Component mounting device and contact determination method

Abstract

A component mounting machine according to the present disclosure is provided with a head including a plurality of holders each holding a suction nozzle so as to be relatively movable, and sequentially performs a mounting operation of mounting a component sucked by the plurality of suction nozzles onto a substrate, the component mounting machine being provided with: a fluid pressure circuit connected to the plurality of holders; a sensor that detects at least one of a pressure and a flow rate of the fluid flowing in the fluid pressure circuit; and a determination unit that sets the threshold value such that the value becomes larger as the absolute value of the pressure or the flow rate detected by the sensor at a predetermined timing is larger, and that determines the threshold value when the mounting operation is performed after the predetermined timing. When the absolute value of the pressure, the absolute value of the amount of change in the pressure, the flow rate, or the absolute value of the amount of change in the flow rate detected by the sensor exceeds a threshold value, it is determined that the component sucked by the suction nozzle is in contact with the substrate.

Description

Technical Field

[0001] This specification discloses a component mounting machine and a contact determination method. Background Art

[0002] In the past, a component mounting machine is known, which determines whether a component adsorbed to a suction nozzle is in contact with a substrate during mounting, and confirms that the component is in contact with the substrate. For example, Patent Document 1 discloses a machine having: a head having a plurality of holders that can be raised and lowered; a suction nozzle that is mounted on a holder in a manner that allows relative movement with respect to the holder; a gas passage that is connected to the plurality of holders, and in which the component is pressed against the substrate by lowering the holder together with the suction nozzle, and the suction nozzle is moved toward the holder by a specified amount and opened to the outside; and a sensor that detects the flow rate or pressure of the gas flowing in the gas passage. In this component mounting machine, the gas flow rate or gas pressure is monitored by a sensor, and when the gas passage is opened to the outside and the gas flow rate or gas pressure exceeds a threshold value (a certain value), it is determined that the component adsorbed to the suction nozzle is in contact with the substrate. Prior art literature Patent Literature

[0003] Patent document 1: International Publication No. 2018 / 179317. Summary of the invention Technical problem to be solved by the invention

[0004] However, in the above-mentioned component mounting machine, a plurality of suction nozzles are maintained on the head, and a plurality of components are adsorbed in one cycle and mounted on the substrate. Therefore, such a component mounting machine can mount the remaining components on the substrate in a short time after mounting the first component among the plurality of components adsorbed by the plurality of suction nozzles on the substrate. During the mounting operation of each component, it is determined whether the component is in contact with the substrate by detecting, using a sensor, that the pressure in the gas passage has decreased and the gas flow rate in the gas passage has changed. When the pressure in the gas passage temporarily decreases, it takes a certain amount of time for it to recover, so the state of the pressure in the gas passage is very different, especially when mounting the first component among the plurality of components on the substrate and when mounting the next component on the substrate. In such a case, if the thresholds of the gas flow rate and the gas pressure are set to certain values ​​as in Patent Document 1, it is sometimes difficult to detect the contact between the component adsorbed on the suction nozzle and the substrate.

[0005] A main object of the present disclosure is to more appropriately detect contact between a component and a substrate in a component mounting machine including a head that holds a plurality of suction nozzles. Means for solving problems

[0006] In order to achieve the above-mentioned main object, the present disclosure adopts the following means.

[0007] The component mounting machine disclosed in the present invention comprises a head including a plurality of retainers which respectively hold suction nozzles so as to be relatively movable, and sequentially performs the mounting action of mounting the components adsorbed by the plurality of suction nozzles on a substrate, and its main purpose is to comprise: a fluid pressure circuit connected to the plurality of retainers; a sensor which detects at least one of the pressure and flow rate of a fluid flowing in the fluid pressure circuit; and a determination unit which sets a threshold value in such a manner that the greater the absolute value of the pressure or the flow rate detected by the sensor at a specified time, the greater the value; after the specified time, when performing the mounting action, when the absolute value of the pressure, the absolute value of the pressure change, the flow rate or the absolute value of the flow rate change detected by the sensor exceeds the threshold value, it is determined that the component adsorbed by the suction nozzle is in contact with the substrate.

[0008] In the component mounting machine, if the absolute value of the pressure, the absolute value of the pressure change, the flow rate or the absolute value of the flow rate change exceeds the threshold value, it is determined that the component is in contact with the substrate. The threshold value at this time is set to a greater value as the absolute value of the pressure or flow rate detected by the sensor at a predetermined timing in advance increases. Thus, the contact between the component and the substrate can be detected more appropriately.

[0009] The contact determination method disclosed in the present invention is applied to a component mounting machine to determine whether a component adsorbed by a suction nozzle is in contact with a substrate. The component mounting machine includes a head including a plurality of retainers that respectively hold the suction nozzles so as to be relatively movable, and sequentially performs an installation operation of installing the components adsorbed by the plurality of suction nozzles onto the substrate. The component mounting machine includes: a fluid pressure circuit connected to the plurality of retainers; and a sensor that detects at least one of a pressure and a flow rate of a fluid flowing in the fluid pressure circuit. The main purpose of the contact determination method is to set a threshold value in such a way that the greater the absolute value of the pressure or the flow rate detected by the sensor at a specified time, the greater the value. After the specified time, during the installation operation, when the absolute value of the pressure, the absolute value of the pressure change, the flow rate or the absolute value of the flow rate change detected by the sensor exceeds the threshold value, it is determined that the component adsorbed by the suction nozzle is in contact with the substrate.

[0010] In this contact determination method, the same effects as those of the component mounting machine of the present disclosure are achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic structural diagram of the component mounting machine 10. Figure 2 It is a schematic structural diagram of the mounting head 40. Figure 3 It is a schematic structural diagram of the negative pressure supply device 70 and the positive pressure supply device 80. Figure 4AThis is an explanatory diagram of a state in which the nozzle 61 of the suction nozzle 60 is not pressed into the nozzle holder 65 side. Figure 4B This is an explanatory diagram showing a state in which the nozzle 61 of the suction nozzle 60 is pushed toward the nozzle holder 65 by a predetermined amount. Figure 5 2 is a block diagram showing the electrical connection relationship of the control device 90 . Figure 6 This is a flowchart showing an example of a component mounting process routine. Figure 7 This is a flowchart showing an example of a threshold value setting processing subroutine. Figure 8 It is an explanatory diagram showing an example of a relational expression between a threshold value and a pressure value. Fig.9A It is an explanatory diagram showing an example of a pressure change model in a high pressure state. Fig. 9B It is an explanatory diagram showing an example of a pressure change model in a low pressure state. Fig.10 It is an explanatory diagram showing the relationship between the mounting order and the deviation amount from the appropriate press-fitting amount. DETAILED DESCRIPTION

[0012] Next, a mode for carrying out the present disclosure will be described with reference to the drawings. Figure 1 It is a schematic structural diagram of the component mounting machine 10. Figure 2 It is a schematic structural diagram of the mounting head 40. Figure 3 It is a schematic structural diagram of the negative pressure supply device 70 and the positive pressure supply device 80. Figure 4A This is an explanatory diagram of a state in which the nozzle 61 of the suction nozzle 60 is not pressed into the nozzle holder 65 side. Figure 4B This is an explanatory diagram showing a state in which the nozzle 61 of the suction nozzle 60 is pushed toward the nozzle holder 65 by a predetermined amount. Figure 5 is a block diagram showing the electrical connection relationship of the control device 90. In addition, Figure 1 The left and right direction is the X-axis direction, the front (near front) and rear (inner side) directions are the Y-axis directions, and the up and down directions are the Z-axis directions.

