An ultra-clean valve for semiconductor manufacturing

Abstract

The present invention discloses an ultra-clean valve for semiconductor manufacturing, which relates to the technical fields of components for semiconductor manufacturing and components of semiconductor production equipment. It mainly includes an inlet joint, an outlet joint, a lifting core, an elastic member, a dividing member, and a bellows body. The dividing member is fixed on the bellows body and located between the two end faces of the bellows body. The lifting core is fixedly connected to the dividing member, and the lifting core can move away from the inlet joint to allow fluid to enter the outlet joint through the flow space and the flow channel. The ultra-clean valve for semiconductor manufacturing of the present invention further includes a driving mechanism, and the output member of the driving mechanism is fixedly connected to the dividing member and / or the lifting core and can drive the lifting core to move in the first direction. The present invention can reduce the friction between the lifting core and the inner wall of the ultra-clean valve for semiconductor manufacturing, and can realize the functions of the ultra-clean valve for semiconductor manufacturing and a common bellows valve.

Description

Technical Field

[0001] The present invention relates to the technical field of components for semiconductor manufacturing and components of semiconductor production equipment, and particularly to a super-clean valve for semiconductor manufacturing in a super-clean scenario for semiconductor manufacturing. Background Art

[0002] As a core field of modern technology industries, semiconductor manufacturing has almost stringent standards for the production environment and equipment cleanliness. This is because during the semiconductor manufacturing process, even extremely tiny particulate contaminants or impurities may have a significant negative impact on the performance, reliability, and yield of semiconductor devices. Therefore, relatively high requirements are imposed on the valves applied during the semiconductor manufacturing process.

[0003] However, in current applications, there are relatively prominent problems with existing one-way valves. The guiding mechanism of the lifting core of the existing one-way valve (generally directly using the inner wall of the one-way valve as the guiding mechanism) is arranged inside the one-way valve. During use, relative movement occurs between the lifting core and the inner wall of the one-way valve or the guiding mechanism, and the resulting friction will inevitably generate particulate matter. The appearance of these particulate matters will seriously affect the cleanliness of the system. For some working environments with extremely high cleanliness requirements, such as gas pipelines for semiconductor manufacturing, semiconductor manufacturing equipment such as lithography machines, and biological pharmaceutical laboratories, it is undoubtedly a major hidden danger. Moreover, it is currently impossible to observe whether the valve is opened or closed from the outside, making it very inconvenient to use. Therefore, there is an urgent need for a super-clean valve for semiconductor manufacturing to solve the above technical problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a super-clean valve for semiconductor manufacturing to solve the problems existing in the above-mentioned prior art, so that the opening and closing states are convenient to observe, and the friction between the lifting core and the inner wall of the super-clean valve for semiconductor manufacturing can be reduced.

[0005] To achieve the above purpose, the present invention provides the following solutions:

[0006] In a first aspect, the present invention provides a super-clean valve for semiconductor manufacturing, including an inlet joint, an outlet joint, a lifting core, an elastic member, a dividing member, and a bellows body. The inlet joint, the bellows body, and the outlet joint are sequentially arranged and communicated along a first direction. The lifting core and the elastic member are sequentially arranged inside the bellows body along the first direction. Two ends of the elastic member respectively abut against the outlet joint and the lifting core. The dividing member is fixed on the bellows body, and the lifting core and the dividing member are fixedly connected through a connecting member.

[0007] In some embodiments, it further includes a guide rod, the guide rod is arranged parallel to the outside of the corrugated pipe body, and the guide rod is slidably connected to the inlet joint and / or the outlet joint, and the dividing member is fixedly connected to the guide rod.

[0008] In some embodiments, the dividing member is a dividing ring, the connecting members are a plurality of connecting rods, the plurality of connecting rods are arranged circumferentially along the lifting core, and two ends of the connecting rod are respectively fixedly connected to the dividing ring and the lifting core. The dividing ring is annular and can divide the corrugated pipe body into a first corrugated pipe and a second corrugated pipe. The first corrugated pipe is fixedly connected to the inlet joint, and the second corrugated pipe is fixedly connected to the outlet joint.

[0009] In some embodiments, the dividing ring protrudes from the outer wall of the corrugated pipe body, the connecting rod passes through the outer wall of the corrugated pipe body, and the connecting rod is sealingly connected to the corrugated pipe body.

[0010] In a second aspect, the ultra-clean valve for semiconductor manufacturing provided by the present invention further includes a pushing mechanism, an output member of the pushing mechanism is fixedly connected to the dividing member and / or the lifting core, and can drive the lifting core to move along the first direction.

[0011] In some embodiments, the pushing mechanism includes a lead screw and a nut. The lead screw is arranged outside the corrugated pipe body along the length direction of the corrugated pipe body and is fixedly connected to the guide rod. The nut is rotatably arranged on the inlet joint and can rotate around its own axis. The nut is threadedly connected to the outside of the lead screw.

[0012] In some embodiments, it further includes a connecting bridge, the connecting bridge is sleeved on the outside of the corrugated pipe body, and two ends of the connecting bridge are respectively fixedly connected to the inlet joint and the outlet joint.

[0013] In some embodiments, it further includes a sliding member, the sliding member is slidably sleeved on the connecting bridge, and the sliding member forms an axially fixed and circumferentially rotatable connection with the nut. A first limiting hole and a second limiting hole are respectively arranged on the sliding member and the connecting bridge. A limiting member can sequentially pass through the first limiting hole and the second limiting hole to limit the sliding member and the connecting bridge.

