Fan assembly, heat dissipation module and electronic device

Abstract

The invention provides a fan assembly, a heat dissipation module and an electronic device. The fan assembly comprises a shell, a fan blade and a wind shielding piece. The shell is provided with an inner surface, an air inlet and at least two air outlets. The inner surface is connected to the at least two air outlets. The air inlet is communicated with the at least two air outlets. The fan blades are rotatably arranged on the shell. The inner surface faces the fan blade. The wind shielding piece is arranged on one of the at least two air outlets and provided with a wind collecting face. The wind collecting face faces the fan blades. The wind collecting face is connected to the inner surface. A gap is formed between the air collecting face and the fan blade and between the inner surface and the fan blade. The gaps are gradually expanded in the rotating direction of the fan blades. The wind shielding piece is used for guiding airflow guided by the fan blades to the other one of the at least two air outlets through the gap.

Description

Technical Field

[0001] The invention relates to an air cooling component, and in particular to a fan component, a heat dissipation module and an electronic device comprising the fan component. Background Art

[0002] In order to dissipate the large amount of waste heat generated by heat sources such as the CPU or GPU, a heat dissipation module is usually installed in a laptop computer. The heat dissipation module usually includes a heat pipe, a heat sink fin, and a fan. The heat pipe is used to effectively transfer the heat generated by the heat source to the heat sink fin. The fan is used to guide the cold air to cool the heat sink fin, so that the heat can be effectively dissipated to the outside of the laptop computer through the large surface area of ​​the heat sink fin.

[0003] However, in recent years, laptops have been developing towards a trend of becoming thinner and lighter. Therefore, the components in the laptop must be arranged in a very dense manner, which makes it inevitable that components adjacent to the fan, such as heat pipes, block part of the fan's air outlet. As a result, the fan cannot show its original heat dissipation performance. Summary of the invention

[0004] The object of the present invention is to provide a fan assembly, a heat dissipation module and an electronic device, which guide the airflow guided by the fan blades to another air outlet through a wind shielding member, so as to maximize the original heat dissipation performance of the fan assembly.

[0005] A fan assembly disclosed in an embodiment of the present invention includes a housing, a fan blade and a wind shield. The housing has an inner surface, an air inlet and at least two air outlets. The inner surface is connected to the at least two air outlets. The air inlet is connected to the at least two air outlets. The fan blade is rotatably disposed on the housing. The inner surface faces the fan blade. The wind shield is disposed on one of the at least two air outlets and has a wind collecting surface. The wind collecting surface faces the fan blade. The wind collecting surface is connected to the inner surface. The wind collecting surface and the inner surface together form a gap with the fan blade. The gap gradually expands along a rotation direction of the fan blade. The wind shield is used to guide an airflow guided by the fan blade to another of the at least two air outlets through the gap.

[0006] A heat dissipation module disclosed in another embodiment of the present invention includes a fan assembly, at least one heat dissipation fin group and a baffle. The fan assembly includes a shell, a fan blade and a wind shield. The shell has an inner surface, an air inlet and at least two air outlets. The inner surface is connected to the at least two air outlets. The air inlet is connected to the at least two air outlets. The fan blade is rotatably arranged on the shell. The inner surface faces the fan blade. The wind shield is arranged at one of the at least two air outlets and has a wind collecting surface. The wind collecting surface faces the fan blade. The wind collecting surface is connected to the inner surface. The wind collecting surface and the inner surface together form a gap with the fan blade. The gap gradually expands along a rotation direction of the fan blade. The wind shield is used to guide an airflow guided by the fan blade to another of the at least two air outlets through the gap. At least one heat dissipation fin group is adjacent to one of the at least two air outlets. The baffle shields at least a portion of the air outlet where the wind shield is arranged.

