Control circuit board surface chemical immersion gold device and immersion gold method

Abstract

The invention belongs to the technical field of circuit board processing, and particularly relates to a control circuit board surface chemical immersion gold device which comprises an immersion gold box, electric push rods are arranged on the two end faces of the immersion gold box, fixing blocks are fixedly connected to the two sides of each electric push rod, the fixing blocks and the immersion gold box are fixedly installed, and a fixing bracket is installed at the piston rod end of each electric push rod. A fixing plate is installed between the fixing brackets, two fixing cylinders are installed on each of the two sides of the lower end face of the fixing plate, air storage cavities are formed in inner cavities of the fixing cylinders, and telescopic columns are slidably connected to inner cavities of the air storage cavities, so that the problems that the operation mode is tedious, a large amount of time is wasted for cleaning a plurality of circuit boards, and the working efficiency is high are solved. And after the gold immersion operation of the circuit board is completed, a bracket needs to be lifted to wait for the chemical solution on the surface of the circuit board to flow back to the gold immersion box, and the chemical solution on the surface can be collected for the gold immersion operation of the next batch of circuit boards after being dried, so that the gold immersion operation efficiency of the circuit board is low.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board processing, in particular to a device and method for controlling chemical gold deposition on the surface of a circuit board. Background Art

[0002] In the circuit board manufacturing process, surface treatment is a crucial link. As an advanced surface treatment technology, chemical gold immersion can significantly improve the circuit board's anti-oxidation, anti-corrosion and welding performance. Therefore, in the circuit board production and preparation process, chemical gold immersion equipment is usually used to perform chemical gold immersion treatment on the circuit board.

[0003] A patent with publication number CN118086881B discloses a device for controlling chemical gold deposition on the surface of a circuit board. The telescopic rod of the electric push rod of the patent drives the lifting frame to move downward, and the hanging frame and the circuit board body move downward under the action of gravity. The hanging frame drives the limit rod and the compression spring to move downward. The limit rod moves downward and gradually disengages from the double-bevel block, and the double-bevel block no longer limits the limit rod. The two groups of compression springs will recover under the action of elastic force and drive the two limit rods to move in a direction close to each other, so that the two limit rods contact the top of the circuit board body, so that the two limit rods limit the top of the circuit board body, which is convenient for subsequent more stable cleaning and gold deposition operations on the circuit board body. When the hanging frame moves downward, it will drive the raised frame to move downward, so that the swing frame intermittently swings back and forth, so that the two wiping strips in each group wipe the surface of the circuit board body, which can remove impurities on the surface of the circuit board body, and facilitate the subsequent chemical solution containing gold ions to more fully contact the surface of the circuit board body, thereby improving the gold deposition effect of the circuit board body.

[0004] The above scheme still has some problems in practical application. Usually, the circuit board is wiped clean on both sides in advance, and then mounted on a bracket for placement. The driving bracket drives the circuit board to slide into the gold immersion box, and the chemical solution containing gold ions in the gold immersion box flows over the circuit board, and then the gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the circuit board to form a layer of metal film. However, this operation method wastes a lot of time for cleaning multiple circuit boards, and after the gold immersion operation of the circuit board is completed, the bracket needs to be lifted to wait for the chemical solution on the surface of the circuit board to flow back to the gold immersion box, and the surface chemical solution needs to be dried before it can be collected for the next batch of circuit boards for gold immersion operation, resulting in low efficiency of the circuit board gold immersion operation.

[0005] To this end, the present invention provides a device and method for controlling chemical gold deposition on the surface of a circuit board. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problems is: a device for controlling chemical gold deposition on the surface of a circuit board described in the present invention comprises a gold deposition box, electric push rods are arranged on both end surfaces of the gold deposition box, and fixed blocks are fixedly connected to both sides of the electric push rods, and the fixed blocks are fixedly installed with the gold deposition box, a fixed bracket is installed at the piston rod end of the electric push rod, a fixed plate is installed between the fixed brackets, two fixed cylinders are installed on both sides of the lower end surface of the fixed plate, an air storage cavity is opened in the inner cavity of the fixed cylinder, and a telescopic column is slidably connected to the inner cavity of the air storage cavity, and one end of the telescopic column passes through the fixed plate and is fixedly connected to a mounting frame, and the mounting frame is used to place the circuit board, and a circuit board separation and cleaning component is arranged between the mounting frames;

[0008] The electric separation cleaning assembly includes a plurality of transmission shafts rotatably connected between the mounting frames, wherein the interiors of the plurality of transmission shafts are hollow, wherein the transmission shafts are provided with a plurality of through slots at the middle positions, and a magnetic rod is slidably installed in the inner cavity of the transmission shaft, and the magnetic rod is used to absorb metal dust on the surface of the circuit board;

[0009] A liquid replacement port is provided at the lower part of one side of the gold sinking box, and a plurality of fixed columns are arranged above the inner cavity of the gold sinking box, and the plurality of fixed columns are rotatably connected to two scrapers outside, wherein one end of each of the two scrapers is fixedly connected to a torsion spring, and one end of the torsion spring is fixedly connected to the fixed column.

[0010] Preferably, a fluff brush is provided on the outside of the transmission shaft for brushing and cleaning metal dust on the surface of the circuit board. Two U-shaped cleaning brushes are fixedly connected on both sides of the mounting frame, and the U-shaped cleaning brushes are arranged in a triangular shape close to each other at one end, for cleaning metal dust on the surface of the circuit board and guiding it into the inner cavity of the U-shaped cleaning brush for collection, and the inner cavity of the U-shaped cleaning brush is provided with a magnetic sheet for adsorbing and collecting metal dust.

