A temperature control assembly for electronic components

Abstract

The present invention relates to the field of electronic component detection, and discloses an electronic component temperature control component, including a bearing component and a temperature control component, the bearing component includes: a bearing base, a bearing support, a detection carrier and an external support; the temperature control component includes: a heating support frame, a ventilation bottom frame and a ventilation top frame, and the heating support frame has a built-in temperature control system; the temperature control system includes: a heat exchange plate, a plurality of channel carrier rods and fluid microchannels for heating and cooling; the heating fluid microchannel and the cooling fluid microchannel are distributed with a 180° phase difference along the radial symmetry plane of the channel carrier rod and are both distributed in a spiral manner, and a micromotor for driving the channel carrier rod is provided on one side of the channel carrier rod; a heating liquid circulates in the heating fluid microchannel, and a cooling liquid circulates in the cooling fluid microchannel, which are used for heating and cooling respectively. The present invention realizes the dynamic regulation of the local temperature field on the surface of the circuit board and the rapid response of the switching of the heating and cooling states through the spirally distributed fluid microchannels combined with the micromotor drive.

Description

Technical Field

[0001] The invention relates to the field of electronic component detection, and in particular to an electronic component temperature control component. Background Art

[0002] With the continuous development of science and technology, electronic components are playing an increasingly important role in aviation, aerospace, automobiles, computers, communications and other fields. The stability of electronic components directly affects the performance and reliability of the entire system. However, in practical applications, electronic components are often faced with the test of various environmental factors, especially the impact of temperature on electronic components. Changes in temperature will cause changes in the electrical properties of electronic components, thereby affecting their stability and reliability. Therefore, it is of great significance to study the stability detection technology of electronic components after being affected by temperature. Electronic components need to be set on the circuit board when in use.

[0003] Based on the above, the current traditional detection devices mainly include temperature sensors, data acquisition systems, analysis software and temperature control components. Although they can detect the temperature changes of electronic components to a certain extent, they still have the following shortcomings: the detection range is limited. For the detection of circuit boards loaded with high-power consumption components, high-precision detection can only be achieved by heating or cooling specific areas for testing. The existing devices lack such technology that can locally heat up the circuit boards, resulting in low detection accuracy and difficulty in meeting high-precision requirements. In addition, the traditional temperature control device has a complex structure and high power consumption, which is not conducive to promotion and application.

[0004] Therefore, in view of the above defects, a new solution needs to be proposed to solve these problems. Summary of the invention

[0005] The present invention overcomes the deficiencies of the prior art and provides an electronic component temperature control assembly.

[0006] To achieve the above-mentioned purpose, the technical scheme adopted by the present invention is as follows: an electronic component temperature control component, including a bearing component and a temperature control component, the bearing component including: a bearing base, a bearing support connected to the bearing base, a detection carrier connected to the bearing support, and an external support connected to the detection carrier; the temperature control component including: a heating support frame connected to the bearing support, a ventilation bottom frame and a ventilation top frame, wherein a temperature control system is arranged in the heating support frame; the temperature control system includes: a heat exchange plate, a plurality of channel carrier rods connected to the heat exchange plate, and a heating fluid microchannel and a cooling fluid microchannel arranged outside the channel carrier rod; the heating fluid microchannel and the cooling fluid microchannel are distributed with a phase difference of 180° along the radial symmetry plane of the channel carrier rod and are arranged in a spiral manner, and temperature regulation is achieved through fluid circulation; the channel carrier rod is driven to rotate by a micro motor arranged at the end, and the lowest point position of the heating fluid microchannel or the cooling fluid microchannel close to the external support is changed during rotation to dynamically adjust the temperature increase or temperature decrease area.

[0007] In a preferred embodiment of the present invention, the temperature control system also includes: a heating tank, a cooling tank, and a microchannel solenoid valve; the cooling tank is filled with coolant, and the heating tank is filled with heating liquid; two microchannel solenoid valves are provided and are respectively arranged on both sides of the cooling tank and the heating tank, each solenoid valve is provided with a coolant channel and a heating liquid channel, and the heating tank and the cooling tank are respectively connected to the corresponding heating liquid channel or cooling liquid channel on the microchannel solenoid valves on both sides through sealed pipelines; a fluid cavity is provided in the microchannel solenoid valve, and the fluid cavity can be selectively connected to the heating liquid channel or the cooling liquid channel.

