Optoelectronic component, mold for producing molded body for optoelectronic component, and method for producing optoelectronic component

Abstract

In at least one embodiment, an optoelectronic component (100) comprises a carrier (1) having a mounting region (10), an optoelectronic semiconductor chip (2) mounted at the mounting region of the carrier, and a filling material (3) arranged on the mounting region laterally close to the semiconductor chip, a side surface (20) of the semiconductor chip being wetted by the filling material. The optoelectronic device further comprises at least one attraction member (4) laterally close to and spaced apart from the semiconductor chip at the mounting region. The suction member is at least laterally surrounded by the filler material. The suction member differs from a portion of a mounting area located laterally close to and laterally surrounding the suction member. In addition, the suction member is configured such that it sucks the liquid phase of the filling material due to the minimization of the surface energy.

Description

[0001] The present disclosure relates to an optoelectronic device, a mold for producing a molded body for an optoelectronic device, and a method for producing an optoelectronic device.

[0002] One object to be achieved is to provide an improved optoelectronic device, for example an optoelectronic device with good optical properties. Another object to be achieved is to provide a mold with which a molded body for such an optoelectronic device can be manufactured. Yet another object to be achieved is to provide a method for manufacturing such an optoelectronic device.

[0003] First, the optoelectronic device is described in detail.

[0004] According to at least one embodiment, the optoelectronic device comprises a carrier having a mounting region. The mounting region may be flat. The mounting region is formed, for example, by a top side of the carrier.

[0005] The carrier comprises, for example, a lead frame embedded in a molded body, so that the mounting area is formed partly by the lead frame and partly by the molded body. Alternatively, the carrier may be a ceramic carrier or a PCB.

[0006] In accordance with at least one embodiment, the optoelectronic component includes an optoelectronic semiconductor chip mounted at or on a mounting region of a carrier.

[0007] The optoelectronic semiconductor chip can be electrically connected to the carrier. For this purpose, the mounting area of ​​the carrier can include an electrically conductive connection area. For example, the semiconductor chip is soldered to the connection area. The optoelectronic semiconductor chip is, for example, a flip chip, in which all contact areas are on the side of the chip facing the mounting area.

[0008] The optoelectronic semiconductor chip may be an LED chip or a laser chip. In particular, the optoelectronic semiconductor chip is configured to produce and emit electromagnetic radiation, for example electromagnetic radiation in the visible spectral range or in the UV range or in the IR range. The optoelectronic semiconductor chip may be based on II-V compound semiconductor materials, such as Al n In 1-n-m Ga m N.

[0009] The optoelectronic component may include two or more optoelectronic semiconductor chips mounted on the mounting region. All components disclosed in connection with one optoelectronic semiconductor chip are also disclosed for the other optoelectronic semiconductor chips.

[0010] According to at least one embodiment, the filling material is arranged on the mounting area of ​​the carrier laterally close to the semiconductor chip. The filling material can be reflective for the radiation emitted by the semiconductor chip. For example, the filling material is based on silicone or epoxy resin. For example, the filling material covers a major part of the mounting area that is not yet covered by the optoelectronic semiconductor chip.

[0011] According to at least one embodiment, the side surfaces of the semiconductor chip are wetted by the filling material. The side surfaces of the semiconductor chip are surfaces extending obliquely or perpendicularly to the mounting area of ​​the carrier. In particular, the side surfaces delimit the semiconductor chip in a lateral direction, wherein the lateral direction is defined herein as a direction parallel to the main extension plane of the carrier and / or parallel to the mounting area.

[0012] The fact that the side surface is wetted by the filling material indicates that the filling material is applied to the mounting area in a liquid or viscous phase and that the liquid filling material has spread onto the side surface due to the minimization of the surface energy. In particular, the side surface of the semiconductor chip is wetted so that the surface of the filling material facing away from the side surface has a concave shape. That is, the thickness of the filling material on the side surface increases in the direction toward the mounting area of ​​the carrier. The side surface of the semiconductor chip may be partially or completely covered by the filling material. Several or all side surfaces of the semiconductor chip may be wetted by the filling material.

[0013] According to at least one embodiment, the optoelectronic device comprises at least one attraction component laterally adjacent to the semiconductor chip at the mounting region and laterally spaced apart from the semiconductor chip. Preferably, the attraction component is also laterally spaced apart from a lateral end or edge of the carrier. For example, at least the side surface of the semiconductor chip closest to the protrusion is wetted.