[0011] Preferably, both end surfaces of the gold sinking box are fixedly connected with a solution mixing assembly, and the solution mixing assembly includes four fixed rods fixedly connected to the two end surfaces of the gold sinking box, and two of the fixed rods form a group and are fixedly connected to both sides of one end surface of the gold sinking box, an air cavity is opened inside the fixed rod, and a sliding column is slidably connected inside the air cavity, and the upper end of the sliding column is fixedly installed with a fixed bracket.

[0012] Preferably, the sliding column is located in the air cavity and fixedly connected to a first piston at one end, the lower end of the fixed rod is fixedly connected to an air duct, and the air duct is connected to the air cavity, one end of the air duct is fixedly connected to a gold sinking box, and the air duct and the gold sinking box are fixedly connected, and a one-way valve is provided in the inner cavity, and the one-way valve can only be flipped open toward the inner cavity of the gold sinking box, an air inlet is opened between the fixed rods, the inner cavity of the air inlet is connected to the lower part of the inner cavity of the air cavity, and the inner cavity of the air inlet is provided with a one-way valve, and the one-way valve can only be flipped open toward the inner cavity of the air cavity.

[0013] Preferably, the inner wall of the gold sinking box is fixedly connected to two exhaust mixing tubes, and the two exhaust mixing tubes are provided with a plurality of tiny pores in a semicircular shape on the outside, wherein the tiny pores are gradually reduced from the inner cavity of the exhaust mixing tube to the outside and are arranged in a conical shape, and the inner cavity of the tiny pores is provided with a rubber cushion layer, which is used for slowly discharging pressurized air to impact the chemical solution containing gold ions for mixing treatment, wherein after the air in the inner cavity of the exhaust mixing tube and the chemical solution in the inner cavity of the gold sinking box reach an equilibrium value, the chemical solution containing gold ions cannot enter the inner cavity of the exhaust mixing tube through the micro pores.

[0014] Preferably, air inlets and outlets are provided between the fixed rods, and the air inlets and outlets are connected to the upper part of the inner cavity of the air cavity, a telescopic hose is fixedly connected to the inner cavity of the air inlet and outlet, one end of the telescopic hose is fixedly connected to the air storage cavity, one end of the telescopic column is located in the air storage cavity and is fixedly connected to a second piston, a plurality of blowing ports are provided on the outside of the fixed cylinder, and the plurality of blowing ports are connected to the upper part of the inner cavity of the air storage cavity for blowing air to move the circuit board.

[0015] Preferably, two grids are installed on both sides of the upper end surface of the gold sinking box, and a plurality of racks are installed on the inner walls of the two grids. The transmission shaft is located on the outside of one end of the inner cavity of the grid and is fixed with a gear, and the gear is meshingly connected with the rack to drive the transmission shaft to rotate and clean the metal dust on the surface of the circuit board.

[0016] Preferably, a plurality of grooves are provided on the upper end surface of the mounting frame, and the inner walls of the plurality of grooves are arranged in a semicircular arc surface, for guiding the rapid placement and installation of the circuit board, the inner wall of the groove is symmetrically provided with two receiving grooves, and springs are fixedly connected to the bottom of the inner cavities of the two receiving grooves, a stop block is fixedly connected to one end of the spring, and the stop block is arranged in a semicircular shape at one end of the inner cavity of the groove, for pressing and limiting the circuit board.

[0017] A method for controlling chemical gold deposition on the surface of a circuit board is applied to a chemical gold deposition device, comprising the following steps:

[0018] S1. Preparation: Install the control circuit boards one by one in the grooves in the mounting frame, and use the limit assembly in the groove to limit the circuit boards. During the installation of the circuit boards, use the transmission shaft and the fluff brush to brush and clean the surface of the circuit boards, and then use the magnetic rod to absorb and collect the metal dust cleaned by the fluff brush through the through groove. When the circuit boards are installed, they pass between two scrapers, and the scrapers can be used to clean their surfaces for a second time until the mounting frame is fully installed with circuit boards.

[0019] S2. Control circuit board lifting operation: After the control circuit board is installed on the mounting frame, the mounting frame is driven to move downward, and the control circuit board is driven to slide into the inner cavity of the gold sinking box, so that the control circuit board is inserted into the chemical solution containing gold ions;

[0020] S3, chemical solution mixing: The chemical solution containing gold ions is stirred and mixed by driving the stirring component, so that the gold ions are evenly dispersed in the chemical solution, so as to ensure that the gold ions fully contact the control circuit board, and then the gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the control circuit board to form a uniform metal film, and then the control circuit board is lifted from the gold sink box, and the chemical solution on the surface of the control circuit board is emptied, and the control circuit board is collected after being dried;

[0021] S4, post-processing: clean, dry and inspect the control circuit board after immersion gold to ensure that the quality of immersion gold meets the requirements, thus completing the immersion gold operation of the control circuit board.

[0022] Preferably, the stirring component in S3 uses an air mixing component to stir and mix the chemical solution containing gold ions, so that the gold ions are evenly dispersed in the chemical solution, while preventing the stirring component from hitting the circuit board during operation.

[0023] The beneficial effects of the present invention are as follows:

[0024] 1. The device and method for chemical gold deposition on the surface of a control circuit board described in the present invention comprises the following steps: installing the circuit board on a mounting frame, passing a transmission shaft through the circuit board surface and brushing the circuit board surface with a fluff brush to clean the metal dust, and then collecting the cleaned metal dust by adsorbing the magnetic rod through a through groove. The circuit board is also inserted between two scrapers, and the scrapers are twisted to fit the circuit board surface with a torsion spring. The circuit boards are separated by a transmission shaft so that there are gaps between the circuit boards, so as to better perform gold deposition on the circuit board and prevent dust impurities from being present on the surface of the control circuit board. If the dust impurities on the surface are not cleaned, the quality of the gold deposition processing will be affected, resulting in problems such as short circuits on the control circuit board in the later stage.

