Substrate cleaning device, cleaning method and gluing and developing equipment

Abstract

The invention discloses a substrate cleaning device, a cleaning method and gluing developing equipment. The substrate cleaning device comprises a chuck main body; the plurality of clamping pieces are circularly arranged on the surface of the chuck main body and are used for clamping the substrate and driving the substrate to rotate; the back surface cleaning mechanism is used for cleaning one surface, close to the chuck main body, of the substrate during rotation of the substrate; and the chuck driving mechanism is connected with the chuck main body and is used for driving the chuck main body to rotate so as to spin-dry the cleaned substrate. The technical effect of improving the cleaning effect of the back face of the substrate and the cleaning efficiency are achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and further to a substrate cleaning device, a cleaning method and a glue coating and developing device. Background Art

[0002] At present, the inline machine for implementing the photolithography process is composed of a coating and developing machine and a photolithography machine. The general process of the photolithography process is: after the substrate is coated with glue in the coating and developing machine, it is sent to the photolithography machine for exposure. After exposure, the substrate returns to the coating and developing machine to complete the development process.

[0003] After the substrate is coated with glue and before being transferred to the photolithography machine for exposure, the back of the substrate needs to be cleaned. The purpose is to prevent the contaminant particles on the back of the substrate from being transferred to the photolithography machine. As a result, during the exposure process, the contaminant particles are sandwiched between the substrate and the substrate carrier, causing the substrate surface to bend to form local protrusions, so that the focus cannot be aligned during exposure, causing defocusing, affecting the accuracy of the substrate exposure pattern, and ultimately leading to a reduction in the substrate processing yield.

[0004] The Chinese patent document with application number 200710160027.7 discloses a substrate cleaning device and a substrate cleaning method. The substrate cleaning device is provided with two substrate holding units for supporting the substrate from the back side of the substrate, and the supporting areas of the two substrate holding units on the back side of the substrate do not overlap each other, and are used to alternately support the substrate during the substrate cleaning period, so that the cleaning mechanism can successively clean different supporting areas on the back side of the substrate. Specifically, the first substrate holding unit includes an adsorption pad, and the adsorption pad is configured to support and adsorb on the peripheral part of the back side of the substrate; the second substrate holding unit includes a rotating chuck, and the rotating chuck is configured to support and adsorb on the central part of the back side of the substrate; and the cleaning mechanism includes a cleaning brush. During the substrate cleaning period, the peripheral part of the back side of the substrate is first supported by the adsorption pad, so that the cleaning mechanism can clean the central part of the back side of the substrate, and then the central part of the back side of the substrate is supported by the rotating chuck, so that the cleaning mechanism can clean the peripheral part of the back side of the substrate, thereby achieving the cleaning of the entire back side of the substrate.

[0005] However, the above scheme still has defects. After the cleaning mechanism completes cleaning the central part of the back side of the substrate, it is necessary to rotate the chuck to support the central part of the back side of the substrate to clean the peripheral part of the back side of the substrate. The cleaning efficiency is low. During this period, there is a risk of contamination particles on the rotating chuck causing secondary contamination to the back side of the substrate, thereby affecting the cleaning effect of the device on the back side of the substrate. There is still a risk of transferring contamination particles on the back side of the substrate into the lithography machine. Summary of the invention

[0006] In view of the above technical problems, the purpose of the present application is to improve the cleaning effect and cleaning efficiency of the substrate cleaning device on the back side of the substrate.

[0007] In order to achieve the above-mentioned objectives, the present application provides a substrate cleaning device, a cleaning method and a glue coating and developing equipment.

[0008] In some embodiments, the substrate cleaning device includes: a chuck body; a plurality of clamping members arranged in a circular shape on the surface of the chuck body, used to clamp the substrate and drive the substrate to rotate; a back cleaning mechanism, used to clean the side of the substrate close to the chuck body during the rotation of the substrate; and a chuck driving mechanism connected to the chuck body, used to drive the chuck body to rotate to spin dry the cleaned substrate.

