Electrostatic chuck and manufacturing method thereof

Abstract

The invention provides an electrostatic chuck capable of relatively reducing measurement errors when the temperature of a workpiece is measured, and a method for manufacturing the electrostatic chuck. The electrostatic chuck comprises a base body, a sleeve, an adsorption electrode, a dielectric layer and a temperature adjusting device. The base body comprises a first surface and a second surface which are electrically insulating, and a through hole penetrating through the first surface and the second surface is formed; the sleeve is a bottomed cylinder, is inserted into the through hole, and is configured so that a temperature sensor for measuring the temperature of the bottom plate can be attached thereto. The adsorption electrode is formed on the first surface and includes a conductor. The dielectric layer is formed so as to cover the sleeve and the adsorption electrode, and is configured so as to be capable of adsorbing a workpiece. The temperature adjusting device is configured so as to be able to adjust the temperature of the workpiece.

Description

Technical Field

[0001] The invention relates to an electrostatic chuck and a method for manufacturing the electrostatic chuck. Background Art

[0002] An electrostatic chuck is a holding device that applies voltage to an adsorption electrode disposed inside and uses the generated electrical attraction force such as Coulomb force, Johnson-Rabec force, or gradient force to adsorb and hold a workpiece.

[0003] The electrostatic chuck includes a substrate, an adsorption electrode formed on the substrate, and a dielectric layer covering the adsorption electrode, and adsorbs the workpiece by the electric attraction generated in the dielectric layer when a voltage is applied to the adsorption electrode. Hereinafter, the surface of the substrate on the side where the adsorption electrode is formed is referred to as the first surface, and the surface on the opposite side of the first surface is referred to as the second surface. In addition, the surface of the workpiece that is directly in contact with the dielectric layer is referred to as the adsorption surface, and the surface on the opposite side of the adsorption surface is referred to as the non-adsorption surface.

[0004] In an electrostatic chuck, a temperature adjustment device may be provided to adjust the temperature of a workpiece. In this case, it is preferable to measure the temperature of the workpiece using a temperature sensor and use it for feedback control or the like.

[0005] The following reasons make it difficult to directly measure the temperature of the workpiece. When measuring the non-adsorption surface of the workpiece, the use of a contact temperature sensor is not ideal in terms of preventing damage or contamination of the workpiece. In addition, in order to use a non-contact temperature sensor, there must be no obstacles between the non-contact temperature sensor and the workpiece, so the design becomes complicated. Moreover, when using an electrostatic suction cup under vacuum, the non-contact temperature sensor needs to take pressure resistance measures, so the manufacturing cost also increases. When measuring the adsorption surface of the workpiece, a through hole is provided that passes through the substrate and the dielectric layer, and a temperature sensor is provided in the through hole to measure the adsorption surface. At this time, since the efficiency of heat conduction between the temperature adjustment device and the surrounding area of ​​the through hole is reduced, the workpiece is prone to temperature unevenness.

[0006] Therefore, in the past, a bottomed hole was formed on the second surface side of the substrate, and the temperature of the workpiece was indirectly measured by measuring the temperature of the bottom surface of the bottomed hole. Japanese Patent Publication No. 2000-286331 discloses an electrostatic chuck in which a thermocouple is buried in a plate-shaped ceramic body. At this time, the temperature obtained by the temperature sensor may have an error with the actual temperature of the workpiece, so the measured value is added with a specific offset value and regarded as the actual temperature of the workpiece. Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] The offset value may change due to various conditions such as the environment around the electrostatic chuck and the temperature of the workpiece before adsorption, so it is not easy to find the appropriate value.

[0009] If the distance between the bottom surface of the bottomed hole and the first surface of the substrate can be reduced, the distance between the temperature measurement position and the workpiece will also be reduced, thereby reducing the measurement error. However, if a thin-walled portion is provided on the substrate, cracks may occur, so there is a limit in design to reducing the distance between the bottom surface of the bottomed hole and the first surface of the substrate.

