Wafer stress detection device and semiconductor equipment

Abstract

The invention discloses a wafer stress detection device and semiconductor equipment, and the device comprises an electrostatic chuck which is used for placing a wafer; the lifting pin is arranged on the electrostatic chuck in a sliding mode in the working direction, the lifting pin is provided with a jacking end, and the jacking end is used for driving the wafer to move; the detection assembly comprises a static part and a moving part, the static part is arranged on the lifting pin, the moving part is movably arranged on the lifting pin, and a certain gap is formed between the moving part and the static part; wherein the lifting pin moves to drive the static part and the moving part to move, so that the wafer is far away from the electrostatic chuck, in the moving process, the wafer generates pressure on the moving part, the moving part moves towards the static part in the working direction, and the stress of the wafer is detected through the change of the distance between the moving part and the static part. According to the invention, whether the stress of the wafer is excessive or not can be detected, so that the situation that the wafer deviates due to difficult desorption and is damaged due to excessive stress is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a wafer force detection device and semiconductor equipment. Background Art

[0002] The lifting pins are placed in the cavity of the semiconductor equipment and installed on the electrostatic chuck. After the wafer is transferred to the electrostatic chuck through the robotic arm, the lifting pins rise to lift the wafer, and then the arm is withdrawn. The lifting pins then accurately align and place the wafer in the predetermined position.

[0003] In the prior art, when the residual charge on the electrostatic chuck accumulates to a certain level, it is difficult to desorb the wafer on the electrostatic chuck, and the wafer may be offset when the lifting pins lift the wafer; in severe cases, the wafer may be broken into pieces.

[0004] Therefore, it is necessary to provide a new wafer force detection device and semiconductor equipment to solve the above problems existing in the prior art. Summary of the invention

[0005] The object of the present invention is to provide a wafer force detection device and semiconductor equipment, which are used to detect the force condition of the wafer during the wafer processing process, and can detect whether the force on the wafer is excessive, so as to avoid the wafer from shifting due to difficulty in desorption, and then being damaged due to excessive force.

[0006] To achieve the above object, the technical solution of the present invention is as follows: A wafer force detection device, comprising: Electrostatic chuck, used to place wafers; A lifting pin is slidably disposed on the electrostatic chuck along a working direction, and the lifting pin has a lifting end, and the lifting end is used to drive the wafer to move; The detection component comprises a stationary part and a moving part, wherein the stationary part is arranged on the lifting pin, and the moving part is movably arranged on the lifting pin, and a certain gap is formed between the moving part and the stationary part; Among them, the movement of the lifting pin drives the stationary part and the movable part to move, so that the wafer moves away from the electrostatic suction cup. During the movement, the wafer generates pressure on the movable part, so that the movable part moves toward the stationary part along the working direction. The force on the wafer is detected by the change in the distance between the movable part and the stationary part.

[0007] By adopting the above technical solution, after the wafer is placed on the lifting pins, the distance change between the moving part and the stationary part can be detected to detect the force condition of the wafer, and it can be judged whether the force on the wafer at each lifting pin is the same, thereby judging whether the position of the wafer is shifted, and the force of the lifting pins when lifting the wafer can be monitored in real time, thereby reducing the possibility of uneven force on the wafer due to wafer shift, which may damage the wafer.

[0008] Optionally, a mounting tube is provided at one end of the lifting pin, and an adjusting part is provided at the other end. The lifting end and the movable part are both passed through the mounting tube. A driving part is movably provided in the mounting tube. One end of the driving part extends to the outside of the mounting tube for contacting the wafer, and the other end contacts the movable part to drive the movable part to move.

[0009] By adopting the above technical solution, the lifting pin moves, driving the installation cylinder to move synchronously. At the same time, the moving part and the stationary part are both arranged in the installation cylinder, so that the movement of the lifting pin can drive the moving part and the stationary part to move. At the same time, one end of the driving part extends to the outside of the installation cylinder. During the movement of the lifting pin, the driving part contacts the wafer, and the lifting pin drives the driving part to move, thereby driving the wafer to rise or fall along the working direction; in this process, especially for warped wafers, the adjusting part fine-tunes the position of the lifting pin according to the change in capacitance between the moving part and the stationary part, so that each push rod applies the same force to the end face of the wafer, thereby ensuring the stability of the wafer.

