Circuit board manufacturing method and circuit board

Abstract

The invention provides a manufacturing method of a circuit board and the circuit board. The manufacturing method of the circuit board comprises the following steps: acquiring the total volume Z of the filled glue required by the circuit board to be filled with the glue, acquiring the cutting size W1 of the selected prepreg, and acquiring a volume calculation formula G = 2 * W1 * P * H1 of the prepreg; according to a prepreg volume calculation formula, the total filling volume Z and the cutting size W1, obtaining a function relational expression Z = 2 * W1 * P * H1 of the prepreg glue content P and the prepreg thickness H1; determining the values of the prepreg glue content P and the prepreg thickness H1 according to the function relation between the prepreg glue content P and the prepreg thickness H1; and according to the prepreg glue content P and the prepreg thickness H1, selecting a prepreg of a target piece type. According to the manufacturing method of the circuit board, the production quality and the production efficiency of the circuit board can be improved, and the overall performance and the applicability of the circuit board can also be improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit board production, and in particular to a circuit board manufacturing method and a circuit board. Background Art

[0002] At present, circuit boards occupy a vital position in the electronics industry. As the "nerve center" of electronic equipment, circuit boards support the normal operation of various electronic components through electrical connections and signal transmission. It is not only the support of electronic components, but also the basis for electronic equipment to realize various functions.

[0003] In the manufacturing process of circuit boards, filling the buried holes of circuit boards with glue is a crucial step. There are two main ways to fill the buried holes with glue, one is resin plugging, and the other is prepreg filling. Compared with prepreg filling, resin plugging takes longer and costs more, and if the resin at the plugging hole is not ground clean, it is easy to cause the circuit board to explode and delaminate, which greatly reduces the production efficiency and production quality of the circuit board, making prepreg filling more popular. However, in the selection process of the board prepreg, if there is no standard guidance for prepreg filling, the glue content of the circuit board will often be insufficient during the filling of the buried holes of the circuit board, which will lead to the problem of bursting and delamination, which not only reduces the production quality of the circuit board, but also affects the production efficiency of the circuit board; at the same time, the glue content and thickness of the selected prepreg will have an important impact on the overall performance and quality of the circuit board. Different circuit boards have different requirements for the glue content and thickness of the prepreg. Therefore, when selecting the prepreg, it is necessary to make a reasonable choice according to the design requirements and production process of the specific circuit board. Summary of the invention

[0004] The purpose of the present disclosure is to overcome the deficiencies in the prior art and to provide a method for manufacturing a circuit board and a circuit board that can not only improve the production quality and production efficiency of the circuit board, but also improve the overall performance and applicability of the circuit board.

[0005] The purpose of this disclosure is achieved through the following technical solutions:

[0006] A method for manufacturing a circuit board, the steps of the method for manufacturing a circuit board comprising:

[0007] Obtain the total glue filling volume Z required for the circuit board to be filled with glue;

[0008] Obtaining the cutting size W1 of the selected prepreg;

[0009] The prepreg volume calculation formula G=2×W1×P×H1 is obtained, wherein the prepreg volume G is equal to the total volume Z of the glue filling, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness;

[0010] According to the prepreg volume calculation formula, the total glue filling volume Z and the cutting size W1, the functional relationship between the prepreg glue content P and the prepreg thickness H1 is obtained:

[0011] Z=2×W1×P×H1, where Z is the total volume of the filler, W1 is the cutting size, P is the prepreg glue content, and H1 is the thickness of the prepreg;

[0012] Determining the values ​​of the prepreg glue content P and the prepreg thickness H1 according to a functional relationship between the prepreg glue content P and the prepreg thickness H1;

[0013] Selecting the prepreg of a target sheet type according to the prepreg glue content P and the prepreg thickness H1;

[0014] Laying the prepreg of the target sheet type on a core board to obtain a board group to be laminated;

[0015] The panel group to be pressed is pressed.

[0016] In one embodiment, the step of obtaining the total glue filling volume Z required for the circuit board to be glue filled comprises:

[0017] Obtaining the total volume X of the buried vias of the circuit board to be filled with glue;

[0018] Obtaining the board surface glue filling volume Y required for the circuit board to be glue-filled;

[0019] The total volume X of the buried vias and the volume Y of the board surface glue filling are summed to obtain the total volume Z of the glue filling.

[0020] In one embodiment, the step of obtaining the total volume X of the buried via of the circuit board to be filled with glue comprises:

[0021] Obtaining a single buried via volume V of the circuit board to be filled with glue;

[0022] Obtaining the number Q of buried vias of the circuit board to be filled with glue;

[0023] A volume calculation operation is performed on the single buried via volume V and the number of buried vias Q to obtain the total buried via volume X.

[0024] In one embodiment, the step of obtaining the volume V of the single buried via of the circuit board to be filled with glue comprises:

[0025] Obtaining a single buried via area S1 of the circuit board to be filled with glue;

[0026] Obtaining the buried hole depth H2 of the circuit board to be filled with glue;

[0027] A volume calculation operation is performed on the single buried via area S1 and the buried via depth H2 to obtain the single buried via volume V.

[0028] In one embodiment, the step of obtaining the buried hole depth H2 of the circuit board to be filled with glue comprises:

[0029] Obtaining the board thickness H3 of the circuit board to be filled with glue;

[0030] Obtaining the maximum copper thickness T of the circuit board to be filled with glue;

[0031] The board thickness H3 and the maximum copper thickness T are subjected to a depth calculation operation to obtain the buried via depth H2.

