Electronic package assembly and method of forming electronic package assembly
By realizing electrical connection and mold encapsulation of different conductive patterns on the substrate packaging substrate, the problems of complex and high cost of electronic packaging components manufacturing processes in the prior art are solved, and the effect of simplifying the process and reducing costs is achieved.
Patent Information
- Application Number
- CN202311425467.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-30
- Publication Date
- 2025-05-02
AI Technical Summary
The prior art requires separate manufacturing and assembly when encapsulating electronic packaging of different electronic components, resulting in complex manufacturing processes and high cost.
By providing a substrate packaging substrate, including a packaging substrate and interconnection portion with different conductive patterns, combined with flexible cable connectors and molds, simultaneous encapsulation and electrical connections of different electronic components are achieved.
The manufacturing process of electronic packaging components is simplified, manufacturing costs are reduced, and integrated electrical connections of different electronic components are realized.
Smart Images
Figure CN119920754A_ABST
Abstract
Description
Technical Field
[0001] The present application relates generally to semiconductor packaging technology, and more particularly to an electronic package assembly and a method of forming an electronic package assembly. Background Art
[0002] The semiconductor industry has been facing complex integration challenges as consumers want their electronic products to be smaller, faster, and higher performing, with more and more functions packed into a single device. In recent years, antenna packages (Antenna-in-Package; AiP) that integrate system-in-package (SiP) and antennas into one package have begun to be used in various portable multimedia devices (such as mobile phones). However, based on the different requirements of electronic components, different molding materials may be required to encapsulate various electronic components such as antennas and semiconductor chips. Therefore, electronic packages that encapsulate different electronic components need to be manufactured separately and assembled together later, which will result in more complex manufacturing processes and higher costs.
[0003] Therefore, there is a need for a method of forming an electronic package assembly with a simplified process and lower cost. Summary of the invention
[0004] An object of the present application is to provide a method for forming an electronic package assembly, which has a simplified process and lower cost.
[0005] According to one aspect of the present application, a method for forming an electronic packaging assembly is provided. The method includes: providing a base packaging substrate, wherein the base packaging substrate includes a first packaging substrate having a first group of conductive patterns, a second packaging substrate having a second group of conductive patterns, and an interconnection portion between the first packaging substrate and the second packaging substrate, wherein the first group of conductive patterns and the second group of conductive patterns are both formed on the front surface of the base packaging substrate; attaching a flexible cable connector to the front surface of the base packaging substrate, and the flexible cable connector spans the interconnection portion to electrically connect the first group of conductive patterns with the second group of conductive patterns; attaching a mold having a first cavity and a second cavity to the front surface of the base packaging substrate so that the first cavity is aligned with the first packaging substrate and the second cavity is aligned with the second packaging substrate; injecting corresponding molding materials into the first cavity and the second cavity, thereby forming a first mold cover in the first cavity and a second mold cover in the second cavity, wherein the first mold cover is isolated from the second mold cover by the interconnection portion of the base packaging substrate; and removing the interconnection portion from the base packaging substrate.
[0006] According to another aspect of the present application, an electronic packaging assembly is provided. The electronic packaging assembly includes: a first package, the first package includes: a first package substrate, the first package substrate has a first group of conductive patterns formed on the front surface of the first package substrate; and a first mold cover, the first mold cover is formed on the front surface of the first package substrate, and the first mold cover encapsulates the first group of conductive patterns; a second package, the second package is separated from the first package, the second package includes: a second package substrate, the second package substrate has a second group of conductive patterns formed on the front surface of the second package substrate; and a second mold cover, the second mold cover is formed on the front surface of the second package substrate, and the second mold cover encapsulates the second group of conductive patterns; and a flexible cable connector, the flexible cable connector includes a first end attached to the front surface of the first package substrate and encapsulated by the first mold cover, and a second end attached to the front surface of the second package substrate and encapsulated by the second mold cover, the flexible cable connector electrically connects the first group of conductive patterns with the second group of conductive patterns.
[0007] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory and do not limit the present invention. In addition, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention and, together with the description, are used to explain the principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The drawings referred to herein form part of this specification. The features shown in the drawings only illustrate some embodiments of the present application, rather than all embodiments of the present application, unless the specific implementation mode clearly indicates otherwise, and the reader of this specification should not make an inference to the contrary.
[0009] Figures 1A to 1K Various steps of a method for forming an electronic package assembly according to a first embodiment of the present application are shown.
[0010] Figures 2A to 2C Part of the steps of a method for forming an electronic package assembly according to a second embodiment of the present application is shown.
[0011] Figure 3A and 3B Part of the steps of a method for forming an electronic package assembly according to a third embodiment of the present application are shown.
