Computer case for data development of computer data network

Abstract

The invention provides a computer case for computer data network data development, and belongs to the technical field of computer equipment.The computer case comprises a case body, a heat dissipation mechanism and an auxiliary heat dissipation mechanism, the case body comprises an outer shell, a mounting cavity is formed in the front end of the interior of the outer shell, and the rear end of the mounting cavity communicates with a cavity; a heat dissipation cavity is formed in the rear end of the outer shell, a mounting frame is fixedly mounted in the mounting cavity, and a mounting groove is formed in the front end of the mounting frame; the heat dissipation mechanism comprises a heat conduction plate which is fixedly installed on the back face of the installation frame and located right behind the installation groove, a heat conduction pipe is fixedly installed in the heat conduction plate, and the rear end of the heat conduction pipe communicates with a cooling heat dissipation unit. The computer case solves the problems of low heat dissipation efficiency, high energy consumption, dust accumulation, noise pollution and the like of a traditional case under a high-load condition.

Description

Technical Field

[0001] The invention relates to the technical field of computer equipment, in particular to a computer case used for computer data network data development. Background Art

[0002] Computer cases are important carriers of computer hardware devices and are widely used in various computing scenarios. They not only provide physical protection for hardware components, but also undertake functions such as heat dissipation, stable operation, and signal connection. In the development process of modern computer data networks, as the performance of hardware devices continues to improve, high-performance processors, GPUs, large-capacity storage units and other hardware will generate a lot of heat when working under high load. In order to ensure the stability of hardware operation, the chassis needs to have efficient heat dissipation function. However, the heat dissipation design of traditional chassis is relatively simple, and most of them are based on vents for heat dissipation or external cooling fans, which is difficult to meet the higher requirements for heat dissipation performance in complex development environments.

[0003] Existing chassis usually adopt the method of opening vents on the chassis shell for passive heat dissipation, or adding cooling fans to assist in heat dissipation. Although this method can alleviate the heat accumulation of hardware to a certain extent, it still has obvious technical defects: First, the efficiency of passive heat dissipation and fan heat dissipation is limited, and it is difficult to effectively cope with the large amount of heat generated under high load conditions, which may cause hardware overheating, thereby affecting the stability of computing performance and hardware life; second, the design of vents and cooling fans easily causes dust to enter the chassis. After the dust accumulates in the chassis, it will not only affect the heat dissipation performance, but also may clog key components or interfaces, increasing the difficulty of equipment maintenance. In addition, the long-term operation of the fan will also cause noise pollution, affecting the working experience of the development environment. These problems significantly restrict the applicability and use effect of traditional chassis in modern data network development scenarios. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0005] In view of the above problems and / or the problems existing in the prior art, the present invention is proposed.

[0006] Therefore, the technical problem to be solved by the present invention is: how to improve the heat dissipation efficiency of the chassis under high load conditions while reducing dust accumulation and noise pollution to meet the needs of modern data network development scenarios.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a computer case for computer data network data development, comprising:

[0008] The chassis body comprises an outer shell, a mounting cavity is provided at the front end of the inner part of the outer shell, a cavity is connected to the rear end of the mounting cavity, a heat dissipation cavity is provided at the rear end of the outer shell, a mounting frame is fixedly installed inside the mounting cavity, and a mounting groove is provided at the front end of the mounting frame;

[0009] The heat dissipation mechanism comprises a heat conduction plate fixedly mounted on the back of the mounting frame and located directly behind the mounting slot, a heat conduction pipe fixedly mounted inside the heat conduction plate, and a rear end of the heat conduction pipe is connected to a cooling and heat dissipation unit; and

[0010] The auxiliary heat dissipation mechanism comprises a thermoelectric conversion unit fixedly installed between the heat conduction plate and the cooling and heat dissipation unit, an energy management unit is arranged above the thermoelectric conversion unit, and a fan is arranged at the rear end of the energy management unit.

