Modified nickel-plated diamond micropowder, electroplated diamond wire

Abstract

The present invention relates to a modified nickel-plated diamond micropowder and an electroplated steel wire. The modified nickel-plated diamond micropowder includes a nickel-plated diamond micropowder matrix, an organic sealing layer coated on the surface of the nickel-plated diamond micropowder matrix, and polyepichlorohydrin amine adsorbed on the surface of the organic sealing layer through hydrogen bonds. The modified nickel-plated diamond micropowder not only has good dispersion effect in the plating solution, has stronger sand deposition ability, but also can avoid hard brittleness of the coating, reduce the risk of wire breakage, thereby reducing the production cost of the electroplated steel wire.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplated diamond wires, and particularly to a modified nickel-plated diamond micropowder and an electroplated diamond wire. Background Art

[0002] Electroplated diamond wires are widely used in cutting hard and brittle materials, and nickel-plated diamond micropowder is one of the key raw materials for electroplated diamond wires. Coating a thin and dense nickel metal layer on the surface of diamond can improve the interfacial bonding ability between diamond and nickel matrix, thereby reducing the diamond shedding during the cutting process and improving the cutting force of the electroplated diamond wire. In the industry, chemical plating or composite plating (first chemical plating and then electroplating) processes are generally used to fabricate nickel-plated diamond micropowder. The density of the electroless nickel plating layer is relatively low and it is easily corroded. Therefore, a dense electroplating is often carried out on the basis of chemical plating to form a composite coating. This composite nickel-plated micropowder has a longer service life than the electroless nickel-plated micropowder, so it is widely used in nickel-plated diamond micropowder. However, this high-density electroplated nickel increases the weight of the micropowder and reduces the suspension of the micropowder, resulting in a need for more nickel-plated diamond micropowder in the sanding tank, which undoubtedly increases the production cost.

[0003] Currently, industrially, by adding a high molecular organic additive to the plating solution, the surface of the micropowder is charged by the adsorption of the polymer on the surface of the micropowder, thereby enhancing the dispersion of the micropowder in the plating solution. However, this high molecular organic additive itself or its redox decomposition products are easily incorporated into the coating layer, which not only reduces the purity of the coating layer, but also the organic inclusions in the coating layer cause the coating layer to become brittle, thereby increasing the risk of wire breakage during the cutting process of the diamond wire. Based on this, the additive in the plating solution is controlled at a low content to reduce its influence on the coating layer, resulting in a low dosage of the additive adsorbed on the surface of the micropowder and a limited surface charge, that is, the dispersion ability of the micropowder is limitedly improved, resulting in a need for a high content of nickel-plated diamond micropowder in the plating solution of the electroplated diamond wire section, which is not conducive to reducing the production cost. Summary of the Invention

[0004] Based on this, it is necessary to provide a modified nickel-plated diamond micropowder and an electroplated diamond wire for the above problems; the modified nickel-plated diamond micropowder not only has good dispersion effect in the plating solution, has stronger sanding ability, but also can avoid the hardening and embrittlement of the coating layer, reduce the risk of wire breakage, thereby reducing the production cost of the electroplated diamond wire.

[0005] A modified nickel-plated diamond micropowder includes a nickel-plated diamond micropowder matrix, an organic sealing layer coated on the surface of the nickel-plated diamond micropowder matrix, and polyepichlorohydrin amine adsorbed on the surface of the organic sealing layer through hydrogen bonds.

[0006] In one embodiment, the absolute value of the Zeta potential of the organic sealing layer is 30 mV - 80 mV.

[0007] In one embodiment, the hydrogen bond content in the organic sealing layer is 1% - 10%.

[0008] In one embodiment, the mass of the organic sealing layer is 0.01% - 2% of the mass of the nickel-plated diamond micropowder substrate.

[0009] In one embodiment, the organic sealing layer includes a polymer film formed by the reaction of a double-bonded organic monomer, a crosslinking agent, a promoter, and an initiator.

[0010] In one embodiment, the double-bonded organic monomer includes at least one of acrylamide and acrylic acid.

[0011] In one embodiment, the organic sealing layer includes a polymer film formed by a silane coupling agent.

[0012] In one embodiment, the mass of the polyepichlorohydrin amine is 0.01% - 2% of the mass of the nickel-plated diamond micropowder substrate.

[0013] In one embodiment, the porosity of the modified nickel-plated diamond micropowder is 0.01% - 0.5%.