[0008] In a preferred embodiment of the present invention, the liquid inlet ports and liquid outlet ports of the heating fluid microchannel and the cooling fluid microchannel can be alternately arranged on the outside or the central axis of the channel carrier rod.

[0009] In a preferred embodiment of the present invention, each of the sealed pipelines is provided with a fluid diversion pump for driving the circulation of the cooling fluid or the heating fluid in the cooling fluid microchannel or the heating fluid microchannel.

[0010] In a preferred embodiment of the present invention, the output end of the micro motor is fixedly connected to a bevel gear set, and the bevel gear set is located outside the channel carrier rod, and the micro motors and bevel gear sets on adjacent channel carrier rods are alternately arranged at both ends of the channel carrier rod.

[0011] In a preferred embodiment of the present invention, a plurality of threaded carrier rings are provided on the bearing pillars, and the heating support frame, the ventilation bottom frame and the ventilation top frame are connected to the threaded carrier rings via threaded structures.

[0012] In a preferred embodiment of the present invention, a temperature measuring bottom piece is disposed at the bottom of the external support, an electrical loading slot for placing the electronic component to be tested is opened at the top, and the side of the electrical loading slot is electrically connected to an external wire.

[0013] In a preferred embodiment of the present invention, a filter frame and a heat dissipation fan are arranged in the ventilation bottom frame and the ventilation top frame, and the heat dissipation fan is connected to the ventilation bottom frame and the ventilation top frame through mounting pillars.

[0014] In a preferred embodiment of the present invention, a supporting side seat and a supporting tray are also provided at the top of the supporting pillar, wherein the supporting side seat is fixedly installed on the side surface of the top of the supporting pillar, and the supporting tray is fixedly installed on the top of the supporting side seat.

[0015] In a preferred embodiment of the present invention, a mounting support groove and a ventilation groove are formed through the inner side of the detection carrier, and an assembly frame is mounted on the detection carrier through the mounting support groove.

[0016] The present invention solves the defects existing in the background technology and has the following beneficial effects:

[0017] (1) The present invention realizes dynamic regulation of the local temperature field on the surface of the circuit board by designing a 180° phase difference between the spirally distributed heating fluid microchannel and the cooling fluid microchannel, combined with the rotation of the channel carrier rod driven by a micro motor. When the channel carrier rod rotates, the flow path of the heating liquid or the cooling liquid is synchronously adjusted with the spiral distribution, so that the heat source / cold source action area is periodically switched, thereby accurately controlling the heating area and the temperature gradient distribution. Compared with the traditional fixed heat source device, this design solves the stress concentration problem caused by uneven local temperature rise. At the same time, through the rapid switching of the microchannel solenoid valve and the coordinated cooling of the heat dissipation fan, rapid temperature cycling can be achieved between high temperature and low temperature, simulating the thermal shock effect under extreme working conditions, and quickly compressing the accelerated aging cycle of the PCB circuit board.

[0018] (2) The present invention adopts a modular structural design. Through the threaded load ring on the load-bearing pillar and the adjustable heating support frame, ventilation bottom frame and ventilation top frame, it can adapt to the testing requirements of circuit boards of different sizes. In addition, the alternating layout of the bevel gear set optimizes the channel load rod spacing, realizes the high-density arrangement of multiple heat sources / cold sources in a limited space, and improves the local temperature control resolution. In addition, the external support is integrated with a temperature measuring base to support real-time monitoring of circuit board temperature changes and ensure signal integrity, thereby improving the detection sensitivity of microcracks on the circuit board. Compared with the traditional single temperature loading method, the present application can simultaneously expose the electromigration defects and interlayer separation risks of the circuit board through rapid hot and cold cycle switching, and the equipment manufacturing cost is low, and the modular structure setting is easy to operate and maintain. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a schematic diagram of the main structure of the overall component assembly of the temperature control detection assembly according to an embodiment of the present invention;

[0021] Figure 2 It is a structural schematic diagram of the assembly and disassembly arrangement of the whole components of the load-bearing base according to an embodiment of the present invention;

[0022] Figure 3 It is a structural schematic diagram of the assembly and disassembly arrangement of the whole component of the bearing pillar according to an embodiment of the present invention;

[0023] Figure 4 It is a structural schematic diagram of the assembly and disassembly arrangement of the whole components of the detection carrier according to an embodiment of the present invention;

[0024] Figure 5 It is a structural schematic diagram of the assembly and disassembly arrangement of the integral components of the external support according to an embodiment of the present invention;

