Processing equipment with measuring system

Abstract

A machining device for a system to be measured for laser machining, grinding or electrical discharge machining of a workpiece into a tool and having a plurality of translating and / or rotating machining axes, comprising: a machining unit comprising a laser system having an optical system for generating, guiding and / or moving a laser beam along an optical axis, a grinding tool rotating about a machining axis or an electrode tool for generating an electrical discharge; a workpiece support to which a workpiece attachment is attached, arranged to move about a second rotational machining axis, the second rotational machining axis being movable relative to a first rotational machining axis perpendicular to the second rotational machining axis; a measurement system positioned at the center of the first rotational machining axis and oriented towards a machining zero point defined by an intersection of the first rotational machining axis and the second rotational machining axis, the measurement system configured to make a measurement along the first measurement axis and / or the second measurement axis to determine measurement data; and a control unit configured to control the processing unit and / or the measuring system.

Description

Technical Field

[0001] The present invention relates to a processing device with a measuring system, and in particular to a processing device with a plurality of translation and / or rotation processing axes, which is used for laser processing, grinding or electric discharge processing of a workpiece into a target tool. Background Art

[0002] Machining devices for converting a workpiece into a tool, in particular grinding machines, laser processing machines or electrical discharge machines, are well known. Known machining devices, such as grinding devices, comprise at least two, preferably three, four or even five machine tool machining axes, comprising rotary machining axes and / or translational machining axes, for moving the workpiece and the grinding tool relative to each other under the control of a programmable control unit. Typically, the grinding device comprises a first rotary machining axis and a second rotary machining axis, the second rotary machining axis being perpendicular to the first rotary machining axis and rotating about the first rotary machining axis, and in some cases also perpendicular to the additional rotary machining axis. The translational machining axes of the machining device may be referred to as the X-axis, the Y-axis and / or the Z-axis.

[0003] Known laser processing devices include: at least one optical axis to position and / or move the laser beam by a laser system (e.g. a scanner unit); and a machine tool processing axis to provide a relative movement between the scanner unit and the workpiece. The scanner unit can be configured to move the focus of the laser beam to provide a large degree of freedom in three-dimensional orientation of the impact point and / or the focus of the laser beam onto the workpiece and thus onto the processing or ablation volume.

[0004] Known electrical discharge machining (EDM) devices generate an electric current discharge between a tool electrode and a workpiece to be machined, separated by a dielectric fluid. As tool electrode, a wire or a rotating conductive wheel can usually be used.

[0005] The machining apparatus may comprise at least two, preferably three, four or even five machine tool axes, including rotary and / or translational machining axes, for moving the workpiece and the tool electrode relative to each other under the control of a programmable control unit. Typically, the EDM apparatus comprises a first rotary machining axis and a second rotary machining axis, and in some cases an additional rotary machining axis, the second rotary machining axis being perpendicular to the first rotary machining axis and rotating about the first rotary machining axis. The translational machining axes may be referred to as the X-axis, the Y-axis and / or the Z-axis.

[0006] These machining devices comprise at least one holding and / or clamping device for receiving the workpiece to be machined, and at least one tool unit acting on the workpiece to perform the desired task. In the context of the present invention, the machining unit may be a grinding unit, such as a cup grinding wheel, or alternatively a laser system used in combination with an optical system to direct a laser beam onto the workpiece surface and to move it across the workpiece surface, or an electrode unit for generating an electrical discharge.

[0007] Known processing equipment may include a measuring system that is configured to measure a workpiece in-process. Depending on the measuring method, the measuring method may be contact or non-contact. For example, a measuring system that measures by contact may include a tactile probe as a measuring device. A non-contact measuring system may include an optical sensor or an inductive sensor. The measuring device may be designed as a contact sensitive probe, a remote scanning probe, a laser scanning probe, a probe using a light beam, or a probe configured for electrostatic response.