[0014] According to at least one embodiment, the attraction component is at least laterally surrounded by the filling material. For example, the attraction component is completely laterally surrounded by the filling material. In a top view on the mounting area of ​​the carrier, a continuous track of the filling material can surround the attraction component without interruption. In particular, the filling material can abut the attraction component, for example on a side of the attraction component facing the semiconductor chip and on a side of the attraction component facing away from the semiconductor chip.

[0015] According to at least one embodiment, the attraction member is different from the installation area portion that is laterally close to and surrounds the attraction member. For example, the attraction member is different from the installation area that is laterally close to and surrounds the attraction member in at least one physical property (such as shape and / or material).

[0016] According to at least one embodiment, the attraction means is configured such that it attracts the liquid phase of the filling material due to the minimization of the surface energy. As a result, the thickness of the filling material at the location of the attraction means is greater than the thickness at this location without the use of the attraction means. In particular, the attraction means is configured to improve the coverage of the filling material of the mounting area, in particular to improve the uniformity of the coverage in terms of thickness.

[0017] The attraction due to the minimization of the surface energy can be achieved in different ways, for example, by the shape of the attraction component and / or the material of the attraction component. The attraction component may include or may be a protrusion and / or may include or consist of a material that causes the contact angle of the liquid filling material to be smaller than other areas of the mounting area around the attraction component. In particular, the attraction component is configured so that due to the attraction, the attraction component pulls a portion of the filling material towards the attraction component, which would spread on the side surface of the semiconductor chip if the attraction component was not present. Therefore, with the attraction component, the coverage of the side surface of the semiconductor chip and / or the thickness on the side surface of the semiconductor chip is less than without the attraction component.

[0018] In particular, the attracting component is a dummy component or element of the optoelectronic device. For example, it has no other function than to hold or attract the filling material. In particular, the attracting component has no electrical function. For example, during operation of the device, no current flows through the attracting component.

[0019] In at least one embodiment, the optoelectronic device includes a carrier having a mounting area, an optoelectronic semiconductor chip mounted at the mounting area of ​​the carrier, and a filling material arranged laterally close to the semiconductor chip mounting area, wherein the side surface of the semiconductor chip is wetted by the filling material. The optoelectronic device also includes at least one attraction component at the mounting area, the at least one attraction component is laterally close to the semiconductor chip and spaced apart from the semiconductor chip. The attraction component is at least laterally surrounded by the filling material. The attraction component is different from a portion of the mounting area that is located laterally close to the attraction component and laterally surrounds the attraction component. In addition, the attraction component is configured so that it attracts the liquid phase of the filling material due to the minimization of surface energy.

[0020] The invention is based in particular on the recognition that when dispensing a filling material, such as a reflector silicone, around a semiconductor chip, the liquid filling material tends to spread onto the side surfaces of the semiconductor chip and, if applicable, onto the side surfaces of the housing wall of the optoelectronic component. This results in a small volume, i.e. a thin layer, of the filling material in the region of the carrier that is remote from the semiconductor chip and the housing wall. A thin layer of filling material is undesirable. For example, in the case where the filling material is a reflector material, light can penetrate the thin region and can be absorbed by the carrier. This results in a poor brightness of the optoelectronic component.

[0021] The inventors of the present invention had the idea of ​​introducing one or more attracting components in a vacant area of ​​the carrier, i.e. an area away from the semiconductor chip and, if applicable, the housing wall. With this design, in the liquid phase of the filling material, the filling material will spread and hold itself on the attracting components. Thus, the amount of filling material that spreads onto the semiconductor chip or onto the housing wall is reduced, and as a result, the thickness of the filling material on the carrier becomes more uniform.

[0022] In accordance with at least one embodiment, the filling material extends continuously (eg uninterruptedly) from the wetted side surface of the semiconductor chip to the attraction component.

[0023] According to at least one embodiment, the thickness of the filling material in the region laterally located between the side surface of the semiconductor chip and the attraction component is less than the height of the semiconductor chip. In this context, the height and thickness of the filling material on the mounting area are measured along a direction perpendicular to a main extension plane of the carrier and / or perpendicular to the mounting area.

[0024] For example, the filling material is applied to the mounting region of the carrier in such a volume that the filling material does not protrude beyond the semiconductor chip in any region. In particular, the mounting region of the semiconductor chip facing away from the mounting region of the carrier is free of filling material.

[0025] According to at least one embodiment, the thickness of the filling material in a region laterally located between the wetted side surface of the semiconductor chip and the attraction component is smaller than the height to which the side surface of the semiconductor chip is wetted by the filling material.

