Chip ceramic inductor and inductance value adjusting method thereof

Abstract

The invention belongs to the technical field of electronic component manufacturing, and discloses a chip ceramic inductor and an inductance value adjusting method thereof.The chip ceramic inductor comprises a first substrate part, a coil part, a second substrate part and two outer electrodes, the coil part is arranged between the first substrate part and the second substrate part, and the two outer electrodes are connected to the two opposite ends of the chip ceramic inductor respectively; a first leading-out end of the coil part is electrically connected with one external electrode, and a second leading-out end of the coil part is electrically connected with the other external electrode, and the method comprises the following steps: S1, manufacturing the first substrate part, the coil part and the second substrate part; s2, processing to obtain the chip ceramic inductor; s3, testing the actual inductance value of the chip ceramic inductor; s4, when the difference value between the actual inductance value and the calibrated inductance value is larger than the tolerance, returning to S1, and changing the ratio of the thickness a of the first substrate part to the thickness b of the second substrate part until the difference value between the actual inductance value and the calibrated inductance value is smaller than or equal to the tolerance; s5, producing the chip ceramic inductors in batches; the internal structure does not need to be changed, cost is low, operation is easy, and precision is high.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component manufacturing, and in particular to a chip-type ceramic inductor and a method for adjusting the inductance thereof. Background Art

[0002] Inductors are the most basic component of electronic devices. They have the functions of screening signals, filtering noise, stabilizing current and suppressing electromagnetic interference. They can convert electrical energy into magnetic energy and store it. They are generally composed of a skeleton, windings, shielding covers, packaging materials, magnetic cores or iron cores, etc. The magnetic cores or copper cores, iron cores, etc. are installed in the inner cavity of the skeleton. Inductors will generate electromotive force due to changes in the current passing through them, thereby resisting changes in current. When there is no current passing through them, they will try to prevent the current from flowing through them when the circuit is connected. If there is current passing through the inductor, it will try to maintain the current unchanged when the circuit is disconnected. When AC interference signals pass through the inductor, they are converted into magnetic induction and heat energy. Higher frequencies are most easily impedanceed by the inductor, which can suppress higher frequency interference signals. Inductance, also known as self-inductance coefficient, is a physical quantity that represents the ability of an inductor to generate self-inductance. The size of the inductance of an inductor mainly depends on the number of turns of the coil, the winding method, the presence or absence of a magnetic core, and the material of the magnetic core, etc. Usually, the more turns the coil has and the denser the wound coil is, the greater the inductance. The coil with a magnetic core has a greater inductance than the coil without a magnetic core. The greater the magnetic permeability of the magnetic core, the greater the inductance.

[0003] With the rapid development of consumer electronics, electronic components have been developing towards miniaturization and high frequency. Chip ceramic inductors are increasingly widely used due to their many advantages. The industry has strict tolerance requirements on the inductance value of chip ceramic inductors. However, due to fluctuations in the manufacturing process, it is difficult to ensure stability between batches, resulting in a reduction in the qualified rate and a waste of resources. The inductance adjustment method of the chip ceramic inductor in the prior art adjusts the inductance by adding an adjustment wiring layer or changing the lamination sequence of the inductor to reduce the difference between the actual inductance and the calibrated inductance to meet the tolerance requirements, but increases the manufacturing cost and increases the difficulty of operation.

[0004] Therefore, a device is urgently needed to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a chip-type ceramic inductor with a simple structure.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A chip ceramic inductor comprises a first substrate portion, a coil portion, a second substrate portion and two external electrodes, wherein the coil portion is sandwiched between the first substrate portion and the second substrate portion, and the two external electrodes are respectively connected to opposite ends of the chip ceramic inductor, wherein the first substrate portion comprises a plurality of stacked first substrates, and the second substrate portion comprises a plurality of stacked second substrates, and the coil portion comprises a first lead-out end and a second lead-out end, wherein the first lead-out end is electrically connected to one of the external electrodes, and the second lead-out end is electrically connected to the other of the external electrodes.

[0008] Preferably, the coil portion includes a first lead-out sheet, several intermediate sheets, and a second lead-out sheet stacked in sequence, the first lead-out sheet is provided with a first lead-out coil, the first lead-out end is provided at the end of the first lead-out coil, several intermediate sheets are provided with an electrode coil, the second lead-out sheet is provided with a second lead-out coil, the second lead-out end is provided at the end of the second lead-out coil, and the first lead-out coil, the multiple electrode coils and the second lead-out coil are electrically connected in sequence.

