Wafer box carrying system and carrying method

Abstract

The invention provides a wafer box carrying system and method, and the system comprises a transportation system which comprises a carrying track and a plurality of carrying robots; the machine table system comprises a plurality of machine tables; the warehousing system comprises a plurality of suspension type temporary storage devices, and the suspension type temporary storage devices are distributed around the machine table; the master control system is used for determining the position information of a current machine table, the position information of a target machine table and the position information of all the suspension type temporary storage devices around the target machine table according to the carrying instruction of the machine table system and map information; wherein the carrying instruction represents that the wafer box is carried to a suspension type temporary storage device around a target machine table from a current machine table; the map information comprises position information of all machines and the suspension type temporary storage device. According to the carrying system and the carrying method for the wafer box, the clamping effect of the wafer box can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductors, and in particular to a wafer box conveying system and a conveying method. Background Art

[0002] With the rapid development of the semiconductor industry, the requirements for the environment and operation accuracy during the manufacturing and handling of wafers are becoming increasingly higher. As a high-precision semiconductor device, wafers are thin, light, brittle, and have extremely high requirements for environmental cleanliness. In order to ensure the quality of wafers and reduce the risk of contamination, wafers are usually stored in dedicated wafer boxes and transported and stored in wafer boxes. In existing wafer box handling systems, automatic guided vehicles (AGVs) combined with robotic arms are generally used for handling. The robotic arm is equipped with a gripping device, such as a gripper or a manipulator, which grasps and carries the wafer box through physical clamping force.

[0003] However, this existing handling method has the following significant defects: Due to the fragility of the wafer box material and the high value of the wafer itself, the clamping force of the clamping device on the wafer box needs to be very precise. However, the existing clamping devices generally adopt a fixed or simple adjustable force control method, which makes it difficult to achieve precise force control. Excessive force can easily crush the wafer box, causing debris contamination of the wafer box, or even crushing the wafer box and the wafer; while too little force will lead to unstable clamping, and the wafer box will easily slip off the clamping device and fall, causing damage to the wafer box and the wafer. Therefore, there is room for improvement. Summary of the invention

[0004] The object of the present invention is to provide a wafer box transport system and a wafer box transport method, which can improve the clamping effect of the wafer box.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention provides a wafer box handling system, comprising: a transport system, including a handling track and a plurality of handling robots;

[0007] A machine system, including multiple machines;

[0008] A storage system, comprising a plurality of suspended temporary storage devices, wherein the suspended temporary storage devices are distributed around the machine platform; and

[0009] The master control system is used to determine the location information of the current machine, the location information of the target machine, and the location information of all suspended temporary storage devices around the target machine according to the transport instruction and map information of the machine system; wherein the transport instruction indicates that the wafer box is transported from the current machine to the suspended temporary storage device around the target machine; and the map information includes the location information of all machines and suspended temporary storage devices;

[0010] The master control system is further used to determine a plurality of preliminary path information from the current machine to all suspended temporary storage devices around the target machine based on the position information of the current machine, the position information of the target machine, and the position information of all suspended temporary storage devices around the target machine; the preliminary path information includes path length information and path curvature information;

[0011] The master control system is further used to calculate a path evaluation value of each piece of the preliminary path information based on the path length information, the path curvature information, the moving speed information, and the steering angle information of the transport robot of each piece of the preliminary path information;

[0012] The master control system is also used to select the preliminary path information corresponding to the optimal path evaluation value as the target path, generate and send a start instruction to the corresponding transport robot; the transport robot completes the transport of the wafer box according to the start instruction and the target path.

[0013] In one embodiment of the present invention, the master control system calculates the path evaluation value according to the following steps:

[0014] Based on the path length information of the preliminary path information and its corresponding weight coefficient, the corresponding length evaluation value P is calculated. L , expressed as: P L =1 / (1+αL); where α represents the weight coefficient of the path length, and L represents the path length information;

[0015] Based on the path curvature information of the preliminary path information and its corresponding weight coefficient, the corresponding curvature evaluation value P is calculated. C , expressed as: Among them, β represents the weight coefficient of path curvature, C i It is represented as the curvature of each line segment on the path, and n is represented as the number of line segments on the path;

[0016] Based on the moving speed information of the transport robot and its corresponding weight coefficient, the corresponding speed evaluation value P is calculated. V , expressed as: P V =1 / (1+γV 2 ), where γ represents the weight coefficient of the moving speed, and V represents the moving speed information;

[0017] Based on the steering angle information of the handling robot and its corresponding weight coefficient, the corresponding angle evaluation value P is calculated. θ , expressed as: Among them, δ represents the weight coefficient of the steering angle, θ i It is represented as the turning angle at each turn on the path, and m is represented as the number of turns on the path;

[0018] Based on the length evaluation value, the curvature evaluation value, the speed evaluation value, and the angle evaluation value, a path evaluation value P of the corresponding preliminary path information is calculated, which is expressed as: P=w1×P L +w2×P C +w3×P V +w4×P θ ; Among them, w1, w2, w3, w4 are weight coefficients, and w1+w2+w3+w4=1.

