Semiconductor silicon wafer slicing device capable of efficiently bending and slicing silicon wafers

Abstract

The invention provides an efficient bending and fragmenting semiconductor silicon wafer fragmenting device, which comprises a fragmenting assembly, and is characterized in that the fragmenting assembly comprises a bending module, a lifting module and a fixing bracket; the bending module comprises a plurality of adsorption blocks; in the straight bearing state, the supporting frame moves upwards to bear the multiple adsorption blocks, and the multiple adsorption planes are horizontally coplanar; in the bending and slicing state, the supporting frame moves downwards, the other adsorption blocks except the fixedly-connected adsorption blocks rotate downwards under the action of gravity or tension springs, and the multiple adsorption planes are not coplanar. According to the scheme, a fixed adsorption block and a plurality of other adsorption blocks rotate around the X horizontal direction, so that a semiconductor silicon wafer is placed on an adsorption plane and is adsorbed and fixed by adsorption holes, and the adsorption blocks rotate downwards under the action of gravity, so that the semiconductor silicon wafer with scratches can be sliced and can be accurately controlled through the vertical position of a support frame; and the bending module can be accurately switched between two states, so that the fragmentation accuracy is improved.

Description

Technical Field

[0001] The invention relates to the technical field of solar semiconductor silicon wafer production, and in particular to a semiconductor silicon wafer slicing device with high-efficiency bending slicing. Background Art

[0002] The slicing device is mainly used to separate the silicon wafers that are not completely cut after slicing by the dicing machine. In the current photovoltaic industry, as the required sizes of semiconductor silicon wafers are different, it is necessary to design according to the specifications of semiconductor silicon wafers and the number of slicing, and it is also necessary to improve the efficiency of slicing.

[0003] The main disadvantages of existing slicing devices include: first, the number of semiconductor silicon wafers that can be broken at one time is limited, and generally only in a single direction; second, for breaking narrow-pitch, large-quantity semiconductor silicon wafers, due to the large number of semiconductor silicon wafers, narrow pitch, and small force area, traditional mechanical hard force breaking can easily cause damage to the semiconductor silicon wafers, which is basically impossible to achieve with existing equipment and basically relies on manual breaking, resulting in a large loss of semiconductor silicon wafers. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor silicon wafer slicing device with high-efficiency bending slicing.

[0005] In order to achieve the purpose of the present invention, the present invention provides a semiconductor silicon wafer slicing device with high efficiency bending slicing, including a slicing assembly, the slicing assembly including a bending module, a lifting module and a fixed bracket; the bending module includes a plurality of adsorption blocks, the adsorption blocks extend along the X horizontal direction, the plurality of adsorption blocks are arranged along the Y horizontal direction, an adsorption plane extending along the X horizontal direction is provided on the adsorption block, adsorption holes are provided on the adsorption plane, an adsorption pipe connected to the adsorption hole is provided in the adsorption block, an interface is provided at the outer end of the adsorption pipe, and a hinge is provided on the edge of the adsorption plane based on the Y horizontal direction of the adsorption block, the hinge extends along the X horizontal direction, and two adjacent adsorptions are connected to each other. The two hinged parts close to each other in the block are hinged; the fixed bracket is fixedly connected to one of the adsorption blocks, and the other adsorption blocks rotate around the X horizontal direction; the lifting module includes a lifting drive device and a support frame, the support frame extends along the Y horizontal direction, the support frame is located below the multiple adsorption blocks, the lifting drive device is connected to the support frame and drives the support frame to move along the Z vertical direction; in the straight supporting state, the support frame moves upward to support the multiple adsorption blocks, and the multiple adsorption planes are horizontally coplanar; in the bent segmentation state, the support frame moves downward, and the other adsorption blocks except the fixedly connected adsorption blocks rotate downward under the action of gravity, and the multiple adsorption planes are not coplanar.

[0006] A further solution is that the adsorption block is provided with a lower stop surface below the hinged portion; in a flat supporting state, there is a movable gap between the two opposite lower stop surfaces; in a bent and segmented state, the two opposite lower stop surfaces are adjacent.

[0007] A further solution is that the lower stop surface is arranged at an acute angle to the vertical direction of the Z axis.

