Uniform flattening equipment for semiconductor film preparation

Abstract

The invention discloses semiconductor film preparation uniform flattening equipment which comprises a supporting plate, a motor is fixedly connected to the outer wall of the supporting plate, a clamping plate is fixedly connected to the inner wall of the supporting plate, a rotating rod is rotatably connected to the inner wall of the supporting plate, a conveying roller is fixedly connected to the outer wall of the rotating rod, and one end of the rotating rod is fixedly connected with the output end of the motor. A scraping mechanism is arranged in the supporting plate, and relates to the technical field of semiconductors, the scraping mechanism is arranged, a telescopic rod is shortened when descending, a supporting block extrudes a spring at the bottom to enable the spring to deform, and after the scraping plate descends, the top of the scraping plate is kept to be attached to the bottom of a film through the elastic force of the spring; and along with conveying of the conveying rollers during attaching, the bottom of the thin film is continuously scraped through the top of a scraping plate, the bottom of the thin film is scraped, wiped and cleaned up, abutting and flattening of the thin film are achieved, and straightening of the thin film is achieved to prevent bending and folding.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to a semiconductor film preparation and uniform flattening device. Background Art

[0002] Semiconductor film refers to a thin film formed by semiconductor materials. Materials with a bandgap width less than 2eV are usually called semiconductors. The conductivity at room temperature varies with the bandgap width. Since the carrier free path in single crystal thin films is long and the mobility is large, high-quality pn junctions can be produced by diffusion doping, so high-quality microelectronic devices can be manufactured. In molecular beam epitaxy technology, long-period superlattice films can be alternately epitaxially grown, becoming the basic material for quantum electronic devices; A flattening structure for preparing a low-dimensional semiconductor film described in a patent application with a reference publication number of CN217229662U, specifically a flattening structure for preparing a low-dimensional semiconductor film, relates to the field of flattening technology, and includes a base, a first support plate is fixedly connected to one side of the top of the base, and a second support plate is fixedly connected to the other side of the top of the base, and the first support plate and the second support plate can support the first pressure roller and the second pressure roller, and the film can be flattened by the first pressure roller and the second pressure roller, and the distance between the first pressure roller and the second pressure roller is reduced by adjusting the height of the second pressure roller, thereby increasing the pressure on the film; Currently, when semiconductor films are flattened by conveyor rollers, it is easy for dust and debris to adhere to the side of the film that needs to be used during storage and transportation, causing the dust and debris to be pressed into the film when the conveyor rollers roll and transport, causing permanent quality damage to the film. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a semiconductor thin film preparation and uniform flattening device to solve the above-mentioned problems.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor thin film preparation uniform flattening device, comprising a support plate, the outer wall of the support plate is fixedly connected to a motor, the inner wall of the support plate is fixedly connected to a clamping plate, the inner wall of the support plate is rotatably connected to a rotating rod, the outer wall of the rotating rod is fixedly connected to a conveying roller, one end of the rotating rod is fixedly connected to an output end of the motor, and a scraping mechanism is arranged inside the support plate; The scraping mechanism comprises: The scraper is a U-shaped plate structure, the bottom of the scraper is fixedly connected to a fixed plate, the outer wall of the scraper is fixedly connected to a slider, the outer wall of the slider is slidably connected to the inner wall of the support plate, and the scraper is used to be pressed by the film to play the role of lifting; A support block, which is a square block structure, a telescopic rod is fixedly connected to the bottom of the support block, one end of the telescopic rod is fixedly connected to the bottom of the inner wall of the support plate, a spring is fixedly connected to the bottom of the support block, one end of the spring is fixedly connected to the bottom of the inner wall of the support plate, and the support block is used to support the fixed plate.

[0005] Preferably, the outer wall of the scraper is fixedly connected to a dust removal plate A, the bottom middle part of the inner wall of the support plate is fixedly connected to a long plate, the top of the long plate is fixedly connected to a square plate, and the top of the square plate is rotatably connected to a rotating ball, so that the hinged rod can be hinged and rotated through the rotating ball.