[0013] like Figure 1 As shown, the component mounting machine 10 includes: a base 11; a housing 12 supported by the base 11; a component supply device 20 for supplying components C to a component supply position; and a substrate conveying device 24 for conveying a substrate S (an example of an object to be mounted). In addition, the component mounting machine 10 includes: a mounting head 40 for picking up components C supplied to the component supply position and mounting them on the substrate S; an XY robot 30 for moving the mounting head 40 along the XY axis direction; and a control device 90 (see Figure 5), the control device as a whole. In addition to these, the component mounting machine 10 also includes a parts camera 26 for photographing the posture of the component C held by the mounting head 40, a mark camera (not shown) provided on the mounting head 40 and used to read the positioning reference mark attached to the substrate S, etc.

[0014] The component supply device 20 is configured as a tape feeder that supplies the components C by feeding out a tape in which the components C are stored in storage portions formed at predetermined intervals.

[0015] like Figure 1 As shown, the XY robot 30 includes: a pair of left and right Y-axis guide rails 33, which are arranged on the upper part of the housing 12 along the front-back direction (Y-axis direction); a Y-axis slide 34, which is mounted on the pair of left and right Y-axis guide rails 33 and can move along the Y-axis guide rails 33; an X-axis guide rail 31, which is arranged on the side of the Y-axis slide 34 along the left-right direction (X-axis direction); and an X-axis slide 32, which can move along the X-axis guide rail 31. The X-axis slide 32 can be moved by an X-axis motor 36 (see Figure 5 ) is driven to move, and the Y-axis slide 34 can be moved by the Y-axis motor 38 (refer to Figure 5 The mounting head 40 is mounted on the X-axis slide 32, and the control device 90 drives and controls the XY robot 30 (X-axis motor 36 and Y-axis motor 38), thereby being able to move the mounting head 40 to any position on the XY plane.

[0016] like Figure 2 or Figure 3 As shown, the mounting head 40 includes a head body 42 on which a plurality (20 in this embodiment) of nozzle holders 65 (in the embodiment) are arranged at predetermined angular intervals (e.g., 13 degree intervals) in a circumferential direction coaxial with the rotation axis. Figure 2 , Figure 3 Only two are shown in the figure); and a suction nozzle 60, which is mounted on the lower end of each suction nozzle holder 65 in a detachable manner. In addition, the mounting head 40 has: an R-axis motor 44, which rotates the mounting head body 42 to rotate (revolve) the multiple suction nozzle holders 65; a Q-axis motor 46, which rotates (rotates) the multiple suction nozzle holders 65; and a lifting device 50, which lifts and lowers the suction nozzle holder 65. In addition, the mounting head 40 has: a negative pressure supply device 70, which supplies negative pressure to the nozzle 61; and a positive pressure supply device 80, which supplies positive pressure to the suction nozzle holder 65.

[0017] like Figure 2 or Figure 3As shown, the head body 42 includes: a frame 41, which is mounted on the X-axis slide 32; a shaft 42a, which is rotatably supported on the frame 41; and a retainer holding portion 42b, which is formed into a cylindrical shape with a larger diameter than the shaft 42a, and holds multiple nozzle holders 65 so that they can move along the Z-axis direction. If the R-axis motor 44 is driven, the shaft 42a and the retainer holding portion 42b rotate, thereby rotating (revolving) multiple nozzle holders 65. In addition, the head body 42 has: a gear 43, which is supported to be coaxial with the shaft 42a and rotatable relative to the shaft 42a; and a gear 47, which rotates as the gear 43 rotates. The gear 43 meshes with the gear 45 mounted on the rotating shaft of the Q-axis motor 46, and the gear 47 meshes with the gear 65b mounted on each nozzle holder 65. When the Q-axis motor 46 is driven, each nozzle holder 65 and the nozzle 60 mounted on each nozzle holder 65 rotate (rotate) in the same rotation direction and by the same rotation amount (rotation angle). In addition, a spring 65a is arranged between the lower surface of the gear 65b and the upper surface of the holder holding portion 42b. The spring 65a applies force to the nozzle holder 65 in the upper direction of the Z-axis.

[0018] The nozzle holder 65 is configured as a cylindrical member extending in the Z-axis direction. Figure 3 As shown in FIG. 1 , a first gas passage 66a and a second gas passage 67a are formed inside the gas passage 66a. Figure 2 or Figure 3 As shown, the nozzle holder 65 is formed at an upper end portion thereof with a horizontal portion 65c extending in the radial direction.

[0019] like Figure 2 As shown, the lifting device 50 includes a linear motor 51 and a Z-axis slide 52 that can be lifted and lowered along the Z-axis direction by the drive of the linear motor 51. The Z-axis slide 52 is formed with an engaging portion 52a that can engage (here, abut) with a horizontal portion 65c provided on the nozzle holder 65. The engaging portion 52a engages with a horizontal portion 65c of a nozzle holder 65 located at a specified lifting position among a plurality of nozzle holders 65. If the Z-axis slide 52 is lifted and lowered in a state where the engaging portion 52a is engaged with the horizontal portion 65c, the nozzle holder 65 located at the lifting position is lifted and lowered accordingly. Since the nozzle 60 is installed on the nozzle holder 65, the nozzle 60 is also lifted and lowered as the nozzle holder 65 is lifted and lowered. In addition, the plurality of nozzle holders 65 are revolved by the R-axis motor 44, whereby the nozzle holder 65 located at the lifting position among the plurality of nozzle holders 65 is switched.

[0020] The negative pressure supply device 70 is a device that independently supplies negative pressure from the same negative pressure source 71 to the plurality of suction nozzles 60 respectively mounted on the plurality of suction nozzle holders 65. Figure 3As shown, the negative pressure supply device 70 includes a negative pressure source 71 such as a vacuum pump, a frame passage 72, a head passage 73, a negative pressure introduction passage 74, an atmosphere introduction passage 75, a valve core hole 77, a valve core 78, and a valve core drive mechanism 79 (see Figure 5 ). The frame passage 72 is formed in the frame 41 of the mounting head 40 and is connected to the negative pressure source 71. The head passage 73 is connected to the frame passage 72 and is formed in a manner extending along the central axis of the mounting head 40. The negative pressure introduction passage 74 is connected to the head passage 73 and is formed in a plurality of ways extending radially from the central axis of the retainer holding portion 42b. The atmosphere introduction passage 75 is formed in a plurality of ways corresponding to the negative pressure introduction passage 74 in a manner connected to the positive pressure source (here, the atmosphere).