[0009] Preferably, the coil portion also includes a connecting member, a first through hole is provided on the first lead-out piece, a second through hole is provided on the second lead-out piece, and a third through hole is provided on the intermediate piece, the connecting member is sequentially passed through the first through hole, several of the third through holes and the second through hole, and the connecting member electrically connects the first lead-out coil, the plurality of electrode coils and the second lead-out coil, and the top of the connecting member abuts against the lower end surface of the first substrate close to the first lead-out piece, and the bottom of the connecting member abuts against the upper end surface of the second substrate close to the second lead-out piece.

[0010] Preferably, two ends of the two outer electrodes are bent to form a first opening and a second opening respectively, and inner walls of the first opening and inner walls of the second opening are both attached to the outermost first substrate and the outermost second substrate.

[0011] Preferably, the lengths of the first substrate, the second substrate, the first lead-out plate, the second lead-out plate and the middle plate are all 1±0.15 mm, and the widths are all 0.5±0.15 mm.

[0012] Preferably, a marking layer is provided on the upper end surface of the outermost layer of the first substrate.

[0013] Another object of the present invention is to provide a method for adjusting the inductance of a chip ceramic inductor, which has low cost, simple operation and high precision.

[0014] To achieve this object, the present invention adopts the following technical solutions:

[0015] A method for adjusting the inductance of a chip ceramic inductor, using the above chip ceramic inductor, comprises the following steps:

[0016] S1, manufacturing a first substrate portion, a coil portion and a second substrate portion;

[0017] S2, processing to obtain a chip ceramic inductor;

[0018] S3, testing the actual inductance of the chip ceramic inductor;

[0019] S4, when the difference between the actual inductance and the calibrated inductance is greater than the tolerance, return to S1, adjust the number of layers of the first substrate and the number of layers of the second substrate, change the ratio of the thickness a of the first substrate portion to the thickness b of the second substrate portion, and when the difference between the actual inductance and the calibrated inductance is less than or equal to the tolerance, execute step S5;

[0020] S5. Batch produce the chip ceramic inductors.

[0021] Preferably, the S1 includes:

[0022] S1.1. A plurality of first substrates are stacked to form the first substrate portion;

[0023] S1.2, a plurality of second substrates are stacked to form the second substrate portion;

[0024] S1.3, setting a first lead-out coil on the first lead-out sheet;

[0025] S1.4, setting an electrode coil on the middle sheet;

[0026] S1.5. Arrange a second lead-out coil on the second lead-out sheet;

[0027] S1.6. Stack the first lead-out sheet, a set number of the intermediate sheets, and the second lead-out sheet to form the coil portion.

[0028] Preferably, the S2 includes:

[0029] S2.1, sandwiching the coil portion between the first substrate portion and the second substrate portion;

[0030] S2.2, isostatically pressing the first substrate portion, the coil portion, and the second substrate portion;

[0031] S2.3, cutting, sintering, silver dipping and nickel-tin electroplating;

[0032] S2.4. Electrically connect the first lead end of the coil portion to an external electrode, and electrically connect the second lead end of the coil portion to another external electrode.

[0033] Preferably, the S3 includes:

[0034] S3.1. Connect the two outer electrodes to an inductance tester;

[0035] S3.2. Read the data on the inductance tester to obtain the actual inductance.

[0036] Beneficial effects: The present invention provides a chip ceramic inductor, comprising a first substrate portion, a coil portion, a second substrate portion and two external electrodes, wherein the coil portion is sandwiched between the first substrate portion and the second substrate portion, and the two external electrodes are respectively connected to opposite ends of the chip ceramic inductor, wherein the first substrate portion comprises a plurality of stacked first substrates, and the second substrate portion comprises a plurality of stacked second substrates, and the coil portion comprises a first lead-out terminal and a second lead-out terminal, wherein the first lead-out terminal is electrically connected to one of the external electrodes, and the second lead-out terminal is electrically connected to the other of the external electrodes, and a method for adjusting the inductance of a chip ceramic inductor is also provided, wherein the above-mentioned chip ceramic inductor is applied. The device comprises the following steps: S1, manufacturing a first substrate portion, a coil portion and a second substrate portion; S2, processing to obtain a chip ceramic inductor; S3, testing the actual inductance of the chip ceramic inductor; S4, when the difference between the actual inductance and the calibrated inductance is greater than the tolerance, returning to S1, adjusting the number of layers of the first substrate and the number of layers of the second substrate, changing the ratio of the thickness a of the first substrate portion to the thickness b of the second substrate portion, and when the difference between the actual inductance and the calibrated inductance is less than or equal to the tolerance, executing step S5; S5, mass-producing the chip ceramic inductor; there is no need to change the internal structure or the stacking sequence, and the cost is low, the operation is simple, and the precision is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a partially exploded schematic diagram of a chip ceramic inductor provided by the present invention;