[0009] In some embodiments, the substrate cleaning method is applicable to a substrate cleaning device, which includes: a chuck body; a plurality of clamping members arranged in a circular shape on the surface of the chuck body, for clamping the substrate and driving the substrate to rotate; a back cleaning mechanism for cleaning the side of the substrate close to the chuck body; a chuck driving mechanism for driving the chuck body to rotate; wherein the substrate cleaning method includes: step S10, carrying and clamping the substrate to be processed by at least some of the clamping members; step S20, driving the substrate to be processed to rotate by at least some of the clamping members, and the back cleaning mechanism cleaning the side of the substrate to be processed close to the chuck body; step S30, driving the chuck body to rotate by the chuck driving mechanism to spin dry the cleaned substrate.

[0010] In some embodiments, the coating and developing equipment includes an equipment front-end module, a process station and an interface station connected in sequence, and the process station includes: a coating unit for coating the substrate; a developing unit for developing the substrate; a heat treatment unit for heat treating the substrate; and the above-mentioned substrate cleaning device for cleaning the substrate after the coating process.

[0011] Compared with the prior art, the present application has the following beneficial effects: the present application clamps and drives the substrate to rotate through the clamping member, so that the back cleaning mechanism cleans the back side of the substrate as a whole, avoiding the prior art of successively cleaning the central part and the peripheral part of the back side of the substrate, which affects the cleaning efficiency of the substrate and increases the risk of secondary contamination of the central part of the back side of the substrate, and drives the chuck body to rotate through the chuck driving mechanism to spin dry the cleaned substrate, thereby achieving the technical effect of improving the cleaning effect and cleaning efficiency of the back side of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The preferred implementation modes will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of the present invention.

[0013] Figure 1 is a schematic diagram of a substrate cleaning device according to an embodiment of the present application;

[0014] Figure 2 yes Figure 1 Sectional view along line aa;

[0015] Figure 3 yes Figure 2 Schematic diagram during clamping of the substrate;

[0016] Figure 4 It is a schematic diagram of the three-dimensional structure of the clamping part. DETAILED DESCRIPTION

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0018] In order to simplify the drawings, only the parts related to the invention are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0019] In this document, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0021] like Figure 1 and Figure 2As shown in FIG. 1 , a substrate cleaning device 10 according to an embodiment of the present application is disclosed. The substrate cleaning device 10 includes a chuck body 200, a plurality of clamping members 300, a back cleaning mechanism 100 and a chuck driving mechanism 400. Figure 1 A plurality of clamping members 300 are arranged in a circular shape on the surface of the chuck body 200 to clamp the substrate 20 and drive the substrate 20 to rotate. Figure 3 The back cleaning mechanism 100 is used to clean the side of the substrate 20 close to the chuck body 200 (the back side 21 of the substrate 20) during the rotation of the substrate 20. The chuck driving mechanism 400 is connected to the chuck body 200 and is used to drive the chuck body 200 to rotate to spin dry the cleaned substrate 20.

[0022] In this embodiment, the clamping member 300 clamps and drives the substrate 20 to rotate, so that the back cleaning mechanism 100 can clean the back of the substrate 20 as a whole, avoiding the prior art of cleaning the central part and the peripheral part of the back of the substrate twice, affecting the cleaning efficiency of the substrate and increasing the risk of secondary contamination of the central part of the back of the substrate. After the back 21 of the substrate 20 is cleaned, the chuck driving mechanism 400 drives the chuck body 200 to rotate to spin dry the cleaned substrate 20, thereby achieving the technical effect of improving the back cleaning effect and cleaning efficiency of the substrate 20.

