Silicon wafer boat beating method, device and equipment of graphite boat and storage medium

Abstract

The embodiment of the invention discloses a silicon wafer boat beating method, device and equipment for a graphite boat and a storage medium, and belongs to the technical field of silicon wafer production, and the method comprises the steps: employing a first boat beating frequency, and carrying out the boat beating of a first fin region; determining a second fin area based on the first fin area after the boat beating processing; and performing boat beating treatment on the second fin area by adopting a second boat beating frequency. According to the automatic boat patting method for the graphite boat, the silicon wafer does not need to be patted to be flat manually, the labor cost in the silicon wafer production process is reduced, the boat patting success rate is increased due to repeated boat patting, and the boat patting flexibility is improved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer production, and in particular to a method, device, equipment and storage medium for silicon wafer boating in a graphite boat. Background Art

[0002] With the advancement of science and technology and the development of society, the demand for silicon wafers has gradually increased. In the relevant technology, during the production process of silicon wafers, silicon wafers can be placed on a graphite boat, and then the silicon wafers can be subsequently processed on the basis of the graphite boat.

[0003] However, in the above-mentioned related technologies, silicon wafers processed from a high-temperature furnace will tend to warp to a large extent, and the silicon wafers may be broken if they are directly given to a robotic arm for insertion and suction in the next process. Therefore, it is necessary to manually flatten the silicon wafers and drop them into fixed slots, which results in high labor costs. Summary of the invention

[0004] The embodiment of the present application provides a method, device, equipment and storage medium for silicon wafer boating of a graphite boat, which can reduce the labor cost in the silicon wafer production process. The technical solution is as follows: On the one hand, an embodiment of the present application provides a method for beating a silicon wafer boat of a graphite boat, the method comprising: Using a first boat-beating frequency, a first warped wafer region is subjected to a boat-beating process; wherein the first warped wafer region refers to a region including at least one warped silicon wafer obtained based on a graphite boat; Based on the first warped chip area after the boat-beating process, determining a second warped chip area; wherein the second warped chip area includes at least one silicon wafer warped chip; The second warp plate area is subjected to a boat beating process using a second boat beating frequency.

[0005] On the other hand, an embodiment of the present application provides a silicon wafer boat beating device for a graphite boat, the device comprising: A boat-beating processing module, used to perform a boat-beating processing on a first warped wafer area using a first boat-beating frequency; wherein the first warped wafer area refers to an area including at least one warped silicon wafer obtained based on a graphite boat; A region determination module, configured to determine a second warping region based on the first warping region after the boat-beating process; wherein the second warping region includes at least one silicon wafer warping; The boat-beating processing module is further used to perform boat-beating processing on the second warp chip area by using a second boat-beating frequency.

[0006] On the other hand, an embodiment of the present application provides a computer device, which includes a processor and a memory, wherein the memory stores a computer program, and the computer program is loaded and executed by the processor to implement the above-mentioned silicon wafer boat beating method of the graphite boat.

[0007] On the other hand, an embodiment of the present application provides a non-temporary computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the silicon wafer boat beating method of the above-mentioned graphite boat is implemented.

[0008] On the other hand, an embodiment of the present application provides a computer program product, which, when executed, enables a computer device to execute the above-mentioned silicon wafer boat beating method for a graphite boat.

[0009] The technical solution provided in the embodiments of the present application can bring the following beneficial effects: An automated boat-beating method for a graphite boat is provided, which does not require manual leveling of silicon wafers, thereby reducing the labor cost in the silicon wafer production process; after beating a first warped wafer area, a second warped wafer area is determined based on the first warped wafer area, and the second warped wafer area is continuously beat, and multiple boat beatings improve the boat beating success rate; different boat beating frequencies are used to beat different warped wafer areas, thereby improving the flexibility of boat beating. In a specific production process, the boat beating frequency can be flexibly set and adjusted according to different production rhythms, a high production rhythm corresponds to a high boat beating frequency to improve the adaptability of the boat beating process to the production process, and a low production rhythm corresponds to a low boat beating frequency to reduce the energy consumption of boat beating and save resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0011] Figure 1 It is a schematic diagram of a silicon wafer boat beating system for a graphite boat provided by an embodiment of the present application; Figure 2 A schematic diagram of a boat-racing robot is shown as an example; Figure 3 This is a flow chart of a method for beating a silicon wafer boat with a graphite boat provided by an embodiment of the present application; Figure 4 is a flow chart of a method for beating a silicon wafer boat with a graphite boat provided by another embodiment of the present application; Figure 5 is a flow chart of a method for beating a silicon wafer boat with a graphite boat provided by another embodiment of the present application; Figure 6 A schematic diagram showing an exemplary method of using a silicon wafer to beat a graphite boat; Figure 7 It is a block diagram of a silicon wafer boat beating device for a graphite boat provided by an embodiment of the present application; Figure 8 It is a block diagram of a silicon wafer boat beating device for a graphite boat provided in another embodiment of the present application. DETAILED DESCRIPTION

[0012] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0013] Please refer to Figure 1 , which shows a schematic diagram of a silicon wafer boating system for a graphite boat provided by an embodiment of the present application. The silicon wafer boating system for a graphite boat may include: a computer device 10. The computer device 10 includes a boating unit 11 and a moving unit 12.

[0014] The boat-beating unit 11 is used to perform a boat-beating process on the graphite boat. In an embodiment of the present application, after determining the area to be beat on the graphite boat, the boat-beating unit 11 performs a boat-beating process on the area to be beat. Optionally, the boat-beating unit 11 determines the boat-beating frequency according to the number of boat-beating times and the number of warped silicon wafers, and then uses the corresponding boat-beating frequency to beat the area to be beat. Exemplarily, in order to reduce silicon wafer fragments after the boat-beating process, the boat-beating unit 11 can use a soft material to beat the graphite boat, such as using a silicone clapping hand to beat the graphite boat.

[0015] The mobile unit 12 is used to control the movement of the above-mentioned boat-patting unit 11. In the embodiment of the present application, if the area to be photographed exceeds the boat-patting range of the boat-patting unit 11, the mobile unit 12 controls the boat-patting unit 11 to move to the position corresponding to the area to be photographed, so that the area to be photographed is located within the boat-patting range of the boat-patting unit 11, and then the boat-patting unit 11 performs a boat-patting process on the area to be photographed. Optionally, the mobile unit 12 determines the moving speed and moving direction according to the position between the area to be photographed and the boat-patting unit 11, and then the mobile unit 12 controls the boat-patting unit 11 to move to the position corresponding to the area to be photographed according to the moving speed and moving direction. Among them, the above-mentioned boat-patting range can be an optimal boat-patting range with the best boat-patting effect.

[0016] In an exemplary embodiment, if Figure 1 As shown, the silicon wafer boat photographing system 10 of the above-mentioned graphite boat also includes an image unit 13, and the image unit 13 is used to perform image acquisition and processing on the graphite boat. In an embodiment of the present application, before the silicon wafer warping is photographed, the image acquisition processing is performed on the graphite boat by the image unit 13 to obtain the graphite boat image, and the image detection processing is performed on the graphite boat image, and then in the case that the silicon wafer warping exists in the graphite boat image, the position of the silicon wafer warping is obtained to determine the area to be photographed on the graphite boat. Optionally, the image detection processing refers to image detection of the graphite boat image based on a pre-trained neural network model.

[0017] It should be noted that the above introduction to the computer device 10 and the silicon wafer boat-beating system of the graphite boat is only exemplary and explanatory. In actual applications, the units included in the computer device 10 and the devices included in the silicon wafer boat-beating system of the graphite boat can be flexibly set and adjusted according to the actual environment. For example, the image unit 13 is split into an image acquisition unit and an image processing unit, the image acquisition unit acquires images, and the image processing unit processes the acquired images. For another example, a control unit is configured in the computer device 10, and the control unit determines the boat-beating parameters for the graphite boat (such as the boat-beating frequency, the moving speed, and the moving direction, etc.). For another example, the computer device 10 only includes: a boat-beating unit 11, a moving unit 12, and an image processing unit, and the image acquisition unit is configured in other devices of the silicon wafer boat-beating system of the graphite boat.

[0018] Optionally, the computer device 10 may be an electronic device such as a mobile phone, a tablet computer, a wearable device, a background server or a PC (Personal Computer), which is not limited in the embodiment of the present application.