[0021] The valve core 78 is a switching valve for selectively connecting the corresponding negative pressure introduction passage 74 and the atmosphere introduction passage 75 to the first gas passage 66a provided in each of the plurality of nozzle holders 65. The first gas passage 66a is connected to the suction port at the front end of the nozzle 61 of the nozzle 60, as will be described in detail later. Figure 3 As shown, the valve core 78 is a cylindrical member inserted into the valve core hole 77, which is formed in the holder holding portion 42b corresponding to the plurality of nozzle holders 65. The valve core 78 is reduced in diameter at the approximate center, and the area around the reduced diameter portion in the space inside the valve core hole 77 becomes a path for the negative pressure from the negative pressure source 71. The valve core 78 is in a state of moving upward ( Figure 3 ), the first gas passage 66a is connected to the negative pressure introduction passage 74, and the connection between the first gas passage 66a and the atmosphere introduction passage 75 is cut off. On the other hand, when the valve core 78 itself moves downward, the connection between the first gas passage 66a and the negative pressure introduction passage 74 is cut off, and the first gas passage 66a is connected to the atmosphere introduction passage 75. The valve core driving mechanism 79 outputs a driving force to move the valve core 78 up and down, thereby switching which of the negative pressure introduction passage 74 and the atmosphere introduction passage 75 the valve core 78 makes communicate with the first gas passage 66a.

[0022] The positive pressure supply device 80 is a device for supplying positive pressure to the second gas passages 67a respectively provided in the plurality of nozzle holders 65. Figure 3As shown, the positive pressure supply device 80 includes a positive pressure source 81 such as a compressor, a pressure sensor 81a, a frame passage 82, a head passage 83, and a positive pressure introduction passage 84. The pressure sensor 81a is connected to the positive pressure source 81 to detect the pressure of the gas (here, air) supplied from the positive pressure source 81 and flowing in the second gas passage 67a. The frame passage 82 is formed in a position different from the frame passage 72 in the frame 41 of the mounting head 40, and is connected to the pressure sensor 81a and the positive pressure source 81. The head passage 83 is connected to the frame passage 82 and is formed in a manner extending along the central axis direction of the mounting head 40. The head passage 83 is annular in shape with the head passage 73 as the center in a plan view, and extends in the vertical direction in a shape separated from the head passage 73 and surrounding the periphery thereof. The positive pressure introduction passage 84 is connected to the head passage 83, and is formed in a plurality in a manner extending from the central axis side of the retainer holding portion 42b toward the outside of the retainer holding portion 42b. A plurality of positive pressure introduction passages 84 are formed corresponding to a plurality of nozzle holders 65, respectively, and are connected to the second gas passage 67a of the corresponding nozzle holder 65. In addition, the plurality of positive pressure introduction passages 84 are formed in a manner avoiding the negative pressure introduction passage 74 and the valve core hole 77. In addition, the frame passage 82, the head passage 83, the positive pressure introduction passage 84, and the second gas passage 67a are not connected to any of the frame passage 72, the head passage 73, the negative pressure introduction passage 74, the atmosphere introduction passage 75, the valve core hole 77, and the first gas passage 66a. That is, the negative pressure path of the negative pressure supply device 70 and the positive pressure (atmosphere) path are independent of the positive pressure path of the positive pressure supply device 80.

[0023] The interior of the nozzle holder 65 and the nozzle 60 are described in detail using FIG. 4. Figure 4A 1 is an explanatory diagram showing a state in which the nozzle 61 of the nozzle 60 is not pressed toward the nozzle holder 65 (upper side in the figure). Figure 4BIt is an explanatory diagram of a state in which the nozzle 61 is pressed into the nozzle holder 65 side by a predetermined amount. As shown in FIG. 4 , the nozzle 60 includes a nozzle 61, a cylindrical portion 62 having a larger diameter than the nozzle 61, and a pin 63. The nozzle 61 is a cylindrical body, and negative pressure is supplied to the internal nozzle passage 61a when the suction port at the front end (lower end of the figure) is in contact with the component C, thereby adsorbing the component C. A plurality of nozzle branch passages 61b are formed at the upper end of the nozzle 61. The nozzle branch passages 61b are upper and lower through holes that connect the nozzle passage 61a with the upper side of the nozzle 61. A plurality of nozzle branch passages 61b are formed at equal intervals on the circumference when viewed from above. Two nozzle branch passages 61b are illustrated in FIG. 4 , but for example, four nozzle branch passages may be provided. There may be more than one nozzle branch passage 61b, but it is preferred that a plurality of nozzle branch passages 61b be provided so that the negative pressure from the negative pressure source 71 can easily act on the suction port at the front end of the nozzle 61. The cylindrical portion 62 is mounted on the outer periphery of the mouth 61 and has a flange portion. The outer diameter of the cylindrical portion 62 is smaller than the inner diameter of the lower end of the outer cylinder 66, and the cylindrical portion 62 and the mouth 61 can be inserted into the outer cylinder 66. The pin 63 penetrates the mouth 61 and the cylindrical portion 62 in the radial direction (left and right direction of FIG. 4). The mouth 61 is provided with a pair of long holes formed in the up-down direction, and the pin 63 penetrates the pair of long holes. Therefore, the pin 63 can move up and down relative to the mouth 61 along the long holes. Thus, the pin 63 allows the mouth 61 to move up and down relative to the cylindrical portion 62, and the mouth 61 is held in a manner that does not fall off from the cylindrical portion 62.

[0024] The nozzle holder 65 has an outer tube 66, an inner tube 67 inside the outer tube 66, a spring 68 and a valve 69. The outer tube 66 has an inner tube 67 inserted inside, and the space between the inner circumferential surface of the outer tube 66 and the outer circumferential surface of the inner tube 67 becomes the first gas passage 66a mentioned above. The first gas passage 66a extends in the up-down direction. The first gas passage 66a is a space provided in such a manner that the gas flows in the up-down direction inside the nozzle holder 65. In addition, the upper side of the mouth 61 and the cylindrical portion 62 of the nozzle 60 is inserted into the inner part of the outer tube 66 from below. A cylindrical pressing member 66d and a spring 66c for applying force to the pressing member 66d downward are installed on the outer side of the outer tube 66. A slit of such a shape is formed in the outer tube 66 from the lower end of the outer tube 66 toward the top and then toward the circumferential direction of the outer tube 66. When the suction nozzle 60 is mounted on the suction nozzle holder 65, after the suction nozzle 60 is raised and the cylindrical portion 62 is inserted into the inner part of the outer tube 66, the suction nozzle 60 is rotated in the circumferential direction. As a result, the pin 63 moves upward and circumferentially in the slit of the outer tube 66 and reaches the end of the slit, and the suction nozzle 60 is mounted on the outer tube 66. In this state, the pressing member 66d presses the pin 63 downward by the action of the spring 66c. As a result, the pressing member 66d prevents the pin 63 from falling off from the slit of the outer tube 66, thereby preventing the suction nozzle 60 from falling off from the outer tube 66. In addition, the outer tube 66 has a leakage hole 66b slightly above the mounting position of the suction nozzle 60. The leakage hole 66b is a through hole that passes through the outer tube 66 horizontally (perpendicularly to the up and down direction) and opens to the outside of the outer tube 66. The leakage hole 66b is formed so as to communicate the inner side and the outer side of the outer tube 66 in the radial direction.