[0025] Figure 6 It is a schematic diagram of the structure of the temperature control component inside the heating support frame according to an embodiment of the present invention;

[0026] Figure 7 is a schematic structural diagram of a channel carrier rod according to an embodiment of the present invention;

[0027] Figure 8 A cross-sectional view of the internal assembly components of the heating support frame according to an embodiment of the present invention Figure 1 ;

[0028] Fig. 9 is a schematic structural diagram of a ventilation bottom frame according to an embodiment of the present invention;

[0029] Fig.10 A cross-sectional view of the internal assembly components of the heating support frame according to an embodiment of the present invention Figure 2 ;

[0030] In the figure: 1. Load-bearing base;

[0031] 101, threaded support tube; 102, fixed support column; 103, supporting side seat; 104, carrying tray;

[0032] 2. Load-bearing pillars;

[0033] 201, rotating sleeve groove; 202, rotating pillar; 2021, threaded carrier tube; 2022, limiting bolt; 203, threaded carrier ring; 204, fixed support;

[0034] 3. Detection of carrier;

[0035] 301, docking support ring; 302, wire bearing groove; 303, mounting support groove; 304, ventilation slot; 305, mounting frame; 306, fixing support block; 307, mounting slot; 308, wire bearing side groove;

[0036] 4. External support;

[0037] 401, locking support block; 402, locking bolt; 403, temperature measuring base; 404, electrical loading slot; 405, external wire; 406, electrical connection block;

[0038] 5. Heating support frame;

[0039] 51. heat exchange plate; 52. channel carrier rod; 521. heating fluid microchannel; 522. cooling fluid microchannel; 523. heat limiting plate; 53. micro motor; 531. bevel gear set; 54. cooling tank; 55. heating tank; 56. fluid diversion pump; 57. microchannel solenoid valve; 571. heating fluid channel; 572. cooling fluid channel; 573. fluid cavity;

[0040] 6. Ventilated bottom frame;

[0041] 601, docking support groove; 602, filter frame; 603, load-bearing bottom block; 604, installation support; 605, cooling fan; 606, installation support block; 7, ventilation top frame. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0044] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention, unless otherwise specified, "multiple" means two or more.

[0045] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0046] Example 1

[0047] like Figure 1 , Figure 6 and Figure 7 As shown, an electronic component temperature control assembly includes a bearing assembly and a temperature control assembly, wherein the bearing assembly includes: a bearing base 1, a bearing pillar 2 connected by a threaded support tube 101 fixedly connected to the top of the bearing base 1, a detection carrier 3 connected to the bearing pillar 2 by a fixed support 204, and an external support 4 connected to the detection carrier 3; wherein a plurality of threaded bearing rings 203 are arranged on the bearing pillar 2, and the external support 4 is used to support and place the electronic components to be detected; the bearing base 1 serves as the basic supporting structure of the entire temperature control assembly, and its stability and bearing capacity directly affect the operating stability of the entire device; the cooperation of the threaded support tube 101 and the bearing pillar 2 makes the height of the detection carrier 3 and the external support 4 adjustable to meet the detection requirements of electronic components of different sizes;

[0048] The temperature control component includes: a heating support frame 5, a ventilated bottom frame 6 and a ventilated top frame 7 connected to the threaded carrier ring 203 through a threaded structure, and a temperature control system is arranged in the heating support frame 5; it is not only convenient to install and disassemble, but also the position and quantity can be flexibly adjusted according to actual needs, thereby improving the versatility and adaptability of the temperature control component; when in use, the heating support frame 5, the ventilated bottom frame 6 and the ventilated top frame 7 need to be rotated to the same axial position as the external support 4, so that the circuit board to be tested on the external support 4 is in the space enclosed by the heating support frame 5, the ventilated bottom frame 6 and the ventilated top frame 7;

[0049] The temperature control system includes: a heat exchange plate 51 connected to the heating support frame 5, a plurality of channel carrier rods 52 rotatably connected to one end of the heat exchange plate 51 facing the external support 4, and a heating fluid microchannel 521 and a cooling fluid microchannel 522 arranged on the outside of the channel carrier rod 52; the heating fluid microchannel 521 and the cooling fluid microchannel 522 are distributed with a phase difference of 180° along the radial symmetry plane of the channel carrier rod 52 and are distributed in a spiral manner, and a micro motor 53 for driving the channel carrier rod 52 to rotate is arranged on one side of the channel carrier rod 52;

[0050] Specifically, a heating fluid flows through the heating fluid microchannel 521, and a cooling fluid flows through the cooling fluid microchannel 522. When the channel carrier rod 52 rotates, the position of the heating fluid microchannel 521 heated by the heating fluid or the cooling fluid microchannel 522 cooled by the cooling fluid close to the lowest point of the external support 4 is changed to change the heating position or the cooling position.