[0019] In one embodiment of the present invention, the handling robot is used to adjust the clamping force during the handling process according to the following steps:

[0020] Obtain information on ambient humidity, ambient temperature, cleanliness, and vibration intensity of the wafer box during transportation;

[0021] Based on the path evaluation value and the influence coefficient, calculate the first influence factor I of the path evaluation value on the clamping force P , expressed as: I P =1 / (1+k P (1-P)); where k P It is expressed as the influence coefficient of the path evaluation value;

[0022] Based on the vibration intensity information and the influence coefficient, calculate the second influence factor I of the vibration intensity information on the clamping force Vosc , expressed as: I Vosc =1+k V ×Vosc; where Vosc represents the vibration intensity information, k V The influence coefficient expressed as vibration intensity information;

[0023] Based on the environmental humidity information and the influence coefficient, the environmental temperature information and the influence coefficient, and the cleanliness information and the influence coefficient, calculate the third influence factor I of the environmental conditions on the clamping force E , expressed as: I E =1+K T ×(T-T0)+K H ×(H-H0)+K C ×(C-C0); where T, T0, KT They are respectively represented as ambient temperature information, reference temperature information, and the influence coefficient of ambient temperature, H, H0, and K H They are respectively represented as ambient humidity information, reference humidity information, and the influence coefficient of ambient humidity, C, C0, and K C They are respectively expressed as cleanliness information, reference cleanliness information, and cleanliness influence coefficient;

[0024] Based on the clamping force change rate and the influence coefficient, the fourth influence factor I of the clamping force change rate on the clamping force is calculated. ΔF , expressed as: I ΔF =1 / (1+k ΔF ×|ΔF|); where ΔF is the rate of change of the clamping force, k ΔF Expressed as the influence coefficient of the clamping force change rate;

[0025] Based on the first influencing factor and weight coefficient, the second influencing factor and weight coefficient, the third influencing factor and weight coefficient, the fourth influencing factor and weight coefficient, and the initial clamping force data, the target clamping force data F is calculated, which is expressed as: F = F0 × (w1' × I P +w'2×I Vosc +w'3×I E +w'4×I ΔF );

[0027] Wherein, w'1, w'2, w'3, w'4 represent weight coefficients and w'1+w'2+w'3+w'4=1, and F0 represents initial clamping force data obtained based on threshold data;

[0028] The clamping force is adjusted according to the target clamping force data.

[0029] In one embodiment of the present invention, the transport robot comprises:

[0030] The vehicle body is located on the transport track;

[0031] A placement platform, installed on the vehicle body, for placing a wafer box;

[0032] A driving assembly is installed on the placement platform;

[0033] At least two clamping plates are connected to the output end of the driving component, and the driving component drives the clamping plates to move closer to or farther from each other; on the contact surface between the clamping plates and the wafer box, one of the clamping plates is provided with a plurality of suction ports;

[0034] At least two pressure sensors are respectively installed in the clamping plate and are used to detect pressure data between the clamping plate and the wafer box;

[0035] a pneumatic component connected to the suction port; and

[0036] A controller, used for judging the magnitude of the pressure data and the threshold data: when the pressure data is greater than the threshold data, generating a stop instruction and an adsorption instruction;

[0037] Wherein, the driving component stops driving the clamping plates to approach each other according to the stop instruction; the pneumatic component is started according to the adsorption instruction to adsorb the side of the wafer box through the adsorption port.

[0038] In one embodiment of the present invention, the clamping plate comprises:

[0039] a fixed plate, wherein an inner cavity is provided therein, and the inner cavity is communicated with the pneumatic component; and

[0040] A flexible plate, fixedly mounted on one side of the fixed plate;

[0041] Wherein, the adsorption port is opened at the corresponding position of the flexible plate and the fixed plate.

[0042] In one embodiment of the present invention, the driving assembly comprises:

[0043] A clamping shell is installed on the placement platform, and a guide rail is fixed inside the clamping shell;

[0044] Two racks are slidably mounted on the guide rail, and the two clamping plates are respectively mounted on different racks;

[0045] Two sector gears are pivotally mounted in the clamping housing, and the sector gears are respectively meshed with corresponding racks;

[0046] Two swing rods, respectively fixedly connected to corresponding sector gears; and

[0047] The driving structure is installed in the clamping shell, and its output end is respectively connected with two swing rods to drive the sector gear to rotate.

[0048] In one embodiment of the present invention, the driving structure includes:

[0049] A driving member, fixedly mounted in the clamping housing; and

[0050] A connecting rod, one side of the central part of the connecting rod is connected to the movable end of the driving member, the two ends of the connecting rod are respectively pivotally connected to one end of the two transmission rods, and the other ends of the two transmission rods are respectively pivotally connected to one end of the corresponding swing rods.

[0051] In one embodiment of the present invention, the driving member comprises:

[0052] A driving motor is fixedly installed in the clamping housing;

[0053] A lead screw connected to the rotating end of the drive motor; and

[0054] A linear guide rail is slidably installed in the clamping shell, and the linear guide rail cooperates with the lead screw; the linear guide rail is connected to the connecting rod.

[0055] In one embodiment of the present invention, a lifting assembly is further included, wherein a fixed end of the lifting assembly is fixedly mounted on the vehicle body, and the placement platform is fixedly mounted on a movable end of the lifting assembly.

[0056] The present invention also provides a method for transporting a wafer box, comprising:

[0057] According to the transport instructions and map information of the machine system, the location information of the current machine, the location information of the target machine, and the location information of all suspended temporary storage devices around the target machine are determined; wherein the transport instructions represent transporting the wafer box from the current machine to the suspended temporary storage device around the target machine; and the map information includes the location information of all machines and suspended temporary storage devices;

[0058] Based on the position information of the current machine, the position information of the target machine, and the position information of all suspended temporary storage devices around the target machine, a plurality of preliminary path information from the current machine to all suspended temporary storage devices around the target machine is determined; the preliminary path information includes path length information and path curvature information;

[0059] Calculate a path evaluation value of each piece of the preliminary path information based on the path length information, the path curvature information, the moving speed information, and the steering angle information of the transport robot;

[0060] The preliminary path information corresponding to the optimal path evaluation value is selected as the target path, and a start instruction is generated and sent to the corresponding transport robot; the transport robot completes the transport of the wafer box according to the start instruction and the target path.