[0010] Optionally, the lifting pin is fixedly arranged on the inner wall of the mounting tube; the stationary part is fixedly arranged on the lifting end, or the stationary part is fixedly arranged on the inner wall of the mounting tube; the movable part is movably arranged on the inner wall of the mounting tube along the working direction.

[0011] By adopting the above technical solution, the stationary part can be fixedly set at the lifting end or fixedly set on the inner wall of the mounting tube, and the movable part is movably set in the mounting tube. Therefore, when the wafer applies pressure to the driving part, the movement of the driving part drives the moving part to move, so that the distance between the moving part and the stationary part changes, which is convenient for monitoring the force of the lifting pin when lifting the wafer.

[0012] Optionally, the driving member includes a push rod and an elastic member; The inner wall of the installation cylinder is provided with a support member; The push rod is movably arranged on the inner wall of the mounting tube along the working direction, and an adjusting member is arranged on the push rod to adjust the thrust of the push rod; One end of the elastic member is arranged on the push rod, and the other end is arranged on the support member, and is used to reset the push rod; The moving member is connected to the push rod, so that the movement of the push rod drives the moving member to move; In the working state, under the pressure of the wafer, the push rod moves along the working direction through the support member, driving the moving member to approach the stationary member; after the wafer is removed, under the action of the elastic member, the push rod drives the moving member away from the stationary member.

[0013] By adopting the above technical solution, one end of the push rod contacts the wafer, and the other end of the push rod passes through the support member and is connected to the moving member. After the wafer applies pressure, the push rod moves in the mounting tube, driving the moving member to move, so that the distance between the moving member and the stationary member changes; after the wafer is removed, under the action of the elastic member and the support member, the push rod is reset, and at the same time drives the moving member to reset, so as to facilitate the next detection process.

[0014] Optionally, a matching portion is provided on the side wall of the push rod, and an adapting portion is provided on the inner wall of the mounting tube; One of the matching portion and the adapting portion is provided with a limiting groove, and the other is penetrated in the limiting groove to limit the push rod.

[0015] By adopting the above technical solution, the matching part cooperates with the adapter part, and one of the matching part and the adapter part is provided with a limiting groove, and the other is penetrated in the limiting groove. Under the limiting effect of the limiting groove, the push rod will not separate from the mounting tube, thereby achieving the effect of limiting the push rod.

[0016] Optionally, the stationary member and the moving member are both conductors, and the stationary member and the moving member are electrically insulated from each other; In the working state, the force applied to the wafer is detected by detecting the change in capacitance between the stationary part and the moving part.

[0017] By adopting the above technical solution, both the moving part and the stationary part are conductors, and there are relative side walls between the moving part and the stationary part. The area of ​​the relative side walls is the effective area. Charges can be stored within the range of the side walls, thereby facilitating the detection of the force of the lifting pin when lifting the wafer by detecting the change in the capacitance value between the stationary part and the moving part.

[0018] Optionally, it further includes a signal converter, wherein the signal converter is electrically connected to the stationary part and the moving part respectively; In the working state, the stationary part and the moving part move, and the capacitance value between the two changes. The signal converter converts the capacitance value change into a voltage or current signal and then outputs it.

[0019] By adopting the above technical solution, the capacitance value between the stationary part and the moving part changes after relative movement occurs between the two. The stationary part, the moving part and the signal converter are in the same measuring circuit. At the same time, the signal converter converts the capacitance value change into a voltage signal or a current signal and outputs it, which makes it easy to observe the force change on the wafer when the lifting pin lifts the wafer.

[0020] Optionally, it further comprises a microprocessor and a machine data system, wherein the microprocessor is electrically connected to the signal converter and the machine data system respectively; During operation, the microprocessor receives the electrical signal from the signal converter, processes and analyzes the electrical signal, and transmits the processing and analysis results to the machine data system.

[0021] By adopting the above technical solution, the microprocessor processes and analyzes the electrical signal converted by the signal converter, and transmits the processing and analysis results to the machine data system, so as to directly observe the force conditions when the lifting pin lifts the wafer from the machine data system.

[0022] A semiconductor device, comprising a cavity, a driver and a wafer force detection device; The lifting pins are provided in plurality, and the plurality of lifting pins and the electrostatic chuck are both provided inside the cavity; The driver is fixedly arranged outside the cavity and connected to the electrostatic chuck to drive the electrostatic chuck to move.

[0023] By adopting the above technical solution, the driver is started to drive the electrostatic chuck to move, and the position of the electrostatic chuck is adjusted to facilitate the wafer processing process.

