Loading mechanism, polishing device and polishing method

Abstract

The invention relates to a loading mechanism, a polishing device and a polishing method. The loading mechanism comprises a first conductive base, a second conductive base, a conductive connecting piece and a limiting column. The first conductive seat is provided with a first hooking part used for being hooked to a power supply anode of the polishing equipment. The second conductive seat is provided with a second hooking part used for being hooked to a power supply anode of the polishing equipment, the second conductive seat and the first conductive seat are oppositely arranged, a containing space capable of containing a pipe is formed between the first conductive seat and the second conductive seat, and the conductive connecting piece is connected with the first conductive seat and the second conductive seat. And the limiting column is arranged between the first conductive seat and the second conductive seat and is used for penetrating into the pipe. The loading mechanism can improve the polishing efficiency of the pipe while guaranteeing the polishing effect of the pipe.

Description

Technical Field

[0001] The present application relates to the technical field of plasma polishing, and in particular to a loading mechanism, a polishing device and a polishing method. Background Art

[0002] Small-sized pipes are usually prepared by laser cutting. After cutting, the surface of the pipe mouth usually has burrs, slag and other raised defects, which have a great impact on subsequent processes such as welding and stitching. Polishing technology can improve the appearance of the pipe mouth surface and remove the raised defects on the pipe mouth surface. Traditional pipe polishing technology is usually electrochemical polishing, but the electrochemical polishing process is complicated, the pass rate is low, and the polishing fluid used is seriously damaging to the environment.

[0003] With the development of polishing technology, plasma polishing technology has gradually been applied to the polishing process of various workpieces due to its advantages of simple polishing process, good polishing effect and less environmental pollution. The principle of plasma polishing technology is to place the workpiece in the polishing liquid, apply a certain DC voltage, vaporize the polishing liquid around the workpiece, form an air layer surrounding the workpiece, and form discharge channels at different positions of the air layer to selectively remove the surface material to achieve polishing of the workpiece surface.

[0004] In the related art, plasma polishing of pipes generally adopts the outer surface conduction or inner surface conduction mechanism. When outer surface conduction is adopted, the clamping position of the pipe needs to be frequently changed during the polishing process to ensure that all areas of the pipe surface can be polished, which slows down the polishing rate and increases labor costs. When inner surface conduction is adopted, due to the skin effect of the current and the presence of a certain gap between the conductive wire and the lower part of the pipe, the current of each part of the pipe will be different, which will lead to a smaller wall thickness in the upper part of the polished pipe and a larger wall thickness in the lower part, which is not conducive to subsequent welding operations. Summary of the invention

[0005] Based on this, it is necessary to provide a loading mechanism, a polishing device and a polishing method to address the problem of how to balance the polishing effect and polishing efficiency of the pipe.

[0006] A loading mechanism for loading a pipe to be polished, the loading mechanism comprising:

[0007] A first conductive seat, wherein the first conductive seat is provided with a first hanging portion;

[0008] A second conductive seat, wherein the second conductive seat is provided with a second hanging portion, the second conductive seat is arranged opposite to the first conductive seat, and an accommodating space for accommodating the pipe is formed between the second conductive seat and the first conductive seat;

[0009] a conductive connecting member, the conductive connecting member connecting the first conductive seat and the second conductive seat; and

[0010] A limiting post is arranged between the first conductive seat and the second conductive seat, and the limiting post is used to penetrate into the pipe.

[0011] The technical solution is further described below:

[0012] In one embodiment, two ends of the conductive connecting member are detachably connected to the first conductive seat and the second conductive seat respectively.

[0013] In one embodiment, one end of the conductive connecting member is connected to the geometric center of the first conductive connecting seat, and the other end is connected to the geometric center of the second conductive seat.

[0014] In one embodiment, one end of the limiting column is connected to the first conductive seat, and the other end of the limiting column is in contact with or separated from the second conductive seat.

[0015] In one embodiment, the limiting column is separately provided from the second conductive seat, and the distance between the limiting column and the second conductive seat is 1 mm-5 mm.

[0016] In one embodiment, there are multiple limit posts, and the multiple limit posts are arranged at intervals along the outer circumference of the conductive connecting member.