[0038] Figure 2 It is a schematic diagram of the structure of the chip ceramic inductor provided by the present invention.

[0039] In the figure: 1. first substrate portion; 11. first substrate; 2. coil portion; 21. first lead-out plate; 210. first lead-out coil; 211. first through hole; 22. middle plate; 220. electrode coil; 221. third through hole; 23. second lead-out plate; 230. second lead-out coil; 231. second through hole; 24. connector; 3. second substrate portion; 31. second substrate; 4. external electrode; 5. marking layer. DETAILED DESCRIPTION

[0040] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0041] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0043] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0044] Embodiment 1

[0045] This embodiment provides a chip ceramic inductor, such as Figure 1 and Figure 2As shown, it includes a first substrate portion 1, a coil portion 2, a second substrate portion 3 and two external electrodes 4, wherein the coil portion 2 is sandwiched between the first substrate portion 1 and the second substrate portion 3, and the two external electrodes 4 are respectively connected to the opposite ends of the chip ceramic inductor. In this embodiment, the first substrate portion 1 is arranged at the top, and the two external electrodes 4 are respectively connected to the opposite ends of the chip ceramic inductor along the length direction. The coil portion 2 is provided with a first lead-out end and a second lead-out end, and the first lead-out end is electrically connected to one of the external electrodes 4, and the second lead-out end is electrically connected to the other external electrode 4.

[0046] Furthermore, if Figure 1 As shown, the first substrate portion 1 includes a plurality of stacked first substrates 11, the second substrate portion 3 includes a plurality of stacked second substrates 31, preferably, the first substrate 11 and the second electrode piece are both ceramic sheets, the coil portion 2 includes a first lead-out sheet 21, a plurality of intermediate sheets 22, and a second lead-out sheet 23 stacked in sequence, the first lead-out sheet 21 is provided with a first lead-out coil 210, the intermediate sheet 22 is provided with an electrode coil 220, and the second lead-out sheet 23 is provided with a second lead-out coil 230. It can be understood that the first lead-out end is one end of the first lead-out coil 210, and the second lead-out end is one end of the second lead-out coil 230. Further, the other end of the first lead-out coil 210, the plurality of electrode coils 220 and the other end of the second lead-out coil 230 are electrically connected in sequence.

[0047] In this embodiment, the first substrate portion 1 is arranged at the top, and a marking layer 5 is provided on the upper end surface of the outermost first substrate 11 . When the inductance of the chip ceramic inductor is tested, the testing direction can be determined by the marking layer 5 .

[0048] Since the number of layers of the intermediate sheet 22 , that is, the number of layers of the electrode coil 220 can determine the inductance of the chip ceramic inductor, in this embodiment, the number of layers of the intermediate sheet 22 is determined according to the required inductance value.

[0049] Preferably, the first substrate 11, the second substrate 31, the first lead-out plate 21, the second lead-out plate 23 and the intermediate plate 22 are all 1±0.15 mm in length and 0.5±0.15 mm in width.

[0050] In this embodiment, the first lead coil 210 is arranged on the side of the first lead sheet 21 away from the second lead sheet 23, the electrode coil 220 is arranged on the side of the middle sheet 22 away from the second lead sheet 23, and the second lead coil 230 is arranged on the side of the second lead sheet 23 close to the middle sheet 22, so as to electrically connect the first lead coil 210, a plurality of electrode coils 220 and the second lead coil 230 in sequence. Preferably, the first lead coil 210 is printed on the first lead sheet 21, and similarly, the electrode coil 220 is printed on the middle sheet 22, and the second lead coil 230 is printed on the second lead sheet 23, so as to reduce the thickness of the coil part 2 and realize the miniaturization of the components.