[0019] Optionally, a boat-beating robot is used to beat the graphite boat. Figure 2 As shown, the boat-beating robot includes a mechanical arm 21, a silicone clapping hand 22, an electric cabinet 23, a mobile robot 24 and a charging pile 25. During the boat-beating process, the image of the graphite boat is collected by the image equipment around the graphite boat and image processing is performed to determine the area to be beat, and further, the moving direction, moving speed and boat-beating frequency are determined. Afterwards, the mobile robot 24 controls the boat-beating robot to move to the position corresponding to the area to be beat according to the moving direction and moving speed, and then the mechanical arm 21 and the silicone clapping hand 22 use the corresponding boat-beating frequency to perform boat-beating processing on the area to be beat. Optionally, during the boat-beating process, the mechanical arm 21 can control the silicone clapping hand 22 to move in the area to be beat, and then control the position of the silicone clapping hand 22 in the area to be beat, so that the silicone clapping hand 22 can beat the boat.

[0020] Optionally, in the embodiment of the present application, the above-mentioned area to be filmed may also be referred to as a warping area, such as the first warping area and the second warping area mentioned below.

[0021] Please refer to Figure 3 , which shows a flow chart of a method for beating a silicon wafer boat with a graphite boat provided by an embodiment of the present application. The method is applied to Figure 1 The computer device 10 in the silicon wafer boat system of the graphite boat shown in the figure. The method may include the following steps (301-303): Step 301, using a first beating frequency to perform beating processing on a first warping region.

[0022] The first warping region refers to a region including at least one warped silicon wafer acquired based on the graphite boat. Optionally, the computer device collects images around the graphite boat, generates a first graphite boat image, and performs image detection processing on the first graphite boat image, thereby determining the region on the graphite boat where the warped silicon wafer exists as the first warping region.

[0023] The first boat-beating frequency is used to indicate a boat-beating speed for the first warp region.

[0024] In a possible implementation, the first boat-beating frequency is a fixed value. For example, the developer determines the best frequency that can ensure the boat-beating efficiency through a large number of experiments and calculations, and then determines the best frequency as the first boat-beating frequency.

[0025] In another possible implementation, the first boat-beating frequency is acquired in real time according to actual conditions. Exemplarily, in order to improve the boat-beating efficiency of computer devices in different environments, the computer device acquires the number of warps of the silicon wafer in the first warp area, and then determines the first boat-beating frequency based on the correspondence between the number of warps and the boat-beating frequency. Optionally, the number of warps of the silicon wafer in the first warp area can be acquired in real time, or it can be acquired through the above-mentioned first graphite boat image while determining the second warp area, and the embodiment of the present application is not limited to this. Among them, the "correspondence between the number of warps and the boat-beating frequency" used in determining the first boat-beating frequency can be referred to as the first correspondence. Optionally, the number of warps is proportional to the boat-beating frequency, that is, the more the number of warps, the greater the corresponding boat-beating frequency, and the fewer the number of warps, the smaller the corresponding boat-beating frequency. Exemplarily, the above-mentioned first correspondence is a pre-stored correspondence determined based on actual and calculated determinations.

[0026] In the embodiment of the present application, after determining the first warping region and the first boat-beating frequency, the computer device performs boat-beating processing on the first warping region using the first boat-beating frequency.

[0027] Step 302: Determine a second warping region based on the first warping region after the boat-scanning process.

[0028] The second warping region includes at least one silicon wafer warping. In an embodiment of the present application, after the computer device performs a boat-scanning process on the first warping region, the computer device determines the second warping region based on the first warping region after the boat-scanning process. Optionally, for the graphite boat after the boat-scanning process, the computer device collects images around the graphite boat, generates a second graphite boat image, and performs image detection processing on the second graphite boat image, thereby determining the region on the graphite boat where the silicon wafer warping exists as the second warping region.

[0029] In a possible implementation, in order to improve the image acquisition efficiency, the computer device collects an image in the first warping region on the graphite boat, generates a second graphite boat image, and performs image detection processing on the second graphite boat image, thereby determining the region in the first warping region where the silicon wafer warping exists as the second warping region. In this case, the image acquisition range when acquiring the second graphite boat image is only in the first warping region, that is, the image acquisition range corresponding to the second graphite boat image is smaller than the image acquisition range corresponding to the first graphite boat image.

[0030] In another possible implementation, in order to improve the accuracy of image acquisition, the computer device collects images around the graphite boat, generates a second graphite boat image, and performs image detection processing on the second graphite boat image, thereby determining the area on the graphite boat where the silicon wafer is warped as the second warped area. In this case, the image acquisition range corresponding to the second graphite boat image is the same as the image acquisition range corresponding to the first graphite boat image.

[0031] Step 303: perform a boat beat process on the second warp film area using a second boat beat frequency.

[0032] The second boat-beating frequency is used to indicate the boat-beating speed for the second warp zone.

[0033] In a possible implementation, the second boat-beating frequency is a fixed value. For example, the developer determines the best frequency that can ensure the boat-beating efficiency through a large number of experiments and calculations, and then determines the best frequency as the second boat-beating frequency.

[0034] In another possible implementation, the second boat-beating frequency is acquired in real time according to actual conditions. Exemplarily, in order to improve the boat-beating efficiency of computer devices in different environments, the computer device obtains the number of wafers in the second wafer area, and then determines the second boat-beating frequency based on the correspondence between the number of wafers and the boat-beating frequency. Among them, the "correspondence between the number of wafers and the boat-beating frequency" used when determining the second boat-beating frequency can be referred to as the second correspondence. Optionally, the number of wafers is proportional to the boat-beating frequency, that is, the more wafers there are, the greater the corresponding boat-beating frequency is, and the fewer wafers there are, the smaller the corresponding boat-beating frequency is. Exemplarily, the above-mentioned second correspondence is a pre-stored correspondence determined based on actual and calculation.

[0035] In the embodiment of the present application, after determining the second warping region, the computer device performs a boat beating process on the second warping region using a second boat beating frequency.

[0036] In a possible implementation manner, there is no relationship between the second boat-beating frequency and the first boat-beating frequency; that is, the second corresponding relationship and the first corresponding relationship may be the same corresponding relationship or may be different corresponding relationships.

[0037] In another possible implementation, in order to improve the boat-beating efficiency, the second boat-beating frequency is greater than the first boat-beating frequency. In this case, the minimum boat-beating frequency recorded in the second corresponding relationship is greater than the maximum boat-beating frequency recorded in the first corresponding relationship.

[0038] To sum up, the technical solution provided in the embodiment of the present application provides an automated boat beating method for a graphite boat, which does not require manual beating of the silicon wafer, thereby reducing the labor cost in the silicon wafer production process; after beating the first wafer area, the second wafer area is determined based on the first wafer area, and the second wafer area is continued to be beated, and multiple boat beatings improve the boat beating success rate; different boat beating frequencies are used to beat different wafer areas, thereby improving the flexibility of boat beating. In a specific production process, the boat beating frequency can be flexibly set and adjusted according to different production rhythms. A high production rhythm corresponds to a high boat beating frequency to improve the adaptability of the boat beating process to the production process, and a low production rhythm corresponds to a low boat beating frequency to reduce the energy consumption of boat beating and save resources.

[0039] In addition, when the second wafer warping area is being beat, the second boat beating frequency is greater than the first boat beating frequency. The boat beating frequency is increased during the second boat beating, thereby improving the boat beating efficiency of the second boat beating. Furthermore, if the silicon wafer warping still exists after the second boat beating, due to the improvement of the previous boat beating efficiency, the time saved can be used to continue the third boat beating, thereby improving the overall boat beating efficiency and the overall boat beating success rate for the graphite boat.

[0040] Next, the boat-beating method of the first warp-piece area is introduced.

[0041] Optionally, the first warping region includes at least one first warping sub-region, and the first warping sub-region includes at least one silicon wafer warping. In an exemplary embodiment, the above step 301 includes the following steps: 1. For a first target sub-region that is not photographed and is adjacent to a photographed first adjacent sub-region in the first warping region, obtain a distance between the first adjacent sub-region and the first target sub-region.

[0042] The first target sub-region refers to any unphotographed first warp sub-region. The first adjacent sub-region refers to the photographed first warp sub-region that is closest to the first target sub-region. In an embodiment of the present application, after the first adjacent sub-region is photographed, the computer device obtains the positional relationship between the first adjacent sub-region and each unphotographed first warp sub-region, determines the first target sub-region based on the positional relationship, and obtains the distance between the first adjacent sub-region and the first target sub-region.

[0043] In one possible implementation, in order to ensure data real-time, the computer device acquires the above positional relationship in real time before performing boat capture processing on the first target sub-region. In another possible implementation, when determining the first warp film region, the computer device records the positional relationship between each first warp film sub-region, thereby improving subsequent boat capture efficiency.