[0007] The electronic device disclosed in another embodiment of the present invention includes a housing, a motherboard assembly, a fan assembly, at least one heat sink fin group and a baffle. The motherboard assembly includes a motherboard and at least one heat source. The motherboard is arranged in the housing. The heat source is arranged on the motherboard. The fan assembly is arranged in the housing and includes a shell, a fan blade and a wind shield. The shell has an inner surface, an air inlet and at least two air outlets. The inner surface is connected to the at least two air outlets. The air inlet is connected to the at least two air outlets. The fan blade is rotatably arranged in the shell. The inner surface faces the fan blade. The wind shield is arranged on one of the at least two air outlets and has a wind collecting surface. The wind collecting surface faces the fan blade. The wind collecting surface is connected to the inner surface. The wind collecting surface and the inner surface together form a gap with the fan blade. The gap gradually expands along a rotation direction of the fan blade. The wind shield is used to guide an airflow guided by the fan blade to another of the at least two air outlets through the gap. At least one heat dissipation fin group is arranged in the housing and adjacent to one of the at least two air outlets. The flow blocking member is arranged in the housing and shields at least a part of the air outlet where the wind shielding member is arranged.

[0008] According to the fan assembly, heat dissipation module and electronic device disclosed in the above embodiments, since the gap gradually expands along the rotation direction of the fan blade, the wind shielding member can guide the airflow guided by the fan blade to the other of the at least two air outlets as much as possible through the gap. In this way, when the air outlet provided with the wind shielding member is inevitably blocked by an adjacent element such as a spoiler, the wind shielding member will guide the wind that would have been blocked by the spoiler to the other air outlet as much as possible, so that the fan assembly can show its original heat dissipation performance as much as possible. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 FIG. 1 is a schematic side view of an electronic device according to a first embodiment of the present invention.

[0010] Figure 2 for Figure 1A three-dimensional diagram of a heat dissipation module of an electronic device in FIG.

[0011] Figure 3 for Figure 2 A three-dimensional view of the first fan assembly of the heat dissipation module.

[0012] Figure 4 for Figure 3 Exploded view of the first fan assembly in FIG.

[0013] Figure 5 for Figure 3 A top cross-sectional schematic diagram of the first fan assembly in FIG.

[0014] Figure 6 for Figure 2 A partially enlarged bottom view of the heat dissipation module in which the cover plate of the first fan assembly is omitted.

[0015] Figure 7 for Figure 3 A partially enlarged view of the side sectional schematic diagram of the first fan assembly in FIG.

[0016] Figure 8 for Figure 2 A three-dimensional view of the second fan assembly of the heat dissipation module.

[0017] Fig. 9 for Figure 8 Exploded view of the second fan assembly in FIG.

[0018] Fig.10 for Figure 8 A top cross-sectional schematic diagram of the second fan assembly in FIG.

[0019] Fig.11 FIG. 4 is a three-dimensional diagram of a heat dissipation module according to a second embodiment of the present invention.

[0020] Fig.12 for Fig.11 A partially enlarged bottom view of the heat dissipation module in which the cover plate of the first fan assembly is omitted.

[0021] The reference numerals are as follows:

[0022] 10: Electronic devices

[0023] 100: Chassis

[0024] 200: Motherboard components

[0025] 210: Motherboard

[0026] 220: Heat source

[0027] 300,300a: Cooling module

[0028] 400: First heat sink fin group

[0029] 450: Second heat sink fin group

[0030] 500: Flow blocking part

[0031] 600,600a: first fan assembly

[0032] 610,710: Shell

[0033] 611,711: Mounting plate

[0034] 6110,7110,6160,6170:Edge

[0035] 612,712: Side panels

[0036] 613,713: Cover

[0037] 614,714:Inner surface

[0038] 615,715: Air inlet

[0039] 616,716: Main air outlet

[0040] 617,717: Auxiliary air outlet

[0041] 620,720: fan blade

[0042] 630,730,630a: Wind shield

[0043] 631,731: Wind-gathering surface

[0044] 700: Second fan assembly

[0045] 800: Third fan assembly

[0046] A1, A21, A22, A31, A32, A4: Airflow

[0047] G1, G2: Gap

[0048] R1, R2: Rotation direction

[0049] C: Center of rotation

[0050] L1, L2: connecting line

[0051] T1, T2: outer contour

[0052] W1,W2: Width DETAILED DESCRIPTION

[0053] The detailed features and advantages of the embodiments of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable those skilled in the art to understand the technical contents of the embodiments of the present invention and implement them accordingly. According to the contents disclosed in this specification, the claims and the drawings, those skilled in the art can easily understand the relevant purposes and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.