[0032] In one embodiment, the step of obtaining the single buried via area S2 of the circuit board to be filled with glue comprises:

[0033] Obtaining the diameter D of the single buried via of the circuit board to be filled with glue;

[0034] An area calculation operation is performed on the single buried via diameter D to obtain the single buried via area S2.

[0035] In one embodiment, the step of obtaining the board surface glue filling volume Y required for the circuit board to be glue-filled includes:

[0036] Obtaining the minimum required thickness N of the cream layer of the circuit board to be filled with glue;

[0037] Obtain the design size W2 of the circuit board to be filled with glue;

[0038] Obtaining a residual copper rate A on the first side of the circuit board to be filled with glue and a residual copper rate B on the second side of the circuit board to be filled with glue;

[0039] Obtaining the maximum copper thickness T of the circuit board to be filled with glue;

[0040] The volume of the board surface filling volume Y is obtained by performing a volume calculation operation on the minimum required thickness N of the cream layer, the design size W2 of the circuit board to be filled with glue, the residual copper rate A of the first side, the residual copper rate B of the second side and the maximum copper thickness T.

[0041] In one embodiment, the minimum required thickness N of the cream layer is 0.005 mm.

[0042] In one embodiment, the design size W2 of the circuit board to be filled with glue is equal to the cutting size W1.

[0043] A circuit board is manufactured using the circuit board manufacturing method described in any of the above embodiments.

[0044] Compared with the prior art, the present invention has at least the following advantages:

[0045] The manufacturing method of the circuit board mentioned above first obtains the total glue filling volume Z required for the circuit board to be filled with glue, the selected cutting size W1 of the prepreg and the prepreg volume calculation formula G=2×W1×P×H1, wherein the prepreg volume G is equal to the total glue filling volume Z, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; then, according to the prepreg volume calculation formula, the total glue filling volume Z and the cutting size W1, the functional relationship between the prepreg glue content P and the prepreg thickness H1 is obtained, that is, Z=2×W1×P×H1, wherein Z is the total glue filling volume, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; then, according to the prepreg volume calculation formula, the total glue filling volume Z and the cutting size W1, the functional relationship between the prepreg glue content P and the prepreg thickness H1 is obtained, that is, Z=2×W1×P×H1, wherein Z is the total glue filling volume, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; then, according to the prepreg glue content P and the prepreg thickness H1 The functional relationship of is used to determine the values ​​of the prepreg glue content P and the prepreg thickness H1; then, a prepreg of a target sheet type is selected according to the prepreg glue content P and the prepreg thickness H1, and the prepreg of the target sheet type is stacked with the core board to obtain a group of boards to be pressed; finally, the group of boards to be pressed is pressed, so that the manufacturing method of the circuit board can effectively avoid the circuit board from bursting and delamination due to insufficient glue content, and can also select a reasonable prepreg glue content P and prepreg thickness H1 according to the design requirements and production processes of different circuit boards, which not only greatly improves the production quality and production efficiency of the circuit board, but also can meet the application requirements of different circuit boards and improve the overall performance and applicability of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0047] Figure 1 A schematic diagram of the steps of a method for manufacturing a circuit board according to an embodiment;

[0048] Figure 2 It is a schematic diagram of the structure of a multi-layer circuit board to be filled with glue before lamination according to another embodiment;

[0049] Figure 3 for Figure 2 The schematic diagram of the structure of the multi-layer circuit board after lamination is shown. DETAILED DESCRIPTION

[0050] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0051] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0053] The present disclosure provides a method for manufacturing a circuit board, the steps of the method for manufacturing a circuit board comprising:

[0054] Obtain the total glue filling volume Z required for the circuit board to be filled with glue;

[0055] Obtaining the cutting size W1 of the selected prepreg;

[0056] The calculation formula for obtaining the prepreg volume is G = 2 × W1 × P × H1, where the prepreg volume G is equal to the total volume of the glue filling Z, W1 is the cutting size, P is the prepreg glue content, and H1 is the thickness of the prepreg;

[0057] According to the calculation formula of prepreg volume, total filling volume Z and cutting size W1, the functional relationship between prepreg glue content P and prepreg thickness H1 is obtained:

[0058] Z = 2 × W1 × P × H1, where Z is the total volume of the filler, W1 is the cut size, P is the prepreg glue content, and H1 is the prepreg thickness;

[0059] Determine the values ​​of the prepreg glue content P and the prepreg thickness H1 according to the functional relationship between the prepreg glue content P and the prepreg thickness H1;

[0060] Select the target prepreg type according to the prepreg glue content P and the prepreg thickness H1;

[0061] Laying the target prepreg sheet and the core board together to obtain a board group to be pressed;

[0062] The panel group to be pressed is pressed together.