[0010] The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electrostatic chuck and a method for manufacturing the same, which can relatively reduce a measurement error when measuring the temperature of a workpiece.

[0011] [Technical means to solve the problem]

[0012] According to the present invention, there is provided an electrostatic suction cup, comprising: a base, comprising a first surface having electrical insulation, and a second surface being the surface on the opposite side of the first surface, and having a through hole formed therein that passes through the first surface and the second surface; a sleeve, which is a bottomed cylindrical body comprising a side wall, an opening formed at one end of the side wall, and a bottom plate arranged at the other end of the side wall, and is inserted into the through hole in a manner that the opening is located on a side close to the second surface and the bottom plate is located on a side close to the first surface, and is constructed in a manner that a temperature sensor for measuring the temperature of the bottom plate can be installed; an adsorption electrode, formed on the first surface, and comprising a conductor; a dielectric layer, formed in a manner that covers the sleeve and the adsorption electrode, and is constructed in a manner that can adsorb a workpiece, and comprises a dielectric; and a temperature adjustment device, constructed in a manner that can adjust the temperature of the workpiece.

[0013] Moreover, according to the present invention, there is provided a method for manufacturing an electrostatic suction cup, comprising: a substrate preparation step of preparing a substrate, the substrate comprising a first surface having electrical insulation and a second surface being a surface on the opposite side of the first surface, and a through hole penetrating the first surface and the second surface; a sleeve insertion step of inserting a sleeve into the through hole in a manner such that an opening is located on a side close to the second surface and a bottom plate is located on a side close to the first surface, the sleeve being a bottomed cylindrical body comprising a side wall, the opening formed at one end of the side wall and the bottom plate arranged at the other end of the side wall, and being constructed in a manner such that a temperature sensor for measuring the temperature of the bottom plate can be installed; an adsorption electrode forming step of forming an adsorption electrode including a conductor on the first surface; a dielectric layer forming step of forming a dielectric layer that is constructed in a manner such that a workpiece can be adsorbed and that includes a dielectric material so as to cover the adsorption electrode and the sleeve; and a temperature adjustment device setting step of setting a temperature adjustment device that is constructed in a manner such that the temperature of the workpiece can be adjusted.

[0014] [Effects of the Invention]

[0015] In the electrostatic chuck of the present invention, a through hole is formed in the base, and a sleeve as a bottomed cylindrical body is inserted into the through hole. In addition, a dielectric layer is formed in a manner that covers the adsorption electrode and the sleeve. When measuring the temperature of the workpiece, a temperature sensor is installed in the sleeve to measure the temperature of the bottom plate of the sleeve. According to this structure, it is possible to design in a manner that the distance between the temperature measurement position and the workpiece becomes relatively small, thereby realizing an electrostatic chuck with a relatively reduced temperature measurement error. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a cross-sectional view of an electrostatic chuck.

[0017] Figure 2 is with Figure 1 A magnified view of the range II.

[0018] Figure 3 It is a bottom view of a substrate having an adsorption electrode formed on a first surface.

[0019] Figure 4 It is an enlarged cross-sectional view of the sleeve.

[0020] Figure 5 It is a top view of a substrate having heater electrodes formed on the second surface.

[0021] Figure 6 It is a flow chart of the manufacturing method of the electrostatic chuck.

[0022] Figure 7 This is an explanatory diagram of a method for manufacturing an electrostatic chuck, showing a base body having grooves and through holes formed therein.

[0023] Figure 8 This is an explanatory diagram of a method for manufacturing an electrostatic chuck, showing a base body with a sleeve inserted therethrough.

[0024] Fig. 9 This is an explanatory diagram of a method for manufacturing an electrostatic chuck, showing a state after a conductor is sprayed.

[0025] Fig.10 This is an explanatory diagram of a method for manufacturing an electrostatic chuck, showing a state after a conductor has been ground.