[0054] See also Figure 1 and Figure 2 , Figure 1 FIG. 1 is a schematic side view of an electronic device according to a first embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional diagram of a heat dissipation module of an electronic device in FIG.

[0055] In this embodiment, the electronic device 10 is, for example, a notebook computer, and includes a housing 100, a motherboard assembly 200, and a heat dissipation module 300. The heat dissipation module 300 is disposed in the housing 100, and includes two first heat dissipation fin assemblies 400, two second heat dissipation fin assemblies 450, a baffle 500, a first fan assembly 600, and a second fan assembly 700.

[0056] The motherboard assembly 200 includes a motherboard 210 and two heat sources 220. The motherboard 210 is disposed in the housing 100. The heat sources 220 are disposed and electrically connected to the motherboard 210.

[0057] The two first heat sink fin groups 400 and the two second heat sink fin groups 450 are disposed on the mainboard 210. The baffle 500 is, for example, a heat pipe group, and is thermally coupled to the two heat sources 220, the two first heat sink fin groups 400, and the two second heat sink fin groups 450. In some embodiments, the two first heat sink fin groups 400 and the two second heat sink fin groups 450 may also be disposed in any structure in the housing 100 or the electronic device 10. Alternatively, in some embodiments, the two first heat sink fin groups 400 and the two second heat sink fin groups 450 may also only contact the baffle 500 and be separated from the housing 100 and the mainboard 210. In addition, in some embodiments, the heat dissipation module 300 may also include only one heat sink fin group (i.e., one first heat sink fin group 400 or one second heat sink fin group 450).

[0058] See also Figures 3 to 5 , Figure 3 for Figure 2 A three-dimensional view of the first fan assembly of the heat dissipation module. Figure 4 for Figure 3 Exploded view of the first fan assembly in FIG. Figure 5 for Figure 3The first fan assembly 600 includes a housing 610 , a fan blade 620 and a wind shield 630 .

[0059] The housing 610 includes a mounting plate 611, two side plates 612 and a cover plate 613, and has an inner surface 614, an air inlet 615, a main air outlet 616 and a secondary air outlet 617. The two side plates 612 stand on the edge 6110 of the mounting plate 611 and are separated from each other. The cover plate 613 is disposed on a side of the side plate 612 away from the mounting plate 611. The air inlet 615 is located on the cover plate 613. The mounting plate 611, the two side plates 612 and the cover plate 613 jointly define the main air outlet 616 and the secondary air outlet 617. Moreover, the main air outlet 616 and the secondary air outlet 617 are respectively located on different sides of the housing 610. The fan blade 620 is used to guide an airflow A1 to flow to the main air outlet 616 first and then guide an airflow A21 to flow to the secondary air outlet 617. The inner surface 614 is located on one of the side plates 612. The inner surface 614 is connected to the main air outlet 616 and the auxiliary air outlet 617. The air inlet 615 is connected to the main air outlet 616 and the auxiliary air outlet 617. In some embodiments, there may be multiple air inlets 615. It should be noted that in some embodiments, there may also be multiple support plates (not shown) protruding outward from the cover plate 613 to support Figure 2 The baffle 500 in the embodiment of the present invention.

[0060] The fan blade 620 is rotatably disposed on the mounting plate 611 . The inner surface 614 faces the fan blade 620 .

[0061] The wind shielding member 630 is disposed at the auxiliary air outlet 617 and has a wind collecting surface 631. The wind collecting surface 631 faces the fan blade 620. The wind collecting surface 631 is connected to the inner surface 614. The wind collecting surface 631 and the inner surface 614 together form a gap G1 with an outer contour T1 of the fan blade 620. The gap G1 gradually expands along a rotation direction R1 of the fan blade 620. In other words, a width W1 of the gap G1 gradually widens along the rotation direction R1 of the fan blade 620. In other words, the gap G1 is vortex-shaped or volute-shaped. The wind collecting surface 631 of the wind shielding member 630 is used to divert the airflow A21 guided by the fan blade 620 through the gap G1 into an airflow A22 guided to the main air outlet 616.