[0017] In one embodiment, the first hanging part includes a first hook, one end of which is connected to the first conductive seat, and the other end of the first hook is used to hang on the power anode of the polishing equipment; and / or, the second hanging part includes a second hook, one end of which is connected to the second conductive seat, and the other end of the second hook is used to hang on the power anode of the polishing equipment.

[0018] In one embodiment, the limiting column is made of insulating material, and the first conductive seat, the second conductive seat, the conductive connecting member, the first hanging portion, and the second hanging portion are all made of conductive material.

[0019] The present application also provides a polishing device, including a polishing device and the above-mentioned loading mechanism, wherein the polishing device includes a power supply and a polishing tank for containing polishing liquid, the polishing tank is connected to the cathode of the power supply, and the loading mechanism is hung to the anode of the power supply through the first hanging part or the second hanging part.

[0020] In one embodiment, the polishing equipment also includes a lifting drive and a connecting rod, wherein the connecting rod is arranged above the polishing tank and is electrically connected to the anode of the power supply, the lifting drive is connected to the connecting rod, and the lifting drive is used to drive the connecting rod to move closer to or away from the polishing tank, and the loading mechanism is suspended on the connecting rod through the first hanging part or the second hanging part.

[0021] The present application also provides a plasma polishing method, which is implemented using the above-mentioned polishing device, and the plasma polishing method includes:

[0022] loading the pipe into the loading mechanism;

[0023] Inputting predetermined polishing parameters into the polishing device and disposing a polishing liquid in the polishing tank;

[0024] The loading mechanism is suspended to the anode of the power source through the first hanging part, the loading mechanism is kept suspended, and the loading mechanism is immersed in the polishing liquid to perform the first polishing;

[0025] The loading mechanism is turned upside down, and is hung to the anode of the power supply through the second hanging part. The loading mechanism is kept in the hanging state, and is immersed in the polishing liquid to perform a second polishing.

[0026] In one embodiment, the polishing liquid is a mixed solution of ammonium sulfate, oxalic acid and water, and the concentration of the polishing liquid ranges from 2% to 10%.

[0027] The above-mentioned loading mechanism, polishing device and polishing method, by placing the pipe into the accommodating space and sleeved on the limiting column, and then sequentially hanging the loading mechanism to the power anode of the polishing equipment through the first hanging part and the second hanging part and placing it in the polishing groove connected to the power cathode, can make the first end and the second end of the pipe act as conductive interfaces in turn to introduce current into the pipe, thereby realizing polishing of the pipe. Compared with the traditional power connection method of outer surface conduction or inner surface conduction, the loading mechanism of the present application can realize the end of the pipe to be conductive, so that the outer surface, the first end and the second end of the pipe can be fully polished by only flipping the loading mechanism once during the polishing process, eliminating the traditional process of changing the clamping position of the pipe multiple times for outer surface conduction, thereby improving the polishing efficiency and reducing the labor cost. At the same time, by flipping the loading mechanism so that the first end and the second end of the pipe act as conductive interfaces in turn, it can ensure that the current of each part of the pipe is consistent during the entire polishing process, thereby ensuring that the wall thickness of each part of the pipe after polishing remains consistent, thereby improving the polishing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application.

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the various elements are drawn only as examples in the drawings and are not necessarily drawn according to the true scale.

[0031] Figure 1 It is a structural schematic diagram of a loading mechanism of an embodiment.

[0032] Figure 2 for Figure 1 A schematic structural diagram of the loading mechanism shown in FIG. 1 from another perspective.

[0033] Figure 3 for Figure 1 Left side view of the loading structure shown in .

[0034] Figure 4 It is a schematic structural diagram of a polishing device according to an embodiment.

[0035] Figure 5 for Figure 4 Schematic diagram of the structure of the polishing device shown in after the loading mechanism is placed in the polishing tank.