[0011] As a preferred solution of the computer case for computer data network data development described in the present invention, the cooling and heat dissipation unit includes a supporting shell fixedly installed at the bottom end of the cavity, a cooling channel is provided at the front end inside the supporting shell, a heat sink is fixedly installed at the rear end of the cooling channel, and the rear end of the heat sink passes through the rear wall of the installation cavity and extends into the heat dissipation cavity, a coolant inlet is provided on the right side of the top end of the cooling channel, a coolant outlet is provided on the left side of the bottom end of the cooling channel, and the input end and output end of the heat conduction pipe are respectively connected to the coolant inlet and the coolant outlet.

[0012] As a preferred solution of the computer case for computer data network data development described in the present invention, coolant is arranged inside the heat transfer tube, and micro circulation pumps are fixedly installed at the liquid inlet and the liquid outlet of the heat transfer tube.

[0013] As a preferred solution of the computer case for computer data network data development described in the present invention, the heat conduction pipe and the cooling channel are both in an "S"-shaped bending structure.

[0014] As a preferred solution of the computer case for computer data network data development described in the present invention, a sealed door is provided at the front end of the outer shell to make the installation cavity in a completely sealed state, the rear end of the heat dissipation cavity is connected to the outside world, and the front end is completely isolated from the cavity by a partition.

[0015] As a preferred solution of the computer case for computer data network data development described in the present invention, there are a plurality of heat sinks, and the rear ends of the plurality of heat sinks are all arranged in the heat dissipation cavity, and the fan is installed at the top of the heat dissipation cavity, directly above the plurality of heat sinks.

[0016] As a preferred solution of the computer case for computer data network data development described in the present invention, the thermoelectric conversion unit is made of bismuth antimony tellurium (Bi2Te3) based thermoelectric material, its hot end is tightly fixed on the back of the heat conduction plate, and the cold end is in contact and connected with the heat sink of the cooling and heat dissipation unit.

[0017] As a preferred solution of the computer case for computer data network data development described in the present invention, the energy management unit includes a DC-DC converter, a super capacitor and a current controller, the input end of the DC-DC converter is connected to the output end of the thermoelectric conversion unit through a wire, and the output end is simultaneously connected to the input end of the super capacitor and the current controller; the output end of the current controller is connected to the fan through a wire.

[0018] As a preferred solution of the computer case for computer data network data development described in the present invention, the DC-DC converter is connected in parallel with the supercapacitor, and the supercapacitor is used to store excess electric energy generated by the thermoelectric conversion unit and provide auxiliary electric energy to the fan when the output of the thermoelectric conversion unit is insufficient.

[0019] As a preferred solution of the computer case for computer data network data development described in the present invention, the thermoelectric conversion unit is fixed to the heat conduction plate by screws and high thermal conductivity silicone grease, and its cold end is closely connected with the heat sink of the cooling and heat dissipation unit through a thermally conductive copper sheet, ensuring efficient temperature difference driving and heat dissipation performance.

[0020] Beneficial effects of the present invention:

[0021] (1) The present invention sets a sealed door at the front end of the outer shell to isolate the installation cavity from the outside world, so that the installation slot and high heat dissipation components are always in a completely sealed state, effectively preventing dust from entering the interior of the chassis. The rear end of the heat dissipation cavity is connected to the outside world, while the front end is completely isolated from the cavity by a partition, further preventing dust from entering the core area through the heat dissipation system. This design greatly reduces the impact of dust accumulation on high heat dissipation components and heat dissipation performance, prolongs the service life of the equipment, and reduces maintenance frequency and cost.

[0022] (2) The present invention sets a mounting groove at the front end of the mounting frame so that the high heat dissipation component can be directly installed in the mounting groove, and the heat conduction plate is set closely behind the mounting groove and directly contacts the high heat dissipation component to form an efficient heat conduction path. The heat is quickly transferred to the heat conduction tube through the heat conduction plate, and then the cooling and heat dissipation process is completed through the cooling and heat dissipation unit. The heat conduction tube and cooling channel with "S"-shaped bending design greatly increase the flow path and heat exchange area of ​​the coolant, significantly improve the heat dissipation efficiency, and ensure that the high heat dissipation component can still maintain stable operation under high load conditions.