[0062] In this embodiment, the wind shield 630 is, for example, adhered to the cover plate 613, but is not limited thereto. In other embodiments, the wind shield may also be adhered to the mounting plate. In still other embodiments, the wind shield may also be integrally formed with at least one of the cover plate, the mounting plate, and the side plate. Further, in an embodiment where the wind shield and the mounting plate are integrally formed or adhered to each other, the wind shield may also be separated from the cover plate; in an embodiment where the wind shield and the side plate are integrally formed, the wind shield may also be separated from the cover plate and the mounting plate.

[0063] In addition, in this embodiment, the two opposite sides of the wind shielding member 630 are respectively in contact with the two side plates 612, but the present invention is not limited thereto. In other embodiments, the two opposite sides of the wind shielding member can also be respectively separated from the two side plates.

[0064] In addition, if Figure 5 As shown, the side of the air collecting surface 631 away from the auxiliary air outlet 617 is between the connecting lines L1 and L2 of the two adjacent edges 6160 and 6170 of the main air outlet 616 and the auxiliary air outlet 617 and a rotation center C of the fan blade 620. In this way, the air collecting surface 631 can guide the airflow A22 to the main air outlet 616 more smoothly.

[0065] See also Figure 6 , Figure 6 for Figure 2 The heat dissipation module in the embodiment of the present invention omits the cover of the first fan assembly from the bottom view. The baffle 500 shields at least a portion of the auxiliary air outlet 617 where the wind shield 630 is provided. In addition, in this embodiment, the wind shield 630 is separated from the baffle 500. In some embodiments, the air outlet may also be shielded by fins, electronic components or housing structures. That is, in some embodiments, the baffle 500 may also be a fin, an electronic component or a housing structure.

[0066] See also Figure 7 , Figure 7 for Figure 3 A partial enlarged view of the side sectional schematic diagram of the first fan assembly in FIG. In addition, in the present embodiment, the wind collecting surface 631 is inclined, and the side of the wind collecting surface 631 connected to the cover plate 613 is farther away from the fan blades 620 than the side of the wind collecting surface 631 away from the cover plate 613. In this way, the efficiency of the wind collecting surface 631 in guiding the airflow A22 to the main air outlet 616 can be improved. However, the present invention is not limited to the shape of the wind collecting surface 631. In other embodiments, the side of the wind collecting surface connected to the cover plate may be closer to the fan blades than the side of the wind collecting surface away from the cover plate, or the wind collecting surface may be a vertical plane, an oppositely inclined manner, a right angle, a guide fillet, or the like.

[0067] See also Figures 8 to 10 , Figure 8 for Figure 2 A three-dimensional view of the second fan assembly of the heat dissipation module. Fig. 9 for Figure 8 Exploded view of the second fan assembly in FIG. Fig.10 for Figure 8 The second fan assembly 700 includes a housing 710 , a fan blade 720 and a wind shield 730 .

[0068] The housing 710 includes a mounting plate 711, two side plates 712 and a cover plate 713, and has an inner surface 714, an air inlet 715, a main air outlet 716 and a secondary air outlet 717. The two side plates 712 stand on the edge 7110 of the mounting plate 711 and are separated from each other. The cover plate 713 is disposed on a side of the side plate 712 away from the mounting plate 711. The air inlet 715 is located on the cover plate 713. The mounting plate 711, the two side plates 712 and the cover plate 713 jointly define the main air outlet 716 and the secondary air outlet 717. Moreover, the main air outlet 716 and the secondary air outlet 717 are respectively located on different sides of the housing 710. The fan blade 720 is used to guide an airflow A31 to flow to the main air outlet 716 first and then guide an airflow A4 to flow to the secondary air outlet 717. The inner surface 714 is located on one of the side plates 712. The inner surface 714 is connected to the main air outlet 716 and the auxiliary air outlet 717 . The air inlet 715 is connected to the main air outlet 716 and the auxiliary air outlet 717 .