[0026] For example, the thickness in the region laterally between the wetted side surface and the attracting member is at most 80% or at most 60% of the height to which the side surface of the semiconductor chip is wetted. Additionally or alternatively, the thickness in the region laterally between the wetted side surface and the attracting member is at least 20% or at least 30% or at least 50% of the height to which the side surface of the semiconductor chip is wetted.

[0027] The surface of the filling material facing away from the mounting area in the area between the semiconductor chip and the attraction means may be concave in shape over a major part of its area or may be completely concave in shape. "Major part" in this context means more than 50%, for example at least 75%.

[0028] According to at least one embodiment, the attraction component is a protrusion or includes a protrusion protruding from the mounting area of ​​the carrier in the same direction as the semiconductor chip. For example, the height of the protrusion measured in a direction perpendicular to the mounting area of ​​the carrier and / or the main extension plane is at least 50μm or at least 70μm and / or at most 200μm or at most 100μm. The height of the protrusion is, for example, at most the height of the semiconductor chip, for example, at most 75% or 50% of the height of the semiconductor chip. The protrusion can be a cuboid. For example, the protrusion has an aspect ratio (height to maximum lateral extension) greater than 1, for example, at least 2. The protrusion can be columnar. Alternatively, the aspect ratio can be less than 1, for example, at most 0.5 or at most 0.33 or at most 0.2. For example, the length of the protrusion is greater than its height. Then, the protrusion can be wall-shaped.

[0029] According to at least one embodiment, the side surface of the protrusion is wetted by the filling material. Moreover, here, "wetting" particularly means that the filling material has spread onto the side surface, and the surface of the filling material facing away from the side surface of the protrusion is concave in shape. The side surface of the protrusion is the surface of the protrusion that delimits the protrusion in the lateral direction.

[0030] The wetted side surface of the protrusion may face the semiconductor chip and / or may be the side surface of the protrusion closest to the semiconductor chip.For example, several or all side surfaces of the protrusion are wetted by the filling material.

[0031] The height of the projection is, for example, greater than the thickness of the filling material in a region laterally situated between the projection and the semiconductor chip. The top side of the projection facing away from the carrier is, for example, free of filling material.

[0032] According to at least one embodiment, a thickness of the filling material in a region laterally located between the wetted side surface of the semiconductor chip and the wetted side surface of the protrusion is smaller than the height to which the side surface of the protrusion is wetted by the filling material.

[0033] According to at least one embodiment, the protrusion has a convex curved surface area. The convex curved surface area is, for example, formed at the end of the protrusion farthest from the mounting area of ​​the carrier. The convex curved surface area may be part of the side surface. For example, the convex curved surface area is an area of ​​the side surface adjacent to the top side of the protrusion. The radius of curvature of this area may be at least 1 μm or at least 10 μm and / or at most 100 μm or at most 50 μm. For example, the radius of curvature is between 10% and 1000% of the height of the protrusion, including 10% and 1000%.

[0034] According to at least one embodiment, the convexly curved area is partially or completely wetted by the filling material.When the filling material spreads onto the convexly curved surface, an even more uniform thickness of the filling material over the mounting area can be obtained.

[0035] According to at least one embodiment, the housing wall laterally surrounds the semiconductor chip. For example, the housing wall laterally completely surrounds the semiconductor chip. That is, in a top view onto the mounting region of the carrier, the housing wall forms a continuous track without interruption around the semiconductor chip. The area of ​​the carrier top side that is laterally surrounded by the housing wall is in particular the mounting region. The height of the housing wall is, for example, greater than the height of the semiconductor chip. The housing wall is, for example, laterally spaced apart from the semiconductor chip by at least 100 μm or at least 200 μm or at least 800 μm.

[0036] The housing wall may be part of a housing body of the optoelectronic device. A part of the housing body may, for example, form a carrier together with a lead frame, and another part of the housing body may form the housing wall. The housing body may be a molded body. For example, the housing body is formed in one piece.

[0037] According to at least one embodiment, the side surface of the housing wall facing the semiconductor chip and laterally spaced apart from the semiconductor chip is wetted by the filling material. In addition, here, "wetting" particularly means that the filling material has spread onto the side surface, and the surface of the filling material facing away from the side surface has a concave shape.

[0038] According to at least one embodiment, the attraction component is arranged to be laterally spaced apart from the wetted-side surface of the housing wall.For example, the attraction component is arranged laterally between the semiconductor chip and the housing wall and is laterally spaced apart from both.