[0008] As is well known, the tactile probe is configured as a trigger probe, which includes a protruding stylus having a distal sensing end as a measuring tip. In some known processing equipment, the trigger probe moves relative to the workpiece along at least one translation direction through the processing axis and contacts the workpiece to be measured. The sensing end deflects, which is determined by a corresponding device, and at the moment of contact, the trigger probe generates a trigger signal that is sent to the processing equipment. The transmitted trigger signal initiates the stop of the processing axis to which the probe is attached, or freezes the output of the read head of the coordinate measuring device. The instantaneous position value can be determined, and this information can be used to adapt further processing. In this case, the trigger probe only acts as a switch and cannot move independently of the processing axis. This type of trigger probe is not suitable for high-precision measurement and high-speed measurement processes because it has a time delay between the actual trigger event and the signal being emitted. The variability of the time delay is not easy to compensate. In addition, thermal effects caused by the operation of the processing equipment itself or an uncontrolled thermal environment may reduce the accuracy of the measurement. Another disadvantage of this measurement system is that these trigger probes cannot move independently of the processing axis and do not have an independent position coordinate system.

[0009] Another known measuring system uses a tactile measuring probe that can be moved independently of the processing device via a linear axis, and has an internal measuring unit for measuring position values ​​in the direction of the linear axis in a separate coordinate system. After the workpiece has been repositioned, another measuring point can be approached. Therefore, measurements can only be made in one direction, and measurements in different directions require repositioning the workpiece. Another problem with such a measuring system may be controlling the force that the probe exerts on the workpiece surface due to contact. If the force is too great, the workpiece surface or the probe may be deformed or damaged by the contact. If the force is too small, a layer of dust or contaminants on the workpiece surface may prevent the probe from fully contacting the measured workpiece surface, resulting in incorrect measurement values.

[0010] Document DE 10 2012 110 673 describes a modular measuring device that is integrated in a grinding machine, in particular mounted on a tool unit that is movable relative to a workpiece along at least one feed axis, and comprises at least one toggle measuring tip and a support that provides a plurality of defined predetermined positions for the toggle measuring tip. The measuring device comprises a linkage that allows a pivoting and translational movement of the toggle measuring tip to bring it into a measuring position and a disengaged position relative to the workpiece. Based on the actual position of the tool unit that is movable in a plurality of directions or spatial axes, the actual position of the toggle measuring tip is determined from a signal that is triggered by the toggle measuring tip when it contacts the workpiece. Positioning the measuring tip in the measuring position introduces certain inaccuracies and some delay times in the system.

[0011] It is therefore an object of the present invention to provide a machining device with a measuring system for measuring workpieces in the machining device and directly in the machining process during machining operations, wherein the measuring system is suitable for measuring with high accuracy, repeatability, high speed and in a manner that prevents damage to sensitive and / or fragile workpieces. Furthermore, the measuring system should be integrated in the machining device as a separate unit in a space-saving manner and should be robust to thermal effects and contamination.

[0012] Another objective is to arrange the measuring system in the best position relative to the processing equipment, in particular as close as possible to the point of operation without intruding into the processing or working area. In addition, the measuring system should have low inertia so as not to interfere with the rapid movement of the moving parts of the processing equipment, be light, have low vibrations, provide a large measuring range and high accuracy. Summary of the invention

[0013] According to one aspect of the present invention, there is provided a processing apparatus having a plurality of translational and / or rotational processing axes for laser processing, grinding or electrical discharge processing of a workpiece into a tool, comprising:

[0014] a machining unit comprising a laser system with an optical system for generating, directing and / or moving a laser beam along an optical axis, a grinding tool rotatable about a machining axis or an electrode tool for generating an electrical discharge,

[0015] a workpiece support to which the workpiece is attached and wherein the workpiece support is arranged to be movable about a second rotary machining axis, which second rotary machining axis is movable relative to a first rotary machining axis which is perpendicular to the second rotary machining axis,

[0016] a measuring system positioned at the center of the first rotary machining axis and oriented towards a machining zero point defined by the intersection of the first rotary machining axis and the second rotary machining axis, wherein the measuring system is configured to perform measurements along the first measuring axis and / or the second measuring axis to determine measurement data, and

[0017] - A control unit configured to control the processing device and / or the measuring system.

[0018] According to one aspect of the invention, a processing device is used to process a workpiece into a tool, preferably a cutting tool, such as a drilling or milling tool, a cutting insert, such as an indexable insert of different designs and geometries. Manufacturing the tool may include continuous processing of the workpiece in different processing steps, such as laser processing, grinding, electrical discharge machining (EDM) and / or other suitable processing in one or more processing devices.

[0019] Typically, a machining apparatus comprises a tool unit, such as a grinding tool, a scanner unit or a tool electrode, and a workpiece unit, which are movable relative to each other along or around a machining axis of the machine tool for machining.