[0023] Specifically, Figure 4 As shown, the clamping member 300 includes a sliding portion 320 and a limiting portion 330 from bottom to top. The sliding portion 320 is a truncated cone structure with a larger bottom and a smaller top, and is configured to provide a vertical upward component force to the edge of the back surface 21 of the substrate 20 when the clamping member 300 slides inward along the radial direction r of the chuck body 200, so as to make the substrate 20 rise. The limiting portion 330 has an annular groove 331 adapted to the edge of the substrate 20, so as to provide friction force to the edge of the substrate 20 during the rotation of the clamping member 300 to drive the substrate 20 to rotate. In addition, the sliding portion 320 can support the substrate through the side of the truncated cone structure. During the loading of the substrate 20, the substrate 20 is first loaded between each clamping member 300 and supported by the side of the truncated cone structure; then, at least one clamping member 300 slides inward along the radial direction r, so that the substrate 20 rises until it is clamped in the annular groove 331.

[0024] Preferably, the clamping member 300 further includes a supporting portion, which is located at the bottom end of the sliding portion 320. Figure 4In one embodiment, the support portion 310 has an annular support surface 311 disposed around the sliding portion 310 for supporting the substrate 20. During the loading of the substrate 20, the substrate 20 is first loaded between the clamping members 300 and supported by the annular support surface 311; thereafter, at least one clamping member 300 slides inwardly along the radial direction r, and the side surface of the truncated cone structure of the sliding portion 320 provides a vertical upward component of force to the edge of the substrate 20, so that the substrate 20 rises until it is clamped in the annular clamping groove 331.

[0025] Preferably, again refer to Figure 1 and Figure 2 The clamping member 300 includes a plurality of first clamping members 340 and a plurality of second clamping members 350, and the substrate cleaning device 10 further includes: a plurality of first radial driving members 341, a plurality of second radial driving members 351, a plurality of rotating driving members 352 and a pressure supply pipeline 360. The first radial driving members 341 and the second radial driving members 351 include cylinders (for example, single-acting spring return cylinders) or hydraulic cylinders; the rotating driving member 352 includes a pneumatic motor or a hydraulic motor.

[0026] Specifically, a plurality of first radial driving members 341 are used to simultaneously drive a plurality of first clamping members 340 to slide in the radial r direction, and the plurality of first radial driving members 341 all have a first starting pressure (the minimum hydraulic pressure or air pressure used to start the first radial driving member 341. Only when the hydraulic pressure or air pressure not less than the first starting pressure is provided to the first radial driving member 341, the first radial driving member 341 can drive the first clamping member 340 to slide and make the substrate 20 rise until it is clamped in the annular clamping groove 331). A plurality of second radial driving members 351 are used to simultaneously drive a plurality of second clamping members 350 to slide in the radial r direction, and the plurality of second radial driving members 351 all have a second starting pressure (similar to the definition of the first starting pressure, which will not be repeated here), and the second starting pressure is not less than the first starting pressure. The plurality of rotary drive members 352 are used to simultaneously drive the plurality of second clamping members 350 to rotate respectively, so as to drive the substrate 20 to rotate, and the plurality of rotary drive members 352 all have a third starting pressure (a minimum hydraulic pressure or air pressure for starting the rotary drive member 352, and only when a hydraulic pressure or air pressure not less than the third starting pressure is provided to the rotary drive member 352, the rotary drive member 352 can drive the second clamping member 350 to rotate and drive the substrate 20 to rotate), and the third starting pressure is greater than the second starting pressure. The pressure supply pipeline 360 ​​is respectively connected to the first radial drive member 341, the second radial drive member 351 and the rotary drive member 352, and is used to connect an external pressure source 361 (e.g., an air pressure source or a hydraulic pressure source) to the first radial drive member 341, the second radial drive member 351 and the rotary drive member 352 to simultaneously provide pressure.

[0027] Preferably, the second starting pressure is configured to be greater than the first starting pressure, and the substrate cleaning device 10 is configured such that during the loading of the substrate 20, the substrate 20 is first loaded between each of the first clamping members 340 and the second clamping members 350, and is supported by the plurality of annular supporting surfaces 311 at the same time. Figure 3 The pressure supply line 360 ​​first provides a first pressure to the first radial drive member 341, the second radial drive member 351 and the rotary drive member 352 at the same time, the first pressure is greater than or equal to the first starting pressure and less than the second starting pressure, so that the first radial drive member 341 drives the first clamping member 340 to slide inward along the radial direction r to drive the substrate 20 to rise and clamp the substrate 20, and then the pressure supply line 360 ​​provides a second pressure, the second pressure is greater than or equal to the second starting pressure and less than the third starting pressure, so that the second clamping member 350 clamps the substrate 20 later than the first clamping member 340.

