High-precision cutting device and method for semiconductor packaging

Abstract

The invention discloses a high-precision cutting device and method for semiconductor packaging, and belongs to the technical field of semiconductor processing devices and methods.The high-precision cutting device comprises a conveying line which is installed on a frame, extends in the preset direction and is used for bearing and conveying a semiconductor; the cleaning treatment mechanism comprises a first motor arranged on the frame, an output shaft of the first motor is in transmission connection with a movable shaft through a first conveying belt, one end of the movable shaft penetrates through the side plate and extends to the side plate on the other side, and a cleaning roller is fixedly connected to the movable shaft; and an output shaft of the first motor is in transmission connection with the first rotating wheel through a second conveying belt parallel to the first conveying belt. The technical problems that under the condition that particulate matter is attached to the surface of a semiconductor, effective proceeding of cutting operation is not facilitated, and due to the long-time conveying effect of a transmission roller, particulate impurities are attached to a conveying belt due to the friction static effect, and then safe work of a conveying line is not facilitated are solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor processing devices and methods, and in particular relates to a high-precision cutting device and method for semiconductor packaging. Background Art

[0002] Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafers from the front-end process of the wafer are cut into small chips through the dicing process, and then the cut chips are glued to the corresponding islands of the substrate frame, and then the bonding pads of the chips are connected to the corresponding pins of the substrate using ultra-fine metal wires or conductive resins to form the required circuit; then the independent chips are packaged and protected with plastic shells, and a series of operations are required after the plastic packaging. After the packaging is completed, the finished product is tested, usually after inspection, testing and packaging, and finally shipped.

[0003] During the semiconductor packaging process, it is necessary to perform corresponding cutting processing. However, if there are particles attached to the surface of the semiconductor, on the one hand, it is not conducive to the effective implementation of the cutting operation. On the other hand, after timely cleaning, due to the long-term conveying action of the drive roller, the particle impurities adhere to the conveyor belt due to the effect of friction and static electricity, which is not conducive to the safe operation of the conveyor line. In addition, during the semiconductor packaging process, a variety of different types of tools are required for different thicknesses and process requirements, and the direction of the wafer cutting machine body is adjusted multiple times. Therefore, it is necessary to repeatedly load and unload the tools and the wafer cutting machine body, which is more troublesome and reduces the processing efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a high-precision cutting device and method for semiconductor packaging, so as to solve the technical problem that when there are particles attached to the surface of the semiconductor, on the one hand, it is not conducive to the effective implementation of the cutting operation; on the other hand, after timely cleaning, due to the long-term conveying action of the drive roller, the particle impurities adhere to the conveyor belt due to the effect of friction and static electricity, which is not conducive to the safe operation of the conveyor line.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A high-precision cutting device for semiconductor packaging, characterized by comprising:

[0007] A conveyor line, which is mounted on the frame and extends in a preset direction for carrying and conveying semiconductors, and an automatic cutting mechanism arranged on the frame is arranged above the conveyor line;

[0008] A cleaning mechanism, the cleaning mechanism comprising a first motor placed on a frame, the output shaft of the first motor being connected to a movable shaft through a first conveyor belt transmission, the movable shaft being arranged on the frame and laterally arranged above the conveyor line, and a cleaning roller being fixedly connected to the movable shaft;

[0009] An impurity collecting mechanism, the impurity collecting mechanism comprising a scraper in contact with the bottom surface of the conveyor line, the scraper being fixed on a first rotating shaft, the first rotating shaft extending into a cover body, and being connected to the first motor through a transmission module provided in the cover body, so as to drive the scraper to swing around the first rotating shaft;

[0010] Among them, a fixed rod is fixedly arranged at the bottom of the scraper, a box is arranged under the fixed rod, and a movable plate is movably arranged horizontally on the floor of the box, and the movable plate is connected to the inner wall of the box through a second spring so as to be able to move back and forth along the longitudinal direction of the box, and when the scraper swings around the first rotating shaft, the fixed rod can follow the movement of the scraper to drive the movable plate to move back and forth along the longitudinal direction of the box, so as to push the impurities dropped on the floor of the box into a preset slot, and a collecting box is also arranged at the slot, and the collecting box is a push-pull design.