[0014] In some embodiments, it further includes a guide cylinder, a second spring, a swing rod, and a support rod. Both the first limiting hole and the second limiting hole are smooth holes. The limiting member is a pin. The support rod is fixedly connected to the sliding member. The guide cylinder is hinged to the pin. The guide cylinder is slidably connected to the first end of the swing rod. The second end of the swing rod is hinged to the support rod. The second spring is sleeved on the swing rod, and the second spring can be in a compressed state.

[0015] In some embodiments, it further includes a tooth and a buckle. The tooth is fixedly arranged on the outer wall of the nut along the circumferential direction of the nut. The buckle is fixedly connected to the swing rod through a connecting rod, and the buckle can be engaged with the tooth.

[0016] The present invention has achieved the following technical effects compared with the prior art:

[0017] The present invention provides an ultra-clean valve for semiconductor manufacturing. The dividing member can divide the bellows main body into a first part of the bellows and a second part of the bellows. When the fluid enters from the inlet joint, the fluid impacts the lifting core, and the lifting core moves in a direction away from the inlet joint. Then, the dividing member also moves in a direction away from the inlet joint. At this time, the first part of the bellows connected to the inlet joint elongates, and the second part of the bellows connected to the outlet joint is compressed and shortened. The lifting core only slides within the flow space of the first part of the bellows and has no relative movement with the second part of the bellows, and there is no friction with the second part of the bellows. Compared with the prior art, the relative sliding between the lifting core and the inner wall of the sliding cavity is converted into the elongation and compression of the bellows main body, reducing the friction between the lifting core and the inner wall of the ultra-clean valve for semiconductor manufacturing, thereby reducing the particulate matter generated by friction and ensuring the environmental cleanliness inside the ultra-clean valve for semiconductor manufacturing, meeting the requirements for semiconductor manufacturing and semiconductor gas path cleanliness in aspects such as semiconductor manufacturing. Similarly, by observing the compression and elongation degrees of the bellows main body, the opening and closing states of the valve can be observed, and the observation is simple and can meet the requirements of the semiconductor manufacturing scenario and operation. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the following described drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 It is a schematic structural diagram of the ultra-clean valve for semiconductor manufacturing in Embodiment 1 of the present invention;

[0020] Figure 2This is the three-dimensional structure diagram of the ultra-clean valve for semiconductor manufacturing in the first embodiment of the present invention;

[0021] Figure 3 This is the schematic diagram of the installation connection bridge of the ultra-clean valve for semiconductor manufacturing in the first embodiment of the present invention;

[0022] Figure 4 This is the structure diagram of the ultra-clean valve for semiconductor manufacturing in the second embodiment of the present invention;

[0023] Figure 5 This is the structure diagram of the ultra-clean valve for semiconductor manufacturing when the pin is inserted in the third embodiment of the present invention;

[0024] Figure 6 This is the structure diagram of the ultra-clean valve for semiconductor manufacturing when the pin is pulled out in the third embodiment of the present invention;

[0025] Figure 7 This is the three-dimensional structure diagram of the ultra-clean valve for semiconductor manufacturing when the pin is inserted in the third embodiment of the present invention;

[0026] Figure 8 This is the three-dimensional structure diagram of the ultra-clean valve for semiconductor manufacturing when the pin is inserted in the third embodiment of the present invention;

[0027] Figure 9 is Figure 8 The enlarged view of part A in

[0028] In the figure: 101 - inlet joint; 102 - outlet joint; 1 - lift core; 2 - dividing part; 201 - dividing ring; 202 - connecting rod; 3 - flow space; 4 - sealing ring; 5 - bellows body; 501 - first bellows; 502 - second bellows; 6 - guide rod; 7 - flange; 8 - guide hole; 9 - connection bridge; 901 - second limit hole; 10 - sliding part; 11 - bolt; 12 - lead screw; 13 - nut; 14 - guide cylinder; 15 - pin; 16 - swing rod; 17 - connecting rod; 18 - buckle; 19 - support rod; 20 - tooth; 21 - guide cylinder; 22 - second spring; 23 - first spring. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] The object of the present invention is to provide an ultra-clean valve for semiconductor manufacturing to solve the problems existing in the prior art, so that the opening and closing states are easy to observe, and the friction between the lifting core and the inner wall of the ultra-clean valve for semiconductor manufacturing can be reduced.

[0031] To make the above objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] Embodiment 1