[0028] Preferably, the substrate cleaning device 10 is configured as follows: during the cleaning of the substrate 20, the pressure supply pipeline 360 ​​simultaneously provides a third pressure to the first radial driving member 341, the second radial driving member 351 and the rotary driving member 352, and the third pressure is greater than or equal to the third starting pressure, so that the rotary driving member 352 drives the second clamping member 350 to drive the substrate 20 to rotate. At this time, the back side 21 of the substrate 20 is cleaned by the back side cleaning mechanism 100.

[0029] Preferably, the substrate cleaning device 10 is configured as follows: after the substrate 20 is cleaned, the pressure provided by the pressure supply line 360 ​​to the first radial drive member 341, the second radial drive member 351 and the rotational drive member 352 simultaneously drops from the third pressure to a pressure lower than the third starting pressure and greater than or equal to the first starting pressure, so that the second clamping member 350 stops driving the substrate 20 to rotate, and then the chuck drive mechanism 400 drives the chuck body 200 to rotate to spin dry the cleaned substrate 20.

[0030] Preferably, the substrate cleaning device 10 is configured as follows: after the substrate 20 is cleaned, the pressure provided by the pressure supply line 360 ​​to the first radial drive member 341, the second radial drive member 351 and the rotary drive member 352 simultaneously drops from the third pressure to a pressure lower than the third starting pressure and greater than or equal to the second starting pressure, so that the second clamping member 350 stops driving the substrate 20 to rotate, and then the chuck driving mechanism 400 drives the chuck body 200 to rotate to spin dry the cleaned substrate 20.

[0031] In this embodiment, during the loading of the substrate 20, the first clamping member 340 is used to drive the substrate 20 to rise and clamp the substrate 20, which plays a role in pre-positioning the substrate 20, and then the second clamping member 350 is used to clamp the substrate 20, thereby increasing the clamping force on the substrate 20, so as to increase the stability of the substrate 20's rotation during the cleaning period and the stability of the revolution during the spin-drying period. A faster clamping speed will cause wear on the edge of the substrate, so the substrate 20 is first driven to rise and clamped by the first clamping member 340 under the first pressure, and then the substrate 20 is clamped by the second clamping member 350 under the second pressure, which can reduce the wear on the edge of the substrate 20 during the rising period of the substrate 20. In addition, this embodiment uses a pressure supply line 360 ​​to simultaneously control the working states of the first radial drive member 341, the second radial drive member 351 and the rotation drive member 352, thereby realizing independent control of the first clamping member 340, the second clamping member 350 and the rotation drive member 352, avoiding the use of multiple pressure supply lines 360 to separately control the first clamping member 340, the second clamping member 350 and the rotation drive member 352, thereby reducing the processing difficulty of setting the pressure supply line 360 ​​in the substrate 20 cleaning device 10.

[0032] In other embodiments of the present application, the second starting pressure is configured to be equal to the first starting pressure, and the substrate cleaning device 10 is configured as follows: during the loading of the substrate 20, the substrate 20 is first loaded between each first clamping member 340 and the second clamping member 350. Subsequently, the pressure supply pipeline 360 ​​first provides the first radial driving member 341, the second radial driving member 351 and the rotary driving member 352 with a first pressure at the same time, and the first pressure is greater than or equal to the first starting pressure and less than the third starting pressure, so that the first radial driving member 341 and the second radial driving member 351 respectively drive the first clamping member 340 and the second clamping member 350 to slide inwardly in the radial direction r at the same time, so as to drive the substrate 20 to rise and clamp the substrate 20.