[0014] An electroplated gold steel wire includes the modified nickel-plated diamond micropowder as described above.

[0015] The modified nickel-plated diamond micropowder of the present invention, through the synergistic effect of the organic sealing layer coated on the surface of the nickel-plated diamond micropowder substrate and the polyepichlorohydrin amine adsorbed by hydrogen bonds, is beneficial to increasing the surface charge amount of the nickel-plated diamond micropowder substrate, improving the suspension property of the micropowder, enhancing the dispersion effect of the micropowder in the plating solution, thereby enhancing the adsorption of the micropowder on the surface of the steel wire during the electroplating sanding process. Furthermore, the modified nickel-plated diamond micropowder has stronger sanding ability, which is beneficial to reducing the usage amount of the modified nickel-plated diamond micropowder. At the same time, it can also avoid the embrittlement of the coating and reduce the risk of wire breakage.

[0016] Therefore, using the modified nickel-plated diamond micropowder of the present invention to prepare electroplated gold steel wire can reduce the production cost on the premise of ensuring the high quality of the electroplated gold steel wire. Description of the Drawings

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1This is a schematic structural diagram of modified nickel-plated diamond micropowder in an embodiment of the present invention.

[0019] Among them, 10 is modified nickel-plated diamond micropowder; 101 is the matrix of nickel-plated diamond micropowder; 102 is an organic sealing layer; 103 is a hydrogen bond; 104 is polyepichlorohydrin amine. Detailed implementation manners

[0020] To facilitate the understanding of the present invention, the present invention will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. On the contrary, these embodiments or examples are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments or examples and are not intended to limit the present invention. The optional scope of the term "and / or" used herein includes any one of two or more related listed items, and also includes any and all combinations of the related listed items. The any and all combinations include any two related listed items, any more related listed items, or the combination of all related listed items.

[0022] In the present invention, when it comes to numerical ranges, unless otherwise specified, the above numerical ranges are considered continuous and include the minimum and maximum values of the range, as well as each value between such minimum and maximum values. Further, when the range refers to integers, it includes each integer between the minimum and maximum values of the range. In addition, when multiple ranges are provided to describe features or characteristics, these ranges can be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all sub-ranges subsumed therein.

[0023] Combined with Figure 1 As shown, the modified nickel-plated diamond micropowder 10 of the present invention includes a matrix 101 of nickel-plated diamond micropowder, an organic sealing layer 102 coated on the surface of the matrix 101 of nickel-plated diamond micropowder, and polyepichlorohydrin amine 104 adsorbed on the surface of the organic sealing layer 102 through a hydrogen bond 103.

[0024] The modified nickel-plated diamond micropowder 10 of the present invention, through the synergistic effect of the organic sealing layer 102 coated on the surface of the nickel-plated diamond micropowder matrix 101 and the polyepichlorohydrin amine 104 adsorbed by the hydrogen bond 103, is beneficial to increasing the surface charge amount of the nickel-plated diamond micropowder matrix 101, improving the suspension property of the micropowder, enhancing the dispersion effect of the micropowder in the plating solution, thereby strengthening the adsorption of the micropowder on the surface of the steel wire during the electroplating sanding process, and further enabling the modified nickel-plated diamond micropowder 10 to have a stronger sanding ability, which is beneficial to reducing the usage amount of the modified nickel-plated diamond micropowder 10. At the same time, it can also avoid the embrittlement of the coating and reduce the risk of wire breakage, thereby reducing the production cost of the electroplated diamond wire while ensuring the high quality of the electroplated diamond wire.

[0025] In an embodiment of the present invention, the absolute value of the Zeta potential of the organic sealing layer 102 is 30 mV - 80 mV. By regulating the surface charge amount of the organic sealing layer 102, it is beneficial to improve the adsorption effect of the organic sealing layer 102 on the polyepichlorohydrin amine 104, further increase the surface charge amount of the nickel-plated diamond micropowder matrix 101, reduce the usage amount of additives in the plating solution, and thereby avoid the embrittlement of the coating.

[0026] It can be understood that the absolute value of the Zeta potential of the organic sealing layer 102 includes but is not limited to any point value or the range value between any two of 30 mV, 40 mV, 50 mV, 60 mV, 70 mV, and 80 mV. Further preferably, the absolute value of the Zeta potential of the organic sealing layer 102 is 50 mV - 70 mV.