[0039] According to at least one embodiment, the filling material extends continuously from the wetted side surface of the housing wall to the attraction component.The filling material may be formed continuously over the entire mounting area.

[0040] According to at least one embodiment, the protrusion is made of the material of the housing wall. In particular, the protrusion can be part of the housing body. For example, the protrusion is formed integrally with the housing wall.

[0041] According to at least one embodiment, the mounting area is at least partially formed by the material of the housing wall.This part of the mounting area can be formed by the housing body.

[0042] According to at least one embodiment, the protrusion is arranged at a portion of the mounting area formed by the material of the housing wall. In particular, the attraction component is arranged at the portion of the mounting area of ​​the carrier formed by the material of the housing wall.

[0043] In accordance with at least one embodiment, the filling material is reflective for radiation emitted by the optoelectronic semiconductor chip, for example, the filling material is silicone filled with reflective particles. The reflective particles may be TiO 2 particles.

[0044] According to at least one embodiment, the housing wall is made of epoxy resin. Thus, the housing body can be formed of epoxy resin. The epoxy resin can be an epoxy molding compound.

[0045] According to at least one embodiment, the optoelectronic device comprises a plurality of attraction components. All components disclosed in connection with one attraction component are also disclosed for all other attraction components.

[0046] According to at least one embodiment, the attraction components are arranged laterally around the semiconductor chip and are laterally spaced apart from each other in pairs. For example, each attraction component is laterally spaced apart from the semiconductor chip or from each semiconductor chip and from the housing wall. In addition, each attraction component is laterally spaced apart from each other attraction component.

[0047] Next, a mold for producing a molded body for an optoelectronic component is described in detail. The molded body is, for example, a housing wall described in detail in conjunction with the optoelectronic component described here. Therefore, all components disclosed in conjunction with the optoelectronic component are also disclosed for the mold, and vice versa.

[0048] In at least one embodiment, the mold is used to manufacture a molded body for an optoelectronic device, wherein the optoelectronic device has a carrier with a mounting area and an optoelectronic semiconductor chip mounted at the mounting area. At least a portion of the mounting area laterally adjacent to the semiconductor chip is formed by the molded body. The mold includes a cavity to be filled with a mold material for the molded body. The inner surface of the mold that defines the cavity defines the portion of the mounting area formed by the molded body. The inner surface includes a groove to be filled with the mold material so as to manufacture a protrusion made of the mold material and protruding from the portion of the mounting area. The groove is spaced apart from the lateral surface of the mold that defines the cavity in the lateral direction.

[0049] The mould may comprise a plurality of these recesses, each recess being filled with mould material in order to produce a protrusion. The produced protrusion(s) form the attraction member(s) as described above.

[0050] The lateral surface of the mold that delimits the cavity in the lateral direction is, for example, a surface that extends obliquely or perpendicularly to the inner surface of the mold.

[0051] The molded body can be manufactured as follows: a carrier part, such as a lead frame, is arranged in a mold. The optoelectronic semiconductor chip may already be arranged on the carrier part. Then, a mold material is injected into the mold, wherein the lead frame is embedded in the mold material, so that a carrier including the carrier part and the mold material is formed. At the mounting area of ​​the carrier, a protrusion made by filling the groove is formed. Then, for example, after curing the mold material, the carrier with the protrusion thereon is released from the mold. If the semiconductor chip has not yet been mounted on the carrier part, the optoelectronic semiconductor chip can now be mounted and, if applicable, the optoelectronic semiconductor chip can be electrically connected to the carrier.

[0052] The mold can be configured such that a housing wall laterally surrounding the semiconductor chip is produced from the mold material.

[0053] Next, a method for producing an optoelectronic device is described in detail. The method can be used in particular for producing an optoelectronic device as described herein. Therefore, all components disclosed in conjunction with the optoelectronic device are also disclosed for the method, and vice versa.

[0054] In at least one embodiment, a method for manufacturing an optoelectronic device includes the step of providing a carrier with components: an optoelectronic semiconductor chip mounted at a mounting area of ​​the carrier, and at least one attraction component laterally adjacent to the semiconductor chip at the mounting area and spaced apart from the semiconductor chip. The attraction component is different from the mounting area laterally surrounding the attraction component. In a further step, a liquid filling material is applied to the carrier laterally adjacent to the semiconductor chip and at least laterally surrounding the attraction component mounting area. Due to the minimization of the surface energy, the liquid filling material wets the side surface of the semiconductor chip and is also attracted by the attraction component. Then, the filling material is cured.