[0033] As Figures 1 - 3 shown, the present invention provides an ultra-clean valve for semiconductor manufacturing, which includes an inlet joint 101, an outlet joint 102, a lifting core 1, an elastic member, a dividing member 2 and a bellows body 5. The inlet joint 101, the bellows body 5 and the outlet joint 102 are arranged and communicated in sequence along a first direction. The inlet joint 101 and the outlet joint 102 are respectively connected to hard pipes, so as to ensure that the relative positions of the inlet joint 101 and the outlet joint 102 do not change. The lifting core 1 and the elastic member are arranged in the bellows body 5 in sequence along the first direction. The two ends of the elastic member are respectively abutted against the outlet joint 102 and the lifting core 1, preferably fixedly connected. The elastic member is preferably a first spring 23. One end of the lifting core 1 close to the inlet joint 101 can block the inlet joint 101. The dividing member 2 is fixed on the bellows body 5 and is located between the two end faces of the bellows body 5 in the first direction. The lifting core 1 and the dividing member 2 are fixedly connected through a connecting member. A flow space 3 can be formed between the lifting core 1 and the bellows body 5 through the connecting member, and the flow space 3 enables the fluid to enter the lifting core 1. Specifically, the dividing member 2 can divide the bellows body 5 into a first bellows 501 and a second bellows 502. One end of the first bellows 501 is hermetically and fixedly connected to the inlet joint 101, and the other end of the first bellows 501 is hermetically and fixedly connected to the first end of the dividing member 2. One end of the second bellows 502 is hermetically and fixedly connected to the second end of the dividing member 2, and the other end of the second bellows 502 is hermetically and fixedly connected to the outlet joint 102. The lifting core 1 is hermetically and fixedly connected to the dividing member 2, and the lifting core 1 includes a blocking end, which can block the inlet joint 101. The blocking end is arranged close to the inlet joint 101, and under the elastic force of the elastic member, the blocking end can block the inlet joint 101. There is a flow space 3 between the outer wall of the lifting core 1 and the inner wall of the first bellows 501, and the flow channel is farther away from the inlet joint 101 than the blocking end.

[0034] Under the impact of the fluid, the lifting core 1 can leave the inlet joint 101 so that the fluid can sequentially pass through the flow space 3 and the flow channel and enter the discharge joint 102. Since the lifting core 1 is fixed relative to the dividing member 2, the dividing member 2 is fixedly connected to the first bellows 501 and the second bellows 502. When the fluid enters from the inlet joint 101, the fluid impacts the lifting core 1, and the lifting core 1 moves away from the inlet joint 101. As a result, the dividing member 2 also moves away from the inlet joint 101. At this time, the first bellows 501 connected to the inlet joint 101 elongates, and the second bellows 502 connected to the discharge joint 102 is compressed and shortened. The lifting core 1 only moves within the flow space 3 in the first bellows 501 and has no relative movement with the second bellows 502, so there is no friction with the second bellows 502. Compared with the prior art, the relative sliding between the lifting core 1 and the inner wall of the sliding cavity is converted into the elongation and compression of the bellows body 5, reducing the friction between the lifting core 1 and the inner wall of the ultra-clean valve for semiconductor manufacturing, thereby reducing the particulate matter generated by friction and ensuring the environmental cleanliness inside the ultra-clean valve for semiconductor manufacturing. It meets the requirements for semiconductor manufacturing scenarios such as cleanliness of semiconductor manufacturing and semiconductor gas circuits.

[0035] As a preferred embodiment, the dividing member 2 is a dividing ring 201, the connecting member is a connecting rod 202, and a plurality of them are arranged circumferentially along the lifting core 1. One end of the dividing ring 201 is fixedly connected to a plurality of connecting rods 202, and the other end of the lifting core 1 is fixedly connected to a plurality of connecting rods 202. And there is a certain distance between the connecting rod 202 and the inner wall of the bellows body 5. The space supported by the connecting rod 202 is the flow space 3 described above. The diameter of the dividing ring 201 is the same as the outer diameter of the bellows body 5 and is annular. Further preferably, the dividing ring 201 protrudes from the outer wall of the bellows body 5, that is, the first bellows 501 and the second bellows 502 are fixedly connected through the dividing ring 201, and the dividing ring 201 can be exposed outside the bellows body 5. The staff can know the opening and closing states of the ultra-clean valve for semiconductor manufacturing by observing the position of the dividing member 2. The visibility of the switch can be realized without borrowing redundant structures or operations, meeting the requirements for semiconductor manufacturing scenarios such as cleanliness of semiconductor manufacturing and semiconductor gas circuits.

[0036] Compared with the bellows valve in the existing patent, the ultra-clean valve for semiconductor manufacturing in this embodiment assembles a mechanical structure, such as the dividing member 2, etc., on the outside of the bellows body 5, which is convenient for users to observe the opening and closing states of the ultra-clean valve for semiconductor manufacturing. And the mechanical structure is arranged on the outside of the bellows body 5, so that the particulate matter inside the bellows body 5 is reduced. In the existing patent's bellows valve, the mechanical structure is isolated inside the bellows by the bellows, and the fluid flows in the space between the outside of the bellows and the outer housing. This setting method is to reduce the particulate matter outside the bellows. However, the outside of the bellows is squeezed by media such as fluid, and the bellows is prone to inward depression and deformation, resulting in a reduced service life. The inside of the bellows body 5 in this embodiment is extremely clean and will not be indented and deformed under the pressure of the fluid, with a long service life, meeting the requirements for cleanliness in semiconductor manufacturing scenarios and semiconductor gas circuits, etc. for semiconductor manufacturing and other aspects.

[0037] Moreover, the split ring may not protrude from the outer wall of the bellows body 5, that is, the split ring is completely located inside the bellows body 5. At this time, by observing the elongation and shortening of the two parts of the bellows body 5, the opening and closing states of the ultra-clean valve for semiconductor manufacturing can also be judged.

[0038] It should be noted that the split ring 201 may also have other types of setting forms, such as being arranged inside the bellows body 5 and not protruding from the bellows body 5; or being flush with the outer wall of the bellows body 5. The setting form of the connecting member may also be other types, such as being set as a cylinder with multiple openings on the side wall.