[0051] Furthermore, if Figure 2 As shown, the coil portion 2 also includes a connector 24 for electrically connecting the first lead coil 210, several electrode coils 220 and the second lead coil 230 in sequence. Specifically, a first through hole 211 is provided on the first lead sheet 21, a second through hole 231 is provided on the second lead sheet 23, and a third through hole 221 is provided on the intermediate sheet 22. The connector 24 is sequentially penetrated through the first through hole 211, several third through holes 221 and the second through hole 231 so as to be able to contact the first lead coil 210, the electrode coil 220 and the second lead coil 230, and the top of the connector 24 abuts against the lower end surface of the first substrate 11 closest to the first lead sheet 21, and the bottom of the connector 24 abuts against the upper end surface of the second substrate 31 closest to the second lead sheet 23 so as to be separated from the first substrate portion 1 and the second substrate portion 3. Preferably, the other end of the first lead-out coil 210, the other end of the plurality of electrode coils 220 and the other end of the second lead-out coil 230 are all electrically connected to the connector 24, and the outer wall of the connector 24 is clamped against the hole wall of the first through hole 211, the hole wall of the second through hole 231 and the hole wall of the third through hole 221 to improve the stability of the structure and prevent poor contact from affecting product quality.

[0052] Preferably, both ends of the two external electrodes 4 are bent to form a first opening and a second opening. In the present embodiment, the first opening and the second opening are both n-shaped openings, and the inner wall of the first opening and the inner wall of the second opening are both attached to the outermost first substrate 11 and the outermost second substrate 31 to achieve stable connection of the external electrodes 4.

[0053] Embodiment 2

[0054] This embodiment provides a method for adjusting the inductance of a chip ceramic inductor, using the above-mentioned chip ceramic inductor, and comprising the following steps:

[0055] S1, manufacturing a first substrate portion 1, a coil portion 2 and a second substrate portion 3;

[0056] S2, processing to obtain a chip ceramic inductor;

[0057] S3. Test the actual inductance of the chip ceramic inductor;

[0058] S4, when the difference between the actual inductance and the calibrated inductance is greater than the tolerance, return to S1, adjust the number of layers of the first substrate 11 and the number of layers of the second substrate 31, change the ratio of the thickness a of the first substrate portion 1 to the thickness b of the second substrate portion 3, and when the difference between the actual inductance and the calibrated inductance is less than or equal to the tolerance, execute step S5;

[0059] S5. Mass production of chip ceramic inductors.

[0060] For S1, specifically, it includes:

[0061] S1.1, a plurality of first substrates 11 are stacked to form a first substrate portion 1;

[0062] S1.2, a plurality of second substrates 31 are stacked to form a second substrate portion 3;

[0063] S1.3, printing the first lead-out coil 210 on the first lead-out sheet 21;

[0064] S1.4, printing the electrode coil 220 on the intermediate sheet 22;

[0065] S1.5, printing the second lead coil 230 on the second lead sheet 23;

[0066] S1.6. Stack the first lead-out piece 21, a set number of intermediate pieces 22, and the second lead-out piece 23 to form the coil portion 2.

[0067] The number of layers of the intermediate sheet 22 is set according to the inductance requirement (calibrated inductance). Furthermore, the first substrate 11, the second substrate 31, the first lead sheet 21, the intermediate sheet 22 and the second lead sheet 23 are all made of ceramic sheets. Multiple first substrates 11 are stacked to form a first substrate portion 1, and multiple second substrates 31 are stacked to form a second substrate portion 3. Furthermore, a first lead coil 210 is arranged on the first lead sheet 21 by printing technology, and one end of the first lead coil 210 is arranged at the edge of the first lead sheet 21, and a first through hole 211 is arranged on the first lead sheet 21, so that the first through hole 211 extends to the other end of the first lead coil 210, and an electrode coil 220 is arranged on the intermediate sheet 22 by printing technology, and a third through hole 221 is arranged on the intermediate sheet 22, so that the third through hole 221 of the uppermost intermediate sheet 22 is opposite to the first through hole 211, and the adjacent intermediate sheets 22 The third through hole 221 on one of the intermediate sheets 22 extends to one end of the electrode coil 220 thereon, and the third through hole 221 on the other intermediate sheet 22 extends to the other end of the electrode coil 220 thereon. The second lead coil 230 is arranged on the second lead sheet 23 by printing technology, and one end of the second lead coil 230 is arranged at the edge of the second lead sheet 23. At the same time, a second through hole 231 is arranged on the second lead sheet 23, so that the second through hole 231 extends to the other end of the second lead coil 230, and the second through hole 231 is opposite to the third through hole 221 arranged on the intermediate sheet 22 above the second lead sheet 23. The connecting member 24 is sequentially passed through the first through hole 211, several third through holes 221 and the second through hole 231 to form the coil part 2. Further, the electrical connection of the first lead coil 210, several electrode coils 220 and the second lead coil 230 can also be achieved.