[0055] In the case where the attraction member is a protrusion, the liquid filling material spreads, for example, onto the side surface of the protrusion.

[0056] The attraction of the side surfaces of the semiconductor chip and the attraction of the attraction member results in a uniform thickness of the filling material over the entire mounting area, at least a more uniform thickness than would be the case without the use of the attraction member.

[0057] According to at least one embodiment, the volume of liquid filling material applied to the mounting region is selected so that the thickness of the filling material remains below the height of the semiconductor chip. In particular, the filling material is applied so that the top side of the semiconductor chip facing away from the mounting region of the carrier remains free of filling material.

[0058] According to at least one embodiment, providing the carrier comprises producing a molded body using a mold as described herein and filling the cavity with a mold material.

[0059] According to at least one embodiment, transfer molding is used to produce the molded body.

[0060] Hereinafter, optoelectronic devices, molds for manufacturing molded bodies of optoelectronic devices, and methods for manufacturing optoelectronic devices will be explained in more detail with reference to the accompanying drawings based on exemplary embodiments. The accompanying drawings are included to provide further understanding. In the accompanying drawings, elements of the same structure and / or function may be represented by the same reference numerals. It should be understood that the embodiments shown in the accompanying drawings are illustrative representations and are not necessarily drawn to scale. Insofar as elements or components correspond to each other in their functions in different drawings, their descriptions are not repeated for each of the following drawings. For clarity, elements may not appear in all drawings with corresponding reference numerals.

[0061] Figure 1 An example of an optoelectronic device is shown in cross-section.

[0062] Figure 2 A first exemplary embodiment of an optoelectronic device is shown in cross-section,

[0063] Figure 3shows the positions in an exemplary embodiment of a method for manufacturing an optoelectronic device,

[0064] Figure 4 Another exemplary embodiment of an optoelectronic device is shown,

[0065] Figure 5 and Figure 6 Shows Figure 4 A cross-sectional view of an exemplary embodiment of

[0066] Figure 7 shows a position in another exemplary embodiment of a method for producing an optoelectronic device,

[0067] Figure 8 Another exemplary embodiment of an optoelectronic device is shown,

[0068] Fig. 9 and Fig.10 shows a cross section of an exemplary embodiment of an optoelectronic device,

[0069] Fig.11 shows a first position of an exemplary embodiment of a mold for producing a molded body and an exemplary embodiment of a method for producing an optoelectronic component,

[0070] Fig.12 and Fig.13 Other locations in an exemplary embodiment of a method for manufacturing an optoelectronic device are shown.

[0071] Figure 1 An optoelectronic device 100 is shown in a cross-sectional view. The optoelectronic device 100 comprises a housing body 5 in the form of a molded body 5. The housing body 5 is formed, for example, of epoxy resin. A lead frame 6 is embedded in the housing body 5. The lead frame 6 and the housing body 5 together form a carrier 1 having a mounting area 10, at which an optoelectronic semiconductor chip 2 is mounted. A portion of the housing body 5 forms a housing wall 5a, which laterally surrounds the semiconductor chip 2 and protrudes beyond the semiconductor chip 2 in a direction perpendicular to the mounting area 10 of the carrier 1.

[0072] The optoelectronic semiconductor chip 2 is, for example, configured to emit electromagnetic radiation during operation. The semiconductor chip 2 is a flip chip. The semiconductor chip 2 is, for example, based on AlGaInN.

[0073] During operation, part of the radiation emitted by the semiconductor chip 2 is emitted towards the mounting region 10 of the carrier 1. This causes the risk that this part of the radiation is absorbed by the carrier 1. In order to prevent this, a reflective filling material 3 is applied to the mounting region 10 of the carrier 2 in a region laterally close to the semiconductor chip 2. The filling material 3 is based on silicone filled with reflective particles such as TiO2 particles, for example. The volume of the filling material 3 filled into the cavity surrounded by the housing wall 5a is selected so that the thickness of the filling material 3 remains below the height of the semiconductor chip 2 and remains below the height of the housing wall 5a, so as to avoid, for example, that the top side of the semiconductor chip 2 is covered by the filling material 3.