[0063] The manufacturing method of the circuit board mentioned above first obtains the total glue filling volume Z required for the circuit board to be filled with glue, the selected cutting size W1 of the prepreg and the prepreg volume calculation formula G=2×W1×P×H1, wherein the prepreg volume G is equal to the total glue filling volume Z, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; then, according to the prepreg volume calculation formula, the total glue filling volume Z and the cutting size W1, the functional relationship between the prepreg glue content P and the prepreg thickness H1 is obtained, that is, Z=2×W1×P×H1, wherein Z is the total glue filling volume, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; then, according to the prepreg volume calculation formula, the total glue filling volume Z and the cutting size W1, the functional relationship between the prepreg glue content P and the prepreg thickness H1 is obtained, that is, Z=2×W1×P×H1, wherein Z is the total glue filling volume, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; then, according to the prepreg glue content P and the prepreg thickness H1 The functional relationship of is used to determine the values ​​of the prepreg glue content P and the prepreg thickness H1; then, a prepreg of a target sheet type is selected according to the prepreg glue content P and the prepreg thickness H1, and the prepreg of the target sheet type is stacked with the core board to obtain a group of boards to be pressed; finally, the group of boards to be pressed is pressed, so that the manufacturing method of the circuit board can effectively avoid the circuit board from bursting and delamination due to insufficient glue content, and can also select a reasonable prepreg glue content P and prepreg thickness H1 according to the design requirements and production processes of different circuit boards, which not only greatly improves the production quality and production efficiency of the circuit board, but also can meet the application requirements of different circuit boards and improve the overall performance and applicability of the circuit board.

[0064] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is described in detail in the following embodiments in conjunction with specific embodiments:

[0065] like Figure 1 As shown, a method for manufacturing a circuit board according to an embodiment of the present invention includes some or all of the following steps:

[0066] S11, obtaining the total glue filling volume Z required for the circuit board to be glue filled;

[0067] In this embodiment, the total glue filling volume Z is the volume of the circuit board to be filled with glue. For example, the total glue filling volume Z includes the volume of the buried holes of the circuit board to be filled with glue and the volume of the board surface of the circuit board to be filled with glue.

[0068] S13, obtaining the cutting size W1 of the selected prepreg;

[0069] In this embodiment, the corresponding cutting size W1 of the prepreg is selected according to the model size of the circuit board, so that the cutting size W1 of the prepreg is equal to the size of the circuit board, which simplifies the assembly process of the prepreg and the circuit board, improves the production efficiency of the circuit board, and can also optimize the filling effect of the circuit board and improve the overall performance of the circuit board.

[0070] S15, obtaining a prepreg volume calculation formula G=2×W1×P×H1, wherein the prepreg volume G is equal to the total volume of the glue filling Z, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness;

[0071] In this embodiment, the semi-cured sheet volume G can be obtained through the semi-cured sheet volume calculation formula, and the selected minimum value of the semi-cured sheet volume G is the total glue filling volume Z. When the selected semi-cured sheet volume G is equal to the total glue filling volume Z, it can not only effectively avoid the circuit board from bursting and delamination due to insufficient glue content, but also avoid waste due to excessive use of semi-cured sheets in the production process of the circuit board, so that the production cost of the circuit board is lower.

[0072] S17, according to the prepreg volume calculation formula, the total volume of the glue filling Z and the cutting size W1, the functional relationship between the prepreg glue content P and the prepreg thickness H1 is obtained:

[0073] Z = 2 × W1 × P × H1, where Z is the total volume of the filler, W1 is the cut size, P is the prepreg glue content, and H1 is the prepreg thickness;

[0074] Specifically, the total filling volume Z and the cutting size W1 are substituted into the prepreg volume calculation formula, that is, G=2×W1×P×H1, to obtain the functional relationship between the prepreg glue content P and the prepreg thickness H1, that is, Z=2×W1×P×H1.

[0075] S19, determining the values ​​of the prepreg glue content P and the prepreg thickness H1 according to the functional relationship between the prepreg glue content P and the prepreg thickness H1.

[0076] In this embodiment, according to the functional relationship between the prepreg glue content P and the prepreg thickness H1, that is, according to the functional relationship, the values ​​of the prepreg glue content P and the prepreg thickness H1 are determined, so that the manufacturing method of the circuit board can effectively avoid the circuit board from bursting and delamination due to insufficient glue content, and can also select reasonable prepreg glue content P and prepreg thickness H1 according to the design requirements and production processes of different circuit boards. It can be understood that the prepreg glue content P is inversely proportional to the prepreg thickness H1, that is, as the value of the prepreg glue content P increases, the value of the prepreg thickness H1 decreases, and vice versa. For example, for products with higher requirements for conductive properties, a prepreg corresponding to a better prepreg thickness H1 is selected, and for products with higher requirements for thermal stability and mechanical strength, a prepreg corresponding to the best prepreg glue content P is selected.

[0077] Furthermore, before step S107, a data table is established with one-to-one correspondence between multiple circuit board models, multiple prepreg glue contents P, and multiple prepreg thicknesses H1, so as to select references and improve the ease of use of the manufacturing method. In this embodiment, the step of determining the values ​​of the prepreg glue content P and the prepreg thickness H1 according to the functional relationship is specifically as follows: determining the values ​​of the prepreg glue content P and the prepreg thickness H1 according to the functional relationship and the model of the circuit board, thereby improving the applicability of the values ​​of the prepreg glue content P and the prepreg thickness H1 to the circuit board.

[0078] S21, selecting a prepreg of a target sheet type according to the prepreg glue content P and the prepreg thickness H1;

[0079] In this embodiment, the target prepreg type is selected according to the prepreg glue content P and the prepreg thickness H1, so that the circuit board can select a reasonable prepreg glue content P and prepreg thickness H1 according to its own design requirements and production process, thereby improving the overall performance of the circuit board.

[0080] S23, laminating the prepreg of the target sheet type and the core board to obtain a board group to be pressed;

[0081] In this embodiment, the target semi-cured sheet type is stacked with the core board to obtain a group of boards to be pressed. During the stacking process of the target semi-cured sheet type and the core board, the target semi-cured sheet type needs to be accurately placed at a preset position of the core board to avoid interlayer slippage or misalignment during subsequent processing, thereby improving the circuit connection accuracy and reliability of the circuit board.