[0025] 2. The device and method for controlling chemical gold deposition on the surface of a circuit board described in the present invention push the fixing rod downward through the fixing bracket, and push the first piston to slide and move downward inside the air cavity, thereby squeezing the air in the air cavity and discharging it into the exhaust mixing pipe, and the exhaust mixing pipe is provided with a plurality of tiny air holes in a semicircular shape on the outside, wherein the tiny air holes gradually decrease from the inner cavity of the exhaust mixing pipe to the outside in a conical shape, and a rubber cushion layer is provided in the inner cavity of the tiny air holes, thereby allowing air to impact the rubber cushion layer in the tiny air holes to open and discharge, and then flushing the statically precipitated gold ions to make them evenly dispersed in the chemical solution. The gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the circuit board to form a uniform metal film, thereby solving the problem that when the control circuit board is placed in the gold immersion box for gold immersion, if the chemical solution containing gold ions is not stirred and mixed to make the gold ions evenly dispersed in the chemical solution, it is difficult for the control circuit board to fully contact with the gold ions in the chemical solution, resulting in poor gold immersion effect of the control circuit board and affecting the quality of the finished circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below in conjunction with the accompanying drawings.

[0027] Figure 1 It is a schematic diagram of the structure of the main view of the present invention as a whole;

[0028] Figure 2 It is a schematic diagram of the structure of the rear-view stereogram of the present invention;

[0029] Figure 3 It is a schematic diagram of the overall structure of the fixing bracket of the present invention;

[0030] Figure 4 It is a schematic diagram of the transmission shaft installation structure of the present invention;

[0031] Figure 5 It is a schematic diagram of the fixing cylinder installation structure of the present invention;

[0032] Figure 6 It is a schematic diagram of the overall structure of the grid of the present invention;

[0033] Figure 7 It is a schematic diagram of the internal structure of a half-section of a fixing rod of the present invention;

[0034] Figure 8 It is a schematic diagram of the internal structure of a partial cross-section of the mounting frame of the present invention;

[0035] Fig. 9 It is a schematic diagram of the overall structure of the transmission shaft of the present invention;

[0036] Fig.10 This is a schematic diagram of the overall structure of the scraper installation of the present invention;

[0037] Fig.11 This is a schematic diagram showing the structure of the air outlet of the present invention;

[0038] In the figure: 1. gold sinking box; 2. electric push rod; 3. solution mixing component; 31. fixed rod; 32. air inlet; 33. telescopic hose; 34. sliding column; 35. air guide tube; 36. exhaust mixing tube; 37. air cavity; 38. first piston; 39. air inlet and outlet; 4. fixed bracket; 5. circuit board; 6. liquid exchange port; 7. grid; 8. rack; 9. mounting frame; 10. fixed plate; 11. transmission shaft; 12. fixed cylinder; 13. U-shaped cleaning brush; 14. cleaning brush cylinder; 15. groove; 16. gear; 17. telescopic column; 18. air storage chamber; 19. second piston; 20. storage slot; 21. spring; 22. block; 23. fixed block; 24. magnetic rod; 25. through slot; 26. air outlet; 27. fixed column; 28. scraper; 29. ​​torsion spring. DETAILED DESCRIPTION

[0039] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0040] Embodiment 1

[0041] like Figures 1 to 10 As shown, a device for controlling chemical gold deposition on the surface of a circuit board according to an embodiment of the present invention comprises a gold deposition box 1, electric push rods 2 are arranged on both end surfaces of the gold deposition box 1, and both sides of the electric push rods 2 are fixedly connected with fixed blocks 23, and the fixed blocks 23 are fixedly installed with the gold deposition box 1, and the piston rod end of the electric push rod 2 is installed with a fixed bracket 4, and a fixed plate 10 is installed between the fixed brackets 4, and two fixed cylinders 12 are installed on both sides of the lower end surface of the fixed plate 10, and an air storage cavity 18 is opened in the inner cavity of the fixed cylinder 12, and a telescopic column 17 is slidably connected to the inner cavity of the air storage cavity 18, and one end of the telescopic column 17 penetrates the fixed plate 10 and is fixedly connected with a mounting frame 9, and the mounting frame 9 is used to place the circuit board 5, and a circuit board separation and cleaning component is arranged between the mounting frames 9;

[0042] The electric separation cleaning assembly includes a plurality of transmission shafts 11 rotatably connected between the mounting frames 9, wherein the plurality of transmission shafts 11 are hollow inside, wherein the transmission shafts 11 are provided with a plurality of through slots 25 at the middle position, and a magnetic rod 24 is slidably installed in the inner cavity of the transmission shaft 11, and the magnetic rod 24 is used to absorb metal dust on the surface of the circuit board 5;

[0043] A liquid exchange port 6 is provided at the lower part of one side of the gold sinking box 1, and a plurality of fixed columns 27 are provided above the inner cavity of the gold sinking box 1, and the plurality of fixed columns 27 are rotatably connected to two scrapers 28 on the outside, wherein one end of the two scrapers 28 are fixedly connected to a torsion spring 29, and one end of the torsion spring 29 is fixedly connected to the fixed column 27, one end of the scraper 28 is arranged in a semicircular arc shape, and brushes are evenly arranged thereon, a collecting chamber is provided in one end of the scraper 28, and a metal dust adsorption block is arranged in the collecting chamber for collecting the metal dust cleaned by the adsorption brush.

