Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus capable of applying a uniform load to an object to be pressurized. A substrate processing apparatus (1) is provided with: a base (180) that receives a load; and an upper jig plate (70) provided with a heat source (170). And a pressurizing plate (80) that is attached to the upper jig plate (70) and pressurizes an object to be pressurized. And a support section (60) that is interposed between the base section (180) and the upper jig plate (70) and that supports the upper jig plate (70) with respect to the base section (180). The support part (60) has a support body (61) made of a ceramic material and an air layer (62) around the support body (61).

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus for processing a substrate provided with a plurality of elements. Background Art

[0002] As an apparatus for forming an element array composed of a plurality of elements on a substrate, there is a substrate processing apparatus. For example, the substrate processing apparatus described in Patent Document 1 includes: a pressurizing unit for pressurizing a plurality of elements temporarily fixed to a substrate to formally fix them; and a heating means for heating the substrate, etc., when pressurizing by the pressurizing unit.

[0003] In recent years, as components have become increasingly miniaturized, an array of components consisting of components with a size (height) of several μm is sometimes formed on a substrate. In order to uniformly form such fine components on a substrate, it is necessary to make the load applied to multiple components uniform. Therefore, the flatness of the pressurized surface or the parallelism between the pressurized surface and the substrate is required to be at the 1 μm level.

[0004] However, when the pressurizing unit is pressurized, if the substrate or the like is heated by the heating method, the influence of the heat may affect the fixture constituting the pressurizing unit, and the fixture may be deformed. As a result, the flatness of the pressurizing surface or the parallelism between the pressurizing surface and the substrate is reduced, and the bonding state of multiple elements bonded to the substrate may deviate. Therefore, as a countermeasure for preventing heat transfer from the heating method to the pressurizing unit, it can be considered to provide a heat insulating material in the pressurizing unit or the like.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2010-232234 Summary of the invention

[0008] Problems to be solved by the invention

[0009] However, if the heat insulating material is placed in the pressurizing unit, the heat insulating material and / or the pressurizing unit may be deformed due to the difference in thermal expansion coefficient between the heat insulating material and the pressurizing unit (e.g., a plate that pressurizes the element). Therefore, in order to avoid such an undesirable situation, the inventors of the present invention have found that a glass fiber material with low thermal conductivity is used as the material of the heat insulating material, but it has been found that the following undesirable situation may occur.

[0010] That is, glass fiber-based materials have high hygroscopicity and are easily affected by creep. Therefore, the thermal insulation material composed of glass fiber-based materials has the disadvantage of being easily deformed by hygroscopicity and creep. If the influence of the deformation of the thermal insulation material spreads to the pressurizing unit (for example, a plate that presses the element), the flatness of the pressurizing surface or the parallelism between the pressurizing surface and the substrate is reduced, and the bonding state of multiple elements bonded to the substrate may deviate.

[0011] The present disclosure has been made in view of such actual conditions, and an object of the present disclosure is to provide a substrate processing apparatus capable of applying a uniform load to a pressurized object.

[0012] Means used to solve problems

[0013] In order to achieve the above-mentioned object, a substrate processing device according to a first aspect of the present disclosure comprises:

[0014] The base that bears the load; and

[0015] an upper fixture plate provided with a heat source; and

[0016] a pressurizing plate mounted on the upper fixture plate to pressurize the pressurized object; and

[0017] a supporting portion interposed between the base and the upper fixture plate and supporting the upper fixture plate relative to the base,

[0018] The support portion includes a support body made of a ceramic material and an air layer around the support body.

[0019] The substrate processing device disclosed in the present invention has a support portion, which is interposed between the base and the upper clamp plate, and supports the upper clamp plate relative to the base. In addition, the support portion has a support body formed of a ceramic material and an air layer around the support body. The ceramic material has low hygroscopicity and is not easily affected by creep. Therefore, deformation of the support body caused by moisture absorption and creep can be prevented. As a result, the flatness of the pressurized surface or the parallelism between the pressurized surface and the substrate can be prevented from being reduced, and a uniform load can be applied to the pressurized object.

[0020] In addition, ceramic materials generally have the property of being prone to cracking or breaking when subjected to eccentric loads or concentrated loads. In this regard, in the substrate processing device disclosed in the present invention, an air layer is formed around the support body in such a way that the support body does not support the entire surface of the upper clamping plate. As a result, the contact area between the support body and the upper clamping plate can be reduced, and cracking or breakage of the support body due to the difference in thermal expansion coefficients between the two can be prevented. Therefore, in this regard, it is also possible to prevent the flatness of the pressurized surface or the parallelism between the pressurized surface and the substrate from being reduced, and a uniform load can be applied to the pressurized object.

[0021] In addition, the upper fixture plate provided with a heat source is not directly fixed to the base, but is fixed to the base via a support. Furthermore, the support body and the air layer play a role as a heat insulating material. Therefore, it is possible to prevent the heat of the upper fixture plate (heat source) from being transferred to the base, and maintain the uniformity of the temperature distribution of the pressurized surface. In addition, the deformation of the base can be prevented, and the deformation of the upper fixture plate accompanying this can be prevented. Therefore, at this point, it is also possible to prevent the flatness of the pressurized surface or the reduction of the parallelism between the pressurized surface and the substrate, and to apply a uniform load to the pressurized object.

[0022] The support may be made of ceramic or glass. In addition to ceramic, when the support is made of glass, the above-mentioned effects can also be obtained.

[0023] Alternatively, the support body may have a columnar shape. In this case, the support body is unlikely to crack or break. In addition, the support body can ensure a gap between the base and the upper fixture plate, and the heat of the upper fixture plate is unlikely to be transferred to the base.

[0024] Alternatively, the support body includes a plurality of support bodies, and the plurality of support bodies are arranged in a matrix. In this case, the upper fixture plate is partially supported by each support body at the location where each support body is set. Therefore, the contact area between each support body and the upper fixture plate can be reduced, and cracks or damages in each support body due to the difference in thermal expansion coefficients between the two can be prevented. In addition, the load applied to the support portion can be dispersed by a plurality of support bodies, and cracks or damages in each support body due to eccentric loads can be prevented.

[0025] Alternatively, the support body has a first support body disposed at a central portion of the base or the upper fixture plate, and the first support body is connected to the base and the upper fixture plate via a connecting member. In this case, the first support body is fixed to the base and the upper fixture plate via a connecting member. Therefore, the first support body is difficult to deviate in the vertical direction and / or the horizontal direction, and the flatness of the pressurized surface or the parallelism between the pressurized surface and the substrate can be prevented from being reduced.

[0026] Alternatively, a first shaft penetrating the first support body along the axial direction of the first support body may be fixed to the first support body, one end of the first shaft in the axial direction is connected to the base, and the other end of the first shaft in the axial direction is connected to the upper fixture plate. By connecting the first support body to the base and the upper fixture plate via the first shaft, the connection strength between them can be improved.

[0027] Alternatively, a buffer material may be provided at one end of the first axis in the axial direction. In this case, when the first support body is thermally expanded, the first support body is not hindered by the base, for example, by deformation of the buffer material, and can be thermally expanded freely. Therefore, the stress applied to the first support body is reduced, and cracks or damages in the first support body can be prevented.

[0028] The support body has a second support body arranged around the first support body, and the second support body is connected to the base, and on the other hand, is not connected to the upper clamp plate but abuts against the upper clamp plate. In this case, when the second support body expands thermally, the second support body is not hindered by the upper clamp plate and can freely expand thermally toward the upper clamp plate side. Therefore, the stress applied to the second support body is reduced, and cracks or damages can be prevented from occurring in the second support body.

[0029] The support body includes a first support body disposed at the central portion of the base or the upper fixture plate, and a bracket disposed along the outer periphery of the first support body may be fixed to the first support body in a manner of surrounding the first support body. In this case, the bracket can prevent the first support body from being displaced in the horizontal direction and the first support body or the upper fixture plate from rotating.

[0030] In order to achieve the above-mentioned object, a substrate processing device according to a second aspect of the present disclosure comprises:

[0031] The base that bears the load; and

[0032] an upper fixture plate provided with a heat source; and

[0033] a pressurizing plate mounted on the upper fixture plate to pressurize the pressurized object; and

[0034] a support portion interposed between the base and the upper fixture plate and supporting the upper fixture plate relative to the base; and

[0035] A holding portion holds the upper fixture plate so as to be displaceable relative to the base portion.