[0023] (3) The auxiliary heat dissipation mechanism converts the heat generated by the high heat dissipation element into electrical energy through the thermoelectric conversion unit to drive the energy management unit and the fan. The energy management unit cooperates with the DC-DC converter, super capacitor and current controller to achieve stable power supply to the fan. The fan is set at the top of the heat dissipation cavity, facing the position of multiple heat sinks. By optimizing the airflow path, the heat dissipation efficiency of the heat sink is further improved to ensure that the internal temperature of the chassis is always within a reasonable range.

[0024] (4) The present invention uses the thermoelectric conversion unit to drive the energy management unit to supply power using the heat inside the chassis, providing energy support for the fan, thereby achieving efficient recovery and utilization of thermal energy. The energy management unit stores excess electrical energy through supercapacitors and provides auxiliary power support when the output of the thermoelectric conversion unit is insufficient, thereby reducing the dependence of the cooling system on external power supply and reflecting the technical advantages of energy saving and environmental protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0026] Figure 1 It is a side sectional view of the chassis body of the present invention;

[0027] Figure 2 It is a top sectional view of the chassis body of the present invention;

[0028] Figure 3 is a three-dimensional diagram of the heat dissipation mechanism of the present invention;

[0029] Figure 4 is a front cross-sectional view of the heat conduction plate of the present invention;

[0030] Figure 5 is a front cross-sectional view of the support shell of the present invention;

[0031] Figure 6It is a flow chart of the auxiliary heat dissipation mechanism of the present invention. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0033] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0034] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0035] Example 1

[0036] Reference Figure 1 to Figure 5 , which is the first embodiment of the present invention, provides a computer case for computer data network data development, including a case body 100 and a heat dissipation mechanism 200 installed inside the case body 100. The heat dissipation mechanism 200 can effectively solve the problem of low heat dissipation efficiency of the existing case under high load conditions. Different from the traditional case using vents and fans to assist in heat dissipation, the present invention uses a high-efficiency heat dissipation design of a heat conduction plate 201 and a heat conduction pipe 202 to quickly conduct heat, and effectively dissipate heat through a cooling and heat dissipation unit 203, thereby avoiding unstable performance and shortened hardware life caused by hardware overheating. At the same time, the design of the heat dissipation mechanism reduces the risk of dust entering the inside of the case, reduces the difficulty of maintenance, and reduces dependence on fans through optimized heat dissipation methods, thereby effectively reducing noise pollution and improving the experience of the working environment.

[0037] Specifically, the chassis body 100 is the structural frame of the entire chassis, carrying all internal heat dissipation components and electronic hardware. The chassis body 100 is composed of an outer shell 101, and the front end of the outer shell 101 is provided with an installation cavity 102 for accommodating an installation frame 105 and related components. The rear end of the installation cavity 102 is connected to a cavity 103, and the cavity 103 is used to provide space to support the flow and air circulation of the internal heat dissipation system. The rear end of the outer shell 101 is provided with a heat dissipation cavity 104, which provides additional heat dissipation space and enhances the heat dissipation capacity of the chassis.

[0038] The mounting frame 105 is fixedly installed in the mounting cavity 102 and is the support base for the heat dissipation mechanism and other hardware components. A mounting slot 105a is provided at the front end of the mounting frame, and the slot is used to install high heat dissipation components, such as CPU, GPU and other components that generate a lot of heat. By tightly and stably fixing these high heat dissipation components in the slot, it is ensured that they can cooperate with the heat dissipation system efficiently, and the heat dissipation efficiency is not affected by vibration or looseness.