[0044] 2. Determine a first moving speed based on the distance between the first adjacent sub-region and the first target sub-region.

[0045] The first moving speed refers to the average speed at which the boat-beating device moves to the first target sub-region. Optionally, the boat-beating device can be a computer device, or it can be other devices other than computer devices in the silicon wafer boat-beating system of Graphite Boat. In an embodiment of the present application, after obtaining the distance between the above-mentioned first adjacent sub-region and the first target sub-region, the computer device determines the first moving speed based on the distance between the first adjacent sub-region and the first target sub-region. Among them, the distance between the sub-regions can be the distance between the edges of the sub-regions, or it can be the distance between the center points of the sub-regions, which is not limited in the embodiment of the present application.

[0046] Optionally, the distance between the first adjacent sub-region and the first target sub-region is proportional to the first moving speed. The longer the distance is, the greater the first moving speed is, and the closer the distance is, the smaller the first moving speed is.

[0047] In a possible implementation, a correspondence between the sub-area distance and the first moving speed is pre-stored in the computer device, and then when the distance between the first adjacent sub-area and the first target sub-area is determined, the first moving speed is determined based on the correspondence between the sub-area distance and the first moving speed. In another possible implementation, a correspondence between the sub-area distance and the first moving time is pre-stored in the computer device, and then when the distance between the first adjacent sub-area and the first target sub-area is determined, the first moving speed is determined based on the correspondence between the sub-area distance and the first moving time. The first moving time can be a numerical value, such as 0.10s, 0.11s or 0.12s, etc.; it can also be a time range, such as 0.05s~0.10s, 0.11s~0.12s or 0.12s~0.17s, etc. Optionally, if the first moving time is a time range, the computer device can determine the first moving speed based on its own state. For example, when the own state is busy, the first moving speed is determined based on the shortest moving time indicated by the first moving time; when the own state is leisurely, the first moving speed is determined based on the longest moving time indicated by the first moving time; when the own state is moderate, the first moving speed is determined based on the average moving time indicated by the first moving time; and so on.

[0048] 3. When moving to the first target sub-region, the first target sub-region is subjected to a boat beating process using a first boat beating frequency.

[0049] Optionally, after determining the first moving speed, the computer device moves to a position corresponding to the first target sub-region according to the first moving speed. In an embodiment of the present application, when moving to the first target sub-region, the computer device performs a boat beating process on the first target sub-region using a first boat beating frequency.

[0050] 4. From the first warping region, determine the unpatched first warping sub-region adjacent to the first target sub-region as the second adjacent sub-region.

[0051] The second adjacent sub-region refers to the uncaptured first warp sub-region that is closest to the first target sub-region. In the embodiment of the present application, after the first target sub-region is captured, the second adjacent sub-region is determined based on the positional relationship between the first target sub-region and each uncaptured first warp sub-region.

[0052] 5. Determine the second adjacent sub-region as a new first target sub-region, and repeat the step of obtaining the distance between the first adjacent sub-region and the target sub-region until the first warping region does not include the unpatched first warping sub-region.

[0053] In an embodiment of the present application, after obtaining the above-mentioned second adjacent sub-region, the computer device determines the second adjacent sub-region as a new first target sub-region, and then repeats the step of obtaining the distance between the first adjacent sub-region and the target sub-region until the first warping region does not include the first warping sub-region that has not been photographed, and it is determined that the photographing of the first warping region is completed.

[0054] One thing that needs to be explained is that, in a possible implementation, if the first target sub-region is the first warp sub-region in the first warp region to perform a boat-beating operation, at this time, the first target sub-region does not have a corresponding first adjacent sub-region. Optionally, in this case, the computer device obtains the distance between the first target sub-region and the boat-beating device; then based on the distance between the first target sub-region and the boat-beating device, the above-mentioned first moving speed is determined; then, when moving to the first target sub-region, the first boat-beating frequency is used to perform a boat-beating process on the first target sub-region. Optionally, in this case, the first target sub-region is the first warp sub-region that is closest to the boat-beating device.

[0055] To sum up, in the technical solution provided in the embodiment of the present application, the moving speed of the computer device is determined by the distance between adjacent areas to be photographed during the boat shooting process, thereby improving the flexibility of movement during the boat shooting process; moreover, a large distance corresponds to a high speed, thereby reducing the time consumed by the movement of the computer device, and a small distance corresponds to a low speed, thereby reducing the amount of power consumed by the movement of the computer device.

[0056] In addition, in order to solve the problem of long moving time due to the large distance between adjacent sub-areas in the long production line production scenario, the moving speed is adjusted at different distances. When the distance between the adjacent sub-areas that have not been filmed is far, the moving speed is increased to quickly move to the adjacent sub-area, thereby reducing the time wasted during the movement process, improving the adaptability of computer equipment to long production lines, and further improving the environmental adaptability of computer equipment during the filming process.

[0057] Similar to the above-mentioned method of tapping the boat for the first warp piece area, the following is an introduction to the method of tapping the boat for the second warp piece area.

[0058] In an exemplary embodiment, the above step 303 includes the following steps: 1. Determine a second boat-beating frequency based on the number of wafer warps in the second wafer warp area.

[0059] In the embodiment of the present application, after determining the second warping area, the computer device determines the second boat-beating frequency based on the number of warpings of the silicon wafer in the second warping area. The number of warpings of the silicon wafer in the second warping area can be obtained in real time, or can be obtained through the second graphite boat image while determining the second warping area, which is not limited in the embodiment of the present application.

[0060] In a possible implementation, in order to improve the boat-beating efficiency, after obtaining the number of wafers in the second wafer area, the computer device determines the second boat-beating frequency based on the correspondence between the number of wafers and the boat-beating frequency, taking the number of wafers in the second wafer area as a reference. Optionally, the number of wafers is proportional to the boat-beating frequency, that is, the more wafers there are in the second wafer area, the greater the corresponding second boat-beating frequency, and the fewer wafers there are in the second wafer area, the smaller the corresponding second boat-beating frequency.

[0061] In another possible implementation, in order to improve the efficiency and success rate of the boat beating, the computer device determines the second boat beating frequency based on the number of the silicon wafers in the second warp area and the number of the silicon wafers in the first warp area after obtaining the number of the silicon wafers in the second warp area. Optionally, the computer device obtains the ratio between the number of the silicon wafers in the second warp area and the number of the silicon wafers in the first warp area, and then determines the second boat beating frequency according to the corresponding relationship between the ratio and the boat beating frequency. Wherein, the above ratio is used to indicate the boat beating success rate of the first warp area after the first warp area is subjected to the boat beating process using the first boat beating frequency. Exemplarily, the ratio is inversely proportional to the boat beating success rate; the higher the ratio, the lower the boat beating success rate, and the lower the ratio, the higher the boat beating success rate. Exemplarily, the boat beating success rate is inversely proportional to the boat beating frequency, the higher the boat beating success rate, the lower the boat beating frequency, and the lower the boat beating success rate, the higher the boat beating frequency.

[0062] 2. Use a second beating frequency to perform beating processing on the second warping film area.

[0063] In the embodiment of the present application, after determining the second boat-beating frequency, the computer device uses the second boat-beating frequency to perform boat-beating processing on the second warp chip area.

[0064] Optionally, the second warping region includes at least one second warping sub-region, and the second warping sub-region includes at least one silicon wafer warping.

[0065] In an exemplary embodiment, when the computer device performs a photographing process on the second warp area, for the unphotographed second target sub-area that is adjacent to the photographed third adjacent sub-area in the second warp area, the distance between the third adjacent sub-area and the second target sub-area is obtained. Exemplarily, after the photographing of the third adjacent sub-area is completed, the computer device obtains the positional relationship between the third adjacent sub-area and each unphotographed second warp sub-area, determines the second target sub-area based on the positional relationship, and obtains the distance between the third adjacent sub-area and the second target sub-area. In one possible implementation, in order to ensure the real-time nature of the data, the computer device obtains the above-mentioned positional relationship in real time before performing the photographing process on the second target sub-area. In another possible implementation, when determining the second warp area, the computer device records the positional relationship between each second warp sub-area, thereby improving the subsequent photographing efficiency.