[0082] S25, performing a pressing operation on the panel group to be pressed.

[0083] In this embodiment, the group of boards to be pressed are pressed. During the pressing process, the semi-cured sheet melts, flows and solidifies under high temperature and high pressure, thereby firmly bonding the core boards together. At the same time, the melted semi-cured sheet will flow into the buried holes to fill the buried holes with glue, thereby avoiding the phenomenon of circuit board explosion and delamination during production or use.

[0084] The manufacturing method of the circuit board mentioned above first obtains the total glue filling volume Z required for the circuit board to be filled with glue, the selected cutting size W1 of the prepreg and the prepreg volume calculation formula G=2×W1×P×H1, wherein the prepreg volume G is equal to the total glue filling volume Z, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; then, according to the prepreg volume calculation formula, the total glue filling volume Z and the cutting size W1, the functional relationship between the prepreg glue content P and the prepreg thickness H1 is obtained, that is, Z=2×W1×P×H1, wherein Z is the total glue filling volume, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; then, according to the prepreg volume calculation formula, the total glue filling volume Z and the cutting size W1, the functional relationship between the prepreg glue content P and the prepreg thickness H1 is obtained, that is, Z=2×W1×P×H1, wherein Z is the total glue filling volume, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; then, according to the prepreg glue content P and the prepreg thickness H1 The functional relationship of is used to determine the values ​​of the prepreg glue content P and the prepreg thickness H1; then, a prepreg of a target sheet type is selected according to the prepreg glue content P and the prepreg thickness H1, and the prepreg of the target sheet type is stacked with the core board to obtain a group of boards to be pressed; finally, the group of boards to be pressed is pressed, so that the manufacturing method of the circuit board can effectively avoid the circuit board from bursting and delamination due to insufficient glue content, and can also select a reasonable prepreg glue content P and prepreg thickness H1 according to the design requirements and production processes of different circuit boards, which not only greatly improves the production quality and production efficiency of the circuit board, but also can meet the application requirements of different circuit boards and improve the overall performance and applicability of the circuit board.

[0085] In this embodiment, the unit of the total volume Z of the filling is mm 3 , the unit of cutting size W1 is mm 2 , the unit of the prepreg thickness H1 is mm.

[0086] In one embodiment, the step S11 of obtaining the total glue filling volume required for the circuit board to be glue-filled includes part or all of the following steps:

[0087] S111, obtaining the total volume X of the buried vias of the circuit board to be filled with glue;

[0088] In this embodiment, the total volume X of the buried vias of the circuit board to be filled with glue is obtained, that is, the sum of the volumes of the buried vias of the circuit board is obtained to obtain the volume of the prepreg required for filling all the buried vias of the circuit board with glue.

[0089] S113, obtaining the board surface glue filling volume Y required for the circuit board to be glue-filled;

[0090] In this embodiment, the volume Y of the board surface glue filling required for the circuit board to be glue-filled is obtained to obtain the volume of the prepreg required when glue filling is performed on the board surface of the circuit board.

[0091] S115, summing up the total volume of the buried vias and the volume of the board surface glue filling to obtain the total glue filling volume Z.

[0092] In this embodiment, the total volume of the buried vias and the volume of the board surface glue filling are summed to obtain the volume of the prepreg required for the glue filling operation on the circuit board to be filled, thereby avoiding the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0093] In this embodiment, the step S115 of summing up the total volume of the buried vias and the volume of the board surface glue filling includes part or all of the following steps:

[0094] S1151, obtaining a summation formula of the total glue filling volume Z, Z=X+Y, where Z is the total glue filling volume, X is the total volume of the buried via, and Y is the glue filling volume of the board surface;

[0095] In this embodiment, the total glue filling volume Z is obtained by the summation formula Z=X+Y, wherein Z is the total glue filling volume, X is the total buried hole volume, and Y is the board surface glue filling volume, so as to obtain the relationship between the total glue filling volume Z, the total buried hole volume X and the board surface glue filling volume Y.

[0096] S1153, substituting the total volume X of the buried vias and the volume Y of the board surface glue filling into the summation formula of the total glue filling volume Z: Z=X+Y, so as to obtain the total glue filling volume Z.

[0097] In this embodiment, the total volume X of the buried vias and the volume Y of the board surface glue filling are substituted into the summation formula Z=X+Y of the total glue filling volume Z to obtain the total glue filling volume Z, that is, the volume of the semi-cured sheet required for the glue filling operation on the circuit board to be filled, so as to facilitate the glue filling operation on the circuit board to be filled and avoid the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0098] In this embodiment, the unit of the total volume X of the buried via is mm 3 , the unit of board filling volume Y is mm 3 .

[0099] In this embodiment, the buried via has a cylindrical structure to reduce the difficulty of processing and forming the circuit board. At the same time, the circular hole can reduce the impedance change during the transmission of the current, ensure the stability and reliability of the signal transmission, and make the cylindrical buried via more stable in electrical performance.

[0100] In one embodiment, the step S111 of obtaining the total volume of the buried vias of the circuit board to be filled with glue includes part or all of the following steps:

[0101] S1111, obtaining a volume V of a single buried via of the circuit board to be filled with glue;

[0102] In this embodiment, the volume V of a single buried via of the circuit board to be filled with glue is obtained to obtain the volume of the prepreg required for filling the single buried via.

