Pad-free PCB (Printed Circuit Board) and manufacturing method thereof
By determining the area to be drilled on the target inner substrate of the padless PCB board based on the position of the ball grid array, and using positioning holes to press and drill holes for pressing and drilling, the problems of difficulty in processing padless PCB board products and low drilling accuracy in the prior art are solved, and the customized requirements are met and the drilling accuracy is improved.
Patent Information
- Application Number
- CN202411893501.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-04-29
AI Technical Summary
Existing padless PCB board products cannot determine the area to be drilled by the ball grid array position of different design solutions, resulting in difficulty in processing and low drilling accuracy, which cannot meet customers' customized needs.
By determining the area to be drilled on the target inner substrate based on the position of the ball grid array, multiple positioning holes are made, and the inner substrate is pressed in series through these positioning holes to form a foundation plate, and then drilling holes in the area to be drilled in the area to be drilled according to the position of the layer bias hole.
It improves drilling accuracy and local position alignment, simplifies the process, and can meet customer customization needs according to different design solutions.
Smart Images
Figure CN119907186A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a padless PCB board and a manufacturing method thereof, belonging to the technical field of printed circuit processing. Background Art
[0002] As the physical layer single link reaches 112G or even 224G, in order to meet this high-speed requirement, a padless design process needs to be adopted on the PCB to reduce the return loss of high-speed signals to meet the transmission needs. However, there are some differences in the padless design solutions for current products. Due to the different designs of each customer, the factory cannot recognize them, which causes processing problems. Summary of the invention
[0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a padless PCB board and a manufacturing method thereof, which can determine the pad area to be drilled according to the ball grid array position of different design schemes, improve the drilling accuracy, simplify the process, and solve the problem that current padless products cannot meet the customized needs of some customers and that padless drilling has high requirements on drilling accuracy and local position alignment.
[0004] In order to achieve the above purpose / solve the above technical problems, the present invention is implemented by adopting the following technical solutions: The present invention provides a method for manufacturing a padless PCB board, comprising: Based on the ball grid array position, determine the pad area to be drilled on the target inner layer substrate; Make multiple positioning holes around the area of the pad to be drilled; stacking the target inner substrates according to a predetermined circuit board structure order; The inner substrates are connected in series through a plurality of positioning holes and pressed together to obtain a base plate; Based on the position of the positioning holes, multiple layer offset coupon holes are drilled on the base plate; According to the layer bias coupon hole, drill holes in the area where the pad is to be drilled to obtain a PCB board without pads.
[0005] Further, the step of determining a pad area to be drilled on a target inner substrate based on a ball grid array position includes: Determine pad size based on ball grid array location; Determine drilling data based on pad size; According to the drilling data, determine the area of the pad to be drilled.
[0006] Furthermore, the drilling data includes a drilling diameter and a drilling diameter center.
[0007] Furthermore, a plurality of positioning holes are made around the area to be drilled on the pad, including: a first positioning hole and a second positioning hole with different apertures are made around the area to be drilled on the pad.
[0008] Furthermore, the diameter of the first positioning hole is greater than 3 mm, and the first positioning hole is a non-through hole.
[0009] Furthermore, the method of drilling a plurality of layer offset coupon holes on the base plate based on the positions of the positioning holes includes: A plurality of successively larger layer offset coupon holes are drilled in the first positioning hole in a clockwise direction according to a preset starting point and a reference.
[0010] Furthermore, the diameter of the second positioning hole is greater than 4.4 mm, and the second positioning hole is a non-through hole.
[0011] Furthermore, the inner substrates are connected in series through a plurality of positioning holes and pressed together to obtain a base plate, including: Punching out the second positioning hole by a punching device; Stacking the target inner substrates and aligning them with the second positioning holes; inserting a rivet into the second positioning hole; The inner substrates connected in series via rivets are pressed together by a pressing device; After the rivets in the second positioning holes are drilled out, the base plate is obtained.