[0033] In addition, during the unloading of the substrate 20, the pressure provided by the pressure supply line 360 ​​drops to below the first starting pressure, so that the second radial driving member 351 drives the second clamping member 350 to slide outward along the radial direction r, and the first radial driving member 341 drives the first clamping member 340 to slide outward along the radial direction r, so as to loosen the substrate 20 and make the substrate 20 descend until it is supported by the annular supporting surface 311, and then unloaded by the robot 30.

[0034] In other embodiments of the present application, during the unloading of the substrate 20, the robot 30 first moves to the bottom of the substrate 20 and above the annular support surface 311, and the pressure provided by the pressure supply line 360 ​​drops to below the first starting pressure, so that the second radial driving member 351 drives the second clamping member 350 to slide outward along the radial direction r, and the first radial driving member 341 drives the first clamping member 340 to slide outward along the radial direction r, so as to release the substrate 20 and support the substrate by the robot 30, and then unload it by the robot 30. Compared with the previous embodiment, in this embodiment, before the substrate 20 drops to contact the annular support surface 311, it is already supported by the robot 30, thereby avoiding the substrate 20 from contacting the annular support surface 311 again, which increases the risk of edge contamination of the substrate 20.

[0035] Specifically, the chuck driving mechanism 400 includes a rotating shaft 410 and a hollow motor 420. The rotating shaft 410 is installed at the bottom of the chuck body 200 and is coaxially arranged with the chuck body 200. The hollow motor 420 is installed on the side wall of the rotating shaft 410 and is used to drive the rotating shaft 410 to rotate. The rotating shaft 410 has a central hole channel and can be used as a pressure supply pipeline 360.

[0036] Preferably, the back cleaning mechanism 100 includes a cleaning brush 110, a cleaning brush moving assembly 120, a first nozzle 130 and a cleaning brush rotating driving assembly 140. The brush surface 111 of the cleaning brush 110 is arranged upward and is installed at the end of the cleaning brush moving assembly 120. The cleaning brush moving assembly 120 is used to move the cleaning brush 110 to the bottom of the substrate 20 during the back cleaning of the substrate 20, so that the brush surface 111 brushes the back side 21 of the substrate 20. The cleaning brush rotating driving assembly 140 is installed at the end of the cleaning brush moving assembly 120 and connected to the cleaning brush 110, and is used to drive the cleaning brush 110 to rotate during the back cleaning of the substrate 20. The first nozzle 130 is installed in the cleaning brush moving assembly 120, and is used to spray cleaning liquid (for example: DIW) toward the back side of the substrate 20 during the back cleaning of the substrate 20, so as to increase the cleaning effect of the cleaning brush 110 on the back side of the substrate 20. In addition, a second nozzle 210 is installed on the surface of the chuck body 200, which is used to spray cleaning liquid toward the back side 21 of the substrate 20 during the back side cleaning of the substrate 20, so as to keep the back side of the substrate 20 moist during the back side cleaning of the substrate 20 and prevent the back side of the substrate 20 from being locally dried to form water stains.

[0037] In this embodiment, during the back side cleaning of the substrate 20, the clamping member 300 only rotates but does not revolve, and the cleaning brush 110 can move between two adjacent clamping members 300 to the bottom of the substrate 20. While the substrate 20 rotates, the cleaning brush 110 reciprocates along the radial direction r to brush the back side 21 of the substrate 20. The rotation of the clamping member 300 does not hinder the cleaning brush 110 from moving to the bottom of the substrate 20 to clean the back side 21 of the substrate 20, so that the back side cleaning mechanism 100 can continuously and comprehensively clean the back side 21 of the substrate 20.

[0038] Preferably, the substrate cleaning device 10 further includes a substrate edge cleaning mechanism 500, which is used to rinse the liquid sputtered to the edge of the upper surface of the substrate 20 after the back side of the substrate 20 is cleaned. Specifically, the substrate edge cleaning mechanism 500 includes a third nozzle 510 and a nozzle moving mechanism 520, and the nozzle moving mechanism 520 is used to drive the third nozzle 510 to move above the edge of the substrate 20, so that the liquid on the edge of the upper surface of the substrate 20 is rinsed by the third nozzle 510 after the back side of the substrate 20 is cleaned.