[0103] S1113, obtaining the number Q of buried vias of the circuit board to be filled with glue;

[0104] In this embodiment, the number Q of buried vias of the circuit board to be filled with glue is obtained to determine the number of buried vias required to be filled with glue when performing a glue filling operation on the circuit board to be filled with glue.

[0105] S1115 , performing a volume calculation operation on a single buried via volume V and the number of buried vias Q to obtain a total buried via volume X.

[0106] In this embodiment, the volume of a single buried via V and the number of buried vias Q are calculated to obtain the total volume X of the buried vias, that is, the volume of the prepreg required for filling all the buried vias of the circuit board with glue, so as to avoid the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0107] In this embodiment, the step S1115 of performing a volume calculation operation on a single buried via volume V and the number of buried vias Q to obtain a total buried via volume X includes part or all of the following steps:

[0108] S11151, obtaining the volume of the total buried via volume X by using the formula X=V×Q, where X is the total buried via volume, V is the volume of a single buried via, and Q is the number of buried vias;

[0109] In this embodiment, the volume of the total buried via volume X is obtained by using the formula X=V×Q, wherein X is the total buried via volume, V is the volume of a single buried via, and Q is the number of buried vias, so as to obtain the relationship between the total buried via volume X, the volume of a single buried via V, and the number of buried vias Q.

[0110] S11151, substituting the volume V of a single buried via and the number Q of buried vias into the volume of the total buried via volume X to obtain the formula X=V×Q, so as to obtain the total buried via volume X.

[0111] In this embodiment, the volume of a single buried via V and the number of buried vias Q are substituted into the volume of the total buried via volume X to obtain the formula X=V×Q to obtain the total buried via volume X, that is, the volume of the semi-cured sheet required for filling all the buried vias of the circuit board with glue, so as to facilitate the filling operation of the circuit board to be filled with glue and avoid the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0112] In this embodiment, the unit of a single buried hole volume V is mm 3 , the unit of buried via quantity Q is piece.

[0113] In one embodiment, the step S1111 of obtaining the volume V of a single buried via of the circuit board to be filled with glue includes part or all of the following steps:

[0114] S11111, obtaining a single buried via area S1 of the circuit board to be filled with glue;

[0115] In this embodiment, the area S1 of a single buried via of the circuit board to be filled with glue is obtained to obtain the cross-sectional area of ​​the single buried via.

[0116] S11113, obtaining the buried hole depth H2 of the circuit board to be filled with glue;

[0117] In this embodiment, the buried hole depth H2 of the circuit board to be filled with glue is obtained to determine the drilling depth of the circuit board during the drilling operation.

[0118] S11115, performing a volume calculation operation on the single buried via area S1 and the buried via depth H2 to obtain the single buried via volume V.

[0119] In this embodiment, the volume of a single buried via area S1 and a buried via depth H2 is calculated to obtain a single buried via volume V, that is, the volume of the semi-cured sheet required for filling a single buried via of the circuit board with glue, thereby avoiding the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0120] In this embodiment, the step S11115 of performing a volume calculation operation on the single buried via area S1 and the buried via depth H2 to obtain the single buried via volume V includes part or all of the following steps:

[0121] S111151, obtain the area of ​​a single buried via volume V and obtain the formula V=S1×H2, where V is the volume of a single buried via, S1 is the area of ​​a single buried via, and H2 is the depth of the buried via;

[0122] In this embodiment, the area of ​​a single buried hole volume V is obtained by using the formula V=S1×H2, wherein V is the single buried hole volume, S1 is the single buried hole area, and H2 is the buried hole depth, so as to obtain the relationship between the single buried hole volume V, the single buried hole area S1 and the buried hole depth H2.

[0123] S111153, substitute the single buried via area S2 and the buried via depth H2 into the area of ​​the single buried via volume V to obtain the formula V=S1×H2, so as to obtain the single buried via volume V.

[0124] In this embodiment, the single buried hole area S2 and the buried hole depth H2 are substituted into the area of ​​the single buried hole volume V to obtain the formula V=S1×H2 to obtain the single buried hole volume V, that is, the volume of the semi-cured sheet required for filling the single buried hole of the circuit board with glue, so as to facilitate the glue filling operation of the circuit board to be filled with glue and avoid the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0125] In this embodiment, the unit of a single buried via area S1 is mm 2 , the unit of buried hole depth H2 is mm.

[0126] In one embodiment, the step S11113 of obtaining the buried hole depth H2 of the circuit board to be filled with glue includes part or all of the following steps:

[0127] S111131, obtaining the thickness H3 of the circuit board to be filled with glue;

[0128] In this embodiment, the board thickness H3 of the circuit board to be filled with glue is obtained to determine the thickness of the circuit board.

[0129] S111133, obtaining the maximum copper thickness T of the circuit board to be filled with glue;

[0130] In this embodiment, the maximum copper thickness T of the circuit board to be filled with glue is obtained to determine the maximum thickness of the copper foil covering the surface of the circuit board.

[0131] S111135, perform a depth calculation operation on the board thickness H3 and the maximum copper thickness T to obtain a buried hole depth H2.