[0036] Description of reference numerals:

[0037] 10. Loading mechanism; 11. First conductive seat; 12. Second conductive seat; 13. Conductive connector; 14. Limiting column; 15. First hanging part; 16. Second hanging part; 20. Polishing equipment; 21. Polishing groove; 22. Cross bar. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0039] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0040] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0041] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0042] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0044] See also Figure 1 as well as Figure 2 , an embodiment of the present application provides a loading mechanism 10 for loading a pipe to be polished in a pipe polishing process. Specifically, the loading mechanism 10 of an embodiment includes a first conductive seat 11, a second conductive seat 12, a conductive connector 13 and a limiting column 14. Among them, the first conductive seat 11 is provided with a first hanging portion 15, and the first hanging portion is used to hang on the power anode of the polishing device 20. The second conductive seat 12 is provided with a second hanging portion 16, and the second hanging portion 16 is used to hang on the power anode of the polishing device 20. The second conductive seat 12 is arranged opposite to the first conductive seat 11, and a containing space capable of accommodating the pipe is formed between the first conductive seat 11 and the second conductive seat 12. Preferably, the distance between the first conductive seat 11 and the first conductive seat 11 is greater than the length of the pipe to be polished. The conductive connector 13 connects the first conductive seat 11 and the second conductive seat 12. The limiting column 14 is arranged between the first conductive seat 11 and the second conductive seat 12, and the limiting column 14 is used to penetrate into the pipe to limit the pipe.

[0045] Furthermore, combined with Figure 4 as well as Figure 5 When the pipe needs to be polished, the pipe is placed in the accommodating space and the pipe is sleeved onto the limiting column 14. The limiting column 14 can limit the pipe to prevent the pipe from leaving the accommodating space during the polishing process. Then the loading mechanism 10 is suspended together with the pipe to the anode of the power supply through the first hanging part 15. At this time, the first conductive seat 11 of the loading mechanism 10 is set upward, and the second conductive seat 12 is set downward. Under the action of gravity, the first end of the pipe is set upward, and the second end of the pipe is set downward and abuts against the second conductive seat 12. Then, the loading mechanism 10 is kept in the suspended state at this time and the loading mechanism 10 together with the pipe is placed in the polishing tank 21 containing the polishing liquid, wherein the polishing tank 21 is connected to the cathode of the power supply. Then turn on the power switch. At this time, the current is transmitted from the first hanging part 15 to the first conductive seat 11, and then transmitted to the second conductive seat 12 through the conductive connector 13. Since the second end of the tube is in contact with the second conductive seat 12 at this time, the second end of the tube can be used as a conductive interface to introduce current into the tube, thereby polishing the outer surface of the tube and the first end.

[0046] After polishing for a period of time, the loading mechanism 10 is turned over, and the second hanging part 16 of the loading mechanism 10 is hung to the anode of the power supply. At this time, the second conductive seat 12 of the loading mechanism 10 is facing upward, and the first conductive seat 11 is facing downward. Under the action of gravity, the second end of the tube is set upward, and the first end of the tube is set downward and abuts against the first conductive seat 11. Then, the loading mechanism 10 is kept in the suspended state at this time and the loading mechanism 10 and the tube are placed into the polishing tank 21 again. Then the power supply is supplied, and the current is transmitted from the second hanging part 16 to the second conductive seat 12, and then transmitted to the first conductive seat 11 through the conductive connector 13. Since the first end of the tube abuts against the first conductive seat 11 at this time, the first end of the tube can be used as a conductive interface to introduce current into the tube, thereby realizing polishing of the outer surface and the second end of the tube.

[0047] The loading mechanism 10 is placed in the accommodating space and sleeved on the limiting column 14, and then the loading mechanism 10 is hung on the power anode of the polishing equipment 20 through the first hanging part 15 and the second hanging part 16 in turn and placed in the polishing groove 21 connected to the power cathode, so that the first end and the second end of the pipe can be used as conductive interfaces to introduce current into the pipe in turn, thereby achieving polishing of the pipe. Compared with the traditional power connection method of outer surface conduction or inner surface conduction, the loading mechanism 10 of the present application can achieve end conduction of the pipe, so that the outer surface, the first end and the second end of the pipe can be fully polished by only turning the loading mechanism 10 once during the polishing process, eliminating the traditional process of changing the clamping position of the pipe many times for outer surface conduction, thereby improving the polishing efficiency and reducing the labor cost. At the same time, by turning over the loading mechanism 10 so that the first end and the second end of the pipe are used as conductive interfaces in turn, it can be ensured that the current of each part of the pipe is consistent during the entire polishing process, thereby ensuring that the wall thickness of each part of the pipe after polishing remains consistent, thereby improving the polishing effect.