[0068] For S2, specifically, it includes:

[0069] S2.1, sandwiching the coil portion 2 between the first substrate portion 1 and the second substrate portion 3;

[0070] S2.2, isostatically pressing the first substrate portion 1, the coil portion 2 and the second substrate portion 3;

[0071] S2.3, cutting, sintering, silver dipping and nickel-tin electroplating;

[0072] S2.4. Electrically connect the first lead end of the coil portion 2 to one external electrode 4 , and electrically connect the second lead end of the coil portion 2 to another external electrode 4 .

[0073] The coil portion 2 is placed between the first substrate portion 1 and the second substrate portion 3 and isostatically pressed. The thickness of the first substrate portion 1 is set to a, and the thickness of the second substrate portion 3 is set to b. Further, the pressed product is cut, sintered, silver-coated, and electroplated with nickel tin. The product is cut to a length of 1±0.15 mm and a width of 0.5±0.15 mm, and the cut edge of the product is electroplated with nickel tin avoiding the first lead-out terminal and the second lead-out terminal. Finally, the first lead-out terminal is electrically connected to one external electrode 4, and the second lead-out terminal is electrically connected to the other external electrode 4. Specifically, the first lead-out terminal and the second lead-out terminal are respectively welded to the opposite sides of the two external electrodes 4 to improve the reliability of the product, thereby obtaining the above-mentioned chip ceramic inductor.

[0074] For S3, specifically, it includes:

[0075] S3.1. Connect the two outer electrodes 4 to the inductance tester;

[0076] S3.2. Read the data on the inductance tester to obtain the actual inductance.

[0077] The chip ceramic inductor obtained above is used as a sample, and its two outer electrodes 4 are connected to an inductance tester, and the data on the inductance tester is read to obtain the actual inductance of the sample.

[0078] For S4, specifically, after obtaining the actual inductance, further compare it with the calibrated inductance. When the difference between the actual inductance and the calibrated inductance is greater than the tolerance, return to S1, remake the first substrate part 1 and the second substrate part 3, specifically, adjust the number of layers of the first substrate 11 and the number of layers of the second substrate 31, and then obtain the chip ceramic inductor through S2, record the ratio x of the thickness a1 of the first substrate part 1 and the thickness b1 of the second substrate part 3 at this time, test its actual inductance, and when the difference between the actual inductance and the calibrated inductance is less than or equal to the tolerance, execute step S5, that is, batch produce chip ceramic inductors with a1 / b1=x.

[0079] It should be noted that by adjusting the value of x, the inductance of the chip ceramic inductor can be adjusted within a range of 2%-5% so as to meet the tolerance requirement. Specifically, when x decreases, the inductance of the chip ceramic inductor gradually increases.

[0080] The inductance adjustment method of the chip ceramic inductor provided in this embodiment has low cost, simple operation and high precision.

[0081] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. Chip ceramic inductor, characterized in that, The invention comprises a first substrate portion (1), a coil portion (2), a second substrate portion (3) and two external electrodes (4); the coil portion (2) is sandwiched between the first substrate portion (1) and the second substrate portion (3); the two external electrodes (4) are respectively connected to opposite ends of the chip ceramic inductor; the first substrate portion (1) comprises a plurality of stacked first substrates (11); the second substrate portion (3) comprises a plurality of stacked second substrates (31); the coil portion (2) comprises a first lead-out end and a second lead-out end; the first lead-out end is electrically connected to one of the external electrodes (4); and the second lead-out end is electrically connected to the other of the external electrodes (4).

