LED support die bonding method and system

Abstract

The invention relates to the field of LED support die bonding, in particular to a die bonding method and system of an LED support. After a first LED support is designed, a coordinate origin is set, a two-dimensional coordinate system is established according to size data of the first LED support, and the fitting precision of the two-dimensional coordinate system is improved by limiting the number of MARK points to be at least two, the positions of the two MARK points and the intersection point of two straight edges selected when the MARK points are selected. According to the method, the MARK point and the MARK point on the first LED bracket are identified to more accurately acquire the coordinates of each die bonding point on the first LED bracket, and during die bonding, the MARK point and the coordinates on the second die bonding bracket are identified to acquire the coordinates of each die bonding point, so that a chip can be directly fixed to the coordinates of the die bonding points on the corresponding second die bonding bracket without identifying a device area on the LED bracket for multiple times through a PR system; the problem that a current die bonder PR system is relatively long in time of identifying and positioning die bonding points of an LED support is solved.

Description

Technical Field

[0001] The invention relates to the field of LED bracket die bonding, and in particular to a LED bracket die bonding method and system. Background Art

[0002] In the current industry, die bonders generally use the PR system to identify and locate the die bonding points of the LED bracket, and then perform operations such as glue dipping, glue dispensing, die removal and die bonding. During the positioning process, the PR system needs to confirm the similarity between the PR shape of each device area and the preset PR shape for matching.

[0003] When the LED bracket has more die-bonding device areas, such as the 1608 bracket product, the PR system needs to identify the device area 936 times to confirm the exact location of the die-bonding point. Therefore, the identification time of the die-bonding point position during the die-bonding process is relatively long, resulting in relatively low die-bonding efficiency. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a method and system for bonding a LED bracket, which solves the problem that the current bonding machine PR system takes a relatively long time to identify and locate the bonding point of the LED bracket.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A method for bonding a LED bracket, the method specifically comprising the following steps:

[0007] S1, obtaining a first LED bracket to set coordinates;

[0008] S2, selecting a number of MARK points on the first LED bracket, and setting the coordinates of each die-bonding point according to the coordinates of the MARK points to obtain coordinate data;

[0009] S3, importing the coordinate data of the first LED bracket into the die bonding machine;

[0010] S4, using a die bonding machine to identify the MARK points on the second LED bracket to be die bonded to obtain coordinates of each die bonding point, and die bonding the chip to the die bonding point.

[0011] Preferably, in step S2, the following steps are specifically included:

[0012] S21, importing the first LED bracket whose coordinates are to be set on the drawing software;

[0013] S22, selecting a number of MARK points on the first LED bracket;

[0014] S23, setting a coordinate origin, and establishing a two-dimensional coordinate system according to the size data of the first LED bracket;

[0015] S24, acquiring the coordinates of each die-bonding point according to the established two-dimensional coordinate system, and respectively corresponding the coordinates of each die-bonding point to different types of chips to obtain coordinate data.

[0016] Preferably, in step S22, the number of the MARK points is at least two;

[0017] Preferably, in step S22, two MARK points among the plurality of MARK points are respectively located on two device regions on the first LED bracket that are farthest apart from each other.

[0018] Preferably, in step S22, the MARK point is located at the intersection of any two straight edges of the device area.

[0019] Preferably, in step S24, the following steps are specifically included:

[0020] S241, obtaining the coordinates of each die-bonding point according to the established two-dimensional coordinate system;

[0021] S242, classifying each solid crystal point into different attribute categories;

[0022] S243. Match different attribute categories with different types of chips to obtain coordinate data.

[0023] Preferably, in step S4, the following steps are specifically included:

[0024] S41, use the teaching mode to import coordinate data in the solder joint program of the die bonder;

[0025] S42, obtaining all MARK points on the second LED bracket to be die-bonded;

[0026] S43, acquiring the coordinates of each die-bonding point on the second LED bracket according to the coordinates of all MARK points on the second LED bracket;

[0027] S44, die-bonding chips with different properties to corresponding die-bonding points on the second LED bracket respectively.