[0048] Optionally, in one embodiment, the first hooking portion 15 includes a first hook, one end of which is connected to the first conductive seat 11, and the other end of the first hook is used to be connected to the power anode of the polishing device 20. Preferably, in this embodiment, the first hook is threadedly connected to the first conductive seat 11, and in other embodiments, the first hook and the first conductive seat 11 can also be welded or bonded with adhesive. Further, the first hook is a conductive material piece, for example, the material of the first hook includes but is not limited to metal materials such as titanium, titanium alloy, stainless steel, platinum iridium, iridium tantalum and copper, so as to improve the conductive effect.

[0049] Specifically, the number of the first hooks is at least one. Preferably, the number of the first hooks is two or more, and the two or more first hooks are arranged on the first conductive seat 11 at intervals, so as to improve the stability of the loading mechanism 10 when it is suspended.

[0050] It should be noted that, in other embodiments, the first hanging portion 15 can also be a hanging ring or a hanging hole arranged on the first conductive seat 11. At the same time, the power supply anode is provided with a hook, and the hanging loading mechanism can be realized by connecting the hanging ring or the hanging hole on the first conductive seat 11 through the hook on the power supply anode, which will not be elaborated here.

[0051] Similarly, in one embodiment, the second hooking portion 16 includes a second hook, one end of which is connected to the second conductive seat 12, and the other end of the second hook is used to be connected to the power anode of the polishing device 20. Preferably, in this embodiment, the second hook is threadedly connected to the second conductive seat 12, and in other embodiments, the second hook and the second conductive seat 12 can also be welded or bonded with adhesive. Further, the second hook is a conductive material piece, for example, the material of the second hook includes but is not limited to metal materials such as titanium, titanium alloy, stainless steel, platinum iridium, iridium tantalum and copper, so as to improve the conductive effect.

[0052] Specifically, the number of the second hooks is at least one. Preferably, the number of the second hooks is two or more, and the two or more second hooks are arranged on the second conductive seat 12 at intervals, thereby improving the stability of the loading mechanism 10 when it is suspended.

[0053] It should be noted that, in other embodiments, the second hanging portion 16 can also be a hanging ring or a hanging hole arranged on the second conductive seat 12. At the same time, the power anode is provided with a hook, and the hanging loading mechanism can be realized by connecting the hanging ring or the hanging hole on the second conductive seat 12 through the hook on the power anode, which will not be elaborated here.

[0054] The first conductive seat 11 and the second conductive seat 12 are both made of conductive materials. Optionally, the materials of the first conductive seat 11 and the second conductive seat 12 include but are not limited to metal materials such as titanium, titanium alloy, stainless steel, platinum iridium, iridium tantalum and copper, so as to improve the conductive effect.

[0055] Optionally, in one embodiment, the first conductive seat 11 and the second conductive seat 12 are both flat plate structures. Preferably, the first conductive seat 11 and the second conductive seat 12 are both disc-shaped plate structures. The diameter range of the first conductive seat 11 and the second conductive seat 12 can be determined according to the diameter of the polishing groove 21, and the thickness range is between 5mm-30mm, thereby ensuring that the first conductive seat 11 and the second conductive seat 12 have sufficient structural strength while not being too heavy.

[0056] Optionally, in one embodiment, the conductive connector 13 is disposed between the first conductive seat 11 and the second conductive seat 12, and one end of the conductive connector 13 is detachably connected to the first conductive seat 11, and the other end of the conductive connector 13 is detachably connected to the second conductive seat 12. In this way, the conductive connector 13 can not only realize the conduction between the first conductive seat 11 and the second conductive seat 12, but also play the role of supporting the first conductive seat 11 and the second conductive seat 12. At the same time, by making the conductive connector 13 detachably connected to the first conductive seat 11 and the second conductive seat 12, on the one hand, before loading the pipe, the second conductive seat 12 can be removed to facilitate the sleeve of the pipe on the limit column 14, and on the other hand, it is also convenient to replace the conductive connector 13 of different diameters according to the conductivity requirements of the pipe to be polished. Preferably, in this embodiment, the conductive connector 13 is threadedly connected to the first connection seat and the second connection seat.

