Device and method for manufacturing multi-layer thin film of chip

Abstract

The invention relates to the technical field of chip coating, and discloses a manufacturing device and method for a multi-layer film of a chip. The fixed seat is arranged on the base, and a first cavity with two open sides is formed in the fixed seat; the placing frame is arranged in the first cavity, the axis of the placing frame is fixedly connected with a steering shaft, the steering shaft is rotationally connected with the fixed seat, a plurality of cavities are formed in the placing frame in the circumferential direction, and chips are assembled in the cavities; the pair of deposition chambers are arranged on the base in a sliding mode, and second cavities opened towards the fixing base are formed in the deposition chambers; the first driving mechanism is used for driving the steering shaft to rotate; the second driving mechanism is used for driving the pair of deposition chambers to slide along the base; and when the pair of deposition chambers is attached to the fixing base, the first cavity communicates with the pair of second cavities in a sealed mode, so that the chip can alternately move in the pair of second cavities when the placing frame rotates, multiple layers of films can be alternately formed on the surface of the chip, and the film coating quality is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of chip coating, and in particular to a device and method for manufacturing a chip multilayer film. Background Art

[0002] The current semiconductor technology is developing day by day. For example, light-emitting diode chips have been widely used in lighting, transportation, advertising, instrumentation, LCD backlighting and other displays due to their high brightness, low power consumption, long life, high reliability, easy driving, energy saving and environmental protection. At present, the production and use of LED chips in the world are showing a rapid upward trend, and at the same time, higher requirements are put forward for the light output efficiency of LED chips, and therefore higher requirements are put forward for the manufacturing process of chips.

[0003] During the LED manufacturing process, LED chips are the core components of LEDs. In order to prevent acid and alkali corrosion and oxidation in the external environment, a thin film is usually coated on the chip surface to avoid chip aging caused by external corrosion and oxidation. Since the protective effect of a single film deposition is not obvious enough, multi-layer film deposition is often performed. When the same film is used for the medium of the multi-layer film, it will cause cracks on the chip surface, affecting the use effect. Summary of the invention

[0004] The object of the present invention is to provide a device and method for manufacturing a chip multilayer film, aiming to solve or improve at least one of the above-mentioned technical problems.

[0005] To achieve the above object, the present invention provides the following solution: The present invention provides a device for manufacturing a chip multilayer film, comprising:

[0006] Pedestal;

[0007] A fixing seat, arranged on the base, wherein a first cavity opened on both sides is arranged in the fixing seat;

[0008] A placement rack is arranged in the first cavity, a steering shaft is fixedly connected to the axis of the placement rack, the steering shaft is rotatably connected to the fixing seat, and a plurality of cavities are circumferentially arranged on the placement rack, and the cavities are used to assemble chips;

[0009] A pair of deposition chambers are slidably disposed on the base, the pair of deposition chambers are respectively located on both sides of the fixed base, and a second cavity open toward the fixed base is disposed in the deposition chamber;

[0010] A first driving mechanism, used for driving the steering shaft to rotate;

[0011] a second driving mechanism, for driving a pair of the deposition chambers to slide along the base;

[0012] When a pair of the deposition chambers are attached to the fixing seat, the first cavity is sealed and connected to a pair of the second cavities, so that when the placement rack rotates, the chip can move alternately in the pair of the second cavities.

[0013] Optionally, the first driving mechanism includes:

[0014] A steering motor, fixedly mounted on the fixing seat;

[0015] A first bevel gear connected to the steering shaft;

[0016] The second bevel gear is connected to the output shaft of the steering motor, and the second bevel gear is meshed with the first bevel gear.

[0017] Optionally, the second driving mechanism includes:

[0018] A travel groove is provided on the base;

[0019] A screw motor is fixedly mounted on one end of the travel slot;

[0020] A bidirectional screw rod is connected to the output shaft of the screw motor, and the two threads on the bidirectional screw rod are in opposite directions;

[0021] A pair of nut seats are respectively threadedly engaged with threads at both ends of the bidirectional lead screw, the nut seats are slidably engaged in the travel groove, and the pair of nut seats are respectively connected to a pair of deposition chambers.