[0039] Other things that need to be explained are as Figure 3 shown, when the inlet joint 101 and the outlet joint 102 are respectively connected to hoses, a connecting bridge 9 needs to be provided between the inlet joint 101 and the outlet joint 102. The two ends of the connecting bridge 9 are respectively fixedly connected to the inlet joint 101 and the outlet joint 102. The connecting bridge 9 can be a cylindrical structure or composed of multiple rods arranged circumferentially around the bellows body 5. The connecting bridge 9 can hoop the bellows body 5, reducing the risk of the bellows body 5 bursting due to excessive internal fluid pressure, and better meeting the requirements for cleanliness in semiconductor manufacturing scenarios and semiconductor gas circuits, etc. for semiconductor manufacturing and other aspects.

[0040] In some embodiments, the ultra-clean valve for semiconductor manufacturing further includes a guide rod 6. The guide rod 6 is arranged outside the bellows body 5 parallel to the axial direction of the bellows body 5, and the guide rod 6 is slidably connected to the inlet joint 101 and / or the outlet joint 102. The dividing member 2 is fixedly connected to the guide rod 6. By observing the movement of the guide rod 6, the opening and closing states of the ultra-clean valve for semiconductor manufacturing can be judged.

[0041] As a preferred embodiment, one end of the guide rod 6 is slidably connected to the inlet joint 101, and the other end is slidably connected to the outlet joint 102. The partition member 2 is fixedly connected to the guide rod 6. Specifically, flanges 7 are provided on both the inlet joint 101 and the outlet joint 102, and guide holes 8 are provided on the flanges 7. The guide rod 6 can only slide along the guide hole 8, and the partition member 2 is fixedly connected to the guide rod 6. When the partition member 2 and the lifting core 1 connected thereto move, they are restricted and guided by the guide rod 6 and can only perform linear motion along the length direction of the guide rod 6, effectively avoiding unstable conditions such as offset and sway under fluid impact, improving the stability of the movement of the internal valve components of the ultra-clean valve for semiconductor manufacturing, and further ensuring the reliability of the operation of the ultra-clean valve for semiconductor manufacturing, so that the requirements for the cleanliness of the semiconductor manufacturing scenario and the semiconductor gas path cleanliness in aspects such as semiconductor manufacturing can be guaranteed. In this embodiment, the opening and closing states of the ultra-clean valve for semiconductor manufacturing can be determined by observing the extension length of the guide rod 6 relative to the outlet joint 102. Further, scale lines can be provided on the guide rod 6 or different color segments can be marked at different lengths to more clearly observe the opening and closing degrees of the ultra-clean valve for semiconductor manufacturing.

[0042] It should be noted that one end of the guide rod 6 can also be fixed to the inlet joint 101 and the other end can be slidably connected to the outlet joint 102; alternatively, one end of the guide rod 6 is slidably connected to the inlet joint 101 and the other end is fixedly connected to the inlet joint 101.

[0043] As a preferred embodiment, a plurality of guide rods 6 are provided along the circumferential direction of the bellows body 5. The plurality of guide rods 6 are circumferentially distributed. The plurality of constraint points constrain and guide the partition member 2 and the lifting core 1. Compared with a single guide rod 6, it can more effectively prevent them from offsetting, swaying or rotating during movement, making the movement trajectory of the lifting core 1 more stable and accurate, ensuring that the lifting core 1 can accurately reach the predetermined position during the opening and closing processes of the ultra-clean valve for semiconductor manufacturing, and realizing a reliable one-way conduction or cutoff function, meeting the requirements for the cleanliness of the semiconductor manufacturing scenario and the semiconductor gas path cleanliness in aspects such as semiconductor manufacturing.

[0044] In some embodiments, a water inlet is provided on the side of the lift core 1, and a water outlet is provided at one end of the lift core 1 away from the inlet joint. There is a flow space 3 between the outer wall of the lift core 1 and the inner wall of the first bellows 501. After the fluid enters through the inlet joint 101, it can sequentially pass through the flow space 3, the water inlet, the flow channel, the water outlet, the second bellows 502, and the discharge joint 102. The sealing end of the lift core 1 fits against the inlet joint, which can block the inlet joint 101, closing the ultra-clean valve for semiconductor manufacturing and effectively preventing the fluid from flowing in the direction opposite to the first direction. When the fluid flows in the first direction, under the impact of the fluid, the sealing end of the lift core 1 leaves the inlet joint, opening the ultra-clean valve for semiconductor manufacturing. The fluid mainly passes through the internal channel of the lift core 1 and the flow space 3, integrating functions such as guiding, controlling, and unidirectional conduction of the fluid in a relatively compact structure, reducing additional components and connections, making the structure of the entire ultra-clean valve for semiconductor manufacturing more concise and compact, not only saving installation space, but also reducing the complexity of the system and potential failure points, and improving the reliability and maintainability of the system. It meets the requirements for semiconductor manufacturing scenarios such as cleanliness of semiconductor manufacturing and cleanliness of semiconductor gas circuits.