[0027] In an embodiment of the present invention, the hydrogen bond content in the organic sealing layer 102 is 1% - 10%. By regulating the hydrogen bond content in the organic sealing layer 102, it is beneficial to further improve the adsorption effect of the organic sealing layer 102 on the polyepichlorohydrin amine 104, enhance the adsorption of the micropowder on the surface of the steel wire during the electroplating sanding process, thereby enabling the modified nickel-plated diamond micropowder 10 to have a stronger sanding ability, and further reducing the usage amount of the modified nickel-plated diamond micropowder 10 and reducing the production cost.

[0028] It can be understood that the hydrogen bond content in the organic sealing layer 102 includes but is not limited to any point value or the range value between any two of 1%, 2%, 3%, 5%, 7%, 9%, and 10%. Further preferably, the hydrogen bond content in the organic sealing layer 102 is 2% - 5%.

[0029] Through long-term research, the inventors found that traditional electroplating corrosion-resistant technology on the surface of diamond usually adopts the method of chemical plating plus electroplating layer. Due to the inevitable pores on the surface of the electroplating layer, the electroplating layer not only fails to achieve the expected role of protecting the base metal, but instead accelerates the corrosion of the base metal. This uneven electroplating layer with pores seriously affects the application performance of electroplated diamond wire. Although increasing the thickness of the electroplating layer is beneficial to reducing the generation of pores to a certain extent, the increase in the thickness of the electroplating layer will instead reduce the mechanical properties of the wire. In the case of strict requirements for dimensions and the like, the wire with an overly thick electroplating layer may not meet the usage requirements of the product, and the overly thick electroplating layer has poor adhesion and is extremely easy to fall off and crack.

[0030] Based on this, in the present invention, an organic sealing layer 102 is coated on the surface of the nickel-plated diamond micropowder matrix 101. Utilizing the high permeability of small molecule organic monomers, it can enter the voids of the nickel layer, and then when the small molecule organic monomers are heated and polymerized, a dense polymer can be formed to effectively seal the pores, and the formed organic film can effectively block corrosion.

[0031] In an embodiment of the present invention, the organic sealing layer 102 includes a polymer film formed by the reaction of double bond organic monomers, crosslinking agents, promoters, and initiators.

[0032] It should be noted that the present invention does not limit the way of forming the polymer film by the reaction of double bond organic monomers, crosslinking agents, promoters, and initiators, and existing processes can be adopted. For example: putting double bond organic monomers, crosslinking agents, promoters, and initiators in a solvent, stirring and reacting under the condition of a cold water bath to form a treatment solution, then putting the nickel-plated diamond micropowder matrix 101 into the treatment solution, stirring and treating under the condition of a cold water bath, and obtaining the nickel-plated diamond micropowder matrix 101 coated with the organic sealing layer 102 through filtration and drying.

[0033] In an embodiment of the present invention, the double bond organic monomers include but are not limited to at least one of acrylamide and acrylic acid. By selecting double bond organic monomers with strong adsorption functional groups such as amino and hydroxyl groups, it is beneficial to further improve the adsorption effect of the organic sealing layer 102 on polyepichlorohydrin amine 104.

[0034] It can be understood that the present invention does not limit the specific types of crosslinking agents, promoters, and initiators. Specifically, the crosslinking agents include but are not limited to N,N-methylenebisacrylamide (BIS, gel crosslinking agent); the promoters include but are not limited to N,N,N',N'-tetramethylethylenediamine (TEMED, gel promoter); the initiators include but are not limited to potassium persulfate (gel initiator).

[0035] In an embodiment of the present invention, the organic sealing layer 102 includes a polymer film formed by a silane coupling agent.

[0036] It should be noted that the present invention does not limit the method of forming the polymer film with the silane coupling agent, and the existing process can be adopted. For example, the silane coupling agent is placed in an aqueous organic solvent and fully hydrolyzed as a treatment solution, and then the nickel-plated diamond micropowder substrate 101 is placed in the treatment solution and stirred, and after filtration and drying, the nickel-plated diamond micropowder substrate 101 coated with the organic sealing layer 102 is obtained.

[0037] It can be understood that the present invention does not limit the specific type of the silane coupling agent, including but not limited to γ-aminopropyltriethoxysilane (KH550), etc.

[0038] In an embodiment of the present invention, the mass of the organic sealing layer 102 is 0.01%-2% of the mass of the nickel-plated diamond micropowder substrate 101, including but not limited to any point value among 0.01%, 0.05%, 0.2%, 0.5%, 0.7%, 1% or the range value between any two of them, and further preferably 0.05%-2%.