[0028] Preferably, in step S42, the following steps are specifically included:

[0029] S421, obtaining a device region containing a MARK point through a PR system of a die bonding machine;

[0030] S422, performing shape fitting on the device regions containing the MARK points on the first LED bracket and the second LED bracket through the PR system;

[0031] S423. Acquire all MARK points on the second LED bracket according to the MARK points on the first LED bracket after shape fitting.

[0032] The technical solution also provides a system for implementing a die-bonding method for an LED bracket, the system comprising: a processor and a memory, the memory being used to store a computer program, and the computer program implementing the die-bonding method for the LED bracket when executed by the processor.

[0033] Compared with the prior art, the present invention provides a method and system for bonding LED brackets, which has the following beneficial effects:

[0034] 1. The present invention sets a coordinate origin and establishes a two-dimensional coordinate system according to the size data of the first LED bracket during the design of the first LED bracket, so that the theoretical coordinate position of each die-bonding point on the first LED bracket can be obtained. Subsequently, during die bonding, the MARK point and coordinates on the second die-bonding bracket are identified, so that the coordinates of each die-bonding point can be obtained, and the chip can be directly fixed to the corresponding die-bonding point coordinates on the second die-bonding bracket, without the need for multiple identification of the device area on the LED bracket through the PR system, which saves more time and has higher die-bonding efficiency.

[0035] 2. In order to ensure the accuracy of establishing the two-dimensional coordinate system and improve the accuracy of the coordinates of the subsequent die-bonding points, the present invention limits the number of MARK points to at least two, and the positions of the two MARK points and the intersection of two straight edges when selecting the MARK points. This can further ensure the stability of the position of the MARK points during the processing of the second LED bracket, and improve the fitting accuracy of the two-dimensional coordinate system, so as to improve the accuracy of the chip die-bonding position. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0037] Figure 1 It is a flow chart of the die bonding method of the LED bracket of the present invention;

[0038] Figure 2 It is a schematic diagram of the coordinates of the die-bonding points on the first LED bracket of the present invention;

[0039] Figure 3 A schematic diagram of a device area on a second LED bracket obtained by a die bonding machine of the present invention;

[0040] Figure 4 Schematic diagram of the MARK point of the present invention. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0042] Those skilled in the art can understand that all or part of the steps in the following embodiments can be completed by instructing the relevant hardware through a program, so the present application can be in the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application can be in the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0043] In order to solve the problem that the current die bonding machine PR system takes a relatively long time to identify and locate the die bonding point of the LED bracket, the present invention provides a die bonding method for the LED bracket, which no longer needs to determine the die bonding point by multiple comparisons to confirm the similarity between the PR shape of each device and the preset PR shape during the die bonding process, such as Figure 1 As shown, the die bonding method specifically includes the following steps:

[0044] S1. Obtain a first LED bracket to set coordinates, where the first LED bracket is a designed LED bracket drawing containing dimension data;

[0045] S2. Select several MARK points on the first LED bracket, and set the coordinates of each die-bonding point according to the coordinates of the MARK points to obtain coordinate data. When selecting the MARK points, the coordinate accuracy of each die-bonding point is related to the accuracy of the two-dimensional coordinate system obtained by fitting the several MARK points. Therefore, in order to further improve the accuracy of the two-dimensional coordinate system, thereby improving the coordinate accuracy of each die-bonding point, as shown in FIG. Figure 2 and Figure 4 As shown, in step S2, the following steps are specifically included:

[0046] S21, importing the first LED bracket whose coordinates are to be set on drawing software such as CAD;

