Portable computer cooling system, portable computer and cooling method of portable computer

Abstract

The embodiment of the invention provides a portable computer heat dissipation system, a portable computer and a heat dissipation method of the portable computer. The portable computer heat dissipation system comprises a shell, a heat dissipation module and a heat dissipation module, the control mainboard is arranged in the shell; the heat dissipation module is arranged on the control main board and electrically connected with the control main board, and the heat dissipation module is used for conducting heat dissipation on the control main board; the first temperature sensor is arranged on the control main board and electrically connected with the control main board, and the first temperature sensor is used for acquiring the operating temperature of the surface of the control main board; the detection module is electrically connected with the control mainboard, the detection module is used for obtaining the use state of the portable computer, and the control mainboard controls the working state of the heat dissipation module according to the running temperature and the use state; according to the cooling system provided by the embodiment of the invention, the energy consumption of the portable computer and the noise generated by the cooling module can be controlled according to the interaction state of the operator and the portable computer, and the comfort of the operator in the interaction process with the portable computer is improved.

Description

Technical Field

[0001] The present application relates to but is not limited to the field of computer hardware technology, and in particular to a portable computer heat dissipation system, a portable computer and a heat dissipation method thereof. Background Art

[0002] As laptops become more and more popular, users are paying more and more attention to the temperature and noise experience of laptops in addition to the performance of the laptops themselves. The higher the temperature of the laptop, the higher the noise, and the lower the temperature, the lower the corresponding noise. Therefore, designing a reasonable thermal strategy has become an important research object in the industry.

[0003] At present, notebook noise optimization is mainly controlled by temperature threshold, speed level and rise and fall time. However, the current fan speed control strategy has a one-to-one correspondence with temperature, and does not comprehensively and effectively evaluate the actual user usage. Summary of the invention

[0004] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0005] The embodiments of the present application provide a portable computer heat dissipation system, a portable computer and a heat dissipation method thereof, which can control the energy consumption of the portable computer and the noise generated by the heat dissipation module according to the interaction state between the operator and the portable computer, thereby improving the comfort of the operator during the interaction with the portable computer.

[0006] To achieve the above-mentioned purpose, the first aspect of an embodiment of the present application proposes a portable computer heat dissipation system, including: a shell; a control motherboard, arranged in the shell; a heat dissipation module, arranged on the control motherboard and electrically connected to the control motherboard, the heat dissipation module is used to dissipate heat from the control motherboard; a first temperature sensor, arranged on the control motherboard and electrically connected to the control motherboard, the first temperature sensor is used to obtain the operating temperature of the surface of the control motherboard; a detection module, electrically connected to the control motherboard, the detection module is used to obtain the usage status of the portable computer, and the control motherboard controls the working status of the heat dissipation module according to the operating temperature and the usage status.

[0007] In some embodiments, the detection module includes a pressure sensor, which is arranged on the top surface of the shell. The pressure sensor is used to detect the operating pressure applied to the shell by an operator, and the control motherboard controls the working state of the heat dissipation module according to the operating pressure.

[0008] In some embodiments, when the operating pressure is less than a preset pressure threshold, the control mainboard obtains the operating temperature of the control mainboard through the first temperature sensor. If the operating temperature is less than a preset first safety temperature, the control mainboard controls the heat dissipation module to operate at a preset first silent heat dissipation power. If the operating temperature is greater than or equal to the first safety temperature, the control mainboard controls the heat dissipation module to operate at a preset first rapid heat dissipation power, wherein the first silent heat dissipation power is less than the first rapid heat dissipation power.

[0009] In some embodiments, when the operating pressure is greater than or equal to a preset pressure threshold, the control mainboard adjusts the working state of the heat dissipation module according to a preset power adjustment piecewise linear function.

[0010] In some embodiments, the detection module also includes a second temperature sensor, which is arranged on the top surface of the shell, and the second temperature sensor is electrically connected to the control main board. The second temperature sensor is used to obtain the touch temperature of the top surface of the shell, and the control main board determines the effectiveness of the operating pressure based on the touch temperature.

[0011] In some embodiments, the detection module includes a built-in keyboard, which is arranged on the top surface of the shell, and the built-in keyboard is electrically connected to the control main board. The detection module is used to obtain a first input state of the built-in keyboard to the control main board, and the detection module controls the working state of the heat dissipation module according to the first input state.

