Protective member forming apparatus

Abstract

The invention provides a protective member forming apparatus which efficiently forms a protective member. The protective member forming apparatus expands and solidifies a liquid resin over the entire surface of one surface of a wafer to form a protective member that protects the entire surface. The protective member forming apparatus includes: a glass table (16) that holds a sheet (S); a wafer holding unit which is disposed facing the glass stage (16) and holds a wafer; a liquid resin supply nozzle that supplies a liquid resin onto the sheet (S) held by the glass stage (16) or onto the wafer held by the wafer holding unit; a lifting mechanism for lifting the glass table (16) and the wafer holding part relative to each other; an ultraviolet irradiation unit (23) as a curing unit that imparts an external stimulus to the liquid resin and cures the liquid resin; and a wettability forming means (27) for irradiating the surface of the sheet (S) held by the glass stage (16) with ultraviolet rays or plasma to improve the wettability of the surface of the sheet (S).

Description

Technical Field

[0001] The present invention relates to a protective member forming device. Background Art

[0002] There is known a protective member forming device that forms a protective member on the surface of a wafer. For example, as disclosed in Patent Documents 1 and 2, the protective member forming device provides a predetermined amount of liquid resin on a wafer, presses the wafer held by a holding portion against the liquid resin, spreads the liquid resin over the entire surface of one surface of the wafer, and then solidifies the resin. Thus, a protective member composed of a sheet and a resin that protects one surface of the wafer is formed.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-061333

[0004] Patent Document 2: Japanese Patent Application Publication No. 2022-020286

[0005] Conventional protective member forming devices have a technical problem that the expansion of the liquid resin takes time. For example, a countermeasure to this technical problem is to reduce the pressure in the sealed chamber that supplies the liquid resin to promote the expansion of the liquid resin.

[0006] However, even if the pressure in the sealed chamber is reduced, the liquid resin in the central portion of the wafer far from the gas-liquid interface is not easy to spread, so the effect is limited. Therefore, a technology that can further shorten the time required to form the protective member is desired. Summary of the invention

[0007] An object of the present invention is to provide a technology for efficiently forming a protective member.

[0008] A protective component forming device in one embodiment of the present invention causes liquid resin to spread and solidify on the entire surface of one surface of a chip to form a protective component that protects the entire surface of one surface of the chip, wherein the protective component forming device comprises: a sheet holding portion, which holds the sheet; a chip holding portion, which is arranged opposite to the sheet holding portion and holds the chip; a liquid resin supply nozzle, which supplies liquid resin to the sheet held by the sheet holding portion or to the chip held by the chip holding portion; a lifting mechanism, which lifts and lowers the sheet holding portion and the chip holding portion relative to each other; a curing unit, which applies external stimulation to the liquid resin to cure the liquid resin; and a wettability forming unit, which irradiates ultraviolet rays or plasma to the surface of the sheet held by the sheet holding portion to improve the wettability of the surface of the sheet.

[0009] According to the present invention, it is possible to provide a technology for efficiently forming a protective member. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1This is a schematic perspective view of a protective member forming device according to one embodiment.

[0011] Figure 2 It is an explanatory diagram showing an example of a sheet supplying step in forming a protective member.

[0012] Figure 3 This is an explanatory diagram showing an example of a wettability forming step in forming a protective member.

[0013] Figure 4 It is an explanatory diagram showing an example of a liquid resin supplying step in forming a protective member.

[0014] Figure 5 This is an explanatory diagram showing an example of a wafer holding step in forming a protective member.

[0015] Figure 6 This is an explanatory diagram showing an example of a spreading process in forming a protective member.

[0016] Figure 7 This is an explanatory diagram showing an example of a curing step in forming a protective member.

[0017] Figure 8 This is an explanatory diagram showing another example of the wettability forming step in forming the protective member.

[0018] Fig. 9 It is an explanatory diagram showing another example of the liquid resin supplying step in forming the protective member.

[0019] Description of symbols

[0020] 1: protective component forming device; 16, 51, 160: glass table; 18: resin supply mechanism; 20, 70: chip holding part; 21: lifting mechanism; 23, 53: ultraviolet irradiation unit; 27, 31: sheet wettability forming unit; 32: chip sheet wettability forming unit; 40: control unit; 50: sheet holding part; 54, 162: support table; 71, 201: holding workbench; 72, 202: porous component; 73, 203: chip holding surface; 161: loading surface; 183: resin supply nozzle; 231, 531: ultraviolet irradiation part; 511: holding surface; H: protective component; M: liquid resin; S: sheet; Sa, Sb, WSa: surface; W: chip; WS: chip sheet. DETAILED DESCRIPTION

[0021] Hereinafter, a protection member forming device according to an embodiment will be described with reference to the drawings. Figure 1 This is a schematic perspective view of a protective member forming device according to one embodiment.

[0022] The X-axis direction, Y-axis direction, and Z-axis direction shown in each figure are perpendicular to each other. The X-axis direction and the Y-axis direction are substantially horizontal directions, and the Z-axis direction is the up-down direction (vertical direction).