[0066] In an exemplary embodiment, after obtaining the distance between the third adjacent sub-region and the second target sub-region, the computer device determines the second moving speed based on the distance between the third adjacent sub-region and the second target sub-region, and the second moving speed refers to the average speed at which the boat-racing device moves to the second target sub-region. Optionally, the boat-racing device can be a computer device, or it can be other devices other than the computer device in the silicon wafer boat-racing system of Graphite Boat. Among them, the distance between the sub-regions can be the distance between the edges of the sub-regions, or it can be the distance between the center points of the sub-regions, which is not limited in the embodiments of the present application. Optionally, the distance between the third adjacent sub-region and the second target sub-region is proportional to the second moving speed. The farther the distance, the greater the second moving speed, and the closer the distance, the smaller the second moving speed.

[0067] In one possible implementation, the computer device pre-stores a correspondence between the sub-area distance and the second moving speed, and then when determining the distance between the third adjacent sub-area and the second target sub-area, the second moving speed is determined based on the correspondence between the sub-area distance and the second moving speed. In another possible implementation, the computer device pre-stores a correspondence between the sub-area distance and the second moving time, and then when determining the distance between the third adjacent sub-area and the second target sub-area, the second moving speed is determined based on the correspondence between the sub-area distance and the second moving time. The second moving time may be a numerical value or a time range. Optionally, if the second moving time is a time range, the computer device may determine the second moving speed based on its own state. For example, when the state is busy, the second moving speed is determined based on the shortest moving time indicated by the second moving time; when the state is leisurely, the second moving speed is determined based on the longest moving time indicated by the second moving time; when the state is moderate, the second moving speed is determined based on the average moving time indicated by the second moving time; and so on.

[0068] In one possible implementation, when the distances between adjacent sub-regions and the target sub-region are the same, the second moving speed is the same as the first moving speed; in another possible implementation, in order to improve boat racing efficiency, when the distances between adjacent sub-regions and the target sub-region are the same, the second moving speed is greater than the first moving speed.

[0069] In an exemplary embodiment, after determining the second moving speed, the computer device moves to a position corresponding to the second target sub-region according to the second moving speed. In an embodiment of the present application, when moving to the second target sub-region, the computer device performs a boat beat process on the second target sub-region using a second boat beat frequency.

[0070] In an exemplary embodiment, after the computer device completes the photographing of the second target sub-region this time, the computer device determines, from the second warp film region, a second warp film sub-region that is adjacent to the second target sub-region and has not been photographed as a fourth adjacent sub-region, where the fourth adjacent sub-region refers to the second warp film sub-region that has not been photographed and is closest to the second target sub-region. Optionally, the computer device determines the fourth adjacent sub-region based on the positional relationship between the second target sub-region and each of the second warp film sub-regions that have not been photographed.

[0071] In an embodiment of the present application, after acquiring the above-mentioned fourth adjacent sub-region, the computer device determines the fourth adjacent sub-region as a new second target sub-region; and repeats the step of acquiring the distance between the third adjacent sub-region and the second target sub-region until the second warping film region does not include the unpatched second warping film sub-region.

[0072] One thing that needs to be explained is that, in a possible implementation, if the second target sub-region is the first second warp sub-region in the second warp region to perform a boat-slapping operation, then the second target sub-region does not have a corresponding third adjacent sub-region. Optionally, in this case, the computer device obtains the distance between the second target sub-region and the boat-slapping device; then based on the distance between the second target sub-region and the boat-slapping device, the second moving speed is determined; then, when moving to the second target sub-region, the second target sub-region is subjected to a boat-slapping process using the second boat-slapping frequency. Optionally, in this case, the second target sub-region is the second warp sub-region that is closest to the boat-slapping device.

[0073] To sum up, in the technical solution provided in the embodiment of the present application, the boat beating frequency is determined by the number of warps, which improves the flexibility of the computer device during the boat beating process, increases the boat beating frequency when the number of warps is large, and improves the boat beating efficiency.

[0074] In addition, in order to solve the problem of long moving time due to the large distance between adjacent sub-areas in the long production line production scenario, the moving speed is adjusted at different distances. When the distance between the adjacent sub-areas that have not been filmed is far, the moving speed is increased to quickly move to the adjacent sub-area, thereby reducing the time wasted during the movement process, improving the adaptability of computer equipment to long production lines, and further improving the environmental adaptability of computer equipment during the filming process.

[0075] Next, the method of obtaining the warping area is introduced.

[0076] For the first warping tab area, in an exemplary embodiment, the above step 301 further includes the following steps: 1. Acquire a first graphite boat image based on the graphite boat.

[0077] The first graphite boat image is used to record the state of at least one silicon wafer on the graphite boat. The state of the silicon wafer includes at least one of the following: warped silicon wafer, chipped silicon wafer, broken silicon wafer, missing silicon wafer, etc. In an embodiment of the present application, the computer device obtains the first graphite boat image based on the graphite boat before obtaining the first warped wafer area.

[0078] In a possible implementation, the first graphite boat image is a static image directly acquired. Optionally, the computer device acquires a static image of the graphite boat at a certain moment to acquire the first graphite boat image. The certain moment may be any moment, and the present application embodiment does not limit this.

[0079] In another possible implementation, since the state of the silicon wafer in the graphite boat may change over time, in order to ensure as much as possible that the state of the silicon wafer recorded by the first graphite boat image is the final state of the silicon wafer before the boat-beating process, the first graphite boat image is a static image extracted from the dynamic image. Optionally, the computer device collects a dynamic image of the graphite boat within a certain period of time, and the dynamic image includes a plurality of continuous static images. Further, the computer device performs image comparison processing on each static image in the dynamic image. When it is determined that there are p continuous static images in which the state of the silicon wafer has not changed, any static image is obtained from the p continuous static images as the first graphite boat image. Wherein, p is any integer greater than 1, such as 5, 10 or 33, etc., and this embodiment of the present application does not limit this.

[0080] Optionally, the computer device obtains the first graphite boat image from the graphite boat through an image acquisition device. The number and / or shooting range of the image acquisition device can be flexibly set and adjusted according to actual conditions. For example, the computer device obtains the first graphite boat image from the graphite boat through an image acquisition device whose shooting range is greater than the first target range value; or, the computer device obtains the first graphite boat image from the graphite boat through multiple image acquisition devices whose shooting range is less than or equal to the first target range value. Optionally, the image acquisition device can be a camera, a camera, a scanner, or a mobile terminal equipped with a camera, etc., which is not limited in the embodiments of the present application. The above-mentioned first target range value can be any value, and the first target range value can be flexibly set and adjusted according to actual conditions, which is not limited in the embodiments of the present application.

[0081] 2. When there are warped silicon wafers in the first graphite boat image, determine the positions of each warped silicon wafer.

[0082] In an embodiment of the present application, after acquiring the first graphite boat image, the computer device determines the position of each warped silicon wafer in the case where there is a warped silicon wafer in the graphite boat image. Optionally, the computer device performs image detection processing on the first graphite boat image, and then determines the position of each warped silicon wafer on the first graphite boat image. Exemplarily, the image detection processing refers to performing image detection on the first graphite boat image based on a pre-trained first neural network model.

[0083] 3. Based on the positions of each wafer warp, determine the position of the unmarked first target wafer warp as the first position; and mark the first target wafer warp.

[0084] The first target wafer warp refers to any wafer warp in the first graphite boat image. In the embodiment of the present application, after determining the positions of each wafer warp in the first graphite boat, the computer device determines the position of the unmarked first target wafer warp as the first position based on the positions of each wafer warp; and marks the first target wafer warp.

[0085] In a possible implementation, there is a marked silicon wafer warp in the first graphite boat image. Optionally, when the marking of the first adjacent silicon wafer warp is completed, the computer device determines the silicon wafer warp that is closest to the first adjacent silicon wafer warp and is not marked as the above-mentioned first target silicon wafer warp based on the positions of each silicon wafer warp in the first graphite boat. Among them, the above-mentioned first adjacent silicon wafer warp can be a silicon wafer warp in the jth first warp sub-region, or a silicon wafer warp in the j-1th first warp sub-region. It should be noted that if the first adjacent silicon wafer warp is a silicon wafer warp in the j-1th first warp sub-region, the first adjacent silicon wafer warp is the last marked silicon wafer warp in the j-1th first warp sub-region, and its position is the final first position in the j-1th first warp sub-region; correspondingly, the first target silicon wafer warp is the first marked silicon wafer warp in the jth first warp sub-region, and its position is the initial first position in the jth first warp sub-region.