[0012] Further, the method of drilling holes in the pad to-be-drilled area according to the layer biased coupon holes to obtain a pad-free PCB board includes: When the alignment degree of the layer offset coupon hole is ≤2mil, drill holes in the pad to be drilled area to obtain a pad-free PCB board.
[0013] Another aspect of the present invention provides a padless PCB board, wherein the padless PCB board is manufactured by the padless PCB board manufacturing method described above.
[0014] Compared with the prior art, the present invention has the following beneficial effects: The present invention determines the pad area to be drilled on the target inner substrate based on the ball grid array position, and can determine the pad area to be drilled according to the ball grid array position of different design schemes, and pre-stacks the inner substrates in series through a plurality of positioning holes made around the pad area to be drilled, and presses the stacked inner substrates to obtain a base plate, and drills a plurality of layer-biased coupon holes on the base plate based on the positions of the positioning holes, and drills holes in the pad area to be drilled according to the layer-biased coupon holes, thereby improving the drilling accuracy and simplifying the process, and solving the problem that the current padless products cannot meet the customized needs of some customers and the padless drilling has high requirements on the drilling accuracy and the alignment of the local position. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a flow chart of a method for manufacturing a padless PCB board provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of determining a pad-to-be-drilled area on a target inner substrate in a method for manufacturing a pad-free PCB provided by an embodiment of the present invention.
[0016] Figure 3 It is a schematic diagram of a pad area to be drilled in a method for manufacturing a pad-free PCB board provided by an embodiment of the present invention; Figure 4 This is a schematic diagram of drilling rivets in a method for manufacturing a padless PCB board provided by an embodiment of the present invention; Figure 5 The present invention is a schematic diagram of the position of a coupon hole in a middle layer of a method for manufacturing a padless PCB board provided by an embodiment of the present invention.
[0017] In the figure: 1, the area of the pad to be drilled; 201, the first positioning hole; 202, the second positioning hole; 3, the ball grid array; 4, the ground via hole; 5, the layer bias coupon hole. DETAILED DESCRIPTION
[0018] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention. Example 1
[0019] like Figure 1 As shown, a method for manufacturing a padless PCB board includes: like Figure 2 As shown, based on the position of the ball grid array 3, the pad area to be drilled 1 is determined on the target inner layer substrate, including: Based on the ball grid array 3 position, determine the pad size; Based on the pad size, determine the drilling data, where the drilling data includes the drilling aperture and the drilling aperture center, specifically: like Figure 3 As shown in Table 1, according to the determined pad size, the drilling hole diameter center and the drilling hole diameter are determined; it should be noted that, Figure 3 H represents the drilling hole diameter, L represents the pad length, W represents the pad width, Y1 represents the center of the drilling hole diameter, and Y2 represents the pad center; Table 1
[0020] According to the drilling data, determine the pad area 1 to be drilled.
[0021] Making a plurality of positioning holes around the pad area 1 to be drilled, including: making a first positioning hole 201 and a second positioning hole 202 with different apertures around the pad area 1 to be drilled; Make four second positioning holes 202 around the area 1 to be drilled on the pad, the second positioning holes 202 are non-through holes, and the diameter of the second positioning holes 202 is greater than 4.4 mm (millimeter); stacking the target inner substrates according to a predetermined circuit board structure order; Punching out the second positioning hole 202 by a punching device; Stacking the target inner substrates and aligning them with the second positioning holes 202; Inserting a rivet into the second positioning hole 202; The inner substrates connected in series via rivets are pressed together by a pressing device; like Figure 4 As shown, after the rivets in the second positioning holes 202 are drilled out, the base plate is obtained.