[0023] Figure 1 The protective member forming device 1 shown is a device for forming a protective member H (see Figure 7 ) is an example of a device that makes liquid resin M (refer to Figure 4 ) expands and solidifies on the entire surface of one side of the chip W between the chip W and the sheet S, so that the resin obtained by solidifying the liquid resin M (in order to distinguish it from the liquid resin M before solidification, it is recorded as resin HM) and the sheet S constitute a protective component H, which protects the entire surface of one side of the chip W.

[0024] The protective member forming apparatus 1 has a structure for improving the wettability of the surface of the sheet S on which the liquid resin M is dropped so that the liquid resin M spreads between the wafer W and the sheet S over the entire surface of one surface of the wafer W in a short time. The structure of the protective member forming apparatus 1 will be described in detail below.

[0025] The example of applying the liquid resin M to the surface of the sheet S in order to form the protective member H is described below. However, the liquid resin M only needs to be applied between the sheet S and the wafer W. The liquid resin M may be applied to the wafer W instead of the sheet S. For example, as described below, Figure 8 and Fig. 9 As described above, the material may be supplied to the surface of the sheet (wafer sheet WS) formed on the surface of the wafer W. Alternatively, the material may be supplied directly to the surface of the wafer W.

[0026] Figure 1 The outer housing 10 of the protective member forming apparatus 1 is indicated by a dotted line, and the components inside the outer housing 10 are shown in a transparent state. The surface of the wafer W facing upward when processed by the protective member forming apparatus 1 is referred to as an upper surface Wa, and the surface facing downward is referred to as a lower surface Wb.

[0027] Wafer W is, for example, a disk-shaped as-cut wafer cut from a cylindrical silicon ingot, etc. Wafer W is not limited to an as-cut wafer before device formation, but may be a device wafer after device formation, or a wafer with bumps.

[0028] The protective member forming apparatus 1 includes a cassette storage section 11 on the +Y direction side of an external housing 10. Inside the cassette storage section 11, a cassette C capable of storing a plurality of wafers W is placed.

[0029] A sheet cutting table 14 is provided at the -Y direction side of the cassette storage portion 11. The sheet cutting table 14 is provided with a sheet cutter 141 for cutting a sheet S attached to the wafer W along the outer shape of the wafer W, which will be described later.

[0030] A first conveying mechanism 12 is provided on the -X direction side relative to the slice cutting table 14 to carry in and carry out the wafer W from the cassette C. The first conveying mechanism 12 includes a robot 122 supported on a base 121, and conveys the wafer W between the cassette C stored in the cassette storage section 11 and the temporary storage table 13 by moving the base 121 in the X-axis direction and the robot 122. In addition, the wafer W is conveyed between the slice cutting table 14 and the cassette C stored in the cassette storage section 11.

[0031] The protective component forming device 1 has a base 15 on the -Y direction side relative to the sheet cutting workbench 14. A glass table 160 (sheet holding portion) made of a light-transmitting material such as quartz glass is provided on the base 15. The glass table 160 is formed in a disk shape. The upper surface of the glass table 160 serves as a flat mounting surface 161 for mounting the sheet S. In addition, a support table 162 for supporting the glass table 160 is provided. The upper surface of the support table 162 has four suction holes 163 connected to a suction source (not shown) to suck the sheet S.

[0032] The protective member forming device 1 has a sheet conveying mechanism 17 for conveying and placing a sheet S on a placing surface 161 of a glass stage 160 and an upper surface of a support table 162. The sheet conveying mechanism 17 has a sheet supplying portion 171 for supporting a rolled sheet S, an arm 172 that can move in the Y-axis direction, and a clamping portion 173 attached to the side surface of the arm 172. In the sheet conveying mechanism 17, the rolled sheet S supported by the sheet supplying portion 171 is held by the clamping portion 173, and the arm 172 is moved in the +Y direction to pull the sheet S, thereby placing the sheet S on the placing surface 161 of the glass stage 160 and the upper surface of the support table 162. Then, the suction source is operated to cause suction to act on the four suction holes 163, and the support table 162 holds the sheet S.

[0033] The sheet S is made of a light-transmitting material. For example, a film made of polyethylene terephthalate or the like can be used as the sheet S. In addition, a sheet S made of other materials may also be used.

[0034] An annular suction hole 164 connected to a suction source (not shown) is formed at the boundary between the outer periphery of the placement surface 161 of the glass stage 160 and the inner periphery of the support stage 162. The suction source operates to cause suction to act on the suction hole 164, thereby sucking and holding the sheet S placed on the placement surface 161. The glass stage 160 and the support stage 162 constitute a glass stage 16 in a broad sense for holding the sheet S, and function as a sheet holding portion of the protective member forming device 1.

[0035] A resin supply mechanism 18 is provided near the glass stage 16 to supply a predetermined amount of liquid resin M onto the sheet S held on the glass stage 16. The resin supply mechanism 18 includes a dispenser 181 connected to a container 184 provided in the base 15, a connecting pipe 182 extending from the dispenser 181, and a resin supply nozzle 183 connected to the connecting pipe 182.

[0036] The resin supply nozzle 183 is a liquid resin supply nozzle provided at the lower part of the arm 172. By moving the arm 172 in the Y-axis direction by the sheet transport mechanism 17, the resin supply nozzle 183 can be set to a state of being positioned between the glass stage 16 and a wafer holding portion 20 for holding a wafer W described later, or to a state of being retracted from between the glass stage 16 and the wafer holding portion 20.

