Equipment and method for winding, coating and electrostatic adsorption

Abstract

The invention relates to the field of vacuum coating, in particular to a winding coating electrostatic adsorption device and method, the winding coating electrostatic adsorption device comprises a main drum and a base material wound on the main drum, the base material is wound on part of the side wall of the main drum, and the winding coating electrostatic adsorption device further comprises a shell which surrounds devices of the winding coating electrostatic adsorption device and is connected with a vacuum pump, the vacuum device is used for keeping the interior of the winding coating electrostatic adsorption equipment vacuum; the evaporation source is arranged on the outer side of the part, wound with the base material, of the main drum and used for enabling evaporated particles to be condensed on the surface of the base material to form a film; the placing assembly is used for providing a movement route for the base material; the electron gun is arranged on the outer side of the base material non-winding part of the main drum and is used for emitting electrons to the main drum; and the insulating coating is uniformly coated on the outer surface of the main drum and is propped against the non-coated surface of the base material. According to the invention, the adsorption effect between the base material and the main drum can be improved, so that the film coating effect is improved.

Description

Technical Field

[0001] The present application relates to the field of vacuum coating, and in particular to a device and method for electrostatic adsorption of roll coating. Background Art

[0002] Vacuum evaporation refers to a process in which a certain heating evaporation method is used to evaporate the coating material under vacuum conditions and gasify it, and the evaporated particles fly to the surface of the substrate and condense into a film. Evaporation is an earlier and more widely used vapor deposition technology, with the advantages of simple film formation method, high film purity and density, and unique film structure and performance.

[0003] At present, a roll-to-roll vacuum film-forming device is used, which includes an electron beam irradiator, an auxiliary roller, a DC bias power supply and a de-static unit. The electron beam irradiator is arranged between the unwinding roller and the evaporation source to irradiate the charged particles to the substrate; the auxiliary roller is arranged between the cooling main drum and the winding roller, and contacts the film-forming surface of the substrate to guide the movement of the substrate; the DC bias power supply applies a DC voltage between the main drum and the auxiliary roller; the de-static unit is arranged between the main drum and the winding roller to de-static the substrate, and the de-static unit is composed of a DC diode discharge type plasma source with one pole grounded. This roll-to-roll vacuum film-forming device can suppress the thermal deformation of the insulating raw material film, form the film at a high speed, and improve production efficiency.

[0004] However, due to the limitation of substrate material and the limited spraying area of ​​the electron beam irradiator, the electron energy and quantity are limited, resulting in poor adsorption between the substrate and the main drum, which affects the coating effect. Summary of the invention

[0005] In order to improve the adsorption effect between the substrate and the main drum, thereby improving the coating effect, the present application provides a device and method for electrostatic adsorption of winding coating.

[0006] On the one hand, the present application provides a winding coating electrostatic adsorption device adopts the following technical solution: A winding coating electrostatic adsorption device comprises a main drum and a substrate wound on the main drum, wherein the substrate is wound on a part of the side wall of the main drum, and further comprises: The shell surrounds the components of the winding coating electrostatic adsorption device and is connected to a vacuum pump to maintain a vacuum inside the winding coating electrostatic adsorption device; An evaporation source is arranged outside the portion of the main drum where the substrate is wound, and is used to make the evaporated particles condense into a film on the surface of the substrate; placing components for providing a movement route for the substrate; An electron gun, arranged outside the non-winding substrate portion of the main drum, for emitting electrons toward the main drum; The insulating coating is evenly coated on the outer surface of the main drum and abuts against the non-coated surface of the substrate.

[0007] By adopting the above technical solution, during coating, electrons are emitted to the main drum through an electron gun, forming a negative potential on the main drum. The negative potential on the main drum will induce an opposite positive charge on the substrate. The positive charge and the negative charge form electrostatic adsorption through the Coulomb force, thereby improving the adhesion between the substrate and the main drum, thereby improving the coating effect.

[0008] Optionally, the insulating coating is set to be an insulating coating of semiconductor ceramic or pure insulating ceramic.

[0009] By adopting the above technical solution, semiconductor ceramics are low-resistance materials. Considering that resistivity will also affect the adsorption of positive and negative charges, semiconductor ceramics with low resistance materials are selected. If ordinary ceramic materials are selected, although they can also meet the needs, they may affect the adsorption effect between the main drum 2 and the substrate 3 due to high resistance and thus high resistivity, so semiconductor ceramic materials are preferred.