[0044] Specifically, in the prior art, both sides of the circuit board are usually cleaned one by one in advance to prevent metal dust and other debris on the surface from affecting the gold immersion effect, and then the circuit board is mounted on a bracket for placement, and the spacing between each circuit board is adjusted, and then the bracket is mounted on a lifting component, and the lifting component drives the bracket to move downward and slide into the gold immersion box, and the chemical solution containing gold ions in the gold immersion box is made to flow over the circuit board, and then the gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the circuit board to form a uniform metal film, thereby completing the gold immersion operation. However, this operation method is not only cumbersome, but also requires a lot of time to clean multiple circuit boards, and after the gold immersion operation of the circuit board is completed, the bracket needs to be hoisted to wait for the chemical solution on the surface of the circuit board to flow back to the gold immersion box, and the surface chemical solution can be collected only after it is dried to carry out the gold immersion operation of the next batch of circuit boards, resulting in the problem of low efficiency of the circuit board gold immersion operation;

[0045] The present invention installs the circuit board 5 on the mounting frame 9, and allows the circuit board 5 to pass through the transmission shaft 11. The magnetic rod 24 inside the transmission shaft 11 absorbs and collects the metal powder on the surface of the circuit board 5 through the through slot 25. At the same time, the circuit board 5 is inserted between two scrapers 28, and the scrapers 28 are twisted by the torsion spring 29 to fit the surface of the circuit board 5. The transmission shaft 11 can separate the circuit boards 5 so that there are gaps between the circuit boards 5. After the circuit boards 5 are fully installed on the mounting frame 9, the mounting frame 9 will push the telescopic column under the gravity of the circuit board 5. 17 moves downward, and after the circuit board 5 slides over the scraper 28, the scraper 28 will use a brush to perform secondary cleaning of the metal dust on the surface of the circuit board 5, and the cleaned metal dust will flow into the collection chamber along the surface of the scraper 28, and will be adsorbed and collected by the metal dust adsorption block to prevent the wind from blowing dust. Then the telescopic column 17 slides in the inner cavity of the air storage chamber 18, so that the mounting frame 9 is fitted with the fixing plate 10, and the electric push rod 2 is started to drive the fixing bracket 4 to move downward, so that the fixing bracket 4 drives the fixing plate 10 to move downward , and at the same time drive the mounting frame 9 and the circuit board 5 to move synchronously, so that the circuit board 5 slides into the inner cavity of the gold sinking box 1, and is inserted into the chemical solution containing gold ions in the gold sinking box 1, and then the gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the circuit board 5 to form a uniform metal film, thereby completing the gold sinking operation. When the circuit board 5 is subjected to the gold sinking operation, the operator extracts the magnetic rod 24 inside the transmission shaft 11, and then cleans and recovers the metal dust adsorbed on the outside of the magnetic rod 24. After the gold sinking work is completed, the electric push rod 2 The fixed bracket 4 is driven to move upward, and the fixed bracket 4 drives the fixed plate 10 to move synchronously with the mounting frame 9 and the circuit board 5. During the upward movement of the fixed plate 10, air is injected into the bottom of the inner cavity of the fixed cylinder 12, and the air drives the telescopic column 17 to move upward, thereby pushing the mounting frame 9 to drive the circuit board 5 to move upward, and the scraper 28 is close to the surface of the circuit board 5, and the distance between them is between 5 mm and 1 mm. During the upward movement of the circuit board 5, the scraper 28 is used to scrape and clean the water stains on the surface of the circuit board 5, thereby solving the above problem.

[0046] like Figures 3 to 5 and Fig. 9 As shown, a fluff brush is arranged on the outside of the transmission shaft 11 for brushing and cleaning the metal dust on the surface of the circuit board 5, and two U-shaped cleaning brushes 13 are fixedly connected on both sides between the mounting frames 9, and the U-shaped cleaning brushes 13 are arranged in a triangular shape close to each other at one end, for cleaning the metal dust on the surface of the circuit board 5, and guiding it into the inner cavity of the U-shaped cleaning brush 13 for collection, and the inner cavity of the U-shaped cleaning brush 13 is provided with a magnetic sheet for adsorbing and collecting metal dust.

[0047] Specifically, the circuit board 5 is installed on the mounting frame 9, and the circuit board 5 passes through the transmission shaft 11, and the fluff brush outside the transmission shaft 11 is used to brush the surface of the circuit board 5 to clean the metal dust, and the metal dust is adsorbed and collected by the magnetic rod 24 inside the transmission shaft 11 through the through groove 25. Moreover, after the circuit boards 5 located on both sides of the mounting frame 9 are between the transmission shaft 11 and the U-shaped cleaning brush 13, the metal dust on the surface of the circuit board 5 can be cleaned by the U-shaped cleaning brush 13, and the cleaned metal dust can be adsorbed and collected by the magnetic sheet in the inner cavity of the U-shaped cleaning brush 13. Moreover, the circuit board 5 will be inserted between the two scrapers 28, and the scraper 28 is twisted to fit the surface of the circuit board 5 by the torsion spring 29. Moreover, the transmission shaft 11 can separate the circuit board 5 so that there are gaps between the circuit boards 5, so as to better perform the gold sinking operation on the circuit board 5 and prevent dust impurities on the surface of the control circuit board. If the dust impurities on its surface are not cleaned, the quality of the gold sinking processing will be affected, resulting in problems such as short circuit in the control circuit board in the later stage.

[0048] like Figure 3 , Figure 4 and Figure 7 As shown, both end surfaces of the gold sinking box 1 are fixedly connected with a solution mixing assembly 3, and the solution mixing assembly 3 includes four fixed rods 31 fixedly connected to the two end surfaces of the gold sinking box 1, and two fixed rods 31 form a group and are fixedly connected to both sides of one end surface of the gold sinking box 1, an air cavity 37 is opened inside the fixed rod 31, and a sliding column 34 is slidably connected inside the air cavity 37, and the upper end of the sliding column 34 is fixedly installed with the fixed bracket 4.