[0039] The heat dissipation mechanism 200 is a core component for efficient heat dissipation, which is installed on the back of the installation frame 105 and located directly behind the installation slot 105a. The heat dissipation mechanism 200 includes a heat conduction plate 201. The main function of the heat conduction plate 201 is to absorb the heat generated by high-heat electronic components such as CPU and GPU, and quickly guide the heat to the heat conduction pipe 202. Through the cooperation of the heat conduction plate 201 and the heat conduction pipe 202, it is ensured that the heat is quickly conducted from the heat source area and efficiently dissipated, avoiding overheating that affects the hardware performance.

[0040] The heat transfer tube 202 is located inside the heat transfer plate 201, and its main function is to transfer heat from the heat transfer plate 201 to the cooling and heat dissipation unit 203. The heat transfer tube 202 is filled with coolant, and the heat is taken away by the flow of the liquid, thereby improving the overall heat dissipation effect. The input end of the heat transfer tube 202 is connected to the coolant inlet 203d, and the output end is connected to the coolant outlet 203e, ensuring that the coolant can flow efficiently in the system to complete the conduction and dissipation of heat.

[0041] The cooling and heat dissipation unit 203 is a key part of the heat dissipation system, located at the bottom of the cavity 103, and fixedly installed in the support shell 203a. A cooling channel 203b is provided at the front end of the support shell 203a, and a heat sink 203c is fixedly installed at the rear end of the cooling channel 203b. The function of the heat sink 203c is to accelerate the heat dissipation by increasing the surface area. The rear end of the heat sink 203c passes through the rear wall of the installation cavity 102 and extends into the heat dissipation cavity 104, so that the heat sink can conduct heat to the external environment of the chassis.

[0042] A coolant inlet 203d is provided on the right side of the top of the cooling channel 203b, and a coolant outlet 203e is provided on the left side of the bottom. The coolant enters the cooling channel through the inlet, takes away the heat and is discharged through the outlet, forming a closed cycle. The input end and the output end of the heat transfer pipe 202 are respectively connected to the coolant inlet 203d and the coolant outlet 203e, ensuring smooth flow of the coolant and completing heat exchange.

[0043] To ensure the coolant flows stably, a micro-circulation pump 204 is fixedly installed at the liquid inlet and the liquid outlet of the heat transfer tube 202. The pump provides kinetic energy to push the coolant to circulate in the heat transfer tube and the cooling channel, ensuring that the heat dissipation system can operate efficiently for a long time. The use of the micro-circulation pump 204 reduces the instability of the coolant flow, improves the heat dissipation effect, and avoids the decrease in heat dissipation efficiency caused by poor flow.

[0044] The heat transfer tube 202 and the cooling channel 203b both have an "S"-shaped curved structure. This design not only increases the flow path of the coolant and prolongs the heat exchange time of the coolant, thereby improving the heat dissipation efficiency, but also optimizes the layout of the internal space of the chassis, making the overall structure more compact and reducing the occupied space.

[0045] In order to prevent dust from entering the chassis and affecting the heat dissipation effect, a sealing door is provided at the front end of the outer shell 101 to ensure that the installation cavity 102 is in a completely sealed state to prevent external dust from entering. The rear end of the heat dissipation cavity 104 is connected to the outside world, and the front end is completely isolated from the cavity 103 by a partition, thereby ensuring smooth heat dissipation air flow and effectively reducing dust accumulation, protecting internal components.

[0046] Through the above design, the computer case of the present invention realizes an efficient heat dissipation mechanism, which can effectively solve the problems of insufficient heat dissipation, dust accumulation and noise pollution of the traditional case, ensure the stable operation of the hardware under high load, and extend the service life of the case and its built-in devices. The reasonable layout and functional division of each component improves the overall heat dissipation efficiency and optimizes the use experience of the case.