[0039] In an embodiment of the present invention, the mass of the polyepichlorohydrin amine 104 is 0.01%-2% of the mass of the nickel-plated diamond micropowder substrate 101, including but not limited to any point value among 0.01%, 0.05%, 0.2%, 0.5%, 0.7%, 1% or the range value between any two of them, and further preferably 0.05%-2%.

[0040] By regulating the masses of the organic sealing layer 102 and the polyepichlorohydrin amine 104, it is beneficial to further balance the sand loading ability of the modified nickel-plated diamond micropowder 10 and the risk of hard brittleness of the coating layer, and further reduce the production cost of the electroplated diamond wire on the premise of ensuring the high quality of the electroplated diamond wire.

[0041] In an embodiment of the present invention, the porosity of the modified nickel-plated diamond micropowder 10 is 0.01%-0.5%, which is beneficial to improving the corrosion resistance of the coating layer, thereby improving the service life of the electroplated diamond wire.

[0042] It can be understood that the porosity of the modified nickel-plated diamond micropowder 10 includes but not limited to any point value among 0.01%, 0.05%, 0.08%, 0.1%, 0.2%, 0.5% or the range value between any two of them, and further preferably, the porosity of the modified nickel-plated diamond micropowder 10 is 0.1%-0.5%.

[0043] It should be noted that the present invention does not limit the preparation method of the modified nickel-plated diamond micropowder 10. The nickel-plated diamond micropowder substrate 101 can be processed in a treatment solution containing an organic sealing layer 102 and a treatment solution containing polyepichlorohydrin amine 104 in sequence by using a conventional preparation process. Preferably, before the nickel-plated diamond micropowder substrate 101 is processed in the treatment solution containing the organic sealing layer 102, the nickel-plated diamond micropowder substrate 101 is pickled and activated first.

[0044] The present invention also provides an electroplated diamond wire, which includes the modified nickel-plated diamond micropowder as described above.

[0045] By electroplating the modified nickel-plated diamond micropowder of the present invention on the surface of the metal wire substrate, not only the electroplated diamond wire has high hardness and wear resistance, which is beneficial to reducing the shedding of the modified nickel-plated diamond micropowder during the cutting process and improving the cutting force of the electroplated diamond wire, but also the corrosion resistance of the electroplated diamond wire is significantly improved, which can effectively prevent the electroplated diamond wire from oxidation, corrosion and rust, extend the service life. At the same time, the present invention also reduces the production cost of the electroplated diamond wire, which is beneficial to the popularization and application of the electroplated diamond wire.

[0046] It should be noted that the present invention does not limit the specific preparation process of the electroplated diamond wire, and it can be prepared by using the existing conventional process.

[0047] Hereinafter, the modified nickel-plated diamond micropowder and the electroplated diamond wire will be further described through the following specific examples. However, those skilled in the art will understand that the following examples are only used to illustrate the present invention and should not be regarded as limiting the scope of the present invention. For those not specified in the examples, they are carried out under conventional conditions or the conditions recommended by the manufacturer. For the reagents or instruments not specified in the manufacturer, they are all conventional products that can be obtained through commercial purchase.

[0048] Example 1

[0049] In 100 mL of an aqueous solution, 10 g of acrylic acid, 0.1 g of N,N-methylenebisacrylamide (BIS, gel crosslinking agent), 0.1 g of N,N,N',N'-tetramethylethylenediamine (TEMED, gel accelerator), and 0.1 g of potassium persulfate (gel initiator) are added, and it is vigorously stirred for 30 minutes under a cold water bath condition to obtain a first treatment solution.

[0050] 25 g of the pickled and activated nickel-plated diamond micropowder substrate is placed in the above first treatment solution and vigorously stirred for 30 minutes under a cold water bath condition. After stopping stirring, the wet micropowder is obtained by suction filtration, and then dried at 120 °C for 4 hours to obtain the nickel-plated diamond micropowder substrate coated with an organic sealing layer.

[0051] In 100 mL of an aqueous solution, 1 g of polyepichlorohydrin amine was added and stirred to mix, obtaining a second treatment solution. The nickel-plated diamond micro-powder substrate coated with an organic sealing layer was placed in the second treatment solution, stirred for 60 minutes, then filtered by suction and dried at 60 °C to obtain modified nickel-plated diamond micro-powder.

