Method for processing array substrate with special-shaped boss and substrate

Abstract

The invention discloses a method for processing an array substrate with a special-shaped boss, which belongs to the technical field of material processing, and comprises the following steps: S1, preparing a substrate I, and cutting a groove I with a certain depth and width on the substrate I by using a grinding wheel blade I with a selected thickness I along a direction I, a second grinding wheel blade with a second selected thickness is used for cutting a second groove with the same depth but different widths in the second direction, and a second base plate with a boss is formed on the first base plate; s2, the top face of the boss is coated with a binding material; s3, a third substrate is prepared, and the second substrate and the third substrate are bonded together according to the bonding process conditions of the used bonding material; and S4, a third grinding wheel blade is adopted to cut off the connecting part in the middle of the boss on the second substrate in the first direction, then a fourth grinding wheel blade is adopted to cut off the connecting part in the middle of the boss on the second substrate in the second direction, and a fourth boss array substrate with a groove is formed. And the substrate with the special-shaped boss structure, which cannot be realized by singly scribing the grinding wheel blade, is formed.

Description

Technical Field

[0001] The invention belongs to the technical field of material processing, and in particular relates to a method for processing a substrate with an array of special-shaped bosses and a substrate. Background Art

[0002] The boss structure is widely used in electronic packaging bases (such as ceramic bases). Grooves of required depth and width are cut on the base by a grinding wheel blade at different angles to form boss arrays of different sizes and spacings.

[0003] The method of simply using a grinding wheel blade to scratch a boss array on a flat base at different angles cannot form the following boss structures with specific shape requirements:

[0004] (1) Arrays with chamfered terrace structures cannot be cut out simply by using a grinding wheel blade at different angles (such as Figure 1 shown);

[0005] (2) Boss structure with grooves (such as Figure 2 shown). Summary of the invention

[0006] The object of the present invention is to provide a method for processing a substrate with an array of irregular bosses to solve the above-mentioned defects.

[0007] A method for processing a substrate with an array of irregular bosses comprises the following steps:

[0008] S1: preparing a substrate 1, and cutting a groove 1 of a certain depth and width along direction 1 on the substrate 1 with a grinding wheel blade 1 of selected thickness 1, and then cutting a groove 2 of the same depth but different width along direction 2 with a grinding wheel blade 2 of selected thickness 2, to form a substrate 2 with a boss on the substrate 1;

[0009] S2: Applying adhesive material on the top surface of the boss;

[0010] S3: preparing a substrate three, and bonding the substrate two and the substrate three together according to the bonding process conditions of the bonding material used;

[0011] S4: using grinding wheel blade three to cut off the connected part in the middle of the boss on substrate two along direction one, and then using grinding wheel blade four to cut off the connected part in the middle of the boss on substrate two along direction two, to form a boss array substrate four with grooves.

[0012] Preferably, the longitudinal section angles at the cutting edges of the grinding wheel blade 1 and the grinding wheel blade 2 are both right angles or acute angles.

[0013] Preferably, the angle between the second direction and the first direction is between 15° and 165°.

[0014] Preferably, the materials of the substrate one and the substrate three are the same, and are any one of ceramic, glass, diamond, metal, and metal-based composite materials.

[0015] Preferably, the materials of the substrate one and the substrate three are different, and are any two of ceramic, glass, diamond, metal, and metal-based composite materials.

[0016] Preferably, the thickness of the grinding wheel blade three is less than the thickness of the grinding wheel blade one, and the thickness of the grinding wheel blade four is less than the thickness of the grinding wheel blade two.

[0017] The invention also discloses a substrate with an array of special-shaped bosses, which is manufactured by the method.

[0018] The present invention has the following beneficial effects:

[0019] The present invention integrates the method of using a grinding wheel blade to scribing and grooving combined with material bonding to form a substrate with a specific boss structure that cannot be achieved by scribing with a grinding wheel blade alone, and the overall processing technology is simple and easy to achieve. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1-2 There are two boss structures with specific shape requirements.

[0021] Figure 3 It is the processing flow chart of Example 1.

[0022] Figure 4 It is the processing flow chart of Example 2.

[0023] Figure 5 Longitudinal cross-sectional views of two different types of cutting blades.

[0024] Among them: A0-substrate one, A1-substrate two, B0-substrate three, B1-substrate four. DETAILED DESCRIPTION

[0025] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following embodiments will help those skilled in the art to better understand the invention.