[0011] Optionally, the driving module includes:

[0012] A first rotating tooth coaxially fixedly connected to the first rotating shaft, the first rotating tooth meshing with the first gear plate for transmission, the first gear plate being fixedly arranged on the pushing block, the pushing block and the inner wall of the housing body being movably connected via a first spring, so that when the pushing block reciprocates along the axial direction of the first spring, the first gear plate can be driven to reciprocate along the extension direction of the first gear plate, thereby driving the first rotating tooth to rotate back and forth;

[0013] A cam is fixedly provided with a second bevel gear, the second bevel gear is meshed and connected with the first bevel gear, the first bevel gear is fixedly connected with the first rotating wheel, and the first rotating wheel is transmission-connected with the output shaft of the first motor through the second conveyor belt, so that the cam is driven to rotate by the first motor, and then the pushing block is driven to reciprocate by the cam.

[0014] , according to claim 1 or 2, the high-precision cutting device for semiconductor packaging is characterized in that the first motor is symmetrically arranged in two groups at both ends of the cleaning roller, and the impurity collection mechanism is symmetrically arranged in two groups corresponding to the two first motors.

[0015] Optionally, both ends of the outer wall of the cover are fixed to the frame through bending rods, and a gap is provided between the bottom end of the fixing rod and the floor of the box.

[0016] Optionally,

[0017] The automatic cutting mechanism comprises electric slide rails arranged on the outer walls of both sides of the frame, the extension direction of the electric slide rails is consistent with the extension direction of the conveyor line, and the electric slide rails are movably connected with guide blocks, and the top ends of the guide blocks are fixedly connected by cross beams;

[0018] A second motor is fixedly mounted on the guide block, a screw shaft is rotatably arranged between the guide blocks, and an output shaft of the second motor is drivingly connected to the screw shaft;

[0019] The fixed slider on the cutting assembly is spirally driven on the screw shaft.

[0020] Optionally,

[0021] Vertically arranged telescopic rods are arranged on both sides of the bottom end of the sliding block of the cutting assembly, and a movable plate is installed at the bottom of the telescopic rods;

[0022] A third motor and a fourth motor are installed on the outer wall of the movable plate, and the output shaft of the third motor passes through the movable plate and extends to the movable plate on the other side through the turntable. A positioning hole connected to the output shaft of the third motor is provided at the center of the turntable, and a ring-shaped knife seat is provided on the outer wall of the turntable, and a corresponding connected knife is detachably installed on the knife seat.

[0023] Optionally,

[0024] The slider is also fixedly connected to a second gear plate vertically arranged, and the second gear plate is movably connected to the movable plate;

[0025] The fourth motor is connected to the second gear plate through a transmission mechanism provided inside the movable plate to drive the movable plate to move up and down.

[0026] Optionally,

[0027] Two second gear plates are symmetrically arranged on the same side of the slider;

[0028] The output shaft of the fourth motor is in driving connection with the second rotating shaft arranged inside the movable plate, the second rotating shaft is fixedly mounted with a second rotating tooth, and the outer wall of the second rotating tooth is meshed and driven with a third rotating tooth;

[0029] The second rotating shaft is connected to the third rotating shaft through the third conveyor belt transmission, and the third rotating shaft is fixed with a fourth rotating tooth. The third rotating tooth and the fourth rotating tooth rotate in opposite directions and are respectively meshed and connected with the two second gear plates.

[0030] Optionally, columns are installed around the bottom end of the frame, and both ends of the first motor are fixedly connected to the frame through support rods.

[0031] A high-precision cutting method for semiconductor packaging, comprising the following steps:

[0032] S1.1, place the semiconductor on the conveyor line, start the driver to drive the conveyor line to rotate and convey the semiconductor, at this time, the first motor starts, and the impurities on the surface of the semiconductor are removed by the cleaning roller. The impurities are adsorbed and attached to the conveyor line due to the effect of friction static electricity;

[0033] S1.2, during step S1.1, under the action of mechanical transmission, the first gear plate drives the first rotating shaft on the first rotating tooth to rotate back and forth, and the scraper on the first rotating shaft blocks and removes the impurities on the conveyor line into the box, and pushes the moving plate through the fixed rod, so that the moving plate pushes the impurities into the collection boxes at both ends and the center of the box;

[0034] S1.3, when the semiconductor is transported to the automatic cutting mechanism, the second motor is started, and different tools are directly replaced by rotating the turntable. The electric slide rail and the screw shaft are used for the spiral transmission, and the cutting assembly realizes the horizontal X-axis movement and Y-axis movement;

[0035] S1.4, during step S1.3, the fourth motor is started, and through the gear meshing transmission, the third and fourth gears are rotated in opposite directions and meshed with the second gear plate synchronously, and the movable plate is driven to move up and down on the telescopic rod, and the cutting assembly is lifted and lowered synchronously.

