first wiring layer substrate (201), on which a connector pin package pad (202), a connector ground pad (203), a first high-speed differential wiring (204), a first wire welding pad (205) and a first wire ground pad (206) are provided; The bottom wiring layer (30) comprises a second wiring layer substrate (301), on which a second high-speed differential wiring (303), a second wire welding pad (304) and a second wire grounding pad (305) are provided.

5. The high-speed transfer printed circuit board with a surface shielding structure according to claim 4, characterized in that: The first conductor grounding pad (206) is connected to at least one first shielding shell welding pad (207), and the second conductor grounding pad (305) is connected to at least one second shielding shell welding pad (306).

6. The high-speed transfer printed circuit board with a surface shielding structure according to claim 4 or 5, characterized in that: A ground isolation line (307) is also provided on the second wiring layer substrate (301).

7. The high-speed transfer printed circuit board with a surface shielding structure according to claim 4, characterized in that: The connector pin packaging pad (202) is connected to the high-speed printed circuit board connector by welding, and the connector ground pad (203) is welded to the connector ground pin; The first wire welding pad (205) is connected to the connector pin through the first high-speed differential trace (204) and the connector pin packaging pad (202) to achieve high-speed signal transmission, and the first wire grounding pad (206) is connected to the connector grounding pin connector through the grounding via (50), the intermediate shielding layer and the connector grounding pad (203) to achieve grounding continuity; The second wire welding pad (304) is connected to the connector pin through the second high-speed differential trace (303), the signal via (40) and the connector pin packaging pad (202) to achieve high-speed signal transmission, and the second wire grounding pad (305) is connected to the connector grounding pin through the grounding via (50), the intermediate shielding layer and the connector grounding pad (203) to achieve grounding continuity.

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