[0022] Make four first positioning holes 201 around the area 1 to be drilled on the pad, the first positioning holes 201 are non-through holes, and the diameter of the first positioning holes 201 is greater than 3 mm (millimeter); like Figure 5 As shown, a ground via hole 4 is drilled in the center of the first positioning hole 201, and with the ground via hole 4 as the center, in the clockwise direction of the figure, with the 2 o'clock direction as the starting point and 0.25 mil as the reference, 1.5 mil, 1.75 mil, 2 mil, 2.25 mil, 2.5 mil, and 2.75 mil layer offset coupon holes 5 are drilled in sequence. When the alignment of the layer offset coupon hole 5 is ≤2 mil, a hole is drilled in the pad to-be-drilled area 1 to obtain a pad-free PCB board. Example 2
[0023] A PCB board without solder pads is prepared by the following method: Based on the ball grid array position, determine the pad area to be drilled on the target inner layer substrate; Make multiple positioning holes around the area of the pad to be drilled; stacking the target inner substrates according to a predetermined circuit board structure order; The inner substrates are connected in series through a plurality of positioning holes and pressed together to obtain a base plate; Based on the position of the positioning holes, multiple layer offset coupon holes are drilled on the base plate; According to the layer bias coupon hole, drill holes in the area where the pad is to be drilled to obtain a PCB board without pads.
[0024] In the description of the present invention, it is to be understood that the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the feature. In the description of the present invention, unless otherwise specified, "plurality" means two or more.
[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.
[0026] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
Claims
1. A method for manufacturing a padless PCB board, characterized in that: include: Based on the ball grid array position, determine the pad area to be drilled on the target inner layer substrate; Make multiple positioning holes around the area of the pad to be drilled; stacking the target inner substrates according to a predetermined circuit board structure order; The inner substrates are connected in series through a plurality of positioning holes and pressed together to obtain a base plate; Based on the position of the positioning holes, multiple layer offset coupon holes are drilled on the base plate; According to the layer bias coupon hole, drill holes in the area where the pad is to be drilled to obtain a PCB board without pads.
2. The method for manufacturing a padless PCB according to claim 1, characterized in that: The method of determining a pad area to be drilled on a target inner layer substrate based on a ball grid array position includes: Determine pad size based on ball grid array location; Determine drilling data based on pad size; According to the drilling data, determine the area of the pad to be drilled.
3. The method for manufacturing a padless PCB according to claim 2, characterized in that: The drilling data includes a drilling hole diameter and a drilling hole diameter center.
4. The method for manufacturing a padless PCB according to claim 1, characterized in that: A plurality of positioning holes are made around the area to be drilled on the pad, including: a first positioning hole and a second positioning hole with different apertures are made around the area to be drilled on the pad.
5. The method for manufacturing a padless PCB according to claim 4, characterized in that: The diameter of the first positioning hole is greater than 3 mm, and the first positioning hole is a non-through hole.
6. The method for manufacturing a padless PCB according to claim 4, characterized in that: Based on the position of the positioning hole, a plurality of layer offset coupon holes are drilled on the base plate, including: A plurality of successively larger layer offset coupon holes are drilled in the first positioning hole in a clockwise direction according to a preset starting point and a reference.
7. The method for manufacturing a padless PCB according to claim 4, characterized in that: The diameter of the second positioning hole is greater than 4.4 mm, and the second positioning hole is a non-through hole.
8. The method for manufacturing a padless PCB according to claim 4, characterized in that: The inner substrates are connected in series through a plurality of positioning holes and pressed together to obtain a base plate, comprising: Punching out the second positioning hole by a punching device; Stacking the target inner substrates and aligning them with the second positioning holes; inserting a rivet into the second positioning hole; The inner substrates connected in series via rivets are pressed together by a pressing device; After the rivets in the second positioning holes are drilled out, the base plate is obtained.
9. The method for manufacturing a padless PCB according to claim 1, characterized in that: The method of drilling holes in the pad to-be-drilled area according to the layer biased coupon hole to obtain a pad-free PCB board includes: When the alignment degree of the layer offset coupon hole is ≤2mil, drill holes in the pad to be drilled area to obtain a pad-free PCB board.
10. A PCB board without solder pads, characterized in that: The padless PCB board is manufactured by the padless PCB board manufacturing method according to any one of claims 1 to 9.