[0020] The machining apparatus according to the invention is configured as a multi-axis machining apparatus comprising a workpiece support for positioning a workpiece relative to a tool unit, such as a grinding wheel, a laser unit and / or a tool electrode, in a precise and repeatable manner.

[0021] The workpiece is received in and positioned by the workpiece support, which will be mentioned below as well as the fixture. The workpiece can be moved at least around the second rotational machining axis and the first rotational machining axis. The fixture can be configured to clamp the tool between two anvils so that the clamping movement is colinear with the second rotational machining axis. Optionally, the fixture is configured to clamp the workpiece so that the clamping movement is perpendicular to the second rotational machining axis. In addition, the workpiece can be held in the fixture by vacuum or magnetic force. In addition, the fixture can be configured as a chuck mounted on the second rotational machining axis, in particular a collet, a hydraulic chuck or any other chuck. Optionally, the fixture includes a machining taper (such as HSK) to receive the workpiece.

[0022] According to the invention, a machining device comprises a measuring system for measuring during machining. Measuring a supported and positioned workpiece during machining may comprise determining the position, orientation and / or additional characteristic values ​​of the workpiece, such as shape, contour and / or size, before machining, during machining and / or in an intermediate state of the finished tool. Based on the measured values ​​determined with high precision by the measuring system, the performance of the machining device may be improved. Furthermore, special signal processing algorithms may be used to determine the characteristic values ​​of the workpiece.

[0023] Prior to machining, the measured values ​​can be used to adjust the machining of the workpiece, in particular to adjust the machining program relative to the measured position and orientation of the workpiece. Such adjustments can be based on measurements of the size, position and / or orientation of the supported workpiece (e.g. a cutting insert). By means of such adjustments, clamping errors can be compensated. In the case of machining cylindrical workpieces, errors can be adjusted based on the position, swing and / or run-out of the supported workpiece.

[0024] The processing device also includes a control unit for controlling the processing device and / or the measuring system. In one embodiment, the control unit controls the movement of the measuring system and can control the force applied by the probe to the workpiece surface through contact when measuring and / or scanning the workpiece.

[0025] According to the invention, the measuring system is positioned at the center of the first rotating machining axis and is oriented toward the machining zero point. The machining zero point is defined as the intersection of the first rotating machining axis and the second rotating machining axis. The machining zero point is a defining characteristic value of the machining device. The machining zero point can be regarded as a reference point of a spatial coordinate system, such as a coordinate reference point of the machining device assigned to the workpiece. Advantageously, the workpiece is machined in an area as close to the machining zero point as possible. Therefore, the arranged measuring system is oriented toward and located near the plane or surface to be measured of the workpiece, so that the measuring system is moved from the stationary position to the measuring position, preferably along the first measuring axis and / or the second measuring axis, the path is short.

[0026] According to a preferred embodiment, the measuring system comprises a probe with a measuring tip, which is movable at least in a measuring position, a rest position and / or a reference position. The measuring system comprises a first linear axis and a second linear axis perpendicular to the first linear axis. The first linear axis and the second linear axis are configured to move the probe along the first measuring axis and the second measuring axis, respectively. The measuring system further comprises a positioning system to detect the position of the measuring tip. Preferably, the positioning system comprises at least one encoder for each linear axis for detecting the position of the measuring tip in the corresponding coordinate axis.

[0027] Typically, the linear axis comprises at least one actuator with a driven member that can be moved to any determined position. According to one embodiment, the probe is a rigid contact probe and can be moved along the first linear axis and the second linear axis in a force-controlled manner. The associated probe can be moved toward the workpiece until the determined detection force value is equal to or greater than a predetermined value. Not only can the force value be determined, but other types of values ​​can also be used to control the movement of the measurement system. These values ​​can be a detectable increase in the detection force and / or the speed of the increase in the detection force. The detectable values ​​can be set relative to predeterminable thresholds. These thresholds can be set by the user and can be stored in the control unit. The measurement system comprising the first linear axis and the second linear axis allows high-precision and accurate measurements while the force can be controlled to avoid violent contact of the probe with a delicate workpiece surface or area.

[0028] Each linear axis representing a measuring axis can be powered by an electric motor. Advantageously, the control of the electric motor is relatively simple.

[0029] The first linear axis and the second linear axis for translating the probe along the first measuring axis and the second measuring axis respectively allow length measurement or detection of coordinate values, which can be processed into probe position information based on an algorithm and thus processed into feature values ​​of the workpiece. The measured size and / or surface shape of the workpiece can be used for closed-loop feedback control of at least one linear axis to coordinate the measurement system.

