High-precision cutting device and method for semiconductor packaging

Abstract

The application discloses a high-precision cutting device and method for semiconductor packaging, and belongs to the technical field of semiconductor processing devices and methods, and comprises a conveying line, which is installed on a frame and extends along a preset direction to carry and convey semiconductors; and a cleaning treatment mechanism, which comprises a first motor arranged on the frame, a first conveying belt in transmission connection between an output shaft of the first motor and a movable shaft, and a cleaning roller fixedly connected to one end of the movable shaft and extending through a side plate to the other side plate, and the first motor output shaft and a first rotating wheel are in transmission connection through a second conveying belt arranged in parallel with the first conveying belt. The application solves the technical problem that the effective cutting operation cannot be carried out due to the existence of particle adhesion on the surface of the semiconductor, and the particle impurities are adhered to the conveying belt due to the frictional electrostatic effect caused by the long-time conveying effect of the transmission roller, thereby being not conducive to the safe operation of the conveying line.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor processing device and method, and particularly relates to a high-precision cutting device and method for semiconductor packaging. BACKGROUND

[0002] Semiconductor packaging refers to a process of processing a wafer that has passed the test into an independent chip according to product models and functional requirements. The packaging process is as follows: the wafer from the wafer front-end process is cut into small chips after the scribing process, then the cut chips are attached to the small islands of the corresponding substrate frame with glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate by using ultra-fine metal wires or conductive resin to form the required circuit; then the independent chips are packaged and protected with a plastic shell, and a series of operations are performed after the plastic packaging; after the packaging is completed, the finished product is tested, and usually goes through the processes of inspection, testing and packaging, and finally is put into the warehouse for delivery.

[0003] During the packaging process of the semiconductor, the semiconductor needs to be subjected to corresponding cutting treatment. However, if there are particles adhered to the surface of the semiconductor, on the one hand, it is not conducive to the effective performance of the cutting operation, and on the other hand, after timely cleaning, due to the long-time conveying effect of the transmission roller, the particle impurities are adhered to the conveying belt due to the effect of frictional electrostatic, which is not conducive to the safe work of the conveying line. In addition, during the packaging process of the semiconductor, a plurality of different types of cutters need to be used for different thicknesses and process requirements, and the direction of the wafer cutting machine bed needs to be adjusted many times, so the cutters and the wafer cutting machine bed need to be repeatedly disassembled and assembled, which is troublesome and reduces the processing efficiency. SUMMARY

[0004] The present application aims to provide a high-precision cutting device and method for semiconductor packaging, which solves the technical problem that if there are particles adhered to the surface of the semiconductor, on the one hand, it is not conducive to the effective performance of the cutting operation, and on the other hand, after timely cleaning, due to the long-time conveying effect of the transmission roller, the particle impurities are adhered to the conveying belt due to the effect of frictional electrostatic, which is not conducive to the safe work of the conveying line.

[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technical scheme:

[0006] A high-precision cutting device for semiconductor packaging, characterized in that it comprises:

[0007] A conveying line is installed on a frame and extends in a predetermined direction to carry and convey the semiconductor, and an automatic cutting mechanism provided on the frame is arranged above the conveying line.

[0008] The cleaning treatment mechanism comprises a first motor arranged on a frame, an output shaft of the first motor is connected with a movable shaft through a first conveying belt, the movable shaft is arranged on the frame and transversely arranged above the conveying line, and a cleaning roller is fixedly connected on the movable shaft;

[0009] The impurity collecting mechanism comprises a scraper in contact with the bottom surface of the conveying line, the scraper is fixed on a first rotating shaft, the first rotating shaft extends into a cover, and the first rotating shaft is in transmission connection with the first motor through a transmission module arranged in the cover, so as to drive the scraper to swing around the first rotating shaft;

[0010] The bottom of the scraper is further provided with a fixed rod, a box is arranged below the fixed rod, a movable plate is transversely movably arranged on the floor of the box, the movable plate is connected with the inner wall of the box through a second spring, so as to reciprocate along the longitudinal direction of the box, and when the scraper swings around the first rotating shaft, the fixed rod can drive the movable plate to reciprocate along the longitudinal direction of the box, so as to push the impurities falling on the floor of the box into the preset slot, and a collecting box is arranged at the slot, and the collecting box is designed as a push-pull type.