2. The chip ceramic inductor according to claim 1, characterized in that: The coil portion (2) comprises a first lead-out sheet (21), a plurality of intermediate sheets (22), and a second lead-out sheet (23) which are stacked in sequence; the first lead-out sheet (21) is provided with a first lead-out coil (210), and the first lead-out end is provided at the end of the first lead-out coil (210); a plurality of intermediate sheets (22) are provided with an electrode coil (220); the second lead-out sheet (23) is provided with a second lead-out coil (230), and the second lead-out end is provided at the end of the second lead-out coil (230); and the first lead-out coil (210), the plurality of electrode coils (220), and the second lead-out coil (230) are electrically connected in sequence.

3. The chip ceramic inductor according to claim 2, characterized in that: The coil portion (2) further comprises a connecting member (24); a first through hole (211) is provided on the first lead-out piece (21); a second through hole (231) is provided on the second lead-out piece (23); a third through hole (221) is provided on the intermediate piece (22); the connecting member (24) is sequentially passed through the first through hole (211), a plurality of the third through holes (221) and the second through hole (231); the connecting member (24) electrically connects the first lead-out coil (210), a plurality of the electrode coils (220) and the second lead-out coil (230); the top of the connecting member (24) abuts against the lower end surface of the first substrate (11) close to the first lead-out piece (21); and the bottom of the connecting member (24) abuts against the upper end surface of the second substrate (31) close to the second lead-out piece (23).

4. The chip ceramic inductor according to claim 3, characterized in that: Both ends of the two outer electrodes (4) are bent to form a first opening and a second opening respectively, and the inner wall of the first opening and the inner wall of the second opening are both attached to the outermost first substrate (11) and the outermost second substrate (31).

5. The chip ceramic inductor according to claim 2, characterized in that: The first substrate (11), the second substrate (31), the first lead-out plate (21), the second lead-out plate (23) and the intermediate plate (22) all have a length of 1±0.15 mm and a width of 0.5±0.15 mm.

6. The chip ceramic inductor according to any one of claims 1 to 5, characterized in that: The upper end surface of the outermost layer of the first substrate (11) is provided with a marking layer (5).

7. A method for adjusting the inductance of a chip ceramic inductor, using the chip ceramic inductor according to any one of claims 1 to 6, characterized in that: The steps include: S1, manufacturing a first substrate portion (1), a coil portion (2), and a second substrate portion (3); S2, processing to obtain a chip ceramic inductor; S3, testing the actual inductance of the chip ceramic inductor; S4, when the difference between the actual inductance and the calibrated inductance is greater than the tolerance, return to S1, adjust the number of layers of the first substrate (11) and the number of layers of the second substrate (31), change the ratio of the thickness a of the first substrate part (1) to the thickness b of the second substrate part (3), and when the difference between the actual inductance and the calibrated inductance is less than or equal to the tolerance, execute step S5; S5. Batch produce the chip ceramic inductors.

8. The method for adjusting the inductance of a chip ceramic inductor according to claim 7, characterized in that: The S1 includes: S1.

1. A plurality of first substrates (11) are stacked to form the first substrate portion (1); S1.2, a plurality of second substrates (31) are stacked to form the second substrate portion (3); S1.3, disposing a first lead-out coil (210) on the first lead-out sheet (21); S1.4, an electrode coil (220) is arranged on the middle sheet (22); S1.

5. Arranging a second lead-out coil (230) on the second lead-out sheet (23); S1.

6. Stack the first lead-out piece (21), a set number of the intermediate pieces (22), and the second lead-out piece (23) to form the coil portion (2).

9. The method for adjusting the inductance of a chip ceramic inductor according to claim 7, characterized in that: The S2 includes: S2.

1. sandwiching the coil portion (2) between the first substrate portion (1) and the second substrate portion (3); S2.2, isostatically pressing the first substrate portion (1), the coil portion (2), and the second substrate portion (3); S2.3, cutting, sintering, silver dipping and nickel-tin electroplating; S2.

4. Electrically connect the first lead end of the coil portion (2) to an external electrode (4), and electrically connect the second lead end of the coil portion (2) to another external electrode (4).

10. The method for adjusting the inductance of a chip ceramic inductor according to claim 7, characterized in that: The S3 includes: S3.

1. Connect the two outer electrodes (4) to an inductance tester; S3.

2. Read the data on the inductance tester to obtain the actual inductance.

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