[0030] Optionally, the probe of the measuring system is configured as a trigger probe having a measuring tip, the sensing end is configured as a spherical head, and can be moved along the first linear axis and the second linear axis until the trigger is activated by contact with the workpiece. Therefore, its contact with the workpiece surface is converted into an electrical signal, the movement is stopped, and the actual contact point coordinate value is determined. Preferably, the trigger probe can scan across the area of ​​the workpiece or scan along a line, so that more characteristic values ​​of the workpiece can be determined.

[0031] A trigger probe has only two types of signal response, signaling the contact or non-contact state of the measuring tip, preferably designed as a ruby ​​ball and arranged at the distal end of the stylus or trigger probe structure.

[0032] The known trigger probe is a probe that contacts the workpiece through the measuring tip, and the probe structure is elastically deformed due to the action of the probing force. The elastic deformation of the structure is measured and can be used by the control unit.

[0033] Another type of trigger probe includes a measuring point that vibrates, thereby detecting changes in vibration characteristics caused by contact with the object being measured.

[0034] Every deformation of the structure or every change in the vibration characteristics is converted into an electrical signal. These signals can be transmitted to a control unit to record the instantaneous position of the first and second linear axes and thus calculate the coordinates of the contact point on the workpiece.

[0035] For measurements with trigger probes, the speed of the probe movement as well as the probing force are relevant parameters. The speed should be equal to or below a certain value to avoid differences between the coordinates determined from the contact detection signal and the actual coordinates of the measuring tip. It is known that the probing force is related to the repeatability of the measurement, the accuracy of the determined contact point coordinates and / or the accuracy of the pressure applied by the sensing end of the probe to the measured surface, which can cause deformation or damage to the workpiece surface. The probing force is usually given by the probe design and is fixed. Therefore, measurements based on controlled and predetermined probing forces increase measurement efficiency and accuracy due to controllable linear axes. Due to the high-precision linear axes, the measuring system allows backlash-free, highly dynamic, low-maintenance measurements and the force can be adjusted according to the measuring task.

[0036] In another embodiment, the measuring system comprises an additional third linear axis extending perpendicularly to the first linear axis and perpendicularly to the second linear axis to provide another adjustment direction of the measuring system. The third linear axis can be configured as a third measuring axis and is preferably configured as a force-controlled measuring axis. In the case where the first measuring axis and the second measuring axis are located in the XY plane, the third linear axis or the third measuring axis represents the Z coordinate direction.

[0037] Providing this third measurement axis allows displacing the measurement point of the probe in an additional direction, thus allowing 3D measurements. Adjusting the position of the probe in at least one additional direction allows 3D measurements of the workpiece surface, which corresponds to measurements using a 3D probe.

[0038] The arrangement of the measuring system in the machining device (the measuring system is positioned in the center of the first rotating machining axis (referred to as the penultimate machining axis of the machining device) and is oriented toward the machining zero point) minimizes thermal and / or contamination effects in the measuring area. It is known that thermal effects and contamination can have a negative impact on the accuracy and precision of the measured values. According to the invention, the measuring system is configured to minimize these effects, in particular those caused by short displacement paths.

[0039] Furthermore, depending on the arrangement and movement of the measuring system, the probe can be of short length and small diameter to reduce the overall weight of the probe and improve the movement accuracy. The measured values ​​can be determined by avoiding systematic errors (e.g. due to pre-travel variations), by reducing the travel of the linear axis, and by minimizing disturbing dynamic effects by shortening the measurement time.

[0040] In another embodiment, the measurement system includes a non-contact sensor probe arranged on a first linear axis, referred to as a first measurement axis, instead of a contact probe. Such a non-contact probe can be configured as an optical sensor and / or an inductive sensor. Depending on the arrangement of the first linear axis and the second linear axis, the non-contact sensor probe can be moved toward and along the workpiece surface without contacting it.

[0041] According to another embodiment, the machining apparatus may include a camera unit to generate an image of the workpiece. Preferably, the camera unit may be fixedly accommodated in the center of the first rotary machining axis and oriented toward the supported workpiece. The camera unit comprises a camera, a focusable optical device and / or an illumination device, whereby the illumination device may be arranged on one side of the camera or on the opposite side of the camera.