[0036] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0037] (1) A cleaning mechanism is provided. Since the semiconductor is in contact with the transmission roller for a long time on the conveyor line, the particle impurities are charged with static electricity and adsorbed on the conveyor line. After the first motor is started, the particles on the surface of the semiconductor can be removed to the conveyor line. When the conveyor line is circulated to the other side, the power of the first motor drives the first bevel gear on the first rotating wheel to rotate under the action of mechanical transmission, and then drives the cam on the second rotating wheel to rotate under the action of gear meshing transmission. Since the push block is in contact with the cam and is connected to the inner wall of the cover body through the first spring, the rotation of the cam can be converted into a linear reciprocating motion of the push block. During the reciprocating motion, the scraper on the first rotating shaft can be driven to reciprocate at a certain angle, thereby effectively blocking and cleaning the impurity particles on the conveyor line and dropping them into the box.

[0038] (2) An impurity collection mechanism is provided. When the scraper is rotating, on the one hand, it can be cleaned by means of rotational friction, and on the other hand, the cleaning time can be extended, thereby effectively cleaning the impurities. At the same time, when the scraper is rotating, it can be connected to the movable plate by means of a fixed rod. Since the movable plate is movably connected to the side wall of the box body through a second spring, when the fixed rod is in contact, the movable plate can be moved back and forth horizontally. During the movement of the movable plate, the granular impurities can be pushed to the collection boxes at both ends and the center of the box body, which can achieve the effect of centralized collection without the need for manual cleaning. In addition, the collection box is a movable pull-out design, which is easy to operate and convenient for subsequent corresponding cleaning work, thereby improving work efficiency.

[0039] (3) An automatic cutting mechanism is provided, and the electric slide rail cooperates with the lead screw shaft connected to the second motor, so that the cutting assembly can realize X-axis and Y-axis movement in the horizontal plane direction. At the same time, the electric slide rail itself is convexly set, which can play a role in accurately guiding the movement of the guide block to prevent the deviation from the track during the movement process. At the same time, during the rotation of the lead screw shaft, with the help of the spiral transmission, accurate structural displacement can be achieved. After the fourth motor is started, it can drive the second rotating tooth on the second rotating shaft to rotate. Under the gear meshing transmission action and the transmission action of the conveyor belt, the third rotating tooth and the fourth rotating tooth rotate in the opposite direction and mesh with the corresponding second gear plate for transmission. In this way, the movable plate can be lifted and moved with the cooperation of the telescopic rod, and the second gear plates are distributed around the movable plate to ensure the balance of the structure, thereby effectively realizing stable lifting and moving, improving the working stability of the device, and enabling the cutting assembly to move to any position in the space.

[0040] (4) A cutting assembly is provided, and a plurality of different cutting tools are installed at one time using a plurality of tool holders. During the processing of the semiconductor cutting machine bed, different cutting tools can be switched to the operating station by starting the third motor. There is no need to repeatedly replace the cutting tools, which is more convenient and improves the efficiency of the processing of the semiconductor cutting machine bed. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 The structure of the high-precision cutting device for semiconductor packaging of the present invention is shown in FIG. Figure 1 ;

[0043] Figure 2The structure of the high-precision cutting device for semiconductor packaging of the present invention is shown in FIG. Figure 2 ;

[0044] Figure 3 is a front view of a high-precision cutting device for semiconductor packaging according to the present invention;

[0045] Figure 4 It is a structural schematic diagram of the impurity collection mechanism of the present invention;

[0046] Figure 5 Schematic diagram of meshing transmission between the first bevel gear and the second bevel gear of the present invention;

[0047] Figure 6 The present invention Figure 1 A magnified image of point A;

[0048] Figure 7 is a connection schematic diagram of the second rotating tooth of the present invention;

[0049] Figure 8 It is a structural schematic diagram of the turntable of the present invention;

[0050] Fig. 9 It is a schematic flow chart of the high-precision cutting method for semiconductor packaging of the present invention.