[0006] Preferably, the top of the rotating ball is fixedly connected to a hinged rod, one end of the hinged rod is hinged to a magnetic block, the top of the magnetic block is slidably connected to the bottom of the dust falling plate A, the outer wall of the magnetic block is fixedly connected to a connecting plate, and the outer wall of the connecting plate is fixedly connected to a spring, so that the support block is pushed to reset by the spring.

[0007] Preferably, a magnetic scraper is slidably connected to the top of the dust removal plate A, a connecting rod is provided above the magnetic scraper, and a beating mechanism is provided inside the support plate.

[0008] Preferably, the beating mechanism includes a rotating shaft, a roller is fixedly connected to the outer wall of the rotating shaft, a plane bearing is arranged outside the rotating shaft, a thin telescopic rod is fixedly connected to the outer wall of the plane bearing, one end of the thin telescopic rod is in contact with the outer wall of the roller, and bristles are fixedly connected to the outer wall of the rotating shaft, so that brushing and cleaning are performed by the bristles.

[0009] Preferably, the outer wall of the plane bearing is fixedly connected with a strip, the outer wall of the strip is fixedly connected with an elastic rope, the outer wall of the magnetic scraper is fixedly connected with a scraper, and the top of the scraper is fixedly connected to one end of a connecting rod.

[0010] Preferably, a sliding groove is provided on the outer wall of the scraper, and the outer wall of the strip is slidably connected to the inner wall of the sliding groove, thereby realizing the sliding of the strip.

[0011] Preferably, the inner wall of the dust collecting plate A is inclined, and the outer wall of the scraper is fixedly connected with the dust collecting plate A, so as to collect dust.

[0012] Preferably, the bristles themselves are made of rubber material and are elastic, and the elastic rope itself is made of rubber material and is elastic, so that deformation and stretching are achieved through elasticity.

[0013] Preferably, the strip is a U-shaped strip structure, the outer wall of the strip is in contact with the outer wall of the bristles, the magnetic block and the magnetic scraper are magnetic, and the magnetism of the magnetic block and the magnetic scraper on the opposite side is that opposite poles attract each other, so that opposite poles attract each other and approach each other.

[0014] The present invention provides a semiconductor thin film preparation and uniform flattening device. It has the following beneficial effects: 1. The present invention provides a scraping mechanism, so that when the film is driven to be conveyed by the conveying roller, the film between the clamping plate and the conveying roller will be quickly tightened, and the film will be quickly straightened after being tightened, and the protruding scraper will be pressed down. After the scraper is pressed down, the support block and the telescopic rod will be driven down, and the telescopic rod will shorten itself when it descends, and the support block squeezes the spring at the bottom to deform the spring, and after the scraper is descended, the top of the scraper is kept in close contact with the bottom of the film by the elastic force of the spring, and with the conveying roller during the close contact, the bottom of the film will be continuously scraped by the top of the scraper, and the bottom of the film will be scraped and wiped clean, and the film will be pressed and flattened, so as to straighten the film and prevent it from bending and folding.

[0015] 2. The present invention provides a scraping mechanism. When the scraper is used, the sharper shape of the top of the scraper will scrape off all the residues adhering to the surface of the film through the scraper. The scraped dust residues will fall onto the dust collecting plate A and be collected by the dust collecting plate A. As the scraper is pressed down, the magnetic block at the bottom of the dust collecting plate A will be pushed by the articulated rod to slide horizontally toward the two sides of the dust collecting plate A at the bottom of the dust collecting plate A through the magnetic attraction between the magnetic block and the magnetic scraper. The magnetic scraper is driven to slide on the surface of the dust collecting plate A, and the residues dropped on the dust collecting plate A are pushed outward, thereby ensuring the cleanliness of the dust collecting plate A and avoiding the problem of excessive dust accumulation on the surface of the dust collecting plate A and overflow due to long-term cleaning and scraping of the film.

