Trigger alarm device for breakage in silicon wafer processing and control method thereof

Abstract

The application relates to a crack triggering alarm device and a control method thereof in silicon wafer processing, belonging to the technical field of silicon wafer processing equipment, which comprises a grinding frame, a grinding turntable arranged in the grinding frame, a plurality of annularly-distributed wafer supporting grooves arranged on the grinding turntable, a grinding wheel for lifting-type rotary wafer grinding arranged above the grinding turntable, and a crack triggering alarm assembly arranged on the side of the grinding wheel. The crack triggering alarm assembly comprises a fixing support, and a plurality of laser sensors extending to the grinding turntable are arranged on the fixing support. The device effectively solves the problem that the LAP wafer grinding equipment does not alarm and cannot stop in time when cracks or fragments occur during the start of processing and the processing process, and the device is always in a normal processing state, effectively solving the problem of equipment foolproofness. Through the detection of cracks or fragments, the device realizes effective reduction of batch fragments and reduction of unnecessary cost loss.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing equipment technology, specifically to a triggering alarm device and its control method for silicon wafer breakage during processing. Background Technology

[0002] Silicon single crystal grinding is an important process in the single crystal silicon wafer manufacturing line. Its main purposes are: to remove visually visible defects such as residual traces from the slicing process; to eliminate residual processing stress from the slicing process; to improve the surface uniformity, surface flatness, and local flatness of the edges of the ground product, thereby improving the surface accuracy of the silicon wafer; and to reduce the surface roughness of the silicon wafer, laying the foundation for the final product to meet various testing indicators, so as to ensure the overall quality and yield of the finished product.

[0003] Therefore, this places stringent requirements on the grinding of 12-inch silicon wafers. The LAP grinding process presents the following two problems:

[0004] (1) The fragment LAP device does not trigger an alarm when processing begins.

[0005] (2) The LAP equipment for chipping does not trigger an alarm during the processing. Summary of the Invention

[0006] This invention primarily addresses the shortcomings of existing technologies by providing a triggering alarm device and control method for silicon wafer breakage during processing. It effectively solves the problem of current LAP (Laser Apron Polishing) equipment failing to alarm or stop in time when wafer breakage or fragmentation occurs at the start or during processing, thus continuing normal processing and effectively addressing the equipment's mistaken-proofing issues. By detecting breakage or fragmentation and triggering an alarm, it effectively reduces batch breakage and minimizes unnecessary cost losses.

[0007] The above-mentioned technical problems of the present invention are mainly solved by the following technical solutions:

[0008] A silicon wafer breakage trigger alarm device includes a grinding mill frame, a grinding turntable inside the grinding mill frame, a plurality of circularly distributed wafer support grooves on the grinding turntable, a grinding wheel for lifting and rotating grinding the wafer above the grinding turntable, and a breakage trigger alarm component on the side of the grinding wheel. The breakage trigger alarm component includes a fixed bracket, and a plurality of laser sensors extending to the grinding turntable are mounted on the fixed bracket.

[0009] As preferred, the side of the frame of the grinding machine is provided with an operation control cabinet in circuit communication with the laser sensor, the broken piece triggering alarm assembly further comprises a buzzer and an intermediate relay installed on the operation control cabinet, and cables are arranged between the buzzer and the intermediate relay and between the intermediate relay and the laser sensor.

[0010] As preferred, the upper end of the grinding wheel is provided with a wheel seat between the grinding wheel and the frame of the grinding machine, and the upper end of the wheel seat is provided with a motor for driving the rotation of the grinding wheel.

[0011] As preferred, a telescopic air cylinder is arranged between the wheel seat and the grinding wheel.

[0012] As preferred, the side of the wheel seat is provided with a polishing liquid pipe, and a pipe clamp seat is fixedly screwed to the wheel seat on the polishing liquid pipe.

[0013] As preferred, a liquid return groove is arranged at the center of the polishing turntable.

[0014] As preferred, a carrier disc is arranged in the piece holding groove, and a plurality of silicon wafer grooves are arranged in a ring shape on the carrier disc.

[0015] As preferred, a carrier self-rotation outer tooth disc is arranged at the outer periphery of the carrier disc, the frame of the grinding machine is provided with a driving motor, a driving gear is fixedly inserted into the driving motor at the upper end of the driving motor, and a transition gear is arranged between the driving gear and the carrier self-rotation outer tooth disc.

[0016] A control method of a broken piece triggering alarm device in a silicon wafer processing process, comprising the following operation steps:

[0017] Step 1: Place the silicon wafer into the piece holding groove on the polishing turntable.

[0018] Step 2: Rotate the polishing turntable, and at the same time, rotate and lower the grinding wheel to contact and polish the silicon wafer.

[0019] Step 3: The laser sensor monitors the silicon wafer polishing process in real time.

[0020] Step 4: When the silicon wafer polishing process appears to be broken or fragmented, the laser sensor will immediately trigger the buzzer alarm, disconnect the connected power supply through the intermediate relay, and thus trigger the grinding wheel to lift and stop the silicon wafer processing.