[0051] Figure numerals: 1, conveyor line; 2, cleaning treatment mechanism; 3, first motor; 4, first conveyor belt; 5, cleaning roller; 6, first rotating wheel; 7, second conveyor belt; 8, first bevel gear; 9, second rotating wheel; 10, second bevel gear; 11, cam; 12, push block; 13, first spring; 14, first gear plate; 15, first rotating shaft; 16, first rotating tooth; 17, scraper; 18, impurity collecting mechanism; 19, fixed rod; 20, moving plate; 21, second spring ; 22. Collection box; 23. Automatic cutting mechanism; 24. Electric slide rail; 25. Guide block; 26. Second motor; 27. Screw shaft; 28. Cutting assembly; 29. ​​Slider; 30. Telescopic rod; 31. Movable plate; 32. Third motor; 33. Fourth motor; 34. Turntable; 35. Knife holder; 36. Knife; 37. Second rotating shaft; 38. Second rotating tooth; 39. Third rotating tooth; 40. Third rotating shaft; 41. Third conveyor belt; 42. Fourth rotating tooth; 43. Second gear plate. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0053] Reference Manual Attached Figure 1 and attached Figure 2 As shown, a high-precision cutting device for semiconductor packaging, comprising:

[0054] A conveyor line 1, which is installed on a frame and extends in a preset direction to carry and convey semiconductors; a cleaning processing mechanism 2, which includes a first motor 3 placed on the frame, a first conveyor belt 4 is transmission-connected between the output shaft of the first motor 3 and a movable shaft, one end of the movable shaft passes through a side plate and extends to the other side plate, a cleaning roller 5 is fixedly connected to the movable shaft, and a second conveyor belt 7 is transmission-connected between the output shaft of the first motor 3 and a first rotating wheel 6 via a second conveyor belt 7 arranged parallel to the first conveyor belt 4.

[0055] Among them, one end of the first rotating wheel 6 is fixed on the first bevel gear 8, the outer wall of the first bevel gear 8 is meshed and transmitted with the second bevel gear 10 fixed on the second rotating wheel 9, and a cam 11 is connected at the center of the second rotating wheel 9. The outer wall of the cam 11 is in contact with the pushing block 12, and the pushing block 12 and the inner wall of the cover are connected by a first spring 13, and one end of the outer wall of the pushing block 12 is meshed and transmitted with the first rotating tooth 16 fixed on the first rotating shaft 15 through the first gear plate 14. The top end of the first rotating shaft 15 passes through the cover and extends to the scraper 17. The scraper 17 is symmetrically arranged relative to the center of the conveyor line 1 and is in contact with the bottom surface of the conveyor line 1.

[0056] A cleaning mechanism 2 is provided. Since the semiconductor is in contact with the transmission roller for a long time on the conveyor line 1, the particulate impurities are charged with static electricity and adsorbed on the conveyor line 1. After the first motor 3 is started, the particles on the surface of the semiconductor can be removed to the conveyor line 1. When the conveyor line 1 is cyclically transported to the other side, the power of the first motor 3 drives the first bevel gear 8 on the first rotating wheel 6 to rotate under the action of mechanical transmission, and then drives the cam 11 on the second rotating wheel 9 to rotate under the action of gear meshing transmission. Since the push block 12 is in contact with the cam 11 and is connected to the inner wall of the cover body through the first spring 13, the rotation of the cam 11 can be converted into a linear reciprocating motion of the push block 12. During the reciprocating motion, the scraper 17 on the first rotating shaft 15 can be driven to reciprocate at a certain angle, so that the impurity particles on the conveyor line 1 can be effectively blocked and cleaned and fall into the box.

[0057] The parallel arrangement of the first conveyor belt 4 and the second conveyor belt 7 can effectively prevent interference between the transmission parts during movement, so that power can be transmitted to the corresponding structural parts through the transmission action of the conveyor belt. At the same time, the output shaft of the first motor 3 actually passes through the frame and extends to the second conveyor belt 7 at the other end, so that the impurity collection mechanisms 18 at both ends can ensure synchronous operation.