[0074] Since the filling material 3 has been applied in the liquid phase or the viscous phase, respectively, it has minimized its surface energy by spreading onto the side surfaces 20 of the semiconductor chip 2 and onto the side surfaces 50 of the housing wall 5a, and thus wets these surfaces 20, 50. Due to the selected filling volume of the filling material 3, the surface of the filling material 3 facing away from the wetted surfaces 20, 50 has a concave shape. In addition, the thickness of the filling material 3 in the region laterally located between the semiconductor chip 2 and the housing wall 5a becomes very small due to the spreading onto the side surfaces 20, 50. In this region of very small thickness, radiation from the semiconductor chip 2 can pass through the filling material 3 and can be absorbed by the carrier 1.

[0075] Figure 2 An exemplary embodiment of an optoelectronic device 100 is shown, which is very similar to Figure 1 The optoelectronic device 100 is an optoelectronic device 100, but wherein the problem of the filling material 3 being very thin in the area laterally located between the semiconductor chip 2 and the shell wall 5a is avoided by introducing an attraction component 4 at the mounting area 10 of the carrier 1. Here, the attraction component 4 is made of the material of the shell body 5 and is a protrusion that protrudes from the mounting area 10 in the same direction as the semiconductor chip 2. The protrusion 4 is arranged to be laterally spaced apart from the semiconductor chip 2 and the shell wall 5a. The protrusion 4 minimizes the attraction of the liquid filling material 3 during the manufacture of the optoelectronic device 100 due to the surface energy of the liquid filling material 3. Specifically, the filling material 3 spreads onto the lateral surface 40 of the protrusion 4. Thereby, a portion of the filling material 3 that has spread onto the side surfaces 20, 50 of the semiconductor chip 2 and the shell wall 5a is drawn away from the semiconductor chip 2 or the shell wall 5a, respectively. Therefore, Figure 1 In contrast, the thickness of the filling material in the region laterally between the semiconductor chip 2 and the housing wall 5 a becomes more uniform, thereby reducing the risk of part of the radiation emitted by the semiconductor chip 2 passing through the filling material 3 and increasing the overall brightness of the optoelectronic component 100 .

[0076] Figure 31 shows a position in an exemplary embodiment of a method for producing an optoelectronic component 100. In this position, a carrier 1 having a mounting region 10 and four optoelectronic semiconductor chips 2 mounted on the mounting region 10 are provided. Here, the semiconductor chips 2 are also surrounded by the housing wall 5a of the housing body 5. A plurality of attraction components 4, each in the form of a protrusion 4, are arranged on the mounting region 10. In each case, the protrusions 4 are laterally spaced apart from the semiconductor chips 2, the housing wall 5a, and also from each other.

[0077] Figure 4 An exemplary embodiment of an optoelectronic component 100 is shown in a perspective view. The optoelectronic component 100 is formed, for example, by filling a liquid filling material 3 into a cavity surrounded by a housing wall 5a and filling the cavity with a liquid filling material 3. Figure 3 It can be seen that the filling material 3 has spread onto the side surface 20 of the semiconductor chip 2 and the side surface 50 of the housing wall 5a. However, the filling material 3 has also spread onto the side surface of the protrusion 4, so that a more uniform thickness of the filling material 3 in the mounting area 10 is obtained compared to the case without the protrusion 4.

[0078] Figure 5 and Figure 6 Shown along Figure 4 2 . It can be seen here that the thickness of the filling material 3 is indeed quite uniform. In particular, there are no regions where the thickness of the filling material 3 is so low that the radiation emitted by the semiconductor chip 2 can pass through the filling material 3 towards the carrier.

[0079] Figure 7 The position in another exemplary embodiment of the method for manufacturing an optoelectronic device 100 is shown. The position is similar to Figure 3 , in which a carrier 1 having a mounting region 10 and a plurality of optoelectronic semiconductor chips 2 mounted at the mounting region 10 are arranged. The carrier 10 and the semiconductor chips 2 are laterally surrounded by a housing wall 5a of a housing body 5, which also forms part of the carrier 1. Here, a plurality of attraction components 4 in the form of protrusions 4 are also arranged at the mounting region 10. The protrusions 4 are wall-shaped in each case.

[0080] Figure 8 Another exemplary embodiment of an optoelectronic device 100 is shown, which is formed by applying a liquid filling material 3 to the Figure 7 The liquid filling material 3 has already spread onto the side surfaces 50 of the housing wall 5 a and onto the side surfaces 20 of the semiconductor chip 2. However, since the liquid filling material 3 has also spread onto the side surfaces of the protrusions 4, a fairly uniform thickness of the filling material 3 over the entire mounting area 10 of the carrier is obtained.