[0057] Further, one end of the conductive connector is connected to the geometric center of the first conductive connector seat, and the other end is connected to the geometric center of the second conductive connector seat. For example, in this embodiment, the first conductive connector seat and the second conductive connector seat are both disc-shaped structures. The two ends of the conductive connector seat are respectively connected to the center of the first conductive connector seat and the center of the second conductive connector seat. In this way, the current distribution on the first conductive connector seat and the second conductive connector seat can be more uniform, which is conducive to improving the uniformity of pipe polishing.

[0058] The conductive connector 13 is a conductive material. Optionally, in one embodiment, the conductive connector 13 includes, but is not limited to, titanium, titanium alloy, stainless steel, platinum iridium, iridium tantalum, copper and other metal materials, so as to improve the conductive effect. Further, the diameter of the conductive connector 13 ranges from 5 mm to 30 mm, and the length of the conductive connector 13 can be determined according to the length of the pipe to be polished, and is not limited here.

[0059] See also Figure 3 Optionally, in one embodiment, one end of the limiting column 14 is connected to the first conductive seat 11, and the other end of the limiting column 14 is in contact with or separated from the second conductive seat 12. Preferably, the limiting column 14 is separately arranged from the second conductive seat 12, and the distance from the second conductive seat 12 to the limiting column 14 is 1mm-5mm. That is, the limiting column 14 is not directly connected to the second conductive seat 12, and the second conductive seat 12 only needs to be connected to the conductive connector 13. In this way, before loading the pipe, it is only necessary to remove the second conductive seat 12 from the conductive connector 13, which is conducive to quickly removing the second conductive seat 12, and then it is more convenient to put the pipe on the limiting column 14.

[0060] Furthermore, the limiting column 14 is threadedly connected to the first conductive seat 11, so that the diameter of the limiting column 14 can be replaced according to the inner diameter of the polished pipe. Preferably, the diameter of the limiting column 14 ranges from 0.2 mm to 10 mm.

[0061] Optionally, in one embodiment, there are multiple limit columns 14, and the multiple limit columns 14 are arranged at intervals between the first conductive seat 11 and the second conductive seat 12. The limit columns 14 can be inserted into different pipes one by one to limit the different pipes. In this way, the loading mechanism 10 can load multiple pipes at one time, so that multiple pipes can be polished at the same time, further improving the polishing efficiency.

[0062] Preferably, in this embodiment, a plurality of limit posts 14 are arranged at intervals along the outer circumference of the conductive connector 13. This makes the structure of the loading mechanism 10 more reasonable and compact, reduces the volume of the loading mechanism 10, and also enables the current transmitted by the conductive connector to be more evenly transmitted to each pipe.

[0063] Furthermore, the limiting column 14 is made of insulating material. In one embodiment, the limiting column 14 is made of plastic, which reduces the overall weight of the loading mechanism 10 and facilitates operation by workers.

[0064] See also Figure 4 as well as Figure 5 The present application also provides a polishing device, specifically, a polishing device of one embodiment includes a polishing device 20 and a loading mechanism 10 of any of the above embodiments, the polishing device 20 includes a power source and a polishing tank 21 for containing a polishing liquid, the polishing tank 21 is connected to the cathode of the power source, and the loading mechanism 10 is connected to the anode of the power source through the first hanging part 15 or the second hanging part 16.

[0065] Furthermore, in one embodiment, the polishing device 20 further includes a lifting drive and a connecting rod, the connecting rod is disposed above the polishing tank 21 and electrically connected to the anode of the power supply, the lifting drive is connected to the connecting rod, the lifting drive is used to drive the connecting rod seat to move closer to or away from the polishing tank 21, and the loading mechanism 10 is suspended on the connecting rod through the first hanging part 15 or the second hanging part 16. Preferably, the connecting rod includes a crossbar 22 and a vertical rod, the vertical rod connects the crossbar 22 and the output shaft of the lifting drive, and the loading mechanism 10 is suspended on the crossbar 22 through the first hanging part 15 or the second hanging part 16, so that the lifting drive drives the connecting rod to move closer to or away from the polishing tank 21, so that the loading mechanism 10 together with the pipe can be immersed in the polishing liquid or taken out of the polishing liquid.