[0008] A further solution is that the adsorption block is provided with a cross bar on the outer side of the hinge part based on the Y horizontal direction, and the bottom surface of the cross bar is provided with an upper stop surface extending along the Y horizontal direction; in the flat supporting state, the upper stop surface of one adsorption block is located above the adsorption plane of an adjacent adsorption block and is adjacent to the adsorption plane; in the bent segmentation state, the upper stop surface of one adsorption block is located above the adsorption plane of an adjacent adsorption block and is separated from the adsorption plane.

[0009] A further solution is that two hinged parts are provided on the edge of the adsorption plane based on the Y horizontal direction, and the two hinged parts are respectively located at the ends of the X horizontal direction; and two adjacent cross bars are staggered in the X horizontal direction.

[0010] A further solution is that the hinged parts are arranged in the form of hinged holes, and two adjacent hinged parts located on the same side are connected along the X horizontal direction and connected through the hinge column.

[0011] A further solution is that the fixed bracket is fixedly connected to two ends of the adsorption block in the X horizontal direction.

[0012] A further solution is that the bending module includes a tension spring, which is connected between the adsorption blocks located on the two outer sides in the Y horizontal direction.

[0013] A further solution is that the semiconductor silicon wafer slicing device includes two slicing components, and the placement positions of the two slicing components are rotated 90° horizontally, wherein the adsorption block of one slicing component rotates around the X horizontal direction, and the adsorption block of the other slicing component rotates around the Y horizontal direction.

[0014] A further solution is that the semiconductor silicon wafer slicing device is provided with a first slicing station and a second slicing station, the slicing component rotating around the X horizontal direction is located at the first slicing station, and the slicing component rotating around the Y horizontal direction is located at the second slicing station; the number of adsorption blocks of the slicing component at the second slicing station is greater than the number of adsorption blocks of the slicing component at the first slicing station.

[0015] The beneficial effect of the present invention is that, based on a fixed adsorption block, the other multiple adsorption blocks rotate around the X horizontal direction, so that a semiconductor silicon wafer is placed on the adsorption plane and fixed by the adsorption hole, and the adsorption block rotates downward under the action of gravity, so the semiconductor silicon wafer with scratches can be sliced, and the upper and lower positions of the support frame can be accurately controlled, so that the bending module can accurately switch between two states to improve the accuracy of the slice. Furthermore, through the arrangement of the lower stop surface and the upper stop surface, and through the arrangement of the hinge at both ends, and the cross bar is staggered, the position stability of the bending module in the straight support state and the bent slice state can be achieved, and the staggered arrangement can make the hinge closer to the edge of the adsorption block, and then the scratches of the slice can be more accurately facing the position of the hinge, thereby further improving the accuracy of the slice. And the elastic tension of the tension spring is used to drive the rotation and bending of the adsorption block, thereby increasing the bending force of the slice.

[0016] In addition, by arranging the first slicing station and the second slicing station, slicing is performed along the X horizontal direction at the first slicing station, and along the Y horizontal direction at the second slicing station. By slicing in the XY directions respectively, the slicing efficiency can be greatly improved. Furthermore, in the first slicing, since the entire sheet is not sliced, the area is large and the resistance is relatively large, so fewer adsorption blocks are set for slicing. In the second slicing, since it has been sliced ​​once, the area is reduced and the resistance is correspondingly reduced, so more adsorption blocks are set for slicing to improve the slicing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural diagram of a complete set of semiconductor silicon wafer slicing and slicing equipment of the present invention.

[0018] Figure 2 It is a structural diagram of an embodiment of a semiconductor silicon wafer slicing device of the present invention.

[0019] Figure 3 It is a structural diagram of an embodiment of a semiconductor silicon wafer slicing device of the present invention from another perspective.

[0020] Figure 4 It is a structural diagram of the slicing assembly at the first slicing station in an embodiment of the semiconductor silicon wafer slicing device of the present invention.

[0021] Figure 5 It is a structural diagram of the slicing assembly at the first slicing station in the embodiment of the semiconductor silicon wafer slicing device of the present invention from another perspective.