[0010] Optionally, a metal layer is sputtered on a side of the substrate that is in contact with the main drum and / or a side of the substrate that is not in contact with the main drum.

[0011] By adopting the above technical solution, in order to achieve further adsorption between the substrate and the main drum, it is necessary to pre-sputter the metal layer on at least one side of the substrate. The metal layer can better support the mutual adsorption of positive and negative charges. In the best case, the metal layer is pre-sputtered on both sides of the substrate, which can further enhance the adsorption and will not affect the subsequent coating.

[0012] Optionally, the portion of the main drum that is not wound around the substrate faces upward or to both sides, and the evaporation source is arranged below the substrate.

[0013] By adopting the above technical solution, the evaporation source is set below the substrate so that the evaporated coating material can completely contact the substrate when moving upward, while the part of the main drum that is not wrapped around the substrate faces upward or to both sides, so that the electron gun can emit electrons to the main drum without affecting the evaporation of the coating material by the evaporation source.

[0014] Optionally, the electron gun is arranged directly above the main shaft of the main drum, and the electron gun is arranged to be a scanning electron gun.

[0015] By adopting the above technical solution, electrons are sprayed on the main drum, which reduces the damage of electrons to the substrate. The obtained sample has lower mechanical strength loss. Only negative voltage induced potential is presented on the main drum. The negative charge on the substrate is repelled, leaving only positive charge. The electron gun adopts scanning type, and the scanning range covers the width of the substrate on the main drum, thereby ensuring uniform potential on the main drum.

[0016] Optionally, the main shaft of the main drum is insulated from the cavity formed in the shell, and a bias voltage is applied to both ends of the main shaft of the main drum, with the value range of the bias voltage being 0-1000V.

[0017] By adopting the above technical solution, the main drum and the cavity are insulated, so that the outside will not affect the bonding between the main drum and the substrate, and a bias voltage is applied to both ends of the main drum to further improve the adsorption effect between the main drum and the substrate. The bias voltage is set not to exceed 1000V to avoid excessive bias voltage causing sparks in the insulating layer on the surface of the main drum.

[0018] Optionally, the placement assembly includes a winding roller arranged in the shell, a winding roller arranged on the side of the main drum away from the winding roller, and auxiliary rollers arranged between the winding roller and the main drum and between the winding roller and the main drum.

[0019] By adopting the above technical solution, when preparation is completed, the unwinding roller, main drum, winding roller and auxiliary roller are respectively installed in the outer shell, and the substrate is wound once in the order of the unwinding roller, auxiliary roller, main drum and winding roller, so that the coated substrate can be finally wound on the winding roller along the auxiliary roller to realize the collection of the substrate.

[0020] On the other hand, the present application provides a winding coating electrostatic adsorption device adopts the following technical solution: Optional, include the following steps: S1. Pre-plating of substrate: a metal layer is pre-sputtered on the substrate to be bonded to the main drum surface. The material of the metal layer is not limited to one or more alloys of Ni, Cr, Cu, Al, C, Ti, and Ta; S2. Main drum coating: A layer of insulating coating is applied on the surface of the main drum. The insulating coating is made of semiconductor ceramic or pure insulating ceramic material. The semiconductor material or pure insulating ceramic material is one of Al2O3, AlN, SiO2, TiO2, ZrO2 or a mixed compound material; S3, spindle processing: applying bias voltage to both sides of the spindle of the main drum; S4, coating preparation: install various components in the housing, install the unwinding roller, main drum, auxiliary roller and winding roller in the housing in sequence, and wind the substrate along the unwinding roller, main drum, auxiliary roller and winding roller in sequence; S5. Start coating: Place the coating material into the evaporation source, connect the housing to the vacuum pump, and then start coating.

[0021] By adopting the above technical solution, preparation work needs to be done before coating. Now a metal layer is pre-sputtered on the surface of the substrate, thereby increasing the mutual attraction between the positive charge on the substrate and the negative charge on the main drum, thereby improving the adhesion between the substrate and the main drum. Then an insulating coating is applied to the surface of the main drum to ensure that the substrate and the main drum can fit closely in the future, and then the components are installed together to start coating.