[0026] Example 1

[0027] like Figure 3 As shown, a method for processing a substrate with an array of irregular bosses comprises the following steps:

[0028] S1: prepare a substrate A0, and cut a groove A of a certain depth and width along direction A on the substrate A0 using a grinding wheel blade A of selected thickness A, and then cut a groove A of the same depth but different width along direction A using a grinding wheel blade A of selected thickness B, to form a substrate A1 with a boss on the substrate A0, wherein the longitudinal section angles of the cutting edges of the grinding wheel blades A1 and A2 are right angles, so that the boss is in the shape of a right quadrangular prism;

[0029] S2: Applying adhesive material on the top surface of the boss;

[0030] S3: preparing a substrate three B0, and bonding the substrate two A1 and the substrate three B0 together according to the bonding process conditions of the bonding material used;

[0031] S4: Use grinding wheel blade three to cut off the connected part in the middle of the boss on substrate two A1 along direction one, and then use grinding wheel blade four to cut off the connected part in the middle of the boss on substrate two A1 along direction two to form a boss array substrate four B1 with grooves.

[0032] Example 2

[0033] like Figure 4 As shown, a method for processing a substrate with an array of irregular bosses comprises the following steps:

[0034] S1: prepare a substrate A0, and cut a groove A of a certain depth and width along direction A on the substrate A0 using a grinding wheel blade A of selected thickness A, and then cut a groove A of the same depth but different width along direction A using a grinding wheel blade A of selected thickness B, to form a substrate A1 with a boss on the substrate A0, wherein the longitudinal section angles of the cutting edges of the grinding wheel blades A1 and A2 are acute angles, so the boss is in the shape of a quadrangular pyramid;

[0035] S2: Applying adhesive material on the top surface of the boss;

[0036] S3: preparing a substrate three B0, and bonding the substrate two A1 and the substrate three B0 together according to the bonding process conditions of the bonding material used;

[0037] S4: Use grinding wheel blade three to cut off the connected part in the middle of the boss on substrate two A1 along direction one, and then use grinding wheel blade four to cut off the connected part in the middle of the boss on substrate two A1 along direction one to form a boss array substrate four B1 with grooves.

[0038] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present disclosure. It should be understood that the above description is only a specific embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. A method for processing a substrate with an array of irregular bosses, characterized in that: The steps include: S1: preparing a substrate 1 (A0), and cutting a groove 1 of a certain depth and width along direction 1 on the substrate 1 (A0) using a grinding wheel blade 1 of selected thickness 1, and then cutting a groove 2 of the same depth but different width along direction 2 using a grinding wheel blade 2 of selected thickness 2, to form a substrate 2 (A1) with a boss on the substrate 1 (A0); S2: Applying adhesive material on the top surface of the boss; S3: preparing a substrate three (B0), and bonding the substrate two (A1) and the substrate three (B0) together according to the bonding process conditions of the bonding material used; S4: Use grinding wheel blade three to cut off the connected part in the middle of the boss on substrate two (A1) along direction one, and then use grinding wheel blade four to cut off the connected part in the middle of the boss on substrate two (A1) along direction two to form a boss array substrate four (B1) with grooves.

2. The method for processing a substrate with an array of irregular bosses according to claim 1, characterized in that: The longitudinal section angles at the cutting edges of the grinding wheel blade 1 and the grinding wheel blade 2 are both right angles or acute angles.

3. The method for processing a substrate with an array of irregular bosses according to claim 1, characterized in that: The angle between the second direction and the first direction is between 15° and 165°.

4. The method for processing a substrate with an array of irregular bosses according to claim 1, characterized in that: The materials of the substrate one (A0) and the substrate three (B0) are the same, and are any one of ceramic, glass, diamond, metal, and metal-based composite materials.

5. The method for processing a substrate with an array of irregular bosses according to claim 1, characterized in that: The materials of the substrate one (A0) and the substrate three (B0) are different and are any two of ceramic, glass, diamond, metal, and metal-based composite materials.

6. The method for processing a substrate with an array of irregular bosses according to claim 1, characterized in that: The thickness of the grinding wheel blade three is less than the thickness of the cutting blade one, and the thickness of the grinding wheel blade four is less than the thickness of the grinding wheel blade two.

7. A substrate with an array of irregular bosses, characterized in that: The method is prepared by any one of claims 1 to 6.

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