[0061] As described above, the present invention provides a wafer box handling system and method. Through an intelligent force control system, the clamping force can be adjusted in real time to ensure that the wafer box will not be crushed due to excessive force, nor will it be clamped unstably due to insufficient force. Accurate force control can avoid the risk of wafer box contamination and crushing caused by improper force, and protect the integrity and cleanliness of the wafer. By adjusting the force in real time, it is ensured that the clamping device can firmly clamp the wafer box under various conditions, reducing the risk of slipping and falling.

[0062] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0064] Figure 1 A schematic diagram of a transport robot in a wafer box transport system in one embodiment of the present invention;

[0065] Figure 2 is a schematic diagram of a driving component in one embodiment of the present invention;

[0066] Figure 3 A schematic diagram of the internal structure of a driving component in one embodiment of the present invention;

[0067] Figure 4 is a schematic diagram of a wafer box in one embodiment of the present invention;

[0068] Figure 5 is a schematic diagram of a wafer box handling system according to an embodiment of the present invention;

[0069] Figure 6 FIG. 4 is a flow chart of a method for transporting a wafer box according to an embodiment of the present invention.

[0070] In the figure: 10, vehicle body;

[0071] 20. Lifting assembly;

[0072] 30. Place the platform;

[0073] 40. driving assembly; 41. clamping housing; 42. driving member; 43. connecting rod; 44. transmission rod; 45. swing rod; 46. sector gear; 47. rack; 48. guide rail;

[0074] 50. Clamping plate; 51. Air hole;

[0075] 60. Pneumatic components;

[0076] 70. Wafer box;

[0077] 100. Transportation system; 200. Machine system; 300. Warehousing system; 400. Master control system. DETAILED DESCRIPTION

[0078] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0079] See also Figure 1 The present invention provides a wafer box handling robot, which can carry the wafer box 70 on the current machine to a suspended temporary storage device around the target machine for temporary storage according to the start command issued by the master control system 400. Among them, one or more robotic arms can be set on the machine, and the wafer box 70 can be moved by the robotic arms. The handling robot can include a vehicle body 10, a lifting component 20, a placement platform 30, a driving component 40, a clamping plate 50, a pneumatic component 60, a pressure sensor, a controller, etc.

[0080] See also Figure 1 In some embodiments, the vehicle body 10 refers to the base part of the handling robot. The vehicle body 10 is the main structural part of the entire robot system and carries all other mechanical and electronic components. The vehicle body 10 can be moved along the handling track by various driving modes (such as motor drive, etc.) to ensure that the handling robot can stably and efficiently complete the handling task on the predetermined path.

[0081] In some embodiments, the transport track can be set on the ceiling of the semiconductor factory, and the wafer box transport robot can be suspended above the semiconductor factory for movement and transportation to save space in the semiconductor factory, thereby forming a wafer box overhead crane transport system.

[0082] In some embodiments, the vehicle body 10 of the wafer box transport robot may not need to be disposed on a transport track. In this case, the vehicle body 10 may be provided with a plurality of wheels, and the vehicle body 10 may be moved according to the path setting of the master control system 400 .

[0083] See also Figure 1 , Figure 2 and Figure 4In some embodiments, the placement platform 30 can be mounted on the vehicle body 10 through the lifting assembly 20. The placement platform 30 can be used to place the wafer box 70. The fixed end of the lifting assembly 20 is fixedly mounted on the vehicle body 10. The placement platform 30 can be fixedly mounted on the movable end of the lifting assembly 20. The fixed end of the lifting assembly 20 is fixedly mounted on the vehicle body 10 to ensure that the lifting assembly 20 has a stable base during the transportation process to prevent unnecessary vibration or instability caused by the movement of the vehicle body 10. The placement platform 30 is fixedly mounted on the movable end of the lifting assembly 20. Through the up and down movement of the lifting assembly 20, the height of the placement platform 30 can be dynamically adjusted to meet different transportation requirements.

[0084] In some embodiments, the lifting assembly 20 can have a variety of specific structural forms. For example, the lifting assembly 20 can be a hydraulic cylinder, the lower part of the hydraulic cylinder can be fixed on the vehicle body 10, the piston rod of the hydraulic cylinder can be connected to the placement platform 30, and the piston rod is driven up and down by the pressure of the hydraulic oil to adjust the height of the placement platform 30. For another example, the lifting assembly 20 can be an electric lifting rod, the lower part of the electric lifting rod can be fixed on the vehicle body 10, and the telescopic part of the electric lifting rod is connected to the placement platform 30. The placement platform 30 is moved up and down by a motor-driven screw or a gear rack mechanism. The specific structure of the lifting assembly 20 is not limited, as long as it can adjust the height of the placement platform 30 to meet the needs of different scenarios.

[0085] See also Figure 2 , Figure 3 and Figure 4 In some embodiments, the driving assembly 40 may be installed on the placement platform 30, and the driving assembly 40 may be used to drive the two clamping plates 50 to move closer to or farther from each other to clamp the wafer box 70. The driving assembly 40 may include a driving structure, a clamping housing 41, a swing rod 45, a sector gear 46, a rack 47, and a guide rail 48.