[0037] The liquid resin M stored in the container 184 is transferred by the dispenser 181 through the connection pipe 182 , and is supplied (drips) downward from the resin supply nozzle 183 . The supply amount of the liquid resin M from the resin supply nozzle 183 can be adjusted by the dispenser 181 .

[0038] The liquid resin M has a property of being cured by external stimulation. In the present embodiment, an ultraviolet curing liquid resin M that is cured by ultraviolet irradiation is used. However, the liquid resin M may also be a thermosetting resin.

[0039] The protective member forming device 1 includes a wafer holding unit 20 disposed above the glass stage 16 and holding the wafer W. The wafer holding unit 20 is supported by a column 19 that is provided to protrude upward from the base 15 at a position on the +Y direction side relative to the glass stage 16. A lifting mechanism 21 is provided on the column 19, and the lifting mechanism 21 moves (lifts and lowers) the wafer holding unit 20 in the Z-axis direction so as to approach and separate from the glass stage 16.

[0040] The lifting mechanism 21 includes a pair of guide rails 211 and a ball screw 212 extending in the Z-axis direction, and a lifting platform 213 supported to be movable in the Z-axis direction relative to the pair of guide rails 211. The lifting mechanism 21 rotates the ball screw 212 by the driving force of the motor 214, thereby moving the lifting platform 213 in the Z-axis direction along the pair of guide rails 211.

[0041] The wafer holding unit 20 is supported by the lifting table 213 , and moves in the Z-axis direction with the movement of the lifting table 213 . That is, the lifting mechanism 21 is configured to lift the wafer holding unit 20 relative to the glass stage 16 .

[0042] The wafer holding unit 20 has a disk-shaped holding table 201. A disk-shaped porous member 202 (see FIG. 2 ) is provided on the lower surface side of the holding table 201. Figure 5 The lower surface of the porous member 202 is a wafer holding surface 203 located above the glass stage 16. The wafer holding surface 203 is a surface substantially parallel to the mounting surface 161 on which the wafer S is mounted. That is, the wafer holding portion 20 and the glass stage 16 are disposed opposite to each other.

[0043] The porous member 202 is connected to a suction source (not shown) via a suction path. The suction source applies suction force to the porous member 202, and the upper surface Wa of the wafer W is sucked and held by the wafer holding surface 203.

[0044] The wafer holding unit 20 includes a load detection unit 22. The load detection unit 22 detects a load applied to the lower surface Wb of the wafer W in the Z-axis direction.

[0045] Below the circular glass stage 160 constituting the glass stage 16, an ultraviolet irradiation unit 23 is arranged to irradiate ultraviolet rays to the liquid resin M dropped onto the sheet S on the mounting surface 161. The ultraviolet irradiation unit 23 may be disposed, for example, in an internal space formed by the support 162 and the glass stage 160 (see Figure 2 The ultraviolet irradiation unit 23 has a plurality of ultraviolet irradiation sections 231 for emitting ultraviolet rays (see Figure 7 ), ultraviolet light UV is irradiated to the liquid resin M through the light-transmitting glass stage 160 and the sheet S as an external stimulus to cure the liquid resin M. The light source used by the ultraviolet irradiation unit 231 may be, for example, an LED.

[0046] The ultraviolet irradiation unit 231 is an example of a curing unit that applies external stimulation to the liquid resin M to cure the liquid resin M. When the liquid resin M is a thermosetting resin, the protective member forming device 1 may replace the ultraviolet irradiation unit 231 with a structure that applies heat to the liquid resin M, such as an infrared irradiation unit that irradiates infrared rays, as a curing unit.

[0047] A second conveying mechanism 25 is provided on the -X direction side relative to the base 15. The second conveying mechanism 25 includes a robot 252 supported on a base 251, and conveys the wafer W between the temporary stage 13 and the wafer holding portion 20 by the movement of the base 251 in the Y-axis direction and the operation of the robot 252. In addition, the wafer W is conveyed between the glass stage 16 and the slice cutting stage 14.

[0048] The protective member forming apparatus 1 further includes a sheet wettability forming unit 27 and an insertion and removal mechanism 28. The sheet wettability forming unit 27 is fixed to the insertion and removal mechanism 28 provided near the glass stage 16.

[0049] The sheet wettability forming unit 27 is a unit that irradiates ultraviolet rays onto the surface of the sheet S held on the glass stage 16 to improve the wettability of the surface of the sheet S. More specifically, the sheet wettability forming unit 27 irradiates ultraviolet rays onto the exposed upper surface of the sheet S held on the glass stage 16. The exposed upper surface is a surface Sa (see Figure 2 ) is the surface where the liquid resin M supplied from the resin supply nozzle 183 contacts the sheet S (refer to Figure 4 ), the higher the wettability of this surface, the easier it is for the liquid resin M to spread on the sheet S.