[0047] Example 2

[0048] Reference Figure 1 , Figure 2 and Figure 6 , which is the second embodiment of the present invention. This embodiment is different from the previous embodiment in that an auxiliary heat dissipation mechanism 300 is added, and the auxiliary heat dissipation mechanism further improves the heat dissipation effect of the heat sink 203c; the auxiliary heat dissipation mechanism 300 adopts a thermoelectric conversion unit 301, which converts the heat in the high-temperature area into electrical energy through the thermoelectric effect, drives the fan 303 installed in the system, and optimizes the heat dissipation process. Different from the traditional heat dissipation fan, the auxiliary heat dissipation mechanism 300 does not need to consume a large amount of external power, and uses the heat generated inside the chassis to achieve self-power supply, thereby reducing energy consumption and improving heat dissipation efficiency.

[0049] Specifically, the auxiliary heat dissipation mechanism 300 includes a thermoelectric conversion unit 301 fixedly installed between the heat conduction plate 201 and the cooling and heat dissipation unit 203, an energy management unit 302 is arranged above the thermoelectric conversion unit 301, and a fan 303 is arranged at the rear end of the energy management unit 302. The hot end of the thermoelectric conversion unit 301 is fixed on the heat conduction plate 201 by close contact, and the cold end is in contact with the heat sink 203c of the cooling and heat dissipation unit 203, which further improves the heat conduction efficiency. The thermoelectric effect converts the heat generated by the heat dissipation into electrical energy, which provides power for the fan 303, thereby improving the heat dissipation effect of the entire chassis, and no additional external power consumption is required.

[0050] Thermoelectric conversion unit 301 is made of bismuth antimony tellurium (Bi2Te3) based thermoelectric material and uses TEC1-12706 thermoelectric module, which can generate about 3V voltage and 2W power at a working temperature difference of 40°C. The hot end of the thermoelectric module is fixed closely to the back of the heat conduction plate 201, while the cold end is in contact with the heat sink 203c of the cooling and heat dissipation unit 203, realizing energy conversion through thermoelectric effect, further improving heat dissipation efficiency. In this way, the thermoelectric conversion unit 301 converts the heat absorbed by the cold end into electrical energy to drive the operation of the heat dissipation system, thereby optimizing the heat dissipation effect of the chassis without the need for an external power supply.

[0051] The energy management unit 302 is responsible for regulating the electric energy generated by the thermoelectric conversion unit 301 to ensure that the fan 303 can operate stably. The energy management unit 302 includes a DC-DC converter 303a, a super capacitor 303b and a current controller 303c. The input end of the DC-DC converter 303a is connected to the output end of the thermoelectric conversion unit 301 through a wire, converting the low-voltage electric energy generated by the thermoelectric conversion unit into the voltage required by the fan 303, and transmitting the electric energy to the super capacitor 303b for storage. The current controller 303c adjusts the speed of the fan 303 in real time to meet the heat dissipation requirements under different load conditions. The output end of the current controller 303c is connected to the fan 303 through a wire to ensure that the fan can automatically adjust its operation according to the temperature changes inside the chassis.

[0052] The fan 303 is located at the top of the heat dissipation cavity 104, directly above the plurality of heat sinks 203c. The main function of the fan 303 is to enhance the heat dissipation effect of the heat sink 203c, accelerate the heat dissipation by accelerating the air flow, and ensure that the temperature in the chassis is always maintained within a reasonable range. The fan 303 adopts a 12V brushless DC fan with a power of 2W, which has low power consumption and a long service life. The speed of the fan is dynamically adjusted through the regulation of the current controller 303c to adapt to the heat dissipation requirements under different load conditions.

[0053] It should be noted that, according to the output power of the thermoelectric conversion unit 301 being 2W, the power requirements and matching conditions of each component are as follows:

[0054] 1. The DC-DC converter 303a converts the output voltage (about 3V) of the thermoelectric conversion unit 301 into a 12V voltage suitable for the fan 303. The input voltage range of the DC-DC converter is 0.5V to 5V, and the output voltage is 12V, which can support the stable operation of the fan 303. The conversion efficiency of the DC-DC converter 303a is above 85%, so it can effectively convert the electric energy provided by the thermoelectric module to ensure sufficient power for the system.