[0081] Fig. 9 and Fig.10 Portions of two exemplary embodiments of an optoelectronic device 100 are shown. Fig. 9 In the embodiment, the protrusion 4 has a sharp edge between its top side facing away from the carrier 1 and its side surface 40. Fig.10 In the embodiment, the area 41 of the surface of the protrusion 4 is convex in shape. Fig. 9 and Fig.10 In the example, the contact angle of the filler material is 20°. Fig. 9 and Fig.10 It can be clearly seen that due to the convex shape of the surface area 41 the thickness of the filling material 3 is even more uniform.

[0082] Fig.11 1 shows an exemplary embodiment of a mold 200 for manufacturing a molded body for an optoelectronic device. The mold 200 includes a cavity 201 to be filled with a mold material. The shape of the cavity 201 is similar to Figure 1 and Figure 2 The housing wall 5a and the carrier 1 together have substantially complementary shapes. The inner surface 202 of the mold 200 delimits the cavity and defines a portion of the mounting area 10 to be produced of the carrier 1. This inner surface 202 comprises a recess 204 which is foreseen to be filled with mold material in order to produce a protrusion made of the mold material. This protrusion will then protrude from the mounting area 10. The recess 204 is spaced apart from a lateral surface 203 of the mold 200 which delimits the cavity 201 in the lateral direction.

[0083] Fig.12 1 shows a position in an exemplary embodiment of a method for producing an optoelectronic device. In this position, a lead frame 6 is arranged in a cavity 201 of a mold 200 .

[0084] exist Fig.13 The cavity 201 is filled with a mold material 5 in the position of the lead frame 6. The mold material 5 surrounds the lead frame 6, thereby forming the carrier 1. The mold material 5 also fills the groove 204 so that a protrusion 4 is formed laterally close to the position where the semiconductor chip 2 is to be mounted. The protrusion 4 protrudes from the mounting area 10 of the carrier 1.

[0085] After this step, the mold material 5 is cured, thereby forming a molded body 5 or a housing body 5, respectively. The molded body 5 together with the lead frame 6 embedded therein can then be released from the mold 200. The optoelectronic semiconductor chip 2 can then be mounted on the mounting region 10. For example, as described above, the optoelectronic semiconductor device 100 is completed by applying the filling material 3 to the mounting region 10 of the carrier 1.

[0086] This patent application claims the priority of German patent application 10 202 2 124 236.6, the disclosure content of which is incorporated herein by reference.

[0087] The invention described herein is not limited to the description in conjunction with the exemplary embodiments. On the contrary, the invention includes any new component and any combination of components, in particular including any combination of components in the patent claims, even if the component or the combination itself is not explicitly stated in the patent claims or the exemplary embodiments.

[0088] Reference Mark List

[0089] 1 carrier

[0090] 2Optoelectronic semiconductor chips

[0091] 3 Filling materials

[0092] 4Attracting parts / protrusions

[0093] 5 Shell body / molded body / mold material

[0094] 5a Shell wall

[0095] 6 Lead Frame

[0096] 10Installation Area

[0097] 20 Side surface of the optoelectronic semiconductor chip 2

[0098] 40 side surface of the protrusion 4

[0099] 41 Convex shape area

[0100] 50 Side surface of housing wall 5a

[0101] 100 Optoelectronic Devices

[0102] 200 molds

[0103] Chamber 201

[0104] 202 inner surface

[0105] 203 lateral surface

[0106] 204 grooves

Claims

1. A photoelectric device (100), comprising: - a carrier (1) having a mounting area (10), an optoelectronic semiconductor chip (2), which is mounted on the mounting region (10) of the carrier (1), a filling material (3) which is arranged on the mounting region (10) laterally adjacent to the semiconductor chip (2), wherein a side surface (20) of the semiconductor chip (2) is wetted by the filling material (3), - at least one attraction element (4) which is laterally adjacent to the semiconductor chip (2) and spaced apart from the semiconductor chip (2) at the mounting region (10), wherein: - Attractor (4) - is at least laterally surrounded by the filling material (3), - a portion of the mounting area (10) different from that laterally adjacent to and surrounding the attraction member (4), as well as - configured so that the attraction means attracts the liquid phase of the filling material (3) due to minimization of surface energy.

2. The optoelectronic device (100) according to claim 1, wherein the filling material (3) extends continuously from the wetted side surface (20) of the semiconductor chip (2) to the attraction component (4), the thickness of the filling material (3) in a region laterally located between the wetted side surface (20) of the semiconductor chip (2) and the attraction element (4) is smaller than the height of the semiconductor chip (2), - the thickness of the filling material (3) in the region laterally located between the wetted side surface (20) of the semiconductor chip (2) and the attraction component (4) is smaller than the height to which the side surface (20) of the semiconductor chip (2) is wetted by the filling material (3).