[0025] The space inside the inner tube 67 becomes the second gas passage 67a mentioned above. The second gas passage 67a extends in the up-down direction. The second gas passage 67a is a space for gas to flow in the up-down direction inside the nozzle holder 65. The inner tube 67 has a second gas passage 67a, a flange portion 67b, a through hole 67c, a protrusion 67d and an opening 67e. The flange portion 67b abuts and engages with the part of the inner circumference of the outer tube 66 where the inner circumference is narrowed by one level. Thus, even if there is a force from the spring 68, the inner tube 67 is subjected to a downward reaction force from the outer tube 66, so the outer tube 66 does not move upward relative to the inner tube 67. The through hole 67c is a hole that penetrates the flange portion 67b from top to bottom, and a plurality of through holes are arranged at equal intervals on the circumference when viewed from above. Two through holes 67c are illustrated in FIG. 4, but for example, the through holes 67c can also be formed at four places. By having one or more through holes 67c, the portion of the first gas passage 66a above the flange portion 67b is connected to the portion below the flange portion 67b. The protrusion 67d is a portion of the inner tube 67 formed below the flange portion 67b to protrude radially outward, and the lower surface of the protrusion 67d abuts against the upper end of the spring 68. The opening 67e is a through hole that passes through the inner tube 67 horizontally (perpendicularly to the up-down direction), and is formed to connect the second gas passage 67a inside the inner tube 67 with the outer peripheral surface side of the inner tube 67. The opening 67e is formed near the end of the lower end of the second gas passage 67a. The opening 67e is formed to connect the inner side and the outer side of the inner tube 67 in the radial direction.

[0026] The valve 69 is a switching valve for switching whether the leakage hole 66b of the outer cylinder 66 is connected to the opening 67e of the inner cylinder 67. It is a cylindrical component having a space inside, and the lower end of the inner cylinder 67 is inserted inside in a manner that can slide up and down. The valve 69 has a protrusion 69a, a valve passage 69b, a communication hole 69c, a reduced diameter portion 69d and a space 69e. The protrusion 69a is a portion of the valve 69 that is formed to protrude radially outward, and the upper surface of the protrusion 69a abuts against the lower end of the spring 68. As a result, the spring 68 is clamped and held from the top and bottom by the protrusion 67d of the inner cylinder 67 and the protrusion 69a of the valve 69. As a result, the spring 68 applies force to the mouth 61 downward via the valve 69. More specifically, the spring 68 allows the mouth 61 to be pressed toward the nozzle holder 65 side (the upper side of Figure 4) and applies force to the mouth 61 downward.

[0027] The valve passage 69b is a hole that penetrates the valve 69 from top to bottom. The upper end of the valve passage 69b is communicated with the first gas passage 66a, and the lower end is communicated with the nozzle branch passage 61b. The valve passage 69b is formed to correspond to the nozzle branch passage 61b. Through the valve passage 69b and the nozzle branch passage 61b, the first gas passage 66a is communicated with the nozzle passage 61a, and the negative pressure or positive pressure (atmosphere) from the first gas passage 66a acts on the front end of the nozzle 61. The communication hole 69c is a through hole that penetrates the valve 69 horizontally (perpendicular to the up and down direction), and is formed to communicate the inside and the outside of the valve 69. The communication hole 69c is formed to communicate the inside and the outside of the valve 69 in the radial direction. The reduced diameter portion 69d is a portion formed in a manner that reduces the diameter of a part of the valve 69, and the space on the outer peripheral surface side of the valve 69 generated by the reduced diameter of the valve 69 is communicated with the communication hole 69c. The reduced diameter portion 69d is formed to have a predetermined length in the vertical direction according to the range in which the valve 69 can move, so that even if the valve 69 moves up and down, the leakage hole 66b and the connecting hole 69c can be kept connected. In addition, the connecting hole 69c and the reduced diameter portion 69d are formed not to be connected with the valve passage 69b. More specifically, the valve passage 69b is connected up and down at a position where the connecting hole 69c and the reduced diameter portion 69d are not present and separated from them when viewed from above. In addition, the connecting hole 69c is formed corresponding to the leakage hole 66b and the opening 67e in a manner that the leakage hole 66b can be connected with the opening 67e. In FIG. 4, the leakage hole 66b, the opening 67e, and the connecting hole 69c are each illustrated in two, but as long as there are more than one, for example, there may be four, etc., respectively. The space 69e is a space that exists at the lower side of the lower end of the inner tube 67 when the valve 69 is not pressed upward. The space 69e is surrounded by the upper surface of the nozzle 61, the inner peripheral surface of the valve 69, and the lower end of the inner tube 67. The existence of the space 69e allows the valve 69 and the nozzle 61 to move vertically relative to the inner tube 67.

[0028] It should be noted that the second gas passage 67a and the opening 67e connected thereto, the connecting hole 69c, the reduced diameter portion 69d and the leakage hole 66b are not connected to the first gas passage 66a and the through hole 67c connected thereto, the valve passage 69b, the nozzle branch passage 61b and the nozzle passage 61a.

[0029] Here, the switching of the connection between the leakage hole 66b and the opening 67e by the valve 69 will be described. For example, when the component C is adsorbed or installed, if the suction nozzle holder 65 is lowered by the lifting device 50, the nozzle 61 is also lowered. In addition, when the nozzle 61 or the component C adsorbed on the front end of the nozzle 61 is not in contact with other parts, or is in contact with other parts but not pressed, the valve 69 and the nozzle 61 are pressed downward by the force of the spring 68, and become Figure 4A In addition, Figure 4AIn the figure, as an example, a state in which the component C adsorbed to the nozzle 61 is in contact with the substrate S and the substrate S is not pressed is shown. Figure 4A In the state, the communication hole 69c of the valve 69 and the opening 67e are offset in position up and down, so the valve 69 cuts off the communication between the leakage hole 66b and the opening 67e. Therefore, the positive pressure supplied from the positive pressure source 81 is supplied to the second gas passage 67a, but the gas does not flow out from the second gas passage 67a. As a result, the gas does not flow to the second gas passage 67a and each passage of the positive pressure supply device 80.