[0011] Optionally, the transmission module comprises:

[0012] A first rotating gear coaxially fixedly connected with the first rotating shaft is in meshing transmission with a first gear plate, the first gear plate is fixedly arranged on a push block, and the push block and the inner wall of the cover are movably connected through a first spring, so that when the push block reciprocates along the axial direction of the first spring, the first gear plate can reciprocate along the extension direction of the first gear plate, and the first rotating gear is driven to rotate back and forth.

[0013] A cam is fixedly provided with a second bevel gear, the second bevel gear is in meshing connection with a first bevel gear, the first bevel gear is fixedly connected with a first rotating wheel, the first rotating wheel is in transmission connection with the output shaft of the first motor through a second conveying belt, so that the cam is driven to rotate by the first motor, and the push block is driven to reciprocate by the cam.

[0014] Optionally, the first motor is symmetrically provided with two groups at both ends of the cleaning roller, and the impurity collecting mechanism is symmetrically provided with two groups corresponding to the two first motors.

[0015] Optionally, the outer wall of the cover is fixed on the frame through a bending rod at both ends, and a gap is arranged between the bottom end of the fixed rod and the floor of the box.

[0016] Optionally,

[0017] The automatic cutting mechanism comprises electric sliding rails arranged on the outer walls of the two sides of the frame, the extending direction of the electric sliding rails is consistent with the extending direction of the conveying line, and guide blocks are movably connected on the electric sliding rails, and the top ends of the guide blocks are fixedly connected through a cross beam;

[0018] A second motor is fixedly installed on the guide blocks, a lead screw shaft is rotatably arranged between the guide blocks, and the output shaft of the second motor is in transmission connection with the lead screw shaft;

[0019] The fixed sliding blocks on the cutting assembly are in screw transmission on the lead screw shaft.

[0020] Optionally,

[0021] The bottom ends of the sliding blocks of the cutting assembly are provided with vertically arranged telescopic rods, and the bottom ends of the telescopic rods are provided with movable plates;

[0022] A third motor and a fourth motor are installed on the outer wall of the movable plate, the output shaft of the third motor penetrates through the movable plate and extends to the other movable plate through a rotating disc, a positioning hole connected with the output shaft of the third motor is arranged at the center of the rotating disc, and an annularly distributed tool seat is arranged on the outer wall of the rotating disc, and a corresponding connected cutter is detachably installed on the tool seat.

[0023] Optionally,

[0024] A second gear plate arranged vertically is further fixedly connected on the sliding block, and the second gear plate is movably connected with the movable plate;

[0025] The fourth motor is in transmission connection with the second gear plate through a transmission mechanism arranged inside the movable plate, so as to drive the movable plate to move up and down.

[0026] Optionally,

[0027] Two second gear plates are symmetrically arranged on the same side of the sliding block;

[0028] The output shaft of the fourth motor is in transmission connection with a second rotating shaft arranged inside the movable plate, a second rotating gear is fixedly installed on the second rotating shaft, and a third rotating gear is in meshing transmission on the outer wall of the second rotating gear;

[0029] The second rotating shaft is in transmission connection with a third rotating shaft through a third conveying belt, a fourth rotating gear is fixedly arranged on the third rotating shaft, the second rotating gear and the fourth rotating gear are reversely rotated, and the second rotating gear and the fourth rotating gear are respectively in meshing connection with the two second gear plates.

[0030] Optionally, a stand is arranged around the bottom end of the frame, and the first motor is fixedly connected with the frame through supporting rods at both ends.

[0031] A high-precision cutting method for semiconductor packaging comprises the following steps:

[0032] S1.1, the semiconductor is placed on the conveying line, the driver is started to drive the conveying line to rotate and convey the semiconductor, at this time, the first motor is started, the impurities on the surface of the semiconductor are removed by the cleaning roller, and the impurities are adsorbed and attached to the conveying line under the action of friction static electricity;

[0033] S1.2, in the process of step S1.1, under the action of mechanical transmission, the first gear plate drives the first rotating shaft on the first rotating gear to rotate back and forth, the scraper on the first rotating shaft blocks and removes the impurities on the conveying line into the box, and the moving plate is pushed by the fixed rod, so that the moving plate pushes the impurities into the collection box at both ends and the center of the box.