[0024] Optionally, it further comprises a connecting member, one end of which is fixedly provided with a plurality of connecting rods, and the plurality of connecting rods are fixedly provided on the electrostatic chuck; A guide rod is fixedly provided at the other end of the connecting member, and the guide rod is used to limit the movement direction of the connecting member.

[0025] By adopting the above technical solution, the driver is connected to the connecting piece, and the connecting rod on the connecting piece is connected to the electrostatic suction cup, so that the driver can timely monitor the force on the wafer during the process of driving the electrostatic suction cup to move. At the same time, the introduction of the elastic part can avoid the situation where the wafer is damaged due to excessive force caused by unsatisfactory desorption.

[0026] The beneficial effects of the wafer force detection device and semiconductor equipment provided by the present invention include at least: 1. Set up moving parts and stationary parts, and monitor the force of the lifting pin when lifting the wafer in real time by changing the distance between the moving parts and the stationary parts, so as to judge whether the force on the wafer is within the allowable range; 2. Charges are stored between the stationary part and the moving part. Changes in the relative distance between the stationary part and the moving part will cause changes in capacitance. The signal converter converts the change in capacitance into a voltage signal or a current signal and then outputs it. This makes it easy to observe the changes in force on the wafer when the lifting pin lifts the wafer, and the detection results are accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the main structure of a wafer force detection device and a semiconductor device according to an embodiment of the present invention; Figure 2 A schematic diagram of the structure and installation position of a wafer force detection device and a detection component of a semiconductor device according to an embodiment of the present invention; Figure 3 A schematic diagram of the positions of an assembly part and an adapter part in a wafer force detection device and a semiconductor device according to an embodiment of the present invention; Figure 4 A schematic diagram of the connection relationship between a wafer force detection device and a detection circuit and detection component of a semiconductor device, a signal converter, a microprocessor and a machine data system according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the contact position between a push rod and a wafer of a wafer force detection device according to an embodiment of the present invention; Figure 6 Schematic diagram of the contact position between the push rod and the warped wafer after the adjustment member adjusts the position of the push rod when the wafer is warped in an embodiment of the present invention.

[0028] Reference numerals: 100, electrostatic suction cup; 200, lifting pin; 210, lifting end; 300, detection component; 310, stationary part; 320, moving part; 400, mounting tube; 410, driving part; 411, push rod; 412, elastic part; 413, supporting part; 414, matching part; 415, adapter part; 420, adjusting part; 510, signal converter; 520, microprocessor; 530, machine data system; 600, cavity; 700, driver; 800, connecting part; 810, connecting rod; 820, guide rod; 900, positioning part. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0030] The specific implementation modes of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0031] Reference Figure 1-6 . An embodiment of the present invention provides a wafer force detection device, wherein the wafer force detection device includes an electrostatic chuck 100, which is circular. For the convenience of subsequent description, the axial direction of the electrostatic chuck 100 is defined as the working direction; during operation, the electrostatic chuck 100 is used to place the wafer, and a lifting pin 200 is provided on the electrostatic chuck 100, and a plurality of mounting holes are provided on the electrostatic chuck 100. At the same time, the lifting pin 200 is provided with a plurality of, and the plurality of lifting pins 200 corresponds to the plurality of mounting holes one by one, and the axial direction of the mounting hole is parallel to the axial direction of the electrostatic chuck 100, and the lifting pin 200 is penetrated through the mounting hole. The lifting pin 200 is arranged in the hole of the electrostatic suction cup 100 for sliding along the working direction. The movement of the lifting pin 200 drives the wafer on the electrostatic suction cup 100 to rise or fall along the working direction. At the same time, the lifting pin 200 has a lifting end 210, and the lifting end 210 passes through the electrostatic suction cup 100. During the movement of the lifting pin 200, the lifting end 210 drives the wafer to rise or fall along the working direction; as the residual charge on the electrostatic suction cup 100 accumulates to a certain extent, it is difficult to desorb the wafer on the electrostatic suction cup 100, and the lifting pin 200 may cause the wafer to shift when lifting the wafer; in severe cases, it may cause the wafer to be broken.