[0058] refer to Figure 1 , Figure 3 , Figure 4 and Figure 5 , the impurity collecting mechanism 18 includes a fixed rod 19 installed at the bottom of the scraper 17, and a box with a slot opened on the ground is provided below the fixed rod 19. Both ends of the outer side of the fixed rod 19 are provided with a movable plate 20 placed on the side wall of the box. The movable plate 20 and the inner wall of the box are connected by a second spring 21, and collection boxes 22 are provided at both ends and the center of the inner wall of the box. The collection box 22 is a push-pull design.

[0059] Both ends of the outer wall of the cover are fixed to the frame by bending rods, and a gap is provided between the fixing rod 19 and the bottom end of the inner wall of the box. As the first motor 3 is started, the fixing rod 19 pushes the movable plates 20 at both ends outward during rotation. At this time, the movable plates 20 push the impurities to the collection boxes 22 at both ends and the center of the box.

[0060] An impurity collecting mechanism 18 is provided. During the rotation of the scraper 17, on the one hand, it can clean by means of rotational friction, and on the other hand, it can prolong the cleaning time, thereby effectively cleaning the impurities. At the same time, during the rotation of the scraper 17, the fixed rod 19 can realize a resistance connection with the movable plate 20. Since the movable plate 20 is movably connected to the side wall of the box body through the second spring 21, the movable plate 20 can be moved back and forth horizontally when the fixed rod 19 is in resistance. During the movement of the movable plate 20, the granular impurities can be pushed into the collection boxes 22 at the two ends and the center of the box body, which can play a role in centralized collection and does not require manual cleaning work. Moreover, the collection box 22 is a movable pull-out design, which is simple to operate and is convenient for subsequent corresponding cleaning work, thereby improving work efficiency.

[0061] The setting of the cover body can provide corresponding support points for components such as the first rotating wheel 6 and the pushing block 12, and the meshing transmission of the first bevel gear 8 and the second bevel gear 10 can realize the reversing adjustment of power, thereby converting the vertical rotational force into the horizontal rotational force, and driving the rotation of the cam 11. In conjunction with the resistance mechanism, the rotational motion of the cam 11 can be converted into the linear movement of the pushing block 12. During the movement of the pushing block 12, the first rotating tooth 16 can be driven by the meshing transmission of the first gear plate 14, and then the first rotating shaft 15 drives the scraper 17 to reciprocate and rotate. In this way, impurities electrostatically adsorbed on the conveyor line 1 can be cleaned. When the impurities fall into the box, the fixed rod 19 can be connected with the movable plate 20 in a resistance manner. In conjunction with the first and second springs 21, the movable plate 20 can centrally process the impurities, which is convenient for subsequent cleaning work.

[0062] refer to Figure 1 , Figure 6 , Figure 7 , Figure 8and Fig. 9 The high-precision cutting device for semiconductor packaging also includes an automatic cutting mechanism 23, which includes electric slide rails 24 placed at both ends of the outer wall of the frame. The electric slide rails 24 are arranged in a convex shape, and a guide block 25 is movably connected to the electric slide rails 24. The top ends of the guide blocks 25 are connected by a crossbeam. A second motor 26 is fixedly installed at one end of the outer wall of the guide block 25. The output shaft of the second motor 26 passes through the guide block 25 and extends to the screw shaft 27. The screw shaft 27 is spirally driven with a slider 29 fixed to the cutting assembly 28.

[0063] An automatic cutting mechanism 23 is provided, and the electric slide rail 24 cooperates with the lead screw shaft 27 connected to the second motor 26, and the cutting assembly 28 can realize the X-axis and Y-axis movement in the horizontal plane direction. At the same time, the electric slide rail 24 itself is convexly arranged, which can play a role of precise guidance for the movement of the guide block 25 to prevent the deviation from the track during the movement process. At the same time, during the rotation of the lead screw shaft 27, with the help of the effect of spiral transmission, precise structural displacement can be achieved. After the fourth motor 33 is started, it can drive the second rotating tooth 38 on the second rotating shaft 37 to rotate. Under the gear meshing transmission action and the transmission action of the conveyor belt, the third rotating tooth 39 and the fourth rotating tooth 42 rotate in the opposite direction and mesh with the corresponding second gear plate 43 for transmission. In this way, the movable plate 31 can be lifted and moved with the cooperation of the telescopic rod 30, and the second gear plate 43 is distributed around the movable plate 31, which can ensure the balance of the structure, thereby effectively realizing stable lifting and moving, improving the stability of the device operation, and enabling the cutting assembly 28 to move to any position in the space.