[0051] More specifically, in a preferred embodiment of the present application, the cross-sections of the heating fluid microchannel 521 and the cooling fluid microchannel 522 at the end face only form one circle or less than one circle, but can cover the continuous path of the entire circuit board to be tested under the drive of the micromotor 53, which is achieved by limiting the pitch. Specifically, the pitch of the fluid microchannel is designed to be large enough so that in the projection of the fluid microchannel, adjacent spiral lines will not overlap or intersect on the cross-section of the end face. This design ensures that the cross-section of the fluid microchannel at the end face only presents a single annular path, thereby simplifying the path of fluid flow and ensuring that only one point toward the external support 4 is achieved. More accurate but simple and continuous temperature zone control, secondly, this structural design also reduces fluid resistance and improves the heat exchange efficiency of the fluid; of course, for those more special circuit boards that need to change multiple local temperature zones at the same radial direction at the same time, special pitch designs of the heating fluid microchannel 521 and the cooling fluid microchannel 522 can also be performed to allow adjacent spiral lines to overlap or intersect on the cross-section of the end face to meet special experiments, which is also not limited here.

[0052] Based on the above arrangement, the present invention can utilize the micro motor 53 to rotate in the detection based on the local heating requirement, drive the channel carrier rod 52 and the heating fluid microchannel 521 threadedly distributed thereon to rotate, and change the position of the lowest point of the heating fluid microchannel 521 close to the external support 4 after the heating to change the heating position;

[0053] Specifically, Figure 1 , Fig.10 As shown, the principle of realizing the heating and cooling of a local area is specifically manifested in this embodiment as follows: the projection of the heating fluid microchannel 521 or the cooling fluid microchannel 522 of this embodiment at the end surface of the channel carrier rod 52 forms a continuous ring without overlapping areas, and a heat limiting sheet 523 is fixedly arranged between each channel carrier rod 52 and the heat exchange plate 51. The heat limiting sheets 523 located on both sides of each channel carrier rod 52 limit the area where heat transfer is formed between the heating fluid microchannel 521 and the circuit board to be tested to an area with a rotation angle of 30-60 degrees along the central axis of the channel carrier rod 52. The heating fluid microchannel 521 or the cooling fluid microchannel 522 exposed in this area is directly facing the external support 4 and is the closest to the circuit board to be tested on the external support 4. The position of the circuit board, the heating fluid microchannel 521 or the cooling fluid microchannel 522 at this position forms a heat exchange area with the circuit board to be tested; because the heating fluid microchannel 521 or the cooling fluid microchannel 522 is spirally distributed on the outside of the channel carrier rod 52, only part of the heating fluid microchannel 521 or the cooling fluid microchannel 522 is exposed in this area to form a heat exchange area with the circuit board to be tested on the external support 4. When the channel carrier rod 52 rotates, the position of the heating fluid microchannel 521 or the cooling fluid microchannel 522 facing the circuit board to be tested on the external support 4 is changed, thereby realizing the change of the local heating and cooling position, accurately controlling the operation of the motor, being able to realize the accurate control of the area of ​​the heating and cooling zone, and also ensuring the uniformity of heating and cooling;

[0054] Based on the requirement of converting the circuit board or electronic components between high temperature and normal temperature or low temperature during testing, the circulation of the heating liquid in the heating fluid microchannel 521 can be quickly cut off to ensure the circulation of the cooling liquid in the cooling fluid microchannel 522, so as to achieve a rapid switch from heating to cooling function. For example, in the accelerated life test of the PCB circuit board, through the rapid conversion from high temperature to normal temperature or low temperature, this fast and high-precision temperature change can ensure the accelerated aging of the PCB circuit board, thereby exposing the defects of the circuit board and achieving an increase in detection accuracy.