[0036] The substrate processing device disclosed in the present invention has a supporting portion, which is interposed between the base and the upper clamp plate, and supports the upper clamp plate relative to the base. Therefore, the upper clamp plate provided with a heat source is not directly fixed to the base, but is fixed to the base via the supporting portion. Thereby, it is possible to prevent the heat of the upper clamp plate (heat source) from being transferred to the base, and maintain the uniformity of the temperature distribution of the pressurized surface. In addition, it is possible to prevent the deformation of the base, and the deformation of the upper clamp plate accompanying this can be prevented. Therefore, it is possible to prevent the flatness of the pressurized surface or the reduction of the parallelism between the pressurized surface and the substrate, and to apply a uniform load to the pressurized object.

[0037] In addition, the substrate processing device disclosed in the present invention has a holding portion that holds the upper fixture plate so as to be displaceable relative to the base. Therefore, the holding portion can displace the upper fixture plate relative to the base according to the thermal expansion of the upper fixture plate and the like. As a result, the upper fixture plate is not hindered by the holding portion and can freely undergo thermal expansion. As a result, deformation associated with the inhomogeneous thermal expansion of the upper fixture plate can be prevented. Therefore, at this point, it is also possible to prevent a decrease in the flatness of the pressurized surface or the parallelism between the pressurized surface and the substrate, and to apply a uniform load to the pressurized object. In addition, by allowing the upper fixture plate to freely undergo thermal expansion, the stress applied to the support portion is reduced, and cracks or breakages in the support portion can be prevented.

[0038] Alternatively, the holding portion may include an elastic body, and the upper fixture plate may be suspended by the elastic force of the elastic body. In this case, the holding portion may freely displace the upper fixture plate relative to the base according to the thermal expansion of the upper fixture plate and the like by the elastic force of the elastic body.

[0039] Alternatively, the holding portion includes: a main body that holds the upper fixture plate; a second shaft, one end of which is fixed to the base to hold the main body slidable; and an elastic body that is fixed to the second shaft to apply force to the base by elastic force. In this case, the main body holding the upper fixture plate can be applied to the base and fixed to the base by the force of the elastic body. In addition, the main body can slide along the second shaft according to the thermal expansion of the upper fixture plate and the like. Thus, the main body can hold the upper fixture plate so that it can be displaced relative to the base.

[0040] The elastic force of the elastic body may be balanced with the deadweight of the object to be held by the holding portion. In this case, it is possible to prevent the thermal expansion of the upper fixture plate and the like from being hindered by the elastic force of the elastic body.

[0041] Alternatively, the second shaft may include a plurality of the second shafts, the elastic body may include a plurality of the elastic bodies fixed to the plurality of the second shafts, and the plurality of the elastic bodies may use elastic force to cause the main body to apply force to the base. In this case, the elastic force of the plurality of elastic bodies may increase the lifting force of the main body on the upper fixture plate. Therefore, the tilting of the upper fixture plate may be prevented, thereby preventing the reduction of the parallelism between the pressurized surface and the substrate.

[0042] The elastic body is a coil-shaped spring, and the second shaft may penetrate (insert) the inside of the elastic body. In this case, the elastic body can urge the main body toward the base by the restoring force of the spring.

[0043] The holding portion includes a plurality of holding portions, and the plurality of holding portions may also hold the outer edge of the upper fixture plate. By holding the outer edge of the upper fixture plate by the holding portion, displacement of the upper fixture plate relative to the base portion can be prevented from being hindered by the holding portion.

[0044] A heat insulating material may also be provided between the holding portion and the upper clamp plate. In addition, the holding portion and the upper clamp plate may clamp the heat insulating material without contacting each other. In this case, it is possible to prevent the heat of the upper clamp plate from being transferred to the holding portion, thereby maintaining the uniformity of the temperature distribution of the pressurized surface. In addition, it is possible to prevent the deformation of the holding portion, and the deformation of the upper clamp plate accompanying this can be prevented. Therefore, it is possible to prevent the flatness of the pressurized surface or the parallelism between the pressurized surface and the substrate from being reduced, and a uniform load can be applied to the pressurized object. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1A It is a perspective view of the substrate processing apparatus according to the first embodiment.

[0046] Figure 1B yes Figure 1A A side view of a substrate processing apparatus shown.

[0047] Figure 2 This is a top view of a substrate that is to be pressurized by the substrate processing apparatus.

[0048] Figure 3A yes Figure 1A 3D is a perspective view of a substrate pressing portion (upper clamp portion) of a substrate processing apparatus shown in FIG.

[0049] Figure 3B is from Figure 3A A perspective view of the upper clamp portion shown with the cover removed.

[0050] Figure 4 yes Figure 3B A top view of the support portion and upper fixture plate is shown.

[0051] Figure 5 It is along Figure 3B A cross-sectional view of the XZ plane of the base plate, the setting portion, the support portion, and the upper fixture plate shown.

[0052] Figure 6 yes Figure 3B A top view of the support portion and upper fixture plate is shown.

[0053] Figure 7 Observed from the X-axis direction Figure 3B A side view of the upper clamp portion is shown.

[0054] Figure 8 Observed from the Y-axis direction Figure 3B A side view of the upper clamp portion is shown.

[0055] Fig. 9 It is along Figure 8 An enlarged cross-sectional view of the holding portion taken along the XZ plane is shown.

[0056] Fig. 10A This is a diagram showing the distribution of the load applied to the pressure-sensitive paper when the pressure-sensitive paper is pressed by an upper clamp part without a support part in a non-heating atmosphere.

[0057] Fig. 10B This is a diagram showing the distribution of the load applied to the pressure-sensitive paper when the pressure-sensitive paper is pressed by the upper jig part having the support part in a non-heating atmosphere.

[0058] Fig.11A This is a diagram showing the distribution of the load applied to the pressure-sensitive paper when the pressure-sensitive paper is pressed by an upper clamp part without a support part in a heated atmosphere.

[0059] Fig. 11B This is a diagram showing the distribution of the load applied to the pressure-sensitive paper when the pressure-sensitive paper is pressed by the upper jig part including the support part in a heated atmosphere.

[0060] Fig. 12A It is a top view of a support portion of a substrate processing apparatus according to a second embodiment.

[0061] Fig. 12B It is a plan view of a support portion of a substrate processing apparatus according to a third embodiment.

[0062] Fig. 12C It is a plan view of a support portion of a substrate processing apparatus according to a fourth embodiment.

[0063] Fig.12D It is a plan view of a support portion of a substrate processing apparatus according to a fifth embodiment.

[0064] Fig.12E It is a plan view of a support portion of a substrate processing apparatus according to a sixth embodiment.

[0065] Fig.12F It is a plan view of a support portion of a substrate processing apparatus according to a seventh embodiment. DETAILED DESCRIPTION

[0066] The embodiments of the present disclosure are described using the accompanying drawings. The drawings are described as needed, but the contents of the drawings are only schematically and exemplarily shown for the purpose of understanding the present disclosure, and the appearance or dimensional ratio may be different from the actual object. The present disclosure is described in detail below based on the embodiments, but is not limited to these embodiments.

[0067] First embodiment

[0068] Figure 1A The substrate processing apparatus 1 of the first embodiment shown in the figure is used to form an element array 4 ( Figure 2 ) device. The substrate processing device 1 has a substrate pressing unit 30. The substrate processing device 1 may also include a stage 10 and a load generating unit 20. The substrate processing device 1 is used to temporarily fix a plurality of elements 4a, 4b, 4c ( Figure 2 ) is pressurized and the pressurizing device that is formally fixed functions.

[0069] Figure 2 The material of the substrate 2 shown is not particularly limited, and is, for example, a glass epoxy material. The substrate 2 may also be made of glass such as SiO2 or Al2O3. Alternatively, the substrate 2 may be made of an elastomer such as polyimide, polyamide, polypropylene, polyetheretherketone, polyurethane, silicone, polyethylene terephthalate, polyethylene naphthalate, glass wool, etc. In this case, the substrate 2 can function as a flexible substrate.

[0070] On the surface of the substrate 2, for example, a conductive bonding material (not shown) is formed. The conductive bonding material may also have the property of curing by heating, and the substrate 2 and the components 4a, 4b, 4c are electrically and mechanically connected by anisotropic conductive particle connection or bump crimping connection. As such a conductive bonding material, for example, ACF, ACP, NCF or NCP can be cited. The thickness of the conductive bonding material is preferably 1.0 to 10000 μm.