[0064] The cutting assembly 28 includes a telescopic rod 30 on both sides of the bottom end of the slider 29, a movable plate 31 is installed at the bottom of the telescopic rod 30, and a third motor 32 and a fourth motor 33 are installed on the outer wall of the movable plate 31 respectively. The output shaft of the third motor 32 passes through the movable plate 31 and extends to the movable plate 31 on the other side through the turntable 34. A positioning hole connected to the output shaft of the third motor 32 is provided at the center of the turntable 34, and a ring-shaped knife seat 35 is provided on the outer wall of the turntable 34, and a corresponding connected knife 36 is detachably installed on the knife seat 35.

[0065] One end of the output shaft of the fourth motor 33 extends to the second rotating shaft 37 inside the movable plate 31, and a second rotating tooth 38 is fixedly mounted on the second rotating shaft 37. The outer wall of the second rotating tooth 38 is meshed with a third rotating tooth 39, and the second rotating shaft 37 and the third rotating shaft 40 are connected by a third conveyor belt 41, and a fourth rotating tooth 42 is fixed on the third rotating shaft 40, and the third rotating tooth 39 and the fourth rotating tooth 42 maintain reverse rotation.

[0066] The third rotating tooth 39 and the fourth rotating tooth 42 are meshed and transmitted at one end of the outer wall with a second gear plate 43 fixed on the slider 29. The second gear plate 43 has a strip groove along the height direction of the movable plate 31, and the second gear plate 43 is distributed around the movable plate 31. As the fourth motor 33 is started, the third rotating tooth 39 and the fourth rotating tooth 42 are meshed and transmitted in the second gear plate 43 in the opposite direction, and drive the movable plate 31 to move up and down on the telescopic rod 30. Columns are installed around the bottom end of the frame, and both ends of the first motor 3 are fixedly connected to the frame through support rods.

[0067] The third conveyor belt 41 arranged between the second rotating shaft 37 and the third rotating shaft 40 can not only transmit the power of the second rotating shaft 37 to the third rotating shaft 40, but also allow the output shaft of the third motor 32 to pass through the third conveyor belt 41 while compensating for the distance, thereby ensuring the normal rotation of the turntable 34, and allowing the output shaft of the third motor 32 to effectively transmit power to the turntable 34.

[0068] refer to Fig. 9 , a high-precision cutting method for semiconductor packaging, comprising the following steps:

[0069] S1.1, place the semiconductor on the conveyor line 1, start the driver to drive the conveyor line 1 to rotate and convey the semiconductor, at this time, the first motor 3 is started, and the impurities on the surface of the semiconductor are removed by the cleaning roller 5. The impurities are adsorbed and attached to the conveyor line 1 due to the effect of friction static electricity;

[0070] S1.2, during step S1.1, under the action of mechanical transmission, the first gear plate 14 drives the first rotating shaft 15 on the first rotating tooth 16 to rotate back and forth, and the scraper 17 on the first rotating shaft 15 blocks and removes the impurities on the conveyor line 1 into the box body, and pushes the moving plate 20 through the fixed rod 19, so that the moving plate 20 pushes the impurities into the collecting boxes 22 at both ends and the center of the box body;

[0071] S1.3, when the semiconductor is transported to the automatic cutting mechanism 23, the second motor 26 is started, and different tools 36 are directly replaced by rotating the turntable 34. The electric slide rail 24 and the screw shaft 27 are used for the spiral transmission, and the cutting assembly 28 realizes the horizontal X-axis movement and Y-axis movement;

[0072] S1.4, during step S1.3, the fourth motor 33 is started, and through the gear meshing transmission, the third rotating tooth 39 and the fourth rotating tooth 42 rotate in opposite directions and mesh with the second gear plate 43 synchronously, and drive the movable plate 31 to move up and down on the telescopic rod 30, and the cutting assembly 28 rises and falls synchronously.