[0055] Furthermore, if Figure 1 , Figure 6 , Figure 7 and Figure 8As shown, the temperature control system also includes: a heating tank 55, a cooling tank 54, and a microchannel solenoid valve 57; the cooling tank 54 is filled with a coolant, and the heating tank 55 is filled with a heating liquid. The coolant can be an ethylene glycol aqueous solution or an electronic fluoride liquid or other solution with a low freezing point and a high boiling point, and the heating liquid can be silicone oil or a synthetic hydrocarbon oil or other high boiling point liquid, which is not limited here; a heating device and a cooling device are provided in the heating tank 55, and one option of the heating device is to use a traditional resistance heating device to heat the heating liquid through an external power supply, and one option of the cooling device can be to use a traditional condenser, which is not limited here;

[0056] Specifically, two microchannel solenoid valves 57 are provided and are respectively arranged on both sides of the cooling tank 54 and the heating tank 55. A cooling liquid channel 572 and a heating liquid channel 571 are provided in each solenoid valve. The heating tank 55 and the cooling tank 54 are respectively connected to the corresponding heating liquid channel 571 or cooling liquid channel 572 on the microchannel solenoid valves 57 on both sides through sealed pipelines; a fluid cavity 573 is provided at the other end of the microchannel solenoid valve 57 away from the heating tank 55 or the cooling tank 54. When the fluid cavity 573 is connected to the cooling liquid channel 572, the heating liquid channel 571 is connected to the cooling liquid channel 572. When connected, the heating liquid channel 571 is located at the central axis of the fluid cavity 573. Conversely, when the fluid cavity 573 is connected to the heating liquid channel 571, the cooling liquid channel 572 is located at the central axis of the fluid cavity 573. Specifically, when the liquid inlet port of the cooling fluid microchannel 522 or the heating fluid microchannel 521 is set on the outside of the channel carrier rod 52, the liquid outlet port is set coaxially with the channel carrier rod 52; conversely, when the liquid outlet port is set on the outside of the channel carrier rod 52, the liquid inlet port is set coaxially with the channel carrier rod 52.

[0057] Based on the above arrangement, when the channel carrier rod 52 rotates, the heating liquid and the cooling liquid can be ensured to flow from the heating tank 55 and the cooling tank 54 to the corresponding heating fluid microchannel 521 and the cooling fluid microchannel 522, and the rationality of the structure ensures the realization of the functions of the application of the present invention.

[0058] Furthermore, each sealed pipeline is provided with a fluid diversion pump 56 for driving the circulation of the cooling liquid or the heating liquid.

[0059] Furthermore, the output end of the micro motor 53 is fixedly connected to a bevel gear set 531, and the bevel gear set 531 is located on the outside of the channel carrier rod 52, and the micro motors 53 and bevel gear sets 531 on adjacent channel carrier rods 52 are alternately arranged at both ends of the channel carrier rod 52; since the design of the bevel gear set 531 increases the overall radial size of the channel carrier rod 52, the alternating position setting of the micro motor 53 and the bevel gear set 531 can ensure that the spacing between the channel carrier rods 52 is minimized, thereby achieving an increase in the number of heat sources or cooling sources in a limited space.

[0060] Furthermore, if Figure 1 , Figure 2 As shown, the top of the fixed pillar 102 is also provided with: a supporting side seat 103 and a carrying tray 104; the supporting side seat 103 is fixedly installed on the top side of the fixed pillar 102; the carrying tray 104 is fixedly installed on the top of the supporting side seat 103, the supporting side seat is used to stabilize the connection of the carrying tray 104, and the carrying tray 104 is used to place other items.

[0061] Furthermore, if Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the inner side of the detection carrier 3 is penetrated with a mounting support groove 303 and a ventilation groove 304, the assembly carrier frame 305 is fixed to the detection carrier 3 through the mounting support groove 303, the ventilation groove 304 is used to dredge the upper and lower ends of the electronic component to be tested, so as to facilitate the heating or cooling of the temperature control components at the upper and lower ends, and the side of the detection carrier 3 is also provided with: a docking support ring 301 and a bearing wire groove 302; the docking support ring 301 is fixedly arranged on both sides of the detection carrier 3; the bearing wire groove 302 is opened on the side of the docking support ring 301, A fixed support block 306 is fixedly arranged on the inner side of the assembly frame 305; the side of the assembly frame 305 is also provided with: an installation slot 307 and a wire-carrying side slot 308; the installation slot 307 is opened on the outer side of the assembly frame 305; the wire-carrying side slot 308 is opened on one side of the assembly frame 305; the threaded cylinder 2021 cooperates with the limit bolt 2022 to rotate and lock the corresponding rotating pillar 202, so that the rotating pillar 202 independently supports the heating support frame 5, the ventilation bottom frame 6 and the ventilation top frame 7 for positioning and adjustment.