[0012] In some embodiments, when the detection module detects that the built-in keyboard is inputting into the control mainboard, the control mainboard obtains the operating temperature of the control mainboard through the first temperature sensor. If the operating temperature is lower than a preset second safety temperature, the control mainboard controls the heat dissipation module to operate at a preset second silent heat dissipation power. If the operating temperature is greater than or equal to the second safety temperature, the control mainboard controls the heat dissipation module to operate at a preset second rapid heat dissipation power, wherein the second silent heat dissipation power is lower than the second rapid heat dissipation power.

[0013] To achieve the above objective, a second aspect of an embodiment of the present application provides a portable computer, wherein the portable computer includes the portable computer heat dissipation system described in the first aspect.

[0014] To achieve the above-mentioned purpose, a third aspect of an embodiment of the present application proposes a portable computer heat dissipation method, which is applied to the portable computer heat dissipation system described in the first aspect, and the portable computer heat dissipation method includes: obtaining the use status of the portable computer and the operating temperature of the control mainboard; when the portable computer is in an interactive state, based on the operating temperature, adjusting the working state of the heat dissipation module according to a preset power adjustment nonlinear function, wherein the interactive state means that the portable computer is started, and the human-computer interaction device electrically connected to the control mainboard is in an interactive state; when the portable computer is in an interactive waiting state, based on the operating temperature, adjusting the working state of the heat dissipation module according to a preset power adjustment piecewise linear function, wherein the interactive waiting state means that the portable computer is started, but the human-computer interaction device electrically connected to the control mainboard is not in an interactive state.

[0015] To achieve the above-mentioned purpose, the fourth aspect of an embodiment of the present application proposes a storage medium, which is a computer-readable storage medium, and the storage medium stores a computer program. When the computer program is executed by a processor, the portable computer heat dissipation method described in the third aspect is implemented.

[0016] According to the solution provided in the embodiment of the present application, the control motherboard is the core component of the laptop computer. Due to the complexity of its calculation, a large amount of heat will be generated. The operating temperature of the control motherboard surface has a direct impact on the comfort of the operator. If the operating temperature of the control motherboard is too high, the surface of the portable computer may overheat, affecting the operator's feel and comfort. The use state of the portable computer includes a state in which an operator is operating the portable computer. In this state, the operator interacts with the portable computer through other human-computer interaction devices connected to the control mainboard. The operator's limbs need to contact the top surface of the inner shell of the portable computer. The temperature of the control mainboard affects the comfort of the operator in the process of interacting with the portable computer. Therefore, when the control mainboard determines through the detection module that the operator is interacting with the portable computer, the control mainboard obtains its own operating temperature through the first temperature sensor. When its own operating temperature is too high, the control mainboard increases the heat dissipation power of the heat dissipation module, thereby quickly reducing the operating temperature of the control mainboard to improve the comfort of the operator in the process of interacting with the portable computer; the use state of the portable computer also includes a state in which the portable computer is running, but the operator does not interact with the portable computer in a contact manner. In this state, the operator's limbs do not contact the shell of the portable computer, and the control mainboard allows its own temperature control requirements to be relaxed. The control mainboard reduces the heat dissipation power of the heat dissipation module, thereby reducing the energy consumption of the portable computer and reducing the noise generated by the heat dissipation module, thereby improving the operator's use experience.

[0017] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide further understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0019] Figure 1 An optional system block diagram of a portable computer heat dissipation system provided in an embodiment of the present application; Figure 2 An optional structural schematic diagram of the back of a portable computer provided in an embodiment of the present application; Figure 3 A schematic diagram of an optional structure of a built-in keyboard surface of a portable computer provided in an embodiment of the present application; Figure 4A schematic diagram of an optional function of a power adjustment nonlinear function provided in an embodiment of the present application; Figure 5 An optional function diagram of a power adjustment piecewise linear function provided in an embodiment of the present application; Figure 6 An optional function schematic diagram for comparing the multi-stage power adjustment nonlinear function provided in the embodiment of the present application; Figure 7 An optional flowchart of a portable computer method provided in an embodiment of the present application; Figure 8 A schematic diagram of an optional structure of a heat dissipation device provided in an embodiment of the present application; Fig. 9 A schematic diagram of an optional hardware structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0020] This section will describe in detail the specific embodiments of the present application. The preferred embodiments of the present application are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present application, but it cannot be understood as a limitation on the scope of protection of the present application.