[0086] In another possible implementation, there is no marked silicon wafer warp in the first graphite boat image, that is, the first target silicon wafer warp is the first marked silicon wafer warp in the first graphite boat image. Optionally, the computer device uses the silicon wafer warp closest to the edge point of the graphite boat as the above-mentioned first silicon wafer warp based on the position of each silicon wafer warp in the first graphite boat. Optionally, the above-mentioned edge point can be any point on the edge of the graphite boat; illustratively, the first warp area that is not photographed is a rectangle, and the edge point can be the upper left vertex, the lower right vertex or the center point of the lower edge, etc., which is not limited in this embodiment of the present application. It should be noted that, in this case, the jth first warp sub-area below is the first first warp sub-area, and the position of the first target silicon wafer warp is the initial first position in the first first warp sub-area.

[0087] Optionally, the mark of the warped silicon wafer based on the first graphite boat image may also be referred to as a first mark.

[0088] 4. Taking the first position as a reference, determining the position of the unmarked wafer warp closest to the first position as the first target position; and marking the unmarked wafer warp closest to the first position.

[0089] In the embodiment of the present application, after determining the first position, the computer device determines the position of the unmarked wafer warp closest to the first position as the first target position based on the first position; and marks the unmarked wafer warp closest to the first position. The distance between the wafer warps can be the distance between any points on the wafer warp (such as the center point, the upper left vertex, or the center point of the upper edge, etc.), which is not limited in the embodiment of the present application.

[0090] 5. Determine the first target position as a new first position; and repeat the step of determining the position of the unmarked silicon wafer warp closest to the first position as the first target position based on the first position until the distance between the new first position and the initial first position is greater than a first threshold.

[0091] In an embodiment of the present application, after obtaining the above-mentioned first target position, the computer device determines the first target position as a new first position; further, the step of determining the position of the unmarked silicon wafer warp closest to the first position as the first target position based on the first position is repeated until the distance between the new first position and the initial first position is greater than the first threshold.

[0092] Optionally, in order to improve the success rate of subsequent boat shooting, the first threshold is determined based on the optimal boat shooting range of the computer device. Exemplarily, if the optimal boat shooting range is a rectangle, the first threshold is the length of the short side of the distance; if the optimal boat shooting range is a trapezoid, the first threshold is the height of the trapezoid; and so on. It should be noted that the optimal boat shooting range can be determined by multiple tests, and the embodiment of the present application does not limit the specific shape and specific area of ​​the optimal boat shooting range.

[0093] 6. Determine the jth first warping piece sub-region based on the final first position and the initial first position.

[0094] In the embodiment of the present application, when the distance between the new first position and the initial first position is greater than the first threshold, the computer device determines the new first position as the final first position, and determines the jth first warping sub-region based on the final first position and the initial first position. Wherein, j is an integer greater than or equal to 1; the first warping region includes m first warping sub-regions, and m is an integer greater than or equal to j; the initial first position refers to the position of the first marked silicon wafer warping after the j-1th first warping sub-region is determined.

[0095] To sum up, in the technical solution provided in the embodiment of the present application, the wafer warping area is divided into multiple wafer warping sub-areas, and the distance between each silicon wafer warping in a single wafer warping sub-area does not exceed a threshold value, so that the silicon wafer warping in each wafer warping sub-area can be concentratedly distributed, thereby reducing the adverse effect of scattered distribution of silicon wafer warping on the success rate of boat shooting, thereby improving the success rate of boat shooting.

[0096] For the second warping tab area, in an exemplary embodiment, the above step 302 further includes the following steps: 1. When there are warped silicon wafers in the first warped wafer area after the boat beating process, determine the positions of each warped silicon wafer.

[0097] In an embodiment of the present application, after performing a boat scan process on the first warped chip area, the computer device determines whether there is a warped silicon wafer in the first warped chip area after the boat scan process, and determines the position of each warped silicon wafer if there is a warped silicon wafer in the first warped chip area after the boat scan process. Optionally, the computer device acquires a second graphite boat image based on the first warped chip area after the boat scan process, and further determines the position of each warped silicon wafer if there is a warped silicon wafer in the second graphite boat image.

[0098] 2. Based on the positions of each wafer warp, determine the position of the unmarked second target wafer warp as the second position; and mark the second target wafer warp.

[0099] The second target wafer warp refers to any wafer warp in the first wafer warp area after the boat-beating process. In the embodiment of the present application, after determining the positions of each wafer warp in the first wafer warp area after the boat-beating process, the computer device determines the position of the unmarked second target wafer warp as the second position based on the positions of each wafer warp; and marks the second target wafer warp.

[0100] In a possible implementation, there is a marked silicon wafer warp in the first warp area after the boat processing. Optionally, when the marking of the second adjacent silicon wafer warp is completed, the computer device determines the silicon wafer warp that is closest to the second adjacent silicon wafer warp and is not marked as the above-mentioned second target silicon wafer warp based on the position of each silicon wafer warp. Among them, the above-mentioned second adjacent silicon wafer warp can be a silicon wafer warp in the i-th second warp sub-area, or it can be a silicon wafer warp in the i-1th second warp sub-area. It should be noted that if the second adjacent silicon wafer warp is a silicon wafer warp in the i-1th second warp sub-area, then the second adjacent silicon wafer warp is the last marked silicon wafer warp in the i-1th second warp sub-area, and its position is the final first position in the i-1th second warp sub-area; correspondingly, the second target silicon wafer warp is the first marked silicon wafer warp in the i-th second warp sub-area, and its position is the initial first position in the i-th second warp sub-area.

[0101] In another possible implementation, there is no marked silicon wafer warp in the first warp area after the boat-beating process, that is, the second target silicon wafer warp is the first marked silicon wafer warp in the first warp area after the boat-beating process. Optionally, based on the positions of each silicon wafer warp, the computer device uses the silicon wafer warp closest to the edge point of the first warp area after the boat-beating process as the above-mentioned second target silicon wafer warp. Optionally, the above-mentioned edge point can be any point on the edge of the first warp area after the boat-beating process; illustratively, the first warp area after the boat-beating process is a rectangle, and the edge point can be the upper left vertex, the lower right vertex or the center point of the lower edge, etc., which is not limited in this embodiment of the present application. It should be noted that, in this case, the i-th second warp sub-area below is the first second warp sub-area, and the position of the second target silicon wafer warp is the initial first position in the first second warp sub-area.

[0102] Optionally, the mark on the warped silicon wafer based on the first warped region after the boat beating process may also be referred to as a second mark.

[0103] 3. Taking the second position as a reference, determining the position of the unmarked wafer warp closest to the second position as the second target position; and marking the unmarked wafer warp closest to the second position.

[0104] In the embodiment of the present application, after determining the second position, the computer device determines the position of the unmarked wafer warp closest to the second position as the second target position based on the second position; and marks the unmarked wafer warp closest to the second position. The distance between the wafer warps can be the distance between any points on the wafer warp (such as the center point, the upper left vertex, or the center point of the upper edge, etc.), which is not limited in the embodiment of the present application.

[0105] 4. Determine the second target position as a new second position; and repeat the step of determining the position of the unmarked silicon wafer warp closest to the second position as the second target position based on the second position until the distance between the new second position and the initial second position is greater than a second threshold.

[0106] In an embodiment of the present application, after obtaining the above-mentioned second target position, the computer device determines the second target position as a new second position; further, the step of determining the position of the unmarked silicon wafer warp closest to the second position as the second target position based on the second position is repeated until the distance between the new second position and the initial second position is greater than the second threshold.

[0107] Optionally, the second threshold may be the same as or different from the first threshold, and the embodiments of the present application do not limit this. In one possible implementation, similar to the first threshold, the second threshold is determined based on the optimal boat-shooting range of the computer device. Exemplarily, if the optimal boat-shooting range is a rectangle, the second threshold is the length of the short side of the distance; if the optimal boat-shooting range is a trapezoid, the second threshold is the height of the trapezoid; and so on. In another possible implementation, in order to improve the success rate of boat-shooting, the second threshold is less than the first threshold, and the computer device determines the second threshold based on the first threshold.

[0108] 5. Determine the i-th second lifter sub-region based on the final second position and the initial second position.

[0109] In the embodiment of the present application, when the distance between the new second position and the initial second position is greater than the second threshold, the computer device determines the new second position as the final second position, and determines the i-th second warping sub-region based on the final second position and the initial second position. Wherein, i is an integer greater than or equal to 1; the second warping region includes n second warping sub-regions, and n is an integer greater than or equal to i; the initial second position refers to the position of the first marked silicon wafer warping after the i-1-th second warping sub-region is determined.

[0110] To sum up, in the technical solution provided in the embodiment of the present application, the wafer warping area is divided into multiple wafer warping sub-areas, and the distance between each silicon wafer warping in a single wafer warping sub-area does not exceed a threshold value, so that the silicon wafer warping in each wafer warping sub-area can be concentratedly distributed, thereby reducing the adverse effect of scattered distribution of silicon wafer warping on the success rate of boat shooting, thereby improving the success rate of boat shooting.