[0030] On the other hand, when Figure 4A When the nozzle holder 65 is further lowered by the lifting device 50 in the state of being ... Figure 4B ). In this state, the second gas passage 67a is connected to the outside of the outer tube 66 via the opening 67e, the communication hole 69c, the reduced diameter portion 69d, and the leak hole 66b. Therefore, the positive pressure supplied from the positive pressure source 81 causes the gas to flow from the positive pressure source 81 to the leak hole 66b and the outside. In this way, the valve 69 is closed when the amount of pressure injected into the mouth 61 does not reach the specified amount (for example, Figure 4A ) and the state of reaching a specified amount (e.g. Figure 4B ), the presence or absence of the communication between the second gas passage 67a and the outside is switched. Furthermore, whether the gas flows in the gas passage including the second gas passage 67a (the gas passage from the positive pressure source 81 to the leak hole 66b) changes depending on whether the second gas passage 67a is connected to the outside. Therefore, in the component mounting machine 10, by detecting the change in the pressure of the gas through the pressure sensor 81a, it is possible to detect whether the component C adsorbed on the suction nozzle 60 (nozzle 61) is in contact with the substrate S (whether the component C adsorbed on the suction nozzle 60 is pressed into the substrate S by an appropriate amount).

[0031] Here, in the present embodiment, the frame passage 82 , the head passage 83 , the positive pressure introduction passage 84 , and the second gas passage 67 a are collectively referred to as a fluid pressure circuit H.

[0032] like Figure 5As shown, the control device 90 is constituted as a microprocessor centered around a CPU 91, and in addition to the CPU 91, it also includes a ROM 92, a memory (such as an HDD, SSD) 93, a RAM 94, an input / output interface 95, and the like. These are connected via a bus 96. The control device 90 is inputted with an image signal from the part camera 26, an image signal from the mark camera, a detection signal from the X-axis position sensor 37 for detecting the position of the X-axis slide 32 in the X-axis direction, a detection signal from the Y-axis position sensor 39 for detecting the position of the Y-axis slide 34 in the Y-axis direction, a detection signal from the Z-axis position sensor 53 for detecting the position of the Z-axis slide 52 in the Z-axis direction, a detection signal from the pressure sensor 81a, and the like via the input / output interface 95. On the other hand, control signals to the component supply device 20, control signals to the substrate conveying device 24, drive signals to the XY robot 30 (X-axis motor 36 and Y-axis motor 38), drive signals to the mounting head 40 (R-axis motor 44, Q-axis motor 46, linear motor 51 and valve core drive mechanism 79), etc. are output from the control device 90 via the input / output interface 95.

[0033] Next, use Figure 6~Figure 10 The operation of the component mounting machine 10 configured as described above, particularly the operation when the component C is picked up by the mounting head 40 and mounted on the substrate S, will be described. Figure 6 This is a flowchart showing an example of a component mounting processing routine. Figure 6 The program of the routine is stored in, for example, the memory 93. The CPU 91 starts this routine when, for example, a mounting instruction including component data on components C to be mounted and target mounting positions of the components C is issued from a management device (not shown).

[0034] When the component mounting processing routine is started, the CPU 91 moves the mounting head 40 to the upper side of the component supply device 20, and makes the multiple nozzles 61 pick up the components C one by one (S100). Specifically, the CPU 91 lowers the nozzle holder 65 located at the lifting position through the lifting device 50, switches the valve core 78 corresponding to the nozzle holder 65 through the valve core driving mechanism 79, and makes negative pressure act on the nozzle 61, so that the front end of the nozzle 61 adsorbs the component C, and then the nozzle 61 is raised. The CPU 91 performs this processing on the nozzles 61 of all the nozzle holders 65.

[0035] Next, the CPU 91 moves each nozzle 61 holding the component C onto the part camera 26 , captures an image with the part camera 26 , recognizes the position of the held component C based on the captured image, and corrects the target mounting position based on the recognized position ( S105 ).

[0036] Next, the CPU 91 sets a target nozzle among the plurality of nozzles 60 to be the target for mounting the component C on the substrate S next (S110). Furthermore, the CPU 91 controls the XY robot 30 to move the target nozzle to the target mounting position on the substrate S (S115). Furthermore, the CPU 91 controls the lifting device 50 to start lowering the target nozzle (S120).

[0037] Next, the CPU 91 obtains the pressure P of the fluid pressure circuit H from the pressure sensor 81a, and sets the obtained pressure P as the first pressure P1 (S125). Next, the CPU 91 waits for the prescribed time ΔT1 to pass (S130). Here, the prescribed time ΔT1 is the interval at which the CPU 91 obtains the pressure of the fluid pressure circuit H from the pressure sensor 81a, and is set to a number [ms] (for example, about 1 [ms]). Next, the CPU 91 obtains the pressure P of the fluid pressure circuit H from the pressure sensor 81a, and sets the obtained pressure P as the second pressure P2 (S135). Furthermore, the CPU 91 determines whether the absolute value of the second pressure P2 is smaller than the absolute value of the first pressure P1 (S140).

[0038] If the absolute value of the second pressure P2 is greater than the absolute value of the first pressure P1, the CPU 91 determines that the component C adsorbed by the object suction nozzle has not yet contacted the substrate S and makes a negative judgment. The CPU 91 makes such a judgment because, when the component C adsorbed by the object suction nozzle has not contacted the substrate S, the connecting hole 69c and the opening 67e are not connected, and the pressure in the fluid pressure circuit H does not drop. On the other hand, if the absolute value of the second pressure P2 is less than the absolute value of the first pressure P1, the CPU 91 determines that the component C adsorbed by the object suction nozzle begins to contact the substrate S, and makes a positive judgment. The CPU 91 makes such a judgment because, when the component C adsorbed by the object suction nozzle begins to contact the substrate S, the connecting hole 69c and the opening 67e begin to communicate, and the pressure in the fluid pressure circuit H begins to decrease.

[0039] If a negative determination is made in S140, the CPU 91 returns to S125 again. On the other hand, if an affirmative determination is made in S140, the CPU 91 executes Figure 7 The threshold value setting processing subroutine ( S145 ) shown sets a threshold value T for determining whether the component C is in contact with the substrate S. The threshold value setting processing subroutine will be described later.

[0040] Next, the CPU 91 obtains the pressure P in the fluid pressure circuit H from the pressure sensor 81a, and sets the obtained pressure P as the third pressure P3 (S150). Next, the CPU 91 waits for the predetermined time ΔT2 to pass (S155). Here, the predetermined time ΔT2 is a predetermined time, which is set to be longer than the predetermined time ΔT1 (for example, about 4 [ms]). Furthermore, the CPU 91 obtains the pressure P in the fluid pressure circuit H from the pressure sensor 81a, and sets the obtained pressure P as the fourth pressure P4 (S160).