[0045] In some embodiments, the ultra-clean valve for semiconductor manufacturing further includes a sealing ring 4, which is fixedly provided at one end of the inlet joint 101 close to the lift core 1. When the lift core 1 blocks the inlet joint 101, the sealing ring 4 can fill the tiny gap between the lift core 1 and the inlet joint 101, effectively preventing the fluid from leaking from these gaps, ensuring the sealing performance when the ultra-clean valve for semiconductor manufacturing is closed, preventing the fluid from flowing in the direction opposite to the first direction, and improving the working reliability of the ultra-clean valve for semiconductor manufacturing. The sealing ring 4 can select suitable materials (such as rubber, polytetrafluoroethylene, etc.) according to different working environments and fluid media, so as to adapt to different working conditions such as temperature, pressure, and chemical corrosion. For example, heat-resistant sealing ring materials can be selected in high-temperature environments, and corrosion-resistant sealing ring materials can be selected in corrosive media. Moreover, the sealing ring 4 usually has a certain elasticity and flexibility, and can play a buffering role during the contact and separation process between the lift core 1 and the inlet joint 101, reducing the direct friction and wear between the two, not only extending the service life of the lift core 1 and the inlet joint 101, but also reducing the pollution of the fluid in the valve by the particles generated by wear, helping to maintain a clean environment inside the valve, and maintaining the normal operation of the ultra-clean valve for semiconductor manufacturing. It meets the requirements for semiconductor manufacturing scenarios such as cleanliness of semiconductor manufacturing and cleanliness of semiconductor gas circuits, and is especially suitable for semiconductor manufacturing and production.

[0046] Embodiment Two

[0047] As Figure 4As shown in the figure, based on the first embodiment, this embodiment can also provide a super-clean valve for semiconductor manufacturing that can be converted, including a driving mechanism and the super-clean valve for semiconductor manufacturing in the first embodiment. The output member of the driving mechanism is fixedly connected to the dividing member 2 and / or the lifting core 1. Preferably, the output member of the driving mechanism is fixedly connected to the dividing member 2. The output member of the driving mechanism can drive the dividing member 2 to move along the length direction of the bellows body 5, and then drive the lifting core 1 to move. When the output member of the driving mechanism finally drives the lifting core 1 away from the inlet joint 101, the super-clean valve for semiconductor manufacturing functions as a bellows valve, and the fluid can flow bidirectionally. When the output member of the driving mechanism moves to different positions, the distance between the lifting core 1 and the inlet joint 101 changes, and the opening degree of the super-clean valve for semiconductor manufacturing also changes accordingly. When the output member of the driving mechanism makes the lifting core 1 fit against the inlet joint, the super-clean valve for semiconductor manufacturing still functions as a check valve. The rapid and convenient conversion of the working state of the super-clean valve for semiconductor manufacturing is more suitable for small-space scenarios in semiconductor manufacturing. Compared with valves in other setting forms, it can occupy less space, making it easier to ensure the cleanliness of the small space during semiconductor manufacturing and meeting the requirements for semiconductor manufacturing aspects such as the cleanliness of the semiconductor manufacturing scenario and the semiconductor gas path cleanliness.

[0048] It should be specifically explained that when the driving mechanism is arranged outside the bellows body, the output member of the driving mechanism is fixedly connected to the dividing member 2; when the driving mechanism is arranged inside the bellows body, the output member of the driving mechanism is fixedly connected to the lifting core 1. Specifically, a small electric-driven driving member can be set. The body of the small driving member can be arranged inside the inlet joint 101 and fixedly connected to the inlet joint 101. The small driving member can be provided with a push rod, and the push rod is fixedly connected to the lifting core 1.

[0049] In some embodiments, the driving mechanism includes a lead screw 12 and a nut 13. The nut 13 is rotatably arranged on the inlet joint 101 and can rotate around its own axis. The lead screw 12 is arranged along the length direction of the bellows body 5 and is fixedly connected to the dividing member 2. Further preferably, the lead screw 12 is arranged in parallel with the guide rod 6 and a connecting member is arranged on the lead screw 12. The lead screw 12 is fixedly connected to the guide rod 6 through the connecting member, and the lead screw 12 and the nut 13 are in threaded connection. Among them, the lead screw 12 is a hollow bolt, and the hollow bolt is sleeved outside the bellows body 5. By turning the nut 13, the movement of the lead screw 12 can be controlled. The lead screw 12 drives the dividing member 2 to move, and the dividing member 2 changes the lengths of the first bellows 501 and the second bellows 502, and can also change the position of the lifting core 1. When the lead screw 12 drives the dividing member 2 to move towards the side close to the outlet joint 102, the lifting core 1 can leave the inlet joint 101, and when moving to different positions, the distance between the lifting core 1 and the inlet joint 101 changes, and the opening degree of the ultra-clean valve for semiconductor manufacturing can be changed. At this time, the original ultra-clean valve for semiconductor manufacturing is a bellows valve, which can realize the bidirectional flow of fluid and the regulation of flow rate. When the lifting core 1 contacts the inlet joint 101, the function of a check valve can be realized. It can integrate the functions of a check valve and a bellows valve. By turning the nut 13, the two working modes can be flexibly switched. It can be used as a check valve, only allowing the fluid to flow unidirectionally, meeting the requirement of preventing the fluid from flowing back under specific working conditions; and it can be converted into a bellows valve when needed to realize the bidirectional flow of fluid, greatly improving the applicable range of the ultra-clean valve for semiconductor manufacturing in this embodiment, reducing the types and quantities of valves in the system, and being more applicable in the small-space scenarios of semiconductor manufacturing, meeting the requirements for semiconductor manufacturing such as the cleanliness of semiconductor manufacturing and the cleanliness of semiconductor gas circuits.