[0021] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] In the description of this application, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0023] In the description of this application, unless otherwise clearly defined, terms such as setting, installation, and electrical connection should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0024] At present, notebook noise optimization is mainly controlled by temperature threshold, speed level and rise and fall time. However, the current fan speed control strategy has a one-to-one correspondence with temperature, and does not comprehensively and effectively evaluate the actual user usage.

[0025] In response to the problem of not fully and effectively evaluating the actual usage of users, the present application provides a portable computer cooling system, a portable computer and a cooling method thereof, which can control the energy consumption of the portable computer and the noise generated by the cooling module according to the interaction status of the operator with the portable computer, thereby improving the comfort of the operator during the interaction with the portable computer.

[0026] The portable computer heat dissipation system, portable computer and heat dissipation method thereof provided in the embodiments of the present application are specifically described through the following embodiments. First, the portable computer heat dissipation system in the embodiments of the present application is described.

[0027] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0028] Reference Figures 1 to 3 One embodiment of the present application provides a portable computer heat dissipation system, comprising: Housing 100; A control mainboard 200 is disposed in the housing 100; The heat dissipation module 300 is disposed on the control mainboard 200 and is electrically connected to the control mainboard 200. The heat dissipation module 300 is used to dissipate heat for the control mainboard 200. A first temperature sensor 400 is disposed on the control mainboard 200 and electrically connected to the control mainboard 200. The first temperature sensor 400 is used to obtain the operating temperature of the surface of the control mainboard 200; The detection module 500 is electrically connected to the control mainboard 200. The detection module 500 is used to obtain the use status of the portable computer. The control mainboard 200 controls the working status of the heat dissipation module 300 according to the operating temperature and the use status.

[0029] It is understandable that the control mainboard 200, as a core component of a laptop computer, will generate a large amount of heat due to the complexity of its calculations. The operating temperature of the surface of the control mainboard 200 has a direct impact on the comfort of the operator. If the operating temperature of the control mainboard 200 is too high, it may cause the surface of the portable computer to overheat, affecting the operator's feel and comfort. The use state of the portable computer includes the state in which the operator is operating the portable computer. In this state, the operator interacts with the portable computer through other human-computer interaction devices connected to the control mainboard 200. The operator's limbs need to contact the top surface of the inner shell 100 of the portable computer. The temperature of the control mainboard 200 affects the operator's comfort during the interaction with the portable computer. Therefore, when the control mainboard 200 determines that the operator is interacting with the portable computer through the detection module 500, the control mainboard 200 obtains its own operating temperature through the first temperature sensor 400. When its own operating temperature is too high, the control mainboard 200 increases. The heat dissipation power of the large heat dissipation module 300 is increased, thereby quickly reducing the operating temperature of the control mainboard 200 to improve the comfort of the operator during the interaction with the portable computer; the use state of the portable computer also includes a state in which the portable computer is running but the operator does not interact with the portable computer in a contact manner. In this state, the operator's limbs are not in direct contact with the shell 100 of the portable computer, and the control mainboard 200 is allowed to relax its own temperature control requirements. The control mainboard 200 reduces the heat dissipation power of the heat dissipation module 300, thereby reducing the energy consumption of the portable computer and reducing the noise generated by the heat dissipation module 300, thereby improving the operator's use experience.

[0030] In a specific embodiment, the heat dissipation module 300 includes a heat dissipation fan and a heat pipe. The heat dissipation fan is arranged in the shell 100. One section of the heat pipe is in close contact with the surface of the control main board 200. The other end of the heat pipe is arranged on the air outlet side of the heat dissipation fan. The end of the heat pipe located on the air outlet side of the heat dissipation fan is provided with heat dissipation fins. The heat generated by each computing element on the control main board 200 is absorbed by the end of the heat pipe in close contact with the control main board 200. The heat dissipation fins can increase the surface area of ​​the heat pipe for heat exchange with the air. When the heat dissipation fan is running, it will inhale the air in the shell 100 and make the air flow along the heat pipe and the heat dissipation fins, thereby taking away the heat accumulated on the heat pipe.