[0022] Figure 6 It is a structural diagram of a bending module in an embodiment of a semiconductor silicon wafer slicing device of the present invention.

[0023] Figure 7 It is an exploded view of the bending module in the embodiment of the semiconductor silicon wafer slicing device of the present invention.

[0024] Figure 8 It is a structural diagram of a semiconductor silicon wafer in an embodiment of a semiconductor silicon wafer slicing device of the present invention.

[0025] Fig. 9 It is a side view of the first slicing station in the embodiment of the semiconductor silicon wafer slicing device of the present invention in a flat supporting state.

[0026] Fig.10 It is a side view of the first slicing station in the embodiment of the semiconductor silicon wafer slicing device of the present invention in a bent slicing state.

[0027] Fig.11 It is a side view of the second slicing station in the embodiment of the semiconductor silicon wafer slicing device of the present invention in a flat supporting state.

[0028] Fig.12 It is a side view of the second slicing station in the embodiment of the semiconductor silicon wafer slicing device of the present invention in a bent slicing state.

[0029] The present invention is further described below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0030] Reference Figures 1 to 12 The semiconductor silicon wafer slicing and slicing equipment includes a slicing device, a robot device 12, a semiconductor silicon wafer slicing device 10 and a feeding device 13. The slicing device is used to perform scratching on the semiconductor silicon wafer 101 along the X horizontal direction and the Y horizontal direction, and then form X-direction scratches 103 and Y-direction scratches 104, thereby planning a plurality of silicon single wafers 102, and having waste edges 105 on both sides of the X horizontal direction, and having waste edges 106 on both sides of the Y horizontal direction. After slicing, the wafer is transported to the semiconductor silicon wafer slicing device 10 by the robot device 12 for slicing.

[0031] The semiconductor silicon wafer slicing device 10 includes a slicing assembly 2, a slicing assembly 4 and a flipping device 3. The semiconductor silicon wafer slicing device 10 is provided with a first slicing station and a second slicing station. The slicing assembly 2 rotating around the X horizontal direction is located at the first slicing station, and the slicing assembly 4 rotating around the Y horizontal direction is located at the second slicing station. The slicing structures and principles of the slicing assembly 2 and the slicing assembly 4 are similar, and only differ in the rotation direction and the arrangement of the adsorption block. The placement positions of the slicing assembly 2 and the slicing assembly 4 are horizontally rotated by 90°. The following mainly takes the slicing assembly 2 as an example for description.

[0032] The slice assembly 2 includes a bending module 21, a lifting module 22, a fixing bracket 23 and four punching modules 24. The bending module 21 includes four adsorption blocks 211 and two tension springs 220. The adsorption block 211 extends along the horizontal direction X. The multiple adsorption blocks 211 are arranged along the horizontal direction Y. The adsorption block 211 is provided with an adsorption plane 212 extending along the horizontal direction X. The adsorption plane 212 is provided with an adsorption hole 213. The adsorption block 211 is provided with an adsorption pipe connected with the adsorption hole 213. The outer end of the adsorption pipe is provided with an interface 217. The interface 217 is used to connect with the vacuum generator. The adsorption block 211 is connected to the adsorption plane 212 by two hinged parts 214 on the edge of the Y horizontal direction, and the two hinged parts 214 are respectively located at the ends of the X horizontal direction. A cross bar 215 is provided on the adsorption plane 212 of the adsorption block 211 on the outer side of the hinged part 214 based on the Y horizontal direction. The cross bar 215 of the adsorption block 211 located in the middle protrudes outward on both sides of the Y horizontal direction, while the cross bar 215 of the adsorption block 211 located at the end is only provided on one side and protrudes outward toward the middle, and the bottom surface of the protruding part of the cross bar 215 is provided with an upper stop surface 216 extending along the Y horizontal direction.

[0033] The hinge part 214 extends along the horizontal direction X. In this embodiment, the hinge part 214 is arranged in a reaming hole. The two hinge parts 214 close to each other in two adjacent adsorption blocks 211 are hinged. The two adjacent hinge parts 214 on the same side are connected along the horizontal direction X and connected by a hinge column (not shown). The two adjacent cross bars 215 are staggered in the horizontal direction X. The adsorption block 211 is provided with a lower stop surface 218 below the hinge part 214. The stop surface 218 extends along the horizontal direction X, and the lower stop surface 218 is arranged at an acute angle with the vertical direction of the Z axis.