[0022] Optionally, a bolt is threadedly engaged in the cavity, one end of the bolt is fixedly connected to a limit block that is slidably engaged in the cavity, and the limit block is used to abut against the chip.

[0023] Optionally, a countersunk hole opened on the outer edge of the placement frame is provided at one end of the cavity away from the steering shaft, and the end of the bolt is located in the countersunk hole.

[0024] Optionally, a sealing strip is provided at the open end of the second cavity.

[0025] Optionally, the deposition chamber is provided with a plurality of air ducts connected with the second cavity.

[0026] Optionally, a control valve is provided on the air duct.

[0027] Optionally, the deposition chamber is provided with a vacuum pump connected to the second cavity.

[0028] The present invention also provides a device for manufacturing a chip multilayer film, comprising the following steps:

[0029] Chip cleaning pretreatment: clean and dry the chip surface;

[0030] Chip installation and positioning, assembling the chip in the cavity;

[0031] The device is closed and sealed, and a pair of the deposition chambers are driven by a second driving mechanism to move close to the fixing seat and fit together, so that a pair of the second cavities are sealed and connected with the first cavity;

[0032] The deposition chamber is evacuated, and the second cavity is evacuated and nitrogen is introduced;

[0033] Passing coating gas, and passing different reaction gases into a pair of the second chambers respectively;

[0034] Alternately stacking the coating, driving the placement rack to rotate by a first driving mechanism, so that the chip can be alternately moved in a pair of the second chambers, so that the chip is in contact with different reaction gases for coating;

[0035] The device is reset to unload, and the second driving mechanism drives a pair of the deposition chambers to move away from the fixing seat to take out the chip in the cavity.

[0036] The present invention discloses the following technical effects: by assembling the chip in the mold cavity and fitting a pair of deposition chambers to a fixing seat, the placement rack is enclosed in a first cavity and a pair of second cavities, and by respectively supplying different coating gases into the second cavities of a pair of deposition chambers, and coordinating the rotation of the placement rack, the chip can be alternately moved in the pair of second cavities, so that the chip alternately contacts different coating gases, and multiple layers of thin films are alternately formed on the chip surface, thereby ensuring the stability and accuracy of the coating process and guaranteeing the coating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0038] Figure 1 It is a schematic diagram of the manufacturing method of the present invention;

[0039] Figure 2 It is a front view of the present invention;

[0040] Figure 3 It is a cross-sectional view of the present invention.

[0041] In the figure: 1. base; 2. fixing seat; 3. deposition chamber; 5. placement rack; 6. cavity; 7. bolt; 8. limit block; 9. bidirectional screw; 10. nut seat; 11. vacuum pump; 12. steering shaft; 14. sealing strip; 15. air duct; 16. control valve; 17. first bevel gear; 18. steering motor; 19. second bevel gear; 20. travel groove; 21. countersunk hole; 22. screw motor. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0044] Reference Figure 1-Figure 3 The present invention provides a device for manufacturing a chip multilayer film, comprising:

[0045] Base 1;

[0046] The fixing seat 2 is arranged on the base 1, and a first cavity opened on both sides is arranged in the fixing seat 2;

[0047] The placement rack 5 is arranged in the first cavity. A steering shaft 12 is fixedly connected to the axis of the placement rack 5. The steering shaft 12 is rotatably connected to the fixed seat 2. A plurality of cavities 6 are circumferentially arranged on the placement rack 5. The cavities 6 are used to assemble chips.

[0048] A pair of deposition chambers 3 are slidably disposed on the base 1, the pair of deposition chambers 3 are respectively located on both sides of the fixed base 2, and a second cavity is disposed in the deposition chamber 3 and is open toward the fixed base 2;

[0049] A first driving mechanism, used for driving the steering shaft 12 to rotate;

[0050] A second driving mechanism is used to drive a pair of deposition chambers 3 to slide along the base 1;

[0051] When a pair of deposition chambers 3 are attached to the fixing base 2 , the first cavity is sealed and connected to the pair of second cavities, so that when the placement rack 5 rotates, the chips can move alternately in the pair of second cavities.