[0071] Wiring is formed in a predetermined pattern on the substrate 2 , and the electrodes of the elements 4 a , 4 b , and 4 c can be connected to the wiring via a conductive bonding material.

[0072] The elements 4a, 4b, 4c are arranged in an array on the substrate 2. The array means that the elements 4a, 4b, 4c are arranged in a plurality of rows and columns according to a determined pattern. In addition, the spacing in the row direction and the column direction may be the same or different. In addition, in this embodiment, "equal" or "same" is not limited to strictly equal or identical situations, and an error within ±10% is allowed between the comparison objects.

[0073] The elements 4a, 4b, and 4c are arranged on a display substrate for a display as pixels of RGB, for example. Alternatively, the elements 4a, 4b, and 4c are arranged on a lighting substrate as light emitters of a backlight. The element 4a is a red light element, the element 4b is a green light element, and the element 4c is a blue light element. However, the elements arranged on the substrate 2 are not limited to these elements.

[0074] The elements 4a, 4b, and 4c are, for example, micro light-emitting elements (micro LED elements). The size (width×depth) of the elements 4a, 4b, and 4c is not particularly limited, and is, for example, 5 μm×5 μm to 50 μm×50 μm. In addition, the thickness (height) of the elements 4a to 4c is not particularly limited, and is, for example, less than 50 μm.

[0075] like Figure 1A As shown, the substrate processing apparatus 1 includes a stage 10, a load generating unit 20, and a substrate pressurizing unit 30. In the accompanying drawings, the X-axis is an axis along the long side of a rectangle which is the shape of the stage 10 when viewed from above. The Y-axis is an axis along the short side of a rectangle which is the shape of the stage 10 when viewed from above. The Z-axis is an axis perpendicular to the X-axis and the Y-axis. Hereinafter, the positive direction side of the Z-axis will be referred to as "above", and the negative direction side of the Z-axis will be referred to as "below". In addition, with respect to each of the X-axis, the Y-axis, and the Z-axis, the direction toward the center of the substrate processing apparatus 1 will be referred to as "inside", and the direction away from the center of the substrate processing apparatus 1 will be referred to as "outside".

[0076] The stand 10 is formed of, for example, a metal frame. The stand 10 includes a stand upper portion 11, a movable pressurizing portion 12, a stand lower portion 13, a guide bushing 14, and a guide shaft 15. The stand lower portion 13 constitutes a base portion of the stand 10. A hollow portion is formed inside the stand lower portion 13, but the shape of the stand lower portion 13 is not particularly limited.

[0077] The lower ends of four guide shafts 15 are fixed to the four corners of the platform lower portion 13. The guide shafts 15 are arranged in a state of being upright in the Z-axis direction. The lower ends of the guide shafts 15 are fixed to the platform lower portion 13, and the upper ends of the guide shafts 15 are fixed to the platform upper portion 11. The guide shafts 15 penetrate the movable pressurizing portion 12. The guide shafts 15 play a role in supporting the platform upper portion 11, and play a role in supporting the movable pressurizing portion 12 to be able to slide up and down.

[0078] The movable pressurizing unit 12 is composed of a rectangular plate (rigid body) and is located between the platform lower portion 13 and the platform upper portion 11. The movable pressurizing unit 12 is configured to be vertically slidable along the four guide shafts 15 by receiving a load from the load generating unit 20.

[0079] Four through holes 12a are formed at the four corners of the movable pressurizing part 12. Four guide bushings 14 are fixed to the four through holes 12a. Four guide shafts 15 are inserted into the four guide bushings 14. The guide bushings 14 have the function of making the movable pressurizing part 12 slide well (reducing the friction with respect to the guide shaft 15) when the movable pressurizing part 12 moves in the up-down direction. In addition, the guide bushings 14 have the function of positioning the guide shaft 15 with respect to the axis of the through hole 12a.

[0080] The platform upper portion 11 constitutes the top plate portion of the platform 10. The upper ends of four guide shafts 15 are fixed to the four corners of the platform upper portion 11. The load generating portion 20 is fixed to the central portion of the platform upper portion 11. The load generating portion 20 is composed of a device such as a pressurizing cylinder, a servo press, a motor, or an actuator, and plays a role in applying a load to the movable pressurizing portion 12. In order to prevent the drawings from becoming complicated, the detailed structure of the movable pressurizing portion 12 is omitted from the illustration, and only a part of the structure is shown.

[0081] The load generating unit 20 applies a load to the movable pressurizing unit 12 by applying a pressure to the center of the upper surface of the movable pressurizing unit 12 using a pressure head (not shown). The load application direction of the load generating unit 20 is the Z-axis direction. As a result, the substrate pressurizing unit 30 (upper clamp unit 31) can be moved downward together with the movable pressurizing unit 12.

[0082] like Figure 1B As shown, the substrate pressing part 30 includes an upper clamp part 31 provided on the movable pressing part 12 and a lower clamp part 32 provided on the stage lower part 13. The lower clamp part 32 includes a lower clamp plate 130. The lower clamp part 32 may also include a base 140, a stage 150 and a cover 160.

[0083] The stage 150 is formed of a flat plate (rigid body) and is provided on the upper surface of the stage lower portion 13. The surface accuracy (flatness or smoothness, etc.) of the stage 150 may be higher than that of the upper surface of the stage lower portion 13.

[0084] The lower fixture plate 130 is composed of a flat plate body (rigid body) and is disposed on the upper surface of the stage 150. The material constituting the lower fixture plate 130 is not particularly limited, and is a metal such as SUS, iron or nickel. The thickness of the lower fixture plate 130 in the Z-axis direction is thicker than the thickness of the stage 150 in the Z-axis direction.

[0085] The installation base 140 is composed of a flat plate body (rigid body) and is installed on the upper surface of the lower fixture plate 130. The substrate 2 ( Figure 2 ). By arranging the base 140 between the lower fixture plate 130 and the substrate 2, when the lower fixture plate 130 is deformed (thermal expansion), its influence is unlikely to affect the substrate 2. Therefore, when the substrate 2 is pressurized by the upper fixture portion 31 (pressurizing plate 80 described later), the pressurizing plate 80 and the substrate 2 are easily parallel to each other, and the substrate 2 ( Figure 2 The multiple elements 4a, 4b, 4c) shown apply the load evenly.

[0086] The surface accuracy (flatness or smoothness, etc.) of the substrate 140 may also be higher than the surface accuracy of the lower fixture plate 130. For example, the upper surface of the substrate 140 may have fewer bumps and less inclination relative to the horizontal plane than the upper surface of the lower fixture plate 130. The surface roughness Ra of the surface (especially the upper surface) of the substrate 140 is not particularly limited, and may be Ra≤1μm. In this case, when the substrate 2 is set on the substrate 140, the substrate 2 can be prevented from tilting relative to the horizontal plane.

[0087] The area of ​​the base 140 may be smaller than that of the lower fixture plate 130 and smaller than that of the base plate 2 ( Figure 2 The thickness of the base 140 in the Z-axis direction may also be smaller than the thickness of the lower fixture plate 130 in the Z-axis direction.

[0088] The substrate 140 may also be made of a material having a lower thermal expansion coefficient than the material constituting the lower fixture plate 130. The substrate 140 may also be made of, for example, ceramic or glass. The glass constituting the substrate 140 is not particularly limited, and may be Neoceram (registered trademark) or quartz glass, etc. The ceramic constituting the substrate 140 may also be silicon carbide, silicon nitride, aluminum nitride, or aluminum oxide, etc. In addition to the above-mentioned materials, various inorganic solid materials having a lower thermal expansion than the lower fixture plate 130 may also be used.

[0089] By forming the setting base 140 from such a material, it is possible to prevent deformation (thermal expansion) of the setting base 140. Therefore, it is possible to prevent deformation of the setting base 140 from affecting the substrate 2 ( Figure 2 ) is affected. In addition, ceramics or glass are easier to ensure the surface accuracy (flatness or smoothness, etc.) than metals etc. constituting the lower fixture plate 130. Therefore, by constituting the setting base 140 with the above materials, the surface accuracy of the setting base 140 can be ensured.