[0055] 2. The capacity of supercapacitor 303b is 2.7V, 1F, and is mainly used to store the excess power generated by thermoelectric conversion unit 301. When the output power of thermoelectric conversion unit 301 is low, supercapacitor 303b will store this power, and when the output of thermoelectric conversion unit 301 is insufficient, it will provide additional power support to fan 303 to ensure its stable operation. The capacity of supercapacitor is sufficient to cope with the short-term power demand of fan 303 and provide stable power support.

[0056] 3. The current controller 303c automatically adjusts the voltage and current according to the current demand of the fan 303, ensuring that the fan 303 can adaptively adjust the speed according to the change of the internal temperature of the chassis. The current controller 303c obtains electrical energy from the supercapacitor 303b and transmits it to the fan 303 to ensure that the fan can operate in the best state under different loads.

[0057] 4. Fan 303 is the core part of the heat dissipation system. Its main function is to accelerate air flow and enhance the heat dissipation effect of heat sink 203c. Fan 303 uses a 12V brushless DC fan with a power of 2W, which has low power consumption and long service life. The power and speed of fan 303 are adjusted by current controller 303c to meet the heat dissipation requirements under different loads. In this design, the power of fan 303 is mainly provided by thermoelectric conversion unit 301 and super capacitor 303b, avoiding the consumption of external power supply.

[0058] Preferably, the thermoelectric conversion unit 301 is fixed to the heat conduction plate 201 by screws and high thermal conductivity silicone grease, ensuring close contact between the hot end and the heat conduction plate, thereby maximizing the heat transfer efficiency. Its cold end is in close contact with the heat sink 203c of the cooling and heat dissipation unit 203 through the thermal conductive copper sheet, further enhancing the heat conduction effect and ensuring efficient temperature difference drive and heat dissipation performance. This design not only improves the conversion efficiency of the thermoelectric effect, but also enhances the heat exchange effect of the coolant, further optimizing the heat dissipation performance.

[0059] In summary, the present invention, through the innovative design of the auxiliary heat dissipation mechanism 300, utilizes the thermoelectric conversion unit 301 to convert the heat generated by the hardware into electrical energy to drive the fan 303, thereby improving the heat dissipation effect without consuming additional external power. Through the intelligent regulation of the energy management unit 302, the fan 303 can automatically adjust the speed according to the system requirements, so as to maintain stable operation and ensure that the temperature in the chassis is always within a reasonable range. At the same time, the system's efficient heat dissipation structure and intelligent control greatly improve the heat dissipation efficiency, reduce energy consumption, and improve the noise level of the working environment. The overall heat dissipation effect has been significantly improved, which can effectively cope with the heat dissipation needs under high load conditions, and provide a more environmentally friendly and efficient heat dissipation solution for modern computer equipment.

[0060] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), installation arrangement, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present invention. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other replacements, modifications, changes and omissions can be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the invention is not limited to a specific embodiment, but extends to several modifications still falling within the scope of the appended claims.

[0061] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0062] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0063] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A computer case for computer data network data development, characterized in that: include, The chassis body (100) comprises an outer shell (101), a mounting cavity (102) is provided at the front end of the inner part of the outer shell (101), a cavity (103) is communicated with the rear end of the mounting cavity (102), a heat dissipation cavity (104) is provided at the rear end of the outer shell (101), a mounting frame (105) is fixedly installed inside the mounting cavity (102), and a mounting groove (105a) is provided at the front end of the mounting frame (105); The heat dissipation mechanism (200) comprises a heat conduction plate (201) fixedly mounted on the back of the mounting frame (105) and located directly behind the mounting groove (105a), a heat conduction pipe (202) fixedly mounted inside the heat conduction plate (201), and a rear end of the heat conduction pipe (202) being connected to a cooling and heat dissipation unit (203); and, The auxiliary heat dissipation mechanism (300) comprises a thermoelectric conversion unit (301) fixedly mounted between the heat conduction plate (201) and the cooling and heat dissipation unit (203); an energy management unit (302) is arranged above the thermoelectric conversion unit (301); and a fan (303) is arranged at the rear end of the energy management unit (302).