[0052] By assembling the chip in the mold cavity 6 and fitting a pair of deposition chambers 3 to the fixing seat 2, the placement rack is enclosed in the first cavity and the pair of second cavities. Different coating gases are respectively supplied into the second cavities of the pair of deposition chambers 3, and the placement rack 5 is rotated to enable the chip to move alternately in the pair of second cavities. The chip is alternately contacted with different coating gases, and multiple layers of thin films are alternately formed on the chip surface, thereby ensuring the stability and accuracy of the coating process and guaranteeing the coating quality.

[0053] Furthermore, the steering shaft 12 is rotatably connected to the fixing seat 2 via a sealed bearing, thereby ensuring that the gas in the deposition chamber 3 does not leak to the outside while allowing the steering shaft 12 to rotate smoothly.

[0054] In one embodiment of the present invention, the first driving mechanism comprises:

[0055] The steering motor 18 is fixedly mounted on the fixing seat 2;

[0056] A first bevel gear 17 connected to the steering shaft 12;

[0057] The second bevel gear 19 is connected to the output shaft of the steering motor 18 , and the second bevel gear 19 is meshed with the first bevel gear 17 .

[0058] The second bevel gear 19 is driven to rotate by the steering motor 18 , and the second bevel gear 19 drives the first bevel gear 17 meshing therewith to rotate, thereby driving the steering shaft 12 to rotate and causing the placement rack 5 to rotate.

[0059] In one embodiment of the present invention, the second driving mechanism comprises:

[0060] The travel groove 20 is formed on the base 1;

[0061] The screw motor 22 is fixedly mounted on one end of the travel slot 20;

[0062] The bidirectional screw rod 9 is connected to the output shaft of the screw motor 22, and the two threads on the bidirectional screw rod 9 are in opposite directions;

[0063] A pair of nut seats 10 are respectively threadedly engaged with threads at both ends of the bidirectional lead screw 9 , and the nut seats 10 are slidably engaged in the travel groove 20 . The pair of nut seats 10 are respectively connected to a pair of deposition chambers 3 .

[0064] The bidirectional screw 9 is driven to rotate by the screw motor 22, and the threads at both ends of the bidirectional screw 9 cooperate with each other to enable a pair of nut seats 10 to move closer to or away from each other, and the side walls of the nut seats 10 are in contact with the side walls of the stroke groove 20 to achieve guide limiting for the nut seats 10.

[0065] In one embodiment of the present invention, the inner thread of the cavity 6 is equipped with a bolt 7, one end of the bolt 7 is fixedly connected to a limit block 8 that is slidably fitted in the cavity 6, and the limit block 8 is used to abut against the chip.

[0066] By rotating the bolt 7, the limit block 8 can be driven to move in the cavity 6 to clamp the chip, ensuring that the chip is stably fixed in the cavity 6 during the coating process to prevent movement or dislocation caused by rotation or gas flow.

[0067] In one embodiment of the present invention, a countersunk hole 21 opened on the outer edge of the placement frame 5 is provided at one end of the cavity 6 away from the steering shaft 12, and the end of the bolt 7 is located in the countersunk hole 21. By providing the countersunk hole 21, the bolt 7 can be prevented from interfering with the rotation of the placement frame 5.

[0068] In one embodiment of the present invention, a sealing strip 14 is provided at the open end of the second cavity, and the sealing strip 14 is provided to ensure that the gas inside the deposition chamber will not leak when the feed port is closed.

[0069] In one embodiment of the present invention, a plurality of air ducts 15 communicating with the second cavity are provided on the deposition chamber 3, and the air ducts 15 are used to introduce the gas required for coating.

[0070] In one embodiment of the present invention, a control valve 16 is provided on the air duct 15, and the control valve 16 can accurately control the flow rate and on-off of the gas.