[0042] According to another embodiment, the processing device comprises an additional camera for generating an image of the workpiece. Preferably, in the case of a laser processing device, the additional camera can be part of the laser system. The image data can be used for additional information. The data from the measurement system and the data from the additional camera can be combined or complementary.

[0043] According to another aspect, the control unit can use the measurement data to control the processing equipment. Based on the measurement data, the processing program of the processing equipment can be modified by the control unit. For example, the processing position, orientation, or even the volume to be processed can be modified based on the measurement data obtained before processing. Additional measurement data obtained during the processing can be used for closed-loop control of the processing process. Additional measurement data obtained after the processing can be used for quality assessment and as input for closed-loop control of the processing equipment for processing subsequent parts. The control unit can directly use an algorithm to utilize the measurement data, or send it to a processing unit, which will then use the data further using an algorithm.

[0044] According to one embodiment, the measuring system can be designed as a separate unit, which is preferably arranged in a space-saving manner in the center of the first rotary machining axis. Another advantage of such a separate unit is that it can be easily replaced, upgraded and / or repaired. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] For a more complete understanding of the present invention and its advantages, exemplary embodiments of the present invention are explained in more detail in the following description with reference to the accompanying drawings, in which like reference numerals represent like parts, and in which:

[0046] Figure 1 is a schematic perspective view of a processing device having a processing unit, the processing unit including a processing tool;

[0047] Figure 2is a schematic perspective view of a detail of a processing device having a measuring system;

[0048] Figure 3 is a schematic perspective view of a detail of a processing device having a measuring system;

[0049] Figure 4 is a schematic cross-sectional view of a measurement system showing a first linear axis;

[0050] Figure 5 is a schematic cross-sectional view of one embodiment of a measurement system. DETAILED DESCRIPTION

[0051] The accompanying drawings are used to further understand the present invention and are incorporated into and constitute a part of the specification. The accompanying drawings illustrate specific embodiments of the present invention and are used to explain the principles of the present invention together with the specification. Other embodiments of the present invention and many of the attendant advantages of the present invention will be more readily understood with further understanding with reference to the detailed description below.

[0052] refer to Figure 1 , schematically shows an embodiment of a machining device 1, which includes a machining unit 2, which is configured to machine a workpiece 10 into a tool. The machining unit 2 may include a grinding tool, such as a cup grinding wheel. Other embodiments of the machining unit 2 may include a laser system or an electric discharge unit depending on the machining process.

[0053] The machining device 1 is configured as a multi-axis device, having at least a first rotary machining axis 3 and a second rotary machining axis 4 perpendicular to the first rotary machining axis 3. The second rotary machining axis 4 is movable relative to the first rotary machining axis 3. In addition to these rotary machining axes 3 and 4, the machining device 1 also includes translation axes (not shown) for moving the workpiece 10 supported in the workpiece support 11 and the machining unit 2 relative to each other under the control of the control unit 12. These translation axes preferably extend along the X-coordinate axis, the Y-coordinate axis and / or the Z-coordinate axis. Figure 1 As schematically shown in FIG. 1 , the machining device 1 comprises a measuring system 20 located at the center 5 of the first rotary machining axis 3. The measuring system 20 is arranged to measure the supported workpiece 10 on at least the first measuring axis 7, in this embodiment along the X-coordinate axis and a second measuring axis 8 extending perpendicularly to the first measuring axis 7. The measuring system 20 is arranged in the machining device 1 at a position close to the machining zero point 6. The machining zero point 6 is a virtual intersection of the first rotary machining axis 3 and the second rotary machining axis 4. The machining zero point 6 generates a reference point of a spatial coordinate system, in particular an origin of a coordinate system of the machining device 1 assigned to the workpiece 10.

[0054] Figure 1Schematically shown in FIG. 4 is an additional camera 40 that can be provided to generate images of the workpiece 10 before, during and / or after processing, thereby generating more data to verify the processing of the workpiece 10. The additional camera 40 can be part of the processing unit 2, in particular part of a laser system for laser processing.

[0055] Figure 2 A machining area is shown in detail, in which a machining process can be carried out on a workpiece 10. The workpiece 10 can be attached to a workpiece support 11. The movable workpiece support 11 is arranged in the second rotary machining axis 4 and is configured to position the workpiece 10 for machining. The workpiece support 11 can be described as a mobile component group of the machining device 1 to clamp and move the workpiece 10 by means of the first rotary machining axis 3 and the second rotary machining axis 4 independently of each other. The workpiece support 11 can be configured as a clamping unit consisting of a driving anvil and a clamping anvil, or can be of any other suitable type.