[0026] Fig.11 This is an explanatory diagram of a method for manufacturing an electrostatic chuck, showing a state after dielectric spraying.

[0027] Fig.12 This is an explanatory diagram of a method for manufacturing an electrostatic chuck, showing a state after a dielectric material has been ground.

[0028] [Explanation of Symbols]

[0029] 1: Electrostatic chuck

[0030] 2: Matrix

[0031] 3: Adsorption electrode

[0032] 4: Dielectric layer

[0033] 5: Sleeve

[0034] 6: Temperature adjustment device

[0035] 7: Temperature sensor

[0036] 21: Side 1

[0037] 22: Side 2

[0038] 23: Through hole

[0039] 24: Slot

[0040] 31: Positive electrode

[0041] 32: Negative electrode

[0042] 51: Sidewall

[0043] 52: Bottom plate

[0044] 53: Flange

[0045] 54: Filling layer

[0046] 61: Heater

[0047] 62: Cooler

[0048] 311, 322, 612: Terminal

[0049] 511: Opening

[0050] 611: Heater electrode

[0051] 622: Cooling piping

[0052] C: Spacing

[0053] D: diameter

[0054] t1, t2: thickness

[0055] W: Workpiece DETAILED DESCRIPTION

[0056] Hereinafter, embodiments of the present invention will be described using the accompanying drawings. Each of the drawings schematically shows each component, and the shape or scale may not be as described in the drawings. The various modifications described below can be implemented in any combination.

[0057] The electrostatic chuck 1 of the present embodiment can be suitably used as a wafer holding device in a vacuum chamber of a semiconductor manufacturing apparatus. However, the application field of the electrostatic chuck 1 is not limited thereto.

[0058] Moreover, the electrostatic chuck 1 of this embodiment can be particularly suitably used when the workpiece W as the adsorbed object contains a material such as glass that has low thermal conductivity and is prone to temperature unevenness. Specifically, it is particularly suitable when the thermal conductivity of the workpiece W (at room temperature, i.e., about 5°C to 30°C) is 3.0 W / m·K or less.

[0059] like Figure 1 and Figure 2 As shown, the electrostatic chuck 1 of the present embodiment includes a base 2 , an adsorption electrode 3 , a dielectric layer 4 , a sleeve 5 , a temperature adjustment device 6 , and a temperature sensor 7 .

[0060] The substrate 2 is a plate-shaped base material for forming the adsorption electrode 3 and the dielectric layer 4. The substrate 2 includes a first surface 21 and a second surface 22 which is a surface on the opposite side of the first surface 21. The first surface 21 is a surface on the side where the adsorption electrode 3 and the dielectric layer 4 are formed, and has electrical insulation. Specifically, the substrate 2 of the present embodiment is a sintered body of ceramic formed integrally, which has the above-mentioned insulation as a whole, and may include a composite material, and at least the first surface 21 has electrical insulation. A through hole 23 is formed in the substrate 2, which penetrates the first surface 21 and the second surface 22 in the plate thickness direction, and the sleeve 5 is inserted into the through hole 23.

[0061] The electrostatic chuck 1 of this embodiment can be used particularly preferably when using a base 2 made of a material that is prone to cracking if a thin-walled portion is provided. Specifically, it is particularly suitable when the base 2 is made of ceramic or glass. For example, alumina can be used as the ceramic.

[0062] The adsorption electrode 3 is an electrode formed on the first surface 21 of the substrate 2 and includes a conductor. The adsorption electrode 3 may be a monopolar type including only one of the positive electrode 31 and the negative electrode 32, or a bipolar type including both the positive electrode 31 and the negative electrode 32. The adsorption electrode 3 of this embodiment is a bipolar type, such as Figure 3 As shown, the positive electrode 31 and the negative electrode 32 are alternately arranged with a specific gap therebetween in a so-called comb-tooth shape. When the workpiece W is adsorbed, a specific voltage is applied to the positive electrode 31 and the negative electrode 32 via the terminal 311 and the terminal 322, respectively.