[0071] In one embodiment of the present invention, a vacuum pump 11 connected to the second cavity is provided on the deposition chamber 3. The vacuum pump 11 is used to extract the gas in the deposition chamber 3 before coating to form a vacuum environment.

[0072] The present invention also provides a device for manufacturing a chip multilayer film, comprising the following steps:

[0073] Chip cleaning pretreatment, cleaning and drying the chip surface, specifically, using an ultrasonic cleaning machine to clean the chip surface, and placing it in a vacuum dryer for drying after cleaning; removing dirt and impurities on the chip surface by ultrasonic cleaning, and then drying it in a vacuum dryer to remove moisture, providing a clean and dry surface for the subsequent coating process, and adding an appropriate amount of surfactant to the cleaning solution to enhance the cleaning effect, so as to quickly and effectively remove dirt and grease on the chip surface, and facilitate subsequent repeated alternating coating;

[0074] Furthermore, the ultrasonic cleaning machine is equipped with anhydrous ethanol and the cleaning time is 10 minutes. It has good decontamination ability and volatility, and can quickly and effectively remove dirt and grease on the chip surface. The vacuum dryer has an operating temperature of 90°C and a drying time of 5 minutes, which can accelerate the evaporation of water while avoiding heat damage to the chip caused by excessively high temperatures.

[0075] Chip installation and positioning: assemble the chip in the cavity 6. Specifically, rotate the bolt 7 to move the limit block 8, so as to limit and fix the chip. By limiting and fixing the chip, the spacing between the chips is ensured to be consistent, so as to avoid mutual interference during the coating process and ensure the uniformity of the coating.

[0076] The device is closed and sealed, and a pair of deposition chambers 3 are driven by a second driving mechanism to move close to the fixed seat 2 and fit together, so that the pair of second cavities are sealed and connected with the first cavity;

[0077] The deposition chamber is evacuated, and the second cavity is evacuated and nitrogen is introduced. Specifically, a pair of deposition chambers 3 are respectively evacuated with vacuum pumps 11, and nitrogen is introduced to replace the air. The vacuum treatment can remove the air in the deposition chamber 3 to avoid the influence of oxygen, water vapor, etc. on the coating process, and the introduction of nitrogen for replacement can further ensure the purity of the coating environment.

[0078] A coating gas is introduced, and different reaction gases are introduced into a pair of second chambers respectively, so as to form an evaporation film on the surface of the chip. Specifically, the evaporation source material in the deposition chamber 3 is heated and evaporated into gas, and then these gases react with the introduced reaction gas to form a desired film on the surface of the chip. Different reaction gases will lead to the formation of different types of films;

[0079] Alternately stack the coating, drive the placement rack 5 to rotate through the first driving mechanism, so that the chip can be alternately moved in a pair of second cavities, so that the chip is in contact with different reaction gases for coating, thereby alternately forming multiple layers of thin films on the chip surface; specifically, different reaction gases or materials are introduced into different deposition chambers 3 respectively, and the placement rack 5 is driven to rotate through the steering shaft 12, so that the chip enters different deposition chambers in turn for coating, and each deposition chamber is equipped with corresponding deposition equipment and control system to ensure the uniformity and quality of the film;

[0080] The equipment is reset to unload, and a pair of deposition chambers 3 are driven by the second driving mechanism to move away from the fixing seat 2 to take out the chip in the cavity 6.

[0081] The method ensures the stability and accuracy of the coating process. The coordinated operation of various components enables the chip to alternately pass through a pair of deposition chambers 3, thereby alternately forming multiple layers of thin films on the chip surface.