[0090] A plurality of fixing portions 120 are provided on the upper surface of the lower fixture plate 130 so as to abut against the edge of the setting base 140. The fixing portions 120 position and fix (or temporarily fix) the setting base 140 at a predetermined position of the lower fixture plate 130. The plurality of fixing portions 120 abut against at least a portion of the edge of the setting base 140. The plurality of fixing portions 120 may also be provided corresponding to the sides of the rectangle formed by the setting base 140. In addition, the number of the fixing portions 120 is not particularly limited, and may be, for example, 1 to 3 or 5 or more.

[0091] The cover 160 is attached to the lower fixture plate 130, for example. The cover 160 is used to protect the lower fixture plate 130 from external forces, etc. The cover 160 may be attached to the lower fixture plate 130 so as to cover the side of the lower fixture plate 130 in the Y-axis direction.

[0092] like Figure 3A and Figure 3B As shown, the upper fixture part 31 includes a support part 60, an upper fixture plate 70, a pressurizing plate 80, and a holding part 90. The upper fixture part 31 may also include only one of the support part 60 and the holding part 90. The upper fixture part 31 may also include a base plate 40, a setting part 50, a heat insulating material 110, a fixing part 120, and a cover 160.

[0093] The base plate 40 is provided on the movable pressurizing portion 12 ( Figure 1A ) on the lower surface. The base plate 40 may also be composed of a flat plate body (rigid body). In addition, the base plate 40 may also be provided with a cooling mechanism (not shown).

[0094] The installation portion 50 is provided, for example, on the lower surface of the base plate 40. The installation portion 50 may also be formed of a flat plate body (rigid body). The area of ​​the installation portion 50 may also be smaller than the area of ​​the base plate 40. For example, the length of the installation portion 50 in the X-axis direction is 100 to 500 mm, the length of the installation portion 50 in the Y-axis direction is 100 to 500 mm, and the height (thickness) of the installation portion 50 is 10 to 100 mm.

[0095] The support portion 60 (a plurality of support bodies 61 described later) is provided in the installation portion 50. The installation portion 50 supports the plurality of support bodies 61 in such a manner that the plurality of support bodies 61 are kept in an upright state. The material constituting the installation portion 50 is not particularly limited, and for example, it may be the same material as the support body 61 (a ceramic material), or may be a metal or the like.

[0096] The installation part 50 may be integrated with the base plate 40. In addition, the base plate 40 may be integrated with the movable pressurizing part 12. In this embodiment, the load generating part 20 ( Figure 1A ) The component that bears the load is called a "base". The base 180 includes the movable pressurizing part 12, the base plate 40 and the setting part 50, but may also include other components. In addition, any one of the movable pressurizing part 12, the base plate 40 and the setting part 50 may be omitted from the base 180.

[0097] The upper fixture plate 70 is formed of a flat plate body (rigid body) and is supported by the support portion 60. The material forming the upper fixture plate 70 may be a metal such as SUS, iron or nickel. The upper fixture plate 70 is formed separately from the base portion 180.

[0098] The upper clamping plate 70 is provided with a heat source 170. The heat source 170 is, for example, a cartridge heater, and is built into the upper clamping plate 70. By heating the upper clamping plate 70 with the heat source 170, the substrate 2 ( Figure 2 ) is heated and pressurized. In addition, the lower clamping plate 130 ( Figure 1B ) is provided with a heat source 170.

[0099] The pressurizing plate 80 is composed of a flat plate body (rigid body) and is provided on the lower surface of the upper fixture plate 70. The pressurizing plate 80 is used to press the substrate 2 ( Figure 2 ) for pressurization.

[0100] The surface accuracy (flatness, smoothness, etc.) of the press plate 80 may also be higher than that of the upper fixture plate 70. For example, the lower surface of the press plate 80 is less concave and convex than the lower surface of the upper fixture plate 70, and the inclination relative to the horizontal plane may also be less. The surface roughness Ra of the surface (especially the lower surface) of the press plate 80 is not particularly limited, and may be Ra≤1μm. In this case, the press plate 80 can be used to press the substrate 2 ( Figure 2 The multiple elements 4a, 4b, 4c) shown apply the load evenly.

[0101] The area of ​​the pressurizing plate 80 is not particularly limited and can be arranged on the same surface as the base 140 ( Figure 1B ) are equal in area. The thickness of the pressure plate 80 in the Z-axis direction is not particularly limited, and can be equal to the thickness of the setting substrate 140 in the Z-axis direction. The material constituting the pressure plate 80 is not particularly limited, and can be the same as the material constituting the setting substrate 140. The parallelism A between the pressure plate 80 and the setting substrate 140 is not particularly limited, and can be A≤1μm.

[0102] A plurality of (e.g., four) fixing portions 120 are provided on the lower surface of the upper fixture plate 70 so as to abut against the edge of the pressure plate 80. The fixing portions 120 position and fix (or temporarily fix) the pressure plate 80 at a predetermined position of the upper fixture plate 70. The plurality of fixing portions 120 abut against at least a portion of the edge of the pressure plate 80. The plurality of fixing portions 120 may also be provided corresponding to the respective sides of the rectangle formed by the pressure plate 80. In addition, the number of the fixing portions 120 may be 1 to 3, or may be 5 or more.

[0103] The cover 160 is attached to the upper jig plate 70, for example. The cover 160 is used to protect the upper jig plate 70 from external forces, etc. The cover 160 may be attached to the upper jig plate 70 so as to cover the side of the upper jig plate 70 in the Y-axis direction.

[0104] The support portion 60 is disposed between the base portion 180 (the movable pressurizing portion 12 ( Figure 1A ), between the base plate 40 and the installation portion 50 and the upper fixture plate 70, the upper fixture plate 70 is supported relative to the base 180. The base 180 is not in contact with the upper fixture plate 70, and is separated via the support portion 60.

[0105] The support portion 60 includes a plurality of support bodies 61 and an air layer 62 around the plurality of support bodies 61. The support body 61 may also have a columnar shape. In this case, it is possible to prevent cracks or breakage from occurring in the support body 61. In addition, the support body 61 can ensure a gap between the base 180 and the upper fixture plate 70, and the heat of the upper fixture plate 70 (heat source 170) is difficult to be transferred to the base 180.

[0106] The support body 61 is in the shape of a cylinder, but may be in the shape of a prism, a cone, a pyramid, etc. In addition, the support body 61 may be in the shape of a tube. The plurality of support bodies 61 may have the same shape, but may have different shapes.

[0107] The support body 61 is fixed to the lower surface of the setting portion 50, and supports the upper fixture plate 70. The upper end portion of the support body 61 is fixed to the setting portion 50, and the lower end portion of the support body 61 is fixed to the upper fixture plate 70. The upper end surface of the support body 61 abuts against the lower surface of the setting portion 50, and the lower end surface of the support body 61 may also abut against the upper surface of the upper fixture plate 70.

[0108] The diameter of the support body 61 is not particularly limited, and is, for example, 10 to 20 mm. The diameters (or cross-sectional areas along the XY plane) of the plurality of support bodies 61 are equal, but may be different. For example, the diameter (or cross-sectional area) of the support body 61 disposed in the center of the upper fixture plate 70 among the plurality of support bodies 61 may be larger than the diameters (or cross-sectional areas) of the other support bodies 61.

[0109] The length of the support body 61 in the Z-axis direction is not particularly limited, and may be, for example, 20 to 50 mm, or 20 to 25 mm. The length of the support body 61 in the Z-axis direction may be equal to the thickness of the upper fixture plate 70 in the Z-axis direction.

[0110] The support body 61 is made of a ceramic material such as ceramic or glass. Examples of the ceramic material constituting the support body 61 include machinable ceramic (Macerite), silicon nitride or aluminum oxide. In addition, examples of the glass constituting the support body 61 include quartz, synthetic quartz, sapphire, Neoceram (registered trademark), etc. In addition to the above materials, various inorganic solid materials can also be used. For example, the support body 61 can also be made of a metal such as carbon steel. The thermal conductivity of the material constituting the support body 61 is not particularly limited, and is, for example, 1.0 W / mK to 50.0 W / mK. The support body 61 can also be made of an elastically deformable rigid body. In addition, the Young's modulus of the material constituting the support body 61 is not particularly limited, and is, for example, 70 GPa to 500 GPa.