[0034] Two fixed brackets 23 extend along the vertical direction of the Z axis and are respectively located at the two ends of the bending module 21 based on the X horizontal direction. The fixed bracket 23 is fixedly connected to an adsorption block 211 located in the middle of the Y horizontal direction. The fixed bracket 23 is fixedly connected to the two ends of the adsorption block 211 in the X horizontal direction, and then the adsorption blocks 211 on the other two sides rotate around the X horizontal direction. The tension spring 220 is connected between the adsorption blocks 211 located on the two outer sides of the Y horizontal direction. The tension spring 220 is located on the back side of the adsorption plane 212. The two tension springs 220 are respectively located at the two ends of the X horizontal direction. The tension spring 220 extends along the Y horizontal direction, and the centering tension of the tension spring 220 is used to apply an elastic external force to drive the rotation of the adsorption block 211.

[0035] The lifting module 22 includes a lifting drive device 221 and a support frame 222. The support frame 222 extends along the Y horizontal direction. The support frame 222 is located below the multiple adsorption blocks 211. The lifting drive device 221 is connected to the support frame 222 and drives the support frame 222 to move along the Z vertical direction.

[0036] The edge punching module 24 includes an edge punching bracket 241, an edge punching drive device 242 and an edge punching column 243. The edge punching drive device 242 is fixedly connected to the edge punching bracket 241. The edge punching drive device 242 can adopt an electric or pneumatic drive device. The edge punching drive device 242 is connected to the edge punching column 243 and drives the edge punching column 243 to move along the Y horizontal direction. The edge punching column 243 is located on the side of the bending module based on the Y horizontal direction. Two edge punching modules 24 are respectively arranged on the side of the bending module based on the Y horizontal direction. The two edge punching modules 24 on the same side are arranged along the X horizontal direction. The edge punching bracket 241 extends along the Z vertical direction. The edge punching drive device 242 is arranged at the upper end of the edge punching bracket 241.

[0037] Reference Fig. 9 In the flat supporting state, the support frame 222 moves upward to support the multiple adsorption blocks 211, and the multiple adsorption planes 212 are horizontally coplanar. At this time, the semiconductor silicon wafer 101 can be placed on the adsorption plane 212 and adsorbed and fixed by the adsorption holes 213, and the X-direction scratch 103 is aligned with the edge of the adsorption plane 212 in the Y horizontal direction. The upper stop surface 216 of an adsorption block 211 is located above the adsorption plane 212 of an adjacent adsorption block 211 and is adjacent to the adsorption plane 212, realizing the upward rotation limit of the adsorption block 211, and there is a movable gap 219 between the two opposite lower stop surfaces 218.

[0038] Reference Fig.10 In the bending and slicing state, the support frame 222 moves downward and loses its supporting effect on the adsorption block 211. Except for the fixedly connected adsorption block 211, the other adsorption blocks 211 rotate downward under the action of gravity and the tension spring 220. At this time, the multiple adsorption planes 212 are not coplanar. The upper stop surface 216 of an adsorption block 211 is located above the adsorption plane 212 of an adjacent adsorption block 211 and is separated from the adsorption plane 212. The two opposite lower stop surfaces 218 are adjacent. At this time, the slicing of the X-direction scratch 103 of the semiconductor silicon wafer 101 is completed. Then, the edge punching column 243 is driven to move along the Y horizontal direction. Since the edge punching movement direction of the edge punching column 243 forms an obtuse angle with the adsorption plane 212 of the adsorption block 211 located at the edge, the edge punching movement direction of the edge punching column 243 forms an obtuse angle with the waste edge 106. As the edge punching column 243 moves, the waste edge 106 is flushed away and can fall into the waste trough below.

[0039] After completing the slicing and punching at the first slicing station, the semiconductor silicon wafer 101 after slicing and punching can be transferred to the slicing assembly 4 of the second slicing station by the robot device 12 and the suction cup 121 located on the robot device 12.