[0049] like Figures 3 to 5 and Figure 7 As shown, the sliding column 34 is located in the air cavity 37 and is fixedly connected to the first piston 38 at one end. The lower end of the fixed rod 31 is fixedly connected to an air guide pipe 35, and the air guide pipe 35 is connected to the air cavity 37. One end of the air guide pipe 35 is fixedly connected to the gold sinking box 1, and the air guide pipe 35 is fixedly connected to the gold sinking box 1, and a one-way valve is provided in the inner cavity, and the one-way valve can only be flipped open toward the inner cavity of the gold sinking box 1. An air inlet 32 ​​is opened between the fixed rods 31, and the inner cavity of the air inlet 32 ​​is connected to the lower part of the inner cavity of the air cavity 37, and a one-way valve is provided in the inner cavity of the air inlet 32, wherein the one-way valve can only be flipped open toward the inner cavity of the air cavity 37.

[0050] like Figures 3 to 5 and Figure 7As shown, two exhaust mixing tubes 36 are fixedly connected to the inner wall of the gold sinking box 1, and a plurality of tiny air holes are opened on the outside of the two exhaust mixing tubes 36 in a semicircular shape, wherein the tiny air holes are gradually reduced from the inner cavity of the exhaust mixing tube 36 to the outside in a conical shape, and a rubber cushion layer is provided in the inner cavity of the tiny air holes for slowly discharging pressurized air to impact the chemical solution containing gold ions for mixing treatment, wherein after the air in the inner cavity of the exhaust mixing tube 36 and the chemical solution in the inner cavity of the gold sinking box 1 reach an equilibrium value, the chemical solution containing gold ions cannot enter the inner cavity of the exhaust mixing tube 36 through the micro air holes.

[0051] Specifically, when the driving circuit board 5 slides into the inner cavity of the gold sinking box 1, the fixing bracket 4 pushes the fixing rod 31 to move downward, and the fixing rod 31 pushes the first piston 38 to slide and move downward inside the air cavity 37, so that the first piston 38 squeezes the air in the air cavity 37, and the air pushes open the one-way valve inside the gold sinking box 1 and is discharged into the exhaust mixing pipe 36, and the exhaust mixing pipe 36 is provided with a plurality of tiny pores in a semicircular shape on the outside, wherein the tiny pores are gradually reduced from the inner cavity of the exhaust mixing pipe 36 to the outside and are arranged in a conical shape, and the inner cavity of the tiny pores A rubber cushion is provided, so that the air impacts the rubber cushion in the tiny pores to open it, and then discharges into the chemical solution containing gold ions in the gold sinking box 1. At the same time, part of the air will impact the chemical solution at the bottom of the inner cavity of the gold sinking box 1, and the static precipitated gold ions will be flushed up to make them evenly dispersed in the chemical solution. In this way, the control circuit board can be fully contacted with the chemical solution containing gold ions. At the same time, the gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the circuit board 5 to form a uniform metal film, thereby improving the gold sinking effect of the control circuit board. The first piston 38 is moved synchronously, and the first piston 38 draws the air in the air cavity 37 to form a negative pressure, thereby opening the one-way valve in the inner cavity of the air inlet 32, and then draws the external air into the air cavity 37. At the same time, the operator collects the circuit board 5 in the inner cavity of the fixed bracket 4, replaces the new circuit board 5 to be immerged in gold, and then drives the circuit board 5 into the immersion gold box 1 again for immersion gold work, and squeezes the air in the air cavity 37 again to impact the chemical solution containing gold ions for full mixing, thereby improving the immersion gold effect of the circuit board 5, thereby solving the problem that the existing control circuit board surface chemical immersion gold device is difficult to fully contact with the gold ions in the chemical solution when the control circuit board is placed in the immersion gold box for immersion gold work.

[0052] like Figures 3 to 5 , Figure 7 and Figure 8As shown, an air inlet and outlet 39 is opened between the fixed rods 31, and the air inlet and outlet 39 is connected to the upper part of the inner cavity of the air cavity 37, and the inner cavity of the air inlet and outlet 39 is fixedly connected with a telescopic hose 33, one end of the telescopic hose 33 is fixedly connected to the air storage cavity 18, the telescopic column 17 is located in the air storage cavity 18 and one end is fixedly connected to the second piston 19, a plurality of blowing ports 26 are opened on the outside of the fixed cylinder 12, and the plurality of blowing ports 26 are connected to the upper part of the inner cavity of the air storage cavity 18, for blowing air to move the circuit board 5.

[0053] Specifically, after air is injected into the bottom of the inner cavity of the fixing cylinder 12 through the telescopic hose 33, the air pushes up the second piston 19 to push the telescopic column 17 upward, and then the telescopic column 17 pushes the mounting frame 9 to move upward for reset, and at the same time, the mounting frame 9 drives the circuit board 5 to move synchronously to wait for collection. In the process of the second piston 19 moving upward, the air in the upper part of the inner cavity of the air storage chamber 18 will be squeezed and discharged through the blowing port 26, and the blown air will blow in the direction of approaching each other, such as Fig.11 The air flow direction is shown, and the air is made to flow into the circuit boards 5 to quickly dry the circuit boards 5. In addition, according to the usage, the two fixed cylinders 12 can be connected by a heating tube, so that the air outlets 26 of the two fixed cylinders 12 are connected to the heating tube, and the blown air is heated by the heating tube, and then blown into the circuit boards 5 to dry them, thereby improving the rapid drying of the circuit boards after gold deposition, and solving the problem that the existing control circuit board surface chemical gold deposition device uses a fan to dry the circuit board and blows away the excess chemical solution containing gold ions on the circuit board surface. However, the excessive wind force of the fan can easily damage the gold deposition layer on the surface of the circuit board, affecting the quality of the circuit board, and the provision of multiple fans increases the cost of the chemical gold deposition device.