[0012] The same reference numbers will be used throughout the drawings to refer to the same or like parts. DETAILED DESCRIPTION
[0013] The following detailed description of exemplary embodiments of the present application refers to the accompanying drawings that form a part of the description. The drawings illustrate specific exemplary embodiments in which the present application can be practiced. The detailed description including the drawings describes these embodiments in sufficient detail to enable a person skilled in the art to practice the present application. A person skilled in the art may further utilize other embodiments of the present application and make logical, mechanical and other changes without departing from the spirit or scope of the present application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and only the appended claims define the scope of the embodiments of the present application.
[0014] In this application, unless otherwise expressly stated, the use of the singular includes the plural. In this application, unless otherwise stated, the use of "or" means "and / or". In addition, the use of other forms of the term "comprising" is not limiting. In addition, unless otherwise specifically stated, terms such as "element" or "component" cover both elements and components that include one unit and elements and components that include more than one subunit. In addition, the section headings used herein are for organizational purposes only and should not be interpreted as limiting the subject matter described.
[0015] As used herein, for ease of description, spatially relative terms such as "under," "below," "above," "above," "up," "upper," "lower," "left," "right," "vertical," "horizontal," "side," and the like may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientations depicted in the figures, the spatially relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly. It should be understood that when an element is referred to as being "connected to" or "coupled to" another element, it may be directly connected to or coupled to the other element, or there may be intervening elements.
[0016] As mentioned above, in a conventional antenna-in-package (AiP), an electronic package with multiple built-in semiconductor chips or some other components and multiple antennas are integrated into one package or package assembly. However, due to the different requirements of these components and antennas, different molding materials are required in the electronic package. Therefore, the electronic packages encapsulating different electronic devices need to be manufactured separately and assembled together later, which will result in a more complicated manufacturing process and higher costs.
[0017] To solve this problem, a new method for forming an electronic package assembly is provided, wherein electronic packages of different electronic assemblies can be encapsulated at the same time and then attached to an external device at one time, thereby simplifying its manufacturing process and reducing manufacturing costs.
[0018] Figures 1A to 1K The various steps of the method for forming an electronic packaging assembly according to the first embodiment of the present application are shown. Figures 1A to 1K The method is described in more detail.
[0019] As can be appreciated, multiple packaging substrate units can be arranged in a packaging substrate strip, so that multiple electronic packages can be formed using the same process. In this embodiment, each of the packaging substrate units can have the same or similar structure, which can be referred to as a base packaging substrate. Figure 1A is a top view of the package substrate strip 100, and Figure 1B A base package substrate 101 is one of the base package substrates along Figure 1A A cross-sectional view of line AA′ is shown in FIG.
[0020] like Figure 1A and 1B As shown in FIG. 1 , the base package substrate 101 includes a first package substrate 111 having an embedded interconnection wire 113, a second package substrate 112 having an embedded interconnection wire 114, and an interconnection portion 115 located between the first package substrate 111 and the second package substrate 112. The first package substrate 111 further includes a first group of conductive patterns 131 formed on the front surface of the first package substrate 111, and the second package substrate 112 further includes a second group of conductive patterns 132 formed on the front surface of the second package substrate 112. Both the first group of conductive patterns 131 and the second group of conductive patterns 132 are adjacent to the interconnection portion 115 of the base package substrate 101. For example, compared with other components mounted on the front surface of the first package substrate 111, the first group of conductive patterns 131 is closer to the interconnection portion 115. In addition, compared with other electronic components also embedded in the second package substrate 112, the second group of conductive patterns 132 is closer to the interconnection portion 115. In some embodiments, the distance from the first group of conductive patterns 131 to the boundary between the first package substrate 111 and the interconnection portion 115 may be hundreds of micrometers to several millimeters. Similarly, the distance from the second group of conductive patterns 132 to the boundary between the second package substrate 112 and the interconnection portion 115 may be hundreds of micrometers to several millimeters. Figure 1A Omitted Figure 1B The structure is formed on the first packaging substrate 111 and the second packaging substrate 112.
[0021] In some embodiments, the first group of conductive patterns 131 and the second group of conductive patterns 132 may include a plurality of conductive pads (e.g., copper pads), and the first group of conductive patterns 131 and the second group of conductive patterns 132 are electrically connected to the embedded interconnection wires 113 and 114 in the first package substrate 111 and the second package substrate 112, respectively. Figure 1B Although not shown, other electronic components formed on or in the second package substrate 112 may be electrically connected to the second group of conductive patterns 132 via the interconnection wires 114. In this way, electronic components mounted on or formed in the package substrates 111 and 112 may be connected via the conductive patterns 131 and 132.
[0022] exist Figure 1A In the illustrated embodiment, each base package substrate 101 is surrounded by certain insulating regions (e.g., scribe lines) to be separated from other base package substrates 101. The plurality of units of the package substrate strip 100 (i.e., the plurality of base package substrates 101) form an array having a plurality of rows and columns. However, it is also understood that the plurality of units of the package substrate strip 100 may have various arrangements and structures according to various layouts of electronic package components.