[0111] like Figure 4 As shown, a plurality of support bodies 61 may also be arranged in a matrix on the upper fixture plate 70. In this case, the upper fixture plate 70 is partially supported by each support body 61 at the position where each support body 61 is set. Therefore, the contact area between each support body 61 and the upper fixture plate 70 can be reduced, and cracks or damages in each support body 61 due to the difference in thermal expansion coefficients between the two can be prevented. In addition, the load applied to the support portion 60 can be dispersed by the plurality of support bodies 61, and cracks or damages in each support body 61 due to eccentric loads can be prevented.

[0112] The plurality of support bodies 61 are separately arranged in the X-axis direction and the Y-axis direction. Therefore, an air layer 62 is formed between the support bodies 61. In addition, the air layer 62 is also formed outside the X-axis direction and outside the Y-axis direction of the assembly of the plurality of support bodies 61. The air layer 62 extends from the setting portion 50 ( Figure 3B ) is formed to the upper surface of the upper fixture plate 70.

[0113] The plurality of supports 61 are arranged at equal intervals, and the center distances between the supports 61 are equal, but may be different. The center distances between the supports 61 are not particularly limited, and may be, for example, 20 to 50 mm, or 20 to 25 mm. The plurality of supports 61 are distributed over the entire area of ​​the upper fixture plate 70, but may be biased (concentrated) in the central portion of the upper fixture plate 70. In addition, the plurality of supports 61 may be randomly arranged on the upper fixture plate 70, or may be arranged in concentric circles.

[0114] The plurality of supports 61 are roughly divided into a first support 61a and a second support 61b. The first support 61a is disposed on the base 180 ( Figure 1A and Figure 3B) and / or the central portion of the upper fixture plate 70. More specifically, the first support body 61a may be disposed directly below the pressurizing axis of the load generating portion 20. The second support body 61b is disposed around (outside) the first support body 61a.

[0115] like Figure 5 As shown, the first support body 61a can also be connected to the base 180 and the upper fixture plate 70 via a shaft 63a. The shaft 63a is a fastener such as a bolt or a rivet. The shaft 63a is fixed to the first support body 61a and penetrates the first support body 61a along the axial direction (Z-axis direction) of the first support body 61a. In addition, the shaft 63a penetrates the through hole formed in the setting portion 50 along the Z-axis. The upper end of the shaft 63a is connected to the base plate 40, and the lower end of the shaft 63a is connected to the upper fixture plate 70.

[0116] In this way, by fixing the first support body 61a to the base 180 and the upper fixture plate 70 via the shaft 63a, the first support body 61a is unlikely to be displaced in the vertical direction and / or horizontal direction, and the flatness of the pressurizing surface of the pressurizing plate 80 or the pressurizing surface and the substrate 2 ( Figure 2 ) between the first support body 61a, the base 180 and the upper fixture plate 70 can be increased in connection strength.

[0117] A buffer material 64 may be provided at the upper end of the shaft 63a. The buffer material 64 is, for example, a force-applying member such as a disc spring washer, a washer, or a leaf spring. In this case, the upper end of the shaft 63a is fixed to the base plate 40 with a relatively weak force via the buffer material 64. Therefore, when the first support body 61a is thermally expanded, for example, the first support body 61a is deformed by the buffer material 64, and is not hindered by the base plate 40, and can be thermally expanded freely. Therefore, the stress applied to the first support body 61a is reduced, and cracks or damages can be prevented from occurring in the first support body 61a.

[0118] In addition, the connecting member connecting the first support body 61a to the base 180 and the upper fixture plate 70 is not limited to the shaft 63a, and may be a resin such as an adhesive. In addition, the shaft 63a may not penetrate the first support body 61a. For example, the upper end of the first support body 61a may be connected to the base plate 40 by the first shaft, and the lower end of the first support body 61a may be connected to the upper fixture plate 70 by the second shaft.

[0119] In addition, the upper end of the shaft 63a may be connected to the setting portion 50. Alternatively, the upper end of the shaft 63a may pass through the setting portion 50 and the base plate 40 and be connected to the movable pressurizing portion 12 ( Figure 1B ).

[0120] The second support body 61b may also be connected to the base 180 via the shaft 63b. The shaft 63b is fixed to the second support body 61b and penetrates the second support body 61b along the axial direction (Z-axis direction) of the second support body 61b. The upper end of the shaft 63b is connected to the setting portion 50. On the other hand, the lower end of the shaft 63b may not be connected to the upper fixture plate 70. In this case, the lower end of the second support body 61b only contacts the upper surface of the upper fixture plate 70.

[0121] In this case, when the second support 61b thermally expands, the second support 61b is not blocked by the upper clamp plate 70 and can thermally expand freely toward the upper clamp plate 70. Therefore, the stress applied to the second support 61b is reduced, and cracks or damages in the second support 61b can be prevented.

[0122] like Figure 4 As shown in FIG. 1 , a bracket 100 arranged along the outer circumference of the first support body 61a may be fixed to the first support body 61a in a manner surrounding the first support body 61a. Figure 6 As shown, the holder 100 has a cylindrical shape. The height of the holder 100 in the Z-axis direction may be lower than the height of the first support body 61a in the Z-axis direction.

[0123] The bracket 100 may also include a first portion 100a and a second portion 100b. The first portion 100a and the second portion 100b may have symmetrical shapes, but may also have asymmetrical shapes. The bracket 100 is fixed to the first support 61a by clamping the first support 61a from the side with the first portion 100a and the second portion 100b.

[0124] The upper end of the bracket 100 is fixed to the base 180 (installation portion 50), but may be fixed to the upper fixture plate 70. The bracket 100 may also be fixed to the installation portion 50 and / or the upper fixture plate 70 via a plurality of (e.g., two) bracket fixing members 100c. By fixing the bracket 100 to the first support body 61a, it is possible to prevent the first support body 61a from being displaced in the horizontal direction, or to prevent the first support body 61a or the upper fixture plate 70 from rotating.

[0125] Figure 3A The holding portion 90 shown holds the upper fixture plate 70 so as to be displaceable in the Z-axis direction relative to the base portion 180 (the base plate 40 and the installation portion 50 , etc.). In the present embodiment, the upper fixture plate 31 includes two holding portions 90 .

[0126] One holding portion 90 is disposed on one side of the upper fixture plate 70 in the X-axis direction. Another holding portion 90 holds the edge of one side of the upper fixture plate 70 in the X-axis direction via the insulating material 110, but the edge may be held directly. Another holding portion 90 is disposed on the other side of the upper fixture plate 70 in the X-axis direction. Another holding portion 90 holds the edge of the other side of the upper fixture plate 70 in the X-axis direction via the insulating material 110, but the edge may be held directly. By holding the outer edge of the upper fixture plate 70 in the X-axis direction using the holding portion 90, it is possible to prevent the displacement of the upper fixture plate 70 relative to the base 180 from being hindered by the holding portion 90.

[0127] like Figure 7 As shown in FIG. 1 , the holding portion 90 has a plurality of (for example, six) elastic bodies 93. The elastic body 93 is, for example, a coil-shaped compression spring. However, the elastic body 93 may also be composed of other elastic components (for example, rubber). Figure 8 As shown, the holding portion 90 lifts the upper fixture plate 70 using the elastic force of the elastic body 93 .

[0128] like Figure 7 and Figure 8 As shown in FIG. 1 , the holding portion 90 may also include a main body 91 and a plurality of (for example, six) shafts 92. The main body 91 has an L-shape and holds (lifts) the upper fixture plate 70. Figure 3A As shown, the main body 91 extends in the Y-axis direction along the edge of the upper fixture plate 70 in the X-axis direction. The length of the main body 91 along the Y-axis is not particularly limited, and may be equal to or greater than the length of the Y-axis along the edge of the upper fixture plate 70 in the X-axis direction, or may be equal to or less than the length of the Y-axis.

[0129] like Figure 7 and Figure 8 As shown, the main body 91 may also have a plurality of (for example, six) setting holes 91a, a pressing portion 91b, an upper wall 91c, and a through hole 91d ( Fig. 9 ). The plurality of setting holes 91a are separately arranged along the Y axis. The setting hole 91a passes through the main body 91 along the X axis, but one opening of the setting hole 91a in the X axis direction may be closed. The shape of the setting hole 91a viewed from the X axis direction is a rectangle, but is not limited thereto.