[0054] Embodiment 2

[0055] like Figure 1 , Figure 4 and Figure 6 As shown, two grids 7 are installed on both sides of the upper end surface of the gold sinking box 1, and a plurality of racks 8 are installed on the inner walls of the two grids 7. A transmission shaft 11 is located at one end of the inner cavity of the grid 7 and is fixedly connected to a gear 16 on the outside. The gear 16 is meshed with the rack 8 to drive the transmission shaft 11 to rotate and clean the metal dust on the surface of the circuit board 5.

[0056] like Figure 1 , Figure 4 , Figure 6 and Figure 8As shown, a plurality of grooves 15 are provided on the upper end surface of the mounting frame 9, and the inner walls of the plurality of grooves 15 are arranged in a semicircular arc surface, for guiding the quick placement and installation of the circuit board 5, and two receiving grooves 20 are symmetrically provided on the inner wall of the groove 15, and a spring 21 is fixedly connected to the bottom of the inner cavity of the two receiving grooves 20, a stop block 22 is fixedly connected to one end of the spring 21, and the stop block 22 is arranged in a semicircular shape at one end of the inner cavity of the groove 15, for pressing and limiting the circuit board 5.

[0057] Specifically, when installing the circuit board 5 in the inner cavity of the mounting frame 9, the circuit board 5 is made to slide into the inner cavity of the groove 15, and at the same time, the circuit board 5 is made to press the stop block 22, so that the stop block 22 squeezes the spring 21 to slide into the inner cavity of the storage groove 20, and then the circuit board 5 is made to slide into the bottom of the inner cavity of the groove 15, and then the spring 21 is used to pop up the stop block 22, and the stop block 22 is made to slide out of the storage groove 20 to abut and limit the circuit board 5, thereby ensuring the stability of the installation of the circuit board 5.

[0058] A method for controlling chemical gold deposition on the surface of a circuit board is applied to a chemical gold deposition device, comprising the following steps:

[0059] S1. Preparation: Install the control circuit boards one by one in the grooves in the mounting frame, and use the limit assembly in the groove to limit the circuit boards. During the installation of the circuit boards, use the transmission shaft and the fluff brush to brush and clean the surface of the circuit boards, and then use the magnetic rod to absorb and collect the metal dust cleaned by the fluff brush through the through groove. When the circuit boards are installed, they pass between two scrapers, and the scrapers can be used to clean their surfaces for a second time until the mounting frame is fully installed with circuit boards.

[0060] S2, control circuit board immersion operation: after the control circuit board is installed on the mounting frame, the mounting frame is driven to move downward, and the control circuit board is driven to slide into the inner cavity of the gold sinking box, so that the control circuit board is inserted into the chemical solution containing gold ions;

[0061] S3, chemical solution mixed gold deposition operation: by driving the stirring component to stir and mix the chemical solution containing gold ions, the gold ions are evenly dispersed in the chemical solution, so as to ensure that the gold ions fully contact the control circuit board, and then the gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the control circuit board to form a uniform metal film, and then the control circuit board is lifted from the gold deposition box, and the chemical solution on the surface of the control circuit board is emptied, and the control circuit board is collected after being dried;

[0062] S4, post-processing: clean, dry and inspect the control circuit board after immersion gold to ensure that the quality of immersion gold meets the requirements, thus completing the immersion gold operation of the control circuit board.

[0063] In this embodiment, the stirring component in S3 uses an air mixing component to stir and mix the chemical solution containing gold ions, so that the gold ions are evenly dispersed in the chemical solution, while preventing the stirring component from hitting the circuit board during operation, and the chemical solution containing gold ions is made of gold salt and reducing agent.

[0064] Working principle: By installing the circuit board 5 on the mounting frame 9, the circuit board 5 passes through the transmission shaft 11, and the magnetic rod 24 inside the transmission shaft 11 is used to absorb and collect the metal powder on the surface of the circuit board 5 through the through slot 25, and the circuit board 5 is inserted between the two scrapers 28, and the scrapers 28 are twisted by the torsion spring 29 to fit the surface of the circuit board 5, and the transmission shaft 11 can be used to separate the circuit boards 5, so that there are gaps between the circuit boards 5. After the circuit boards 5 are fully installed on the mounting frame 9, the mounting frame 9 will be pushed by the gravity of the circuit board 5. The telescopic column 17 moves downward, and after the circuit board 5 slides over the scraper 28, the scraper 28 uses a brush to perform secondary cleaning of the metal dust on the surface of the circuit board 5, and the cleaned metal dust flows into the collection chamber along the surface of the scraper 28, and is adsorbed and collected by the metal dust adsorption block to prevent the wind from blowing dust. Then the telescopic column 17 slides in the inner cavity of the air storage cavity 18, so that the mounting frame 9 fits with the fixed plate 10, and the electric push rod 2 is started to drive the fixed bracket 4 to move downward, so that the fixed bracket 4 drives the fixed plate 10 moves downward, driving the mounting frame 9 and the circuit board 5 to move synchronously, so that the circuit board 5 slides into the inner cavity of the gold sinking box 1, and is inserted into the chemical solution containing gold ions in the gold sinking box 1, and then the gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the circuit board 5 to form a uniform metal film, thereby completing the gold sinking operation. When the circuit board 5 is subjected to the gold sinking operation, the operator extracts the magnetic rod 24 inside the transmission shaft 11, and then cleans and recovers the metal dust adsorbed on the outside of the magnetic rod 24. After the gold sinking work is completed , the electric push rod 2 drives the fixed bracket 4 to move upward, and the fixed bracket 4 drives the fixed plate 10 to move synchronously with the mounting frame 9 and the circuit board 5. During the upward movement of the fixed plate 10, air is injected into the bottom of the inner cavity of the fixed cylinder 12, and the air drives the telescopic column 17 to move upward, thereby pushing the mounting frame 9 to drive the circuit board 5 to move upward, and the scraper 28 is close to the surface of the circuit board 5, and the distance between them is between 5 mm and 1 mm. During the upward movement of the circuit board 5, the scraper 28 is used to scrape and clean the water stains on the surface of the circuit board 5;