[0039] The present application also discloses a substrate cleaning method, which is applicable to a substrate cleaning device, and the structure of the substrate cleaning device is the same as that of the substrate cleaning device 10 in any of the above embodiments, which will not be described in detail here.

[0040] Wherein, the substrate cleaning method comprises:

[0041] Step S10, using at least some of the clamping members 300 to carry and clamp the substrate to be processed;

[0042] Step S20, at least some of the clamping members 300 drive the substrate to be processed to rotate, and the back cleaning mechanism 100 cleans the side of the substrate to be processed close to the chuck body 200;

[0043] In step S30, the chuck driving mechanism 400 drives the chuck body 200 to rotate so as to spin dry the cleaned substrate.

[0044] Preferably, the second starting pressure is configured to be greater than the first starting pressure, and step S10 comprises:

[0045] Step S11: The substrate to be processed is loaded between the clamping members 300 and supported by the clamping members 300;

[0046] Step S12: the pressure supply pipeline 360 ​​provides a first pressure, the first pressure is greater than or equal to the first starting pressure and less than the second starting pressure, so that the first clamping member 340 drives the substrate to be processed to rise and clamp the substrate to be processed;

[0047] Step S13: the pressure supply pipeline 360 ​​provides a second pressure, the second pressure is greater than or equal to the second starting pressure and less than the third starting pressure, so that the second clamping member 350 clamps the substrate to be processed.

[0048] Preferably, step S20 includes:

[0049] Step S21: the pressure supply pipeline 360 ​​provides a third pressure, which is greater than or equal to a third starting pressure, so that the second clamping member 350 drives the substrate to be processed to rotate;

[0050] Step S22: Cleaning the substrate to be processed by the back cleaning mechanism 100 .

[0051] Preferably, step S30 includes:

[0052] Step S31: the pressure provided by the pressure supply pipeline 360 ​​drops to a value lower than the third starting pressure and greater than or equal to the second starting pressure, so that the second clamping member 350 stops driving the cleaned substrate to rotate;

[0053] Step S32: the chuck driving mechanism 400 drives the chuck body 200 to rotate to spin dry the cleaned substrate.

[0054] Preferably, the substrate cleaning method further comprises: step S40 , unloading the substrate after the spin-drying process from the substrate cleaning device 10 .

[0055] Specifically, step S40 includes:

[0056] Step S411: the pressure provided by the pressure supply pipeline 360 ​​drops to a value lower than the first starting pressure, and the clamping member 300 slides outward along the radial direction r to release the substrate after the spin-drying process and make it drop until it is supported by the annular support surface 311;

[0057] Step S412 : unloading the substrate supported by the annular supporting surface 311 through the robot arm 30 .

[0058] In another embodiment of the present application, step S40 includes:

[0059] Step S421: the robot arm 30 moves to below the substrate after the spin-drying process and is higher than the annular support surface 311;

[0060] Step S422 : the pressure provided by the pressure supply line 360 ​​drops to a value lower than the first starting pressure, and the clamping member 300 slides outward along the radial direction r to release the substrate after the spin-drying process and support it by the robot arm 30 .

[0061] The present application also discloses a coating and developing device, comprising a device front-end module, a process station and an interface station connected in sequence. The process station comprises a coating unit, a developing unit, a heat treatment unit and a substrate cleaning device 10 .

[0062] The coating unit is used to coat the substrate. The developing unit is used to develop the substrate. The heat treatment unit is used to heat treat the substrate. The substrate cleaning device 10 is used to clean the substrate after coating to prevent the contaminant particles on the back of the substrate from being transferred into the photolithography machine, causing the contaminant particles to be sandwiched between the substrate and the substrate carrier during the exposure process, causing the substrate surface to bend to form a local bulge, so that the focus cannot be aligned during exposure, causing defocusing, affecting the accuracy of the substrate exposure pattern, and resulting in a reduction in the substrate processing yield.