[0016] 3. The present invention sets a beating mechanism, which drives the roller and the rotating shaft to rotate when the film is driven to slide on the top of the scraper. The rotation of the rotating shaft drives the bristles to continuously rotate and brush the bottom of the film back and forth continuously, so as to quickly brush away the fine dust remaining in the gap at the top of the scraper after scraping, and continuously beat the film with the elastic force of the bristles to achieve vibration of the film. The beating and sweeping of the bristles further enhance the cleaning effect of the film, thereby ensuring the quality of the film after transmission.

[0017] 4. The present invention sets a beating mechanism, and when the film moves, it drives the roller and the bristles to rotate, so that the rotation of the bristles is continuously moved by the thin telescopic rod. Because the thin telescopic rod is limited by the moving bar through the plane bearing, when the bristles are moved by the moving bar to slide horizontally, they are also continuously contacted and moved with the thin telescopic rod through the vertical rotation. The residues adhered to the film by the bristles themselves when cleaning the film are shaken off as the elastic force of the bristles rebounds, thereby ensuring the cleanliness of the bristles and further improving the cleaning effect on the film, avoiding the secondary contamination of the film caused by stains adhered to the bristles. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 The structure of the scraping mechanism of the present invention is shown in FIG. Figure 1 ; Figure 3 The structure of the scraping mechanism of the present invention is shown in FIG. Figure 2 ; Figure 4 It is a schematic diagram of the disassembled structure of the scraping mechanism of the present invention; Figure 5 The structure of the scraping mechanism of the present invention is shown in FIG. Figure 3 ; Figure 6 For the present invention Figure 5 Enlarged view of point C; Figure 7 For the present invention Figure 3 A magnified image of point A; Figure 8 The structure of the scraping mechanism of the present invention is shown in FIG. Figure 4 ; Fig. 9 For the present invention Figure 3 The enlarged view of point B; Fig.10 The three-dimensional transformation of the scraping mechanism of the present invention Figure 1 ; Fig.11 The three-dimensional transformation of the scraping mechanism of the present invention Figure 2 ; Fig.12 It is a structural schematic diagram of the beating mechanism of the present invention; Fig.13 For the present invention Fig.12 Enlarged view of point D.

[0019] In the figure: 1 rotating rod, 2 supporting plate, 3 scraping mechanism, 301 scraper, 302 fixed plate, 303 slider, 304 supporting block, 305 spring, 306 telescopic rod, 307 dust falling plate A, 308 long plate, 309 square plate, 310 rotating ball, 311 hinged rod, 312 magnetic block, 313 magnetic scraper, 314 connecting rod, 315 spring, 316 connecting plate, 317 dust falling plate B, 4 beating mechanism, 401 rotating shaft, 402 roller, 403 bristles, 404 strip, 405 sliding groove, 407 scraper, 408 elastic rope, 409 plane bearing, 410 thin telescopic rod, 5 conveying roller, 6 clamping plate, 7 motor. DETAILED DESCRIPTION