[0023] Specifically, at least one first type electronic component 121 may be mounted on the front surface of the first package substrate 111, and the first package substrate 111 is electrically connected to the embedded interconnection wire 113. The at least one first type electronic component 121 may include various types of electronic devices, such as semiconductor chips, resistors, capacitors, or other similar devices. In some embodiments, a plurality of first type electronic components 121 may be electrically connected to the interconnection wire 113 via a plurality of solder bumps. In addition, in Figure 1B In the embodiment shown in FIG. 1 , at least one second type electronic component 122 may be mounted in the second package substrate 112, which may include one or more antennas, for example. In some other embodiments, at least one second type electronic component 122 may be mounted on the front surface of the second package substrate 112 via solder bumps.
[0024] In this embodiment, the first type electronic component 121 and the second type electronic component 122 mounted on the corresponding first packaging substrate 111 and the second packaging substrate 112 may have different requirements for encapsulation, and therefore may need to be encapsulated using different molding materials. In addition, in order to improve the subsequent installation process of the electronic packaging assembly on an external device or substrate, a flexible joint is required between the first packaging substrate 111 and the second packaging substrate 112 to replace the interconnection portion 115, and the interconnection portion 115 may be formed of the same material as the first packaging substrate 111 and the second packaging substrate 112, which is relatively rigid and inflexible. In the following, the steps of forming a flexible joint between the first packaging substrate 111 and the second packaging substrate 112 will be described in detail.
[0025] Next, a flexible cable connector 133 is attached to the front surface of the base package substrate 101 , the flexible cable connector 133 spanning the interconnection portion 115 to electrically connect the first group of conductive patterns 131 with the second group of conductive patterns 132 . Figure 1C is a top view of the packaging substrate strip 100 and the structures thereon, Figure 1D The base package substrate 101 is along Figure 1C The cross-sectional view of the line AA' shown in FIG. Figure 1C and 1D , the first end of the flexible cable connector 133 is attached to the front surface of the first packaging substrate 111, and the second end of the flexible cable connector 133 is attached to the front surface of the second packaging substrate 112. It should be noted that some or all steps in the above-mentioned process and the process to be mentioned below will be described with reference to one of the base packaging substrates 101, however, the same or similar process can be applied to other base packaging substrates 101 of the packaging substrate strip 100. For example, Figure 1C As shown, a plurality of flexible cable connections 133 are to be attached to the package substrate strip 100 , with each flexible cable connection 133 aligned with and covering one interconnect portion 115 .
[0026] Still refer to Figure 1D, the flexible cable connector 133 may have a built-in cable or wire that can electrically connect the first group of conductive patterns 131 to the second group of conductive patterns 132, and thus the first package substrate 111 and the second package substrate 112 can be electrically connected to each other to form an integrated circuit device. In some embodiments, the flexible cable connector 133 may be flexible enough to be bent into any shape according to various layouts of the electronic packaging components formed subsequently. At the same time, the flexible cable connector 133 should also provide a reliable electrical connection between the first group of conductive patterns 131 and the second group of conductive patterns 132. In some embodiments, the flexible cable connector 133 may include a cable or wire wrapped by a protective coating. The cable or wire may be formed of a metal material such as copper, and the protective coating may be formed of a polymer material such as polyimide, which has the desired flexibility and wear resistance. In some embodiments, the conductive patterns 131 and 132 may protrude from the front surfaces of the first and second packaging substrates 111 and 112, and the conductive patterns 131 and 132 are higher than the front surfaces, so that there is a gap between the flexible cable connector 133 and the front surface of the interconnection portion 115. The flexibility of the flexible cable connector 133 allows at least a portion (e.g., a middle portion thereof) of the flexible cable connector 133 to be pressed downward and pressed against the front surface of the interconnection portion 115 under external pressure, and prevents the flexible cable connector 133 from cracking or breaking. However, it is understood that in some other embodiments, the conductive patterns 131 and 132 may be flush with the front surfaces of the first and second packaging substrates 111 and 112, so that when the flexible cable connector 133 is attached to the front surface of the base packaging substrate 101, the flexible cable connector 133 may contact the interconnection portion 115. In some embodiments, the flexible cable connector 133 may be loosely attached to the front surface of the base packaging substrate 101 to avoid breaking during subsequent processing.
[0027] Then, if Figure 1E As shown in FIG. 1 , a mold 140 for molding and encapsulation is attached to the front surface of the base package substrate 101. It is understood that the base package substrate 101 can be placed on a platform (not shown). The mold 140 includes a first cavity 141 and a second cavity 142 aligned with the first package substrate 111 and the second package substrate 112, respectively. The first cavity 141 and the second cavity 142 determine the position and shape of the first mold cover and the second mold cover subsequently formed on the base package substrate 101. Figure 1EIn the embodiment shown in , the first cavity 141 can be used to accommodate the first type electronic component 121, the first group of conductive patterns 131 and the first end of the flexible cable connector 133. The second cavity 142 can be used to accommodate the second type electronic component 122, the second group of conductive patterns 132 and the second end of the flexible cable connector 133. In addition, the second type electronic component 122 may include one or more antennas, and accordingly, the second cavity 142 may include one or more steps, each of which is aligned with one of the one or more antennas. In this embodiment, the step may be a truncated pyramid. The second cavity 142 of this shape located above the antenna is conducive to the subsequent formation of a second mold cover of this shape on the surface of the second packaging substrate 112, thereby improving the transmission and reception efficiency of the antenna. In some other embodiments, the second cavity 142 located above the antenna may have various shapes, such as a trapezoidal, a rhombus, a hemispherical, a semi-elliptical or a lens shape.