[0065] In the process of driving the circuit board 5 to slide into the inner cavity of the gold sinking box 1, the fixing rod 31 is pushed downward by the fixing bracket 4, and the fixing rod 31 pushes the first piston 38 to slide downward in the air cavity 37, so that the first piston 38 squeezes the air in the air cavity 37, and the air pushes open the one-way valve inside the gold sinking box 1 and is discharged into the exhaust mixing pipe 36, and the outer side of the exhaust mixing pipe 36 is semicircular with a plurality of tiny pores, wherein the tiny pores are gradually reduced from the inner cavity of the exhaust mixing pipe 36 to the outside and are arranged in a conical shape, and the inner cavity of the tiny pores is provided with a rubber cushion layer, so that the air impacts the rubber cushion layer in the tiny pores to open, and then is discharged into the chemical solution containing gold ions in the gold sinking box 1, and at the same time, part of the air will impact the chemical solution at the bottom of the inner cavity of the gold sinking box 1, and the statically precipitated gold ions will be flushed up and evenly dispersed in the chemical solution, so that the control circuit board and the gold ions can be contacted. The gold ions are fully contacted with the chemical solution of the circuit board 5, and the gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the circuit board 5 to form a uniform metal film, thereby improving the gold sinking effect and quality of the control circuit board. When the fixed bracket 4 drives the circuit board 5 to move upward for collection, the fixed bracket 4 will drive the sliding column 34 to move downward, and the sliding column 34 drives the first piston 38 to move synchronously, so that the first piston 38 pumps the air in the air cavity 37 to form a negative pressure, thereby opening the one-way valve in the inner cavity of the air inlet 32, and then pumping the external air into the air cavity 37. At the same time, the operator collects the circuit board 5 in the inner cavity of the fixed bracket 4, and replaces the new circuit board 5 to be immerged in gold, and then drives the circuit board 5 into the immersion gold box 1 again for immersion gold work, and at the same time squeezes the air in the air cavity 37 again to impact the chemical solution containing gold ions for full mixing, thereby improving the gold sinking effect of the circuit board 5.

[0066] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A device for controlling chemical gold deposition on the surface of a circuit board, characterized in that: The invention comprises a gold sinking box (1), wherein electric push rods (2) are arranged on both end surfaces of the gold sinking box (1), and both sides of the electric push rods (2) are fixedly connected with fixed blocks (23), and the fixed blocks (23) are fixedly installed with the gold sinking box (1), and the piston rod end of the electric push rod (2) is installed with a fixed bracket (4), and a fixed plate (10) is installed between the fixed brackets (4), and two fixed cylinders (12) are installed on both sides of the lower end surface of the fixed plate (10), and the inner cavity of the fixed cylinder (12) is provided with an air storage cavity (18), and the inner cavity of the air storage cavity (18) is slidably connected with a telescopic column (17), and one end of the telescopic column (17) passes through the fixed plate (10) and is fixedly connected with a mounting frame (9), and the mounting frame (9) is used to place a circuit board (5), and a circuit board separation and cleaning component is arranged between the mounting frames (9); The electric separation cleaning assembly comprises a plurality of transmission shafts (11) rotatably connected between the mounting frames (9), wherein the interior of the plurality of transmission shafts (11) is hollow, wherein the transmission shafts (11) are provided with a plurality of through slots (25) at the middle position, and a magnetic rod (24) is slidably installed in the inner cavity of the transmission shaft (11), and the magnetic rod (24) is used to absorb metal dust on the surface of the circuit board (5); A liquid replacement port (6) is provided at the lower part of one side of the gold sinking box (1), and a plurality of fixed columns (27) are provided above the inner cavity of the gold sinking box (1), and the plurality of fixed columns (27) are externally rotatably connected to two scrapers (28), wherein one end of each of the two scrapers (28) is fixedly connected to a torsion spring (29), and one end of the torsion spring (29) is fixedly connected to the fixed column (27).

2. A device for chemical gold deposition on the surface of a control circuit board according to claim 1, characterized in that: The transmission shaft (11) is provided with a fluff brush on the outside for brushing and cleaning metal dust on the surface of the circuit board (5); two U-shaped cleaning brushes (13) are fixedly connected to both sides of the mounting frame (9); the U-shaped cleaning brushes (13) are arranged in a triangular shape close to one end and are used to clean metal dust on the surface of the circuit board (5) and guide the metal dust into the inner cavity of the U-shaped cleaning brush (13) for collection; and a magnetic sheet is provided in the inner cavity of the U-shaped cleaning brush (13) for adsorbing and collecting metal dust.

3. A device for chemical gold deposition on the surface of a control circuit board according to claim 1, characterized in that: The two end surfaces of the gold sinking box (1) are fixedly connected with a solution mixing assembly (3), and the solution mixing assembly (3) includes four fixed rods (31) fixedly connected to the two end surfaces of the gold sinking box (1), and two of the fixed rods (31) form a group and are fixedly connected to the two sides of one end surface of the gold sinking box (1), an air cavity (37) is opened inside the fixed rod (31), and a sliding column (34) is slidably connected inside the air cavity (37), and the upper end of the sliding column (34) is fixedly installed with the fixed bracket (4).