[0050] The reason for improving wettability by irradiating the surface of sheet S with ultraviolet rays is that the surface is modified by growing hydrophilic functional groups such as OH groups, CO groups, CHO groups, and COOH groups on the surface of sheet S. In more detail, by ultraviolet rays, oxygen molecules in the air are decomposed to produce ozone, and then active oxygen is generated from ozone. The generated active oxygen reacts with the molecules on the surface of sheet S whose molecular bonds are cut by ultraviolet rays to form new functional groups such as hydroxyl groups (also called hydroxyl groups. OH), carbonyl groups (CO), aldehyde groups (CHO), and carboxyl groups (COOH). These functional groups show high wettability, that is, hydrophilicity. Therefore, by irradiating the surface of sheet S with ultraviolet rays to improve wettability, the liquid resin M can easily spread on sheet S.

[0051] The insertion and removal mechanism 28 is configured to be rotatable around a rotation axis oriented in the Z-axis direction, and includes a support portion 281 that accommodates the rotation axis and a support portion 282 that extends in the horizontal direction from the support portion 281. The sheet wettability forming unit 27 is fixed to a recessed portion of the support portion 282 that opens toward the glass stage 16 side, and faces the glass stage 16 side. As the insertion and removal mechanism 28 rotates around the rotation axis, the sheet wettability forming unit 27 moves from the outside to the inside of the space between the glass stage 16 and the wafer holding portion 20 or from the inside to the outside together with the support portion 282. Thus, the sheet wettability forming unit 27 is inserted or removed from between the glass stage 16 and the wafer holding portion 20.

[0052] The protective member forming device 1 is centrally controlled by a control unit 40. The control unit 40 includes a processor that executes various processes and a storage unit (memory) that stores various parameters, programs, etc. The storage unit of the control unit 40 includes, as part of a control program, a program that controls the wafer wettability forming unit 27 to irradiate ultraviolet rays to the wafer S to improve the wettability of the surface of the wafer S in a series of processes for forming a protective member on the wafer W.

[0053] According to the protective member forming apparatus 1 configured as above, the wettability of the surface of the sheet S can be improved by the sheet wettability forming unit 27, so that the liquid resin M dropped onto the sheet S can be easily spread. Therefore, when the liquid resin M is sandwiched between the wafer W and the sheet S, the liquid resin M can be spread over the entire surface of the wafer W in a short time, and the protective member can be efficiently formed in a short time.

[0054] In addition, in a state with high wettability, that is, in a state where the contact angle is small and the adhesive is well adapted to the surface of the adhered material, the adhesiveness is also improved, and therefore, the improvement of the wettability of the surface of the sheet S also contributes to the improvement of the adhesiveness between the sheet S and the liquid resin M. Therefore, according to the protective member forming apparatus 1, a protective member that is firmly adhered to the wafer W can be formed.

[0055] Next, a method for forming a protective member performed by the protective member forming apparatus 1 of the present embodiment will be described in detail. Figures 2 to 7 The respective steps in forming the protective member are shown. Figure 2 It is an explanatory diagram showing a sheet supplying process. Figure 3 It is an explanatory diagram showing the wettability forming step. Figure 4 It is an explanatory diagram showing the liquid resin supplying step. Figure 5 It is an explanatory diagram showing a wafer holding process. Figure 6 It is an explanatory diagram showing the development process. Figure 7 It is an explanatory diagram showing the curing process.

[0056] Figure 2 4 shows a sheet carrying process in the formation of the protective member. In the sheet carrying process, the sheet conveying mechanism 17 is controlled by the control unit 40. The sheet conveying mechanism 17 clamps the end of the sheet S with the clamping unit 173 and moves the arm 172 in the +Y direction (refer to Figure 1 ) is moved. Thus, the sheet S is pulled out from the sheet supply unit 171 and conveyed to the glass stage 16. The pulled out sheet S is cut into a predetermined length.

[0057] The control unit 40 operates the suction source to apply suction force to the suction holes 163 and 164. Thus, the sheet S placed on the glass stage 16 is suctioned and held on the glass stage 16. The area of ​​the sheet S at this stage is larger than the area of ​​the lower surface Wb of the wafer W.

[0058] Figure 3 1 shows a wettability forming step in the formation of the protective member. In the wettability forming step, the sheet wettability forming unit 27 is positioned above the sheet S placed on the glass stage 16 in the sheet carrying step. This positioning is performed by rotating the insertion and removal mechanism 28 by the control unit 40 to insert the support part 282 to which the sheet wettability forming unit 27 is fixed between the glass stage 16 and the wafer holding part 20.

[0059] After the sheet wettability forming unit 27 is positioned, the sheet wettability forming unit 27 is controlled by the control unit 40 so that the sheet wettability forming unit 27 irradiates the surface of the sheet S held on the glass stage 16 with ultraviolet rays. The surface of the sheet S irradiated with ultraviolet rays is the surface Sa opposite to the surface Sb of the sheet S held on the glass stage 16. Thus, the wettability of the surface (surface Sa) of the sheet S is improved. When the irradiation of ultraviolet rays is completed, the control unit 40 rotates the insertion and removal mechanism 28 to withdraw the sheet wettability forming unit 27 from above the glass stage 16, completing the wettability forming process.