[0132] In this embodiment, the board thickness H3 and the maximum copper thickness T are used to calculate the depth to obtain the buried hole depth H2, that is, the maximum depth of the buried hole of the circuit board is obtained, ensuring that the volume of the selected prepreg is greater than or equal to the volume of the prepreg actually required for the circuit board, thereby avoiding the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0133] In this embodiment, the step S111135 of performing a depth operation on the board thickness H3 and the maximum copper thickness T to obtain the buried via depth H2 includes part or all of the following steps:

[0134] S1111351, obtain the depth of the buried via hole H2 and obtain the formula H2=H3+2×T, where H2 is the buried via hole depth, H3 is the board thickness of the circuit board to be filled with glue, and T is the maximum copper thickness of the circuit board to be filled with glue;

[0135] In this embodiment, the depth of the buried via hole depth H2 is obtained by using the formula H2=H3+2×T, wherein H2 is the buried via hole depth, H3 is the board thickness of the circuit board to be filled with glue, and T is the maximum copper thickness of the circuit board to be filled with glue, so as to obtain the relationship between the buried via hole depth H2, the board thickness H3 and the maximum copper thickness T.

[0136] S1111353, substitute the board thickness H3 and the maximum copper thickness T into the depth of the buried via hole H2 to obtain the formula H2=H3+2×T to obtain the buried via hole depth H2.

[0137] In this embodiment, the board thickness H3 and the maximum copper thickness T are substituted into the depth of the buried hole depth H2 to obtain the formula H2=H3+2×T to obtain the buried hole depth H2, that is, the maximum depth of the buried hole of the circuit board is obtained, ensuring that the volume of the selected prepreg is greater than or equal to the volume of the prepreg actually required for the circuit board, avoiding the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0138] In this embodiment, the unit of the board thickness H3 is mm, the unit of the maximum copper thickness T is mm, and the unit of the buried via depth H2 is mm.

[0139] In one embodiment, the step S11111 of obtaining the area S2 of a single buried via of the circuit board to be filled with glue includes part or all of the following steps:

[0140] S111111, obtaining a single buried via diameter D of the circuit board to be filled with glue;

[0141] In this embodiment, the diameter D of a single buried via of the circuit board to be filled with glue is obtained to determine the aperture of the buried via of the circuit board.

[0142] S111113, performing an area calculation operation on the single buried via diameter D to obtain a single buried via area S2.

[0143] In this embodiment, the area of ​​a single buried via diameter D is calculated to obtain a single buried via area S2, so that the single buried via area S2 can be adjusted by adjusting the single buried via diameter D during the design process of the circuit board. For example, the larger the single buried via diameter D, the larger the single buried via area S2.

[0144] In this embodiment, the step S11113 of performing an area calculation operation on a single buried via diameter D to obtain a single buried via area S2 includes part or all of the following steps:

[0145] S1111131, get the area of ​​a single buried via S2 and calculate the formula S2 = 0.785D 2 , where S2 is the area of ​​a single buried via, and D is the diameter of a single buried via;

[0146] In this embodiment, the area of ​​a single buried via S2 is obtained by formula S2=0.785D 2 , where S2 is the area of ​​a single buried via, and D is the diameter of a single buried via, so as to obtain a relationship between the area S2 of a single buried via and the diameter D of a single buried via.

[0147] S1111133, substitute the single buried via diameter D into the area of ​​the single buried via area S2 to obtain the formula S2 = 0.785D 2 , to obtain a single buried via area S2.

[0148] In this embodiment, the diameter D of a single buried via is substituted into the area of ​​a single buried via S2 to obtain the formula S2=0.785D 2 , to obtain a single buried via area S2, so that in the design process of the circuit board, the single buried via area S2 can be adjusted by adjusting the single buried via diameter D. For example, when the single buried via diameter D is larger, the single buried via area S2 is larger.

[0149] In this embodiment, the unit of the diameter D of a single buried via is mm.

[0150] In one embodiment, the step S113 of obtaining the board surface glue filling volume Y required for the circuit board to be glue-filled includes part or all of the following steps:

[0151] S1131, obtaining the minimum required thickness N of the cream layer of the circuit board to be filled with glue;

[0152] In this embodiment, during the production of the circuit board, a relatively thin interface layer with a creamy (or white, light yellow, etc.) color formed between the outer copper foil and the bonding sheet (such as prepreg) after high-temperature lamination is called the cream layer. As the interface layer between the copper foil and the bonding sheet, the cream layer has an important influence on the reliability and performance of the circuit board. It determines the bonding strength between the copper foil and the bonding sheet, and further affects the heat resistance, corrosion resistance and electrical performance of the circuit board. Therefore, during the production of the circuit board, it is necessary to ensure that the thickness of the cream layer can meet the minimum required thickness to ensure that the produced circuit board has good quality.

[0153] S1133, obtaining the design size W2 of the circuit board to be filled with glue;

[0154] In this embodiment, during the production process of the circuit board, the design size W2 of the circuit board to be filled with glue is designed according to the use scenario and production process of the circuit board.

[0155] S1135, obtaining a residual copper rate A on the first side of the circuit board to be filled with glue and a residual copper rate B on the second side of the circuit board to be filled with glue;

[0156] In this embodiment, the residual copper rate of the circuit board is an important quality control indicator, which reflects the residual proportion of excess copper material in the circuit board manufacturing process. The lower the residual copper rate, the tighter the bonding between the copper foil and the substrate, and the higher the quality of the circuit board. If the residual copper rate A on the first side or the residual copper rate B on the second side is too high, it should be regarded as a defective product and removed to ensure that the finished circuit board can have a good quality.

[0157] S1137, obtaining the maximum copper thickness T of the circuit board to be filled with glue;

[0158] In this embodiment, the maximum copper thickness T of the circuit board to be filled with glue is obtained to determine the maximum thickness of the copper foil covering the surface of the circuit board.