[0052] Example 2

[0053] In a mixed solution of 100 mL of ethanol and water (the mass ratio of ethanol to water is 95:5), 1 g of silane coupling agent KH550 was added and vigorously stirred for 1 hour to fully hydrolyze the silane coupling agent, obtaining a first treatment solution.

[0054] 25 g of pickled and activated nickel-plated diamond micro-powder substrate was placed in the above first treatment solution and stirred at room temperature for 1 hour. After stopping stirring, the wet micro-powder was obtained by suction filtration, and then dried at 120 °C for 4 hours to obtain a nickel-plated diamond micro-powder substrate coated with an organic sealing layer.

[0055] In 100 mL of an aqueous solution, 1 g of polyepichlorohydrin amine was added and stirred to mix, obtaining a second treatment solution. The nickel-plated diamond micro-powder substrate coated with an organic sealing layer was placed in the second treatment solution, stirred for 60 minutes, then filtered by suction and dried at 60 °C to obtain modified nickel-plated diamond micro-powder.

[0056] Example 3

[0057] In 100 mL of an aqueous solution, 5 g of acrylamide, 0.05 g of N,N'-methylenebisacrylamide (BIS, gel cross-linking agent), 0.05 g of N,N,N',N'-tetramethylethylenediamine (TEMED, gel accelerator), and 0.05 g of potassium persulfate (gel initiator) were added, and vigorously stirred for 30 minutes under cold water bath conditions to obtain a first treatment solution.

[0058] 25 g of pickled and activated nickel-plated diamond micro-powder substrate was placed in the above first treatment solution and vigorously stirred for 30 minutes under cold water bath conditions. After stopping stirring, the wet micro-powder was obtained by suction filtration, and then dried at 120 °C for 4 hours to obtain a nickel-plated diamond micro-powder substrate coated with an organic sealing layer.

[0059] In 100 mL of an aqueous solution, 1 g of polyepichlorohydrin amine was added and stirred to mix, obtaining a second treatment solution. The nickel-plated diamond micro-powder substrate coated with an organic sealing layer was placed in the second treatment solution, stirred for 60 minutes, then filtered by suction and dried at 60 °C to obtain modified nickel-plated diamond micro-powder.

[0060] Example 4

[0061] In a 100 mL mixed solution of ethanol and water (mass ratio of ethanol to water is 95:5), 5 g of silane coupling agent KH590 was added, and it was vigorously stirred for 1 hour to fully hydrolyze the silane coupling agent, obtaining the first treatment solution.

[0062] 10 g of pickled and activated nickel-plated diamond micropowder matrix was placed in the above first treatment solution and stirred at room temperature for 1 hour. After stopping stirring, the wet micropowder was obtained by suction filtration, and then dried at 120 °C for 4 hours to obtain a nickel-plated diamond micropowder matrix coated with an organic sealing layer.

[0063] In a 100 mL aqueous solution, 5 g of polyepichlorohydrin amine was added and stirred to mix, obtaining the second treatment solution. The above nickel-plated diamond micropowder matrix coated with an organic sealing layer was placed in the second treatment solution, stirred for 60 minutes, then suction filtered and dried at 60 °C to obtain modified nickel-plated diamond micropowder.

[0064] Example 5

[0065] The difference between Example 5 and Example 1 is that the amount of acrylic acid used is 0.5 g.

[0066] Comparative Example 1

[0067] In a 100 mL aqueous solution, 10 g of acrylic acid, 0.1 g of N,N-methylenebisacrylamide (BIS, gel crosslinking agent), 0.1 g of N,N,N',N'-tetramethylethylenediamine (TEMED, gel accelerator), and 0.1 g of potassium persulfate (gel initiator) were added, and it was vigorously stirred for 30 minutes under cold water bath conditions to obtain the first treatment solution.

[0068] 25 g of pickled and activated nickel-plated diamond micropowder matrix was placed in the above first treatment solution and vigorously stirred for 30 minutes under cold water bath conditions. After stopping stirring, the wet micropowder was obtained by suction filtration, and then dried at 120 °C for 4 hours to obtain a nickel-plated diamond micropowder matrix coated with an organic sealing layer.

[0069] Comparative Example 2

[0070] In a 100 mL aqueous solution, 1 g of polyepichlorohydrin amine was added and stirred to mix, obtaining the second treatment solution. 25 g of nickel-plated diamond micropowder matrix was placed in the second treatment solution, stirred for 30 minutes, then suction filtered and dried at 120 °C for 4 hours to obtain modified nickel-plated diamond micropowder.