[0050] It should be noted that the lead screw 12 can also have other setting methods. For example, it is not set as a hollow bolt, but only set as an ordinary lead screw. When only one lead screw is arranged above the bellows body 5, the nut can be rotatably arranged above the inlet joint 101. When multiple lead screws are arranged along the circumferential direction of the bellows body 5, the nut 13 can be set as an annular nut and sleeved on the inlet joint 101.

[0051] It should also be noted that when the guide rod 6 is not provided, the lead screw 12 can also be directly fixedly connected to the dividing member 2 through a connecting member.

[0052] As a feasible embodiment, the driving mechanism can also adopt other structures, such as a hydraulic cylinder. The hydraulic rod of the hydraulic cylinder is fixedly connected to the dividing member. However, when the ultra-clean valve for semiconductor manufacturing functions as a check valve, the movement of the hydraulic rod should ensure the same movement as that of the lifting core.

[0053] In some embodiments, the ultra-clean valve for semiconductor manufacturing further includes a connecting bridge 9, which is sleeved on the outside of the bellows body 5, and the two ends of the connecting bridge 9 are respectively fixedly connected to the inlet connector 101 and the outlet connector 102. The connecting bridge 9 can fix the relative positions of the inlet connector 101 and the outlet connector 102, and the connecting bridge 9 can enclose the bellows body 5. Even if the fluid pressure inside the bellows body 5 is too high, the connecting bridge 9 can clamp the bellows body 5, reducing the risk of the bellows body 5 bursting, thereby extending the service life of the ultra-clean valve for semiconductor manufacturing and better meeting the requirements for semiconductor manufacturing, such as the cleanliness of the semiconductor manufacturing scene and the cleanliness of the semiconductor gas path.

[0054] As a preferred embodiment, unlike using the upper screw nut to adjust the opening of the ultra-clean valve for semiconductor manufacturing, this embodiment provides an ultra-clean valve for semiconductor manufacturing, which also includes a sliding member 10 and a connecting bridge 9. The connecting bridge 9 is sleeved on the outside of the bellows body 5 and fixedly connected to the inlet joint 101 and the outlet joint 102. The sliding member 10 is slidably sleeved on the connecting bridge 9, and the sliding member 10 and the nut 13 form an axially fixed and circumferentially rotatable connection. Specifically, it can be connected through a bearing, the sliding member 10 is fixedly connected to the inner ring of the bearing, and the nut 13 is fixedly connected to the outer ring of the bearing. The sliding member 10 and the connecting bridge 9 are respectively provided with a first limiting hole and a second limiting hole 901. The limiting member can pass through the first limiting hole and the second limiting hole 901 in sequence, and can lock the sliding member 10 and the connecting bridge 9 to limit the position. When it is necessary to adjust the opening of the ultra-clean valve for semiconductor manufacturing to function as a bellows valve, it is only necessary to pull the sliding member to slide relative to the connecting bridge. The sliding member 10 drives the partition 2 and the screw 12 and nut 13 to move as a whole. After the opening is adjusted appropriately, the limit member is sequentially passed through the first limit hole and the second limit hole aligned therewith, so that the ultra-clean valve for semiconductor manufacturing remains in a normally open state and acts as a bellows valve. The connecting bridge 9 is sleeved on the outside of the bellows body 5 and fixedly connected to the inlet connector 101 and the outlet connector 102, playing a role of strengthening and protecting, and can enhance the stability of the entire bellows body 5. The sliding member 10 is slidably arranged on the connecting bridge 9, and the sliding member 10 cannot rotate relative to the connecting bridge 9. By dragging the sliding member 10, the sliding member 10 can drive the screw 12 and the nut 13 to slide as a whole, thereby directly adjusting the position of the partition 2 and realizing the back-and-forth conversion from a one-way valve to a bellows valve. The opening of the bellows valve can be adjusted by sliding the sliding part of this embodiment, and the opening of the bellows valve can also be adjusted by the screw nut mechanism. The two operating methods can be flexibly selected according to the usage scenario and adjustment requirements, and meet the requirements of semiconductor manufacturing scene cleanliness and semiconductor gas path cleanliness and other aspects for semiconductor manufacturing.

[0055] It should be noted that the sliding member 10 can be a sliding cylinder or a sliding block, and the connecting bridge 9 can be a connecting cylinder or a connecting rod.

[0056] As a preferred embodiment, a plurality of first limiting holes are provided in the length direction of the sliding member 10, and a plurality of second limiting holes 901 are provided in the length direction of the connecting bridge 9. Both the first limiting holes and the second limiting holes 901 are bolt holes, and the limiting member is a bolt 11. By inserting the limiting member into the first limiting holes and the second limiting holes 901 at different positions, the opening degree of the ultra-clean valve for semiconductor manufacturing can be adjusted. When the sliding member 10 is dragged towards the direction close to the discharge joint 102, the limiting member can be controlled to be inserted into the first limiting hole and the second limiting hole 901 closest to the discharge joint 102, and the lifting core 1 is in a state of leaving the inlet joint 101. At this time, the ultra-clean valve for semiconductor manufacturing functions as a bellows valve, and the opening degree is the largest at this time. When the sliding member 10 is dragged towards the direction close to the inlet joint 101 until the sealing end of the lifting core 1 fits against the inlet joint 101, the limiting member can be controlled to be inserted into the first limiting hole and the second limiting hole 901 closest to the inlet joint 101. At this time, the ultra-clean valve for semiconductor manufacturing functions as a check valve. By dragging the sliding member 10 to change the working state of the ultra-clean valve for semiconductor manufacturing, it is more direct and faster to adjust compared with adjusting through a lead screw-nut structure. In the precision environment of semiconductor manufacturing, it saves more operation time and meets the requirements for semiconductor manufacturing, such as the cleanliness of the semiconductor manufacturing environment and the cleanliness of the semiconductor gas path.