[0041] Next, CPU91 calculates the pressure difference ΔP (= P4-P3) (S165). Next, CPU91 determines whether the absolute value of the pressure difference ΔP is greater than the threshold value T (S170). If the absolute value of the pressure difference ΔP is less than the threshold value T, CPU91 determines that the component C adsorbed by the object suction nozzle is not in contact with the substrate S (the component C adsorbed by the object suction nozzle is not pressed into the substrate S by an appropriate amount), and makes a negative judgment. On the other hand, if the absolute value of the pressure difference ΔP is greater than the threshold value, CPU91 determines that the component C adsorbed by the object suction nozzle is in contact with the substrate S (the component C adsorbed by the object suction nozzle is pressed into the substrate S by an appropriate amount), and makes a positive judgment.

[0042] If a negative determination is made in S170, the CPU 91 returns to S150 again. On the other hand, if a positive determination is made in S170, the CPU 91 controls the lifting device 50 to stop the descent of the object suction nozzle (S175). Next, the CPU 91 switches the valve core 78 corresponding to the object suction nozzle through the valve core drive mechanism 79, and supplies positive pressure (atmosphere) to the nozzle 61 (S180). As a result, the adsorption of the object suction nozzle on the component C is released. And, the CPU 91 controls the lifting device 50 to raise the nozzle 61 (S185). Next, the CPU 91 determines whether all components C adsorbed on the nozzle 61 in S100 are installed on the substrate S (S190). If a negative determination is made in S190, the CPU 91 returns to S110 again, and sets a suction nozzle 60 different from the suction nozzle 60 set as the object suction nozzle last time as the object suction nozzle. On the other hand, if a positive determination is made in S190, the CPU 91 ends this routine.

[0043] Here, the threshold setting processing subroutine is described. When the threshold setting processing subroutine is started, the CPU 91 sets the value 1 to the variable i (S200). Next, the CPU 91 obtains the pressure P in the fluid pressure circuit H from the pressure sensor 81a and sets it as the i-th pressure Pi for threshold setting (S205). Then, the CPU 91 waits for the predetermined time ΔT1 to pass (S210). And, the CPU 91 increases the value of the variable i by 1 (S215).

[0044] Next, the CPU 91 determines whether the value of the variable i is greater than a specified number. Here, the specified number is a predetermined value, for example, a value of about 4 to 10. If the value of the variable i is less than the specified number, the CPU 91 determines that the measured values ​​of the pressure sensor 81a of the specified number have not been obtained, and makes a negative determination. On the other hand, if the value of the variable i is greater than the specified number, the CPU 91 determines that the pressure Pi of the specified number has been obtained, and makes a positive determination.

[0045] If a negative determination is made in S220, the CPU 91 returns to S205 again. On the other hand, if a positive determination is made in S220, the CPU 91 calculates the total pressure value (=Σ|Pi|) (S225). Next, the CPU 91 substitutes the total pressure value (Σ|Pi|) into the following relational expression (1) to calculate the threshold value T (S230). Figure 8 As shown, relational expression (1) is a linear function determined such that the larger the value of Σ|Pi|(pressure), the larger the threshold value T. Threshold value T is calculated as a linear function of the total pressure value in order to mitigate the influence of noise on the i-th pressure Pi for threshold setting.

[0046] T = a + b × Σ | Pi | (1)

[0047] In addition, constant a and proportional constant b are both greater than 0 and are determined by experiments. After S230, CPU 91 returns to Figure 6 S150 of the component mounting processing routine is shown.

[0048] As described above, the component mounting machine 10 has a plurality of suction nozzles 60 in the mounting head 40, and absorbs a plurality of components C in one cycle and mounts them on the substrate S. Therefore, after the component mounting machine 10 mounts the first component C among the plurality of components C absorbed by the plurality of suction nozzles 60 on the substrate S, it is possible to mount the remaining components C on the substrate S in a short time. In the mounting operation of each component C, it is determined whether the component C is in contact with the substrate S by detecting, using the pressure sensor 81a, that the pressure in the fluid pressure circuit H is reduced due to the fluid pressure circuit H being opened to the outside. If the pressure of the fluid pressure circuit H is temporarily reduced, it takes a certain amount of time to recover, so the pressure state in the fluid pressure circuit H is greatly different, especially when the first component C among the plurality of components C is mounted on the substrate S and when the next component C is mounted on the substrate S.

[0049] In addition, in the component mounting machine 10, by determining whether the pressure difference ΔP exceeds the threshold value T, it is determined whether the component C adsorbed by the target suction nozzle is in contact with the substrate S, that is, it is determined whether the component C adsorbed by the target suction nozzle is pressed into the substrate S by an appropriate amount. Therefore, assuming that the threshold value T is set to a constant value, there is a situation where the time from when the component C adsorbed by the suction nozzle 60 comes into contact with the substrate S to when the pressure difference ΔP exceeds the threshold value T becomes longer or shorter. This is because the pressure P in the fluid pressure circuit H changes differently depending on the pressure P in the immediately preceding fluid pressure circuit H. Therefore, sometimes the amount of component C pressed into the substrate S is unstable, and the amount of component C pressed into the substrate S is less than the appropriate amount, or more than the appropriate amount.

[0050] Here, an example of a case where the amount of component C pressed into the substrate S is unstable is described. First, a case where the amount of component C pressed into the substrate S is less than the appropriate amount is described. After S100 of the component installation processing routine, when the first component C is installed on the substrate S, the measured value of the pressure sensor 81a becomes a relatively high value. This is because the time from causing each suction nozzle 60 to adsorb component C in S100 of the component installation processing routine to obtaining pressure P from the pressure sensor 81a in S125 is relatively long, during which time the pressure P in the fluid pressure circuit H rises sufficiently. In the pressure sensor 81a, when the absolute value of the pressure in the fluid pressure circuit H is high, the influence of noise is large, and the measured value is prone to deviation. In addition, when the pressure in the fluid pressure circuit H is high, the amplitude of the pressure is large, so when the connecting hole 69c is connected to the opening 67e, the pressure in the fluid pressure circuit H is prone to change. Therefore, when the threshold value T is set to a constant value, as in Fig.9A As shown in FIG. 1 , the time from when the component C sucked by the target nozzle comes into contact with the substrate S to when the pressure difference ΔP exceeds the threshold value T becomes a relatively short time. Fig.10 As shown, when the contact between the component C and the substrate S is detected using a constant threshold value T, the amount of the component C pressed into the substrate S tends to be less than the appropriate amount (see Fig.10 and the deviation from the appropriate amount corresponding to installation sequence 1).

[0051] In addition, Fig.10 In the above, a deviation from the appropriate amount of 0 indicates that the amount of component C pressed into the substrate S is the same as the appropriate amount. In addition, a negative deviation from the appropriate amount indicates that the amount of component C pressed into the substrate S is less than the appropriate amount. In addition, a positive deviation from the appropriate amount indicates that the amount of component C pressed into the substrate S is more than the appropriate amount. In addition, the amount of component C pressed into the substrate S is calculated based on the difference between the detection value of the Z-axis position sensor 53 at the moment when the absolute value of the pressure difference ΔP exceeds the threshold value T and the reference value predetermined in the Z-axis position sensor 53.