[0082] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0083] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A device for manufacturing a multi-layer thin film on a chip, characterized in that: include: Base (1); A fixing seat (2) is arranged on the base (1), and a first cavity with two sides open is arranged in the fixing seat (2); A placement rack (5) is arranged in the first cavity, a steering shaft (12) is fixedly connected to the axis of the placement rack (5), the steering shaft (12) is rotatably connected to the fixed seat (2), and a plurality of cavities (6) are circumferentially arranged on the placement rack (5), and the cavities (6) are used to assemble chips; A pair of deposition chambers (3) are slidably arranged on the base (1), the pair of deposition chambers (3) are respectively located on both sides of the fixed base (2), and a second cavity is arranged in the deposition chamber (3) and is open toward the fixed base (2); A first driving mechanism, used for driving the steering shaft (12) to rotate; A second driving mechanism, used for driving a pair of the deposition chambers (3) to slide along the base (1); When a pair of the deposition chambers (3) are fitted with the fixing seat (2), the first cavity is sealed and connected to a pair of the second cavities, so that when the placement rack (5) rotates, the chip can move alternately in the pair of the second cavities.

2. The device for manufacturing a multi-layer thin film on a chip according to claim 1, characterized in that: The first driving mechanism comprises: A steering motor (18) is fixedly mounted on the fixing seat (2); A first bevel gear (17) connected to the steering shaft (12); The second bevel gear (19) is connected to the output shaft of the steering motor (18), and the second bevel gear (19) is meshed with the first bevel gear (17).

3. The device for manufacturing a multi-layer thin film on a chip according to claim 1, characterized in that: The second driving mechanism comprises: A travel groove (20) is provided on the base (1); A screw motor (22) is fixedly mounted on one end of the travel slot (20); A bidirectional screw (9) connected to the output shaft of the screw motor (22), wherein the two threads on the bidirectional screw (9) are in opposite directions; A pair of nut seats (10) are respectively threadedly engaged with threads at both ends of the bidirectional screw rod (9); the nut seats (10) are slidably engaged in the travel groove (20); and the pair of nut seats (10) are respectively connected to a pair of deposition chambers (3).

4. The device for manufacturing a multi-layer thin film on a chip according to claim 1, characterized in that: The inner thread of the cavity (6) is fitted with a bolt (7), one end of the bolt (7) is fixedly connected with a limit block (8) that is slidably fitted in the cavity (6), and the limit block (8) is used to abut against the chip.

5. The device for manufacturing a multi-layer thin film for a chip according to claim 4, characterized in that: A countersunk hole (21) opened on the outer edge of the placement frame (5) is provided at one end of the mold cavity (6) away from the steering shaft (12), and the end of the bolt (7) is located in the countersunk hole (21).

6. The device for manufacturing a multi-layer thin film for a chip according to claim 1, characterized in that: The open end of the second cavity is provided with a sealing strip (14).

7. The device for manufacturing a multi-layer thin film for a chip according to claim 1, characterized in that: The deposition chamber (3) is provided with a plurality of air ducts (15) which are in communication with the second cavity.

8. The device for manufacturing a chip multilayer film according to claim 7, characterized in that: The air duct (15) is provided with a control valve (16).

9. The device for manufacturing a chip multilayer film according to claim 1, characterized in that: The deposition chamber (3) is provided with a vacuum pump (11) which is in communication with the second cavity.

10. A device for manufacturing a multi-layer thin film for a chip, based on the device for manufacturing a multi-layer thin film for a chip according to any one of claims 1 to 9, characterized in that: The following steps are involved: Chip cleaning pretreatment: clean and dry the chip surface; Chip installation and positioning, assembling the chip in the cavity (6); The device is closed and sealed, and a pair of the deposition chambers (3) are driven by a second driving mechanism to move close to the fixing seat (2) and fit together, so that a pair of the second cavities are sealed and connected with the first cavity; The deposition chamber is evacuated, and the second cavity is evacuated and nitrogen is introduced; Passing coating gas, and passing different reaction gases into a pair of the second chambers respectively; Alternately stacking the coating, driving the placement rack (5) to rotate by a first driving mechanism, so that the chip can be alternately moved in a pair of the second cavities, so that the chip contacts different reaction gases for coating; The device is reset to unload, and the second driving mechanism drives a pair of the deposition chambers (3) to move away from the fixing seat (2), thereby taking out the chip in the cavity (6).

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