[0071] Comparative Example 3

[0072] The difference between Comparative Example 3 and Example 1 is that an equal amount of poly(diallyldimethylammonium chloride) was used to replace polyepichlorohydrin amine. Since there are no functional groups with hydrogen bonds in the structure of poly(diallyldimethylammonium chloride), the adsorption force of the micropowder to it is low, and the micropowder cannot achieve effective adsorption and charging.

[0073] The fine powders prepared from all the examples and all the comparative examples were tested, and the results are shown in Table 1.

[0074] Table 1

[0075]

[0076] Application Example

[0077] The fine powders prepared from all the examples and all the comparative examples were made into plating solutions to prepare electroplated diamond wires, and their properties were tested. The results are shown in Table 2.

[0078] Preparation method: Electroplating production verification was carried out on a horizontal diamond wire machine for sanding. The bus bar was made of carbon steel with a diameter of 37 μm. The starting amount of the sanding fine powder was 500 g, and the production line speed was 40 m / min. Under the condition of setting the same voltage, 10 km of diamond wires were continuously produced for sampling.

[0079] Preparation of conventional diamond wires: 0.3 g / L of polyepichlorohydrin amine was added to the sanding plating solution. The sanding fine powder selected was untreated fine powder, and other conditions were equivalent to the above preparation method. The preparation of conventional diamond wires requires adding polyepichlorohydrin amine separately in the plating solution to improve the sanding activity of diamond, so as to achieve a sufficient exposure rate to meet the basic cutting requirements.

[0080] Testing method: (1) Samples of the diamond wires after leaving the machine were taken, and a Kopel tester was used to detect the exposure rate of the fine powder, so as to evaluate the sanding ability of the fine powder through the exposure rate. Exposure rate: The diamond particles electroplated on the surface of the diamond wire per unit area. At the same production speed, the higher the exposure rate of the diamond wire, the higher the surface charge amount of the fine powder, and the stronger its sanding ability; (2) Samples of the diamond wires after leaving the machine were taken, and a mechanical tensile machine was used to detect the knot breaking force of the diamond wire, so as to evaluate the coating quality through the knot breaking force. Among them, the knot breaking force is represented by the breaking tensile force of the diamond wire after knotting; Adding organic additives to the plating solution will cause the coating to be coated with organic substances, making the coating hard and brittle, and then reducing the toughness of the diamond wire, resulting in a decrease in the knot breaking force; A high knot breaking force of the diamond wire proves good coating quality, good toughness of the diamond wire, and low risk of wire breakage.

[0081] Table 2

[0082]

[0083] It can be seen from Table 1 and Table 2 that compared with the comparative examples and conventional diamond wires, the modified nickel-plated diamond fine powders provided by all the examples not only have excellent sanding ability, but also have a lower risk of wire breakage, significantly reducing the production cost of electroplated diamond wires and being beneficial to market application.

[0084] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0085] The above-described embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A modified nickel-plated diamond micropowder, characterized in that, The modified nickel-plated diamond micropowder includes a nickel-plated diamond micropowder matrix, an organic sealing layer coated on the surface of the nickel-plated diamond micropowder matrix, and polyepichlorohydrin amine adsorbed on the surface of the organic sealing layer through hydrogen bonds. Among them, the organic sealing layer includes a polymer film formed by the reaction of a double-bonded organic monomer, a cross-linking agent, a promoter, and an initiator, and the absolute value of the Zeta potential of the organic sealing layer is 30 mV - 80 mV, and the hydrogen bond content in the organic sealing layer is 1% - 10%.

2. The modified nickel-plated diamond micropowder according to claim 1, wherein The mass of the organic sealing layer is 0.01% - 2% of the mass of the nickel-plated diamond micropowder matrix.

3. The modified nickel-plated diamond micropowder according to claim 1, wherein The double-bonded organic monomer includes at least one of acrylamide and acrylic acid.

4. The modified nickel-plated diamond micropowder according to claim 1, characterized in that, The organic sealing layer includes a polymer film formed by a silane coupling agent.

5. The modified nickel-plated diamond micropowder according to claim 1, wherein, The mass of the polyepichlorohydrin amine is 0.01% - 2% of the mass of the nickel-plated diamond micropowder matrix.

6. The modified nickel-plated diamond micropowder according to claim 1, wherein The porosity of the modified nickel-plated diamond micropowder is 0.01% - 0.5%.

7. An electroplated steel wire, characterized in that, It includes the modified nickel-plated diamond micropowder according to any one of claims 1 to 6.

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