[0032] Reference Figure 1-6The wafer force detection device also includes a detection component 300, wherein the detection component 300 includes a stationary part 310 and a moving part 320. The stationary part 310 is arranged on the lifting pin 200 and can move synchronously with the movement of the lifting pin 200. The moving part 320 is movably arranged on the lifting pin 200. The lifting pin 200 drives the moving part 320 to move during the movement. At the same time, the moving part 320 will also have a tendency to move toward the stationary part 310 relative to the stationary part 310. There is a certain gap between the moving part 320 and the stationary part 310, so that when the moving part 320 moves toward the stationary part 310, the gap between the moving part 320 and the stationary part 310 changes; during the working process, the lifting pin 200 moves along the working direction, driving the stationary part 310 and the moving part 320 to move, pushing the wafer away from electrostatic attraction. Disk 100, during this movement, since the wafer also exerts pressure on the moving part 320, under the action of the pressure of the wafer, the moving part 320 moves along the working direction toward the stationary part 310, and at this time, the gap between the moving part 320 and the stationary part 310 changes. By detecting the change in the distance between the moving part 320 and the stationary part 310, the force applied to the wafer can be detected, thereby determining whether the force applied to the wafer is uniform. In addition, the change in the distance between the moving part 320 and the stationary part 310 can be detected by directly adding a pressure sensor between the two, or by detecting the change in capacitance to detect the force applied to the wafer after the distance between the two changes. In this embodiment, the force applied to the wafer is detected by detecting the change in capacitance between the moving part 320 and the stationary part 310.

[0033] Reference Figure 1-6In order to fix the positions of the stationary member 310 and the movable member 320, a mounting cylinder 400 is arranged on the lifting pin 200, wherein the mounting cylinder 400 is coaxially arranged with the lifting pin 200, and the lifting end 210 of the lifting pin 200 is penetrated in the mounting cylinder 400, and the movable member 320 is also penetrated in the mounting cylinder 400, and the movable member 320 can move in the mounting cylinder 400 along the working direction, and a driving member 410 is movably arranged in the mounting cylinder 400, and the driving member 410 can move in the mounting cylinder 400 along the working direction, and one end of the driving member 410 It extends to the outside of the mounting cylinder 400 and is used to contact with the wafer, so as to facilitate the movement of the wafer. The other end contacts with the moving member 320, so as to facilitate the movement of the moving member 320. When the wafer contacts the driving member 410, the pressure of the wafer is transmitted to the moving member 320 through the driving member 410, and drives the moving member 320 to move toward the stationary member 310 along the working direction, so as to change the distance between the driving member 410 and the moving member 320, thereby changing the capacitance value of the capacitor. The real-time capacitance value change (i.e., displacement change) can be obtained by measuring the capacitance. In addition, the lifting end 210 of the lifting pin 200 is fixedly arranged on the inner wall of the installation cylinder 400, and the fixing method thereof can be bonding, clamping or interference fit, etc. In this embodiment, it is preferred that the lifting pin 200 is fixedly arranged on the inner wall of the installation cylinder 400 by interference fit, so that the lifting pin 200 can drive the installation cylinder 400 to move synchronously when moving. At the same time, the stationary part 310 can be fixedly arranged on the lifting end 210, or it can be fixedly arranged on the inner wall of the installation cylinder 400. In this embodiment, the stationary part 310 is fixedly arranged on the lifting end 210. The lifting end 210 can be fixed by bonding, clamping or integral molding, etc. In the present embodiment, it is preferred that the two are fixed by bonding, so that the lifting pin 200 can drive the stationary part 310 to move when it moves; in addition, the movable part 320 is movably arranged on the inner wall of the mounting tube 400 along the working direction, and is connected to the driving part 410 at the same time, so that the lifting pin 200 can drive the mounting tube 400, the stationary part 310, the movable part 320 and the driving part 410 to move at the same time during the movement, so as to facilitate the movement process of the wafer.