[0034] S1.3, when the semiconductor is conveyed to the automatic cutting mechanism, the second motor is started, different cutters are directly replaced by the rotation of the turntable, and the cutting assembly realizes X-axis movement and Y-axis movement in the horizontal direction under the action of the screw transmission of the electric sliding rail and the lead screw shaft.

[0035] S1.4, in the process of step S1.3, the fourth motor is started, the third rotating gear and the fourth rotating gear are reversely rotated and synchronously meshed and transmitted with the second gear plate under the action of gear meshing transmission, the movable plate is lifted and lowered on the telescopic rod, and the cutting assembly is synchronously lifted and lowered.

[0036] As described above, due to the adoption of the above technical scheme, the beneficial effects of the present application are:

[0037] (1) The cleaning treatment mechanism is arranged, because the semiconductor is in contact with the transmission roller on the conveying line for a long time, the particle impurities have static electricity and are adsorbed on the conveying line, after the first motor is started, the particles on the surface of the semiconductor can be removed to the conveying line, when the conveying line is circularly conveyed to the other side, the power of the first motor drives the first bevel gear on the first rotating wheel to rotate under the action of mechanical transmission, then the cam on the second rotating wheel is driven to rotate under the action of gear meshing transmission, because the pushing block is in contact with the cam and is connected to the inner wall of the cover by the first spring, the rotation of the cam can be converted into the linear reciprocating motion of the pushing block, in the reciprocating motion process, the scraper on the first rotating shaft can be driven to rotate back and forth at a certain angle, so that the impurity particles on the conveying line can be effectively blocked and cleaned and fall into the box.

[0038] (2) Set the impurity collection mechanism, the scraper in the process of rotation, on the one hand can be cleaned through the rotating friction mode, on the other hand can extend the cleaning time, so as to effectively clean the impurities, at the same time, the scraper in the process of rotation, the fixed rod can be connected with the moving plate, because the moving plate is movably connected to the side wall of the box through the second spring, when the fixed rod is in contact, the moving plate can move back and forth horizontally, during the movement of the moving plate, the granular impurities can be pushed into the collection box at both ends and the center of the box, so that the effect of centralized collection can be achieved, and manual cleaning work is not required, and the collection box is designed to be movable and easy to pull, so that the subsequent cleaning work is facilitated and the work efficiency is improved.

[0039] (3) Set the automatic cutting mechanism, the electric slide rail is connected with the lead screw shaft through the second motor, the cutting assembly can move in the X axis and Y axis directions of the horizontal plane, and the electric slide rail is provided in a convex shape, so that the movement of the guide block can be accurately guided, and the phenomenon of deviating from the track during movement is prevented, and the lead screw shaft can realize accurate structural displacement through the action of screw transmission during rotation, the second gear on the second rotating shaft can be driven to rotate by the fourth motor, the third gear and the fourth gear are reversely rotated and meshed with the corresponding second gear plate under the action of gear transmission and the transmission of the conveying belt, so that the movable plate can move up and down under the cooperation of the telescopic rod, and the second gear plate is distributed around the movable plate, so that the balance of the structure can be ensured, so that stable up and down movement can be realized, the stability of the device is improved, and the cutting assembly can move to any position in the space.

[0040] (4) Set the cutting assembly, a plurality of different cutters are installed in the cutter seat at one time, different cutters can be switched to the operation station by starting the third motor during the machining of the semiconductor cutting machine bed, so that the cutters do not need to be replaced repeatedly, which is more convenient and improves the machining efficiency of the semiconductor cutting machine bed. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0042] Figure 1 It is a structure diagram of the high-precision cutting device for semiconductor packaging of the present application Figure 1 ;

[0043] Figure 2It is the structure diagram of high-precision cutting device for semiconductor packaging of the present application Figure 2 ;

[0044] Figure 3 It is the front view of high-precision cutting device for semiconductor packaging of the present application

[0045] Figure 4 It is the structure diagram of impurity collecting mechanism of the present application

[0046] Figure 5 It is the meshing transmission diagram of first bevel gear and second bevel gear of the present application