[0062] Furthermore, if Figure 5 As shown, the side of the external support 4 is also provided with: a locking support block 401 and a locking bolt 402; the locking support block 401 is fixedly arranged on the side of the external support 4; the locking bolt 402 is rotatably arranged on the inner side of the locking support block 401; a temperature measuring bottom piece 403 is fixedly arranged on the bottom of the external support 4 for monitoring the temperature of the circuit board on the external support 4; an electrical loading slot 404 for placing the electronic components to be tested is opened on the top of the external support 4, and an external wire 405 is electrically connected to the side of the electrical loading slot 404, and an electrical connection block 406 is fixedly arranged at one end of the external wire 405, which is convenient for connecting other external devices or systems for monitoring.

[0063] Furthermore, if Fig. 9As shown, a filter frame 602 and a heat dissipation fan 605 are arranged in the ventilation bottom frame 6 and the ventilation top frame 7, a docking support groove 601 is opened on the side of the ventilation bottom frame 6 or the ventilation top frame 7 to connect the detection carrier 3 or the heating support frame 5, a bearing bottom block 603 is fixedly arranged on the inner side of the ventilation bottom frame 6 or the ventilation top frame 7, the filter frame 602 is connected to the ventilation bottom frame 6 and the ventilation top frame 7 through a threaded structure, a plurality of mounting support blocks 606 are fixedly connected to the outer side of the heat dissipation fan 605, the heat dissipation fan 605 is connected to the ventilation bottom frame 6 and the ventilation top frame 7 by a plurality of mounting pillars 604 fixedly connected to the bearing bottom block 603 and the mounting support blocks 606, the setting of the heat dissipation fan 605 can cooperate with the coolant in the temperature control component to realize double cooling, realize rapid cooling after the test is completed, and facilitate the operator to replace another circuit board to be tested.

[0064] Furthermore, if Figure 2 As shown, a threaded carrier tube 2021 and a limiting bolt 2022 are provided on the outer side of the threaded carrier ring 203, and the threaded carrier tube 2021 is fixedly connected to the threaded carrier ring 203. Specifically, a plurality of rotating sleeve grooves 201 cooperating with the threaded carrier tube 2021 are provided on the load-bearing pillar 2 to limit the height of the threaded carrier ring 203 on the load-bearing pillar 2. The threaded carrier ring 203 is connected to the load-bearing pillar 2 through the cooperation of the threaded carrier tube 2021 and the limiting bolt 2022. Through the provision of the threaded carrier tube 2021, the threaded carrier ring 203 can be rotated relative to the load-bearing pillar 2, and then cooperated with the limiting bolt 2022 to stably realize the rapid assembly of various modules on the threaded carrier ring 203.

[0065] Temperature cycle circuit board life acceleration test method based on Example 1:

[0066] The circuit board to be tested is fixed in the electrical loading slot 404 of the external support 4, ensuring that it is stably connected to the electrical connection block 406, and connected to the monitoring equipment through the external wire 405, and the threaded loading ring 203 on the bearing support 2 is adjusted. During the experiment, the spacing between the heating support frame 5 and the ventilation bottom frame 6 and the ventilation top frame 7 is matched with the size of the circuit board. After the heating support frame 5, the ventilation bottom frame 6 and the ventilation top frame 7 are rotated to the same axial position as the external support 4, the position is locked by the limit bolt 2022, so that the circuit board to be tested is in the space enclosed by the heating support frame 5, the ventilation bottom frame 6 and the ventilation top frame 7;

[0067] Inject silicone oil (heating liquid) into the heating tank 55, inject ethylene glycol aqueous solution (cooling liquid) into the cooling tank 54, check the sealing of the pipeline through the microchannel solenoid valve 57, start the fluid diversion pump 56, pre-circulate the heating liquid and the cooling liquid, remove the bubbles in the pipeline, and ensure the stability of the fluid flow rate in the microchannel;

