A size customized solar silicon wafer dicing device

Abstract

The application provides a size self-defined solar silicon light piece splitting device, which comprises a fixing assembly, a rotating assembly and a sliding assembly; the fixing assembly comprises a fixing support and a fixing clamping module, the fixing support is provided with a fixing mounting groove, the rotating assembly comprises a rotating support, a rotating driving device and a rotating clamping module, and the rotating support is provided with a rotating mounting groove. The end of the silicon light piece is clamped by the sliding clamping block, and the preset stroke is advanced by the driving of the sliding driving device, the preset stroke corresponds to the splitting size of the silicon light piece, the splitting is realized by the hinging of the fixing support and the rotating support, the silicon light piece is split along the horizontal rotating shaft direction, the clamping and fixing of the fixing clamping module and the rotating clamping module at the two ends of the splitting position are matched, the stability of the splitting is improved, and the efficient splitting of multiple silicon light piece units can be realized by the driving advancement of the sliding driving device and the rotation of the rotating support.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solar silicon wafer production, and particularly relates to a solar silicon wafer splitting device with a self-defined size. BACKGROUND

[0002] The splitting device is mainly used to separate the silicon wafer that is not completely cut by the scribe machine. In the current photovoltaic industry, with the different sizes of the required semiconductor silicon wafer, the semiconductor silicon wafer specifications and the number of scribing need to be designed.

[0003] The existing silicon wafer splitting is usually designed according to the corresponding splitting mold of the predetermined specifications, so the splitting specifications of the silicon wafer splitting device are usually fixed. However, with more types of products applied to the solar silicon wafer, the size of the solar silicon wafer needs to be personalized, and therefore, a solar silicon wafer splitting device with a self-defined size needs to be designed to meet the requirements of wide applicability and also to meet the requirements of automation and high efficiency. SUMMARY

[0004] The present application relates to the technical field of solar silicon wafer production, and particularly relates to a solar silicon wafer splitting device with a self-defined size.

[0005] In order to achieve the object of the present application, the present application provides a size self-defined solar silicon light sheet splitting device, comprising a fixed assembly, a rotating assembly and a sliding assembly; the fixed assembly comprises a fixed support and a fixed clamping module, the fixed support is provided with a fixed mounting groove extending along the horizontal advancing direction, the fixed mounting groove is used for loading the solar silicon light sheet, the end of the fixed mounting groove in the horizontal advancing direction is provided with a fixed clamping end, the fixed clamping module is located at the fixed clamping end, the fixed clamping module is used for clamping the solar silicon light sheet located at the fixed clamping end, and the fixed support is provided with a first hinged part at the fixed clamping end; the sliding assembly comprises a sliding clamping block and a sliding driving device, the sliding clamping block is located on the fixed mounting groove, the sliding clamping block is located on the other end of the fixed clamping end in the horizontal advancing direction, the sliding clamping block is used for clamping the end of the solar silicon light sheet, and the sliding driving device is connected with the sliding clamping block and drives the sliding clamping block to move along the horizontal advancing direction; the rotating assembly comprises a rotating support, a rotating driving device and a rotating clamping module, the rotating support is provided with a rotating mounting groove extending along the horizontal advancing direction, the rotating mounting groove is used for loading the solar silicon light sheet, the end of the rotating mounting groove in the horizontal advancing direction is provided with a rotating clamping end, the rotating clamping end is close to the fixed clamping end, the rotating clamping module is located at the rotating clamping end, the rotating clamping module is used for clamping the solar silicon light sheet located at the rotating clamping end, and the rotating support is provided with a second hinged part at the rotating clamping end, the second hinged part is hinged with the first hinged part and rotates around the horizontal rotation shaft direction, the rotating driving device is connected with the rotating support and drives the rotating support to rotate around the horizontal rotation shaft, in the advancing state, the bearing bottom surface of the fixed mounting groove is coplanar with the bearing bottom surface of the rotating mounting groove, and in the splitting state, the bearing bottom surface of the fixed mounting groove is non-coplanar with the bearing bottom surface of the rotating mounting groove.