[0130] A plurality of elastic bodies 93 and a plurality of shafts 92 passing through the inner sides of the plurality of elastic bodies 93 are respectively arranged in the plurality of setting holes 91a. Therefore, the elastic force of the plurality of elastic bodies 93 can increase the lifting force of the main body 91 on the upper fixture plate 70. Thus, the inclination of the upper fixture plate 70 can be prevented, and the pressure plate 80 ( Figure 3B ) and the pressing surface of the substrate 2 ( Figure 2 ) reduces the degree of parallelism between them.

[0131] The pressing portion 91b is formed at the lower end of the main body 91 and protrudes along the X-axis. The pressing portion 91b is integral with the main body 91, but may be separately formed. The pressing portion 91b plays a role in supporting the heat insulating material 110 described later.

[0132] The upper wall 91c is a portion located at the upper part of the inner wall of the hole 91a. The upper wall 91c is pressed by the elastic body 93. Fig. 9 As shown, the through hole 91d penetrates the main body 91 and extends from the upper end of the main body 91 to the upper wall 91c. The through hole 91d is connected to the setting hole 91a.

[0133] like Figure 8 and Fig. 9 As shown, the upper end of the shaft 92 is fixed to the base 180 (the mounting portion 41 as a part of the base plate 40), and the lower end of the shaft 92 is arranged in the setting hole 91a. The shaft 92 passes through the main body 91 along the Z axis and protrudes toward the setting hole 91a. The shaft 92 slidably holds the main body 91 along its axial direction.

[0134] The elastic body 93 has a first end fixing portion 93a at the lower end thereof. The first end fixing portion 93a is fixed to the lower end of the shaft 92. In order to fix the first end fixing portion 93a, a stopper having a larger diameter than other portions is formed at the lower end of the shaft 92. The first end fixing portion 93a is provided with, for example, an annular member and fixed to the stopper.

[0135] The upper end (second end) of the elastic body 93 is a free end. A second end pressing portion 93b is provided at the upper end of the elastic body 93. In the present embodiment, the elastic body 93 is a compression spring, so the second end pressing portion 93b applies force to the upper wall 91c toward the mounting portion 41 by the restoring force of the compression spring. The second end pressing portion 93b is provided with, for example, an annular member, and abuts against the upper wall 91c.

[0136] Thus, the main body 91, which is in a state of holding the upper clamp plate 70, can be forced toward the base 180 (mounting portion 41) and fixed to the base 180 by the force of the elastic body 93. In addition, the main body 91 can slide along the shaft 92 in the Z-axis direction according to the thermal expansion of the upper clamp plate 70 and the like. For example, when the upper clamp plate 70 is thermally expanded, the main body 91 is pressed by the stress applied from the upper clamp plate 70 and moves downward. As a result, a gap G ( L ) of length L is formed between the upper end of the main body 91 and the mounting portion 41. Fig. 9 ). On the other hand, when the upper fixture plate 70 is thermally contracted, the main body 91 is released from the above-mentioned stress and moves upward. As a result, the gap G disappears. In this way, the main body 91 can maintain the upper fixture plate 70 so that it can be displaced relative to the base 180. In addition, the main body 91 can also slide along the shaft 92 in the Z-axis direction according to the thermal expansion of the support body 61.

[0137] The elastic force of the elastic body 93 can also be balanced with the weight of the object (upper clamp plate 70 and heat insulating material 110) held by the holding portion 90. This prevents the elastic force of the elastic body 93 from hindering thermal expansion of the upper clamp plate 70 and the like.

[0138] The heat insulating material 110 is provided between the pressing portion 91b of the main body 91 and the pressing portion 71 of the upper fixture plate 70. The pressing portion 71 is fixed to the upper fixture plate 70 by bolts 72. The heat insulating material 110 has a rectangular parallelepiped shape and extends along the Y axis ( Figure 3B ). The length of the heat insulating material 110 along the Y axis may be equal to or longer than the length of the pressing portion 91b along the Y axis, or may be equal to or shorter than the length of the pressing portion 91b. The material constituting the heat insulating material 110 is not particularly limited, and may be glass fiber, for example. By using a material in which glass fiber is fixed by resin as the heat insulating material 110, cracks or breakage of the heat insulating material 110 can be prevented. In addition, the heat insulating material 110 may be made of the same material as the support body 61.

[0139] The pressing portion 91b and the pressing portion 71 hold the heat insulating material 110 without contacting each other. In this case, it is possible to prevent the heat of the upper clamping plate 70 from being transferred to the main body 91, and maintain the uniformity of the temperature distribution of the pressing surface of the pressurizing plate 80. In addition, it is possible to prevent the thermal deformation of the holding portion 90, and the deformation of the upper clamping plate 70 associated therewith. Therefore, it is possible to prevent the flatness of the pressing surface of the pressurizing plate 80, or prevent the pressing surface from being uneven with the substrate 2 ( Figure 2 ) between the parallelism, the multiple elements 4a, 4b, 4c ( Figure 2 ) applies a uniform load.

[0140] Fig. 10A It means that in the absence of Figure 3B The upper clamp portion 31 of the support portion 60 shown in the figure is disposed on the lower clamp portion 32 (the base 140 ( Figure 1B )) is a diagram showing the distribution of the load applied to the pressure-sensitive paper 6 when the pressure-sensitive paper 6 is pressurized. In addition, Fig. 10B It means that Figure 3B The upper clamp portion 31 of the support portion 60 shown in the figure is disposed on the lower clamp portion 32 (the base 140 ( Figure 1B )) is a graph showing the distribution of the load applied to the pressure-sensitive paper 6 when the pressure-sensitive paper 6 is pressed. The pressure-sensitive paper 6 is pressed 100 times with a load of 6 kN in a non-heating atmosphere. Fig. 10A as well as Fig. 10B In the example, the distribution of the load applied to the pressure-sensitive paper 6 is equivalent to that applied to the substrate 2 ( Figure 2 ) distribution of load. In the accompanying drawings, a relatively large load is applied to a portion shown in a dark color, and a relatively small load is applied to a portion shown in a light color.

[0141] like Fig. 10A As shown, in the upper clamp portion 31 ( Figure 3B ) does not include the support portion 60 ( Figure 3B ), the closer to the center of the pressure-sensitive paper 6, the smaller the load applied to the pressure-sensitive paper 6 is, and the closer to the outer edge of the pressure-sensitive paper 6, the larger the load applied to the pressure-sensitive paper 6 is. Fig. 10B As shown, in the upper clamp portion 31 ( Figure 3B ) is provided with a support portion 60 ( Figure 3B ), the load applied to the pressure-sensitive paper 6 is uniform at each position of the pressure-sensitive paper 6. As described above, in this embodiment, even if the pressure-sensitive paper 6 is repeatedly pressed by the upper clamp portion 31, a uniform load can be applied to the pressure-sensitive paper 6.

[0142] Fig.11A It means that in the absence of Figure 3B The upper clamp portion 31 of the support portion 60 shown in the figure is disposed on the lower clamp portion 32 (the base 140 ( Figure 1B )) is a diagram showing the distribution of the load applied to the pressure-sensitive paper 6 when the pressure-sensitive paper 6 is pressurized. In addition, Fig. 10B It means that Figure 3B The upper clamp portion 31 of the support portion 60 shown in the figure is disposed on the lower clamp portion 32 (the base 140 ( Figure 1B )) is a graph showing the distribution of the load applied to the pressure-sensitive paper 6 when the pressure-sensitive paper 6 is pressed. The pressure-sensitive paper 6 is pressed 100 times with a load of 6 kN in a heated atmosphere at 135°C. Fig.11A as well as Fig. 11B In the example, the distribution of the load applied to the pressure-sensitive paper 6 is equivalent to that applied to the substrate 2 ( Figure 2 ) distribution of the load portion. In the accompanying drawings, a relatively large load is applied to the portion shown in dark color, and a relatively small load is applied to the portion shown in light color.

[0143] like Fig.11A As shown, in the upper clamp portion 31 ( Figure 3B ) does not include the support portion 60 ( Figure 3B ), the closer to the center of the pressure-sensitive paper 6, the greater the load applied to the pressure-sensitive paper 6, and the closer to the outer edge of the pressure-sensitive paper 6, the smaller the load applied to the pressure-sensitive paper 6. It can be seen that an uneven load is applied to the pressure-sensitive paper 6. This is because Figure 3B The heat of the upper jig plate 70 (heat source 170) is transferred to the base 180 and / or the press plate 80, causing them to deform, resulting in a decrease in the flatness of the press surface of the press plate 80 or the parallelism between the press surface and the substrate.