3. The optoelectronic device (100) according to claim 1 or 2, wherein the attraction member (4) is a protrusion protruding from the mounting area of ​​the carrier (1) in the same direction as the semiconductor chip (2), - The side surfaces (40) of the protrusions (4) are wetted by the filling material (3).

4. The optoelectronic device (100) according to claim 3, wherein - the thickness of the filling material (3) in the region laterally located between the wetted side surface (20) of the semiconductor chip (2) and the wetted side surface (40) of the protrusion (4) is smaller than the height to which the side surface (40) of the protrusion (4) is wetted by the filling material (3).

5. The optoelectronic device (100) according to claim 3 or 4, wherein the protrusion (4) has a convexly curved surface area which faces away from the mounting region (10) of the carrier (1) and is at least partially wetted with the filling material (3), The radius of curvature of the convexly curved area (41) is between 10% and 1000%, inclusive, of the height of the protrusion (4).

6. The optoelectronic device (100) according to any one of the preceding claims, a housing wall (5a) laterally surrounding the semiconductor chip (1), - a side surface (50) of the housing wall (5a) which faces the semiconductor chip (2) and is laterally spaced apart from the semiconductor chip (2) is wetted by the filling material (4), the suction member (4) is arranged laterally spaced apart from the wetted side surface (50) of the housing wall (5a), The filling material (4) extends continuously from the wetted side surface (50) of the housing wall (5a) to the suction element (4).

7. An optoelectronic device (100) according to claim 6 as appended to any one of claims 3 to 5, wherein The projection (4) is made of the material of the housing wall (5a).

8. The optoelectronic device (100) according to claim 7, wherein - the mounting area (10) is at least partially formed by the material of the housing wall (5a), The projection (4) is arranged at a portion of the mounting area (10) formed by the material of the housing wall (5a).

9. The optoelectronic device (100) according to any one of claims 6 to 8, wherein - the filling material (4) is silicone filled with reflective particles, - The housing wall (5a) is made of epoxy resin.

10. The optoelectronic device (100) according to any one of the preceding claims, comprising - a plurality of attraction members (4), wherein The attraction components (4) are arranged laterally around the semiconductor chip (1) and are laterally spaced apart from each other in pairs.

11. A mold (200) for producing a molded body (5) for an optoelectronic device (100), wherein: The optoelectronic component (100) comprises a carrier (1) with a mounting region (10) and an optoelectronic semiconductor chip (2) mounted on the mounting region (10), wherein at least a portion of the mounting region (10) laterally adjacent to the semiconductor chip (1) is formed by the molded body (5), wherein - the mould (200) comprises a cavity (201) to be filled with mould material for the moulded body (5), - an inner surface (202) of the mould (200) delimiting the cavity (201), wherein the inner surface (202) defines the portion of the mounting area (10), the inner surface (202) comprising a recess (204) to be filled with the mould material in order to produce a protrusion (4) made of the mould material and protruding from the portion of the mounting area (10), - wherein the groove (204) is spaced apart in lateral direction from a lateral surface (203) of the mold (200) delimiting the cavity (201).

12. A method for manufacturing an optoelectronic device (100), comprising: - providing a carrier (1) and an optoelectronic semiconductor chip (2) mounted at a mounting region (10) of the carrier (1), and at least one attraction element (4) laterally adjacent to the semiconductor chip (2) at the mounting region (10) and spaced apart from the semiconductor chip (2), wherein: The suction member (4) is different from the mounting area (10) which laterally surrounds the suction member (4), - applying a liquid filling material (3) to the mounting region (10) of the carrier (1) laterally adjacent to the semiconductor chip (2) and at least laterally surrounding the attraction element (4), wherein, due to minimization of the surface energy, - the liquid filling material (3) spreads onto the side surface (20) of the semiconductor chip (2), and - being attracted by the attraction member (4), - Curing of the filling material (3).

13. The method according to claim 12, wherein The volume of the liquid filling material (3) applied to the mounting area (10) is selected such that the thickness of the filling material (3) remains below the height of the semiconductor chip (2).

14. The method according to claim 12 or 13, wherein - Providing the carrier (1) comprises producing a molded body (5) using a mold (200) according to claim 11 and filling the cavity (201) with a mold material.

15. The method according to claim 14, wherein: The molded body (5) is produced using transfer molding.

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