[0006] As can be seen from the above scheme, the end of the silicon light sheet is clamped by the sliding clamping block, and the driving of the sliding driving device is utilized, and then the self-defined preset stroke can be advanced, which corresponds to the splitting size of the silicon light sheet, and the splitting is achieved by the hinging of the fixed support and the rotating support to split the silicon light sheet along the horizontal rotation shaft direction, and the clamping and fixing of the fixed clamping module and the rotating clamping module at both ends of the splitting position, thereby improving the stability of the splitting, and with the driving advancement of the sliding driving device and the rotation of the rotating support, the efficient splitting of multiple silicon light sheet units can be realized.

[0007] Further, the edge of the fixed mounting groove at the fixed clamping end is arranged in line with the horizontal rotation shaft direction.

[0008] As can be seen above, by arranging the edge in line with the horizontal rotation shaft direction, the splitting position and size of the silicon light sheet are more accurate.

[0009] Further, the bearing bottom surface of the fixed installation groove is provided with a sliding groove extending along the horizontal advancing direction, a sliding block is arranged in the sliding groove, the sliding driving device is connected with the sliding block and drives the sliding block to move along the horizontal advancing direction, and the sliding clamping block is arranged on the sliding block and moves with the sliding block.

[0010] Further, the sliding block is provided with a positioning step in the fixed installation groove, the sliding assembly further comprises a sliding clamping driving device, the positioning step is used for bearing the end of the solar silicon wafer, and the sliding clamping driving device is connected with the sliding clamping block and drives the sliding clamping block to move towards the positioning step.

[0011] As can be seen from the above, through the advancing of the sliding block in the sliding groove, the silicon wafer can be more smoothly and stably advanced, and through the clamping of the positioning step and the sliding clamping block, the silicon wafer can be stably advanced while being clamped.

[0012] Further, the fixed clamping module comprises a fixed clamping plate and a fixed clamping driving device, the fixed clamping driving device is connected with the fixed clamping plate, and the fixed clamping driving device drives the fixed clamping plate to move towards the bearing bottom surface of the fixed installation groove.

[0013] Further, the rotating clamping module comprises a rotating clamping plate and a rotating clamping driving device, the rotating clamping driving device is connected with the rotating clamping plate, and the rotating clamping driving device drives the rotating clamping plate to move towards the bearing bottom surface of the rotating installation groove.

[0014] As can be seen from the above, through the driving of the fixed clamping plate and the rotating clamping plate, the automatic clamping of the silicon wafer splitting position can be realized, and then the stability during splitting is improved, so that the yield is improved.

[0015] Further, the rotating clamping module comprises a negative pressure generating device, and the bearing bottom surface of the rotating installation groove is provided with a negative pressure hole, and the negative pressure generating device is connected with the negative pressure hole.

[0016] As can be seen from the above, the negative pressure hole can also be used on the rotating support to adsorb and fix the silicon wafer, which can realize the relative fixation of the silicon wafer.

[0017] Further, the rotating support is provided below the rotating clamping end with a stop inclined surface, the stop inclined surface and the bearing bottom surface of the rotating installation groove are arranged at an acute angle, and in the state of the split piece, the stop inclined surface is adjacent to the fixed support.

[0018] As can be seen from the above, through the arrangement of the stop inclined surface, the excessive rotation of the rotating support is avoided, and the operation stability of the equipment is improved.

[0019] A further solution is to provide multiple fixing ribs extending in the horizontal direction within the fixed mounting groove, forming a fixed sub-groove between two adjacent fixing ribs, and the sliding assembly includes multiple sliding clamping blocks, with one sliding clamping block located on a fixed sub-groove and clamping the end of the solar silicon photosheet located on the fixed sub-groove.

[0020] A further proposed solution is to install multiple rotating ribs extending along the horizontal propulsion direction within the rotating mounting groove, with rotating slots formed between adjacent rotating ribs.

[0021] As can be seen from the above, by arranging the fixed ribs and rotating ribs, the dicing device can perform secondary dicing on the long silicon wafer after the first dicing. In addition, with the custom advance stroke of the sliding drive device, it can realize dicing with custom length and width dimensions. It can also use the fixed ribs and rotating ribs to limit the movement of the silicon wafer, making the movement and advance of the silicon wafer smoother and more stable. Attached Figure Description

[0022] Figure 1 This is a structural diagram of an embodiment of the solar silicon wafer dicing device of the present invention.