[0063] The material of the adsorption electrode 3 is not particularly limited as long as it can be used as an electrode. When the adsorption electrode 3 is made of the same material as the filling layer 54 described below, a material with high thermal conductivity is preferred. The adsorption electrode 3 may be made of, for example, aluminum, copper, silver, nickel, tungsten, and alloys containing these as main components.

[0064] The dielectric layer 4 is a layer containing a dielectric formed in a manner covering the sleeve 5 and the adsorption electrode 3. The dielectric layer 4 is configured to be able to adsorb the workpiece W, and the workpiece W is directly in contact with the dielectric layer 4 and held. Specifically, when a specific voltage is applied to the adsorption electrode 3, an electric attraction such as a Coulomb force, a Johnson-Rabec force, and a gradient force is generated in the dielectric layer 4, and the workpiece W is adsorbed.

[0065] The material of the dielectric layer 4 can be selected from any dielectric according to the required resistivity. The dielectric layer 4 can include, for example, zircon, alumina, zirconium oxide, titanium dioxide, aluminum nitride, silicon dioxide, and a mixture thereof. The thickness of the dielectric layer 4 is, for example, about 0.2 mm or more and about 0.5 mm or less.

[0066] The sleeve 5 is a bottomed cylinder configured in such a way that the temperature sensor 7 can be mounted. Figure 4 As shown, the sleeve 5 includes a side wall 51, a bottom plate 52, and a flange 53. An opening 511 is formed at one end of the side wall 51, and the bottom plate 52 is disposed at the other end of the side wall 51. Figure 2 As shown, the sleeve 5 is inserted into the through hole 23 of the base 2 in such a manner that the opening 511 is located on the side close to the second surface 22 and the bottom plate 52 is located on the side close to the first surface 21. In order to grasp the temperature of the workpiece W, the temperature sensor 7 is inserted into the side wall 51 through the opening 511 to measure the temperature of the bottom plate 52. According to this structure, there is no need to provide a thin-walled portion on the base 2, and the temperature can be measured at a position closer to the workpiece W, which can further reduce the measurement error of the temperature.

[0067] The material of the sleeve 5 is not particularly limited, and a material with good thermal conductivity is preferred. The sleeve 5 may include, for example, metals such as aluminum, stainless steel, iron, and alloys thereof as main components, machinable ceramics, and alumina. In particular, aluminum (including aluminum alloys) is excellent and suitable as the material of the sleeve 5 in terms of thermal conductivity, machinability, and availability.

[0068] The thickness t1 of the bottom plate 52 of the sleeve 5 is preferably as small as possible in order to bring the temperature measurement position closer to the workpiece W. The thickness t1 of the bottom plate 52 is, for example, about 3 mm or less. The lower limit of the thickness t1 of the bottom plate 52 is not particularly limited, and the usual processing limit is about 0.5 mm.

[0069] The flange 53 is a flange portion formed on the periphery of the base plate 52. By providing the flange 53, the temperature measurement area of ​​the temperature sensor 7 can be substantially increased. In addition, the sleeve 5 can be prevented from falling off during manufacturing. On the other hand, when the sleeve 5 includes a conductor, the sleeve 5 and the adsorption electrode 3 need to be provided in a non-contact manner. When the design is performed in a manner that the sleeve 5 does not contact the adsorption electrode 3, if the area of ​​the flange 53 is large, the area of ​​the adsorption electrode 3 that can be formed is correspondingly reduced, and there is a possibility that the adsorption force of the electrostatic suction cup 1 is affected. Based on the above, the area of ​​the flange 53 is preferably a size that improves the temperature measurement accuracy and does not affect the adsorption force, and the diameter D of the flange 53 is, for example, about 8 mm or more and about 10 mm or less.