[0040] The slice assembly 4 includes a bending module 41, a lifting module 44, a fixed bracket and eight punching modules 44. The bending module 41 includes seven adsorption blocks 411. Based on the same principle of the slice assembly 2, the seven adsorption blocks 411 are hinged along the X horizontal direction, the fixed bracket is fixedly connected to the middle adsorption block 411, and the other adsorption blocks 411 rotate around the Y horizontal direction.

[0041] Reference Fig.11 In the flat supporting state, the support frame 422 moves upward to support the multiple adsorption blocks 411, and the multiple adsorption planes are horizontally coplanar. At this time, the semiconductor silicon wafer 101 can be placed on the adsorption plane and adsorbed and fixed by the adsorption holes, and the Y-direction scratch 104 is aligned with the edge of the adsorption plane in the X-horizontal direction.

[0042] Reference Fig.12 In the bending and slicing state, the support frame 422 moves downward and loses its supporting effect on the adsorption block 411. Except for the fixedly connected adsorption block, the other adsorption blocks rotate downward under the action of gravity and the tension spring. At this time, multiple adsorption planes are not coplanar, and then the Y-direction scratch 104 of the semiconductor silicon wafer 101 is sliced. Then, the punching column of the punching module 44 is driven to move along the X horizontal direction. Since the punching movement direction of the punching column forms an obtuse angle with the adsorption plane of the adsorption block located at the edge, the punching movement direction of the punching column forms an obtuse angle with the waste edge 105. As the punching column moves, the waste edge 105 is flushed away and can fall into the waste trough below.

[0043] Then, the silicon wafer 102 is flipped toward the bending module 41 through the flipping device 3, and each silicon wafer 102 is adsorbed by the adsorption block on the flipping device 3. After flipping again, the direction of the silicon wafer 102 can be flipped. Finally, each silicon wafer 102 is transferred to the material tray of the unloading device 13 through the suction cup 121 on the manipulator device 12 and transported outward.

[0044] Of course, the above embodiments are only preferred embodiments of the present case. In specific applications, the number of adsorption blocks and punching modules can be set according to actual conditions, including but not limited to two or more, and the specific number of punching modules can also be set according to actual conditions. As for the setting of the upper stop surface and the lower stop surface, the switching between the straight supporting state and the curved segmentation state can be realized by lifting the support frame. The setting of the upper stop surface and the lower stop surface is a selective setting.

[0045] As can be seen from the above, based on a fixed adsorption block, the other multiple adsorption blocks rotate around the X horizontal direction, so that the semiconductor silicon wafer is placed on the adsorption plane and is adsorbed and fixed by the adsorption hole. The adsorption block rotates downward under the action of gravity, so the semiconductor silicon wafer with scratches can be sliced, and the upper and lower positions of the support frame can be accurately controlled, so that the bending module can accurately switch between two states to improve the accuracy of the slice. Furthermore, through the arrangement of the lower stop surface and the upper stop surface, and the arrangement of the hinge at both ends, and the staggered arrangement of the cross bar, the position stability of the bending module in the straight support state and the bent slice state can be achieved, and the staggered arrangement can make the hinge closer to the edge of the adsorption block, and then the scratches of the slice can be more accurately aligned with the position of the hinge, thereby further improving the accuracy of the slice. And by using the adjacent positioning of the lower stop surface, it can not only limit the rotation of the adsorption block, but also provide support when the edge punching column is facing the semiconductor silicon wafer.

[0046] In addition, by arranging the first slicing station and the second slicing station, slicing is performed along the X horizontal direction at the first slicing station, and along the Y horizontal direction at the second slicing station. By slicing in the XY directions respectively, the slicing efficiency can be greatly improved. Furthermore, in the first slicing, since the entire sheet is not sliced, the area is large and the resistance is relatively large, so fewer adsorption blocks are set for slicing. In the second slicing, since it has been sliced ​​once, the area is reduced and the resistance is correspondingly reduced, so more adsorption blocks are set for slicing to improve the slicing efficiency.