[0159] S1139, performing a volume calculation operation on the minimum required thickness N of the cream layer, the design size W2 of the circuit board to be filled with glue, the residual copper rate A of the first side, the residual copper rate B of the second side and the maximum copper thickness T to obtain the board surface filling volume Y.

[0160] In this embodiment, the minimum required thickness N of the cream layer, the design size W2 of the circuit board to be filled with glue, the residual copper rate A of the first side, the residual copper rate B of the second side and the maximum copper thickness T are calculated to obtain the board surface filling volume Y, that is, the volume of the prepreg required when filling the board surface of the circuit board with glue is obtained, so as to avoid the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0161] In this embodiment, the step S1139 of performing a volume calculation operation on the minimum required thickness N of the cream layer, the design size W2 of the circuit board to be filled with glue, the residual copper rate A of the first side, the residual copper rate B of the second side, and the maximum copper thickness T to obtain the board surface filling volume Y includes part or all of the following steps:

[0162] S11391, obtain the volume of the board filling volume Y by the formula Y=2×N×W2+(2-AB)×W2×T, where Y is the board filling volume, N is the minimum required thickness of the cream layer, W2 is the design size of the circuit board to be filled with glue, A is the residual copper rate of the first side, B is the residual copper rate of the second side, and T is the maximum copper thickness;

[0163] In this embodiment, the volume of the board filling volume Y is obtained by the formula Y=2×N×W2+(2-AB)×W2×T, wherein Y is the board filling volume, N is the minimum required thickness of the cream layer, W2 is the design size of the circuit board to be filled with glue, A is the residual copper rate of the first side, B is the residual copper rate of the second side, and T is the maximum copper thickness, so as to obtain the relationship between the board filling volume Y, the minimum required thickness of the cream layer N, the design size of the circuit board to be filled with glue W2, the residual copper rate A of the first side, the residual copper rate B of the second side and the maximum copper thickness T.

[0164] S11393, substitute the minimum required thickness N of the cream layer, the design size W2 of the circuit board to be filled with glue, the residual copper rate A of the first side, the residual copper rate B of the second side and the maximum copper thickness T into the volume of the board filling volume Y to obtain the formula Y=2×N×W2+(2-AB)×W2×T, so as to obtain the board filling volume Y.

[0165] In this embodiment, the minimum required thickness N of the cream layer, the design size W2 of the circuit board to be filled with glue, the residual copper rate A of the first side, the residual copper rate B of the second side and the maximum copper thickness T are substituted into the volume of the board filling volume Y to obtain the formula Y=2×N×W2+(2-AB)×W2×T, so as to obtain the board filling volume Y, that is, the volume of the semi-cured sheet required for filling the board surface with glue, so as to avoid the phenomenon of circuit board explosion and delamination due to insufficient glue content.

[0166] In this embodiment, the unit of the minimum required thickness N of the cream layer is mm, and the unit of the design size W2 of the circuit board to be filled with glue is mm 2 The unit of the maximum copper thickness T is mm, the unit of the residual copper rate A on the first side is %, and the unit of the residual copper rate B on the second side is %.

[0167] In one embodiment, the minimum required thickness N of the cream layer is 0.005 mm, so as to effectively prevent the circuit board from bursting and delamination while reducing the production cost of the circuit board.

[0168] In this embodiment, the design size W2 of the circuit board to be filled with glue is equal to the cutting size W1, so as to effectively prevent the circuit board from bursting and delamination while reducing the production cost of the circuit board.

[0169] In this embodiment, the selected prepreg volume G is greater than or equal to the total glue filling volume Z, so as to avoid the circuit board from bursting and delamination due to insufficient glue content, thereby improving the production quality and production efficiency of the circuit board.

[0170] In this embodiment, the unit of the prepreg volume G is mm 3 .

[0171] In this embodiment, when a plurality of prepregs are selected, the volume of each prepreg is accumulated to obtain the total volume of the prepregs.

[0172] like Figures 2 to 3 As shown, in this embodiment, the manufacturing method of the above-mentioned circuit board is to first drill the second layer substrate and the third layer substrate of the circuit board; then the circuit board is electroplated, and then the second layer substrate and the third layer substrate of the circuit board are laminated, exposed, developed, and etched in sequence until the circuit board is patterned, and finally the circuit board is pressed.

[0173] The present disclosure also provides a circuit board, which is manufactured using the circuit board manufacturing method described in the above embodiment.

[0174] Compared with the prior art, the present invention has at least the following advantages:

[0175] For the above-mentioned circuit board, first, the total volume Z of the glue filling required for the circuit board to be filled with glue, the selected cutting size W1 of the semi-cured sheet and the semi-cured sheet volume calculation formula G=2×W1×P×H1 are obtained in sequence, wherein the semi-cured sheet volume G is equal to the total volume Z of the glue filling, W1 is the cutting size, P is the semi-cured sheet glue content, and H1 is the semi-cured sheet thickness; then, according to the semi-cured sheet volume calculation formula, the total volume Z of the glue filling and the cutting size W1, the functional relationship between the semi-cured sheet glue content P and the semi-cured sheet thickness H1 is obtained, that is, Z=2×W1×P×H1, wherein Z is the total volume of the glue filling, W1 is the cutting size, P is the semi-cured sheet glue content, and H1 is the semi-cured sheet thickness; then, according to the semi-cured sheet volume calculation formula, the total volume Z of the glue filling and the cutting size W1, the functional relationship between the semi-cured sheet glue content P and the semi-cured sheet thickness H1 is obtained, that is, Z=2×W1×P×H1, wherein Z is the total volume of the glue filling, W1 is the cutting size, P is the semi-cured sheet glue content, and H1 is the semi-cured sheet thickness; then, according to the functional relationship between the semi-cured sheet glue content P and the semi-cured sheet thickness H1 The relationship determines the values ​​of the prepreg glue content P and the prepreg thickness H1; then, the prepreg of the target sheet type is selected according to the prepreg glue content P and the prepreg thickness H1, and the prepreg of the target sheet type is stacked with the core board to obtain a group of boards to be pressed; finally, the group of boards to be pressed is pressed, so that the manufacturing method of the circuit board can effectively avoid the circuit board from bursting and delamination due to insufficient glue content, and can also select a reasonable prepreg glue content P and prepreg thickness H1 according to the design requirements and production processes of different circuit boards, which not only greatly improves the production quality and production efficiency of the circuit board, but also can meet the application requirements of different circuit boards and improve the overall performance and applicability of the circuit board.

[0176] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.

Claims

1. A method for manufacturing a circuit board, characterized in that: The steps of the method for manufacturing the circuit board include: Obtain the total glue filling volume Z required for the circuit board to be filled with glue; Obtaining the cutting size W1 of the selected prepreg; The prepreg volume calculation formula G=2×W1×P×H1 is obtained, wherein the prepreg volume G is equal to the total volume Z of the glue filling, W1 is the cutting size, P is the prepreg glue content, and H1 is the prepreg thickness; According to the prepreg volume calculation formula, the total glue filling volume Z and the cutting size W1, the functional relationship between the prepreg glue content P and the prepreg thickness H1 is obtained: Z=2×W1×P×H1, where Z is the total volume of the filler, W1 is the cutting size, P is the prepreg glue content, and H1 is the thickness of the prepreg; Determining the values ​​of the prepreg glue content P and the prepreg thickness H1 according to a functional relationship between the prepreg glue content P and the prepreg thickness H1; Selecting the prepreg of a target sheet type according to the prepreg glue content P and the prepreg thickness H1; Laying the prepreg of the target sheet type on a core board to obtain a board group to be laminated; The panel group to be pressed is pressed.

2. The method for manufacturing a circuit board according to claim 1, characterized in that: The step of obtaining the total glue filling volume Z required for the circuit board to be glue filled comprises: Obtaining the total volume X of the buried vias of the circuit board to be filled with glue; Obtaining the board surface glue filling volume Y required for the circuit board to be glue-filled; The total volume X of the buried vias and the volume Y of the board surface glue filling are summed to obtain the total volume Z of the glue filling.

3. The method for manufacturing a circuit board according to claim 2, characterized in that: The step of obtaining the total volume X of the buried vias of the circuit board to be filled with glue comprises: Obtaining a single buried via volume V of the circuit board to be filled with glue; Obtaining the number Q of buried vias of the circuit board to be filled with glue; A volume calculation operation is performed on the single buried via volume V and the number of buried vias Q to obtain the total buried via volume X.

4. The method for manufacturing a circuit board according to claim 3, characterized in that: The step of obtaining the volume V of the single buried via of the circuit board to be filled with glue comprises: Obtaining a single buried via area S1 of the circuit board to be filled with glue; Obtaining the buried hole depth H2 of the circuit board to be filled with glue; A volume calculation operation is performed on the single buried via area S1 and the buried via depth H2 to obtain the single buried via volume V.

5. The method for manufacturing a circuit board according to claim 4, characterized in that: The step of obtaining the buried hole depth H2 of the circuit board to be filled with glue comprises: Obtaining the board thickness H3 of the circuit board to be filled with glue; Obtaining the maximum copper thickness T of the circuit board to be filled with glue; The board thickness H3 and the maximum copper thickness T are subjected to a depth calculation operation to obtain the buried via depth H2.

6. The method for manufacturing a circuit board according to claim 4, characterized in that: The step of obtaining the single buried via area S2 of the circuit board to be filled with glue comprises: Obtaining the diameter D of the single buried via of the circuit board to be filled with glue; An area calculation operation is performed on the single buried via diameter D to obtain the single buried via area S2.

7. The method for manufacturing a circuit board according to claim 5, characterized in that: The step of obtaining the board surface glue filling volume Y required for the circuit board to be glue-filled comprises: Obtaining the minimum required thickness N of the cream layer of the circuit board to be filled with glue; Obtain the design size W2 of the circuit board to be filled with glue; Obtaining a residual copper rate A on the first side of the circuit board to be filled with glue and a residual copper rate B on the second side of the circuit board to be filled with glue; Obtaining the maximum copper thickness T of the circuit board to be filled with glue; The volume of the board surface filling volume Y is obtained by performing a volume calculation operation on the minimum required thickness N of the cream layer, the design size W2 of the circuit board to be filled with glue, the residual copper rate A of the first side, the residual copper rate B of the second side and the maximum copper thickness T.

8. The method for manufacturing a circuit board according to claim 7, characterized in that: The minimum required thickness N of the cream layer is 0.005 mm.

9. The method for manufacturing a circuit board according to claim 7, characterized in that: The design size W2 of the circuit board to be filled with glue is equal to the cutting size W1.

10. A circuit board, characterized in that: The circuit board is manufactured by the method for manufacturing a circuit board according to any one of claims 1 to 9.

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