[0022] Optionally, a metal layer is pre-sputtered on the surface of the substrate that is bonded to the main drum, including the steps of: then pre-sputtering a metal layer on the surface of the substrate that is not bonded to the main drum, and the material of the metal layer includes but is not limited to one or more alloys of Ni, Cr, Cu, Al, C, Ti and Ta.

[0023] By adopting the above technical solution, a metal layer is pre-sputtered on the surface of the substrate that is not bonded to the main drum, thereby further increasing the mutual attraction between the positive charge on the substrate and the negative charge on the main drum, thereby improving the bonding force between the substrate and the main drum. The alloy selected as the material of the metal layer is resistant to high temperatures and has no effect on subsequent coating, so that the film of the evaporated material can be smoothly plated on the substrate.

[0024] Optionally, placing the coating material into an evaporation source includes the following steps: coating methods suitable for winding coating electrostatic adsorption equipment include but are not limited to magnetron sputtering winding coating, wire feeding evaporation winding coating, induction evaporation winding coating and electron beam evaporation winding coating.

[0025] By adopting the above technical solution, during coating, the coating material is placed in an evaporation source for evaporation. There are many applicable evaporation methods, which can be applicable to magnetron sputtering winding coating, wire feeding evaporation winding coating, induction evaporation winding coating and electron beam evaporation winding coating, so that the evaporation method to be used can be considered according to actual conditions.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. The shell, main drum, substrate, evaporation source, placement component, electron gun and insulating coating are set up. During coating, electrons are emitted to the main drum through the electron gun to form a negative potential on the main drum. The negative potential on the main drum will induce an opposite positive charge on the substrate. The positive and negative charges form electrostatic adsorption through Coulomb force, thereby improving the adhesion between the substrate and the main drum, thereby improving the coating effect; 2. By setting up the metal layer, in order to achieve further adsorption between the substrate and the main drum, it is necessary to pre-sputter the metal layer on at least one side of the substrate. The metal layer can better support the mutual adsorption of positive and negative charges. In the best case, the metal layer is pre-sputtered on both sides of the substrate, which can further enhance the adsorption and will not affect the subsequent coating; 3. By setting up the unwinding roller, winding roller and auxiliary roller, when preparation is completed, the unwinding roller, main drum, winding roller and auxiliary roller are respectively installed in the outer shell, and the substrate is wound once in the order of the unwinding roller, auxiliary roller, main drum and winding roller, so that the coated substrate can be finally wound on the winding roller along the auxiliary roller to realize the collection of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of this application.

[0028] Figure 2 It is a flow chart of the present application method.

[0029] Explanation of the reference numerals: 1. outer shell; 2. main drum; 3. substrate; 4. evaporation source; 5. placement component; 51. unwinding roller; 52. winding roller; 53. auxiliary roller; 6. electron gun; 7. insulating coating; 8. metal layer. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1-2 This application is described in further detail.

[0031] The embodiments of the present application disclose an apparatus and method for electrostatic adsorption of a winding coating.

[0032] Reference Figure 1 , a device and method for electrostatic adsorption of winding coating includes a shell 1, a main drum 2, a substrate 3 wound on the main drum 2, an evaporation source 4, a placement component 5 for providing a movement route for the substrate 3, an electron gun 6, and an insulating coating 7 on the main drum 2, and the substrate 3 is wound on part of the side wall of the main drum 2. The shell 1 surrounds the components of the electrostatic adsorption device for winding coating, and one side of the shell 1 is connected to the outside and connected to a vacuum pump to keep the inside of the electrostatic adsorption device for winding coating in a vacuum. The evaporation source 4 is arranged on the outside of the part of the main drum 2 where the substrate 3 is wound, and is used to make the evaporated particles condense into a film on the surface of the substrate 3. The electron gun 6 is arranged on the outside of the part of the main drum 2 where the substrate 3 is not wound, and is used to emit electrons to the main drum 2.

[0033] During coating, electrons are emitted to the main drum 2 through the electron gun 6, forming a negative potential on the main drum 2. The negative potential on the main drum 2 will induce an opposite positive charge on the substrate 3. The positive charge and the negative charge form electrostatic adsorption through the Coulomb force, thereby improving the adhesion between the substrate 3 and the main drum 2, thereby improving the coating effect.