[0023] Figure 2 This is a structural diagram of an embodiment of the solar silicon wafer dicing device of the present invention from another perspective.

[0024] Figure 3 This is a structural diagram of the fixed component and the sliding component in an embodiment of the solar silicon wafer dicing device of the present invention.

[0025] Figure 4 This is a structural diagram of the rotating component in an embodiment of the solar silicon wafer dicing device of the present invention.

[0026] Figure 5 This is a cross-sectional view of an embodiment of the solar silicon wafer dicing device of the present invention in the advancing state.

[0027] Figure 6 This is a cross-sectional view of an embodiment of the solar silicon wafer dicing device of the present invention in a clamped and fixed state.

[0028] Figure 7 yes Figure 6 Enlarged view of point A in the middle.

[0029] Figure 8 This is a cross-sectional view of an embodiment of the solar silicon wafer cleaving device of the present invention in the cleaving state.

[0030] Figure 9 yes Figure 8 Enlarged view of point B in the middle.

[0031] Figure 10 This is a structural diagram of another embodiment of the solar silicon wafer dicing device of the present invention.

[0032] Figure 11 is the structure diagram of another embodiment of the solar silicon wafer splitting device from another perspective.

[0033] Figure 12 is the structure diagram of the fixed assembly and the sliding assembly in another embodiment of the solar silicon wafer splitting device.

[0034] Figure 13 is the structure diagram of the rotating assembly in another embodiment of the solar silicon wafer splitting device.

[0035] The application will be further described below in conjunction with the drawings and embodiments. DETAILED DESCRIPTION

[0036] First embodiment of the solar silicon wafer splitting device:

[0037] Referring to Figures 1 to 9 , the solar silicon wafer 101 splitting device includes a fixed assembly 1, a rotating assembly 2, and a sliding assembly 3. The fixed assembly 1 includes a fixed support 11 and a fixed clamping module. The fixed support 11 is arranged in a rectangular frame and is provided with a mounting cavity 114 in the horizontal advancing direction X. The fixed support 11 is provided with a fixed mounting groove 111 extending in the horizontal advancing direction X at the top. The fixed mounting groove 111 is used to load the solar silicon wafer 101. The fixed mounting groove 111 is provided with positioning ribs on both sides in the width direction. The bearing surface of the fixed mounting groove 111 is provided with a sliding groove 112 extending in the horizontal advancing direction X in the middle. The fixed mounting groove 111 is provided with a fixed clamping end 113 at the end in the horizontal advancing direction X. The fixed clamping module is located at the fixed clamping end 113. The fixed clamping module is used to clamp the solar silicon wafer 101 located at the fixed clamping end 113.

[0038] The fixed clamping module includes a fixed clamping plate 12 and two fixed clamping driving devices 13. The fixed clamping plate 12 is arranged in a right-angle U shape, i.e., the lower end of the fixed clamping plate 12 has a pressing flat plate. The two fixed clamping driving devices 13 are respectively located at the two ends of the fixed clamping plate 12 based on the horizontal rotating shaft direction Y. The fixed clamping driving devices 13 are connected with the two ends of the fixed clamping plate 12. The fixed clamping plate 12 is located above the fixed clamping end 113. The fixed clamping driving devices 13 drive the fixed clamping plate 12 to move towards the bearing surface of the fixed mounting groove 111, and then use the driving pressing at both ends to improve the pressing stability. The fixed support 11 is provided with a first hinge part 14 at the fixed clamping end 113. The first hinge part 14 is arranged in a hinge hole.

[0039] The sliding assembly 3 comprises a sliding clamping block 31, a sliding block 33, a sliding clamping driving device 32 and a sliding driving device 34. The sliding driving device 34 is arranged in a linear driving device and arranged in the mounting cavity 114. The sliding block 33 is arranged in the sliding groove 112. The sliding driving device 34 is connected with the sliding block 33 and drives the sliding block 33 to move in the horizontal advancing direction X. The sliding clamping block 31 is arranged on the sliding block 33 and moves with the sliding block 33. The sliding block 33 is provided with a positioning step 331 in the fixed mounting groove 111. The positioning step 331 is arranged in an L shape. The positioning step 331 is used to bear the end of the solar silicon wafer 101. The sliding clamping driving device 32 is connected with the sliding clamping block 31 and drives the sliding clamping block 31 to move towards the positioning step 331. The sliding clamping block 31 is located on the other end of the fixed clamping end 113 in the horizontal advancing direction X. The sliding clamping block 31 is used to clamp the end of the solar silicon wafer 101, thereby realizing clamping and pushing the solar silicon wafer 101 to move in the horizontal advancing direction X.