[0020] For example, see Figure 1-3The present invention provides a technical solution: a semiconductor thin film preparation uniform flattening device, comprising a support plate 2, the outer wall of the support plate 2 is fixedly connected to a motor 7, the inner wall of the support plate 2 is fixedly connected to a clamping plate 6, the inner wall of the support plate 2 is rotatably connected to a rotating rod 1, the outer wall of the rotating rod 1 is fixedly connected to a conveying roller 5, one end of the rotating rod 1 is fixedly connected to the output end of the motor 7, and a scraping mechanism 3 is arranged inside the support plate 2; The scraping mechanism 3 comprises: The scraper 301 is a U-shaped plate structure. The bottom of the scraper 301 is fixedly connected to a fixed plate 302. The outer wall of the scraper 301 is fixedly connected to a slider 303. The outer wall of the slider 303 is slidably connected to the inner wall of the support plate 2. The scraper 301 is used to be pressed by the film to rise and fall. A support block 304, which is a square block structure, is fixedly connected to a telescopic rod 306 at the bottom of the support block 304, one end of which is fixedly connected to the bottom of the inner wall of the support plate 2, and is fixedly connected to a spring 305 at the bottom of the support block 304, one end of which is fixedly connected to the bottom of the inner wall of the support plate 2. The support block 304 is used to support the fixed plate 302; The semiconductor film is passed through the two clamping plates 6 and placed on the scraper 301, and then inserted into the conveying roller 5 through the scraper 301. At this time, the motor 7 is started to drive the rotating rod 1 and the conveying roller 5 to rotate, and the film passing through the conveying roller 5 is conveyed out. When the film is horizontally fed through the two clamping plates 6, the space between the clamping plates is enough for the film to pass through without clamping the film. After the film passes through, when it is lifted up and passes over 302, the film generates friction with the bottom of the upper clamping plate. When the transmission roller transmits the film, the friction resistance between the film and the bottom of the upper clamping plate 6 tightens the film and can scrape off part of the dust and residue on the film, so that when the film is driven to be conveyed by the conveying roller 5, the clamping plate The film between the scraper 306 and the conveying roller 5 is quickly tightened, and the film is quickly straightened after being tightened, and the protruding scraper 301 is pressed down. After the scraper 301 is pressed down, the support block 304 and the telescopic rod 306 are driven to descend. When the telescopic rod 306 descends, it shortens itself, and the support block 304 squeezes the spring 305 at the bottom, so that the spring 305 is deformed, and after the scraper 301 descends, the elastic force of the spring 305 keeps the top of the scraper 301 close to the bottom of the film, and with the transmission of the conveying roller 5 during the close contact, the bottom of the film will be continuously scraped by the top of the scraper 301, the bottom of the film is scraped and wiped clean, and the film is pressed and flattened, so that the film is straightened to prevent bending and folding; Example 2, based on Example 1, please refer to Figure 1-9The present invention provides a technical solution: a dust removal plate A307 is fixedly connected to the outer wall of the scraper 301, a long plate 308 is fixedly connected to the middle part of the bottom inner wall of the support plate 2, a square plate 309 is fixedly connected to the top of the long plate 308, and a rotating ball 310 is rotatably connected to the top of the square plate 309.

[0021] A hinged rod 311 is fixedly connected to the top of the rotating ball 310, and a magnet 312 is hinged at one end of the hinged rod 311. The top of the magnet 312 is slidably connected to the bottom of the dust falling plate A307. The outer wall of the magnet 312 is fixedly connected to a connecting plate 316, and the outer wall of the connecting plate 316 is fixedly connected to a spring 315.

[0022] A magnetic scraper 313 is slidably connected to the top of the dust removal plate A307, a connecting rod 314 is arranged above the magnetic scraper 313, and a beating mechanism 4 is arranged inside the support plate 2; The scraper 301 has a sharp top and a sharp shape, and when scraping the film surface, all the residues adhering to the film surface will be scraped off, and the scraped dust residues will fall onto the dust dropping plate A307 and be collected by the dust dropping plate A307. When the scraper 301 is pressed down, the hinge rod 311 is pressed downward and moves to both sides, pushing the magnetic block 312 at the bottom of the dust dropping plate A307 to slide horizontally to both sides of the dust dropping plate A307 at the bottom of the dust dropping plate A307, and through the magnetic attraction between the magnetic block 312 and the magnetic scraper 313, the magnetic scraper 313 is driven to slide on the surface of the dust dropping plate A307, pushing the residues dropped onto the dust dropping plate A307 outward, thereby ensuring the cleanliness of the dust dropping plate A307 and avoiding the problem of excessive dust accumulation on the surface of the dust dropping plate A307 and overflow due to long-term cleaning and scraping of the film. For example 3, please refer to Figure 1-13 On the basis of Embodiment 1 and Embodiment 2, the present invention provides a technical solution: the beating mechanism 4 includes a rotating shaft 401, the outer wall of the rotating shaft 401 is fixedly connected to a roller 402, a plane bearing 409 is arranged outside the rotating shaft 401, a thin telescopic rod 410 is fixedly connected to the outer wall of the plane bearing 409, one end of the thin telescopic rod 410 is in contact with the outer wall of the roller 402, and the outer wall of the rotating shaft 401 is fixedly connected to bristles 403.