[0144] On the other hand, Fig. 11B As shown, in the upper clamp portion 31 ( Figure 3B) is provided with a support portion 60 ( Figure 3B ), the load applied to the pressure-sensitive paper 6 is uniform at each position of the pressure-sensitive paper 6. That is, it can be seen that a uniform load is applied to the pressure-sensitive paper 6. This is because Figure 3B The heat of the upper clamp plate 70 (heat source 170) shown is difficult to transfer to the base 180 and / or the pressure plate 80, which are difficult to deform. As a result, it is believed that the flatness of the pressure surface of the pressure plate 80 or the parallelism between the pressure surface and the substrate can be prevented from being reduced.

[0145] As explained above, if Figure 3B As shown, in the substrate processing device 1 of this embodiment, the support part 60 has a support body 61 made of a ceramic material and an air layer 62 around the support body 61. The ceramic material has low hygroscopicity and is not easily affected by creep. Therefore, it is possible to prevent the deformation of the support body 61 caused by moisture absorption and creep. As a result, it is possible to prevent the flatness of the pressurizing surface of the pressurizing plate 80 or the pressurizing surface from being uneven with the substrate 2 ( Figure 2 ) can reduce the parallelism between the plurality of elements 4a, 4b, 4c ( Figure 2 ) applies a uniform load.

[0146] In addition, ceramic materials are generally prone to cracking or breakage. In this regard, in the substrate processing device 1 of the present embodiment, an air layer 62 is formed around the support body 61 in such a manner that the support body 61 does not support the entire surface of the upper fixture plate 70. This can reduce the contact area between the support body 61 and the upper fixture plate 70, thereby preventing cracking or breakage of the support body due to the difference in thermal expansion coefficients between the two. Therefore, in this regard, it is also possible to prevent the flatness of the pressurized surface of the pressurized plate 80, or to prevent the pressurized surface from contacting the substrate 2 ( Figure 2 ) between the plurality of elements 4a, 4b, 4c ( Figure 2 ) applies a uniform load.

[0147] In addition, the upper clamp plate 70 provided with the heat source 170 is not directly fixed to the base 180, but is fixed to the base 180 via the support portion 60. Furthermore, the support body 61 and the air layer 62 function as a heat insulating material. Therefore, it is possible to prevent the heat of the upper clamp plate 70 (heat source 170) from being transferred to the base 180, and maintain the uniformity of the temperature distribution of the pressurizing surface of the pressurizing plate 80. In addition, thermal deformation of the base 180 can be prevented, and the deformation of the upper clamp plate 70 associated therewith can be prevented. Therefore, in this regard, it is also possible to prevent the flatness of the pressurizing surface of the pressurizing plate 80, or prevent the pressurizing surface from being in contact with the substrate 2 ( Figure 2 ) between the plurality of elements 4a, 4b, 4c ( Figure 2 ) applies a uniform load.

[0148] In addition, the substrate processing device 1 has a holding portion 90 that holds the upper clamp plate 70 so that it can be displaced relative to the base 180. Therefore, the holding portion 90 can displace the upper clamp plate 70 relative to the base 180 according to the thermal expansion of the upper clamp plate 70. As a result, the upper clamp plate 70 is not hindered by the holding portion 90 and can freely expand thermally. As a result, deformation caused by inhomogeneous thermal expansion of the upper clamp plate 70 can be prevented. Therefore, at this point, it is also possible to prevent the flatness of the pressurizing surface of the pressurizing plate 80 or prevent the pressurizing surface from being displaced from the substrate 2 ( Figure 2 ) between the plurality of elements 4a, 4b, 4c ( Figure 2 ) A uniform load is applied. In addition, since the upper fixture plate 70 is freely thermally expanded, the stress applied to the support body 61 is reduced, and cracks or breakages in the support body 61 can be prevented.

[0149] In addition, the holding portion 90 can displace the upper fixture plate 70 relative to the base 180 according to the thermal expansion of the support body 61. As a result, the support body 61 can be thermally expanded freely without being hindered by the upper fixture plate 70. As a result, deformation caused by inhomogeneous thermal expansion of the support body 61 can be prevented, and the influence of the deformation of the support body 61 on the upper fixture plate 70 can be prevented.

[0150] In addition, if Figure 8 As shown, the holding portion 90 has an elastic body 93, and the upper clamp plate 70 is suspended by the elastic force of the elastic body 93. In this case, the holding portion 90 can freely displace the upper clamp plate 70 relative to the base 180 according to the thermal expansion of the upper clamp plate 70 and the like by the elastic force of the elastic body 93.

[0151] Second embodiment

[0152] Fig. 12A The substrate processing apparatus 1A of the second embodiment shown in the figure has the same structure as the substrate processing apparatus 1 of the first embodiment except for the following points. The substrate processing apparatus 1A includes a support portion 60A. The support portion 60A is different from the support portion 60 (9) of the first embodiment in that it includes a plurality of (9) support bodies 61 arranged in 3 rows and 3 columns. Figure 4 In this way, even when the number of the supporting bodies 61 included in the supporting portion 60 is changed, the same effects as those of the first embodiment can be obtained.

[0153] Third embodiment

[0154] Fig. 12BThe substrate processing apparatus 1B of the third embodiment shown in the figure has the same structure as the substrate processing apparatus 1A of the second embodiment except for the following points. The substrate processing apparatus 1B has a support portion 60B. The support portion 60B has a plurality of (9) support bodies 61B. The support body 61B is different from the support body 61 (9) of the second embodiment in that the cross-sectional shape of the support body 61B in the direction perpendicular to the axial direction thereof is rectangular. Fig. 12A ) is different. In this way, even when the cross-sectional shape of the support body 61B is changed, the same effect as the second embodiment can be obtained. In addition, the cross-sectional shape of the support body 61B can also be a triangle, other polygons, or other shapes.

[0155] Fourth embodiment

[0156] Fig. 12C The substrate processing apparatus 1C of the fourth embodiment shown in the figure has the same structure as the substrate processing apparatus 1B of the third embodiment except for the following points. The substrate processing apparatus 1C has a support portion 60C. The support portion 60C has a single support body 61C. An air layer 62 is formed around the support body 61C. The cross-sectional area of ​​the cross section perpendicular to the axial direction of the support body 61C is larger than the cross-sectional area of ​​the cross section perpendicular to the axial direction of the support body 61B ( Fig. 12B ) in the axial direction. The sectional area of ​​the section perpendicular to the axial direction of the support body 61C may be 1 / 4 or more of the area of ​​the upper surface of the upper fixture plate 70, or may be 1 / 2 or more. In this way, even when the sectional area and the number of the support bodies 61C are changed, the same effect as that of the third embodiment can be obtained. In particular, when the number of the support bodies 61C is odd, the support portion 60C is angularly spaced relative to the setting portion 50 ( Figure 3B ) is easy to set up.

[0157] Fifth embodiment

[0158] Fig.12D The substrate processing apparatus 1D of the fifth embodiment shown in the figure has the same structure as the substrate processing apparatus 1C of the fourth embodiment except for the following points. The substrate processing apparatus 1D has a support portion 60D. The support portion 60D has a single support body 61D. The support body 61D is arranged at the center of the upper fixture plate 70. The cross-sectional area of ​​the cross section perpendicular to the axial direction of the support body 61D is smaller than the cross section perpendicular to the axial direction of the support body 61C ( Fig. 12C ). The cross-sectional area of ​​the cross section perpendicular to the axial direction of the support body 61D may be less than 1 / 4 of the area of ​​the upper surface of the upper fixture plate 70, or may be less than 1 / 8. In this way, even when the cross-sectional area of ​​the support body 61D is changed, the same effect as that of the fourth embodiment can be obtained. In addition, the number of the support body 61D may be multiple.