[0057] It should be noted that the nut end of the bolt 11 can be set to be magnetic or a rope body can be wound around the nut end. When using a magnetic nut, after unscrewing the bolt 11, the nut end of the bolt 11 can be adsorbed to positions such as the sliding member 10 or the connecting bridge 9. When using a nut tied with a rope body, the rope can be tied to positions such as the sliding member 10 or the connecting bridge 9 to avoid the loss of the bolt 11. Moreover, the number of the first limiting holes can be one, and the number of the second limiting holes 901 is multiple.

[0058] It should also be noted that the bolt 11 can also adopt other forms of structures. For example, a magnetic rod can be used, and both the first limiting holes and the second limiting holes 901 are set as through holes without threads. Through magnetic adsorption, the magnetic rod is limited within the first limiting holes and the second limiting holes 901.

[0059] Embodiment Three

[0060] As Figures 5 - 9As shown, different from the first limiting hole and the second limiting hole in the second embodiment which are bolt holes and the limiting member is a bolt. The ultra-clean valve for semiconductor manufacturing in this embodiment includes a guide cylinder 21, a second spring 22, a swing rod 16 and a support rod 19. The first limiting hole and the second limiting hole 901 are both smooth holes, and the limiting member is a pin 15. The support rod 19 is fixedly connected to the sliding member 10, the guide cylinder 21 is hinged to the pin 15, the first end of the swing rod 16 is slidably connected to the guide cylinder 21, the second end of the swing rod 16 is hinged to the support rod 19, and the second spring 22 is sleeved on the swing rod 16 and the spring is in a compressed state. Through the linkage of components such as the swing rod 16 and the guide cylinder 21, the operator only needs to press or lift the swing rod 16 to quickly insert or pull out the pin 15 from the smooth hole, realize the adjustment of the position of the sliding member 10, and then adjust the opening degree and working mode of the valve, and keep the pulled-out or inserted state of the pin 15 through the second spring 22. Compared with the bolt connection method, there is no need to use tools to tighten or loosen the bolts, the operation is more rapid and convenient, the valve state can be changed in a short time, and the work efficiency is improved. Preferably, a guide cylinder 14 is further provided above the first limiting hole of the sliding member 10, and the pin 15 can pass through the guide cylinder 14, the first limiting hole and the second limiting hole 901 in sequence. The setting of the guide cylinder 14 makes the plugging and unplugging operation of the pin 15 smoother and more accurate. When the operator operates the swing rod 16, the pin 15 can be inserted or pulled out of the smooth hole more stably along the path of the guide cylinder 14, which can reduce the possibility of the pin 15 deviating or jamming during the insertion process, further improving the convenience and efficiency of the operation, meeting the requirements for the cleanliness of the semiconductor manufacturing scenario and the semiconductor gas path cleanliness in aspects such as semiconductor manufacturing.

[0061] It should be further noted that when the pin 15 is completely inserted into the guide cylinder 14 and when the pin 15 is pulled out of the guide cylinder 14, the compression amount of the second spring 22 is the smallest in these two cases; when the swing rod 16 and the sliding member 10 are in a parallel state, that is, when the second spring 22 is in a horizontal state, the compression amount of the second spring 22 is the largest. The setting of the second spring 22 enables the pulled-out state and the inserted state of the pin 15 to be relatively stable, and facilitates the buckling of the buckle 18 and the tooth 20. The operation is smoother and simpler, saving a great deal of time during the semiconductor manufacturing process and improving the production quality of semiconductors to a certain extent.

[0062] In some embodiments, the ultra-clean valve for semiconductor manufacturing further includes a locking tooth 20 and a snap 18. The locking tooth 20 is fixedly arranged on the outer wall of the nut 13 along the circumferential direction of the nut 13. The snap 18 is fixedly connected to the swing rod 16 through a connecting rod 17, and the locking tooth 20 is engaged with the snap 18. The locking tooth 20 cannot rotate around its own axis, and thus the nut 13 cannot rotate around its own axis either. When the ultra-clean valve for semiconductor manufacturing functions as a check valve, the lifting core 1 drives the dividing member 2 to move along the length direction of the bellows body 5, and the dividing member 2 drives the lead screw 12 to move along the length direction of the bellows body 5. Since the nut 13 cannot rotate, the lead screw 12 drives the nut 13 to move along the length direction of the bellows body 5. And the nut 13 is connected to the sliding member 10 through a bearing. Therefore, ultimately, the lifting core 1 drives the sliding member 10 to slide on the connecting bridge 9. Preferably, the connecting bridge 9 and the sliding member 10 can be connected through a slider and chute structure. A chute can be arranged on the connecting bridge 9, and a slider can be arranged on the sliding member 10. The slider is slidably arranged in the chute. On the one hand, the slider and chute structure can provide sliding guidance. On the other hand, it can prevent the sliding member 10 from rotating relative to the connecting bridge 9. Ensuring the stability of the connection and avoiding connection failure are very important for semiconductor manufacturing. The manufacturing of semiconductors requires relatively precise operations. A stable connection can meet the requirements for aspects such as the cleanliness of the semiconductor manufacturing scenario and the cleanliness of the semiconductor gas path in semiconductor manufacturing and other aspects.