[0111] Please refer to Figure 4 , which shows a flow chart of a method for beating a silicon wafer boat with a graphite boat provided by another embodiment of the present application. The method is applied to Figure 1 The method may include the following steps (401-406): Step 401, using a first beating frequency to perform beating processing on a first warping region.

[0112] The above step 401 and Figure 3 Step 301 in the embodiment is similar, see Figure 3 The embodiments are not described in detail here.

[0113] Step 402: Acquire a second graphite boat image based on the first warped film region after the boat capture process.

[0114] The second graphite boat image is used to record the state of at least one silicon wafer in the first warped wafer area after the boat-beating process. In the embodiment of the present application, before acquiring the second warped wafer area, the computer device acquires the second graphite boat image based on the first warped wafer area after the boat-beating process.

[0115] In a possible implementation, the second graphite boat image is a static image directly acquired. Optionally, the computer device collects a static image of the first warping region after the boat-beating process from the graphite boat at a certain moment to acquire the second graphite boat image. The certain moment may be any moment, and the present application embodiment does not limit this.

[0116] In another possible implementation, since the state of the silicon wafer in the graphite boat may change over time, in order to ensure as much as possible that the state of the silicon wafer recorded by the second graphite boat image is the final state of the silicon wafer before the second warping region is determined, the second graphite boat image is a static image extracted from the dynamic image. Optionally, the computer device collects a dynamic image of the graphite boat within a certain period of time, and the dynamic image includes a plurality of continuous static images. Further, the computer device performs image comparison processing on each static image in the dynamic image, and when it is determined that there are q continuous static images in which the state of the silicon wafer has not changed, any static image is obtained from the q continuous static images as the second graphite boat image. Wherein, q is any integer greater than 1, such as 6, 10 or 34, etc., and the embodiment of the present application does not limit this. It should be noted that the above q and the above p may be the same or different in value, and the embodiment of the present application does not limit this.

[0117] Optionally, the computer device obtains the second graphite boat image from the first warping area after the boat is photographed through an image acquisition device. The number and / or shooting range of the image acquisition devices can be flexibly set and adjusted according to actual conditions. For example, the computer device obtains the second graphite boat image from the first warping area after the boat is photographed through an image acquisition device whose shooting range is greater than the second target range value; or, the computer device obtains the second graphite boat image from the first warping area after the boat is photographed through multiple image acquisition devices whose shooting range is less than or equal to the second target range value. The above-mentioned second target range value can be any value, and the second target range value can be flexibly set and adjusted according to actual conditions, which is not limited in the embodiments of the present application.

[0118] It should be noted that the image acquisition device used to obtain the second graphite boat image may be the same as or different from the image acquisition device used to obtain the first graphite boat image, and this embodiment of the present application does not limit this.

[0119] Step 403: perform image detection processing on the second graphite boat image to obtain an image processing result.

[0120] In the embodiment of the present application, after acquiring the second graphite boat image, the computer device performs image detection processing on the second graphite boat image to obtain an image processing result.

[0121] In one possible implementation, the computer device uses a pre-trained second neural network model to perform image detection on the second graphite boat image. The second neural network model and the first neural network model may be the same neural network model or different neural network models, which is not limited in the present application. In another possible implementation, the computer device uses the first graphite boat image to perform image detection processing on the second graphite boat image by image comparison.

[0122] In the embodiment of the present application, after obtaining the above-mentioned image processing result, the computer device determines whether there is a warped silicon wafer in the first warped wafer area after the boat-beating process. Then, if the image processing result indicates that there is a warped silicon wafer in the first warped wafer area after the boat-beating process, the following steps 404 and 405 are performed; if the image processing result indicates that there is no warped silicon wafer in the first warped wafer area after the boat-beating process, the following step 406 is performed.

[0123] Step 404, determining a second warping region based on the first warping region after the boat-scanning process.

[0124] Step 405: perform a boat beat process on the second warp film area using a second boat beat frequency.

[0125] The above steps 404 and 405 are Figure 3 Steps 302 and 303 in the embodiment are similar, see Figure 3 The embodiments are not described in detail here.

[0126] Step 406, determining that the boat beating for the first warp chip area is completed.

[0127] In the embodiment of the present application, when the computer device determines that there is no silicon wafer warpage in the first warp region after the warp processing, the computer device determines that the warp processing for the first warp region is completed. After that, the subsequent new warp region continues to be warped. The new warp region does not overlap with the first warp region.

[0128] To sum up, in the technical solution provided in the embodiment of the present application, by performing image detection processing on the first warped chip area after the boat beating processing, and then continuing the boat beating processing when there is still silicon wafer warping in the first warped chip area after the boat beating processing, the boat beating success rate of the entire graphite boat is improved.

[0129] Please refer to Figure 5 , which shows a flow chart of a method for beating a silicon wafer boat with a graphite boat provided in another embodiment of the present application. The method is applied to Figure 1 The method may include the following steps (501-507): Step 501, using a first beating frequency to perform beating processing on a first warping region.

[0130] The above step 501 and Figure 3 Step 301 in the embodiment is similar, see Figure 3 The embodiments are not described in detail here.

[0131] Step 502: Acquire a second graphite boat image based on the first warped film region after the boat capture process.

[0132] The above step 502 and Figure 4 Step 402 in the embodiment is similar, see Figure 4 The embodiments are not described in detail here.

[0133] Step 503: perform image detection processing on the second graphite boat image to obtain an image processing result.

[0134] For the specific image detection process, please refer to the above Figure 4 Step 403 of the embodiment is not described in detail here.

[0135] In the embodiment of the present application, when the computer device determines that there is a wafer warp in the first warp area after the boat-beating process, the computer device obtains the total number of boat beats for the first warp area. Afterwards, when the total number of boat beats for the first warp area is less than the target value, the following steps 504 and 505 are performed; when the total number of boat beats for the first warp area is greater than the target value, the following step 506 is performed. Optionally, when the total number of boat beats for the first warp area is equal to the target value, the following steps 504 and 505 are still performed. Among them, the target value can be any value, and the target value can be flexibly set and adjusted according to the actual situation, and the embodiment of the present application does not limit this.

[0136] It should be noted that the period from determining the first warp chip area to obtaining the second graphite boat image is one shot, that is, the total number of shots for the first warp chip area can be obtained by adding one to the total number of historical shots for the first warp chip area. The total number of historical shots refers to the total number of shots for the warp chip area including the first warp chip area before obtaining the first warp chip area.

[0137] In the embodiment of the present application, when the computer device determines that there is no silicon wafer warping in the first warping area after the boat-beating process, the computer device executes the following step 507 .

[0138] Step 504: determine a second warping region based on the first warping region after the boat-scanning process.

[0139] Step 505: perform a boat beat process on the second warp film area using a second boat beat frequency.

[0140] The above steps 504 and 505 are Figure 3 Steps 302 and 303 in the embodiment are similar, see Figure 3 The embodiments are not described in detail here.

[0141] Step 506, sending warning information.

[0142] The warning information is used to indicate manual intervention on the wafer warping of the first wafer region. In the embodiment of the present application, when the computer device determines that there is wafer warping in the first wafer region after the boat beat processing, and the total number of boat beats for the first wafer region is greater than the target value, the computer device sends a warning information to the user terminal to remind the user to manually intervene in the wafer warping of the first wafer region.

[0143] Optionally, the warning information includes position information of the first warping region and / or position information of each silicon wafer warp in the first warping region.

[0144] Step 507, determining that the boat beating for the first warp plate area is completed.

[0145] The above step 507 and Figure 4 Step 406 in the embodiment is similar, see Figure 4 The embodiments are not described in detail here.

[0146] To sum up, in the technical solution provided by the embodiment of the present application, by detecting the total number of beats, preview information is issued when the total number of beats exceeds the target value, so as to facilitate subsequent manual intervention, reduce the number of invalid beats, and thereby reduce the damage to computer equipment caused by multiple invalid beats.

[0147] One point that needs to be explained is that the above is an introduction to the silicon wafer beating method of the graphite boat in this application, taking the first warping area and the second warping area as examples. In an exemplary embodiment, when there is silicon wafer warping in the second warping area after the beating process, and the total number of beatings for the second warping area is less than or equal to the target value, the third warping area is determined based on the second warping area after the beating process, and then the third warping area is beating. Moreover, the beating frequency is proportional to the number of beatings, and the greater the number of beatings, the higher the frequency of beating; that is, when the effect of a single beating does not meet the requirements, when the beating is continued, the beating frequency is increased with the number of beatings, and the beating time is reduced to facilitate subsequent multiple beatings, thereby improving the overall beating effect.