[0159] Sixth Embodiment

[0160] Fig.12E The substrate processing device 1E of the sixth embodiment shown has the same structure as the substrate processing device 1 of the first embodiment except for the points shown below. The substrate processing device 1E has a support portion 60E. The support portion 60E has a support body 61 arranged in the central portion of the upper clamping plate 70 and a support body 61E surrounding the support body 61. An air layer 62 is formed between the support body 61 and the support body 61E. In addition, the air layer 62 is also formed around (outside) the support body 61E. The support body 61E has a square ring shape. The edges of the quadrilateral formed by the support body 61E are arranged along the outer edge of the upper clamping plate 70. In this way, even when the support body 61E is formed in a shape other than a cylinder or a prism, the same effect as the first embodiment can be obtained. In particular, in this embodiment, the outer edge of the upper clamping plate 70 can be supported by the support body 61E.

[0161] In addition, the number of the support bodies 61 may be plural. Similarly, the number of the support bodies 61E may be plural. The number of the plural support bodies 61 may be arranged inside the support body 61E. In addition, the support body 61 may be arranged outside the support body 61E.

[0162] Seventh embodiment

[0163] Fig.12F The substrate processing device 1F of the seventh embodiment shown has the same structure as the substrate processing device 1E of the sixth embodiment except for the points shown below. The substrate processing device 1F has a support portion 60F. The support portion 60F has a support body 61 arranged in the central portion of the upper clamping plate 70 and two support bodies 61F arranged on both sides of the support body 61. An air layer 62 is formed between the support body 61 and the support body 61F. In addition, the air layer 62 is also formed around (outside) the support body 61F. The support body 61F has a rectangular parallelepiped shape and is arranged along the outer edge of the upper clamping plate 70. The shape of the cross section perpendicular to the axial direction of the support body 61F is rectangular. The number of support bodies 61F can also be singular or three or more. In this way, when the support body 61F is formed in a rectangular parallelepiped shape, the same effect as the sixth embodiment can be obtained. In particular, in this embodiment, compared with the sixth embodiment, cracks or damage can be prevented from occurring in the support body 61F.

[0164] In addition, the number of the support bodies 61 may be plural. A plurality of the support bodies 61 may be arranged between two support bodies 61F. In addition, the support body 61 may be arranged outside the region sandwiched by the two support bodies 61F.

[0165] In addition, the present disclosure is not limited to the above-mentioned embodiment, and various changes can be made within the scope of the present disclosure.

[0166] In the above-mentioned embodiments, the upper clamp portion 31 may be omitted. Figure 3B In addition, when the upper clamp portion 31 includes the holding portion 90, the support body 61 may be made of a material other than a ceramic material. For example, the support body 61 may be made of a glass fiber material.

[0167] In the above embodiments, Figure 3B The support portion 60 shown is suitable for Figure 1B The lower clamp portion 32 is shown.

[0168] In each of the above-mentioned embodiments, the pressurizing plate 80 shown in FIG. 3 may be omitted.

[0169] In the above embodiments, Figure 2 As shown, the substrate 2 is in the shape of a quadrilateral, but may also be in the shape of a circle or other polygons.

[0170] Description of Reference Numerals

[0171] 1. 1A~1F: Substrate processing equipment

[0172] 2: Substrate

[0173] 4: Component array

[0174] 4a, 4b, 4c: Components

[0175] 6: Pressure-sensitive paper

[0176] 10: Set up the platform

[0177] 11: Upper part of the stand

[0178] 12: Movable pressurizing unit

[0179] 12a: Through hole

[0180] 13: Lower part of the platform

[0181] 14: Guide bushing

[0182] 15: Guide shaft

[0183] 20: Load generating part

[0184] 30: Substrate pressurization unit

[0185] 31: Upper fixture

[0186] 32: Lower fixture

[0187] 40: Base plate

[0188] 41: Installation

[0189] 50: Settings

[0190] 60, 60A~60F: Supporting part

[0191] 61, 61B~61F: Support body

[0192] 61a: First support

[0193] 61b: Second support

[0194] 62: Air layer

[0195] 63a, 63b: shaft (connecting member)

[0196] 64: Buffer material

[0197] 70: Upper fixture plate

[0198] 71: Pressing part

[0199] 72: Bolt

[0200] 80: Pressure plate

[0201] 90: Maintaining

[0202] 91: Main body

[0203] 91a: Setting hole

[0204] 91b: Pressing part

[0205] 91c: Upper wall

[0206] 91d: Through hole

[0207] 92: Axis

[0208] 93: Elastomer

[0209] 93a: First end fixing portion

[0210] 93b: Second end pressing portion

[0211] 100: Bracket

[0212] 100a: Part I

[0213] 100b: Part 2

[0214] 100c: Bracket fixing parts

[0215] 110: Insulation materials

[0216] 120: Fixed part

[0217] 130: Lower fixture plate

[0218] 140: Setting the base

[0219] 150: Carrier

[0220] 160: Cover

[0221] 170: Heat Source

[0222] 180: base.

Claims

1. A substrate processing device, wherein: have: The base that bears the load; an upper fixture plate provided with a heat source; a pressurizing plate mounted on the upper fixture plate to pressurize the pressurized object; and a supporting portion interposed between the base and the upper fixture plate and supporting the upper fixture plate relative to the base, The support portion includes a support body made of a ceramic material and an air layer around the support body.

2. The substrate processing apparatus according to claim 1, wherein: The support body is made of ceramic or glass.

3. The substrate processing apparatus according to claim 1 or 2, wherein: The support body has a columnar shape.

4. The substrate processing apparatus according to claim 3, wherein: The support body is in the shape of a cylinder, a prism, a cone or a pyramid.

5. The substrate processing apparatus according to claim 1 or 2, wherein: The support body has a plurality of the support bodies, The plurality of support bodies are arranged in a matrix.

6. The substrate processing apparatus according to claim 1 or 2, wherein: The support body has a first support body arranged at the central portion of the base or the upper fixture plate, The first support body is connected to the base and the upper fixture plate via a connecting member.

7. The substrate processing apparatus according to claim 6, wherein: A first shaft is fixed to the first support body and passes through the first support body along the axial direction of the first support body. One end of the first shaft in the axial direction is connected to the base portion, and the other end of the first shaft in the axial direction is connected to the upper fixture plate.

8. The substrate processing apparatus according to claim 7, wherein: A cushioning material is provided at one end of the first shaft in the axial direction.

9. The substrate processing apparatus according to claim 6, wherein: The support body has a second support body arranged around the first support body, The second support body is connected to the base portion, is not connected to the upper fixture plate, and is in contact with the upper fixture plate.

10. The substrate processing apparatus according to claim 1 or 2, wherein: The support body has a first support body arranged at the central portion of the base or the upper fixture plate, A bracket disposed along the outer circumference of the first support body so as to surround the first support body is fixed to the first support body.

11. A substrate processing device, wherein: have: The base that bears the load; an upper fixture plate provided with a heat source; A pressurizing plate mounted on the upper fixture plate to pressurize the pressurized object; a support portion interposed between the base and the upper fixture plate and supporting the upper fixture plate relative to the base; and A holding portion holds the upper fixture plate so as to be displaceable relative to the base portion.

12. The substrate processing apparatus according to claim 11, wherein: The holding portion has an elastic body, and the upper fixture plate is suspended by the elastic force of the elastic body.

13. The substrate processing apparatus according to claim 11, wherein: The holding portion comprises: a main body that holds the upper fixture plate; a second shaft, one end of which is fixed to the base to hold the main body slidably; and an elastic body that is fixed to the second shaft to apply force to the base by elastic force.

14. The substrate processing apparatus according to claim 12 or 13, wherein: The elastic force of the elastic body is balanced with the dead weight of the object to be held by the holding portion.

15. The substrate processing apparatus according to claim 13, wherein: The second axis has a plurality of second axes, The elastic body includes a plurality of the elastic bodies fixed to a plurality of the second shafts, The plurality of elastic bodies urge the main body toward the base using elastic force.

16. The substrate processing apparatus according to claim 13 or 15, wherein: The elastic body is a coil-shaped spring, The second shaft passes through the inner side of the elastic body.

17. The substrate processing apparatus according to any one of claims 11 to 13, wherein: The holding portion includes a plurality of holding portions. The plurality of holding portions hold the outer edge portion of the upper fixture plate.

18. The substrate processing apparatus according to any one of claims 11 to 13, wherein: A heat insulating material is provided between the holding portion and the upper fixture plate.

19. The substrate processing apparatus according to claim 18, wherein: The holding portion and the upper jig plate clamp the heat insulating material without contacting each other.

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