[0066] An embodiment of the present application further provides a polishing method implemented by using the polishing device of any of the above embodiments, comprising the following steps:

[0067] S110: loading the pipe into the loading mechanism 10;

[0068] Specifically, the second conductive seat 12 of the loading mechanism 10 is first removed, the pipes are sleeved on the limiting pillars 14 one by one, and then the second conductive seat 12 is connected to the conductive connector 13 to complete the installation of the pipes.

[0069] S120: inputting predetermined polishing parameters into the polishing device and configuring a polishing liquid in the polishing tank 21;

[0070] Among them, the predetermined polishing parameters include but are not limited to voltage value, polishing time, etc. Specifically, first turn on the power switch and set the voltage value. The voltage can be set in the range of 200-350V. Then open the water supply solenoid valve to add purified water to the polishing tank 21, and close the water supply solenoid valve when the water level reaches the required height. Turn on the heating knob again to heat the purified water, and turn off the heating knob when the temperature of the purified water reaches the required temperature. Then add the polishing liquid stock solution to the polishing tank 21. In this embodiment, the polishing liquid stock solution is a mixed solution of ammonium sulfate and oxalic acid. At the same time, open the water supply solenoid valve switch again to add purified water to the polishing tank 21 to configure a certain concentration of polishing liquid. Preferably, in this embodiment, the polishing liquid concentration range is 2%-10%. Finally, set the polishing time. The polishing time can be set according to the desired polishing effect. Generally, the polishing time is 100s-500s. S130: Hang the loading mechanism 10 to the anode of the power supply through the first hanging part 15;

[0071] Specifically, the first hanging portion 15 can be hung on the cross bar 22 connected to the anode of the power supply. At this time, the first conductive seat 11 of the loading mechanism 10 is set upward, and the second conductive seat 12 is set downward. Under the action of gravity, the first end of the tube is set upward, and the second end of the tube is set downward and abuts against the second conductive seat 12 to serve as a conductive interface of the tube.

[0072] S140: maintaining the hanging state of the loading mechanism, and immersing the loading mechanism in the polishing liquid to perform the first polishing;

[0073] Specifically, close the hatch of the polishing equipment, turn on the exhaust button, click the start button, and the lifting drive member drives the cross bar 22 to descend to immerse the loading mechanism 10 and the pipe in the polishing liquid. At this time, the current is transmitted from the first hanging part 15 to the first conductive seat 11, and then transmitted to the second conductive seat 12 through the conductive connector 13. Since the second end of the pipe is in contact with the second conductive seat 12 at this time, the second end of the pipe can be used as a conductive interface to introduce current into the pipe, thereby starting to polish the pipe. After polishing for a predetermined time, the power circuit will automatically cut off the power, and the lifting drive member drives the cross bar 22 to lift to lift the loading mechanism 10 together with the pipe, thereby completing the first polishing of the pipe.

[0074] S150: turning the loading mechanism upside down, and hanging the loading mechanism to the anode of the power source through the second hanging part;

[0075] Similarly, the second hanging portion 16 can be hung on the cross bar 22 connected to the anode of the power supply. At this time, the second conductive seat 12 of the loading mechanism 10 is set upward, and the first conductive seat 11 is set downward. Under the action of gravity, the second end of the tube is set upward, and the first end of the tube is set downward and abuts against the first conductive seat 11 to serve as a conductive interface of the tube.

[0076] S160: Keeping the loading mechanism in a suspended state, immersing the loading mechanism in the polishing liquid to perform a second polishing;

[0077] Similarly, the lifting drive member drives the cross bar 22 down again to immerse the loading mechanism 10 and the tube in the polishing liquid. At this time, the current is transmitted from the second hanging part 16 to the second conductive seat 12, and then transmitted to the first conductive seat 11 through the conductive connector 13. Since the first end of the tube is in contact with the first conductive seat 11 at this time, the first end of the tube can be used as a conductive interface to introduce current into the tube, thereby starting to polish the tube. After polishing for a predetermined time, the power circuit will automatically cut off the power, and the lifting drive member drives the cross bar 22 to lift to lift the loading mechanism 10 together with the tube, thereby completing the second polishing of the tube.