[0028] In addition, when Figure 1E When viewed in the length direction shown, the first cavity 141 and the second cavity 142 are isolated from each other at the interconnection portion 115 by the mold 140. Specifically, when the mold 140 is attached to the base package substrate 101, the bottom surface of the mold 140 may contact the top surface of the flexible cable connector 133, and then the mold 140 may compress the flexible cable connector 133 toward the base package substrate 101. Due to the pressure applied by the mold 140, the central portion of the flexible cable connector 133 may be deformed and slightly moved downward to contact the top surface of the interconnection portion 115. After the mold 140 is attached to the base package substrate 101, the flexible cable connector 133 is sandwiched between the mold 140 and the interconnection portion 115, and the interconnection portion 115 may serve as a portion of the isolation structure between the first cavity 141 and the second cavity 142. As mentioned above, due to the flexibility of the flexible cable connector 133, the pressure applied by the mold 140 will not break the flexible cable connector 133, but the pressure applied by the mold 140 can optimize the isolation effect during the subsequent molding process, which will be described in detail below.
[0029] Next, corresponding molding materials are injected into the first cavity 141 and the second cavity 142, thereby forming a first mold cap in the first cavity 141 and a second mold cap in the second cavity 142. In some embodiments, the molding materials injected into the first cavity 141 and the second cavity 142 may be the same, but in some other embodiments, the molding materials injected into the first cavity 141 and the second cavity 142 may be different. After forming the first mold cap and the second mold cap, the mold 140 is removed from the base package substrate 101. Figure 1F is a top view of the package substrate strip 100 and the structures thereon, and Figure 1G The base package substrate 101 and the structure thereon are along Figure 1F A cross-sectional view of line AA' shown in FIG.
[0030] like Figure 1F and 1G As shown in , the first mold cap 151 covers the top surface of the first type electronic component 121, the first group of conductive patterns 131 and the first end of the flexible cable connector 133 to encapsulate the above structure, thereby forming a first package. In addition, the second mold cap 152 covers the top surface of the second group of conductive patterns 132 and the second end of the flexible cable connector 133, thereby encapsulating the above structure through the second mold cap 152, thereby forming a second package. In some other embodiments, at least one second type electronic component 122 can be mounted on the front surface of the second package substrate 112, so that the second mold cap 152 covers the top surface of the second group of conductive patterns 132, at least one second type electronic component 122 and the second end of the flexible cable connector 133, thereby encapsulating the above structure through the second mold cap 152.
[0031] exist Figure 1F and 1G In the illustrated embodiment, the first mold cap 151 is isolated from the second mold cap 152 by the interconnection portion 115 of the base package substrate 101 and the flexible cable connector 133. In addition, the molding material forming the first mold cap 151 is different from the molding material forming the second mold cap 152. Specifically, the first mold cap 151 is composed of an epoxy molding compound, and the second mold cap 152 is composed of an epoxy molding compound, and the dielectric constant of the epoxy molding compound of the first mold cap 151 is lower than the dielectric constant of the epoxy molding compound of the second mold cap 152. In some embodiments, the first mold cap 151 can be formed of a material such as epoxy resin, epoxy acrylate or other polymer composite materials. The first mold cap 151 can be non-conductive and can provide structural support and protect the first type electronic component 121 from external elements and contaminants in the environment. The second mold cap 152 may include a dielectric material with a high dielectric constant, such as ajinomoto composition film, prepreg material, glass, ceramic, silicon, copper clad laminate, quartz and polytetrafluoroethylene. The material of the second mold cover 152 can improve the transmission and receiving capabilities of the second type electronic component 122 covered by the second mold cover 152 . In this embodiment, the material can improve the transmission and receiving capabilities of the antenna.
[0032] In addition, if Figure 1GAs shown in , the second mold cover 152 includes one or more steps, each of which is aligned with one of the one or more antennas 122. In the present embodiment, the steps may be in the shape of a truncated pyramid. More specifically, each antenna 122 may be aligned with one of the truncated pyramid-shaped steps. In some other embodiments, the second mold cover 152 above the antenna 122 may have various shapes, such as a rhombus, a hemispherical, a semi-elliptical, or a lens shape. The shape of the second mold cover 152 may increase the transmitting and receiving areas of the corresponding antenna 122, and the shape of the second mold cover 152 may optimize the refraction, diffraction, and reflection characteristics of the radio frequency signal to improve the transmitting and receiving efficiency of the antenna 122, thereby allowing the second package to have better antenna performance.