[0040] The rotating assembly 2 comprises a rotating support 21, a rotating driving device 25 and a rotating clamping module. The rotating support 21 is provided with a rotating mounting groove 211 extending along the horizontal advancing direction X. The rotating mounting groove 211 is used to load the solar silicon wafer 101. The rotating mounting groove 211 is provided with a rotating clamping end 213 at the end in the horizontal advancing direction X. The rotating clamping end 213 is close to the fixed clamping end 113. The rotating mounting groove 211 is provided with positioning ribs 216 at both ends in the horizontal rotating shaft direction Y. The rotating clamping module is located at the rotating clamping end 213. The rotating clamping module is used to clamp the solar silicon wafer 101 located at the rotating clamping end 213.

[0041] The rotating clamping module comprises a rotating clamping plate 22, a rotating clamping driving device 23 and a negative pressure generating device (not shown). The rotating clamping plate 22 is arranged in a right-angle U shape, i.e. the lower end of the rotating clamping plate 22 has a pressing flat plate. Two rotating clamping driving devices 23 are respectively located at both ends of the rotating clamping plate 22 based on the horizontal rotating shaft direction Y. The rotating clamping driving device 23 is connected with both ends of the rotating clamping plate 22. The rotating clamping plate 22 is located above the rotating clamping end 213. The rotating clamping driving device 23 drives the rotating clamping plate 22 to move towards the bearing bottom surface of the rotating mounting groove 211, thereby using the driving pressing of both ends to improve the pressing stability. Both ends of the rotating clamping plate 22 are respectively provided with positioning grooves 221. The positioning grooves 221 are gap-positioned with the positioning ribs 216. The rotating support 11 is provided with a second hinge part 24 at the rotating clamping end 213. The second hinge part 24 is arranged in a hinge column.

[0042] The bearing bottom surface of the rotating installation groove 211 is provided with a plurality of negative pressure holes 214, each of which is connected with an air nozzle 215. A negative pressure generating device is connected with the negative pressure holes 214 through the air nozzles 215, thereby generating negative pressure in the negative pressure holes 214 for adsorbing and fixing the solar silicon wafer 101. The rotating support 21 is provided below the rotating clamping end 213 with a stop inclined surface 218, which is arranged at an acute angle with the bearing bottom surface of the rotating installation groove 211. The rotating support 21 is provided at the bottom of the rotating installation groove 211 with a connecting portion 217. The rotating drive device 25 is a linear telescopic drive device and is arranged in the installation cavity 114. The driving end of the rotating drive device 25 is hinged with the connecting portion 217. The second hinge portion 24 is hinged with the first hinge portion 14 and rotates around the horizontal rotation axis direction Y. The rotating drive device 25 is connected with the rotating support 21 and drives the rotating support 21 to rotate around the horizontal rotation axis.

[0043] With reference to Figure 5 When the solar silicon wafer 101 is to be cracked, the solar silicon wafer 101 is first installed into the fixed installation groove 111 and the end portion of the solar silicon wafer 101 is clamped by the sliding clamping block 31. With the movement of the sliding clamping block 31, the solar silicon wafer 101 is pushed to move along the horizontal advancing direction X towards the fixed clamping plate 12.

[0044] With reference to Figure 6 And Figure 7 When the solar silicon wafer 101 is advanced by a preset distance, the bearing bottom surface of the fixed installation groove 111 is coplanar with the bearing bottom surface of the rotating installation groove 211 in the advancing state, so that part of the solar silicon wafer 101 is located in the rotating installation groove 211 and the part of the solar silicon wafer 101 located in the rotating installation groove 211 has a preset length. Then, the solar silicon wafer 101 is clamped by the fixed clamping plate 12 and the rotating clamping plate 22 located on both sides, and the edge of the fixed installation groove 111 at the fixed clamping end 113 is arranged in line with the horizontal rotation axis direction Y.