[0047] Figure 6 It is the enlarged view of A of the present application Figure 1

[0048] Figure 7 It is the connection diagram of second rotating tooth of the present application

[0049] Figure 8 It is the structure diagram of rotating disc of the present application

[0050] Figure 9 It is the flow diagram of high-precision cutting method for semiconductor packaging of the present application

[0051] The drawings: 1, conveying line; 2, cleaning treatment mechanism; 3, first motor; 4, first conveying belt; 5, cleaning roller; 6, first rotating wheel; 7, second conveying belt; 8, first bevel gear; 9, second rotating wheel; 10, second bevel gear; 11, cam; 12, push block; 13, first spring; 14, first gear plate; 15, first rotating shaft; 16, first rotating tooth; 17, scraper; 18, impurity collecting mechanism; 19, fixed rod; 20, moving plate; 21, second spring; 22, collecting box; 23, automatic cutting mechanism; 24, electric sliding rail; 25, guide block; 26, second motor; 27, screw shaft; 28, cutting assembly; 29, sliding block; 30, telescopic rod; 31, movable plate; 32, third motor; 33, fourth motor; 34, rotating disc; 35, tool holder; 36, cutter; 37, second rotating shaft; 38, second rotating tooth; 39, third rotating tooth; 40, third rotating shaft; 41, third conveying belt; 42, fourth rotating tooth; 43, second gear plate. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application. ​

[0053] With reference to the drawings Figure 1 and the accompanying Figure 2 semiconductor package with high-precision cutting device, comprising:

[0054] Conveying line 1, conveying line 1 is installed on the frame and extends along the preset direction, for carrying and conveying semiconductor; Cleaning treatment mechanism 2, cleaning treatment mechanism 2 includes first motor 3 placed on the frame, first motor 3 output shaft and movable shaft between the first conveying belt 4 transmission connection, movable shaft one end through the side plate and extends to the other side of the side plate, and movable shaft is fixedly connected with cleaning roller 5, and first motor 3 output shaft and first rotating wheel 6 are connected through the second conveying belt 7 arranged parallel to the first conveying belt 4.

[0055] Wherein, one end of the first rotating wheel 6 is fixed on the first bevel gear 8, the first bevel gear 8 is engaged with the second bevel gear 10 fixed on the second rotating wheel 9, the second rotating wheel 9 is connected with the cam 11 at the center, the cam 11 is in contact with the push block 12 on the outer wall, the push block 12 and the inner wall of the cover are connected by the first spring 13, and the first gear plate 14 is engaged with the first gear 16 fixed on the first rotating shaft 15 on the outer wall of the push block 12, the first rotating shaft 15 extends through the cover and extends to the scraper 17 on the top, the scraper 17 is symmetrically arranged with respect to the center of the conveying line 1 and is in contact with the bottom surface of the conveying line 1.

[0056] The cleaning treatment mechanism 2 is arranged, because the semiconductor is in contact with the transmission roller on the conveying line 1 for a long time, the particles and impurities are electrostatic and adsorbed on the conveying line 1, the first motor 3 can remove the particles on the surface of the semiconductor to the conveying line 1 after starting, when the conveying line 1 is circulated and conveyed to the other side, the power of the first motor 3 drives the first bevel gear 8 on the first rotating wheel 6 to rotate under the action of mechanical transmission, then drives the cam 11 on the second rotating wheel 9 to rotate under the action of gear engagement transmission, because the push block 12 is in contact with the cam 11 and is connected to the inner wall of the cover through the first spring 13, the rotation of the cam 11 can be converted into the linear reciprocating motion of the push block 12, which can drive the scraper 17 on the first rotating shaft 15 to rotate reciprocatingly at a certain angle during the reciprocating motion, so as to effectively block and clean the impurity particles on the conveying line 1 and fall into the box.

[0057] The parallel arrangement of the first conveying belt 4 and the second conveying belt 7 can effectively prevent the interference phenomenon of the transmission parts during the movement, so that the power can be transmitted to the corresponding structural parts through the transmission of the conveying belt, and the output shaft of the first motor 3 extends through the frame and extends to the second conveying belt 7 at the other end, which can ensure that the impurity collecting mechanisms 18 at both ends work synchronously.