4. A device for chemical gold deposition on the surface of a control circuit board according to claim 3, characterized in that: The sliding column (34) is located in the air cavity (37) and is fixedly connected to a first piston (38) at one end. The lower end of the fixed rod (31) is fixedly connected to an air guide pipe (35), and the air guide pipe (35) is connected to the air cavity (37). One end of the air guide pipe (35) is fixedly connected to the gold sinking box (1), and the inner cavity of the air guide pipe (35) and the gold sinking box (1) is fixedly connected. A one-way valve is provided, and the one-way valve can only be turned over to open toward the inner cavity of the gold sinking box (1). An air inlet (32) is provided between the fixed rods (31), and the inner cavity of the air inlet (32) is connected to the lower part of the inner cavity of the air cavity (37), and the inner cavity of the air inlet (32) is provided with a one-way valve, and the one-way valve can only be turned over to open toward the inner cavity of the air cavity (37).

5. A device for chemical gold deposition on the surface of a control circuit board according to claim 4, characterized in that: The inner wall of the gold sinking box (1) is fixedly connected with two exhaust mixing tubes (36), and the outer parts of the two exhaust mixing tubes (36) are provided with a plurality of tiny pores in a semicircular shape, wherein the tiny pores are gradually reduced from the inner cavity of the exhaust mixing tube (36) to the outside and are arranged in a conical shape, and the inner cavity of the tiny pores is provided with a rubber cushion layer for slowly discharging pressurized air to impact the chemical solution containing gold ions for mixing treatment, wherein after the air in the inner cavity of the exhaust mixing tube (36) and the chemical solution in the inner cavity of the gold sinking box (1) reach an equilibrium value, the chemical solution containing gold ions cannot enter the inner cavity of the exhaust mixing tube (36) through the micro pores.

6. A device for chemical gold deposition on the surface of a control circuit board according to claim 4, characterized in that: An air inlet and outlet (39) is provided between the fixed rods (31), and the air inlet and outlet (39) is connected to the upper part of the inner cavity of the air cavity (37); a telescopic hose (33) is fixedly connected to the inner cavity of the air inlet and outlet (39); one end of the telescopic hose (33) is fixedly connected to the air storage cavity (18); one end of the telescopic column (17) is located in the air storage cavity (18) and is fixedly connected to a second piston (19); a plurality of blowing ports (26) are provided on the outside of the fixed cylinder (12), and the plurality of blowing ports (26) are connected to the upper part of the inner cavity of the air storage cavity (18) for blowing air to move the circuit board (5).

7. A device for chemical gold deposition on the surface of a control circuit board according to claim 1, characterized in that: Two grid frames (7) are installed on both sides of the upper end surface of the gold sinking box (1), and a plurality of racks (8) are installed on the inner walls of the two grid frames (7). The transmission shaft (11) is located at one end of the inner cavity of the grid frame (7) and is fixedly connected to a gear (16) on the outside. The gear (16) is meshingly connected with the rack (8) and is used to drive the transmission shaft (11) to rotate and clean the metal dust on the surface of the circuit board (5).

8. The device for chemical gold deposition on the surface of a control circuit board according to claim 1, characterized in that: The upper end surface of the mounting frame (9) is provided with a plurality of grooves (15), and the inner walls of the plurality of grooves (15) are arranged in a semicircular arc surface, for guiding the rapid placement and installation of the circuit board (5); the inner wall of the groove (15) is symmetrically provided with two receiving grooves (20), and the bottom of the inner cavity of the two receiving grooves (20) is fixedly connected with a spring (21); one end of the spring (21) is fixedly connected with a stopper (22), and the stopper (22) is arranged in a semicircular shape at one end of the inner cavity of the groove (15), for pressing and limiting the circuit board (5).

9. A method for controlling chemical gold deposition on the surface of a circuit board, using a chemical gold deposition device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1. Preparation: Install the control circuit boards one by one in the grooves in the mounting frame, and use the limit assembly in the groove to limit the circuit boards. During the installation of the circuit boards, use the transmission shaft and the fluff brush to brush and clean the surface of the circuit boards, and then use the magnetic rod to absorb and collect the metal dust cleaned by the fluff brush through the through groove. When the circuit boards are installed, they pass between two scrapers, and the scrapers can be used to clean their surfaces for a second time until the mounting frame is fully installed with circuit boards. S2, control circuit board immersion operation: after the control circuit board is installed on the mounting frame, the mounting frame is driven to move downward, and the control circuit board is driven to slide into the inner cavity of the gold sinking box, so that the control circuit board is inserted into the chemical solution containing gold ions; S3, chemical solution mixed gold deposition operation: by driving the stirring component to stir and mix the chemical solution containing gold ions, the gold ions are evenly dispersed in the chemical solution, so as to ensure that the gold ions fully contact the control circuit board, and then the gold ions are reduced to metal through electrochemical reaction and deposited on the surface of the control circuit board to form a uniform metal film, and then the control circuit board is lifted from the gold deposition box, and the chemical solution on the surface of the control circuit board is emptied, and the control circuit board is collected after being dried; S4, post-processing: clean, dry and inspect the control circuit board after immersion gold to ensure that the quality of immersion gold meets the requirements, thus completing the immersion gold operation of the control circuit board.

10. A method for chemical gold deposition on the surface of a control circuit board according to claim 9, characterized in that: The stirring component in S3 uses an air mixing component to stir and mix the chemical solution containing gold ions, so that the gold ions are evenly dispersed in the chemical solution, while preventing the stirring component from hitting the circuit board during operation.

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