[0063] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of the present invention. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A substrate cleaning device, characterized in that: include: Chuck body; A plurality of clamping members are arranged in a circular shape on the surface of the chuck body, and are used to clamp the substrate and drive the substrate to rotate; A back cleaning mechanism, used for cleaning a side of the substrate close to the chuck body during the rotation of the substrate; The chuck driving mechanism is connected to the chuck main body and is used to drive the chuck main body to rotate so as to spin dry the cleaned substrate.

2. The substrate cleaning device according to claim 1, characterized in that: The clamping member includes, from bottom to top,: The sliding portion is a truncated cone structure with a larger bottom and a smaller top, and is configured to provide a vertical upward force component to the edge of the substrate when the clamp slides radially inwardly along the chuck body, so as to lift the substrate; The limiting portion has an annular groove matched with the edge of the substrate.

3. The substrate cleaning device according to claim 2, characterized in that: The clamping member also includes: The support portion is located at the bottom end of the sliding portion; wherein, The supporting portion has an annular supporting surface arranged around the sliding portion and used for supporting the substrate.

4. The substrate cleaning device according to claim 1, characterized in that: The plurality of clamping members include a plurality of first clamping members and a plurality of second clamping members, and the substrate cleaning device further includes: A plurality of first radial driving members, used for simultaneously and respectively driving the plurality of first clamping members to slide along the radial direction of the chuck body, and the plurality of first radial driving members all have a first starting pressure; A plurality of second radial driving members, used for simultaneously and respectively driving the plurality of second clamping members to slide along the radial direction, and the plurality of second radial driving members all have a second starting pressure, and the second starting pressure is not less than the first starting pressure; A plurality of rotary driving members are used to simultaneously drive the plurality of second clamping members to rotate respectively, so as to drive the substrate to rotate, and the plurality of rotary driving members all have a third starting pressure, and the third starting pressure is greater than the second starting pressure.

5. The substrate cleaning device according to claim 4, characterized in that: The substrate cleaning device further comprises: The pressure supply pipeline is connected to the first radial drive member, the second radial drive member and the rotary drive member respectively, and is used to provide pressure to the first radial drive member, the second radial drive member and the rotary drive member at the same time.

6. The substrate cleaning device according to claim 5, characterized in that: The second starting pressure is greater than the first starting pressure, and the substrate cleaning device is configured as follows: During substrate loading, the pressure supply pipeline first provides a first pressure, which is greater than or equal to the first starting pressure and less than the second starting pressure, so that the first clamping member drives the substrate to rise and clamp the substrate. Then, the pressure supply pipeline provides a second pressure, which is greater than or equal to the second starting pressure and less than the third starting pressure, so that the second clamping member clamps the substrate.

7. The substrate cleaning device according to claim 5, characterized in that: The substrate cleaning device is configured as follows: During substrate cleaning, the pressure supply pipeline provides a third pressure, and the third pressure is greater than or equal to the third starting pressure, so that the second clamping member drives the substrate to rotate.

8. The substrate cleaning device according to claim 5, characterized in that: The substrate cleaning device is configured as follows: After the substrate is cleaned, the pressure provided by the pressure supply pipeline drops to a level lower than the third starting pressure and greater than or equal to the first starting pressure, so that the second clamping member stops driving the substrate to rotate, and then the chuck driving mechanism drives the chuck body to rotate to spin dry the cleaned substrate.

9. The substrate cleaning device according to claim 5, characterized in that: The substrate cleaning device is configured as follows: After the substrate is cleaned, the pressure provided by the pressure supply pipeline drops to a level lower than the third starting pressure and greater than or equal to the second starting pressure, so that the second clamping member stops driving the substrate to rotate, and then the chuck driving mechanism drives the chuck body to rotate to spin dry the cleaned substrate.