[0034] Reference Figure 1The insulating coating 7 is evenly coated on the outer surface of the main drum 2, and the outer surface of the insulating coating 7 abuts against the non-coated surface of the substrate 3. The insulating coating 7 is set as a semiconductor ceramic or pure insulating ceramic insulating coating 7. Specifically, the semiconductor material or pure insulating ceramic is a low-resistance material formed by doping Al2O3, AlN, SiO2, TiO2, and ZrO2.

[0035] Semiconductor ceramics are low-resistance materials. Considering that resistivity also affects the adsorption of positive and negative charges, semiconductor ceramics with low resistance materials are selected. If ordinary ceramic materials are selected, although they can also meet the requirements, they may affect the adsorption effect between the main drum 2 and the substrate 3 due to high resistance and high resistivity. In addition, semiconductor ceramic materials are doped with multiple materials to form low-resistance materials, which further enhances the adsorption effect between positive and negative charges, so semiconductor ceramic materials are preferred.

[0036] Reference Figure 1 At least one side of the substrate 3 is pre-sputtered with a metal layer 8, that is, the side of the substrate 3 that is in contact with the main drum 2 and / or the side of the substrate 3 that is not in contact with the main drum 2 is sputtered with a metal layer 8. In order to better improve the adsorption effect between the main drum 2 and the substrate 3, it is better to sputter the metal layer 8 on both sides of the substrate 3.

[0037] In order to achieve further adsorption between the substrate 3 and the main drum 2, it is necessary to pre-sputter the metal layer 8 on at least one side of the substrate 3. The metal layer 8 can better support the mutual adsorption of positive and negative charges. In the best case, the metal layer 8 is pre-sputtered on both sides of the substrate 3, which can further enhance the adsorption and will not affect the subsequent coating.

[0038] In order to facilitate the evaporation of the coating material by the evaporation source 4, the evaporation source 4 is arranged below the substrate 3. Therefore, the portion of the main drum 2 not wound with the substrate 3 faces upward or to the sides, which is used to leave a position for the electron gun 6 to emit electrons to the main drum 2. In the drawings of the present application, the portion of the main drum 2 not wound with the substrate 3 faces upward.

[0039] The evaporation source 4 is set below the substrate 3 so that the evaporated coating material can completely contact the substrate 3 when moving upward, and the part of the main drum 2 that is not wrapped around the substrate 3 is facing upward or to both sides, so that the electron gun 6 can emit electrons to the main drum 2 without affecting the evaporation of the coating material by the evaporation source 4.

[0040] Reference Figure 1 The main shaft of the main drum 2 is insulated from the cavity formed in the shell 1, and a bias voltage is applied to both ends of the main shaft of the main drum 2, and the value range of the bias voltage is 0-1000V.

[0041] The main drum 2 is insulated from the cavity, so that the outside will not affect the adhesion between the main drum 2 and the substrate 3, and a bias voltage is applied to both ends of the main drum 2 to further improve the adsorption effect between the main drum 2 and the substrate 3. The bias voltage is set not to exceed 1000V to avoid excessive bias voltage causing sparks on the insulating layer on the surface of the main drum 2. Only negative voltage induced potential is presented on the main drum 2, and the negative charge on the substrate 3 is repelled, leaving only positive charge.

[0042] The electron gun 6 is arranged just above the main drum 2 where the substrate 3 is not wound, and the electron gun 6 is a scanning electron gun 6. By spraying electrons on the main drum 2, the damage of the electrons to the substrate 3 is reduced, and the obtained sample has a lower mechanical strength loss. In addition, the electron gun 6 is scanning, and the scanning range covers the width of the substrate 3 on the main drum 2, ensuring that the potential on the main drum 2 is uniform.

[0043] The placement assembly 5 includes a winding roller 51 disposed in the housing 1, a take-up roller 52 disposed on the side of the main drum 2 away from the winding roller 51, and an auxiliary roller 53 disposed between the winding roller 51 and the main drum 2, and between the take-up roller 52 and the main drum 2. When the preparation is completed, the winding roller 51, the main drum 2, the take-up roller 52 and the auxiliary roller 53 are respectively installed in the housing 1, and the substrate 3 is wound once in the order of the winding roller 51, the auxiliary roller 53, the main drum 2, and the take-up roller 52, so that the coated substrate 3 can be finally wound on the take-up roller 52 along the auxiliary roller 53, so that the substrate 3 is collected.