[0033] It should be noted that the above-mentioned process is with reference to one of the base package substrates 101 in Figure 1G However, the same or similar process can be applied to other base package substrates 101 of the package substrate strip 100. Figure 1F As shown in FIG. 1 , the mold 140 may be simultaneously attached to each base packaging substrate 101 of the packaging substrate strip 100 , and then, a first mold cap 151 and a second mold cap 152 may be formed on each base packaging substrate 101 .
[0034] More specifically, the first mold cover 151 and the second mold cover 152 can be formed at the same time. Figure 1F , the mold 140 attached to the package substrate strip 100 may include a plurality of first cavities 141 and a plurality of second cavities 142 forming a column, and the column consisting of the plurality of first cavities 141 and the column consisting of the plurality of second cavities 142 are isolated from each other. When forming the first mold cap 151 and the second mold cap 152, different molding materials may be injected into the column consisting of the plurality of first cavities 141 and the column consisting of the plurality of second cavities 142, respectively, so as to simultaneously form the first mold cap 151 and the second mold cap 152 forming the column. Since the column consisting of the first cavity 141 and the column consisting of the second cavity 142 of the mold 140 are isolated from each other, the different molding materials respectively injected into the first cavity 142 and the second cavity 142 do not flow into the column consisting of adjacent cavities, thereby allowing the first mold cap 151 and the second mold cap 152 consisting of different materials to be simultaneously formed in the first cavity 141 and the second cavity 142. In this way, for each unit of the package substrate strip 100, i.e., the base package substrate, the elements and structures on the first package substrate 111 and the second package substrate 112 can be encapsulated at the same time, thereby forming a first package and a second package electrically connected to the flexible cable connector 133. Then, the first package and the second package can be mounted on an external device together without being mounted separately, which can significantly simplify the manufacturing process and save costs.
[0035] Then, if Figure 1H As shown in FIG. 1 , a plurality of solder bumps 161 may be formed on the back surface of each of the plurality of first package substrates 111. The solder bumps 161 may be used to attach the first package substrate 111 to an external device such as a printed circuit board, and the solder bumps 161 are electrically coupled to the interconnection wires 113 in the first package substrate 111, thereby also being electrically coupled to the first type electronic component 121 mounted on the first package substrate 111.
[0036] Next, the package substrate strip 100 may be cut into a plurality of monomers (ie, monomerized), each monomer corresponding to a unit of the package substrate strip 100, namely, a base package substrate 101 formed from the monomerization of the package substrate strip 100 with a structure thereon. Fig. 1I is a top view of a base package substrate 101 formed from the package substrate strip 100 with structures thereon, and Figure 1J The base package substrate 101 and the structure thereon are along Fig. 1I The cross-sectional view of the line AA' shown in FIG. Fig. 1I and 1J , singulation can be performed along the boundary of the first packaging substrate 111 or the second packaging substrate 112. After singulation, each base packaging substrate 101 includes the first packaging substrate 111 with a corresponding structure thereon, the second packaging substrate 112 with a corresponding structure thereon, and a flexible cable connection 133 electrically connecting the first packaging substrate 111 with the second packaging substrate 112. During the singulation process, the interconnection portion 115 can be removed from each of the plurality of base packaging substrates 101, thereby forming the electronic packaging assembly 180. For example, the packaging substrate strip 100 can be cut by sawing, and each base packaging substrate 101 can be cut from its back surface to its front surface at the interconnection portion 115. In this way, the interconnection portion 115 can be removed from the base packaging substrate 101, thereby separating the base packaging substrate 101 into two parts, namely, the first packaging substrate 111 and the second packaging substrate 112 connected only via the flexible cable connection 133. It should be noted that the flexible cable connector 133 connecting the first group of conductive patterns 132 and the second group of conductive patterns should not be cut during the singulation process and the removal process of the interconnection portion 115. In some embodiments, the interconnection portion 115 can be removed by at least one process selected from milling, drilling, pinching, etching, or a combination thereof. In some other embodiments, a tiny shallow groove can be formed at the boundary of the interconnection portion 115 in advance, and the interconnection portion 115 can be easily broken and separated from the base package substrate 101 along the tiny shallow groove.