[0045] With reference to Figure 8 And Figure 9Then, the splitting is performed by rotating the rotating support 21 downwardly by driving the driving device 25, and then in the splitting state, the bearing bottom surface of the fixed mounting groove 111 is out of plane with the bearing bottom surface of the rotating mounting groove 211. Since the fixed clamping plate 12 and the rotating clamping plate 22 are located on both sides to clamp the solar silicon wafer 101, the edge of the solar silicon wafer 101 at the fixed clamping end 113 is broken, and the first splitting of the solar silicon wafer 101 is achieved. At the same time, in the splitting state, the stop inclined surface 218 abuts against the fixed support 11, and the split silicon wafer 101 is fixed by vacuum suction through the negative pressure hole 114. Then, the split silicon wafer 101 is taken away by the feeding and discharging transfer device, and then the rotating support 21 is reset. With the re-advancing and clamping of the silicon wafer 101, the splitting of the silicon wafer 101 of the preset length can be achieved again.

[0046] Second embodiment of the solar silicon wafer splitting device:

[0047] With reference to Figures 10 to 13 On the basis of the first embodiment, the second embodiment mainly improves the fixed rib 17 and the rotating rib 27. The first embodiment is used for the first splitting of the silicon wafer 101, and the split silicon wafer 102 is arranged in a long strip, which can be subjected to secondary splitting by the second embodiment.

[0048] On the basis of the first embodiment of the above-mentioned solar silicon wafer splitting device, a plurality of fixed ribs 17 extending along the horizontal advancing direction X are arranged in the fixed mounting groove 111, and a fixed sub-groove 1110 is formed between adjacent two fixed ribs 17. Each fixed sub-groove 1110 is used to bear the silicon wafer 102, and each fixed sub-groove 1110 is provided with a sliding groove 112. The sliding assembly 3 includes a plurality of sliding clamping blocks 31, one sliding clamping block 31 is located on one fixed sub-groove 1110 and clamps the end of the solar silicon wafer 102 located on the fixed sub-groove 1110.

[0049] In addition, a plurality of rotating ribs 27 extending along the horizontal advancing direction X are arranged in the rotating mounting groove 211, and a rotating sub-groove 2110 is formed between adjacent two rotating ribs 27. The rotating sub-groove 2110 is used to bear part of the solar silicon wafer 102, and the rotating clamping plate 22 is provided with a plurality of positioning grooves 221. One positioning groove 221 is in clearance fit with one fixed rib 17. By locating the fixed clamping plate 12 and the rotating clamping plate 22 on both sides to clamp the solar silicon wafer 102, the edges of a plurality of solar silicon wafers 102 at the fixed clamping end 113 are broken by the same splitting steps of the above-mentioned first embodiment, and the second splitting of the solar silicon wafer 102 is achieved.

[0050] Of course, the above embodiments are only the preferred embodiments of the present application, and more changes can be made in specific applications. For example, the fixed clamping module and the rotating clamping module can have more forms, such as spring clamps, elastic members cooperating with pressing blocks, or slits for gap fitting, which can all achieve the positioning of the silicon wafer to improve the splitting precision. As for each driving module, it can be driven in an electric, pneumatic or hydraulic manner. The above changes all belong to the protection scope of the present application.

[0051] As can be seen from the above, the end of the silicon wafer is clamped by the sliding clamping block, and the driving of the sliding driving device is used to advance the preset stroke, which corresponds to the splitting size of the silicon wafer. The splitting is achieved by the hinging of the fixed support and the rotating support to split the silicon wafer along the horizontal rotation axis direction, and the clamping and fixing of the fixed clamping module and the rotating clamping module at both ends of the splitting position, thereby improving the stability of the splitting. With the driving advancement of the sliding driving device and the rotation of the rotating support, efficient splitting of multiple silicon wafer units can be achieved.