2. The computer case for computer data network data development as claimed in claim 1, characterized in that: The energy management unit (302) comprises a DC-DC converter (303a), a super capacitor (303b) and a current controller (303c); the input end of the DC-DC converter (303a) is connected to the output end of the thermoelectric conversion unit (301) via a wire, and the output end is simultaneously connected to the input ends of the super capacitor (303b) and the current controller (303c); the output end of the current controller (303c) is connected to the fan (303) via a wire.

3. The computer case for computer data network data development as claimed in claim 2, characterized in that: The DC-DC converter (303a) is connected in parallel with the super capacitor (303b), and the super capacitor (303b) is used to store excess electric energy generated by the thermoelectric conversion unit (301) and to provide auxiliary electric energy to the fan (303) when the output of the thermoelectric conversion unit (301) is insufficient.

4. The computer case for computer data network data development as claimed in claim 2, characterized in that: The cooling and heat dissipation unit (203) comprises a supporting shell (203a) fixedly mounted at the bottom end of the cavity (103); a cooling channel (203b) is provided at the front end of the supporting shell (203a); a heat sink (203c) is fixedly mounted at the rear end of the cooling channel (203b); the rear end of the heat sink (203c) passes through the rear wall of the mounting cavity (102) and extends into the heat dissipation cavity (104); a coolant inlet (203d) is provided at the right side of the top end of the cooling channel (203b); a coolant outlet (203e) is provided at the left side of the bottom end of the cooling channel (203b); and the input end and the output end of the heat transfer pipe (202) are respectively connected to the coolant inlet (203d) and the coolant outlet (203e).

5. The computer case for computer data network data development as claimed in claim 4, characterized in that: The thermoelectric conversion unit (301) is made of bismuth antimony tellurium (Bi2Te3) based thermoelectric material, with its hot end tightly fixed on the back of the heat conduction plate (201) and its cold end in contact with and connected to the heat sink (203c) of the cooling and heat dissipation unit (203).

6. The computer case for computer data network data development as claimed in claim 5, characterized in that: The thermoelectric conversion unit (301) is fixed to the heat conduction plate (201) by means of screws and high thermal conductivity silicone grease, and its cold end is closely contacted and connected with the heat sink (203c) of the cooling and heat dissipation unit (203) by means of a thermal conductive copper sheet, thereby ensuring efficient temperature difference driving and heat dissipation performance.

7. The computer case for computer data network data development as claimed in claim 4, characterized in that: Cooling liquid is arranged inside the heat transfer tube (202), and a micro-circulation pump (204) is fixedly installed at the liquid inlet and the liquid outlet of the heat transfer tube (202).

8. The computer case for computer data network data development as claimed in claim 7, characterized in that: The heat transfer tube (202) and the cooling channel (203b) both present an "S"-shaped curved structure.

9. The computer case for computer data network data development as claimed in claim 8, characterized in that: A sealing door is provided at the front end of the outer shell (101) so that the installation cavity (102) is in a completely sealed state; the rear end of the heat dissipation cavity (104) is in communication with the outside, and the front end is completely isolated from the cavity (103) by a partition.

10. The computer case for computer data network data development as claimed in claim 9, characterized in that: A plurality of the heat sinks (203c) are provided, and the rear ends of the plurality of heat sinks (203c) are all arranged in the heat sink cavity (104), and the fan (303) is installed at the top of the heat sink cavity (104), directly above the plurality of heat sinks (203c).

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