[0060] Figure 4 1 shows a liquid resin supplying step in forming the protective member. In the liquid resin supplying step, the resin supplying nozzle 183 of the resin supplying mechanism 18 is positioned above the sheet S whose surface wettability is improved in the sheet wettability forming step. The resin supplying nozzle 183 is positioned above the center of the glass stage 16. This positioning is performed by the sheet conveying mechanism 17 being controlled by the control unit 40 and the sheet conveying mechanism 17 moving the arm 172 in the Y-axis direction.

[0061] After the resin supply nozzle 183 is positioned, the controller 40 controls the dispenser 181 so that the dispenser 181 delivers the liquid resin M from the container 184 to the resin supply nozzle 183 , and the liquid resin M is dripped toward the sheet S from the resin supply nozzle 183 .

[0062] The liquid resin M dripped from the resin supply nozzle 183 falls to the vicinity of the center of the surface Sa of the sheet S. Since the surface Sa of the sheet S has improved wettability by the previous steps, the liquid resin M spreads from the vicinity of the center toward the periphery after falling.

[0063] In addition, the control unit 40 controls the dispenser 181 based on information such as the size of the wafer W, and supplies the liquid resin M in an amount (predetermined amount) covering the entire lower surface Wb of the wafer W to the sheet S. When the supply of the predetermined amount of liquid resin M is completed, the control unit 40 moves the arm 172 to retract the resin supply nozzle 183 from above the glass stage 16, thereby completing the liquid resin supply process.

[0064] Figure 5 The wafer holding process in the formation of the protective component is shown. Figure 5 FIG. 2 shows a state in which the wafer holding section 20 holds the wafer W in the wafer holding step. In the wafer holding step, the protective member H (see FIG. 2 ) is taken out from the cassette C by the first transport mechanism 12. Figure 7) before the wafer W. Then, the wafer W is handed over to the second transfer mechanism 25, and the wafer W is transferred to the wafer holding part 20. In the wafer holding part 20, the suction source is operated to exert suction force on the porous member 202. The wafer holding part 20 uses the suction force to attract the upper surface Wa of the wafer W and hold it on the wafer holding surface 203.

[0065] In addition, at least a part of the wafer holding step may be performed in parallel (simultaneously) with the wafer carrying step, the wettability forming step, and the liquid resin supplying step.

[0066] Figure 6 FIG. 2 shows a development process in the formation of the protective member. The wafer W held by the wafer holding portion 20 is in a state where it is located above the liquid resin M on the sheet S (see FIG. 2 ). Figure 5 ) and then enter Figure 6 In the pushing step, the control unit 40 controls the motor 214 of the lifting mechanism 21 to lower the lifting table 213 and the holding table 201 at a predetermined feed speed.

[0067] By keeping the worktable 201 lowered, the lower surface Wb of the wafer W approaches the glass stage 16 and contacts the liquid resin M. Then, the liquid resin M is pressed by the lower surface Wb of the wafer W, and the liquid resin M is pushed in the radial direction of the wafer W. The liquid resin M before contacting the lower surface Wb of the wafer W is in a state of spreading to a certain extent after being dripped onto the surface Sa of the sheet S due to the high wettability of the surface Sa. By pressing the liquid resin M that has spread to a certain extent with the wafer W, the liquid resin M is further spread toward the outer edge side of the wafer W, and the entire surface of the wafer W can be covered with the liquid resin M in a short time.

[0068] Furthermore, in the case of adjusting the descending amount of the holding stage 201 according to the spreading state of the liquid resin M, the motor 214 may be controlled by the control unit 40 based on the detection result of the load detection unit 22 .

[0069] Figure 7The curing process in the formation of the protective member is shown. In the curing process, the ultraviolet irradiation unit 23 is controlled by the control unit 40, and the ultraviolet irradiation unit 23 irradiates ultraviolet rays of intensity and wavelength that cure the liquid resin M. More specifically, the ultraviolet rays emitted from the ultraviolet irradiation unit 231 to the mounting surface 161 pass through the glass stage 160 and the sheet S and reach the liquid resin M, which is an ultraviolet curable resin, to cure the liquid resin M. When the liquid resin M becomes a fully cured state, the ultraviolet irradiation unit 23 ends the ultraviolet irradiation. By curing the liquid resin M, the protective member H composed of the resin HM obtained by curing the liquid resin M and the sheet S is formed in a manner that covers the entire lower surface Wb of the wafer W, and the lower surface Wb of the wafer W is protected by the protective member H that covers the entire lower surface Wb of the wafer W.

[0070] In the above-described embodiment, in the process of forming the protective member H, the wettability of the surface of the sheet S constituting the protective member H is improved before the liquid resin M is supplied. Therefore, even when no special sheet is used and, for example, the same sheet as in the related art is used, the liquid resin M can be spread over the entire lower surface Wb of the wafer W in a short time, and as a result, the protective member H can be efficiently formed in a short time.

[0071] Alternatively, the liquid resin M may be spread after the wettability of the lower surface Wb of the wafer W is improved.

[0072] In addition, due to the improvement of the wettability of the surface, the adhesive force between the liquid resin M functioning as an adhesive and the sheet S is improved. Therefore, the protective member H firmly bonded to the wafer W can be formed.