[0034] Reference Figure 1-6The driving member 410 includes a push rod 411 and an elastic member 412, wherein a support member 413 is fixedly arranged on the inner wall of the mounting cylinder 400, wherein the push rod 411 is slidably arranged on the inner wall of the mounting cylinder 400 along the working direction, and one end of the push rod 411 extends to the outside of the mounting cylinder 400 for contacting with the wafer, and the support member 413 is fixedly arranged on the inner side wall of the mounting cylinder 400, and the push rod 411 can pass through the support member 413. In order to facilitate the passing of the push rod 411, in this embodiment, the support member 413 is selected to be ring-shaped, and its fixing method can be bonding, clamping, etc. In this embodiment, the support member 413 is fixedly arranged on the inner wall of the mounting tube 400 by means of interference fit, and the elastic member 412 is also arranged inside the mounting tube 400. One end of the elastic member 412 is arranged on the end of the push rod 411, and the other end is arranged on the support member 413. The elastic member 412 has elasticity and is used to reset the push rod 411 after the push rod 411 moves, that is, to push the push rod 411 to move in the direction close to the wafer. In this embodiment, the elastic member 412 is selected as a spring, and one end of the elastic member 412 is fixedly arranged on the inner wall of the mounting tube 400 by means of interference fit. The push rod 411 is fixedly arranged on the end face of the push rod 411, and the other end is arranged on the end face of the support member 413 by means of a clamping connection; in addition, the push rod 411 passes through the support member 413 and is connected with the moving member 320, so that the push rod 411 can drive the moving member 320 to rise or fall along the working direction when it rises or falls along the working direction, that is, the push rod 411 drives the moving member 320 to move synchronously when it moves. Therefore, during the working process, after the wafer contacts the push rod 411, pressure is applied to the push rod 411, and under the pressure of the wafer, the push rod 411 moves downward along the working direction and passes through During this process, the support member 413 drives the movable member 320 to move toward the stationary member 310 along the working direction, and the distance between the movable member 320 and the stationary member 310 changes, thereby realizing a change in the capacitance value, thereby causing a change in the capacitance through the change in distance, and then detecting the change in capacitance; when the wafer is removed, the push rod 411 is no longer subjected to pressure from the wafer, and under the action of the elastic member 412, the push rod 411 is pushed to move along the working direction toward a direction away from the electrostatic suction cup 100, while driving the movable member 320 to move, so that the movable member 320 is away from the stationary member 310.

[0035] Reference Figure 1-6In order to prevent the elastic member 412 from causing the push rod 411 to disengage from the mounting tube 400 during the process of driving the push rod 411 to return to its original position, a matching portion 414 is provided on the side wall of the push rod 411, and an adapting portion 415 is provided on the inner wall of the mounting tube 400, wherein one of the matching portion 414 and the adapting portion 415 is provided with a limiting groove, and the other is penetrated in the limiting groove; the matching portion 414 can be a limiting groove, and the adapting portion 415 can be penetrated in the limiting groove, or the adapting portion 415 can be a limiting groove, and the matching portion 414 can be penetrated in the limiting groove; in this embodiment, a limiting groove is provided on the adapting portion 415, specifically, the inner wall of the mounting tube 400 is provided with the adapting portion 415, and the adapting portion 415 is the limiting groove, and the length direction of the adapting portion 415 can be parallel to the axial direction of the mounting tube 400, or the adapting portion 4 15 is annular. In the present embodiment, the length direction of the adapter portion 415 can be parallel to the axial direction of the mounting tube 400. At the same time, one or more adapter portions 415 can be provided. In the present embodiment, multiple adapter portions 415 are provided, and the multiple adapter portions 415 are evenly distributed on the inner wall of the mounting tube 400 around the axis of the mounting tube 400; the matching portion 414 is block-shaped and is fixedly arranged on the side wall of the push rod 411 in an integrated manner, and the number of the matching portions 414 and the adapter portion 415 is the same, and the matching portion 414 is penetrated in the adapter portion 415 and can rise or fall in the adapter portion 415 along the working direction. The adapter portion 415 has a limiting effect on the matching portion 414, so that when the elastic member 412 drives the push rod 411 to reset, the push rod 411 will not separate from the mounting tube 400.