[0086] See also Figure 3 and Figure 4In some embodiments, the clamping housing 41 may be a closed housing for mounting and fixing the various components of the driving assembly 40. The guide rail 48 may be fixed inside the clamping housing 41 to guide the sliding of the rack 47. The number of guide rails 48 may be unlimited, for example, it may be one or two. The number of racks 47 may be two, and the two racks 47 may be slidably mounted on the guide rails 48 and may move along the guide rails 48. The two clamping plates 50 are respectively fixed on different racks 47 to clamp the wafer box 70. The two sector gears 46 may be pivotally mounted in the clamping housing 41 to mesh with the corresponding racks 47. The two swing arms 45 are respectively fixedly connected to the corresponding sector gears 46. The driving structure may be installed in the clamping housing 41, and its output ends are respectively connected to the two swing arms 45 to drive the sector gear 46 to rotate.

[0087] See also Figure 3 and Figure 4 In some embodiments, after the output end of the driving structure starts to move, the two swinging rods 45 can be driven to swing. The swinging of the swinging rod 45 causes the sector gear 46 to pivot in the clamping housing 41, and the rotation direction and angle of the sector gear 46 depend on the output of the driving structure. The rotation of the sector gear 46 causes the rack 47 to slide along the guide rail 48 through the engagement with the rack 47. The sliding of the rack 47 drives the movement of the clamping plate 50, and the clamping plate 50 moves inward or outward to clamp or release the wafer box 70.

[0088] See also Figure 3 In some embodiments, the driving structure may include a driving member 42 and a connecting rod 43. The driving member 42 may include a driving motor, a lead screw and a linear guide. Among them, the driving motor may be fixedly installed in the clamping housing 41 to provide power. The lead screw may be connected to the rotating end of the driving motor, and the rotation of the lead screw is driven by the rotation of the motor. The linear guide may be slidably installed in the clamping housing 41, cooperate with the lead screw, and convert the rotational motion of the lead screw into the linear motion of the linear guide. The linear guide may be connected to the connecting rod 43, and the movement of the connecting rod 43 is driven by the linear motion.

[0089] See also Figure 3In some embodiments, one side of the central portion of the connecting rod 43 can be connected to the movable end (i.e., the linear guide) of the driving member 42. The movement of the linear guide will directly drive the movement of the connecting rod 43. The two ends of the connecting rod 43 are pivotally connected to one end of the two transmission rods 44 respectively, and this pivot connection allows the transmission rod 44 to rotate around the connection point when the connecting rod 43 moves. One end of the two transmission rods 44 can be pivotally connected to the two ends of the connecting rod 43 respectively, and the other end of the two transmission rods 44 can be pivotally connected to one end of the corresponding swing rod 45. This connection method allows the movement of the connecting rod 43 to be transmitted to the swing rod 45 through the transmission rod 44, so that the swing rod 45 rotates around its fixed point.

[0090] See also Figure 3 In some embodiments, after the driving motor starts to rotate, the lead screw can be driven to rotate. The rotational motion of the lead screw is converted into the linear motion of the linear guide by cooperating with the linear guide. The linear guide is connected to the connecting rod 43, and the movement of the linear guide directly drives the movement of the connecting rod 43. The movement direction and distance of the connecting rod 43 are consistent with the movement of the linear guide. The two ends of the connecting rod 43 can be pivotally connected to one end of the two transmission rods 44 respectively. When the connecting rod 43 moves, the transmission rod 44 will swing around the pivot point between it and the connecting rod 43. The other end of the transmission rod 44 is pivotally connected to one end of the corresponding swing rod 45. The swing of the transmission rod 44 will drive the swing rod 45 to rotate around its fixed point. The other end of the swing rod 45 is fixedly connected to the fan gear 46. The rotation of the swing rod 45 will drive the rotation of the fan gear 46. The fan gear 46 is meshed with the corresponding rack 47. The rotation of the fan gear 46 will cause the rack 47 to slide along the guide rail 48 through meshing. The sliding movement of the rack 47 drives the clamping plate 50 to move, thereby clamping or releasing the wafer box 70 .

[0091] See also Figure 1 , Figure 2 and Figure 4 In some embodiments, the number of clamping plates 50 may be at least two. The clamping plate 50 may include a fixed plate, a flexible plate and an adsorption port 51. The material of the fixed plate may be a high-strength aluminum alloy, which provides sufficient rigidity and lightness. An inner cavity is provided inside the fixed plate, and the inner cavity is connected to the pneumatic component 60 through an air pipe. The design of the inner cavity ensures that the airflow can be evenly distributed to each adsorption port 51. The material of the flexible plate may be highly elastic rubber or silicone, which provides flexibility and buffering, and reduces damage to the wafer box 70 during the clamping process. The flexible plate can be fixedly mounted on one side of the fixed plate and can be fixed by an adhesive or a snap-on method. A plurality of adsorption ports 51 are provided on the flexible plate, and these adsorption ports 51 are connected to the corresponding positions of the inner cavity of the fixed plate. The adsorption ports 51 can be arranged in an array, for example, 5 rows and 5 columns, to ensure uniform distribution of adsorption force.

[0092] In some embodiments, the number of pressure sensors may be at least two (not shown in the figure), and the pressure sensors may be installed in the clamping plate 50, for example, close to the contact surface between the flexible plate and the wafer box 70, to ensure accurate detection of the pressure data between the clamping plate 50 and the wafer box 70. The controller may receive real-time pressure data through the pressure sensor. A threshold value data is preset inside the controller, and the threshold value is used to determine whether the pressure data between the clamping plate 50 and the wafer box 70 reaches the threshold value data. When the pressure data detected by any pressure sensor is greater than the threshold value data, the controller may generate a stop instruction and an adsorption instruction.