[0031] The operator may be using a portable computer to type, work, browse the web, or play games. The operator directly interacts with the laptop computer, inputs commands through the built-in keyboard 600, touchpad 700, touch screen and other human-computer interaction devices, and receives information through output devices such as display screens and speakers. The operator's hands are in direct contact with the top surface of the portable computing shell 100 and the built-in keyboard 600. When the operating temperature of the control motherboard 200 is too high, the heat is transferred to the top surface of the shell 100 through the shell 100, thereby increasing the temperature of the top surface of the shell 100 and the built-in keyboard 600. At this time, the control motherboard 200 adjusts the heat dissipation power of the heat dissipation module 300 according to its own operating temperature. , thereby improving its heat dissipation efficiency; or, the portable computer is executing a task that does not require continuous operation by the operator, such as file downloading, video playing or system updating, or the operator remotely controls the portable computer through a wired mouse, a wireless mouse, a wired keyboard and a wireless keyboard, and the operator does not directly interact with the human-computer interaction device connected to the portable computer by wire. At this time, the operator's limbs do not come into contact with the housing 100 of the portable computer. Therefore, the control motherboard 200 can relax the control requirements for the operating temperature and reduce the heat dissipation power of the heat dissipation module 300, thereby reducing the noise generated by the heat dissipation module 300 during the heat dissipation process and improving the operator's experience.

[0032] According to the use status of the portable computer, the portable computer cooling system integrates two sets of cooling control strategies, such as Figure 4 and Figure 5 As shown, Figure 4 It is a schematic diagram of the power adjustment nonlinear function. Figure 5 It is a schematic diagram of the piecewise linear function for power adjustment. Figure 4 and Figure 5The horizontal axis in the figure is the operating temperature of the control mainboard 200 detected by the first temperature sensor 400, and the vertical axis is the ratio of the heat dissipation power of the heat dissipation module 300 to the full-speed power. When the operator's limbs are not in contact with the housing 100, the control mainboard 200 adjusts the heat dissipation power of the heat dissipation module 300 according to the power adjustment nonlinear function based on the preset control frequency. When the operating temperature of the control mainboard 200 is lower than the preset safety temperature, it means that the operating temperature of the control mainboard 200 is at a safe level, and each computing element on the control mainboard 200 can operate normally. At this time, the control mainboard 200 controls the heat dissipation module 300 to dissipate heat at the preset silent heat dissipation power, which is relative to the power adjustment. In the entire piecewise linear function, the heat dissipation power indicated by the current operating temperature has a lower silent heat dissipation power, which can effectively reduce the energy consumption of the heat dissipation module 300 and reduce the noise generated by the heat dissipation module 300; when the operating temperature of the control mainboard 200 rises to a level greater than or equal to the safety temperature, it means that the operating temperature of the control mainboard 200 begins to affect the normal operation of the computing elements. At this time, the control mainboard 200 controls the heat dissipation module 300 to dissipate heat at a preset fast heat dissipation power, thereby quickly reducing the operating temperature of the control mainboard 200, ensuring the safety of the control mainboard 200, and also reducing the time that the heat dissipation module 300 dissipates heat at high power, that is, reducing the duration of high noise of the heat dissipation module 300.

[0033] When the operator's limbs come into contact with the shell 100, the control mainboard 200 adjusts the heat dissipation power of the heat dissipation module 300 according to the power adjustment piecewise linear function. Based on the preset control frequency, the control mainboard 200 determines the corresponding heat dissipation power in the power adjustment piecewise linear function according to the operating temperature; the power adjustment piecewise linear function can be divided into multiple linear functions, each linear function is located in a different temperature range and each linear function is connected in sequence. The higher the temperature, the greater the slope of the linear function in the corresponding temperature range, that is, when the temperature is higher, the greater the power change value determined by the heat dissipation power of the heat dissipation module 300 with the same temperature change value, until the heat dissipation power of the heat dissipation module 300 reaches the maximum power. On the contrary, when the operating temperature is lower, the power change value determined by the heat dissipation module 300 with the same temperature change value is greater. The cooling power of the cooling module 300 is small until it reaches the minimum start-up power. Therefore, when the operator is interacting with the portable computer, if the current operating temperature of the control motherboard 200 is at a low level, the cooling power of the cooling module 300 is also low. As the operating temperature slowly increases, the cooling power changes slowly, thereby reducing the power consumption of the cooling module 300 and reducing noise; if the operating temperature of the control motherboard 200 is at a high level, it means that the computing element is performing high-power calculations, and the cooling power of the cooling module 300 needs to be at a high level. As the operating temperature changes, it means that the power consumption of the computing element changes. Therefore, the cooling power of the cooling module 300 also needs to change more sensitively, so as to effectively control the operating temperature of the control motherboard 200 and ensure the safety of the computing elements on the control motherboard 200.