[0023] The outer wall of the plane bearing 409 is fixedly connected with a shift bar 404 , the outer wall of the shift bar 404 is fixedly connected with an elastic rope 408 , the outer wall of the magnetic scraper 313 is fixedly connected with a scraper 407 , and the top of the scraper 407 is fixedly connected to one end of the connecting rod 314 .

[0024] A sliding groove 405 is formed on the outer wall of the scraper 301 , and the outer wall of the shift bar 404 is slidably connected to the inner wall of the sliding groove 405 .

[0025] The inner wall of the dust collecting plate A307 is inclined, and the outer wall of the scraper 301 is fixedly connected with the dust collecting plate A317.

[0026] The bristles 403 are made of rubber and are elastic, and the elastic rope 408 is made of rubber and is elastic.

[0027] The strip 404 is a U-shaped strip structure, and the outer wall of the strip 404 contacts the outer wall of the bristle 403. The magnetic block 312 and the magnetic scraper 313 are magnetic, and the magnetism of the opposite side of the magnetic block 312 and the magnetic scraper 313 is that opposite poles attract each other.

[0028] At the same time, when the film is driven to slide on the top of the scraper 301, the roller 402 and the rotating shaft 401 are driven to rotate. The rotation of the rotating shaft 401 drives the bristles 403 to rotate continuously to continuously brush the bottom of the film back and forth, so that the fine dust remaining due to the gap position on the top of the scraper 301 after scraping can be quickly brushed off, and the film is continuously slapped by the elastic force of the bristles 403 to achieve vibration of the film. The slapping and sweeping of the bristles 403 further improve the cleaning effect of the film, thereby ensuring the quality of the film after delivery. When the magnetic scraper 313 is driven to move on the surface of the dust falling plate A307, the connecting rod 314 will pull the bar 404 to move horizontally synchronously. When the bar 404 slides on the inner wall of the sliding groove 405, the bar 404 will pull the elastic rope 408 to deform, and the bristles 403 are continuously scraped horizontally through the movement of the bar 404. When the film moves, the roller 402 and the bristles 403 are driven to rotate, so that the bristles 403 are continuously moved by the thin telescopic rod 410 through the rotation. Because the thin telescopic rod 410 is limited by the sliding bar 404 through the plane bearing 409, when the bristles 403 are horizontally slid and moved by the sliding bar 404, they are also constantly in contact with and moved by the thin telescopic rod 410 through vertical rotation, so that the residues adhered to the bristles 403 when cleaning the film are shaken off as the elastic force of the bristles 403 rebounds, ensuring the cleanliness of the bristles 403 and further improving the cleaning effect on the film, avoiding the secondary contamination of the film caused by the stains adhered to the bristles 403.