[0036] Reference Figure 1-6, since in this embodiment, according to the change of the distance between the moving part 320 and the stationary part 310, the capacitance change between the moving part 320 and the stationary part 310 is detected, in order to form capacitance between the moving part 320 and the stationary part 310, the moving part 320 and the stationary part 310 are both conductors, and the moving part 320 and the stationary part 310 are electrically insulated, that is, the mounting tube 400 is made of insulating material, so that the charge between the moving part 320 and the stationary part 310 will not be exchanged. In the working state, the moving part 320 and the stationary part 310 move relative to each other, and the capacitance change between the moving part 320 and the stationary part 310 is detected, so as to detect the force condition of the wafer; in addition, the wafer force detection device also includes a signal converter 510, and the signal converter 510 is electrically connected to the stationary part 310 and the moving part 320 respectively, that is, the signal converter 510, the stationary part 310 and the moving part 320 are in the same measurement circuit, and at the same time, the signal converter 510 and the part where the capacitance changes are arranged in parallel, and the signal converter 510 and the stationary part 310 are connected in parallel. The detection components 300 are in parallel relationship; the signal converter 510 is used to convert the capacitance value change between the moving part 320 and the stationary part 310 into a voltage signal or a current signal output. During the working process, the moving part 320 and the stationary part 310 move relative to each other, so that the capacitance value between the two changes. At this time, the signal converter 510 converts the capacitance value change between the two into a voltage signal or a current signal output, which is convenient for observing the capacitance change between the stationary part 310 and the moving part 320, thereby measuring the distance change and the force condition of the wafer; in order to facilitate the observation of the results, the wafer force detection device also includes a microprocessor 520 and a machine data system 530, wherein the microprocessor 520 is electrically connected to the signal converter 510 and the machine data system 530 respectively. During the working process, the microprocessor 520 receives the digital signal of the signal converter 510, processes and analyzes the electrical signal, and transmits the processing and analysis results to the machine data system 530, and the detection results can be intuitively seen on the machine data system 530; In addition, the moving member 320 and the stationary member 310 are arranged relative to each other so that there is a relative side wall, that is, an effective area, between the two. During the relative movement of the moving member 320 and the stationary member 310, the charge is contained in the space where the effective area of ​​the moving member 320 and the effective area of ​​the stationary member 310 are relative to each other. The specific calculation process is referred to the following formula:

[0037] in is the capacitance value; is the vacuum parameter, i.e. 8.854 × 10-12 F / m; is the dielectric constant, i.e. the relative dielectric constant of the material; A is the effective area of ​​the two plates; d is the distance between the two plates; The change in the distance between the plates; during the calculation process, the change in capacitance value can be calculated according to the above formula, and after data processing and signal conditioning by the signal sensor and the microprocessor 520, the measurement result is transmitted to the machine data system 530; after data processing and calculation by the microprocessor 520, the measurement result is digitized and displayed on the LCD screen with high accuracy (the specific operation mode and calculation method of the microprocessor 520 are prior art and will not be repeated here).

[0038] In some embodiments, the possibility of warping and unevenness of the wafer is also taken into consideration. The push rod 411 is used to directly contact the surface of the wafer and apply a certain force to the wafer to lift the wafer. However, when desorption is difficult and the wafer is warped, there may be a problem of uneven force applied to the wafer by the push rods 411 at various positions, which may cause the wafer to tilt or shift. The wafer may be broken or otherwise damaged during the lifting process. In order to solve the problem of uneven force caused by wafer warping and the high probability of wafer damage caused by difficulty in desorption, the push rod 411 needs to be adjusted.

[0039] The specific lifting process is that the bottom surface of the warped wafer is closer to the bottom and contacts the push rod 411 first, and then continues to move upward.

[0040] In some embodiments, an adjusting member 420 is provided at one end of the lifting pin 200. Specifically, the adjusting member 420 is provided at the end of the lifting pin 200 away from the push rod 411, that is, a mounting tube 400 is provided at one end of the lifting pin 200, and an adjusting member 420 is provided at the other end; wherein the adjusting member 420 is used to fine-tune the position of the lifting pin 200 so that each push rod 411 applies the same force to the end surface of the wafer, thereby ensuring the stability of the wafer; at the same time, the adjusting member 420 is electrically connected to the machine data system 530. Since a capacitor is formed between the moving member 320 and the stationary member 310, the adjusting member 420 can adjust the position of the lifting pin 200 according to the change in capacitance, thereby adjusting the push rod 411, so that each push rod 411 applies the same force to the bottom surface of the wafer.

[0041] In some embodiments, the adjustment member 420 is a fine-tuning driver, which is used to ensure that the forces applied by the bottom push rods 411 to the bottom surface of the wafer are equal (that is, the capacitances are the same) before the wafer completely leaves the electrostatic chuck 100. After the adjustment action of making the capacitances the same is completed (because the same capacitance means that the forces at each contact point are the same), the wafer is pushed upward as a whole.

[0042] The capacitance corresponding to each push rod 411 is the same, and the capacitance at each point needs to be compared. With the help of the adjustment member 420, the position of the lifting pin 200 is adjusted, thereby adjusting the horizontal height of the push rod 411 relative to other push rods 411. This process is crucial for uniform force on the wafer.