[0073] In addition, the protective member H will be peeled off later, so a resin with good re-peelability is selected in advance as the liquid resin M. Therefore, even if the adhesive force is increased due to the improvement of wettability, peeling will not be too difficult. In addition, when peeling the protective member H from the wafer W, the protective member H can also be ground with a grinding tool. At this time, the protective member H can also be irradiated with ultraviolet rays again to further solidify the protective member H and then ground with a grinding tool.

[0074] Figure 8 This is an explanatory diagram showing another example of the wettability forming step in forming the protective member. Fig. 9 It is an explanatory diagram showing another example of the liquid resin supplying step in forming the protective member.

[0075] In the above-mentioned embodiment, an example is shown in which the resin supplying nozzle 183 supplies liquid resin M to the sheet S held on the glass table 16, but the resin supplying nozzle 183 is not limited to supplying liquid resin M to the sheet S held on the glass table, and can also supply liquid resin M to the chip W held on the chip holding part.

[0076] Below, refer to Figure 8 and Fig. 9 A method for forming a protective member by a protective member forming apparatus according to another embodiment of the present invention will be described. The protective member forming apparatus supplies a liquid resin M onto a wafer W to form a protective member H.

[0077] First, for Figure 8 and Fig. 9 The structure of the protective member forming device of the present embodiment shown in the figure is different from the protective member forming device 1. The protective member forming device of the present embodiment is different from the protective member forming device 1 in that: a sheet holding portion 50 is provided instead of the glass stage 16 as the sheet holding portion; a wafer holding portion 70 is provided instead of the wafer holding portion 20; the lifting mechanism 21 lifts and lowers the sheet holding portion 50 instead of the wafer holding portion 70; and a wafer wettability forming unit 32 is provided in addition to the sheet wettability forming unit 31. In addition, in the present embodiment, a case where a wafer W having a wafer sheet WS attached to a surface on which bumps B are formed is used is described as an example.

[0078] The sheet holding portion 50 is different from the glass stage 16 in that the holding surface 511 is arranged in a state facing vertically downward, and the other structures are the same as the glass stage 16. The sheet holding portion 50 is a glass stage in a broad sense that holds the sheet S and includes a glass stage 51 and a support stage 54. The glass stage 51 and the support stage 54 correspond to the glass stage 160 and the support stage 162 of the glass stage 16, respectively.

[0079] The sheet holding portion 50 is similar to the glass stage 16 in that it contains an ultraviolet irradiation unit 53 including a plurality of ultraviolet irradiation sections 531. The sheet holding portion 50 is also similar to the glass stage 16 in that it sucks and holds the sheet S. The sheet holding portion 50 operates the suction source 60 to generate suction force on the holding surface 511 of the sheet holding portion 50 via the suction path 52, thereby sucking and holding the sheet S on the holding surface 511. The ultraviolet irradiation unit 53 and the ultraviolet irradiation section 531 correspond to the ultraviolet irradiation unit 23 and the ultraviolet irradiation section 231, respectively.

[0080] The wafer holding part 70 is different from the wafer holding part 20 in that the wafer holding surface 73 is arranged in a state facing vertically upward, and the other structures are the same as those of the wafer holding part 20. The wafer holding part 70 includes a holding table 71 and a porous member 72, and the wafer holding surface 73, which is the surface of the porous member 72, is operated by the suction source 80 to generate suction force, so that the wafer W is sucked and held on the wafer holding surface 73. The holding table 71, the porous member 72, and the wafer holding surface 73 correspond to the holding table 201, the porous member 202, and the wafer holding surface 203 of the wafer holding part 20, respectively.

[0081] In the protective component forming device of the present embodiment, the configuration of the sheet holding part 50 (glass table 16) and the chip holding part 70 (chip holding part 20) is upside down with respect to the protective component forming device 1, so that the liquid resin M discharged from the resin supply nozzle 183 drips onto the chip W, and more specifically, drips onto the upper surface of the chip sheet WS adhered to the surface of the chip W, that is, the surface WSa.

[0082] In order to make the dripped liquid resin M spread on the surface WSa, it is desirable that the surface WSa has high wettability. In addition, the liquid resin M is sandwiched between the surface WSa and the lower surface of the sheet S held in the sheet holding portion 50, that is, the surface Sa, and is spread in the radial direction of the wafer W. Therefore, in order to make the liquid resin M spread in a short time, it is preferred that the two surfaces contacted by the liquid resin M have high wettability, that is, not only the surface WSa of the wafer W but also the surface Sa of the sheet S have high wettability. In view of this, the protective component forming device of the present embodiment has a sheet wettability forming unit 31 and a wafer sheet wettability forming unit 32.

[0083] The sheet wettability forming unit 31 irradiates ultraviolet rays to the surface (surface Sa) of the sheet S held by the sheet holding portion 50 (glass stage), thereby improving the wettability of the surface (surface Sa) of the sheet S. In contrast, the wafer sheet wettability forming unit 32 irradiates ultraviolet rays to the surface WSa of the wafer sheet WS attached to the surface of the wafer W held by the wafer holding portion 70, thereby improving the wettability of the surface WSa of the wafer sheet WS. The sheet wettability forming unit 31 and the wafer sheet wettability forming unit 32 are fixed to the insertion and removal mechanism 30, which is provided near the sheet holding portion 50 and the wafer holding portion 70.