[0093] See also Figure 1 , Figure 2 and Figure 4 After receiving the stop command generated by the controller, the driving component 40 immediately stops driving the clamping plates 50 to approach each other to avoid damage to the wafer box 70 caused by excessive clamping. After receiving the adsorption command generated by the controller, the pneumatic component 60 starts the air pump or vacuum pump. The pneumatic component 60 introduces the air flow into the inner cavity of the fixed plate through the air pipe, and then generates a uniform adsorption force on the side of the wafer box 70 through multiple adsorption ports 51, further ensuring the stable clamping of the wafer box 70.

[0094] See also Figure 5 , when the wafer box 70 completes the processing procedure on the current machine, it needs to be transported to the target machine for the next round of processing. When transporting the wafer box 70, the target machine can be taken as the center, and the suspension temporary storage device closest to the target machine can be selected, and the wafer box 70 can be transported to the suspension temporary storage device closest to the target machine by a transport robot to complete the transport work. The suspension temporary storage device can temporarily store the wafer box 70 so that the target machine can process the wafer box 70 stored in the suspension temporary storage device in sequence. In order to realize the above-mentioned transport process, the present invention also provides a wafer box transport system to complete the transport work of the wafer box 70 by controlling the transport robot. The transport system may include a transportation system 100, a machine system 200, a storage system 300 and a general control system 400.

[0095] In some embodiments, the transport system 100 may include a transport track and a plurality of transport robots. The transport track may be arranged in a factory, and the plurality of transport robots may move back and forth along a transport direction on the transport track.

[0096] In some embodiments, the tool system 200 may include semiconductor tools, each of which may perform different process steps.

[0097] In some embodiments, the storage system 300 may include a plurality of suspended temporary storage devices, which may be distributed around the machine platform to temporarily store the wafer boxes 70 .

[0098] In one embodiment, the master control system 400 can be used to determine the location information of the current machine, the location information of the target machine, and the location information of all suspended temporary storage devices around the target machine based on the transport instructions and map information of the machine system 200; wherein the transport instructions represent transporting the wafer box 70 from the current machine to the suspended temporary storage device around the target machine; and the map information includes the location information of all machines and suspended temporary storage devices.

[0099] In one embodiment, the master control system 400 may be a central control system in the entire semiconductor production process, responsible for coordinating and managing the operations of each machine, handling robot, and suspended temporary storage device. The handling instruction may be a command generated by the machine system 200, instructing to carry the wafer box 70 from the current machine to the suspended temporary storage device around the target machine. The handling instruction may include the location information of the machine where the wafer box 70 is currently located, the location information of the machine to which the wafer box 70 needs to be carried, and the location information of the suspended temporary storage device around the target machine.

[0100] In one embodiment, the map information is a layout diagram of the entire production area, including the location information of all machines and overhead temporary storage devices. The map information may include the precise location coordinates of each machine, the precise location coordinates of each overhead temporary storage device, and the connection paths between the machines and the overhead temporary storage devices (including possible obstacles and turning points).

[0101] In one embodiment, the master control system 400 can also be used to determine a preliminary path information set from the current machine to all suspended temporary storage devices around the target machine based on the location information of the current machine, the location information of the target machine, and the location information of all suspended temporary storage devices around the target machine; the preliminary path information set includes multiple preliminary path information, and the preliminary path information includes path length information and path curvature information.

[0102] In one embodiment, the preliminary path information set is a set of multiple possible paths from the current machine to all suspended temporary storage devices around the target machine, generated by the master control system 400 based on the above-mentioned location information. The master control system 400 uses a path planning algorithm to calculate all possible paths from the current machine to each suspended temporary storage device around the target machine, and organizes all calculated paths into a preliminary path information set. Among them, the path length information refers to the total length of each preliminary path, indicating the total distance that the transport robot needs to travel from the current machine to the target suspended temporary storage device. The path curvature information refers to the curvature of each preliminary path, indicating the degree of curvature of the path. The path curvature information can help evaluate the complexity of the path and the difficulty of the transport robot traveling on the path.

[0103] In one embodiment, the master control system 400 needs to analyze the generated preliminary path information to determine whether there are obstacles on these paths. Obstacles refer to objects that may hinder the normal passage of the transport robot on the transport path, such as equipment, other transport robots, temporary obstacles, etc. The master control system 400 detects whether there are obstacles on each preliminary path through map information and real-time monitoring data. If an obstacle is detected on a preliminary path, the master control system 400 will remove this path from the candidate paths and will no longer consider using this path. If no obstacles are detected on a preliminary path, the master control system 400 will retain this path.

[0104] In one embodiment, the master control system 400 may calculate the path evaluation value of each piece of preliminary path information based on the path length information, path curvature information, and the moving speed information and steering angle information of the transport robot of each piece of preliminary path information.

[0105] In some embodiments, since there are multiple pieces of preliminary path information, it is necessary to select the best piece of preliminary path information from the multiple pieces of preliminary path information as the target path. In this embodiment, each piece of preliminary path information can be comprehensively evaluated from the perspectives of path length information, path curvature information, moving speed information of the transport robot, steering angle information, etc., for screening.

[0106] In some embodiments, the shorter the path length information, the higher the handling efficiency, but a too short path may contain more sharp turns and complex terrain, increasing the instability of the handling. Therefore, the corresponding length evaluation value P can be calculated based on the path length information of the preliminary path information and its corresponding weight coefficient. L , expressed as: P L =1 / (1+αL); where α represents the weight coefficient of the path length, and L represents the path length information.

[0107] In some embodiments, since the smaller the path curvature information, the straighter the path, and the more stable the handling process, the corresponding curvature evaluation value P can be calculated based on the path curvature information of the preliminary path information and its corresponding weight coefficient. C , expressed as: Among them, β represents the weight coefficient of path curvature, C i It is represented as the curvature of each line segment on the path, and n is represented as the number of line segments on the path.