[0058] ReferenceFigure 1 、 Figure 3 、 Figure 4 and Figure 5 , the impurity collecting mechanism 18, the fixed rod 19 is installed at the bottom of the scraper 17, the fixed rod 19 is provided below the box which is opened on the ground, the outer two ends of the fixed rod 19 are provided with the moving plate 20 which is arranged on the side wall of the box, the moving plate 20 and the inner wall of the box are connected through the second spring 21, and the two ends and the center of the inner wall of the box are provided with the collecting box 22 which is designed as a push-pull type.

[0059] The outer wall of the cover is fixed on the frame through the bending rod, the gap is arranged between the fixed rod 19 and the bottom end of the inner wall of the box, when the first motor 3 is started, the fixed rod 19 pushes the moving plate 20 at the two ends outward in the rotating process, at this time, the moving plate 20 pushes the impurities to the collecting box 22 at the two ends and the center of the box.

[0060] The impurity collecting mechanism 18 is arranged, the scraper 17 can be cleaned through the rotating friction during the rotating process, the cleaning time can be prolonged, the impurities can be effectively cleaned, and the scraper 17 can realize the abutting connection of the moving plate 20 through the fixed rod 19 during the rotating process. Since the moving plate 20 is movably connected to the side wall of the box through the second spring 21, when the fixed rod 19 abuts, the moving plate 20 can move back and forth horizontally. During the movement of the moving plate 20, the granular impurities can be pushed into the collecting box 22 at the two ends and the center of the box, so that the centralized collection effect can be achieved, manual cleaning work is not needed, the collecting box 22 is designed as a movable pull-out type, the operation is simple, the subsequent cleaning work is facilitated, and the work efficiency is improved.

[0061] The cover can provide corresponding supporting points for the first rotating wheel 6, the pushing block 12 and other components, the meshing transmission of the first bevel gear 8 and the second bevel gear 10 can realize the reversing adjustment of the power, so as to convert the vertical rotating force into the horizontal rotating force, drive the rotation of the cam 11, cooperate with the abutting mechanism, convert the rotary motion of the cam 11 into the linear motion of the pushing block 12, drive the first gear plate 14 to mesh and transmit the first rotating gear 16 during the movement of the pushing block 12, and then drive the scraper 17 to reciprocatingly rotate through the first rotating shaft 15, so that the impurities electrostatically adsorbed on the conveying line 1 can be cleaned. When the impurities fall into the box, the fixed rod 19 can abut and connect with the moving plate 20, cooperate with the first and second springs 21, and can concentrate the impurities by the moving plate 20, so that the subsequent cleaning work is facilitated.

[0062] Reference Figure 1 、 Figure 6 、 Figure 7 、 Figure 8And Figure 9 The high-precision cutting device for semiconductor packaging further comprises an automatic cutting mechanism 23, which comprises electric sliding rails 24 arranged at both ends of the outer wall of the frame, the electric sliding rails 24 are arranged in a convex shape, and guide blocks 25 are movably connected to the electric sliding rails 24, the top ends of the guide blocks 25 are connected by a cross beam, a second motor 26 is fixedly installed at one end of the outer wall of each guide block 25, the output shaft of the second motor 26 penetrates through the guide block 25 and extends to a lead screw shaft 27, and a sliding block 29 fixed to a cutting assembly 28 is screw-driven on the lead screw shaft 27.

[0063] The automatic cutting mechanism 23, the lead screw shaft 27 connected with the second motor 26 of the electric sliding rail 24, and the cutting assembly 28 can realize the movement of the X-axis and the Y-axis in the horizontal plane. Meanwhile, the electric sliding rail 24 is arranged in a convex shape, which can accurately guide the movement of the guide block 25 and prevent the guide block 25 from deviating from the track during movement. Meanwhile, the lead screw shaft 27 can realize accurate structural displacement by screw transmission during rotation. After the fourth motor 33 is started, the second gear teeth 38 on the second rotating shaft 37 can be driven to rotate. Under the gear meshing transmission and in cooperation with the transmission of the conveying belt, the third gear teeth 39 and the fourth gear teeth 42 rotate in opposite directions and mesh with the corresponding second gear plates 43. In this way, the movable plate 31 can move up and down under the cooperation of the telescopic rod 30. Meanwhile, the second gear plates 43 are distributed around the movable plate 31, which can ensure the balance of the structure and effectively realize stable up-and-down movement, improve the stability of the device, and enable the cutting assembly 28 to move to any position in space.