[0084] The insertion and removal mechanism 30 is configured to be rotatable around a rotation axis oriented in the Z-axis direction, and includes a support portion 300 that accommodates the rotation axis, and a support portion 301 and a support portion 302 that extend in the horizontal direction from the support portion 300. The support portion 301 and the support portion 302 are supported by the support portion 300 in a state of being overlapped up and down. The sheet wettability forming unit 31 is fixed to a recessed portion of the support portion 301 that opens toward the sheet holding portion 50, of the support portion 301 and the support portion 302, and faces the sheet holding portion 50. The wafer wettability forming unit 32 is fixed to a recessed portion of the support portion 302 that opens toward the wafer holding portion 70, of the support portion 301 and the support portion 302, and faces the wafer holding portion 70.

[0085] As the insertion and removal mechanism 30 rotates around the rotation axis, the sheet wettability forming unit 31 and the wafer wettability forming unit 32 move from the outside to the inside or from the inside to the outside of the space between the sheet holding part 50 and the wafer holding part 70 together with the support parts 301 and 302. Thus, the sheet wettability forming unit 31 and the wafer wettability forming unit 32 are inserted or removed from between the sheet holding part 50 and the wafer holding part 70.

[0086] In the protective component forming device of the present embodiment constructed as described above, the protective component is also formed in a similar order to the protective component forming device 1. Specifically, first, the protective component forming device performs a sheet supplying process and a wafer holding process. Thus, the sheet S and the wafer W are held in the sheet holding portion 50 and the wafer holding portion 70, respectively. Then, the protective component forming device performs Figure 8 The wettability formation process shown.

[0087] Figure 8 FIG. 2 shows a wettability forming step in forming the protective member. In the wettability forming step, the sheet wettability forming unit 31 and the wafer sheet wettability forming unit 32 are positioned between the wafer holding part 70 and the sheet holding part 50. This positioning is performed by rotating the insertion and removal mechanism 30 by the control part 40 to insert the support part 301 to which the sheet wettability forming unit 31 is fixed and the support part 302 to which the wafer sheet wettability forming unit 32 is fixed between the sheet holding part 50 and the wafer holding part 70.

[0088] After the sheet wettability forming unit 31 and the wafer wettability forming unit 32 are positioned, the sheet wettability forming unit 31 and the wafer wettability forming unit 32 are controlled by the control unit 40, so that the sheet wettability forming unit 31 irradiates ultraviolet light to the surface Sa of the sheet S held by the sheet holding unit 50, and the wafer wettability forming unit 32 irradiates ultraviolet light to the surface WSa of the wafer WS of the wafer W held by the wafer holding unit 70. Thus, the wettability of the surfaces (surface Sa, surface WSa) of the sheet S and the wafer WS is improved.

[0089] When the ultraviolet irradiation is completed, the control unit 40 rotates the insertion and removal mechanism 30 to withdraw the sheet wettability forming unit 31 and the wafer wettability forming unit 32 from between the sheet holding unit 50 and the wafer holding unit 70, completing the wettability forming process. When the wettability forming process is completed, the liquid resin supply process is performed.

[0090] Fig. 9 The liquid resin supplying step in forming the protective member is shown. In the liquid resin supplying step, the resin supplying nozzle 183 is positioned above the wafer WS whose surface wettability is improved by the wafer wettability forming step. The resin supplying nozzle 183 is positioned above the center of the wafer holding portion 70 .

[0091] After the resin supply nozzle 183 is positioned, the controller 40 controls the dispenser 181, so that the dispenser 181 delivers the liquid resin M from the container 184 to the resin supply nozzle 183, and the liquid resin M is dripped from the resin supply nozzle 183 toward the wafer WS. The liquid resin M dripped from the resin supply nozzle 183 falls to the vicinity of the center of the surface WSa of the wafer WS. The surface WSa of the wafer WS has improved wettability through the previous process, so the liquid resin M spreads from the vicinity of the center toward the periphery after falling. When the liquid resin supply process is completed, the spreading process is performed.

[0092] In the spreading process, the motor 214 of the lifting mechanism 21 is controlled by the control unit 40 to lower the support table 54 at a predetermined feed speed. As the support table 54 is lowered, the surface Sa of the sheet S approaches the wafer holding portion 70 and contacts the liquid resin M. Then, the liquid resin M is pressed by the surface Sa of the sheet S, and the liquid resin M is spread in the radial direction of the wafer W. The liquid resin M before contacting the surface Sa of the sheet S is in a state of spreading to a certain extent due to the high wettability of the surface WSa after being dripped onto the surface WSa of the wafer WS. By pressing the liquid resin M that has spread to a certain extent with the wafer W, the liquid resin M is further spread toward the outer edge side of the wafer W, and the entire surface of the wafer W can be covered with the liquid resin M in a short time. In particular, in this embodiment, ultraviolet rays are irradiated not only to the surface WSa of the wafer WS, but also to the surface Sa of the sheet S to improve the wettability of the two surfaces sandwiching the liquid resin M, so that the liquid resin M is more easily spread. Therefore, the liquid resin M can be spread to the entire surface of the wafer W in a shorter time.