[0108] In some embodiments, the higher the moving speed information of the transport robot, the higher the transport efficiency, but too high a moving speed information may cause vibration and impact, affecting the stability of the transport. Therefore, the corresponding speed evaluation value P can be calculated based on the moving speed information of the transport robot and its corresponding weight coefficient. V , expressed as: P V =1 / (1+γV 2 ), where γ represents the weight coefficient of the moving speed, and V represents the moving speed information.

[0109] In some embodiments, the smaller the steering angle information of the handling robot at each turn, the smaller the vibration and impact during the turn, and the more stable the handling process. Therefore, the corresponding angle evaluation value P can be calculated based on the steering angle information of the handling robot and its corresponding weight coefficient. θ , expressed as: Among them, δ represents the weight coefficient of the steering angle, θ i It is represented as the steering angle at each turn on the path, and m is the number of turns on the path.

[0110] In some embodiments, the evaluation values ​​of the above factors can be weighted and integrated to obtain the final path evaluation value. That is, based on the length evaluation value, curvature evaluation value, speed evaluation value, and angle evaluation value, the path evaluation value P of the corresponding preliminary path information is calculated, which is expressed as: P = w1 × P L +w2×P C +w3×P V +w4×P θ ; Among them, w1, w2, w3, w4 are weight coefficients, and w1+w2+w3+w4=1.

[0111] In some embodiments, the master control system 400 may be used to select preliminary path information corresponding to the optimal path evaluation value as the target path, generate and send a start instruction to the corresponding transport robot; the transport robot completes the transport of the wafer box according to the start instruction and the target path.

[0112] In some embodiments, the start instruction is a command generated by the master control system 400 to instruct the handling robot to start the handling operation. The start instruction may include target path information and handling task information. The target path information indicates the specific route and key point coordinates of the optimal path. The handling task information indicates the current position of the wafer box 70, the position information of the target suspended temporary storage device, etc. After the handling robot receives the start instruction sent by the master control system 400, it can plan a specific walking route according to the target path information in the start instruction, and finally place the wafer box 70 in the target suspended temporary storage device to complete the handling task.

[0113] In some embodiments, during the handling process, due to vibration and other situations, it is necessary to dynamically adjust the clamping force to ensure the safety and stability of the wafer box during the handling process. Therefore, the handling robot needs to adjust the clamping force in real time during the handling process.

[0114] In some embodiments, when adjusting the clamping force, it is necessary to consider the influence of parameters such as the clamping force change rate, path evaluation value, ambient humidity information, ambient temperature information, cleanliness information, and vibration intensity information of the wafer box. Specifically, the higher the path evaluation value, the more stable and safe the path, and the clamping force can be appropriately reduced; the lower the path evaluation value, the more unstable the path, and the clamping force needs to be increased. The higher the vibration intensity information, the greater the vibration during the handling process, and the clamping force needs to be increased to ensure the safety of the wafer box; the lower the vibration intensity information, the clamping force can be appropriately reduced. A clamping force change rate that is too high may cause the clamping device to wear, and the change rate needs to be appropriately reduced; a clamping force change rate that is too low may cause the clamping force to respond untimely, and the change rate needs to be appropriately increased. The higher the ambient temperature information, the material may be deformed, and the clamping force needs to be appropriately increased. The higher the ambient humidity information, the material may slide easily, and the clamping force needs to be appropriately increased. The lower the cleanliness information, the clamping surface may be contaminated, and the clamping force needs to be appropriately increased. The clamping force change rate can be calculated by the pressure sensor installed in the clamping plate 50, that is, at the first clamping, the initial clamping force change rate can be set to zero; at the subsequent clamping, the subsequent clamping force change rate can be calculated by subtracting the clamping force detected by the pressure sensor from the clamping force detected last time. Environmental humidity information, environmental temperature information, and cleanliness information can be detected by various humidity sensors, temperature sensors, and cleanliness sensors installed inside the factory. Vibration intensity information can be detected by a vibration sensor installed in the clamping plate 50.

[0115] In some embodiments, the first influence factor I of the path evaluation value on the clamping force can be calculated based on the path evaluation value and the influence coefficient. P , expressed as: I P =1 / (1+k P(1-P)); where k P Expressed as the influence coefficient of the path evaluation value.

[0116] In some embodiments, the second influence factor I of the vibration intensity information on the clamping force can be calculated based on the vibration intensity information and the influence coefficient. Vosc , expressed as: I Vosc =1+k V ×Vosc; where Vosc represents the vibration intensity information, k V Expressed as the influence coefficient of vibration intensity information.

[0117] In some embodiments, the third influencing factor I of the environmental conditions on the clamping force can be calculated based on the environmental humidity information and the influencing coefficient, the environmental temperature information and the influencing coefficient, and the cleanliness information and the influencing coefficient. E , expressed as: I E =1+K T ×(T-T0)+K H ×(H-H0)+K C ×(C-C0); where T, T0, K T They are respectively represented as ambient temperature information, reference temperature information, and the influence coefficient of ambient temperature, H, H0, and K H They are respectively represented as ambient humidity information, reference humidity information, and the influence coefficient of ambient humidity, C, C0, and K C They are respectively expressed as cleanliness information, benchmark cleanliness information, and cleanliness influence coefficient.

[0118] In some embodiments, the fourth influence factor I of the clamping force change rate on the clamping force can be calculated based on the clamping force change rate and the influence coefficient. ΔF , expressed as: I ΔF =1 / (1+k ΔF ×|ΔF|); where ΔF is the rate of change of the clamping force, k ΔF Expressed as the influence coefficient of the clamping force change rate.