[0068] Then, the resistance heating device of the heating tank 55 is turned on, the target temperature is set, and the heat is transferred to the circuit board to be tested through the heating fluid microchannel 521. The micromotor 53 is started to drive the channel carrier rod 52 to rotate, so that the spirally distributed heating fluid microchannel 521 is periodically close to the surface of the circuit board to achieve uniform heating. By adjusting the speed of the micromotor 53 and controlling the coverage of the heating area, the non-uniform heat load under actual working conditions can be simulated. When the surface temperature of the circuit board reaches the set value, the heating liquid is maintained to circulate for 30-60 minutes, and the temperature distribution of key areas (such as BGA solder joints, power modules) is recorded in real time through the temperature measuring base 403. If the temperature fluctuation exceeds ±2°C, it can be compensated by adjusting the transmission ratio of the bevel gear set 531 or the fluid flow rate;

[0069] When the cooling mode is switched quickly, the heating liquid channel 571 is closed, the microchannel solenoid valve 57 is switched to the cooling liquid channel, and the heat dissipation fan 605 is started to assist in cooling. The channel carrier rod 52 is rotated to make the low-temperature area of ​​the cooling fluid microchannel 522 cover the surface of the circuit board, control the cooling rate, simulate the thermal shock in extreme environments, and perform electrical performance tests, mechanical stress detection and other tests while the circuit board is cooled to the target low temperature.

[0070] Performance Testing:

[0071] The test equipment used in the experimental group is the temperature control component mentioned in Example 1 of the present application, and the test equipment used in the control group is: on the basis of Example 1 of the present application, the temperature control system in the heating support frame 5 in Example 1 is replaced by a traditional resistance temperature control device;

[0072] 20 PCB circuit boards with preset defects produced in the same batch were used, with 10 in each of the experimental group and the control group. The experimental data were recorded using an infrared thermal imager and a multi-channel temperature recorder.

[0073] Test 1: Temperature change rate comparison experiment:

[0074] Experimental group: Start the circulation of heating liquid (silicone oil 120℃), and after the circuit board to be tested reaches the predetermined temperature, block the heating liquid channel 571 of the microchannel solenoid valve 57 and open the cooling liquid channel 572, and switch to the cooling liquid (ethylene glycol -45℃) to switch between hot and cold states;

[0075] Control group: Turn on the heating function of the traditional resistance temperature control device. After the circuit board to be tested reaches a predetermined temperature and is maintained for the same time as the experimental group, start the cooling fan 605 and the compressor in the traditional resistance temperature control device for cooling. The temperature range is the same as that of the experimental group.

[0076] The time (T1) required for the center area of ​​the circuit board to drop from 120°C to -40°C and the amount of temperature overshoot (ΔT) were recorded for both sets of experiments.

[0077] Test 2: Local temperature control accuracy experiment:

[0078] Experimental group: The channel carrier rod 52 was driven by a micro motor 53 to control the ±5℃ fluctuation of a 2cm×2cm area on a designated circuit board;

[0079] Control group: using the air cooling combination of the local heating plate in the traditional resistance temperature control device and the heat dissipation fan 605;

[0080] Record the temperature standard deviation (σ) of the target area of ​​the circuit board to be tested within 30 minutes and the temperature interference degree (ΔTa) of the adjacent area in the two groups of experiments;

[0081] The test results of test 1 and test 2 are shown in Table 1 and Table 2:

[0082] Table 1 Temperature change rate comparison experimental data table

[0083]

[0084] Table 2 Local temperature control accuracy experimental data table

[0085]

[0086] Analyzing the above experimental data, it can be seen from Table 1 that the device of the present application adopts a microchannel solenoid valve 57 and a dual fluid independent circuit design, has a fast temperature switching capability, and achieves an extreme temperature change from -40°C to 120°C within 25 seconds, while the traditional device takes about 60 seconds, and the temperature overshoot is reduced by about 70%, which can meet the high-precision accelerated aging test requirements of PCB circuit boards;

[0087] It can be seen from Table 2 that the use of a micro motor 53 to drive the spiral microchannel to adjust the temperature control area range reduces the standard deviation of temperature fluctuation in the target area compared to traditional equipment, while reducing the interference between adjacent areas, and can accurately simulate complex working conditions such as chip hot spots and edge heat dissipation.

[0088] Summary: This equipment uses dynamic microchannel temperature control and mechanical-fluid coordinated regulation, which is significantly superior to traditional solutions in temperature response speed, local temperature control accuracy and energy efficiency. It can greatly shorten the reliability verification cycle of electronic components and provide a reliable and innovative test platform for defect detection of advanced electronic products such as high-density packaging devices and high-performance circuit boards.

[0089] The above is based on the ideal embodiment of the present invention. Through the above description, relevant personnel can make various changes and modifications without departing from the technical concept of the present invention. The technical scope of the present invention is not limited to the content in the specification, and the technical scope must be determined according to the scope of the claims.