[0093] Finally, a curing step is performed. In the curing step, the ultraviolet irradiation unit 53 is controlled by the control unit 40, and the ultraviolet irradiation unit 53 irradiates ultraviolet rays of intensity and wavelength that cure the liquid resin M. As a result, the liquid resin M is cured, and a protective member consisting of the resin obtained by curing the liquid resin M and the sheet S is formed on the wafer sheet WS. The curing step is different from the protective member forming device 1 except that the ultraviolet rays are irradiated from above. Figure 7 The curing procedure shown is the same.

[0094] In the above-described embodiment, in the process of forming the protective member, the wettability of the surface of the adherend (sheet S, wafer W) in contact with the liquid resin is improved before providing the liquid resin M. Therefore, the liquid resin M can be spread between the sheet S and the wafer W over the entire upper surface of the wafer WS of the wafer W in a short time, and as a result, the protective member H can be efficiently formed in a short time.

[0095] Alternatively, after grinding the surface of the wafer W opposite to the surface on which the protective member H is formed using a grinding tool, a dicing tape may be attached to the ground surface and the annular frame, the wafer may be mounted on the annular frame, and then the protective member H may be removed together with the wafer WS.

[0096] In addition, the embodiments of the present invention are not limited to the above-mentioned embodiments, and various changes, substitutions, and deformations can be made within the scope of the main idea of ​​the present invention. Moreover, according to the progress of technology or other derived technologies, as long as the technical idea of ​​the present invention can be realized in other ways, the method can also be used for implementation. Therefore, the claims cover all embodiments that can be included in the scope of the technical idea of ​​the present invention.

[0097] In the above-mentioned embodiment, an example is shown in which the wettability forming unit irradiates ultraviolet rays to the surface to improve wettability, but the wettability forming unit may also irradiate plasma instead of or in addition to ultraviolet rays. When the wettability forming unit irradiates plasma, hydrophilic functional groups such as OH groups, CO groups, CHO groups, and COOH groups are formed on the surface by oxygen plasma, so wettability can be improved in the same way as when irradiating ultraviolet rays.

[0098] In the above-mentioned embodiment, an example is shown in which the sheet wettability forming unit irradiates ultraviolet rays to the surface to improve wettability, but the sheet wettability forming unit may also irradiate plasma instead of or in addition to ultraviolet rays. When the sheet wettability forming unit irradiates plasma, hydrophilic functional groups such as OH groups, CO groups, CHO groups, and COOH groups are formed on the surface by oxygen plasma, so wettability can be improved in the same way as when irradiating ultraviolet rays.

[0099] In the above-mentioned embodiment, a glass table is exemplified as a sheet holding portion for holding the placed sheet S, but the sheet holding portion is not limited to a glass table as long as it is a table for holding the sheet S. In addition, when the curing unit is configured to apply an external stimulus to the liquid resin via the sheet holding portion, the sheet holding portion is preferably a structure that does not hinder the transmission of the external stimulus. For example, when the external stimulus is ultraviolet light as in the above-mentioned embodiment, the sheet holding portion is preferably a table made of a light-transmitting material, such as a glass table.

[0100] In the above-mentioned embodiment, the example in which the lifting mechanism 21 is configured to lift the wafer holding part 20 relative to the glass stage 16 functioning as the sheet holding part and the example in which the lifting mechanism 21 lifts the sheet holding part 50 (glass stage 51) relative to the wafer holding part 70 are shown. That is, the lifting mechanism 21 only needs to be configured to lift the wafer holding part and the sheet holding part relative to each other, and may lift only one of the wafer holding part and the sheet holding part, or may lift both of them.

[0101] Industrial Applicability

[0102] As described above, in the protective component forming device of the present invention, the wettability of the surface of the sheet in contact with the liquid resin is improved, so that the liquid resin can be easily spread and the adhesion after curing can be improved. Therefore, a protective component that is firmly bonded to the surface of the wafer can be formed in a short time, and it is useful in a protective component forming device that forms a protective component on the surface of a wafer using a liquid resin.

Claims

1. A protective member forming device, which spreads and solidifies a liquid resin on the entire surface of one surface of a wafer to form a protective member for protecting the entire surface of the one surface of the wafer, wherein: The protective component forming device comprises: a sheet holding portion that holds the sheet; a wafer holding portion, which is arranged opposite to the sheet holding portion and holds the wafer; a liquid resin supply nozzle for supplying liquid resin onto the chip held by the chip holding portion or onto the wafer held by the wafer holding portion; a lifting mechanism for lifting and lowering the sheet holding portion relative to the wafer holding portion; a curing unit that applies an external stimulus to the liquid resin to cure the liquid resin; and The wettability improving means irradiates ultraviolet rays or plasma onto the surface of the sheet held by the sheet holding portion to improve the wettability of the surface of the sheet.

2. The protective member forming device according to claim 1, wherein: The protective component forming device has a wafer piece wettability forming unit, which irradiates ultraviolet rays or plasma to the surface of the wafer piece attached to the surface of the wafer held by the wafer holding part, thereby improving the wettability of the surface of the wafer piece.

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