[0119] In some embodiments, the target clamping force data F can be calculated based on the first influencing factor and weight coefficient, the second influencing factor and weight coefficient, the third influencing factor and weight coefficient, the fourth influencing factor and weight coefficient, and the initial clamping force data, expressed as: F = F0 × (w1' × I P +w'2×I Vosc +w'3×I E +w'4×I ΔF );Wherein, w′1, w′2, w′3, w′4 are represented as weight coefficients and w′1+w′2+w′3+w′4=1, F0 is represented as the initial clamping force data obtained based on the threshold data.

[0120] In some embodiments, after calculating the target clamping force data, the controller may adjust the clamping force between the clamping plate 50 and the wafer box 70 by adjusting the working state of the driving component.

[0121] See also Figure 6 The present invention also provides a method for transporting a wafer box, which can be applied to the above-mentioned transport system. The transport method may include the following steps:

[0122] Step S10, determining the location information of the current machine, the location information of the target machine, and the location information of all suspended temporary storage devices around the target machine according to the transport instruction and map information of the machine system; wherein the transport instruction indicates that the wafer box is transported from the current machine to the suspended temporary storage device around the target machine; and the map information includes the location information of all machines and suspended temporary storage devices;

[0123] Step S20, based on the location information of the current machine, the location information of the target machine, and the location information of all suspended temporary storage devices around the target machine, determining a plurality of preliminary path information from the current machine to all suspended temporary storage devices around the target machine; wherein the preliminary path information includes path length information and path curvature information;

[0124] Step S30, calculating a path evaluation value of each piece of preliminary path information based on the path length information, path curvature information, moving speed information, and steering angle information of the transport robot;

[0125] Step S40, selecting the preliminary path information corresponding to the optimal path evaluation value as the target path, generating and sending a start instruction to the corresponding transport robot; the transport robot completes the transport of the wafer box according to the start instruction and the target path.

[0126] It can be seen that in the above scheme, the clamping force can be adjusted in real time through the intelligent force control system to ensure that the wafer box will not be crushed due to excessive force, nor will it be clamped unstably due to insufficient force. Accurate force control can avoid the risk of wafer box debris contamination and crushing caused by improper force, and protect the integrity and cleanliness of the wafer. By adjusting the force in real time, it is ensured that the clamping device can firmly clamp the wafer box in all situations, reducing the risk of slipping and falling.

[0127] The embodiments of the present invention disclosed above are only used to help illustrate the present invention. The embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A wafer box handling system, characterized in that: include: A transport system, including a transport track and multiple transport robots; A machine system, including multiple machines; The storage system includes a plurality of suspended temporary storage devices, wherein the suspended temporary storage devices are distributed around the machine platform; as well as The master control system is used to determine the location information of the current machine, the location information of the target machine, and the location information of all suspended temporary storage devices around the target machine according to the transport instruction and map information of the machine system; wherein the transport instruction indicates that the wafer box is transported from the current machine to the suspended temporary storage device around the target machine; and the map information includes the location information of all machines and suspended temporary storage devices; The master control system is further used to determine a plurality of preliminary path information from the current machine to all suspended temporary storage devices around the target machine based on the position information of the current machine, the position information of the target machine, and the position information of all suspended temporary storage devices around the target machine; the preliminary path information includes path length information and path curvature information; The master control system is further used to calculate a path evaluation value of each piece of the preliminary path information based on the path length information, the path curvature information, the moving speed information, and the steering angle information of the transport robot of each piece of the preliminary path information; The master control system is also used to select the preliminary path information corresponding to the optimal path evaluation value as the target path, generate and send a start instruction to the corresponding transport robot; the transport robot completes the transport of the wafer box according to the start instruction and the target path.

2. The wafer box transport system according to claim 1, characterized in that: The master control system calculates the path evaluation value according to the following steps: Based on the path length information of the preliminary path information and its corresponding weight coefficient, the corresponding length evaluation value P is calculated. L , expressed as: P L =1 / (1+αL); where α represents the weight coefficient of the path length, and L represents the path length information; Based on the path curvature information of the preliminary path information and its corresponding weight coefficient, the corresponding curvature evaluation value P is calculated. C , expressed as: Among them, β represents the weight coefficient of path curvature, C i It is represented as the curvature of each line segment on the path, and n is represented as the number of line segments on the path; Based on the moving speed information of the transport robot and its corresponding weight coefficient, the corresponding speed evaluation value P is calculated. V , expressed as: P V =1 / (1+γV 2 ), where γ represents the weight coefficient of the moving speed, and V represents the moving speed information; Based on the steering angle information of the handling robot and its corresponding weight coefficient, the corresponding angle evaluation value P is calculated. θ , expressed as: Among them, δ represents the weight coefficient of the steering angle, θ i It is represented as the turning angle at each turn on the path, and m is represented as the number of turns on the path; Based on the length evaluation value, the curvature evaluation value, the speed evaluation value, and the angle evaluation value, a path evaluation value P of the corresponding preliminary path information is calculated, which is expressed as: P=w1×P L +w2×P C +w3×P V +w4×P θ ; Among them, w1, w2, w3, w4 are weight coefficients, and w1+w2+w3+w4=1.