[0052] Next, the case where the amount of component C pressed into the substrate S is greater than the appropriate amount will be described. When the second and subsequent components C are installed on the substrate S, the measured value of the pressure sensor 81a becomes a relatively low value. This is because the time from when the component C adsorbed by a certain suction nozzle 60 is installed on the substrate S to when the other suction nozzle 60 is set as the target suction nozzle and the component C adsorbed by the target suction nozzle is installed on the substrate S is relatively short, and during this period, the pressure P in the fluid pressure circuit H does not rise much. In the pressure sensor 81a, when the absolute value of the pressure in the fluid pressure circuit H is low, the influence of noise is small, and the measured value is unlikely to deviate. In addition, when the pressure P in the fluid pressure circuit H is low, the amplitude of the pressure is small, so when the connecting hole 69c is connected to the opening 67e, the pressure in the fluid pressure circuit H is unlikely to change. Therefore, when the threshold value T is set to a constant value, such as Fig. 9B As shown in FIG. 1 , the time from when the component C sucked by the target nozzle comes into contact with the substrate S to when the absolute value of the pressure difference ΔP exceeds the threshold value T becomes a relatively long time. Fig.10 As shown in FIG. 1 , the amount of component C pressed into the substrate S is likely to be greater than the appropriate amount (in Fig.10 Refer to the appropriate deviation amount corresponding to installation sequence 2 to 20).

[0053] In this way, when the threshold value is set to a constant value, the amount of component C pressed into the substrate S may be unstable. In contrast, in the component mounting machine 10, the threshold value T is set using a linear function of the pressure P (measured value of the pressure sensor 81a) in the fluid pressure circuit H when the component C sucked by the suction nozzle 60 starts to contact the substrate S. Therefore, compared with the case where the threshold value T is set to a constant value, the contact between the component C sucked by the suction nozzle 60 and the substrate S can be appropriately detected. As a result, the amount of component C pressed into the substrate S can be stabilized.

[0054] Here, the correspondence between the components of the component mounting machine of this embodiment and the components of the component mounting machine of the present disclosure is clarified. The component mounting machine 10 of this embodiment is equivalent to the component mounting machine of the present disclosure, the fluid pressure circuit H is equivalent to the fluid pressure circuit, the pressure sensor 81a is equivalent to the sensor, and the CPU 91 is equivalent to the determination unit.

[0055] In the component mounting machine 10 described above, if the absolute value of the change in pressure in the fluid pressure circuit H exceeds the threshold value, it is determined that the component C is in contact with the substrate S. The threshold value T at this time is set to a value that increases as the absolute value of the pressure detected by the pressure sensor 81a at a predetermined timing increases. Thus, the contact between the component C and the substrate S can be detected more appropriately.

[0056] In addition, in the component mounting machine 10, the fluid pressure circuit H is opened to the outside by the nozzle 61 moving a predetermined amount toward the nozzle holder 65. That is, the pressure in the fluid pressure circuit H changes before and after the mounting operation, so it is significant to set the threshold value T based on the absolute value of the pressure detected by the pressure sensor 81a at a predetermined timing.

[0057] In the component mounting machine 10 , the CPU 91 sets the threshold T using the relational expression (1) representing the relationship between Σ|Pi| (pressure detected by the pressure sensor 81 a at a predetermined timing) and the threshold T. Thus, the threshold T can be set relatively easily.

[0058] In addition, in the component mounting machine 10, the mounting head 40 is a rotary head in which a plurality of nozzle holders 65 are arranged on a circle and can rotate in the circumferential direction. In the rotary head, a plurality of components C are continuously mounted on the substrate before the pressure in the fluid pressure circuit is restored. Therefore, it is of great significance to be able to set the threshold value according to the pressure in the fluid pressure circuit at a predetermined timing.

[0059] In addition, the present disclosure is not limited to the above-mentioned embodiment at all, and can be implemented in various forms as long as it belongs to the technical scope of the present disclosure.

[0060] In the above-mentioned embodiment, the component mounting machine 10 is provided with a pressure sensor 81a for detecting the pressure of the gas flowing in the fluid pressure circuit H. However, the component mounting machine 10 may also be provided with a flow sensor capable of detecting the gas flow rate in the fluid pressure circuit H. In this case, it is sufficient to determine whether the component C adsorbed by the object suction nozzle is in contact with the substrate S based on the absolute value of the change in the gas flow rate in the fluid pressure circuit H. At this time, in S125, S135, S150 and S160 of the component mounting processing routine, the flow rate of the gas flowing in the fluid pressure circuit H can be obtained from the flow sensor. In addition, the gas flow rate is obtained in S205 of the threshold setting processing subroutine, the total value of the flow rate is calculated in S225, and the total value of the flow rate is substituted into the same linear function as the relationship (1) in S230 to calculate the threshold T.

[0061] Alternatively, in this case, it is sufficient to determine whether the component C sucked by the target suction nozzle is in contact with the substrate S based on the gas flow rate in the fluid pressure circuit H. In this case, in S125 and S135 of the component mounting processing routine, the flow rate of the gas flowing in the fluid pressure circuit H can be obtained from the flow sensor. In addition, instead of the processing of S150 to S165 of the component mounting processing routine, the flow rate of the gas flowing in the fluid pressure circuit H at a certain moment can be obtained from the flow sensor. In addition, the gas flow rate is obtained in S205 of the threshold setting processing subroutine, the total value of the flow rate is calculated in S225, and the total value of the flow rate is substituted into the same linear function as the relationship (1) in S230 to calculate the threshold T.

[0062] In the above-described embodiment, the lifting and lowering position at which the lifting and lowering device 50 can lift and lower the nozzle holder 65 is one, but the lifting and lowering position may be two or more.

[0063] In the above-mentioned embodiment, positive pressure is supplied to the fluid pressure circuit H. However, it is also possible to replace Figure 3 Instead of the positive pressure source 80 shown in the figure, a negative pressure source is provided to supply negative pressure to the fluid pressure circuit H. In this case, the negative pressure may be supplied to the fluid pressure circuit H from a negative pressure source different from the negative pressure source 70, or from a common negative pressure source 70. In this case, the pressure detected by the pressure sensor 81a also changes depending on whether the component C sucked by the target suction nozzle is in contact with the substrate S, so the CPU 91 can determine whether the component C sucked by the target suction nozzle is in contact with the substrate S.