[0043] The embodiment of the present application also discloses a semiconductor device, wherein the semiconductor device includes a cavity 600, a driver 700 and a wafer force detection device. In the present embodiment, the cavity 600 is a vacuum cavity. In the semiconductor device, a plurality of lifting pins 200 are provided, and the plurality of lifting pins 200 are evenly distributed on the electrostatic chuck 100, and the lifting pins 200 are placed inside the electrostatic chuck 100, so the lifting pins 200 and the electrostatic chuck 100 are both arranged inside the cavity 600; the driver 700 is fixedly arranged outside the cavity 600, and may be fixedly arranged with the outer wall of the cavity 600, or may not be fixedly arranged with the outer wall of the cavity 600, as long as it can It is sufficient to ensure that the driver 700 can drive the electrostatic chuck 100 to move in the working direction in the cavity 600. The driver 700 is connected to the electrostatic chuck 100 to drive the electrostatic chuck 100 to move. In addition, the semiconductor device also includes a connector 800. The connector 800 is plate-shaped, and a connecting rod 810 is fixedly provided at one end of the connector 800. The fixing method can be bonding, welding or integrated molding. In this embodiment, the connecting rod 810 is selected to be fixed to the connecting member 800 by integrated molding. A plurality of connecting rods 810 are provided, and the plurality of connecting rods 810 are evenly distributed on the connecting member 800. At the same time, the connecting rod 810 The other end of the connecting member 800 is fixedly arranged on the electrostatic suction cup 100, and the fixing method thereof can be bonding, welding or integrated molding, etc. In the present embodiment, the connecting rod 810 is selected to be fixedly arranged on the electrostatic suction cup 100 by means of integrated molding, the driver 700 is started, and the connecting member 800 is driven to move, and the electrostatic suction cup 100 is driven to move at the same time. At the same time, since a plurality of connecting rods 810 are provided, the electrostatic suction cup 100 is subjected to uniform force, and the movement process is smooth, and no interference is caused to the processing process of the wafer; at the same time, the other end of the connecting member 800 is fixedly arranged with a guide rod 820, and the fixing method thereof can be bonding, welding or integrated molding, etc. In the present embodiment, the guide rod is selected to be fixedly arranged on the electrostatic suction cup 100 by means of integrated molding, etc. 820 is fixedly set on the connecting member 800 by means of integral molding. The axial direction of the guide rod 820 is parallel to the working direction and is used to limit the movement direction of the connecting member 800. In actual use, the guide rod 820 can be slidably set on the ground, or slidably set on other positioning members 900, as long as the connecting member 800 can move along the working direction; in this embodiment, the guide surface is selected to be slidably set on the positioning member 900, wherein the positioning member 900 is fixedly set relative to the cavity 600. In addition, the driver 700 is also fixedly set on the positioning member 900, so that the driver 700 can drive the electrostatic suction cup 100 to move.

[0044] The implementation principle of a wafer force detection device and a semiconductor device in the embodiment of the present application is as follows: after the wafer is placed on the electrostatic chuck 100, the driver 700 is started to drive the lifting pin 200 to move. The lifting pin 200 pushes the wafer to move while moving. During this process, the wafer applies pressure to the push rod 411, causing the push rod 411 to move and drive the moving part 320 to move toward the stationary part 310 along the working direction. During this process, the distance between the moving part 320 and the stationary part 310 changes, causing the capacitance value between the moving part 320 and the stationary part 310 to change, and the measuring circuit measures the capacitance. The change in capacitance value is measured, and the signal converter 510 converts the signal of the capacitance value change into an electrical signal. The microprocessor 520 processes and analyzes the electrical signal, and transmits the processing and analysis results to the machine data system 530, so as to monitor the force of the lifting pin 200 when lifting the wafer in real time, and compare the forces (capacitances) corresponding to each push rod 411 at the same time. Then, when the wafer is lifted and the force is uneven, the micro-actuator is adjusted to achieve the same capacitance corresponding to the push rod 411, so as to ensure that the force on the wafer is uniform and reduce the damage to the wafer caused by the uneven force.