[0073] The entire packaging cutting design is reasonable and has strong integrated performance. It can quickly realize high-precision cutting of semiconductors, improve work efficiency, and ensure product quality. Multiple tool holders 35 are used to install multiple different tools 36 at one time. During the processing of the semiconductor cutting machine bed, different tools 36 can be switched to the operating station by starting the third motor 32. There is no need to repeatedly replace the tools 36, which is more convenient and improves the efficiency of processing the semiconductor cutting machine bed.

[0074] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

[0075] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A high-precision cutting device for semiconductor packaging, characterized in that: include: A conveyor line (1), the conveyor line (1) being mounted on a frame and extending in a preset direction for carrying and conveying semiconductors, an automatic cutting mechanism (23) being arranged on the frame being arranged above the conveyor line (1); A cleaning mechanism (2), the cleaning mechanism (2) comprising a first motor (3) disposed on a frame, the output shaft of the first motor (3) being connected to a movable shaft via a first conveyor belt (4), the movable shaft being disposed on the frame and laterally disposed above the conveyor line, and a cleaning roller (5) being fixedly connected to the movable shaft; An impurity collecting mechanism (18), the impurity collecting mechanism (18) comprising a scraper (17) in contact with the bottom surface of the conveyor line (1), the scraper (17) being fixed on a first rotating shaft (15), the first rotating shaft (15) extending into a cover body, and being transmission-connected to the first motor (3) via a transmission module arranged in the cover body, so as to drive the scraper (17) to swing around the first rotating shaft (15); A fixing rod (19) is fixedly arranged at the bottom of the scraper (17), a box is arranged below the fixing rod (19), a movable plate (20) is movably arranged on the floor of the box in a transverse direction, the movable plate (20) is connected to the inner wall of the box through a second spring (21) so as to be able to reciprocate along the longitudinal direction of the box, and when the scraper (17) swings around the first rotating shaft (15), the fixing rod (19) can follow the movement of the scraper (17) to drive the movable plate (20) to reciprocate along the longitudinal direction of the box, thereby pushing impurities dropped onto the floor of the box into a preset notch, and a collecting box (22) is also arranged at the notch, and the collecting box (22) is of a push-pull design.

2. The high-precision cutting device for semiconductor packaging according to claim 1, characterized in that: The driving module comprises: a first rotating tooth (16) coaxially fixedly connected to the first rotating shaft (15), the first rotating tooth (16) meshingly transmitting with the first gear plate (14), the first gear plate (14) being fixedly arranged on the pushing block (12), the pushing block (12) and the inner wall of the housing body being movably connected via a first spring (13), so that when the pushing block (12) reciprocates along the axial direction of the first spring (13), the first gear plate (14) can be driven to reciprocate along the extension direction of the first gear plate (14), thereby driving the first rotating tooth (16) to rotate back and forth; A cam (11) is fixedly provided with a second bevel gear (10), the second bevel gear (10) is meshedly connected with the first bevel gear (8), the first bevel gear (8) is fixedly connected with the first rotating wheel (6), and the first rotating wheel (6) is transmission-connected with the output shaft of the first motor (3) through the second conveyor belt (7), so that the cam (11) is driven to rotate through the first motor (3), and the cam (11) then drives the push block (12) to reciprocate.

3. The high-precision cutting device for semiconductor packaging according to claim 1 or 2, characterized in that: Two groups of the first motor (3) are symmetrically arranged at the two ends of the cleaning roller (5), and two groups of the impurity collecting mechanism (18) are symmetrically arranged corresponding to the two first motors (3).

4. The high-precision cutting device for semiconductor packaging according to claim 1, characterized in that: Both ends of the outer wall of the housing are fixed to the frame via bending rods, and a gap is provided between the bottom end of the fixing rod (19) and the floor of the box.