[0070] like Figure 2 As shown, a filling layer 54 may be formed between the bottom plate 52 of the sleeve 5 and the dielectric layer 4. The reason for providing the filling layer 54 will be described below.

[0071] The temperature adjustment device 6 is a device configured to adjust the temperature of the workpiece W. The temperature adjustment device 6 preferably performs feedback control using the temperature of the workpiece W measured by the temperature sensor 7. The temperature adjustment device 6 includes at least one of a heater 61 for heating the workpiece W and a cooler 62 for cooling the workpiece W. In the present embodiment, the temperature adjustment device 6 is disposed adjacent to the second surface of the substrate 2, and at least a portion thereof may be disposed inside the substrate 2.

[0072] The heater 61 of this embodiment includes a heater electrode 611. The heater electrode 611 is an electrode including a resistive heating element. The resistive heating element may be, for example, a nickel-chromium alloy. Figure 5 As shown, the heater electrode 611 is directly formed on the second surface 22 of the substrate 2. Therefore, the second surface 22 needs to have electrical insulation. When the workpiece W is heated, a specific voltage is applied to the heater electrode 611 via the terminal 612.

[0073] The heater 61 is not limited to a heater including the heater electrode 611. For example, the heater 61 may include a heating pipe as a pipe through which a heating medium can flow, a sheath heater, or a sheet heater such as a polyimide heater or a polyester heater.

[0074] The cooler 62 of this embodiment includes a cooling pipe 622. The cooling pipe 622 is a pipe through which air or a refrigerant can flow. The cooler 62 is not limited to a cooler including the cooling pipe 622. For example, the cooler 62 may include a Peltier element.

[0075] The temperature sensor 7 measures the temperature of the bottom plate 52 of the sleeve 5, thereby indirectly obtaining the temperature of the workpiece W. The temperature sensor 7 is preferably a contact temperature sensor. More specifically, the temperature sensor 7 may be, for example, a thermocouple, a temperature measuring resistor, or a thermistor. The position and number of the temperature sensor 7 and the sleeve 5 for inserting the temperature sensor 7 are not particularly limited. In terms of more accurately measuring the temperature of the workpiece W, it is preferred to provide a plurality of temperature sensors 7 and sleeves 5 distributed over the entire surface of the electrostatic chuck 1. The electrostatic chuck 1 of this embodiment includes nine temperature sensors 7 and sleeves 5.

[0076] Below, refer to Figures 6 to 12 A method for manufacturing the electrostatic chuck 1 of this embodiment will be described. Figures 7 to 12 In particular, the structure of the electrostatic chuck 1 is simplified.

[0077] First, a substrate preparation step (S1) is performed to prepare the substrate 2. Figure 7 As shown, a through hole 23 penetrating the first surface 21 and the second surface 22 is formed in the base 2, and a groove 24 is formed in the first surface 21. The through hole 23 includes a first portion having a diameter substantially the same as the outer diameter of the side wall 51 of the sleeve 5, and a second portion having a diameter substantially the same as the outer diameter of the flange 53 of the sleeve 5, the first portion being located on the side close to the second surface 22, and the second portion being located on the side close to the first surface 21. The groove 24 has the same shape as the adsorption electrode 3 to be formed.

[0078] A sleeve inserting step (S2) of inserting the sleeve 5 into the through hole 23 of the base body 2 is performed. Figure 8 As shown, the sleeve 5 is inserted from the first surface 21 side so that the opening 511 is located on the side close to the second surface 22 and the bottom plate 52 is located on the side close to the first surface 21. Here, when the sleeve 5 is pressed into the boundary surface between the first part and the second part of the flange 53 abutting against the through hole 23, it is preferred to form a small gap C between the bottom plate 52 of the sleeve 5 and the first surface 21.