[0045] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A wafer force detection device, characterized in that: include: An electrostatic chuck (100) for placing a wafer; A lifting pin (200) is slidably disposed on the electrostatic chuck (100) along a working direction, the lifting pin (200) having a lifting end (210), and the lifting end (210) is used to drive the wafer to move; A detection component (300) comprises a stationary part (310) and a moving part (320), wherein the stationary part (310) is arranged on the lifting pin (200), and the moving part (320) is movably arranged on the lifting pin (200), and a certain gap is formed between the moving part (320) and the stationary part (310); The movement of the lifting pin (200) drives the stationary part (310) and the movable part (320) to move, so that the wafer moves away from or close to the electrostatic suction cup (100). During the movement, the wafer generates pressure on the movable part (320), so that the movable part (320) moves toward the stationary part (310) along the working direction. The force applied to the wafer is detected by changing the distance between the movable part (320) and the stationary part (310).

2. The wafer force detection device according to claim 1, characterized in that: A mounting tube (400) is arranged at one end of the lifting pin (200), and an adjusting member (420) is arranged at the other end; the lifting end (210) and the moving member (320) are both inserted into the mounting tube (400); a driving member (410) is movably arranged in the mounting tube (400); one end of the driving member (410) extends to the outside of the mounting tube (400) for contacting the wafer, and the other end contacts the moving member (320) to drive the moving member (320) to move.

3. The wafer force detection device according to claim 2, characterized in that: The lifting pin (200) is fixedly arranged on the inner wall of the installation cylinder (400); the stationary part (310) is fixedly arranged on the lifting end (210), or the stationary part (310) is fixedly arranged on the inner wall of the installation cylinder (400); and the movable part (320) is movably arranged on the inner wall of the installation cylinder (400) along a working direction.

4. The wafer force detection device according to claim 2, characterized in that: The driving member (410) comprises a push rod (411) and an elastic member (412); The inner wall of the installation cylinder (400) is provided with a support member (413); The push rod (411) is movably arranged on the inner wall of the installation cylinder (400) along the working direction; One end of the elastic member (412) is arranged on the push rod (411), and the other end is arranged on the support member (413), and is used to reset the push rod (411); The moving member (320) is connected to the push rod (411), so that the movement of the push rod (411) drives the moving member (320) to move; In the working state, under the pressure of the wafer, the push rod (411) passes through the support member (413) and moves along the working direction, driving the moving member (320) to approach the stationary member (310); after the wafer is removed, under the action of the elastic member (412), the push rod (411) drives the moving member (320) away from the stationary member (310).

5. The wafer force detection device according to claim 4, characterized in that: The side wall of the push rod (411) is provided with a matching portion (414), and the inner wall of the installation cylinder (400) is provided with an adapting portion (415); One of the matching portion (414) and the adapting portion (415) is provided with a limiting groove, and the other is penetrated in the limiting groove to limit the push rod (411).

6. The wafer force detection device according to any one of claims 1 to 5, characterized in that: The stationary part (310) and the moving part (320) are both conductors, and the stationary part (310) and the moving part (320) are electrically insulated from each other; In a working state, the force applied to the wafer is detected by detecting a change in capacitance between the stationary part (310) and the movable part (320).

7. The wafer force detection device according to claim 6, characterized in that: It also includes a signal converter (510), wherein the signal converter (510) is electrically connected to the stationary part (310) and the moving part (320) respectively; In a working state, the stationary member (310) and the moving member (320) move, and the capacitance value between the two changes. The signal converter (510) converts the capacitance value change into a voltage or current signal and then outputs it.

8. The wafer force detection device according to claim 7, characterized in that: It also includes a microprocessor (520) and a machine data system (530), wherein the microprocessor (520) is electrically connected to the signal converter (510) and the machine data system (530) respectively; During operation, the microprocessor (520) receives the electrical signal from the signal converter (510), processes and analyzes the electrical signal, and transmits the processing and analysis results to the machine data system (530).

9. A semiconductor device, characterized in that: It comprises a cavity (600), a driver (700) and a wafer force detection device according to any one of claims 1 to 8; A plurality of the lifting pins (200) are provided, and the plurality of lifting pins (200) and the electrostatic chuck (100) are both provided inside the cavity (600); The driver (700) is fixedly disposed outside the cavity (600) and is connected to the electrostatic chuck (100) to drive the electrostatic chuck (100) to move.

10. The semiconductor device according to claim 9, characterized in that It also includes a connecting member (800), one end of which is fixedly provided with a plurality of connecting rods (810), and the plurality of connecting rods (810) are fixedly provided on the electrostatic chuck (100); A guide rod (820) is fixedly provided at the other end of the connecting member (800), and the guide rod (820) is used to limit the movement direction of the connecting member (800).

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