[0044] Reference Figure 2 The present application provides a winding coating electrostatic adsorption device adopts the following technical solution: comprising the steps of: S1, pre-plating of substrate 3: pre-sputtering a metal layer 8 on the surface of substrate 3 attached to main drum 2, the material of metal layer 8 is but not limited to one or more alloys of Ni, Cr, Cu, Al, C, Ti, Ta; S11. Then, a metal layer 8 is pre-sputtered on the surface of the substrate 3 that is not in contact with the main drum 2. The material of the metal layer 8 includes but is not limited to one or more alloys of Ni, Cr, Cu, Al, C, Ti and Ta.

[0045] A metal layer 8 is pre-sputtered on the surface of the substrate 3 that is not in contact with the main drum 2, thereby further increasing the mutual attraction between the positive charges on the substrate 3 and the negative charges on the main drum 2, thereby improving the adhesion between the substrate 3 and the main drum 2. The alloy selected for the metal layer 8 is resistant to high temperatures and has no effect on subsequent coating, so that the film of the evaporated material can be smoothly plated on the substrate 3.

[0046] S2, coating of main drum 2: a layer of insulating coating 7 is applied on the surface of main drum 2, the insulating coating 7 is selected from semiconductor ceramics or pure insulating ceramic materials, the semiconductor material or pure insulating ceramic material is one of Al2O3, AlN, SiO2, TiO2, ZrO2 or a mixed compound material; S3, spindle processing: applying bias voltage to both sides of the spindle of the main drum 2; S4, coating preparation: install various components in the housing 1, install the unwinding roller 51, the main drum 2, the auxiliary roller 53 and the winding roller 52 in the housing 1 in sequence, and wind the substrate 3 along the unwinding roller 51, the main drum 2, the auxiliary roller 53 and the winding roller 52 in sequence; S5, start coating: put the coating material into the evaporation source 4, connect the housing 1 to the vacuum pump, and then start coating.

[0047] S51. Coating methods suitable for winding coating electrostatic adsorption equipment include but are not limited to magnetron sputtering winding coating, wire feeding evaporation winding coating, induction evaporation winding coating and electron beam evaporation winding coating.

[0048] During coating, the coating material is placed in the evaporation source 4 for evaporation. There are many applicable evaporation methods, which can be applied to magnetron sputtering winding coating, wire feeding evaporation winding coating, induction evaporation winding coating and electron beam evaporation winding coating, so the evaporation method to be used can be considered according to actual conditions.

[0049] Before coating, preparation work needs to be done. Now, a metal layer 8 is pre-sputtered on the contact surface of the substrate 3, thereby increasing the mutual attraction between the positive charge on the substrate 3 and the negative charge on the main drum 2, thereby improving the adhesion between the substrate 3 and the main drum 2. Then, an insulating coating 7 is applied to the surface of the main drum 2 to ensure that the substrate 3 and the main drum 2 can fit tightly in the future. Then, the components are installed together to start coating.

[0050] The implementation principle of the device and method for electrostatic adsorption of winding coating in the embodiment of the present application is as follows: preparation work needs to be done before coating. A metal layer 8 is pre-sputtered on the contact surface of the substrate 3, thereby increasing the mutual attraction between the positive charge on the substrate 3 and the negative charge on the main drum 2, thereby improving the adhesion between the substrate 3 and the main drum 2. During coating, electrons are emitted to the main drum 2 through the electron gun 6 to form a negative potential on the main drum 2. The negative potential on the main drum 2 will induce an opposite positive charge on the substrate 3, and electrostatic adsorption is formed between the positive charge and the negative charge through the Coulomb force, thereby improving the adhesion between the substrate 3 and the main drum 2, thereby improving the coating effect.