Claims

1. A semiconductor silicon wafer slicing device with high efficiency bending slicing, characterized in that: It includes a slice assembly, and the slice assembly includes a bending module, a lifting module and a fixing bracket; The bending module comprises a plurality of adsorption blocks, the adsorption blocks extend in the X horizontal direction, the plurality of adsorption blocks are arranged in the Y horizontal direction, the adsorption blocks are provided with an adsorption plane extending in the X horizontal direction, the adsorption plane is provided with adsorption holes, an adsorption pipe connected with the adsorption holes is provided in the adsorption block, an interface is provided at the outer end of the adsorption pipe, the adsorption block is provided with a hinged part at the edge of the adsorption plane based on the Y horizontal direction, the hinged part extends in the X horizontal direction, and two hinged parts close to each other in two adjacent adsorption blocks are hinged; The fixed bracket is fixedly connected to one of the adsorption blocks, and the other adsorption blocks rotate around the X horizontal direction; The lifting module includes a lifting drive device and a support frame, the support frame extends along the Y horizontal direction, the support frame is located below the plurality of adsorption blocks, and the lifting drive device is connected to the support frame and drives the support frame to move along the Z vertical direction; In the flat supporting state, the support frame moves upward to support the plurality of adsorption blocks, and the plurality of adsorption planes are horizontally coplanar; In the bent and split state, the support frame moves downward, and the adsorption blocks except the fixedly connected adsorption blocks rotate downward under the action of gravity, and the multiple adsorption planes are not coplanar.

2. The semiconductor silicon wafer slicing device according to claim 1, characterized in that: The adsorption block is provided with a lower stop surface below the hinge portion; In the flat supporting state, there is a movable gap between the two opposite lower stop surfaces; In the bent segment state, the two opposite lower stop surfaces are in abutment with each other.

3. The semiconductor silicon wafer slicing device according to claim 2, characterized in that: The lower stop surface is arranged at an acute angle to the vertical direction of the Z axis.

4. The semiconductor silicon wafer slicing device according to claim 1, characterized in that: The adsorption block is provided with a cross bar on the outer side of the hinge part based on the Y horizontal direction, and the bottom surface of the cross bar is provided with an upper stop surface extending along the Y horizontal direction; In the flat supporting state, the upper stop surface of one adsorption block is located above the adsorption plane of an adjacent adsorption block and is adjacent to the adsorption plane; In the bent and split state, the upper stop surface of one adsorption block is located above the adsorption plane of an adjacent adsorption block and is separated from the adsorption plane.

5. The semiconductor silicon wafer slicing device according to claim 4, characterized in that: The adsorption plane is provided with two hinge parts based on the edge of the Y horizontal direction, and the two hinge parts are respectively located at the ends of the X horizontal direction; Two adjacent cross bars are staggered in the X horizontal direction.

6. The semiconductor silicon wafer slicing device according to claim 5, characterized in that: The hinge parts are arranged in the form of hinge holes, and two adjacent hinge parts located on the same side are connected along the X horizontal direction and connected through hinge columns.

7. The semiconductor silicon wafer slicing device according to claim 1, characterized in that: The fixing bracket is fixedly connected to the adsorption block at two ends in the X horizontal direction.

8. The semiconductor silicon wafer slicing device according to claim 1, characterized in that: The bending module includes a tension spring connected between the adsorption blocks located at two outer sides in the Y horizontal direction.

9. The semiconductor silicon wafer slicing device according to any one of claims 1 to 8, characterized in that: The semiconductor silicon wafer slicing device comprises two slicing assemblies, and the placement positions of the two slicing assemblies are rotated 90° horizontally, wherein the adsorption block of one slicing assembly rotates around the X horizontal direction, and the adsorption block of the other slicing assembly rotates around the Y horizontal direction.

10. The semiconductor silicon wafer slicing device according to claim 7, characterized in that: The semiconductor silicon wafer slicing device is provided with a first slicing station and a second slicing station, the slicing assembly rotating around the X horizontal direction is located at the first slicing station, and the slicing assembly rotating around the Y horizontal direction is located at the second slicing station; The number of the adsorption blocks of the slicing assembly of the second slicing station is greater than the number of the adsorption blocks of the slicing assembly of the first slicing station.

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