[0079] After inserting the sleeve 5, Fig. 9 As shown in FIG. 1 , the conductor is sprayed on the entire surface of one side of the first surface 21 ( S3 ). Next, the sprayed conductor is ground to remove unnecessary conductors ( S4 ). Specifically, the portion other than the through hole 23 and the groove 24 is ground until the base 2 is exposed. Thus, the adsorption electrode forming step is performed, and as shown in FIG. Fig.10As shown, an adsorption electrode 3 including a positive electrode 31 and a negative electrode 32, and a filling layer 54 are formed on the first surface 21 of the substrate 2. In other words, the adsorption electrode forming step of the present embodiment includes: a step of spraying a conductor at least in the groove 24 and the pitch C; and a step of removing unnecessary portions of the sprayed conductor, forming the adsorption electrode 3 at the groove 24, and forming the filling layer 54 at the pitch C.

[0080] In the present embodiment, the adsorption electrode 3 is formed by spraying, but the method for forming the adsorption electrode 3 is not limited thereto. For example, the adsorption electrode 3 may be formed by printing. Furthermore, the adsorption electrode 3 may be formed by adhering a wire. Furthermore, when the base 2 is formed of a fired body of ceramic, a conductor may be provided on the ceramic raw material before firing and fired to produce the base 2 integrated with the adsorption electrode 3.

[0081] Furthermore, when forming the adsorption electrode 3 by spraying, in this embodiment, after the conductor is sprayed on the entire surface, the unnecessary parts are removed by grinding. According to the method, there are advantages in that the gap between the electrodes can be easily made close to the design size, and the thickness of the electrode becomes roughly uniform, which can suppress the unevenness of the adsorption performance. However, it is also possible to provide a mask formed with a desired electrode pattern, and to spray the conductor on the mask to form the adsorption electrode 3. In the above case, it is not necessary to provide the groove 24 in the base 2.

[0082] In the case where the unnecessary parts are removed by grinding after the conductor is sprayed on the entire surface, it is necessary to avoid damage to the sleeve 5 caused by grinding. In the present embodiment, damage to the sleeve 5 is avoided by setting a spacing C between the bottom plate 52 of the sleeve 5 and the first surface 21. Moreover, the spacing C is filled with a spraying material to form a filling layer 54. The spraying material filled in the spacing C may be a material different from the conductor forming the adsorption electrode 3, but in terms of simplifying the manufacturing process, it is preferably the same material. That is, the filling layer 54 preferably contains the same material as the adsorption electrode. In terms of making the temperature measurement position closer to the workpiece W, the thickness t2 of the filling layer 54 is preferably as small as possible. The thickness t2 of the filling layer 54 is, for example, greater than about 0.1 mm and less than about 0.5 mm.

[0083] After forming the adsorption electrode 3, as Fig.11 As shown in FIG. 1 , a dielectric material is sprayed on the entire surface of one side of the first surface 21 ( S5 ). Next, the sprayed dielectric material is ground to make the surface flat ( S6 ). Thus, the dielectric layer forming process is performed, and as shown in FIG. Fig.11 As shown, the dielectric layer 4 is formed so as to cover the adsorption electrode 3 and the sleeve 5 .

[0084] In the present embodiment, the dielectric layer 4 is formed by thermal spraying, but the method for forming the dielectric layer 4 is not limited thereto. For example, the dielectric layer 4 may be formed by adhering a plate-shaped or film-shaped dielectric.

[0085] Then, a temperature adjustment device setting process (S7) of setting a temperature adjustment device is implemented. In the case of setting a heater electrode 611 constituting the heater 61, a resistive heating element may be sprayed on the second surface 22 of the substrate 2 to form the heater electrode 611. In the case of forming the heater electrode 611 by spraying, a groove may be formed on the second surface 22, a resistive heating element may be sprayed on the entire surface of one side of the second surface 22, and the sprayed resistive heating element may be ground to remove unnecessary resistive heating elements, thereby forming the heater electrode 611. Furthermore, a mask having a desired electrode pattern may be provided, and a resistive heating element may be sprayed on the mask to form the heater electrode 611.