[0047] S22. Select several MARK points on the first LED bracket. When the distance between the MARK points is closer, the error of the two-dimensional coordinate system obtained by fitting is greater. Therefore, in order to improve the accuracy of the two-dimensional coordinate system and improve the accuracy of the coordinates of each subsequent solid crystal point, when the number of MARK points is 1, if the position of the LED bracket is offset during feeding, the accuracy of the two-dimensional coordinate system will be poor. Therefore, in order to prevent the influence of the deviation during feeding of the LED bracket on the coordinates of the subsequent solid crystal points, the number of MARK points is at least two. At the same time, in order to make the two-dimensional coordinate system more accurate, two of the several MARK points are respectively located on the two device areas with the farthest distance between them on the first LED bracket. In the production and processing of the LED bracket, errors may occur. Therefore, the position of the selected MARK point needs to be not prone to deviation during the production process. According to the characteristics of the stamping die, the selected MARK point is located at the intersection of any two straight edges of the device area, such as Figure 4 As shown, this point is the intersection of two straight edges, and the shape is more regular. The shape and size accuracy here will be higher during the punching process. Therefore, the accuracy of the coordinates of this point in the stamping process is relatively high, and it is more suitable for the subsequent establishment of a two-dimensional coordinate system.

[0048] S23, setting the coordinate origin, for example, setting one of the MARK points as the coordinate origin, and obtaining the coordinates of each MARK point according to the size data of the first LED bracket, thereby achieving the purpose of fitting and establishing a two-dimensional coordinate system according to the size data of the first LED bracket;

[0049] S24, according to the established two-dimensional coordinate system, the coordinates of each bonding point are obtained, and the coordinates of each bonding point are respectively matched with different types of chips to obtain coordinate data. Some first LED brackets may need to be provided with chips of different specifications, so it is necessary to classify the coordinates of each bonding point so that different chips are bonded to corresponding bonding points. In step S24, the following steps are specifically included:

[0050] S241, obtaining the coordinates of each die-bonding point according to the established two-dimensional coordinate system;

[0051] S242, classifying each solid crystal point into different attribute categories;

[0052] S243. Match different attribute categories with different types of chips to obtain coordinate data.

[0053] S3, importing the coordinate data of the first LED bracket into the die bonding program system of the die bonding machine;

[0054] S4, the die bonding machine identifies the MARK points on the second LED bracket to be bonded to obtain the coordinates of each die bonding point, and bonds the chip to the die bonding point. The implementation of die bonding depends on the operation process of the die bonding machine. The specific process of die bonding is described in detail below. Figure 3 As shown, in step S4, the following steps are specifically included:

[0055] S41, use the teaching mode to import coordinate data in the solder joint program of the die bonder;

[0056] S42, obtaining all the MARK points on the second LED bracket to be bonded. The acquisition method can be manually selecting all the MARK points on the bonding machine program interface with the second LED bracket photographed, but this method is time-consuming. In order to increase the acquisition speed of the MARK points and improve the degree of automation without manual operation, step S42 specifically includes the following steps:

[0057] S421, obtaining a device region containing a MARK point through a PR system of a die bonding machine;

[0058] S422, performing shape fitting on the device regions containing the MARK points on the first LED bracket and the second LED bracket through the PR system. Generally, when the similarity of the fitting reaches 75% or more, it indicates that the fitting is completed;

[0059] S423. Acquire all the MARK points on the second LED bracket according to the MARK points on the first LED bracket after shape fitting, that is, mark the position points on the second LED bracket corresponding to the MARK points on the first LED bracket as MARK points.

[0060] S43, obtaining the coordinates of each die-bonding point on the second LED bracket according to the coordinates of all the MARK points on the second LED bracket, and after obtaining the coordinates of all the MARK points on the second LED bracket, a two-dimensional coordinate system can be established and the coordinates of each die-bonding point on the second LED bracket can be obtained;

[0061] S44, according to the coordinates of each die-bonding point on the second LED bracket, die-bond the chips with different properties to the corresponding die-bonding points on the second LED bracket respectively.

[0062] When the present invention is implemented, the coordinate origin is first set during the design of the first LED bracket and a two-dimensional coordinate system is established according to the size data of the first LED bracket, so that the theoretical coordinate position of each die-bonding point on the first LED bracket can be obtained. Subsequently, during die bonding, the MARK point and coordinates on the second die-bonding bracket are identified, so that the coordinates of each die-bonding point can be obtained, and the chip can be directly fixed to the corresponding die-bonding point coordinates on the second die-bonding bracket, without the need for multiple identification of the device area on the LED bracket through the PR system, which saves more time and has higher die-bonding efficiency.