3. The wafer box transport system according to claim 1, characterized in that: The handling robot is used to adjust the clamping force during the handling process according to the following steps: Obtain information on ambient humidity, ambient temperature, cleanliness, and vibration intensity of the wafer box during transportation; Based on the path evaluation value and the influence coefficient, calculate the first influence factor I of the path evaluation value on the clamping force P , expressed as: I P =1 / (1+k P (1-P)); where k P It is expressed as the influence coefficient of the path evaluation value; Based on the vibration intensity information and the influence coefficient, calculate the second influence factor I of the vibration intensity information on the clamping force Vosc , expressed as: I Vosc =1+k V ×Vosc; where Vosc represents the vibration intensity information, k V The influence coefficient expressed as vibration intensity information; Based on the environmental humidity information and the influence coefficient, the environmental temperature information and the influence coefficient, and the cleanliness information and the influence coefficient, calculate the third influence factor I of the environmental conditions on the clamping force E , expressed as: I E =1+K T ×(T-T0)+K H ×(H-H0)+K C ×(C-C0); where T, T0, K T They are respectively represented as ambient temperature information, reference temperature information, and the influence coefficient of ambient temperature, H, H0, and K H They are respectively represented as ambient humidity information, reference humidity information, and the influence coefficient of ambient humidity, C, C0, and K C They are respectively expressed as cleanliness information, reference cleanliness information, and cleanliness influence coefficient; Based on the clamping force change rate and the influence coefficient, the fourth influence factor I of the clamping force change rate on the clamping force is calculated. ΔF , expressed as: I ΔF =1 / (1+k ΔF ×|ΔF|); where ΔF is the rate of change of the clamping force, k ΔF Expressed as the influence coefficient of the clamping force change rate; Based on the first influencing factor and weight coefficient, the second influencing factor and weight coefficient, the third influencing factor and weight coefficient, the fourth influencing factor and weight coefficient, and the initial clamping force data, the target clamping force data F is calculated, which is expressed as: F=F0×(w1'×I P +w'2×I Vosc +w'3×I E +w'4×I ΔF ), wherein w′1, w′2, w′3, w′4 represent weight coefficients and w′1+w′2+w′3+w′4=1, and F0 represents the initial clamping force data obtained based on the threshold data; The clamping force is adjusted according to the target clamping force data.

4. The wafer box transport system according to claim 1, characterized in that: The handling robot comprises: The vehicle body is located on the transport track; A placement platform, installed on the vehicle body, for placing a wafer box; A driving assembly is installed on the placement platform; At least two clamping plates are connected to the output end of the driving component, and the driving component drives the clamping plates to move closer to or farther from each other; on the contact surface between the clamping plates and the wafer box, one of the clamping plates is provided with a plurality of suction ports; At least two pressure sensors are respectively installed in the clamping plate and are used to detect pressure data between the clamping plate and the wafer box; a pneumatic component connected to the suction port; and A controller, used for judging the magnitude of the pressure data and the threshold data: when the pressure data is greater than the threshold data, generating a stop instruction and an adsorption instruction; Wherein, the driving component stops driving the clamping plates to approach each other according to the stop instruction; the pneumatic component is started according to the adsorption instruction to adsorb the side of the wafer box through the adsorption port.

5. The wafer box transport system according to claim 4, characterized in that: The clamping plate comprises: a fixed plate, wherein an inner cavity is provided therein, and the inner cavity is communicated with the pneumatic component; and A flexible plate, fixedly mounted on one side of the fixed plate; Wherein, the adsorption port is opened at the corresponding position of the flexible plate and the fixed plate.

6. The wafer box transport system according to claim 4, characterized in that: The drive assembly comprises: A clamping shell is installed on the placement platform, and a guide rail is fixed inside the clamping shell; Two racks are slidably mounted on the guide rail, and the two clamping plates are respectively mounted on different racks; Two sector gears are pivotally mounted in the clamping housing, and the sector gears are respectively meshed with corresponding racks; Two swing rods, respectively fixedly connected to corresponding sector gears; and The driving structure is installed in the clamping shell, and its output end is respectively connected with two swing rods to drive the sector gear to rotate.

7. The wafer box transport system according to claim 4, characterized in that: The driving structure comprises: A driving member, fixedly mounted in the clamping housing; and A connecting rod, one side of the central part of the connecting rod is connected to the movable end of the driving member, the two ends of the connecting rod are respectively pivotally connected to one end of the two transmission rods, and the other ends of the two transmission rods are respectively pivotally connected to one end of the corresponding swing rods.

8. The wafer box transport system according to claim 7, characterized in that: The driving member comprises: A driving motor is fixedly installed in the clamping housing; A lead screw connected to the rotating end of the drive motor; and A linear guide rail is slidably installed in the clamping shell, and the linear guide rail cooperates with the lead screw; the linear guide rail is connected to the connecting rod.

9. The wafer box transport system according to claim 4, characterized in that: It also includes a lifting component, the fixed end of the lifting component is fixedly installed on the vehicle body, and the placement platform is fixedly installed on the movable end of the lifting component.

10. A method for transporting a wafer box, characterized in that: include: According to the transport instructions and map information of the machine system, the location information of the current machine, the location information of the target machine, and the location information of all suspended temporary storage devices around the target machine are determined; wherein the transport instructions represent transporting the wafer box from the current machine to the suspended temporary storage device around the target machine; and the map information includes the location information of all machines and suspended temporary storage devices; Based on the position information of the current machine, the position information of the target machine, and the position information of all suspended temporary storage devices around the target machine, a plurality of preliminary path information from the current machine to all suspended temporary storage devices around the target machine is determined; the preliminary path information includes path length information and path curvature information; Calculate a path evaluation value of each piece of the preliminary path information based on the path length information, the path curvature information, the moving speed information, and the steering angle information of the transport robot; The preliminary path information corresponding to the optimal path evaluation value is selected as the target path, and a start instruction is generated and sent to the corresponding transport robot; the transport robot completes the transport of the wafer box according to the start instruction and the target path.

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