[0086] The order of the steps in the manufacturing method described above can be changed within the practicable range. For example, the heater electrode 611 can be formed at any time before the dielectric layer 4 is formed.

[0087] The present invention is not limited to the configuration of the above-described embodiment, and various modifications and applications are possible without departing from the technical concept of the present invention.

Claims

1. An electrostatic chuck, comprising: A substrate including a first surface having electrical insulation and a second surface which is a surface on the opposite side of the first surface, and having a through hole penetrating the first surface and the second surface; The sleeve is a bottomed cylindrical body including a side wall, an opening formed at one end of the side wall, and a bottom plate provided at the other end of the side wall, and is inserted into the through hole in such a manner that the opening is located on a side close to the second surface and the bottom plate is located on a side close to the first surface, and is configured in such a manner that a temperature sensor for measuring the temperature of the bottom plate can be installed; an adsorption electrode, formed on the first surface, comprising a conductor; a dielectric layer formed so as to cover the sleeve and the adsorption electrode, configured so as to be able to adsorb the workpiece, and containing a dielectric; and The temperature adjustment device is configured to be able to adjust the temperature of the workpiece.

2. The electrostatic chuck according to claim 1, wherein the thickness of the bottom plate is 3 mm or less.

3. The electrostatic chuck according to claim 1, wherein the sleeve further comprises a flange formed at a periphery of the base plate. The electrostatic chuck according to claim 3 , wherein a diameter of the flange is greater than or equal to 8 mm and less than or equal to 10 mm. 5 . The electrostatic chuck according to claim 1 , further comprising a filling layer formed between the bottom plate and the dielectric layer. The electrostatic chuck according to claim 5 , wherein the filling layer has a thickness of 0.1 mm or more and 0.5 mm or less. 7 . The electrostatic chuck of claim 5 , wherein the filling layer comprises the same material as the adsorption electrode.

8. The electrostatic chuck of claim 1, wherein the temperature adjustment device comprises a heater.

9. The electrostatic chuck according to claim 8, wherein the second surface has electrical insulating properties, The heater includes a heater electrode formed on the second surface and including a resistance heating element.

10. The electrostatic chuck of claim 1, wherein the temperature adjustment device comprises a cooler. The electrostatic chuck of claim 1 , wherein the temperature sensor is a contact temperature sensor.

12. The electrostatic chuck according to claim 1, wherein the thermal conductivity of the workpiece is 3.0 W / m·K or less.

13. The electrostatic chuck of claim 1, wherein the substrate comprises ceramic or glass.

14. A method for manufacturing an electrostatic chuck, comprising: a substrate preparation step of preparing a substrate including a first surface having electrical insulation and a second surface which is a surface on the opposite side of the first surface, and having a through hole penetrating the first surface and the second surface; a sleeve inserting step of inserting a sleeve into the through hole in such a manner that the opening is located on a side close to the second surface and the bottom plate is located on a side close to the first surface, the sleeve being a bottomed cylindrical body including a side wall, the opening formed at one end of the side wall and the bottom plate provided at the other end of the side wall, and being configured in such a manner that a temperature sensor for measuring the temperature of the bottom plate can be installed; an adsorption electrode forming step of forming an adsorption electrode including a conductor on the first surface; a dielectric layer forming step of forming a dielectric layer which is configured to adsorb the workpiece and contains a dielectric substance so as to cover the adsorption electrode and the sleeve; and The temperature adjustment device installation step is to install a temperature adjustment device configured to adjust the temperature of the workpiece.

15. The method for manufacturing an electrostatic chuck according to claim 14, wherein a groove is formed on the first surface, A gap is formed between the bottom plate of the sleeve inserted into the through hole and the first surface, The adsorption electrode forming process includes: A step of spraying the conductor at least in the groove and the spacing; and The step of removing unnecessary portions of the thermally-sprayed conductor, forming the adsorption electrode at the groove, and forming a filling layer at the gap.

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