[0029] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor thin film preparation and uniform flattening device, comprising a support plate (2), the outer wall of the support plate (2) being fixedly connected to a motor (7), the inner wall of the support plate (2) being fixedly connected to a clamping plate (6), the inner wall of the support plate (2) being rotatably connected to a rotating rod (1), the outer wall of the rotating rod (1) being fixedly connected to a conveying roller (5), one end of the rotating rod (1) being fixedly connected to an output end of the motor (7), characterized in that: A scraping mechanism (3) is provided inside the support plate (2); The scraping mechanism (3) comprises: A scraper (301), the scraper (301) being a U-shaped plate structure, the bottom of the scraper (301) being fixedly connected to a fixing plate (302), the outer wall of the scraper (301) being fixedly connected to a sliding block (303), the outer wall of the sliding block (303) being slidably connected to the inner wall of the support plate (2), and the scraper (301) being used to be pressed by the film to rise and fall; A support block (304), the support block (304) being a square block structure, a telescopic rod (306) being fixedly connected to the bottom of the support block (304), one end of the telescopic rod (306) being fixedly connected to the bottom of the inner wall of the support plate (2), a spring (305) being fixedly connected to the bottom of the inner wall of the support plate (2), and the support block (304) being used to support the fixed plate (302).

2. The semiconductor thin film preparation uniform flattening device according to claim 1, characterized in that: The outer wall of the scraper (301) is fixedly connected to a dust removal plate A (307), the middle part of the bottom of the inner wall of the support plate (2) is fixedly connected to a long plate (308), the top of the long plate (308) is fixedly connected to a square plate (309), and the top of the square plate (309) is rotatably connected to a rotating ball (310).

3. The semiconductor thin film preparation uniform flattening device according to claim 2, characterized in that: The top of the rotating ball (310) is fixedly connected to a hinged rod (311), one end of the hinged rod (311) is hingedly connected to a magnetic block (312), the top of the magnetic block (312) is slidably connected to the bottom of the dust falling plate A (307), the outer wall of the magnetic block (312) is fixedly connected to a connecting plate (316), and the outer wall of the connecting plate (316) is fixedly connected to a spring (315).

4. The semiconductor thin film preparation uniform flattening device according to claim 3, characterized in that: The top of the dust removal plate A (307) is slidably connected to a magnetic scraper (313), a connecting rod (314) is provided above the magnetic scraper (313), and a beating mechanism (4) is provided inside the support plate (2).

5. The semiconductor thin film preparation uniform flattening device according to claim 4, characterized in that: The beating mechanism (4) comprises a rotating shaft (401), the outer wall of the rotating shaft (401) being fixedly connected to a roller (402), a plane bearing (409) being arranged outside the rotating shaft (401), a thin telescopic rod (410) being fixedly connected to the outer wall of the plane bearing (409), one end of the thin telescopic rod (410) being in contact with the outer wall of the roller (402), and bristles (403) being fixedly connected to the outer wall of the rotating shaft (401).

6. The semiconductor thin film preparation uniform flattening device according to claim 5, characterized in that: The outer wall of the plane bearing (409) is fixedly connected to a shifting bar (404), the outer wall of the shifting bar (404) is fixedly connected to an elastic rope (408), the outer wall of the magnetic scraper (313) is fixedly connected to a scraper (407), and the top of the scraper (407) is fixedly connected to one end of the connecting rod (314).

7. The semiconductor thin film preparation and uniform flattening device according to claim 6, characterized in that: The outer wall of the scraper (301) is provided with a sliding groove (405), and the outer wall of the strip (404) is slidably connected to the inner wall of the sliding groove (405).

8. The semiconductor thin film preparation uniform flattening device according to claim 7, characterized in that: The inner wall of the dust falling plate A (307) is in an inclined shape, and the outer wall of the scraper (301) is fixedly connected to the dust falling plate A (317).

9. The semiconductor thin film preparation uniform flattening device according to claim 8, characterized in that: The bristles (403) are made of rubber and are elastic, and the elastic rope (408) is made of rubber and is elastic.

10. The semiconductor thin film preparation and uniform flattening device according to claim 9, characterized in that: The strip (404) is a U-shaped strip structure, the outer wall of the strip (404) contacts the outer wall of the bristles (403), the magnetic block (312) and the magnetic scraper (313) are magnetic, and the magnetism of the opposite sides of the magnetic block (312) and the magnetic scraper (313) is that opposite poles attract each other.

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