[0064] The cutting assembly 28 comprises telescopic rods 30 at both sides of the bottom end of the sliding block 29, the telescopic rods 30 are installed at the bottom of the movable plate 31, the third motor 32 and the fourth motor 33 are respectively installed on the outer wall of the movable plate 31, the output shaft of the third motor 32 penetrates through the movable plate 31 and extends to the other movable plate 31 through the rotating disc 34, the rotating disc 34 is provided with a positioning hole connected with the output shaft of the third motor 32 at the center, and the rotating disc 34 is provided with ring-shaped knife seats 35 on the outer wall, and the knife seats 35 are detachably installed with corresponding connected cutters 36.

[0065] One end of the output shaft of the fourth motor 33 extends to the second rotating shaft 37 inside the movable plate 31, the second rotating shaft 37 is fixedly installed with the second gear teeth 38, the second gear teeth 38 are meshed with the third gear teeth 39 on the outer wall, the second rotating shaft 37 and the third rotating shaft 40 are transmission-connected through the third conveying belt 41, the third rotating shaft 40 is fixedly installed with the fourth gear teeth 42, and the third gear teeth 39 and the fourth gear teeth 42 rotate in opposite directions.

[0066] The outer wall of the third rotating tooth 39 and the fourth rotating tooth 42 is meshed with the second gear plate 43 fixed on the sliding block 29, the second gear plate 43 is provided with a strip-shaped slot in the height direction of the movable plate 31, and the second gear plate 43 is distributed around the movable plate 31; when the fourth motor 33 is started, the third rotating tooth 39 and the fourth rotating tooth 42 are reversely meshed and driven on the second gear plate 43, and the movable plate 31 is lifted and lowered on the telescopic rod 30; the frame is provided with a stand around the bottom end, and the first motor 3 is fixedly connected with the frame through the support rod at both ends.

[0067] The third conveying belt 41 arranged between the second rotating shaft 37 and the third rotating shaft 40 can drive the second rotating shaft 37 to the third rotating shaft 40, compensate the distance, and allow the output shaft of the third motor 32 to pass through the third conveying belt 41, so as to ensure the normal rotation of the rotating disc 34 and effectively transmit the power of the output shaft of the third motor 32 to the rotating disc 34.

[0068] Reference Figure 9 A high-precision cutting method for semiconductor packaging, comprising the following steps:

[0069] S1.1, the semiconductor is placed on the conveying line 1, the driving device is started to drive the conveying line 1 to rotate and convey the semiconductor, at this time, the first motor 3 is started, and the impurities on the surface of the semiconductor are removed by the cleaning roller 5, and the impurities are adsorbed and attached to the conveying line 1 due to the frictional electrostatic effect;

[0070] S1.2, in the process of step S1.1, under the action of mechanical transmission, the first gear plate 14 drives the first rotating shaft 15 on the first rotating tooth 16 to rotate back and forth, the scraper 17 on the first rotating shaft 15 blocks and removes the impurities on the conveying line 1 into the box, and the moving plate 20 is pushed by the fixed rod 19, so that the moving plate 20 pushes the impurities into the collection box 22 at both ends and the center of the box;

[0071] S1.3, when the semiconductor is conveyed to the automatic cutting mechanism 23, the second motor 26 is started, different cutters 36 are directly replaced by the rotation of the rotating disc 34, the cutting assembly 28 realizes X-axis movement and Y-axis movement in the horizontal direction under the action of the screw transmission of the electric sliding rail 24 and the lead screw shaft 27;

[0072] S1.4, in the process of step S1.3, the fourth motor 33 is started, the third rotating tooth 39 and the fourth rotating tooth 42 are reversely rotated and synchronously meshed and driven with the second gear plate 43 through gear meshing transmission, and the movable plate 31 is lifted and lowered on the telescopic rod 30, and the cutting assembly 28 is synchronously lifted and lowered.