Claims

1. An electronic component temperature control assembly, characterized in that: Including load-bearing components and temperature control components, The bearing assembly comprises: a bearing base (1), a bearing support (2) connected to the bearing base (1), a detection base (3) connected to the bearing support (2), and an external support (4) connected to the detection base (3); The temperature control assembly comprises: a heating support frame (5) connected to the bearing support pillar (2), a ventilation bottom frame (6) and a ventilation top frame (7), wherein a temperature control system is arranged in the heating support frame (5); The temperature control system comprises: a heat exchange plate (51), a plurality of channel carrier rods (52) connected to the heat exchange plate (51), a heating tank (55), a cooling tank (54), a microchannel solenoid valve (57), and a heating fluid microchannel (521) and a cooling fluid microchannel (522) arranged outside the channel carrier rods (52); The heating fluid microchannel (521) and the cooling fluid microchannel (522) are distributed with a phase difference of 180° along the radial symmetry plane of the channel carrier rod (52) and are arranged in a spiral manner, and temperature regulation is achieved through fluid circulation; The channel carrier rod (52) is driven to rotate by a micro motor (53) arranged at the end, and changes the lowest point position of the heating fluid micro channel (521) or the cooling fluid micro channel (522) close to the external support (4) during rotation, so as to dynamically adjust the temperature increase or temperature decrease area; The cooling tank (54) contains a cooling liquid, and the heating tank (55) contains a heating liquid; Two microchannel solenoid valves (57) are provided and are respectively arranged on both sides of the cooling tank (54) and the heating tank (55); each of the microchannel solenoid valves (57) is provided with a cooling liquid channel (572) and a heating liquid channel (571); the heating tank (55) and the cooling tank (54) are respectively connected to the corresponding heating liquid channel (571) or cooling liquid channel (572) on the microchannel solenoid valves (57) on both sides through sealed pipelines; A fluid cavity (573) is provided in the microchannel solenoid valve (57), and the fluid cavity (573) can be selectively connected to the heating liquid channel (571) or the cooling liquid channel (572); The liquid inlet ports and liquid outlet ports of the heating fluid microchannel (521) and the cooling fluid microchannel (522) can be alternately arranged on the outside or the central axis of the channel carrier rod (52); Each of the sealed pipelines is provided with a fluid diversion pump (56) for driving the circulation of the cooling fluid or the heating fluid in the cooling fluid microchannel (522) or the heating fluid microchannel (521).

2. The electronic component temperature control assembly according to claim 1, characterized in that: The output end of the micro motor (53) is fixedly connected to a bevel gear set (531), and the bevel gear set (531) is located outside the channel carrier rod (52), and the micro motors (53) and bevel gear sets (531) on adjacent channel carrier rods (52) are alternately arranged at both ends of the channel carrier rod (52).

3. The electronic component temperature control assembly according to claim 1, characterized in that: A plurality of threaded carrier rings (203) are provided on the bearing pillar (2); the heating support frame (5), the ventilation bottom frame (6) and the ventilation top frame (7) are connected to the threaded carrier rings (203) via a threaded structure.

4. The electronic component temperature control assembly according to claim 1, characterized in that: The bottom of the external support (4) is provided with a temperature measuring bottom piece (403), and the top is provided with an electrical loading slot (404) for placing the electronic component to be tested, and the side of the electrical loading slot (404) is electrically connected to an external wire (405).

5. The electronic component temperature control assembly according to claim 1, characterized in that: A filter frame (602) and a heat dissipation fan (605) are arranged inside the ventilation bottom frame (6) and the ventilation top frame (7); the heat dissipation fan (605) is connected to the ventilation bottom frame (6) and the ventilation top frame (7) via mounting pillars (604).

6. The electronic component temperature control assembly according to claim 1, characterized in that: The top of the bearing pillar (2) is also provided with a supporting side seat (103) and a bearing tray (104); the supporting side seat (103) is fixedly mounted on the side surface of the top of the bearing pillar (2); and the bearing tray (104) is fixedly mounted on the top of the supporting side seat (103).

7. The electronic component temperature control assembly according to claim 1, characterized in that: The inner side of the detection carrier (3) is provided with a mounting support groove (303) and a ventilation groove (304) extending through the inner side, and the detection carrier (3) is provided with an assembly frame (305) via the mounting support groove (303).

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