[0056] according to Figure 2 In the embodiment shown, the workpiece support 11 is oriented coaxially with respect to the second rotary machining axis 4 .

[0057] also, Figure 2 The measuring system 20 shown in FIG. 8 is arranged in the center 5 (not shown) of the first rotating machine axis 3 and is oriented toward the machine zero point 6 .

[0058] from Figure 2 As can be seen in the figure, in this embodiment, the measuring system 20 comprises a probe 21 having a measuring tip 22 extending coaxially with the first rotary machining axis 3 towards the machining zero point 6. According to the embodiment shown, the probe 21 is configured as a force-controlled contact probe and is movable via a first linear axis 23 and a second linear axis 24 perpendicular to the first linear axis 23. Thus, the probe 21 can be moved along the first measuring axis 7 and the second measuring axis 8 (as indicated by the arrows) from a stationary position in the measuring position to a reference position and / or any determinable position. With this arrangement of the measuring system 20, the measuring tip 22 of the probe 21 is positioned in the vicinity of the plane or surface 13 to be measured of the workpiece 10, so that in the case of the contact probe 21, only a short travel path is required to achieve contact of the measuring tip 22 with the surface 13.

[0059] The probe 21, in particular the measuring tip 22, is in contact with the workpiece surface 13 and / or can be moved along a measuring path on the surface 13 of the workpiece 10 in a plane determined by the first measuring axis 7 and the second measuring axis 8. The movement is preferably force-controlled via the first linear axis 23 and the second linear axis 24. The control of the movement can be based on a determinable force increase or a speed of the force increase, wherein the determined value is set to be related to a predeterminable threshold value. When the measuring tip 22 is in contact with the surface 13 of the workpiece 10, the actual position coordinate value can be determined by means of a positioning system 30 of the measuring system 20, which can be further processed into a characteristic value of the workpiece 10 or data for controlling the adjustment of the workpiece 10 or controlling the machining process. The positioning system 30 can be configured as an encoder arranged on the linear axis, in particular an encoder associated with the first linear axis 23 and another encoder associated with the second linear axis 24.

[0060] In another embodiment, the probe 21 can be configured as a non-contact sensor, such as an optical sensor or an inductive sensor. The measurement performed by the non-contact sensor does not provide contact with the surface 13 of the workpiece 10, but may include movement of the non-contact sensor toward the workpiece 10 to position the measuring tip 22 near the workpiece surface 13 to be measured, in particular within a predetermined distance to the workpiece surface 13.

[0061] In an alternative embodiment, the measuring system 20 comprises a camera unit 26 ( Figure 4 ). The camera unit 26 comprises a camera, focusing optics and optional lighting.

[0062] exist Figure 3 , the arrangement details of the measuring system 20 in the machining device 1 are shown. The workpiece 10 is an indexable insert attached to the workpiece support 11 and extending from the center of the second rotary machining axis 4. The probe 21 having a measuring tip 22 can be moved by a first linear axis 23 and a second linear axis 24. Specifically, the first linear axis 23 is mounted on the second linear axis 24 so that the probe 21 attached to the first linear axis 23 can be moved two-dimensionally in a controlled manner. The first measuring axis 7 extends along the movement path of the first linear axis 23, and the second measuring axis 8 extends along the movement path of the second linear axis 24. By moving the probe 21 in a plane defined by the first measuring axis 7 and the second measuring axis 8 (in particular in the XY coordinate plane), the measuring tip 22 can be moved along a defined path on the surface 13 of the workpiece 10.

[0063] Furthermore, a third measuring axis 9 may be provided, which in the illustrated embodiment extends along the Z axis, so that the measuring tip 22 of the probe 21 can be moved in three dimensions, generating 3D data of the workpiece 10 .

[0064] exist Figure 4 , a top cross-sectional view of the measurement system 20 is shown. Figure 4 The first linear axis 23 is configured to move the attached probe 21 towards the workpiece 10, in particular along the first measurement axis 7, and in this case along the Y coordinate axis. The second linear axis 24 is configured to move the probe 21 along a second measurement axis 8 perpendicular to the first measurement axis 7, and in this case along the X coordinate axis.

[0065] The first linear axis 23 and the second linear axis 24 may each comprise an electric motor to drive these linear axes 23 , 24 in a controlled manner.