[0063] Specifically, the chute structure can be set as a dovetail groove or a T-shaped groove, and the slider is set as a corresponding dovetail slider or a T-shaped slider with a dovetail cross-section. The settings of the locking teeth 20 and the buckle 18 can achieve an interlocking or interlocking relationship between the rotation operation of the nut 13 and the movement of the swing rod 16. When it is necessary to adjust the opening degree of the ultra-clean valve for semiconductor manufacturing or switch the working mode, the movement of the swing rod 16 drives the connecting rod 17, and then the locking teeth 20 and the buckle 18 interact with each other. Only when the pin 15 is in the inserted state can the locking teeth 20 be separated from the buckle 18, allowing the nut 13 to rotate. The opening degree of the ultra-clean valve for semiconductor manufacturing can be adjusted through the lead screw 12-nut 13 mechanism. When the pin 15 is away from the guide cylinder 14, the locking teeth 20 are engaged with the buckle 18, and the nut 13 cannot rotate at this time, which can avoid the rotation of the nut 13 driven by the sliding of the lifting core 1 and reduce the wear of the nut 13. Therefore, such an interlocking or interlocking mechanism can improve the sealing reliability and sealing accuracy of the ultra-clean valve for semiconductor manufacturing, reduce the risk of leakage, and the open state can be maintained stably. And the stable state maintenance makes the flow coefficient (CV value) of the ultra-clean valve for semiconductor manufacturing remain fixed. It should be noted that the locking teeth 20 are preferably Y-shaped locking teeth, and the buckle 18 slides into the upper half of the Y-shaped locking teeth and is stuck to the lower half of the Y-shaped locking teeth, which is not easy to slide out, and the clamping is relatively stable, so that the requirements for the cleanliness of the semiconductor manufacturing scenario and the semiconductor gas path cleanliness can be met.

[0064] It should also be generally noted that the fixed connections between the various components in the first embodiment, the second embodiment, and the third embodiment need to be set as sealed fixed connections to increase the safety of use.

[0065] In the present invention, specific examples are used to elaborate on the principles and implementation manners of the present invention. The descriptions of the above embodiments are only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. An ultra-clean valve for semiconductor manufacturing, characterized in that: It includes an inlet joint (101), an outlet joint (102), a lifting core (1), an elastic member, a dividing member (2), a guide rod (6), a driving mechanism, a connecting bridge (9), a sliding member (10) and a bellows body (5). The inlet joint (101), the bellows body (5) and the outlet joint (102) are arranged in sequence and communicated along a first direction. The lifting core (1) and the elastic member are arranged in sequence inside the bellows body (5) along the first direction. Two ends of the elastic member are respectively abutted against the outlet joint (102) and the lifting core (1). The dividing member (2) is fixed on the bellows body (5). The lifting core (1) and the dividing member (2) are fixedly connected through a connecting member. The guide rod (6) is arranged parallel to the outside of the bellows body (5), and the guide rod (6) is slidably connected with the outlet joint (102). The dividing member (2) is fixedly connected with the guide rod (6). The dividing member (2) is a dividing ring (201), and the connecting member is a plurality of connecting rods (202). The dividing ring (201) protrudes from the outer wall of the bellows body (5). The connecting rods (202) pass through the outer wall of the bellows body (5), and the connecting rods (202) are hermetically connected with the bellows body (5). The driving mechanism includes a lead screw (12) and a nut (13). The lead screw (12) is arranged outside the bellows body (5) along the length direction of the bellows body (5) and is fixedly connected with the guide rod (6). The nut (13) is rotatably arranged on the inlet joint (101) and can rotate around its own axis. The nut (13) is threadedly connected outside the lead screw (12). The connecting bridge (9) is sleeved outside the bellows body (5), and two ends of the connecting bridge (9) are respectively fixedly connected with the inlet joint (101) and the outlet joint (102). The sliding member (10) is slidably sleeved on the connecting bridge (9), and the sliding member (10) and the nut (13) form an axially fixed and circumferentially rotatable connection. A first limiting hole and a second limiting hole (901) are respectively arranged on the sliding member (10) and the connecting bridge (9). A limiting member can sequentially pass through the first limiting hole and the second limiting hole (901) to limit the sliding member (10) and the connecting bridge (9).

2. The ultra-clean valve for semiconductor manufacturing according to claim 1, wherein: The plurality of connecting rods (202) are arranged circumferentially along the lifting core (1), and two ends of the connecting rods (202) are respectively fixedly connected with the dividing ring (201) and the lifting core (1). The dividing ring (201) is annular and can divide the bellows body into a first bellows (501) and a second bellows (502). The first bellows (501) is fixedly connected with the inlet joint (101), and the second bellows (502) is fixedly connected with the outlet joint (102).

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