[0021] As preferred, the laser sensors are connected in series, the positive pole of each laser sensor is connected with the positive pole of the power supply, the negative pole of the first laser sensor is connected with the negative pole of the power supply; the negative pole of the middle laser sensor is connected with the switch output end of the last laser sensor, the switch of the last laser sensor is connected with the stop input end of the operation control cabinet; the buzzer is connected between the negative pole of the power supply and one end of the middle relay, one end of the middle relay is connected with the buzzer and the positive pole of the power supply, the other end of the middle relay is connected with the stop input end of the operation control cabinet.

[0022] The present application can achieve the following effects:

[0023] The present application provides a kind of trigger alarm device and control method of fragmentation in silicon wafer processing, compared with prior art, effectively solve the current LAP grinding piece equipment in the process of starting processing and processing occurs and LAP grinding piece equipment does not alarm, not timely stop, always in normal processing state, effectively solve the foolproof problem of equipment.By detecting the crack or fragment to alarm, effectively reduce the batch fragmentation, while reducing unnecessary cost loss. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is the front view structural schematic diagram of the present application.

[0025] Figure 2 It is the top view structural schematic diagram of the present application.

[0026] Figure 3 It is the structural schematic diagram of the fragmentation trigger alarm assembly of the present application.

[0027] Figure 4 It is the transmission structure schematic diagram of the carrier disc of the present application.

[0028] In the drawing: grinding piece rack 1, motor 2, grinding wheel seat 3, grinding piece grinding wheel 4, operation control cabinet 5, fragmentation trigger alarm assembly 6, telescopic air cylinder 7, polishing liquid pipe 8, pipe clamp seat 9, polishing turntable 10, back liquid tank 11, piece holding groove 12, buzzer 13, cable 14, middle relay 15, fixed support 16, laser sensor 17, carrier disc 18, carrier self-rotation outer gear disc 19, silicon wafer groove 20, transition gear 21, driving gear 22, driving motor 23. DETAILED DESCRIPTION

[0029] The technical solutions of the present application will be further specifically described below by examples, and combined with the drawings.

[0030] Example: as Figures 1-4As shown, a trigger alarm device for silicon wafer processing fracture, including the grinding frame 1, the grinding frame 1 is provided with a grinding turntable 10, the grinding turntable 10 is provided with five annular distribution of the wafer slot 12, the wafer slot 12 is provided with a carrier disc 18, the carrier disc 18 is provided with four annular distribution of the silicon wafer groove 20. The outer circle of the carrier disc 18 is provided with the carrier self-rotation outer gear disc 19 which is integrated with the carrier disc 18, the grinding frame 1 is provided with a drive motor 23, the upper end of the drive motor 23 is provided with a driving gear 22 which is inserted into the drive motor 23 by clamping spring type, and the driving gear 22 and the carrier self-rotation outer gear disc 19 are provided with a transition gear 21. The center of the grinding turntable 10 is provided with a return liquid groove 11. The upper end of the grinding turntable 10 is provided with a grinding wheel 4 which rotates and lifts to grind the wafer, and the upper end of the grinding wheel 4 and the grinding frame 1 are provided with a grinding wheel seat 3, the side of the grinding wheel seat 3 is provided with a grinding liquid pipe 8, and the upper end of the grinding wheel seat 3 is provided with a pipe clamp seat 9 which is fixedly connected with the grinding wheel seat 3 by screws. The upper end of the grinding wheel seat 3 is provided with a motor 2 which drives the grinding wheel 4 to rotate. The grinding wheel seat 3 and the grinding wheel 4 are provided with an extension cylinder 7. The side of the grinding wheel 4 is provided with a fracture trigger alarm assembly 6, and the fracture trigger alarm assembly 6 includes a fixed support 16, and the fixed support 16 is provided with a plurality of laser sensors 17 which extend to the grinding turntable 10. The side of the grinding frame 1 is provided with an operation control cabinet 5 which is in electrical communication with the laser sensor 17, and the fracture trigger alarm assembly 6 further includes a buzzer 13 and an intermediate relay 15 which are installed on the operation control cabinet 5, and the buzzer 13 and the intermediate relay 15 are provided with a cable 14.

[0031] A control method of a trigger alarm device for silicon wafer processing fracture, including the following operation steps:

[0032] First step: the silicon wafer is placed into the wafer slot 12 on the grinding turntable 10.

[0033] Second step: the grinding turntable 10 rotates, and the grinding wheel 4 rotates and descends to contact and grind the silicon wafer.

[0034] Third step: the laser sensor 17 monitors the silicon wafer grinding process in real time.

[0035] The laser sensors 17 are connected in series, the positive electrode of each laser sensor 17 is connected with the positive electrode of the power supply, the negative electrode of the first laser sensor 17 is connected with the negative electrode of the power supply, the negative electrode of the intermediate laser sensor 17 is connected with the switch output end of the previous laser sensor 17, the switch of the last laser sensor 17 is connected with the stop input end of the operation control cabinet 5, the buzzer 13 is connected with the negative electrode of the power supply and one end of the intermediate relay 15, one end of the intermediate relay 15 is connected with the buzzer 13 and the positive electrode of the power supply, and the other end of the intermediate relay 15 is connected with the stop input end of the operation control cabinet 5.