[0066] Figure 4 Not shown in the drawing is a third measuring axis 9 which is perpendicular to the first measuring axis 7 and the second measuring axis 8 and which in this case extends along the Z coordinate axis.

[0067] Figure 5 1 shows another embodiment of the invention, in particular an arrangement of a measuring system 20 comprising a camera unit 26, which is arranged fixedly relative to the first rotary machining axis 3 and oriented towards the machining zero point 6. The camera unit 26 comprises a camera and an optional lighting device 27, which is arranged on the same side of the camera or on the opposite side, such as Figure 5 Furthermore, the camera unit 26 comprises a focusable lens so that an image of the surface 13 of the workpiece 10 can be captured and the image can be further processed.

[0068] While the invention has been described in detail with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications may be made without departing from the scope of the claims, and that equivalents thereof may be employed.

Claims

1. A processing device (1) having a plurality of translational and / or rotational processing axes for laser processing, grinding or electrical discharge processing of a workpiece (10) into a tool, comprising: a machining unit (2) comprising a laser system with an optical system for generating, guiding and / or moving a laser beam along an optical axis, a grinding tool rotatable about a machining axis or an electrode tool for generating an electrical discharge, a workpiece support (11) to which the workpiece (10) is attached and wherein the workpiece support (11) is arranged to be movable about a second rotary machining axis (4), the second rotary machining axis (4) being movable relative to a first rotary machining axis (3), the first rotary machining axis (3) being perpendicular to the second rotary machining axis (4), a measuring system (20) positioned in the center (5) of the first rotary machining axis (3) and oriented towards a machining zero point (6) defined by the intersection of the first rotary machining axis (3) and the second rotary machining axis (4), wherein the measuring system (20) is configured to perform measurements along the first measuring axis (7) and / or the second measuring axis (8) to determine measurement data, and - a control unit (12) configured to control the machining unit (2) and / or the measuring system (20).

2. The processing device (1) according to claim 1, wherein the measuring system (20) comprises: - a probe (21) having a measuring tip (22) movable between a measuring position, a rest position and / or a reference position, a first linear axis (23) arranged coaxially with the first rotary machining axis (3) and a second linear axis (24) perpendicular to the first linear axis (23), wherein the first linear axis (23) and the second linear axis (24) are configured to move the probe (21) along the first measurement axis (7) and the second measurement axis (8), respectively, and - A positioning system (30) detecting the position of the measuring tip (22).

3. The processing device (1) according to claim 2, wherein the movement of the probe (21) along the first linear axis (23) and / or the second linear axis (24) is force-controlled.

4. A processing device (1) according to claim 3, wherein the force control of the first linear axis (23) and / or the second linear axis (24) is based on determined data, such as the detection force, the increase in the detection force and / or the speed of the increase in the detection force, wherein the threshold value can be predetermined.

5. The processing device (1) according to claim 2, wherein the probe (21) is configured as a trigger probe, which is programmed to generate a trigger signal, which signals the contact of the measuring tip (22) with the workpiece surface (13).

6. The processing equipment (1) according to claim 2, wherein the probe (21) is configured as a non-contact sensor probe, such as an optical sensor and / or an inductive sensor, and is configured to perform non-contact measurement on the workpiece (10).

7. A processing device (1) according to one or more of the preceding claims, wherein the measuring system (20) comprises a third linear axis (25) extending perpendicularly to the first linear axis (23) and perpendicularly to the second linear axis (24).

8. Processing device (1) according to claim 7, wherein the third linear axis (25) is a third measuring axis (9).

9. The processing device (1) according to claim 1, wherein the measuring system (20) comprises a camera unit (26), which is fixedly arranged in the center (5) of the first rotating processing axis (3) and comprises a camera, a focusable optical device and / or a lighting device.

10. The machining device (1) according to one or more of the preceding claims, wherein an additional camera (40) is provided in the machining device (1) in order to generate an image of the workpiece (10).

11. Processing device (1) according to claim 10, wherein the measurement data from the measuring system (20) are combined with the measurement data from the additional camera (40).

12. Processing plant (1) according to one or more of the preceding claims, wherein the control unit (12) uses the measurement data for controlling the processing plant (1).

13. The machining apparatus (1) according to any one of the preceding claims, wherein the measuring system (1) is configured as a separate unit which can be arranged in the centre (5) of the first rotary machining axis (23).

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