[0073] The whole package cutting design is reasonable, the integration performance is strong, the high-precision cutting work of the semiconductor can be realized quickly, the work efficiency is improved, the product quality is guaranteed, a plurality of different cutters 36 are installed at one time by using a plurality of cutter holders 35, different cutters 36 can be switched to the operation station by starting the third motor 32 in the process of machining the semiconductor cutting machine bed, the cutters 36 do not need to be replaced repeatedly, it is more convenient, and the machining efficiency of the semiconductor cutting machine bed is improved.

[0074] The above is only a preferred embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

[0075] The preferred embodiments of the present application disclosed above are only used to help explain the present application. The preferred embodiments do not describe all the details and limit the present application to the specific embodiments. Obviously, many modifications and changes can be made according to the content of the present application. The embodiments are selected and described in detail in order to better explain the principles and practical applications of the present application, so that the skilled in the art can well understand and use the present application. The present application is limited by the claims and the whole scope and equivalents thereof.

Claims

1. A high-precision cutting device for semiconductor packaging, characterized in that, The utility model relates to a kind of semiconductor wafer cleaning device, including: Conveying line (1), the conveying line (1) is installed on frame and extends along preset direction, to carry and transport semiconductor, conveying line (1) top is provided with automatic cutting mechanism (23) being arranged on frame; Cleaning processing mechanism (2), the cleaning processing mechanism (2) includes first motor (3) being placed on frame, the output shaft of first motor (3) is drivenly connected with movable shaft by first conveying belt (4), the movable shaft is arranged on the frame, and is laterally arranged above the conveying line, and movable shaft is fixedly connected with cleaning roller (5) on it; Impurity collection mechanism (18), the impurity collection mechanism (18) includes scraper (17) being in contact with the bottom surface of conveying line (1) and fitting, scraper (17) is fixed on first rotating shaft (15), first rotating shaft (15) extends to a cover, and is drivenly connected with first motor (3) by the transmission module being arranged in the cover, to drive scraper (17) swing around first rotating shaft (15). Wherein, the bottom of the scraper (17) is also fixedly provided with a fixed rod (19), the box is provided below the fixed rod (19), the moving plate (20) is movably arranged on the floor of the box in the transverse direction, the moving plate (20) is connected with the inner wall of the box by the second spring (21), and is reciprocatingly arranged along the longitudinal direction of the box, and when the scraper (17) swings around the first rotating shaft (15), the fixed rod (19) drives the moving plate (20) to reciprocate along the longitudinal direction of the box by following the movement of the scraper (17), so as to push the impurities falling on the floor of the box into the preset slot, the collecting box (22) is also provided at the slot, and the collecting box (22) is designed as a push-pull type. The transmission module includes: The first gear (16) is coaxially fixedly connected with the first rotating shaft (15), the first gear (16) is in meshing transmission with the first gear plate (14), the first gear plate (14) is fixedly arranged on the push block (12), the push block (12) and the inner wall of the cover are movably connected by the first spring (13), so that when the push block (12) reciprocates along the axial direction of the first spring (13), the first gear plate (14) is reciprocally moved along the extension direction of the first gear plate (14), and then the first gear (16) is driven to rotate back and forth. Cam (11), cam (11) is fixedly provided with second bevel gear (10) on it, second bevel gear (10) is meshingly connected with first bevel gear (8), first bevel gear (8) is fixedly connected with first rotating wheel (6), first rotating wheel (6) is drivenly connected with the output shaft of first motor (3) by second conveying belt (7), so as to drive cam (11) to rotate by first motor (3), then drive push block (12) to reciprocate by cam (11).

2. The high-precision dicing apparatus for semiconductor packaging according to claim 1, wherein The first motor (3) is symmetrically provided with two groups at both ends of the cleaning roller (5), and the impurity collection mechanism (18) is symmetrically provided with two groups corresponding to the two first motors (3).