5. The high-precision cutting device for semiconductor packaging according to claim 1, characterized in that: The automatic cutting mechanism (23) comprises electric slide rails (24) arranged on the outer walls of both sides of the frame, the extension direction of the electric slide rails (24) is consistent with the extension direction of the conveyor line (1), and the electric slide rails (24) are movably connected with guide blocks (25), and the top ends of the guide blocks (25) are fixedly connected by cross beams; A second motor (26) is fixedly mounted on the guide block (25), a screw shaft (27) is rotatably arranged between the guide blocks (25), and an output shaft of the second motor (26) is drivingly connected to the screw shaft (27); A fixed slide block (29) on the cutting assembly (28) is screw-driven on the screw shaft (27).

6. The high-precision cutting device for semiconductor packaging according to claim 5, characterized in that: Vertically arranged telescopic rods (30) are arranged on both sides of the bottom end of the slider (29) of the cutting assembly (28), and a movable plate (31) is installed at the bottom of the telescopic rod (30); A third motor (32) and a fourth motor (33) are mounted on the outer wall of the movable plate (31); an output shaft of the third motor (32) passes through the movable plate (31) and extends to the movable plate (31) on the other side through a rotating disk (34); a positioning hole connected to the output shaft of the third motor (32) is provided at the center of the rotating disk (34); and a knife seat (35) distributed in an annular pattern is provided on the outer wall of the rotating disk (34); a correspondingly connected knife (36) is detachably mounted on the knife seat (35).

7. The high-precision cutting device for semiconductor packaging according to claim 6, characterized in that: The slider (29) is also fixedly connected to a second gear plate (43) which is vertically arranged, and the second gear plate (43) is movably connected to the movable plate (31); The fourth motor (33) is connected to the second gear plate (43) via a transmission mechanism disposed inside the movable plate (31) to drive the movable plate (31) to move up and down.

8. The high-precision cutting device for semiconductor packaging according to claim 7, characterized in that: Two second gear plates (43) are symmetrically arranged on the same side of the slider (29); The output shaft of the fourth motor (33) is in driving connection with a second rotating shaft (37) arranged inside the movable plate (31); a second rotating tooth (38) is fixedly mounted on the second rotating shaft (37); and a third rotating tooth (39) is meshed and driven on the outer wall of the second rotating tooth (38); The second rotating shaft (37) is connected to the third rotating shaft (40) through the third conveyor belt (41), and the third rotating shaft (40) is fixed with a fourth rotating tooth (42). The third rotating tooth (39) and the fourth rotating tooth (42) rotate in opposite directions and are respectively meshed with the two second gear plates (43).

9. The high-precision cutting device for semiconductor packaging according to claim 1, characterized in that: Vertical columns are installed around the bottom of the frame, and both ends of the first motor (3) are fixedly connected to the frame via support rods.

10. A high-precision cutting method for semiconductor packaging, applied to the high-precision cutting device for semiconductor packaging according to any one of claims 1 to 9, characterized in that: The steps include: S1.1, placing a semiconductor on a conveyor line (1), starting a driver to drive the conveyor line (1) to rotate and convey the semiconductor, at which time the first motor (3) is started, and impurities on the surface of the semiconductor are removed by a cleaning roller (5), and the impurities are adsorbed and adhered to the conveyor line (1) due to the effect of frictional static electricity; S1.2, during step S1.1, under the action of mechanical transmission, the first gear plate (14) drives the first rotating shaft (15) on the first rotating tooth (16) to rotate back and forth, and the scraper (17) on the first rotating shaft (15) blocks and removes impurities on the conveyor line (1) into the box body, and pushes the moving plate (20) through the fixed rod (19), so that the moving plate (20) pushes the impurities into the collection boxes (22) at both ends and the center of the box body; S1.3, when the semiconductor is transported to the automatic cutting mechanism (23), the second motor (26) is started, and different cutting tools (36) are directly replaced by rotating the turntable (34), and the cutting assembly (28) realizes horizontal X-axis movement and Y-axis movement through the spiral transmission of the electric slide rail (24) and the lead screw shaft (27); S1.4, during step S1.3, the fourth motor (33) is started, and through the gear meshing transmission, the third rotating tooth (39) and the fourth rotating tooth (42) rotate in opposite directions and mesh with the second gear plate (43) synchronously, thereby driving the movable plate (31) to move up and down on the telescopic rod (30), and the cutting assembly (28) to move up and down synchronously.

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