[0064] In the above-mentioned embodiment, it is determined whether the component C adsorbed by the target suction nozzle is in contact with the substrate S based on the absolute value of the pressure change in the fluid pressure circuit H. However, it is also possible to determine whether the component C adsorbed by the target suction nozzle is in contact with the substrate S based on the absolute value of the pressure in the fluid pressure circuit H. In this case, instead of the processing of S150 to S165 of the component mounting processing routine, the pressure of the gas flowing in the fluid pressure circuit H at a certain moment can be obtained from the pressure sensor 81a. In addition, in S230 of the threshold setting processing routine, the total pressure value can be substituted into the same linear function as the relationship (1) to calculate the threshold T.

[0065] In the above-described embodiment, when the process of S100 of the component mounting process routine is executed, it may be determined whether the suction nozzle 60 (the nozzle 61 ) is in contact with the component C.

[0066] In the above embodiment, the leak hole 66b is provided so that the gas flows perpendicularly to the vertical direction, but the invention is not limited thereto and may be provided so that the gas flows in the vertical direction. In addition, the leak hole 66b may not be provided and the communication hole 69c of the valve 69 may open directly to the outside.

[0067] In the above embodiment, the opening to the outside (here, the leak hole 66b) communicating with the second gas passage 67a is provided in the nozzle holder 65, but the present invention is not limited thereto. For example, the nozzle 60 may also be provided with an opening to the outside communicating with the second gas passage 67a.

[0068] In the above embodiment, the first gas passage 66a and the second gas passage 67a are both provided so that gas flows in the vertical direction, but the present invention is not limited thereto. For example, at least one of the first gas passage 66a and the second gas passage 67a may be provided so that gas flows perpendicularly to the vertical direction.

[0069] In the above-described embodiment, air flows through the first gas passage 66a and the second gas passage 67a. However, the positive pressure source 81 may supply an inert gas to the fluid pressure circuit H.

[0070] In the above-mentioned embodiment, the present disclosure has been described as the component mounting machine 10 , but may also be a contact determination method.

[0071] In the above-described embodiment, the mounting head 40 is a rotary head. However, the mounting head 40 may be a head in which a plurality of nozzle holders 65 are arranged linearly.

[0072] It should be noted that, in this specification, the technical idea of ​​changing the original claim 4 from "the component mounting machine according to claim 1 or 2" to "the component mounting machine according to any one of claims 1 to 3" is also disclosed. In addition, in this specification, the technical idea of ​​changing the original claim 5 from "the component mounting machine according to claim 1 or 2" to "the component mounting machine according to any one of claims 1 to 4" is also disclosed. Industrial Applicability

[0073] The present invention can be utilized in a component mounting machine that mounts components on a mounting target object such as a substrate. Description of Reference Numerals

[0074] 10 component mounting machine, 11 base, 12 housing, 20 component supply device, 24 substrate transport device, 26 parts camera, 30 XY robot, 31 X-axis guide, 32 X-axis slide, 33 Y-axis guide, 34 Y-axis slide, 36 X-axis motor, 37 X-axis position sensor, 38 Y-axis motor, 39 Y-axis position sensor, 40 mounting head, 41 frame, 42 head body, 42a shaft portion, 42b holder holding portion, 43 gear, 44 R-axis motor, 45 gear, 46 Q-axis motor, 47 gear, 50 lifting device, 51 linear motor, 52 Z-axis slide, 52a engaging portion, 53 Z-axis position sensor, 60 nozzle, 61 nozzle, 61a nozzle passage, 61b nozzle branch passage 62 cylindrical portion, 63 pin, 65 nozzle holder, 65a spring, 65b gear, 65c horizontal portion, 66 outer cylinder, 66a first gas passage, 66b leak hole, 66c spring, 66d pressing member, 67 inner cylinder, 67a second gas passage, 67b flange, 67c through hole, 67d protrusion, 67e opening, 68 spring, 69 Valve, 69a protrusion, 69b valve passage, 69c connecting hole, 69d reduced diameter portion, 69e space, 70 negative pressure supply device, 71 negative pressure source, 72 frame passage, 73 head passage, 74 negative pressure introduction passage, 75 atmosphere introduction passage, 77 valve core hole, 78 valve core, 79 valve core drive mechanism, 80 positive pressure supply device, 81 positive pressure source, 81a pressure sensor, 82 frame passage, 83 head passage, 84 positive pressure introduction passage, 90 control device, 91 CPU, 92 ROM, 93 memory, 94 RAM, 95 input / output interface, 96 bus, C element, H fluid pressure circuit, P pressure, P1 first pressure, P2 second pressure, P3 third pressure, P4 fourth pressure, Pi threshold value setting for i-th pressure, S substrate, a constant, b proportional constant, i variable, ΔP pressure difference.

Claims

1. A component mounting machine, comprising a head including a plurality of holders each holding a suction nozzle so as to be relatively movable, and sequentially performing a mounting operation of mounting components adsorbed by the plurality of suction nozzles on a substrate, The component mounting machine comprises: a fluid pressure circuit connected to the plurality of retainers; a sensor for detecting at least one of a pressure and a flow rate of a fluid flowing in the fluid pressure circuit; and The judging unit sets a threshold value in such a manner that the greater the absolute value of the pressure or the flow rate detected by the sensor at a specified time, the greater the value; after the specified time, when performing the installation action, if the absolute value of the pressure, the absolute value of the pressure change, the flow rate or the absolute value of the flow rate change detected by the sensor exceeds the threshold value, it is judged that the component adsorbed by the suction nozzle is in contact with the substrate.

2. The component mounting machine according to claim 1, wherein The fluid pressure circuit is opened to the outside when the suction nozzle moves toward the holder by a predetermined amount.

3. The component mounting machine according to claim 1 or 2, wherein: The determination unit sets the threshold value using a relational expression that indicates a relationship between the pressure or flow rate detected by the pressure sensor at the predetermined timing and the threshold value.

4. The component mounting machine according to claim 1 or 2, wherein: The fluid pressure circuit is supplied with negative pressure.

5. The component mounting machine according to claim 1 or 2, wherein The mounting head is a rotating head that arranges the plurality of retainers on a circumference and is rotatable in a circumferential direction.

6. A contact determination method, applied to a component mounting machine, for determining whether a component adsorbed by a suction nozzle is in contact with a substrate. The component mounting machine includes a head including a plurality of holders that respectively hold the suction nozzles so as to be relatively movable, and sequentially performs mounting operations of mounting the components adsorbed by the plurality of suction nozzles on a substrate. The component mounting machine has: a fluid pressure circuit connected to the plurality of retainers; and a sensor for detecting at least one of a pressure and a flow rate of a fluid flowing in the fluid pressure circuit; In the contact determination method, The threshold value is set so that the greater the absolute value of the pressure or the flow rate detected by the sensor at a predetermined timing, the greater the value. After the specified timing, when the installation action is performed, if the absolute value of the pressure, the absolute value of the pressure change, the flow rate or the absolute value of the flow rate change detected by the sensor exceeds the threshold, it is determined that the component adsorbed by the suction nozzle is in contact with the substrate.

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