[0036] Fourth step: when the silicon wafer grinding process occurs crack or fragments, the laser sensor 17 will trigger the buzzer 13 alarm, through the intermediate relay 15 disconnect the power connected, so that the grinding wheel 4 lifting stop silicon wafer processing.

[0037] In summary, the silicon wafer processing occurs crack trigger alarm device and its control method, effectively solve the current LAP grinding device in the process of starting processing and processing occurs crack or fragments and LAP grinding device is not alarm, not timely stop, always in normal processing state, effectively solve the problem of equipment foolproof. Through the detection of crack or fragments alarm, effectively reduce the batch of fragments, while reducing unnecessary cost loss.

[0038] The above only for the specific embodiments of the present application, but the structural features of the present application is not limited to this, any person skilled in the art in the field of the present application, the change or modification are covered in the patent scope of the present application.

Claims

1. A triggering alarm device for silicon wafer breakage during processing, characterized in that: The device includes a grinding mill frame (1), a grinding turntable (10) is provided inside the grinding mill frame (1), a plurality of annularly distributed grinding slots (12) are provided on the grinding turntable (10), a grinding wheel (4) for lifting and rotating grinding is provided above the grinding turntable (10), and a breakage trigger alarm component (6) is provided on the side of the grinding wheel (4); the breakage trigger alarm component (6) includes a fixed bracket (16), and a plurality of laser sensors (17) extending to the grinding turntable (10) are provided on the fixed bracket (16). The grinding machine frame (1) is provided with an operation control cabinet (5) connected to the laser sensor (17) on the side. The breakage trigger alarm component (6) also includes a buzzer (13) and an intermediate relay (15) installed on the operation control cabinet (5). Cables (14) are provided between the buzzer (13) and the intermediate relay (15) and between the intermediate relay (15) and the laser sensor (17). The wafer tray (12) is provided with a carrier disk (18), and the carrier disk (18) is provided with a number of silicon wafer slots (20) arranged in a ring. The outer ring of the carrier disk (18) is provided with a carrier rotating external gear disk (19) integrated with the carrier disk (18). The grinding frame (1) is provided with a drive motor (23). The upper end of the drive motor (23) is provided with a drive gear (22) that is snapped into the drive motor (23). A transition gear (21) is provided between the drive gear (22) and the carrier rotating external gear disk (19).

2. The triggering alarm device for silicon wafer breakage during processing according to claim 1, characterized in that: A grinding wheel seat (3) is provided between the upper end of the grinding wheel (4) and the grinding machine frame (1), and a motor (2) for driving the grinding wheel (4) to rotate is provided on the upper end of the grinding wheel seat (3).

3. The triggering alarm device for silicon wafer breakage during processing according to claim 2, characterized in that: A telescopic cylinder (7) is provided between the grinding wheel holder (3) and the grinding wheel (4).

4. The triggering alarm device for silicon wafer breakage during processing according to claim 2, characterized in that: The grinding wheel holder (3) is provided with a grinding fluid pipe (8) on its side, and the grinding fluid pipe (8) is provided with a pipe clamp seat (9) that is screwed and fixed to the grinding wheel holder (3).

5. The triggering alarm device for silicon wafer breakage during processing according to claim 4, characterized in that: The grinding disc (10) is provided with a return tank (11) at its center.

6. A control method for a trigger alarm device for silicon wafer breakage during processing according to claim 5, characterized in that... The following steps are included: Step 1: Place the silicon wafer into the wafer tray (12) on the grinding turntable (10); Step 2: The grinding turntable (10) rotates, and at the same time the grinding wheel (4) rotates and descends to contact the silicon wafer surface for grinding; Step 3: The laser sensor (17) monitors the silicon wafer grinding process in real time; Step 4: When a crack or fragment occurs during the silicon wafer grinding process, the laser sensor (17) will immediately trigger the buzzer (13) to sound an alarm, and disconnect the connected power supply through the intermediate relay (15), thereby triggering the grinding wheel (4) to lift and stop the silicon wafer processing.

7. The control method for the trigger alarm device for silicon wafer breakage during processing according to claim 6, characterized in that: The laser sensors (17) are connected in series. The positive terminal of each laser sensor (17) is connected to the positive terminal of the power supply, and the negative terminal of the first laser sensor (17) is connected to the negative terminal of the power supply. The negative terminal of the middle laser sensor (17) is connected to the switch output terminal of the previous laser sensor (17), and the switch of the last laser sensor (17) is connected to the stop input terminal of the operation control cabinet (5). The buzzer (13) is connected to the negative terminal of the power supply and one end of the intermediate relay (15). One end of the intermediate relay (15) is connected to the buzzer (13) and the positive terminal of the power supply, and the other end of the intermediate relay (15) is connected to the stop input terminal of the operation control cabinet (5).

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