[0148] For example, Figure 6As shown, after the computer device determines the target chip warping area based on the graphite boat, it uses the target chip beating frequency to perform a chip beating process on the target chip warping area. After the chip beating is completed, it is determined whether there is chip warping in the target chip warping area after the chip beating process. Furthermore, when there is chip warping in the target chip warping area after the chip beating process, the computer device determines whether the total number of chip beatings for the target chip warping area exceeds the target value. If the total number of chip beatings for the target chip warping area does not exceed the target value, a new target chip warping area is obtained from the target chip warping area after the chip beating process, the target chip beating frequency is increased, and the new target chip warping area is processed by the increased target chip beating frequency. The above steps are repeated until there is no chip warping in the target chip warping area after the chip beating process, or, if the total number of chip beatings for the target chip warping area exceeds the target value, an early warning message is sent.

[0149] The following is an embodiment of the device of the present application, which can be used to execute the embodiment of the method of the present application. For details not disclosed in the embodiment of the device of the present application, please refer to the embodiment of the method of the present application.

[0150] Please refer to Figure 7 , which shows a block diagram of a silicon wafer boat beating device for a graphite boat provided by an embodiment of the present application. The device has the function of implementing the above-mentioned silicon wafer boat beating method for a graphite boat, and the function can be implemented by hardware, or by hardware executing corresponding software. The device can be a computer device in a silicon wafer boat beating system for a graphite boat, and can also be set in a computer device in a silicon wafer boat beating system for a graphite boat. The device 700 may include: a boat beating processing module 710 and an area determination module 720.

[0151] The boat-beating processing module 710 is used to perform a boat-beating processing on a first warped wafer area using a first boat-beating frequency; wherein the first warped wafer area refers to an area including at least one silicon wafer warped wafer obtained based on a graphite boat.

[0152] The region determination module 720 is used to determine a second warping region based on the first warping region after the boat-scanning process; wherein the second warping region includes at least one silicon wafer warping.

[0153] The boat-beating processing module 710 is further used to perform boat-beating processing on the second warp chip area by using a second boat-beating frequency.

[0154] In an exemplary embodiment, the second boat-beating frequency is greater than the first boat-beating frequency.

[0155] In an exemplary embodiment, if Figure 8 As shown, the beat boat processing module 710 includes: a frequency determination submodule 711 and a beat boat processing submodule 712.

[0156] The frequency determination submodule 711 is used to determine the second boat-beating frequency based on the number of warped wafers in the second warped wafer area.

[0157] The beat processing submodule 712 is used to perform beat processing on the second warp region by using the second beat frequency.

[0158] In an exemplary embodiment, the frequency determination submodule 711 is used to determine the second boat-beating frequency based on the correspondence between the number of warps and the boat-beating frequency, taking the number of warps of the silicon wafer in the second warp area as a reference; or, determine the second boat-beating frequency based on the number of warps of the silicon wafer in the second warp area and the number of warps of the silicon wafer in the first warp area.

[0159] In an exemplary embodiment, the second warping region includes at least one second warping sub-region, and the second warping sub-region includes at least one silicon wafer warping; the boat processing submodule 712 is used to: For a second target sub-region in the second warp region that is not photographed and is adjacent to a photographed third adjacent sub-region, acquiring a distance between the third adjacent sub-region and the second target sub-region; determining a second moving speed based on the distance between the third adjacent sub-region and the second target sub-region, where the second moving speed refers to an average speed of moving to the second target sub-region; When moving to the second target sub-region, performing a boat-beating process on the second target sub-region using the second boat-beating frequency; From the second warping film area, determine the unpatched second warping film sub-area adjacent to the second target sub-area as a fourth adjacent sub-area; determining the fourth adjacent sub-region as a new second target sub-region; and repeating the step of obtaining the distance between the third adjacent sub-region and the second target sub-region until the second warping film region does not include the second warping film sub-region that is not filmed.

[0160] In an exemplary embodiment, the first warping region includes at least one first warping sub-region, and the first warping sub-region includes at least one silicon wafer warping; the boat processing submodule 712 is further used for: For a first unpatched target sub-region in the first warp region that is adjacent to a first adjacent sub-region that has been photographed, acquiring a distance between the first adjacent sub-region and the first target sub-region; determining a first moving speed based on a distance between the first adjacent sub-region and the first target sub-region, where the first moving speed refers to an average speed of moving to the first target sub-region; When moving to the first target sub-region, performing a boat beating process on the first target sub-region using the first boat beating frequency; From the first warping film area, determine an unpatched first warping film sub-area adjacent to the first target sub-area as a second adjacent sub-area; determining the second adjacent sub-region as a new first target sub-region; and repeating the step of obtaining the distance between the first adjacent sub-region and the first target sub-region until the first warping film region does not include the first warping film sub-region that has not been filmed.

[0161] In an exemplary embodiment, if Figure 8 As shown, the region determination module 720 includes: a position determination submodule 721 and a region determination submodule 722 .

[0162] The position determination submodule 721 is used to determine the position of each wafer warp when there are wafer warps in the first wafer warp area after the boat-beating process.

[0163] The position determination submodule 721 is further configured to determine the position of an unmarked second target silicon wafer warp as a second position based on the positions of each silicon wafer warp; and mark the second target silicon wafer warp.

[0164] The position determination submodule 721 is further configured to determine the position of the unmarked wafer warp closest to the second position as the second target position based on the second position; and mark the unmarked wafer warp closest to the second position.

[0165] The position determination submodule 721 is also used to determine the second target position as a new second position; and repeat the step of determining the position of the unmarked silicon wafer warp closest to the second position as the second target position based on the second position until the distance between the new second position and the initial second position is greater than a second threshold.

[0166] The area determination submodule 722 is used to determine the i-th second tilting piece sub-area based on the final second position and the initial second position, where i is an integer greater than or equal to 1; wherein the second tilting piece area includes n second tilting piece sub-areas, where n is an integer greater than or equal to i.

[0167] In an exemplary embodiment, if Figure 8 As shown, the device 700 also includes: an image acquisition module 730.

[0168] The image acquisition module 730 is configured to acquire a first graphite boat image based on the graphite boat.

[0169] The position determination submodule 721 is further configured to determine the position of each warped silicon wafer when there is a warped silicon wafer in the first graphite boat image.

[0170] The position determination submodule 721 is further configured to determine the position of an unmarked first target silicon wafer warp as a first position based on the positions of each silicon wafer warp; and mark the first target silicon wafer warp.

[0171] The position determination submodule 721 is further configured to determine the position of the unmarked wafer warp closest to the first position as the first target position based on the first position; and mark the unmarked wafer warp closest to the first position.

[0172] The position determination submodule 721 is further configured to determine the first target position as a new first position; and repeat the step of determining the position of the unmarked wafer warp closest to the first position as the first target position based on the first position until the distance between the new first position and the initial first position is greater than a first threshold; The area determination submodule 722 is also used to determine the jth first tilting piece sub-area based on the final first position and the initial first position, where j is an integer greater than or equal to 1; wherein the first tilting piece area includes m first tilting piece sub-areas, where m is an integer greater than or equal to j.

[0173] In an exemplary embodiment, if Figure 8 As shown, the device 700 further includes: an image processing module 740 and a boat shooting completion module 760 .

[0174] The image acquisition module 730 is used to acquire a second graphite boat image based on the first warped sheet area after the boat capture process.

[0175] The image processing module 740 is used to perform image detection processing on the second graphite boat image to obtain an image processing result.

[0176] The area determination module 720 is further configured to, when the image processing result indicates that there is wafer warping in the first warping area after the boat-beating processing, execute the step of determining the second warping area based on the first warping area after the boat-beating processing.

[0177] The boating completion module 760 is used to determine that the boating completion for the first warping area is completed when the image processing result indicates that there is no silicon wafer warping in the first warping area after the boating processing.

[0178] In an exemplary embodiment, if Figure 8 As shown, the device 700 also includes: an information sending module 750.

[0179] The region determination module 720 is further configured to, when the total number of boat beats for the first warping film region is less than a target value, execute the step of determining the second warping film region based on the first warping film region after the boat beats.

[0180] The information sending module 750 is used to send warning information when the total number of boat beatings is greater than a target value, wherein the warning information is used to instruct manual intervention to be performed on the wafer warping of the first wafer warping area.