[0069] The fan blade 720 is rotatably disposed on the mounting plate 711 . The inner surface 714 faces the fan blade 720 .

[0070] The wind shielding member 730 is disposed at the main air outlet 716 and has a wind collecting surface 731. The wind collecting surface 731 faces the fan blade 720. The wind collecting surface 731 is connected to the inner surface 714. The wind collecting surface 731 and the inner surface 714 together form a gap G2 with an outer contour T2 of the fan blade 720. The gap G2 gradually expands along a rotation direction R2 of the fan blade 720. In other words, a width W2 of the gap G2 gradually widens along the rotation direction R2 of the fan blade 720. In other words, the gap G2 is vortex-shaped or volute-shaped. The wind collecting surface 731 of the wind shielding member 730 is used to divert the airflow A31 guided by the fan blade 720 through the gap G2 into an airflow A32 guided to the auxiliary air outlet 717.

[0071] In this embodiment, the heat dissipation module 300 includes a first fan assembly 600 with a wind shield 630 disposed at the auxiliary air outlet 617 and a second fan assembly 700 with a wind shield 730 disposed at the main air outlet 716, but the present invention is not limited thereto. In other embodiments, the heat dissipation module may also include only one fan assembly with a wind shield disposed at the auxiliary air outlet or one fan assembly with a wind shield disposed at the main air outlet, and the number of heat sources or heat dissipation fin groups may also be adjusted accordingly.

[0072] Please refer again Figure 2 The two first heat dissipation fin groups 400 are respectively disposed adjacent to the main air outlet 616 and the auxiliary air outlet 617 of the first fan assembly 600. The two second heat dissipation fin groups 450 are respectively disposed adjacent to the main air outlet 716 and the auxiliary air outlet 717 of the second fan assembly 700.

[0073] In this embodiment, the heat dissipation module 300 may further include a third fan assembly 800 disposed adjacent to one of the second heat dissipation fin assemblies 450. In other embodiments, the heat dissipation module may not include the third fan assembly.

[0074] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the previous embodiments, and the following embodiments will not be repeated.

[0075] The present invention is not limited to the relationship between the wind shield and the flow blocking member. Fig.11 and Fig.12 . Fig.11 FIG. 4 is a three-dimensional diagram of a heat dissipation module according to a second embodiment of the present invention. Fig.12 for Fig.11 A partial enlarged view of the top view of the heat dissipation module in the embodiment omitting the cover of the first fan assembly. The difference between the heat dissipation module 300a of the present embodiment and the heat dissipation module 300 of the electronic device 10 of the first embodiment is that the wind shield 630a of the first fan assembly 600a of the present embodiment is thermally coupled to the baffle 500. Further, in the present embodiment, the wind shield 630a is, for example, a heat pipe group, and protrudes outward from the auxiliary air outlet 617 and is in thermal contact with the baffle 500. In this way, the wind shield 630a will also assist in cooling the baffle 500. In some embodiments, the wind shield 630a may also be thermally coupled to the heat dissipation fins or the casing. That is to say, in some embodiments, the wind shield 630a may also assist in cooling the baffle 500 as a heat dissipation fin or the casing.

[0076] According to the fan assembly, heat dissipation module and electronic device disclosed in the above embodiments, since the gap gradually expands along the rotation direction of the fan blade, the wind shielding member can guide the airflow guided by the fan blade to the other of the at least two air outlets as much as possible through the gap. In this way, when the air outlet provided with the wind shielding member is inevitably blocked by an adjacent element such as a spoiler, the wind shielding member will guide the wind that would have been blocked by the spoiler to the other air outlet as much as possible, so that the fan assembly can show its original heat dissipation performance as much as possible.

[0077] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Those skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the claims attached to this specification.