[0034] Reference Figure 3 As shown, in one embodiment of the present application, the detection module 500 includes a pressure sensor 510, which is arranged on the top surface of the shell 100. The pressure sensor 510 is used to detect the operating pressure applied to the shell 100 by the operator, and the control motherboard 200 controls the working state of the heat dissipation module 300 according to the operating pressure.

[0035] Specifically, the detection module 500 determines the usage status of the portable computer through the pressure detected by the pressure sensor 510. When the operating pressure is less than the preset pressure threshold, it means that the operator's limbs are not in contact with the shell 100 of the portable computer. When the operating pressure is greater than the preset pressure threshold, it means that the operator's limbs are in contact with the shell 100 of the portable computer. The operator interacts with the portable computer through a human-computer interaction device wired to the control motherboard 200.

[0036] Refer again Figure 4 and Figure 5When the operating pressure is less than the preset pressure threshold, the control mainboard 200 adjusts the heat dissipation power of the heat dissipation module 300 according to the power adjustment nonlinear function based on the preset control frequency. When the operating temperature of the control mainboard 200 is less than the preset safety temperature, it indicates that the operating temperature of the control mainboard 200 is at a safe level, and each computing element on the control mainboard 200 can operate normally. At this time, the control mainboard 200 controls the heat dissipation module 300 to dissipate heat at a preset silent heat dissipation power. Compared with the heat dissipation power indicated by the current operating temperature in the power adjustment piecewise linear function, the silent heat dissipation power is lower, thereby It can effectively reduce the energy consumption of the heat dissipation module 300 and reduce the noise generated by the heat dissipation module 300; when the operating temperature of the control mainboard 200 rises to be greater than or equal to the safety temperature, it means that the operating temperature of the control mainboard 200 begins to affect the normal operation of the computing elements. At this time, the control mainboard 200 controls the heat dissipation module 300 to dissipate heat at a preset fast heat dissipation power, thereby quickly reducing the operating temperature of the control mainboard 200, ensuring the safety of the control mainboard 200, and can also reduce the time for the heat dissipation module 300 to dissipate heat at high power, that is, reducing the duration of the heat dissipation module 300 maintaining high noise heat dissipation.

[0037] Specifically, when the operating pressure is less than a preset pressure threshold, the control mainboard 200 obtains the operating temperature of the control mainboard 200 through the first temperature sensor 400. If the operating temperature is less than the preset first safety temperature, the control mainboard 200 controls the heat dissipation module 300 to operate at a preset first silent heat dissipation power. If the operating temperature is greater than or equal to the first safety temperature, the control mainboard 200 controls the heat dissipation module 300 to operate at a preset first rapid heat dissipation power, wherein the first silent heat dissipation power is less than the first rapid heat dissipation power. When the operating pressure is greater than or equal to the preset pressure threshold, the control mainboard 200 adjusts the working state of the heat dissipation module 300 according to a preset power adjustment piecewise linear function.

[0038] In a specific embodiment, the operating temperature range is divided into more than two intervals based on the power adjustment nonlinear function of the operating temperature of the control mainboard 200, and each temperature interval corresponds to a safety power. When the operating temperature is in one of the temperature intervals, the heat dissipation power of the heat dissipation module 300 is controlled to the safety power corresponding to the temperature interval.