Claims

1. A solar silicon wafer dicing device with customizable dimensions, characterized in that, Includes fixed components, rotating components, and sliding components; The fixing assembly includes a fixing bracket and a fixing clamping module. The fixing bracket is provided with a fixing mounting groove extending along the horizontal pushing direction. The fixing mounting groove is used to load solar silicon photosheets. The fixing mounting groove is provided with a fixing clamping end at the end in the horizontal pushing direction. The fixing clamping module is located at the fixing clamping end and is used to clamp the solar silicon photosheet located at the fixing clamping end. The fixing bracket is provided with a first hinge portion at the fixing clamping end. The sliding assembly includes a sliding clamping block and a sliding driving device. The sliding clamping block is located on the fixed mounting groove and is located at the other end of the horizontal pushing direction relative to the fixed clamping end. The sliding clamping block is used to clamp the end of the solar silicon photosheet. The sliding driving device is connected to the sliding clamping block and drives the sliding clamping block to move along the horizontal pushing direction. The rotating assembly includes a rotating bracket, a rotating drive device, and a rotating clamping module. The rotating bracket is provided with a rotating mounting groove extending along the horizontal pushing direction. The rotating mounting groove is used to load solar silicon photosheets. A rotating clamping end is provided at the end of the rotating mounting groove in the horizontal pushing direction. The rotating clamping end is close to the fixed clamping end. The rotating clamping module is located at the rotating clamping end and is used to clamp the solar silicon photosheet located at the rotating clamping end. The rotating bracket is provided with a second hinge portion at the rotating clamping end. The second hinge portion is hinged to the first hinge portion and rotates around the horizontal rotation axis. The rotating drive device is connected to the rotating bracket and drives the rotating bracket to rotate around the horizontal rotation axis. In the advancing state, the bearing bottom surface of the fixed mounting groove is coplanar with the bearing bottom surface of the rotating mounting groove; In the fractured state, the bearing bottom surface of the fixed mounting groove is not parallel to the bearing bottom surface of the rotating mounting groove; The rotating clamping module includes a negative pressure generating device, and the bearing bottom surface of the rotating mounting groove is provided with a negative pressure hole, and the negative pressure generating device is connected to the negative pressure hole; The rotating bracket is provided with a stop slope below the rotating clamping end, and the stop slope is arranged at an acute angle with the bearing bottom surface of the rotating mounting groove. In the fractured state, the stop bevel is adjacent to the fixed bracket; The fixed mounting groove is provided with multiple fixed ribs extending along the horizontal pushing direction, and a fixed slot is formed between two adjacent fixed ribs. The sliding assembly includes multiple sliding clamping blocks, one of which is located on one of the fixed slots and clamps the end of the solar silicon photosheet located on the fixed slot. The rotating mounting groove is provided with multiple rotating ribs extending along the horizontal pushing direction, and a rotating groove is formed between two adjacent rotating ribs.

2. The solar silicon wafer dicing apparatus according to claim 1, characterized in that: The edge of the fixed mounting groove at the fixed clamping end is arranged collinearly with the direction of the horizontal rotation axis.

3. The solar silicon wafer dicing apparatus according to claim 1, characterized in that: The bearing bottom surface of the fixed mounting groove is provided with a sliding groove extending along the horizontal pushing direction. A slider is provided in the sliding groove. The sliding driving device is connected to the slider and drives the slider to move along the horizontal pushing direction. The sliding clamping block is provided on the slider and moves with the slider.

4. The solar silicon wafer dicing apparatus according to claim 3, characterized in that: The slider is provided with a positioning step in the fixed mounting groove. The sliding assembly also includes a sliding clamping drive device. The positioning step is used to support the end of the solar silicon photosheet. The sliding clamping drive device is connected to the sliding clamping block and drives the sliding clamping block to move toward the positioning step.

5. The solar silicon wafer dicing apparatus according to claim 1, characterized in that: The fixed clamping module includes a fixed clamping plate and a fixed clamping driving device. The fixed clamping driving device is connected to the fixed clamping plate and drives the fixed clamping plate to move toward the bearing bottom surface of the fixed mounting groove.

6. The solar silicon wafer dicing apparatus according to claim 1, characterized in that: The rotating clamping module includes a rotating clamping plate and a rotating clamping driving device. The rotating clamping driving device is connected to the rotating clamping plate and drives the rotating clamping plate to move toward the bearing bottom surface of the rotating mounting groove.

Images