Claims

1. A fan assembly, characterized in that: Include: A housing having an inner surface, an air inlet and at least two air outlets, the inner surface being connected to the at least two air outlets, and the air inlet being connected to the at least two air outlets; A fan blade is rotatably disposed on the housing, and the inner surface faces the fan blade; as well as A wind shield is arranged at one of the at least two air outlets and has a wind collecting surface, the wind collecting surface faces the fan blade, the wind collecting surface is connected to the inner surface, the wind collecting surface and the inner surface together form a gap with the fan blade, the gap gradually expands along a rotation direction of the fan blade, and the wind shield is used to guide an airflow guided by the fan blade to the other of the at least two air outlets through the gap.

2. The fan assembly according to claim 1, characterized in that The at least two air outlets include a main air outlet and a secondary air outlet. The main air outlet and the secondary air outlet are respectively located on two different sides of the shell, and the wind shielding member is arranged on the secondary air outlet.

3. The fan assembly according to claim 1, wherein: The at least two air outlets include a main air outlet and a secondary air outlet. The main air outlet and the secondary air outlet are respectively located on two different sides of the shell. The wind shielding member is arranged at the main air outlet.

4. The fan assembly according to claim 1, wherein: The side of the wind collecting surface away from the air outlet where the wind shielding member is arranged is between the connecting line of two mutually adjacent edges of the at least two air outlets and a rotation center of the fan blade.

5. The fan assembly according to claim 1, wherein: The shell includes a mounting plate, a side plate and a cover plate, the side plate stands on the edge of the mounting plate, the cover plate is arranged on the side of the side plate away from the mounting plate, the air inlet is located on the cover plate, the mounting plate, the side plate and the cover plate jointly define the at least two air outlets, and the inner surface is located on the side plate.

6. The fan assembly according to claim 5, characterized in that The wind shielding member is integrally formed with at least one of the cover plate, the mounting plate and the side plate.

7. The fan assembly according to claim 5, characterized in that The wind shielding member is adhered to the cover plate or the mounting plate.

8. A heat dissipation module, characterized in that: Include: A fan assembly, comprising: A housing having an inner surface, an air inlet and at least two air outlets, the inner surface being connected to the at least two air outlets, and the air inlet being connected to the at least two air outlets; A fan blade is rotatably disposed on the housing, and the inner surface faces the fan blade; as well as a wind shielding member, disposed at one of the at least two air outlets and having a wind collecting surface, the wind collecting surface facing the fan blade, the wind collecting surface connected to the inner surface, the wind collecting surface and the inner surface together forming a gap with the fan blade, the gap gradually expanding along a rotation direction of the fan blade, the wind shielding member is used to guide an airflow guided by the fan blade to the other of the at least two air outlets through the gap; at least one heat dissipation fin set, disposed adjacent to one of the at least two air outlets; and A baffle shields at least a portion of the air outlet where the wind shielding member is disposed.

9. The heat dissipation module according to claim 8, characterized in that: The flow-blocking component is a heat pipe group and is thermally coupled to the at least one heat dissipation fin, and the wind shielding component is thermally coupled to the flow-blocking component.

10. An electronic device, characterized in that: Include: a housing; A motherboard assembly, comprising a motherboard and at least one heat source, wherein the motherboard is disposed in the housing, and the heat source is disposed on the motherboard; a fan assembly disposed in the housing and comprising; A housing having an inner surface, an air inlet and at least two air outlets, the inner surface being connected to the at least two air outlets, and the air inlet being connected to the at least two air outlets; A fan blade is rotatably disposed on the housing, and the inner surface faces the fan blade; as well as a wind shielding member, disposed at one of the at least two air outlets and having a wind collecting surface, the wind collecting surface facing the fan blade, the wind collecting surface connected to the inner surface, the wind collecting surface and the inner surface together forming a gap with the fan blade, the gap gradually expanding along a rotation direction of the fan blade, the wind shielding member is used to guide an airflow guided by the fan blade to the other of the at least two air outlets through the gap; At least one heat dissipation fin group is disposed in the housing and adjacent to one of the at least two air outlets; as well as A flow blocking member is arranged in the housing and shields at least a portion of the air outlet where the wind shielding member is arranged.

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