[0051] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A device for electrostatic adsorption of winding coating, comprising a main drum (2) and a substrate (3) wound on the main drum (2), wherein the substrate (3) is wound on a part of the side wall of the main drum (2), characterized in that: Also includes: The outer shell (1) surrounds the components of the roll-to-roll coating electrostatic adsorption device and is connected to a vacuum pump to maintain a vacuum inside the roll-to-roll coating electrostatic adsorption device; An evaporation source (4) is arranged outside the portion of the main drum (2) on which the substrate (3) is wound, and is used to cause evaporated particles to condense into a film on the surface of the substrate (3); A placement component (5) is used to provide a movement route for the substrate (3); an electron gun (6) disposed outside the non-winding substrate (3) portion of the main drum (2) and used for emitting electrons toward the main drum (2); The insulating coating (7) is evenly coated on the outer surface of the main drum (2) and abuts against the non-coated surface of the substrate (3).

2. The device for electrostatic adsorption of winding coating according to claim 1, characterized in that: The insulating coating (7) is configured as an insulating coating (7) of semiconductor ceramic or pure insulating ceramic.

3. The device for electrostatic adsorption of winding coating according to claim 1, characterized in that: A metal layer (8) is sputtered on the side of the substrate (3) that is in contact with the main drum (2) and / or the side of the substrate (3) that is not in contact with the main drum (2).

4. The device for electrostatic adsorption of winding coating according to claim 3 is characterized in that: The portion of the main drum (2) that is not wound around the substrate (3) faces upward or to both sides, and the evaporation source (4) is arranged below the substrate (3).

5. The device for electrostatic adsorption of winding coating according to claim 1, characterized in that: The electron gun (6) is arranged just above the main axis of the main drum (2), and the electron gun (6) is arranged as a scanning electron gun (6).

6. The device for electrostatic adsorption of winding coating according to claim 5, characterized in that: The main shaft of the main drum (2) is insulated from the cavity formed in the housing (1), and a bias voltage is applied to both ends of the main shaft of the main drum (2), with the value range of the bias voltage being 0-1000V.

7. The device for electrostatic adsorption of winding coating according to claim 1, characterized in that: The placement assembly (5) comprises a winding roller (51) arranged in the housing (1), a winding roller (52) arranged on the side of the main drum (2) away from the winding roller (51), and an auxiliary roller (53) arranged between the winding roller (51) and the main drum (2) and between the winding roller (52) and the main drum (2).

8. The method for using the winding coating electrostatic adsorption device according to claim 7, characterized in that: Includes steps: S1. Pre-plating of the substrate (3): a metal layer (8) is pre-sputtered on the surface of the substrate (3) that is attached to the main drum (2), wherein the material of the metal layer (8) includes but is not limited to one or more alloys of Ni, Cr, Cu, Al, C, Ti, and Ta; S2, coating of the main drum (2): a layer of insulating coating (7) is applied on the surface of the main drum (2), wherein the insulating coating (7) is made of semiconductor ceramic or pure insulating ceramic material, wherein the semiconductor material or pure insulating ceramic material is one of Al2O3, AlN, SiO2, TiO2, ZrO2 or a compound material formed by mixing them; S3, spindle processing: applying a bias voltage to both sides of the spindle of the main drum (2); S4, coating preparation: installing various components in the housing (1), installing the unwinding roller (51), the main drum (2), the auxiliary roller (53) and the winding roller (52) in sequence in the housing (1), and winding the substrate (3) along the unwinding roller (51), the main drum (2), the auxiliary roller (53) and the winding roller (52) in sequence; S5, start coating: put the coating material into the evaporation source (4), connect the housing (1) to the vacuum pump, and then start coating.

9. The method for using the winding coating electrostatic adsorption device according to claim 8, characterized in that: A metal layer (8) is pre-sputtered on the surface of the substrate (3) that is in contact with the main drum (2), comprising the steps of: pre-sputtering a metal layer (8) on the surface of the substrate (3) that is not in contact with the main drum (2), wherein the material of the metal layer (8) includes but is not limited to one or more alloys of Ni, Cr, Cu, Al, C, Ti and Ta.

10. The device and method for electrostatic adsorption of winding coating according to claim 8, characterized in that: Placing the coating material into the evaporation source (4) comprises the following steps: coating methods applicable to the winding coating electrostatic adsorption equipment include but are not limited to magnetron sputtering winding coating, wire feeding evaporation winding coating, induction evaporation winding coating and electron beam evaporation winding coating.

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