[0181] To sum up, the technical solution provided in the embodiment of the present application provides an automated boat beating method for a graphite boat, which does not require manual beating of the silicon wafer, thereby reducing the labor cost in the silicon wafer production process; after beating the first wafer area, the second wafer area is determined based on the first wafer area, and the second wafer area is continued to be beated, and multiple boat beatings improve the boat beating success rate; different boat beating frequencies are used to beat different wafer areas, thereby improving the flexibility of boat beating. In a specific production process, the boat beating frequency can be flexibly set and adjusted according to different production rhythms. A high production rhythm corresponds to a high boat beating frequency to improve the adaptability of the boat beating process to the production process, and a low production rhythm corresponds to a low boat beating frequency to reduce the energy consumption of boat beating and save resources.

[0182] In an exemplary embodiment, a computer device is also provided, the computer device comprising a processor and a memory, wherein a computer program is stored in the memory, and the computer program is loaded and executed by the processor to implement the above-mentioned silicon wafer boat beating method of the graphite boat.

[0183] In an exemplary embodiment, a non-transitory computer-readable storage medium is also provided, on which a computer program is stored, and when the computer program is executed by a processor, the silicon wafer boat beating method of the graphite boat is implemented.

[0184] In an exemplary embodiment, a computer program product is also provided. When the computer program product is run, a computer device executes the above-mentioned silicon wafer boat beating method for a graphite boat.

[0185] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the invention.

[0186] It should be understood that the "multiple" mentioned in this article refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. In addition, the step numbers described in this article only illustrate a possible execution sequence between the steps. In some other embodiments, the above steps may not be executed in the order of the numbers, such as two steps with different numbers are executed at the same time, or two steps with different numbers are executed in the opposite order to the diagram. The embodiments of the present application are not limited to this.

[0187] The above description is only an exemplary embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method for beating a silicon wafer in a graphite boat, characterized in that: The method comprises: Using a first boat-beating frequency, a first warped wafer region is subjected to a boat-beating process; wherein the first warped wafer region refers to a region including at least one warped silicon wafer obtained based on a graphite boat; Based on the first warped chip area after the boat-beating process, determining a second warped chip area; wherein the second warped chip area includes at least one silicon wafer warped chip; The second warp plate area is subjected to a boat beating process using a second boat beating frequency.

2. The method according to claim 1, characterized in that The second boat-beating frequency is greater than the first boat-beating frequency.

3. The method according to claim 1, characterized in that: The step of performing a boat beating process on the second warp chip area using a second boat beating frequency includes: determining the second boat-beating frequency based on the number of warped wafers in the second warped wafer area; The second flap area is flapped using the second flap frequency.

4. The method according to claim 3, characterized in that The determining the second boat-beating frequency based on the number of wafers in the second wafer region includes: According to the corresponding relationship between the number of chip warps and the boat-beating frequency, the second boat-beating frequency is determined based on the number of chip warps in the second chip warp area; or, The second boat-beating frequency is determined based on the number of warped silicon wafers in the second warped region and the number of warped silicon wafers in the first warped region.

5. The method according to claim 3, characterized in that: The second warping region includes at least one second warping sub-region, and the second warping sub-region includes at least one silicon wafer warping; The step of performing a boat beating process on the second warp chip area using the second boat beating frequency includes: For a second target sub-region in the second warp region that is not photographed and is adjacent to a photographed third adjacent sub-region, acquiring a distance between the third adjacent sub-region and the second target sub-region; determining a second moving speed based on the distance between the third adjacent sub-region and the second target sub-region, where the second moving speed refers to an average speed of moving to the second target sub-region; When moving to the second target sub-region, performing a boat-beating process on the second target sub-region using the second boat-beating frequency; From the second warping film area, determine the unpatched second warping film sub-area adjacent to the second target sub-area as a fourth adjacent sub-area; determining the fourth adjacent sub-region as a new second target sub-region; and repeating the step of obtaining the distance between the third adjacent sub-region and the second target sub-region until the second warping film region does not include the second warping film sub-region that is not filmed.

6. The method according to claim 1, characterized in that The first warping region includes at least one first warping sub-region, and the first warping sub-region includes at least one silicon wafer warping; The first flapping frequency is used to perform a flapping process on the first warping region, including: For a first unpatched target sub-region in the first warp region that is adjacent to a first adjacent sub-region that has been photographed, acquiring a distance between the first adjacent sub-region and the first target sub-region; determining a first moving speed based on a distance between the first adjacent sub-region and the first target sub-region, where the first moving speed refers to an average speed of moving to the first target sub-region; When moving to the first target sub-region, performing a boat beating process on the first target sub-region using the first boat beating frequency; From the first warping film area, determine an unpatched first warping film sub-area adjacent to the first target sub-area as a second adjacent sub-area; determining the second adjacent sub-region as a new first target sub-region; and repeating the step of obtaining the distance between the first adjacent sub-region and the first target sub-region until the first warping film region does not include the first warping film sub-region that has not been filmed.

7. The method according to claim 1, characterized in that The determining of the second warping region based on the first warping region after the boat-beating process includes: In the case where there are warped silicon wafers in the first warped wafer area after the boat beating process, determining positions of each warped silicon wafer; Based on the positions of each wafer warp, determining the position of a second target wafer warp that is not marked as a second position; and marking the second target wafer warp; Taking the second position as a reference, determining the position of the unmarked wafer warp closest to the second position as the second target position; and marking the unmarked wafer warp closest to the second position; Determine the second target position as a new second position; and repeat the step of determining the position of the unmarked wafer warp closest to the second position as the second target position based on the second position until the distance between the new second position and the initial second position is greater than a second threshold; The i-th second tilting piece sub-region is determined based on the final second position and the initial second position, where i is an integer greater than or equal to 1; wherein the second tilting piece region includes n second tilting piece sub-regions, where n is an integer greater than or equal to i.

8. The method according to claim 1, characterized in that Before the first flapping frequency is used to perform the flapping process on the first warping region, the method further includes: acquiring a first graphite boat image based on the graphite boat; In the case where there are warped silicon wafers in the first graphite boat image, determining positions of each warped silicon wafer; Based on the positions of each wafer warp, determining the position of an unmarked first target wafer warp as a first position; and marking the first target wafer warp; Taking the first position as a reference, determining the position of the unmarked wafer warp closest to the first position as a first target position; and marking the unmarked wafer warp closest to the first position; Determine the first target position as a new first position; and repeat the step of determining the position of the unmarked wafer warp closest to the first position as the first target position based on the first position until the distance between the new first position and the initial first position is greater than a first threshold; The jth first tilting piece sub-region is determined based on the final first position and the initial first position, where j is an integer greater than or equal to 1; wherein the first tilting piece region includes m first tilting piece sub-regions, where m is an integer greater than or equal to j.

9. The method according to any one of claims 1 to 8, characterized in that: Before determining the second warping region based on the first warping region after the boat-scanning process, the method further includes: Acquire a second graphite boat image based on the first warped film area after the boat-beating process; performing image detection processing on the second graphite boat image to obtain an image processing result; When the image processing result indicates that the first warped region after the boat-beating process has a warped silicon wafer, performing the step of determining the second warped region based on the first warped region after the boat-beating process; When the image processing result indicates that there is no wafer warpage in the first warped region after the boat-capturing process, it is determined that the boat-capturing process for the first warped region is completed.

10. The method according to claim 9, characterized in that In the case where the image processing result indicates that there is wafer warping in the first warping area after the boat processing, the method further includes: When the total number of times of boat beating for the first warping film area is less than the target value, the step of determining the second warping film area based on the first warping film area after boat beating is performed; When the total number of boat beatings is greater than the target value, an early warning message is sent, where the early warning message is used to instruct manual intervention to be performed on the wafer warping of the first wafer warping area.

11. A silicon wafer boat beating device for a graphite boat, characterized in that: The device comprises: A boat-beating processing module, used to perform a boat-beating processing on a first warped wafer area using a first boat-beating frequency; wherein the first warped wafer area refers to an area including at least one warped silicon wafer obtained based on a graphite boat; A region determination module, configured to determine a second warping region based on the first warping region after the boat-beating process; wherein the second warping region includes at least one silicon wafer warping; The boat-beating processing module is further used to perform boat-beating processing on the second warp chip area by using a second boat-beating frequency.

12. A computer device, characterized in that: The computer device comprises a processor and a memory, wherein a computer program is stored in the memory, and the computer program is loaded and executed by the processor to implement the method according to any one of claims 1 to 10.

13. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 10 is implemented.

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