[0037] Still refer to Figure 1J , more specifically, the electronic package assembly 180 may include a first package and a second package electrically connected to each other through a flexible cable connector 133. The first package further includes: a first package substrate 111 having a first group of conductive patterns 131 formed on a front surface of the first package substrate 111; at least one first type electronic component 121 mounted on the front surface of the first package substrate 111, and a first mold cover 151 formed on the front surface of the first package substrate 111 and encapsulating the first group of conductive patterns 131 and the at least one first type electronic component 121. The second package further includes: a second package substrate 112 having a second group of conductive patterns 132 formed on a front surface of the second package substrate 112, at least one second type electronic component mounted on or in the second package substrate 112, and a second mold cover 152 formed on the front surface of the second package and encapsulating the second group of conductive patterns 132 and the at least one second type electronic component 122. In addition, the first group of conductive patterns 131 and the second group of conductive patterns 132 are formed on the same side of the flexible cable connector. A first end of the flexible cable connector 133 may be attached to the front surface of the first packaging substrate 111 and encapsulated by the first mold cover 151, and a second end of the flexible cable connector 133 may be attached to the front surface of the second packaging substrate 112 and encapsulated by the second mold cover 152, thereby electrically connecting the first group of conductive patterns 131 with the second group of conductive patterns 132 to achieve electrical connection between the first package and the second package.
[0038] The electronic package assembly 180 can be mounted on an external device. Figure 1K As shown in FIG. 1 , the flexible cable connector 133 of the electronic package assembly 180 can be bent to an angle of 90° to mount the first package and the second package to two perpendicular side surfaces of an external device. In some other embodiments, the flexible cable connector 133 can be bent to any other suitable angle from 0.1° to 180° according to various layouts of the semiconductor device.
[0039] In some embodiments, the electronic package assembly 180 may be applied to any electronic device requiring flexible layout and lower process cost, such as a highly integrated portable device or the like.
[0040] exist Figures 1A to 1KIn the embodiment shown in FIG. 1 , the step of removing the interconnection portion 115 from the base package substrate 101 is performed after the step of forming the first mold cap 151 in the first cavity 141 and the step of forming the second mold cap 152 in the second cavity 142. In some other embodiments, the step of removing the interconnection portion 115 from the base package substrate 101 is performed before the step of attaching the mold 140 having the first cavity 141 and the second cavity 142 on the front surface of the base package substrate 101.
[0041] Figures 2A to 2C A portion of the steps of a method for forming an electronic package assembly according to a second embodiment of the present application is shown. It can be understood that a plurality of package substrate units can be arranged in a package substrate strip, so that a plurality of electronic package assemblies can be formed using the same process. In this embodiment, each of the package substrate units can have the same or similar structure, which can be referred to as a base package substrate. Figure 2A is a top view of the package substrate strip 200, and Figure 2B A base package substrate 201 is one of the base package substrates along Figure 2A A cross-sectional view of line BB' shown in FIG. Figure 2A and 2B As shown, each base package substrate 201 includes a first package substrate 211 having an embedded interconnection wire 213, a second package substrate 212 having an embedded interconnection wire 214, and an interconnection portion 215 located between the first package substrate 211 and the second package substrate 212. The second package substrate 212 further includes at least one second type electronic component 222 mounted in the second package substrate 212. Then, the interconnection portion 215 can be removed from the base package substrate 201 to form a plurality of openings 216 in the package substrate strip 200. However, since the plurality of units of the package substrate strip 200 have not yet been singulated from each other, the following steps can still be performed on the entire package substrate strip 200 rather than on separate units. Then, a first set of conductive patterns 231 and at least one first type electronic component 221 are formed or mounted on the front surface of each of the first package substrates 211, and a second set of conductive patterns 232 can be formed on the front surface of each of the second package substrates 212. In some other embodiments, the interconnection portion 215 may be removed from the base package substrate 201 after the first type electronic component 221, the first group of conductive patterns 231, and the second group of conductive patterns 232 are mounted or formed on the front surface of the base package substrate 201. It should be noted that for simplicity, Figure 2A Omitted Figure 2B The structure formed on the first packaging substrate 211 and the second packaging substrate 212.
[0042] Then, if Figure 2C, the flexible cable connector 233 spans the opening 216 and is attached to the front surfaces of the first package substrate 211 and the second package substrate 212 to electrically connect the first group of conductive patterns 231 with the second group of conductive patterns 232. Since the interconnection portion 215 can be removed before the step of attaching the flexible cable connector 233 that electrically connects the first group of conductive patterns 231 and the second group of conductive patterns 232, the flexible cable connector 233 will not be damaged when the interconnection portion 215 is removed. It should be noted that the following steps will be exemplarily described with reference to one of the base package substrates 201, however, the same or similar steps can be applied to other base package substrates 301 of the package substrate strip 200.
[0043] In implementation Figures 2A to 2C After the steps shown in , the method of manufacturing an electronic package assembly may include Figures 1E to 1K Similar steps shown in will not be described in detail here for simplicity. The main steps of the method include: attaching a mold having a first cavity and a second cavity to the front surface of the base packaging substrate so that the first cavity is aligned with the first packaging substrate and the second cavity is aligned with the second packaging substrate; injecting corresponding molding materials into the first cavity and the second cavity, thereby forming a first mold cover in the first cavity and a second mold cover in the second cavity, wherein the first mold cover is isolated from the second mold cover by the interconnection portion of the base packaging substrate; and forming a base packaging substrate by singulation from a packaging substrate strip with a structure thereon, thereby forming an electronic packaging assembly. Other details of the steps of the method may be similar to Figures 1E to 1K The details are documented in the steps shown in .