[0078] Optionally, after the second polishing is completed, the workpiece and the polishing tank may be cleaned. Specifically, the polishing method of an embodiment may further include the following steps:

[0079] S170: cleaning the pipe;

[0080] Specifically, after polishing is completed, the loading mechanism 10 together with the pipe is immersed in water and then wiped dry, and then passivation is performed, that is, the polished pipe is placed in the prepared nitric acid for passivation for 30 minutes; then it is placed in pure water for ultrasonic treatment for 5 minutes to wash away the nitric acid remaining on the surface; finally, it is immersed in 75% alcohol for more than 30 seconds and placed in an oven for drying.

[0081] S180: Cleaning the polishing tank 20;

[0082] Specifically, the drain button of the polishing device 20 is turned on to drain the waste liquid in the polishing tank 21. After the waste liquid is drained, purified water is poured into the polishing tank 21 and the tank wall of the polishing tank 21 is scrubbed. After the scrubbing is completed, the waste liquid draining operation is performed again.

[0083] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A loading mechanism for loading pipes to be polished, characterized in that: The loading mechanism comprises: A first conductive seat, wherein the first conductive seat is provided with a first hanging portion; A second conductive seat, wherein the second conductive seat is provided with a second hanging portion, the second conductive seat is arranged opposite to the first conductive seat, and an accommodating space for accommodating the pipe is formed between the second conductive seat and the first conductive seat; a conductive connecting member, the conductive connecting member connecting the first conductive seat and the second conductive seat; and A limiting post is arranged between the first conductive seat and the second conductive seat, and the limiting post is used to penetrate into the pipe.

2. The loading mechanism according to claim 1, characterized in that: Two ends of the conductive connector are detachably connected to the geometric centers of the first conductive seat and the second conductive seat respectively.

3. The loading mechanism according to claim 1, characterized in that: One end of the limiting column is connected to the first conductive seat, and the other end of the limiting column is in contact with or separated from the second conductive seat.

4. The loading mechanism according to claim 1, characterized in that: There are multiple limit posts, and the multiple limit posts are arranged at intervals along the outer circumference of the conductive connecting piece.

5. The loading mechanism according to claim 1, characterized in that: The first hanging part includes a first hook, one end of which is connected to the first conductive seat, and the other end of the first hook is used to be hung to the power anode of the polishing equipment; and / or, the second hanging part includes a second hook, one end of which is connected to the second conductive seat, and the other end of the second hook is used to be hung to the power anode of the polishing equipment.

6. The loading mechanism according to any one of claims 1 to 5, characterized in that: The limiting column is made of insulating material, and the first conductive seat, the second conductive seat, the conductive connecting member, the first hanging part and the second hanging part are all made of conductive material.

7. A polishing device, characterized in that: It comprises a polishing device and a loading mechanism as described in any one of claims 1 to 6, wherein the polishing device comprises a power source and a polishing tank for containing polishing liquid, wherein the polishing tank is connected to the cathode of the power source, and the loading mechanism is connected to the anode of the power source through the first hanging part or the second hanging part.

8. The polishing device according to claim 7, characterized in that: The polishing equipment also includes a lifting drive and a connecting rod, wherein the connecting rod is arranged above the polishing tank and is electrically connected to the anode of the power supply, the lifting drive is connected to the connecting rod, and the lifting drive is used to drive the connecting rod to move closer to or away from the polishing tank, and the loading mechanism is suspended on the connecting rod through the first hanging part or the second hanging part.

9. A polishing method, implemented by using the polishing device according to any one of claims 7 or 8, characterized in that: The plasma polishing method comprises the following steps: loading the pipe into the loading mechanism; Inputting predetermined polishing parameters into the polishing device and disposing a polishing liquid in the polishing tank; The loading mechanism is suspended to the anode of the power source through the first hanging part, the loading mechanism is kept suspended, and the loading mechanism is immersed in the polishing liquid to perform the first polishing; The loading mechanism is turned upside down, and is hung to the anode of the power supply through the second hanging part. The loading mechanism is kept in the hanging state, and is immersed in the polishing liquid to perform a second polishing.

10. The polishing device according to claim 9, characterized in that: The polishing liquid is a mixed solution of ammonium sulfate, oxalic acid and water, and the concentration of the polishing liquid ranges from 2% to 10%.

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