10. The substrate cleaning device according to claim 4, characterized in that: The rotary drive member includes a pneumatic motor or a hydraulic motor; And / or, the first radial driving member and the second radial driving member include a pneumatic cylinder or a hydraulic cylinder.

11. The substrate cleaning device according to claim 1, characterized in that: The back cleaning mechanism comprises: A cleaning brush, wherein the brush surface of the cleaning brush is arranged upward; The cleaning brush moving component is used to move the cleaning brush to the bottom of the substrate during the rotation of the substrate, so that the brush faces the back of the substrate for brushing.

12. A substrate cleaning method, characterized in that: Applicable to a substrate cleaning device, the substrate cleaning device comprises: a chuck body; a plurality of clamping members arranged in a circular shape on the surface of the chuck body, used to clamp the substrate and drive the substrate to rotate; a back cleaning mechanism, used to clean the side of the substrate close to the chuck body; a chuck driving mechanism, used to drive the chuck body to rotate; wherein the substrate cleaning method comprises: Step S10, carrying and clamping the substrate to be processed by at least some of the clamping members; Step S20, driving the substrate to be processed to rotate by at least some of the plurality of clamping members, and the back cleaning mechanism cleans a side of the substrate to be processed close to the chuck body; Step S30, driving the chuck body to rotate by the chuck driving mechanism to spin dry the cleaned substrate.

13. The substrate cleaning method according to claim 12, characterized in that: The plurality of clamping members include a plurality of first clamping members and a plurality of second clamping members, and the substrate cleaning device further includes: A plurality of first radial driving members, used for simultaneously and respectively driving the plurality of first clamping members to slide along the radial direction of the chuck body, and the plurality of first radial driving members all have a first starting pressure; A plurality of second radial driving members, used for simultaneously and respectively driving the plurality of second clamping members to slide along the radial direction, and the plurality of second radial driving members all have a second starting pressure, and the second starting pressure is greater than the first starting pressure; A plurality of rotary driving members, used for simultaneously driving the plurality of second clamping members to rotate respectively, so as to drive the substrate to rotate, and the plurality of rotary driving members all have a third starting pressure, and the third starting pressure is greater than the second starting pressure; a pressure supply pipeline, connected to the first radial drive member, the second radial drive member and the rotary drive member, respectively, for simultaneously providing pressure to the first radial drive member, the second radial drive member and the rotary drive member; wherein the step S10 comprises: Step S11: the substrate to be processed is loaded between the clamping members and supported by the clamping members; Step S12: the pressure supply pipeline provides a first pressure, wherein the first pressure is greater than or equal to the first starting pressure and less than the second starting pressure, so that the first clamping member drives the substrate to be processed to rise and clamps the substrate to be processed; Step S13: the pressure supply pipeline provides a second pressure, wherein the second pressure is greater than or equal to the second starting pressure and less than the third starting pressure, so that the second clamping member clamps the substrate to be processed.

14. The substrate cleaning method according to claim 13, characterized in that: The step S20 comprises: Step S21: the pressure supply pipeline provides a third pressure, wherein the third pressure is greater than or equal to the third starting pressure, so that the second clamping member drives the substrate to be processed to rotate; Step S22: cleaning the substrate to be processed by the back side cleaning mechanism.

15. The substrate cleaning method according to claim 13, characterized in that: The step S30 comprises: Step S31: the pressure provided by the pressure supply pipeline drops to a value lower than the third starting pressure and greater than or equal to the second starting pressure, so that the second clamping member stops driving the cleaned substrate to rotate; Step S32: the chuck driving mechanism drives the chuck body to rotate to spin dry the cleaned substrate.

16. A coating and developing device, comprising a device front-end module, a process station and an interface station connected in sequence, characterized in that: The process station comprises: A coating unit, used for coating the substrate; A developing unit, used for developing the substrate; A heat treatment unit, used for heat treating the substrate; And a substrate cleaning device as described in any one of claims 1 to 11, used for cleaning the substrate after coating treatment.

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