[0044] Figure 3A and 3B A partial step of a method for forming an electronic packaging assembly according to a third embodiment of the present application is shown. A packaging substrate strip having a plurality of units is provided. In this embodiment, each of the units may have a similar or similar structure, which may be referred to as a base packaging substrate 301 . Figure 3A 3 is a cross-sectional view of a base packaging substrate 301. It should be noted that the following process will be exemplarily described with reference to one of the base packaging substrates 301, however, the same or similar process may be applied to other base packaging substrates 301 of the packaging substrate strip.
[0045] like Figure 3AAs shown in FIG. 3 , the base package substrate 301 includes a first package substrate 311 having an embedded interconnection wire 313, a second package substrate 312 having an embedded interconnection wire 314, and an interconnection portion 315 located between the first package substrate 311 and the second package substrate 312. The first package substrate 311 further includes at least one first type electronic component 321 and a first group of conductive patterns 331 mounted or formed on the front surface of the first package substrate 311. The second package substrate 312 further includes at least one second type electronic component 322 mounted in the second package substrate 312 and a second group of conductive patterns 332 formed on the front surface of the second package substrate 312. In the present embodiment, the base package substrate 301 includes a groove located on its front surface, the groove extending across the interconnection portion 315. In some preferred embodiments, the base package substrate 301 may also include a groove extending across the interconnection portion 315 on its back surface.
[0046] like Figure 3B As shown in FIG. , a flexible cable connector 333 is attached to the front surface of the base package substrate 301, and the flexible cable connector 333 crosses the interconnection portion 315 to electrically connect the first group of conductive patterns 331 with the second group of conductive patterns 332. Next, a mold 340 having a first cavity 341 and a second cavity 342 is attached to the front surface of the base package substrate 301 so that the first cavity 341 is aligned with the first package substrate 311 and the second cavity 342 is aligned with the second package substrate 312. Since there is a groove on the front surface of the interconnection portion 315, there may be a gap between the bottom surface of the mold 340 and the top surface of the interconnection portion 315, which can be used to accommodate the middle portion of the flexible cable connector 333. In this way, when the mold 340 is attached to the front surface of the base package substrate 301, the flexible cable connector 333 is subjected to less external pressure and undergoes less deformation so as to avoid damage to the flexible cable connector 333.
[0047] In taking Figure 3A and 3B After the steps shown in , the method of manufacturing an electronic package assembly may include Figures 1F to 1KSimilar steps shown in will not be described in detail here for simplicity. The main steps of the method include: injecting corresponding molding materials into the first cavity and the second cavity to form a first mold cover in the first cavity and a second mold cover in the second cavity, wherein the first mold cover is isolated from the second mold cover by the interconnection part of the base packaging substrate; forming a base packaging substrate from a packaging substrate strip with a structure thereon by singulation. During the singulation process, the remaining part of the interconnection part can be removed from the base packaging substrate to form an electronic packaging assembly. Since there is a groove on the front surface of the interconnection part in the previous step, the step of removing the remaining part of the interconnection part from the base packaging substrate will be easier. Other details of the steps of the method may be similar to Figures 1F to 1K The details are in the steps shown in .
[0048] Although the exemplary method for forming an electronic package assembly of the present application is described in conjunction with the corresponding drawings, those skilled in the art will appreciate that modifications and adaptations may be made to the method without departing from the scope of the present invention.
[0049] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and changes may be made thereto, and additional embodiments may be implemented, without departing from the broader scope of the invention as set forth in the appended claims. In addition, other embodiments will be apparent to those skilled in the art by consideration of the specification and practice of one or more embodiments of the invention disclosed herein. Therefore, it is intended that the present application and the examples herein be considered exemplary only, with the true scope and spirit of the invention being indicated by the list of the appended exemplary claims.
Claims
1. A method for manufacturing an electronic packaging component, characterized in that: The method comprises: Providing a base package substrate, wherein the base package substrate includes a first package substrate having a first group of conductive patterns, a second package substrate having a second group of conductive patterns, and an interconnection portion between the first package substrate and the second package substrate, wherein the first group of conductive patterns and the second group of conductive patterns are both formed on a front surface of the base package substrate; attaching a flexible cable connector to the front surface of the base package substrate, with the flexible cable connector spanning the interconnection portion to electrically connect the first set of conductive patterns with the second set of conductive patterns; attaching a mold having a first cavity and a second cavity on the front surface of the base packaging substrate so that the first cavity is aligned with the first packaging substrate and the second cavity is aligned with the second packaging substrate; injecting respective molding materials into the first cavity and the second cavity to form a first mold cap in the first cavity and a second mold cap in the second cavity, wherein the first mold cap is isolated from the second mold cap by the interconnection portion of the base package substrate; and The interconnect portion is removed from the base package substrate.