[0063] Corresponding to the crystal bonding method of the LED bracket provided in the above-mentioned embodiment, the present embodiment also provides a system for implementing the crystal bonding method of the LED bracket. Since the crystal bonding system of the LED bracket provided in the present embodiment corresponds to the crystal bonding method of the LED bracket provided in the above-mentioned embodiment, the implementation method of the crystal bonding method of the aforementioned LED bracket is also applicable to the crystal bonding system of the LED bracket provided in the present embodiment, and will not be described in detail in the present embodiment.

[0064] The system comprises a processor and a memory, wherein the memory is used to store a computer program, and when the computer program is executed by the processor, a die-bonding method of an LED bracket is implemented.

[0065] The above implementation methods have been described in detail. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A method for bonding a LED bracket, characterized in that: The die bonding method specifically comprises the following steps: S1, obtaining a first LED bracket to set coordinates; S2, selecting a number of MARK points on the first LED bracket, and setting the coordinates of each die-bonding point according to the coordinates of the MARK points to obtain coordinate data; S3, importing the coordinate data of the first LED bracket into the die bonding machine; S4, using a die bonding machine to identify the MARK points on the second LED bracket to be die bonded to obtain coordinates of each die bonding point, and die bonding the chip to the die bonding point.

2. The LED bracket die bonding method according to claim 1, characterized in that: In step S2, the following steps are specifically included: S21, importing the first LED bracket whose coordinates are to be set on the drawing software; S22, selecting a number of MARK points on the first LED bracket; S23, setting a coordinate origin, and establishing a two-dimensional coordinate system according to the size data of the first LED bracket; S24, acquiring the coordinates of each die-bonding point according to the established two-dimensional coordinate system, and respectively corresponding the coordinates of each die-bonding point to different types of chips to obtain coordinate data.

3. The LED bracket die bonding method according to claim 2, characterized in that: In step S22, the number of the MARK points is at least two.

4. The LED bracket die bonding method according to claim 2, characterized in that: In step S22, two MARK points among the plurality of MARK points are respectively located on two device regions on the first LED bracket that are farthest apart from each other.

5. The LED bracket die bonding method according to claim 2, characterized in that: In step S22, the MARK point is located at the intersection of any two straight edges of the device area.

6. The LED bracket die bonding method according to claim 2, characterized in that: In step S24, the following steps are specifically included: S241, obtaining the coordinates of each die-bonding point according to the established two-dimensional coordinate system; S242, classifying each solid crystal point into different attribute categories; S243. Match different attribute categories with different types of chips to obtain coordinate data.

7. The LED bracket die bonding method according to claim 1, characterized in that: In step S4, the following steps are specifically included: S41, use the teaching mode to import coordinate data in the solder joint program of the die bonder; S42, obtaining all MARK points on the second LED bracket to be die-bonded; S43, acquiring the coordinates of each die-bonding point on the second LED bracket according to the coordinates of all MARK points on the second LED bracket; S44, die-bonding chips with different properties to corresponding die-bonding points on the second LED bracket respectively.

8. The LED bracket die bonding method according to claim 7, characterized in that: In step S42, the following steps are specifically included: S421, obtaining a device region containing a MARK point through a PR system of a die bonding machine; S422, performing shape fitting on the device regions containing the MARK points on the first LED bracket and the second LED bracket through the PR system; S423. Acquire all MARK points on the second LED bracket according to the MARK points on the first LED bracket after shape fitting.

9. A die bonding method for implementing the LED bracket according to any one of claims 1 to 8, characterized in that: It comprises a processor and a memory, wherein the memory is used to store a computer program, and when the computer program is executed by the processor, the die bonding method of the LED bracket according to any one of claims 1 to 8 is implemented.

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