[0039] In a specific embodiment, referring to Figure 6As shown, the range division of the operating temperature in the power adjustment nonlinear function is the same as the division of the operating temperature in the power adjustment piecewise linear function, that is, each temperature interval in the power adjustment nonlinear function is the same as the temperature interval in the power adjustment piecewise linear function. In the power adjustment piecewise linear function, the heat dissipation power of the heat dissipation module 300 corresponding to each temperature interval is adjusted according to a linear function. In the power adjustment nonlinear function, the heat dissipation power of the heat dissipation module 300 corresponding to each temperature interval is equal to the maximum value or minimum value of the linear function in the same temperature interval of the power adjustment piecewise linear function. When the temperature interval is too large, the heat dissipation power taken by the power adjustment nonlinear function in the temperature interval is equal to the corresponding linear function in the power adjustment piecewise linear function. The maximum value of the linear function. On the contrary, when the temperature range is small, the heat dissipation power taken by the power adjustment nonlinear function in the temperature range is equal to the minimum value of the corresponding linear function in the power adjustment piecewise linear function; for example, assuming that in the power adjustment piecewise linear function, the linear function with a temperature range of 20 degrees Celsius to 40 degrees Celsius is W=10+0.3T, where W represents the ratio of the heat dissipation power of the heat dissipation module 300 to the full-speed power, in %, and T represents the operating temperature of the control motherboard 200. When the operating temperature is 20 degrees Celsius, the heat dissipation power is 0.16×full-speed power, and when the operating temperature is 40 degrees Celsius, the heat dissipation power is 0.22×full-speed power. Correspondingly, in the power adjustment nonlinear function In the number, the safe power when the temperature range is 20 degrees Celsius to 40 degrees Celsius takes the minimum value of the linear function W=20+0.5T when it is 20 degrees Celsius to 40 degrees Celsius, that is, 0.16×full speed power. At this time, the operating temperature of the control motherboard 200 is still at a safe level. By controlling the heat dissipation power at a lower level based on the power adjustment nonlinear function, the power consumption of the heat dissipation module 300 can be effectively reduced and the noise of the heat dissipation module 300 can be reduced. Under the premise that the operating power of the control motherboard 200 does not change significantly, the control motherboard 200 can also maintain a stable and comfortable operating temperature. For another example, assuming that in the power adjustment nonlinear function, the linear function of the temperature range is 60 degrees Celsius to 80 degrees Celsius is W= 20+0.5T, when the operating temperature is 60 degrees Celsius, the heat dissipation power is 0.5×full-speed power, and when the operating temperature is 80 degrees Celsius, the heat dissipation power is 0.6×full-speed power. Correspondingly, in the power adjustment nonlinear function, the safety power in the temperature range of 60 degrees Celsius to 80 degrees Celsius takes the maximum value of the linear function W=20+0.5T in the range of 60 degrees Celsius to 80 degrees Celsius, that is, the safety power in the range of 60 degrees Celsius to 80 degrees Celsius is equal to 0.6×full-speed power. Therefore, when the operating temperature of the control mainboard 200 is low, by fixing the heat dissipation power at a higher level, the control mainboard 200 can be quickly cooled down, thereby improving the comfort of the operator during the interaction with the portable computer.

[0040] Reference Figure 3 As shown, in a specific embodiment, the detection module 500 also includes a second temperature sensor 520, which is arranged on the top surface of the shell 100. The second temperature sensor 520 is electrically connected to the control main board 200. The second temperature sensor 520 is used to obtain the touch temperature of the top surface of the shell 100, and the control main board 200 determines the effectiveness of the operating pressure based on the touch temperature.

[0041] Specifically, the detection module 500 simultaneously detects the operating pressure detected by the pressure sensor 510 and the touch temperature detected by the second temperature sensor 520. If the operating pressure detected by the pressure sensor 510 is greater than the preset pressure threshold, and the touch temperature detected by the second temperature sensor 520 is less than the preset first temperature threshold or greater than the preset second temperature threshold, it means that the operating pressure detected by the pressure sensor 510 is not obtained by the operator's limbs contacting the top surface of the shell 100, that is, the operator does not directly interact with the portable computer, and there are other heavy objects placed on the top surface of the shell 100. At this time, the control motherboard 200 adjusts the heat dissipation power of the heat dissipation module 300 according to the power adjustment piecewise linear function; when the operation detected by the pressure sensor 510 is greater than the pressure threshold, and the touch temperature detected by the second temperature sensor 520 is greater than the first temperature threshold and less than the second temperature threshold, it means that the operator's limbs are in contact with the top surface of the shell 100. At this time, the control motherboard 200 adjusts the heat dissipation power of the heat dissipation module 300 according to the power adjustment nonlinear function.

[0042] In addition, in one embodiment of the present application, considering that during the interaction between the operator and the portable computer, the operator's limbs do not necessarily come into direct contact with the shell 100, the operator's hands come into contact with the built-in keyboard 600 located on the top surface of the shell 100. Due to the design of the built-in keyboard 600 and for the pressing feel of the built-in keyboard 600 itself, it is difficult to install a pressure sensor 510 on the built-in keyboard 600. Therefore, the detection module 500 will also obtain the input status of the built-in keyboard 600, mouse (not shown in the figure), touchpad 700 or touch screen (not shown in the figure) and other human-computer interaction devices to the control mainboard 200, and adjust the heat dissipation power of the heat dissipation module 300 according to the input status.