2. The method according to claim 1, characterized in that A molding material forming the first mold cover is different from a molding material forming the second mold cover.
3. The method according to claim 2, characterized in that The first mold cover is composed of an epoxy molding compound, and the second mold cover is composed of an epoxy molding compound, wherein the dielectric constant of the epoxy molding compound of the first mold cover is lower than the dielectric constant of the epoxy molding compound of the second mold cover.
4. The method according to claim 1, characterized in that The process of forming a first mold cover in the first cavity and forming a second mold cover in the second cavity includes: The first mold cover and the second mold cover are formed simultaneously.
5. The method according to claim 1, characterized in that The process of forming a first mold cover in the first cavity and forming a second mold cover in the second cavity includes: The first set of conductive patterns is encapsulated with the first mold cap and the second set of conductive patterns is encapsulated with the second mold cap.
6. The method according to claim 1, characterized in that The base packaging substrate further includes at least one first type electronic component mounted on the front surface of the first packaging substrate and at least one second type electronic component mounted on the front surface of the second packaging substrate; wherein the process of forming a first mold cover in the first cavity and forming a second mold cover in the second cavity includes: The first group of conductive patterns and the at least one first-type electronic component are encapsulated by the first mold cap, and the second group of conductive patterns and the at least one second-type electronic component are encapsulated by the second mold cap.
7. The method according to claim 1, characterized in that The base packaging substrate further includes at least one first type electronic component mounted on the front surface of the first packaging substrate, and at least one second type electronic component formed in the second packaging substrate; The process of forming a first mold cover in the first cavity and forming a second mold cover in the second cavity includes: The first group of conductive patterns and the at least one first type electronic component are encapsulated by the first mold cap, and the second group of conductive patterns are encapsulated by the second mold cap.
8. The method according to claim 1, characterized in that The base package substrate includes a groove on a front surface thereof, the groove extending across the interconnection portion.
9. The method according to claim 1, characterized in that: Prior to the step of attaching a mold having a first cavity and a second cavity on the front surface of the base package substrate, a step of removing the interconnection portion from the base package substrate is performed.
10. The method according to claim 1, characterized in that The step of removing the interconnection portion from the base package substrate is performed after the steps of forming a first mold cap in the first cavity and forming a second mold cap in the second cavity.
11. The method according to claim 1, characterized in that: The first group of conductive patterns and the second group of conductive patterns are both adjacent to the interconnection portion of the base package substrate.
12. An electronic packaging assembly, characterized in that: The electronic packaging assembly comprises: A first package, the first package comprising: a first packaging substrate having a first group of conductive patterns formed on a front surface of the first packaging substrate; and a first mold cover formed on the front surface of the first packaging substrate and encapsulating the first group of conductive patterns; A second package, the second package is separated from the first package, and the second package includes: a second packaging substrate having a second group of conductive patterns formed on a front surface of the second packaging substrate; and a second mold cover formed on the front surface of the second packaging substrate and encapsulating the second group of conductive patterns; and a flexible cable connector, the flexible cable connector comprising a first end attached to the front surface of the first packaging substrate and enclosed by the first mold cover, and a second end attached to the front surface of the second packaging substrate and enclosed by the second mold cover, the flexible cable connector electrically connecting the first group of conductive patterns with the second group of conductive patterns.
13. The electronic packaging assembly according to claim 12, characterized in that: A molding material forming the first mold cover is different from a molding material forming the second mold cover.
14. The electronic packaging assembly according to claim 13, characterized in that: The first mold cover is composed of an epoxy molding compound, and the second mold cover is composed of an epoxy molding compound, wherein the dielectric constant of the epoxy molding compound of the first mold cover is lower than the dielectric constant of the epoxy molding compound of the second mold cover.
15. The electronic packaging assembly according to claim 12, characterized in that: The first group of conductive patterns and the second group of conductive patterns are formed on a same side of the flexible cable connector.
16. The electronic packaging assembly according to claim 12, characterized in that: The first package further includes at least one first type electronic component mounted on the front surface of the first package substrate, and the second package further includes at least one second type electronic component mounted on the front surface of the second package substrate; wherein the first group of conductive patterns and the at least one first type electronic component are encapsulated by the first mold cover, and the second group of conductive patterns and the at least one second type electronic component are encapsulated by the second mold cover.
17. The electronic packaging assembly according to claim 12, characterized in that: The first package further includes at least one first type electronic component mounted on the front surface of the first package substrate, and the second package further includes at least one second type electronic component formed in the second package substrate; wherein the first group of conductive patterns and the at least one first type electronic component are encapsulated by the first mold cover, and the second group of conductive patterns are encapsulated by the second mold cover.
18. The electronic packaging assembly according to claim 17, characterized in that: The at least one second type electronic component includes one or more antennas, and the second mold cover includes one or more steps, each of the one or more steps is aligned with one of the one or more antennas.