3. The high-precision dicing apparatus for semiconductor packaging according to claim 1, wherein The outer wall of the cover body is fixed on the frame through bending rods at both ends, and a gap is provided between the bottom end of the fixing rod (19) and the floor of the box. 4.The high-precision cutting device for semiconductor packaging of claim 1, wherein The automatic cutting mechanism (23) comprises electric sliding rails (24) arranged on the outer walls of the frame, the extending direction of the electric sliding rails (24) is consistent with the extending direction of the conveying line (1), and guide blocks (25) are movably connected to the electric sliding rails (24), and the top ends of the guide blocks (25) are fixedly connected through a cross beam; A second motor (26) is fixedly installed on the guide blocks (25), and a lead screw shaft (27) is rotatably arranged between the guide blocks (25), and the output shaft of the second motor (26) is in transmission connection with the lead screw shaft (27); The fixed sliding block (29) on the cutting assembly (28) is in screw transmission on the lead screw shaft (27). 5.The high-precision cutting device for semiconductor packaging of claim 4, wherein A vertically arranged telescopic rod (30) is arranged at the bottom end of the sliding block (29) on both sides, and a movable plate (31) is installed at the bottom of the telescopic rod (30); A third motor (32) and a fourth motor (33) are installed on the outer wall of the movable plate (31), the output shaft of the third motor (32) penetrates through the movable plate (31) and extends to the other movable plate (31) through a turntable (34), a positioning hole connected with the output shaft of the third motor (32) is arranged at the center of the turntable (34), and an annularly distributed tool seat (35) is arranged on the outer wall of the turntable (34), and a corresponding connected cutter (36) is detachably installed on the tool seat (35). 6.The high-precision cutting device for semiconductor packaging of claim 5, wherein A vertically arranged second gear plate (43) is further fixedly connected to the sliding block (29), and the second gear plate (43) is movably connected to the movable plate (31); The fourth motor (33) is in transmission connection with the second gear plate (43) through a transmission mechanism arranged in the movable plate (31) to drive the movable plate (31) to move up and down. 7.The high-precision cutting device for semiconductor packaging of claim 6, wherein Two second gear plates (43) are symmetrically arranged on the same side of the sliding block (29); The output shaft of the fourth motor (33) is in transmission connection with a second rotating shaft (37) arranged in the movable plate (31), a second rotating gear (38) is fixedly installed on the second rotating shaft (37), and a third rotating gear (39) is in meshing transmission on the outer wall of the second rotating gear (38); The second rotating shaft (37) is in transmission connection with a third rotating shaft (40) through a third conveying belt (41), and a fourth rotating gear (42) is fixedly installed on the third rotating shaft (40), the third rotating gear (39) and the fourth rotating gear (42) are reversely rotatable, and are in meshing connection with the two second gear plates (43) respectively.

8. The high-precision dicing apparatus for semiconductor packaging according to Claim 1, wherein A stand is arranged around the bottom end of the frame, and the first motor (3) is fixedly connected to the frame through support rods at both ends.

9. A high-precision cutting method for semiconductor packages, applied to the high-precision cutting device for semiconductor packages according to any one of claims 1-8, characterized in that, The method comprises the following steps: S1.1, the semiconductor is placed on the conveying line (1), the driver is started to drive the conveying line (1) to rotate and convey the semiconductor, at this time, the first motor (3) is started, the impurities on the surface of the semiconductor are removed by the cleaning roller (5), and the impurities are adsorbed and attached to the conveying line (1) due to the action of friction static electricity; S1.2, in the process of step S1.1, under the action of mechanical transmission, the first gear plate (14) drives the first rotating shaft (15) on the first rotating gear (16) to rotate back and forth, the scraper (17) on the first rotating shaft (15) blocks and removes the impurities on the conveying line (1) into the box, and the fixed rod (19) pushes the moving plate (20), so that the moving plate (20) pushes the impurities into the collection box (22) at both ends and the center of the box; S1.3, when the semiconductor is conveyed to the automatic cutting mechanism (23), the second motor (26) is started, different cutters (36) are directly replaced by the rotation of the turntable (34), the spiral transmission effect of the electric sliding rail (24) and the lead screw shaft (27), the cutting assembly (28) realizes the horizontal X-axis movement and Y-axis movement; S1.4, in the process of step S1.3, the fourth motor (33) is started, the third rotating gear (39) and the fourth rotating gear (42) are reversely rotated and synchronously meshed with the second gear plate (43) through gear meshing transmission, and the movable plate (31) is lifted and lowered on the telescopic rod (30), and the cutting assembly (28) is synchronously lifted and lowered.

Images