[0043] Specifically, for the built-in keyboard 600 fixed on the top surface of the shell 100, the detection module 500 is used to obtain the first input state of the built-in keyboard 600 to the control mainboard 200. When the detection module 500 detects that the built-in keyboard 600 is inputting to the control mainboard 200, the control mainboard 200 obtains the operating temperature of the control mainboard 200 through the first temperature sensor 400. If the operating temperature is lower than the preset second safety temperature, the control mainboard 200 controls the heat dissipation module 300 to operate at a preset second silent heat dissipation power. If the operating temperature is greater than or equal to the second safety temperature, the control mainboard 200 controls the heat dissipation module 300 to operate at a preset second rapid heat dissipation power, wherein the second silent heat dissipation power is lower than the second rapid heat dissipation power.

[0044] It can be understood that, based on the first input state of the built-in keyboard 600 to the control mainboard 200, when the built-in keyboard 600 is inputting to the control mainboard 200, that is, the operator's hand is in contact with the built-in keyboard 600, the control mainboard 200 adjusts the heat dissipation power of the heat dissipation module 300 based on its own operating temperature according to the power adjustment nonlinear function mentioned in the above embodiment; based on the input state of the human-computer interaction device such as the mouse, touchpad or touch screen that is wired to the control mainboard 200 to the control mainboard 200, when the detection module 500 determines that the operator is in direct contact with the shell 100 of the portable computer, the control mainboard 200 adjusts the heat dissipation power of the heat dissipation module 300 based on its own operating temperature according to the power adjustment nonlinear function mentioned in the above embodiment.

[0045] In addition, an embodiment of the present application further provides a portable computer, which may be a laptop computer, a portable workstation, a PDA, a smart phone, a tablet computer, etc. The portable computer includes the portable computer heat dissipation system in the above embodiment.

[0046] It can be understood that the specific implementation of the portable computer is substantially the same as the specific implementation of the portable computer heat dissipation system described above, and will not be described in detail herein.

[0047] In addition, refer to Figure 7 As shown, the embodiment of the present application further provides a portable computer heat dissipation method, which is applied to the portable computer heat dissipation system in the above embodiment and a portable computer including the portable computer heat dissipation system. The portable computer heat dissipation method includes but is not limited to the following steps S710 to S730: Step S710, obtaining the use status of the portable computer and controlling the operating temperature of the mainboard; Step S720, when the portable computer is in an interactive state, adjusting the working state of the heat dissipation module according to a preset power adjustment nonlinear function based on the operating temperature, wherein the interactive state refers to that the portable computer is started and the human-computer interaction device electrically connected to the control mainboard is in an interactive state; Step S730, when the portable computer is in an interactive waiting state, based on the operating temperature, the working state of the heat dissipation module is adjusted according to a preset power adjustment piecewise linear function, wherein the interactive waiting state indicates that the portable computer is started, but the human-computer interaction device electrically connected to the control mainboard is not in an interactive state.

[0048] The above-mentioned portable computer heat dissipation method and portable computer heat dissipation system are based on the same inventive concept, which will not be described in detail here.

[0049] In addition, refer to Figure 8 The present application also provides a heat dissipation device 800, comprising: The acquisition module 801 is used to acquire the use status of the portable computer and control the operating temperature of the mainboard; The first processing module 802 is used to adjust the working state of the heat dissipation module according to a preset power adjustment nonlinear function based on the operating temperature when the portable computer is in an interactive state; The second processing module 803 is used to adjust the working state of the heat dissipation module according to a preset power adjustment piecewise linear function based on the operating temperature when the portable computer is in the interactive waiting state.

[0050] The heat dissipation device 800 and the heat dissipation method for a portable computer are based on the same inventive concept, which will not be described in detail herein.

[0051] In addition, refer to Fig. 9 , Fig. 9 The hardware structure of an electronic device of another embodiment is illustrated, and the electronic device includes: The processor 901 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application; The memory 902 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 902 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 902, and the processor 901 calls and executes the portable computer heat dissipation method of the embodiment of the present application; Input / output interface 903, used to implement information input and output; Communication interface 904, used to realize communication interaction between the device and other devices, which can be realized through wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.); A bus 905 that transmits information between various components of the device (e.g., the processor 901, the memory 902, the input / output interface 903, and the communication interface 904); The processor 901 , the memory 902 , the input / output interface 903 and the communication interface 904 are connected to each other in communication within the device via a bus 905 .

[0052] An embodiment of the present application also provides a storage medium, which is a computer-readable storage medium used for computer-readable storage. The storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the above-mentioned portable computer heat dissipation method.

[0053] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0054] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0055] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0056] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0057] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0058] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0059] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0060] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0061] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0062] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A portable computer cooling system, characterized in that: include: case; A control mainboard, arranged in the housing; A heat dissipation module, arranged on the control mainboard and electrically connected to the control mainboard, the heat dissipation module being used to dissipate heat from the control mainboard; A first temperature sensor, disposed on the control mainboard and electrically connected to the control mainboard, the first temperature sensor being used to obtain an operating temperature of a surface of the control mainboard; The detection module is electrically connected to the control mainboard, and the detection module is used to obtain the use status of the portable computer. The control mainboard controls the working status of the heat dissipation module according to the operating temperature and the use status.

2. The portable computer heat dissipation system according to claim 1, characterized in that: The detection module includes a pressure sensor, which is arranged on the top surface of the shell. The pressure sensor is used to detect the operating pressure applied to the shell by an operator, and the control mainboard controls the working state of the heat dissipation module according to the operating pressure.

3. The portable computer cooling system according to claim 2, characterized in that: When the operating pressure is less than a preset pressure threshold, the control mainboard obtains the operating temperature of the control mainboard through the first temperature sensor. If the operating temperature is less than a preset first safety temperature, the control mainboard controls the heat dissipation module to operate at a preset first silent heat dissipation power. If the operating temperature is greater than or equal to the first safety temperature, the control mainboard controls the heat dissipation module to operate at a preset first rapid heat dissipation power, wherein the first silent heat dissipation power is less than the first rapid heat dissipation power.

4. The portable computer cooling system according to claim 2, characterized in that: When the operating pressure is greater than or equal to a preset pressure threshold, the control mainboard adjusts the working state of the heat dissipation module according to a preset power adjustment piecewise linear function.

5. The portable computer cooling system according to claim 2, characterized in that: The detection module also includes a second temperature sensor, which is arranged on the top surface of the shell, and is electrically connected to the control main board. The second temperature sensor is used to obtain the touch temperature of the top surface of the shell, and the control main board determines the validity of the operating pressure based on the touch temperature.

6. The portable computer heat dissipation system according to claim 1, characterized in that: The detection module includes a built-in keyboard, which is arranged on the top surface of the shell and is electrically connected to the control mainboard. The detection module is used to obtain a first input state of the built-in keyboard to the control mainboard, and the detection module controls the working state of the heat dissipation module according to the first input state.

7. The portable computer heat dissipation system according to claim 6, characterized in that: When the detection module detects that the built-in keyboard is inputting into the control mainboard, the control mainboard obtains the operating temperature of the control mainboard through the first temperature sensor. If the operating temperature is lower than a preset second safety temperature, the control mainboard controls the heat dissipation module to operate at a preset second silent heat dissipation power. If the operating temperature is greater than or equal to the second safety temperature, the control mainboard controls the heat dissipation module to operate at a preset second rapid heat dissipation power, wherein the second silent heat dissipation power is lower than the second rapid heat dissipation power.

8. A portable computer, characterized in that: The portable computer comprises the portable computer heat dissipation system according to any one of claims 1 to 7.

9. A portable computer heat dissipation method, characterized in that: The portable computer heat dissipation method is applied to the portable computer heat dissipation system according to any one of claims 1 to 7, and the portable computer heat dissipation method comprises: Get the usage status of the portable computer and control the operating temperature of the motherboard; When the portable computer is in an interactive state, the working state of the heat dissipation module is adjusted according to a preset power adjustment nonlinear function based on the operating temperature, wherein the interactive state means that the portable computer is started and the human-computer interaction device electrically connected to the control mainboard is in an interactive state; When the portable computer is in an interactive waiting state, the working state of the heat dissipation module is adjusted based on the operating temperature according to a preset power adjustment piecewise linear function, wherein the interactive waiting state indicates that the portable computer is started, but the human-computer interaction device electrically connected to the control mainboard is not in an interactive state.

10. A storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the portable computer heat dissipation method of claim 9 is implemented.

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