Semiconductor heating plate quality detection device and detection method

Abstract

The invention belongs to the technical field of heating plate quality detection, and particularly relates to a semiconductor heating plate quality detection device and method.The semiconductor heating plate quality detection device comprises a device shell, the interior of the device shell is divided into a first cavity and a second cavity through a partition plate, and the first cavity is internally provided with a containing mechanism used for containing a semiconductor heating plate; a heating mechanism is arranged above the placing mechanism, and a cooling mechanism is arranged in the second cavity. A first door body and a second door body are correspondingly arranged at the outer side end of the first cavity and the outer side end of the second cavity respectively, and a control panel is installed on the first door body. Different currents are output to the semiconductor heating disc under the control of the control panel, the semiconductor heating disc generates different powers, the service life of the semiconductor heating disc under the different powers is detected, the magnitude of the currents input to the semiconductor heating disc is controlled through the control panel, and therefore the service life of the semiconductor heating disc under the actual power generated under the currents can be detected. And the actual service life can be normally used.

Description

Technical Field

[0001] The present invention belongs to the technical field of heating disk quality detection, and in particular relates to a semiconductor heating disk quality detection device and detection method. Background Art

[0002] The materials used to make semiconductor heating plates need to be resistant to high temperatures, have high thermal conductivity and wear resistance. Due to the special use environment, the selection of materials is very critical, and they need to have a long service life and a stable heating state to meet the production needs of products with high process requirements.

[0003] For example, a pressure-resistant testing device for electric heating tubes provided in Chinese patent application CN108196156A comprises: a swing frame for placing electric heating tubes, the swing frame tilts from one end to the other end, the electric heating tubes are placed into the swing frame from the higher end and fall out along the lower end of the swing frame; a pressure-resistant testing mechanism is arranged on both sides of the lower end of the swing frame, comprises a cylinder and a conductive head connected to the cylinder, the conductive head is connected to an external testing circuit, when the electric heating tube passes through the pressure-resistant testing mechanism, the conductive head is driven by the cylinder to approach the swing frame and contact the two ends of the electric heating tube, the external testing circuit tests the conductivity and pressure-resistant performance of the electric heating tube through the conductive head, and judges whether the tested electric heating tube is qualified or not based on this.

[0004] In the prior art as recorded in the Chinese patent, only the conductivity and voltage resistance of the product to be tested can be tested. However, many products whose service life does not reach the expected value will not have any problems when conducting conductivity and voltage resistance tests, and it is difficult to detect the life limit of the product. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor heating plate quality detection device and detection method, by controlling the current input to the semiconductor heating plate through a control panel, so that the actual life of normal use under the actual power generated under the current can be detected, thereby detecting the quality of the product, and by changing the current output to the semiconductor heating plate, the actual life of the product under different powers can be detected, which is convenient for measuring the relationship between product life and power.

[0006] The technical solution adopted by the present invention is as follows: A semiconductor heating disk quality detection device and detection method, comprising: a device shell, the device shell is divided into chamber one and chamber two by a partition, the chamber one is provided with a placement mechanism for placing the semiconductor heating disk, a heating mechanism is arranged above the placement mechanism, and a cooling mechanism is arranged in the chamber two; the outer ends of the chamber one and the chamber two are respectively provided with a door body one and a door body two, and a control panel is installed on the door body one; the placement mechanism includes a placement table movably arranged in the chamber one, and the semiconductor heating disk is placed on the placement table; the heating mechanism includes a liquid storage tank, and the cooling mechanism includes a cooling box, and the liquid storage tank and the cooling box are connected by an evaporating tube; the semiconductor heating disk and the control panel are electrically connected by a wire; the control panel is used to control the output of different currents to the semiconductor heating disk, so that the semiconductor heating disk generates different powers, and the service life of the semiconductor heating disk at different powers is detected.

[0007] In a preferred embodiment, heat dissipation openings are provided on the device housing at locations corresponding to the two chambers, and an observation window and a buzzer are also provided on the first door.

[0008] In a preferred embodiment, the lower end of the placing table is connected to an electric telescopic rod 1, and guide rod 1 is connected to both sides of the placing table. The placing table is moved forward and backward along the guide rod 1. A plurality of clamping components are arranged on the inner side of the placing table, and the clamping components include a slide groove, a slider is arranged in the slide groove, a slide rod is connected in the slider, an electric telescopic rod 2 is connected to the bottom of the slider, and a clamping claw for clamping the semiconductor heating plate is installed on the upper end of the slider.

[0009] In a preferred solution, the extension and retraction lengths of the electric telescopic rods 2 corresponding to each set of clamping components are individually controlled through a control panel.

[0010] In a preferred embodiment, a liquid level sensor, a temperature sensor and a liquid inlet are respectively provided at the top of the liquid storage tank, a solenoid valve 1 is installed on the liquid inlet, and a reflux pipe is connected to the liquid inlet.

[0011] In a preferred embodiment, an adjusting rod is connected to the upper end of the liquid storage tank, and two guide rods are arranged on both sides of the adjusting rod. The lower end of the two guide rods is connected to the liquid storage tank, and the upper end of the two guide rods is connected to the device housing.

[0012] In a preferred embodiment, one side of the cooling box is connected to the water inlet of the pump body by means of a connecting pipe, and the other end of the return pipe is connected to the water outlet of the pump body.

[0013] In a preferred embodiment, the side edge of the cooling box is provided with a heat sink, and air forms convection in the second chamber through the heat dissipation opening.

[0014] In a preferred embodiment, a connecting pipe 2 is further connected to the bottom of the cooling box, and a liquid injection port and a liquid discharge port are respectively provided at the far end of the connecting pipe 2, and a solenoid valve 2 and a solenoid valve 3 are respectively provided on the liquid injection port and the liquid discharge port.

[0015] The present invention also provides a semiconductor heating plate quality detection method, which is applied to the semiconductor heating plate quality detection device mentioned above, and comprises the following steps: S1. Place the semiconductor heating plate to be tested on the placement mechanism and send it into the device housing through the placement mechanism so that the semiconductor heating plate is directly below the heating mechanism; S2, manipulating the liquid storage tank in the heating mechanism to move downward and contact with the semiconductor heating plate, and injecting liquid into the liquid storage tank; S3, using the control panel to control the current flowing into the semiconductor heating disk, so that the semiconductor heating disk is powered on at the required test power, and the life of normal operation at the power is detected; S4. The heat generated by the semiconductor heating plate in normal operation heats the liquid in the heating mechanism. The liquid in the heating mechanism absorbs heat and evaporates, and enters the cooling mechanism through the evaporation pipe to be cooled, thereby maintaining the pressure in the heating mechanism.

[0016] The technical effects achieved by the present invention are: The present invention cleverly places the semiconductor heating disk inside the device housing, and precisely controls the current intensity input to the semiconductor heating disk through the control panel, thereby achieving detailed detection of the product's service life under actual power under different current conditions. This design can not only effectively evaluate the quality of the product, but also comprehensively examine the actual service life of the product under various power states by adjusting the size of the output current, thereby scientifically revealing the inherent relationship between product life and power, providing solid data support for subsequent optimization; Furthermore, the present invention innovatively constructs a circulation system that is complemented by a heating mechanism and a cooling mechanism. When the semiconductor heating disk is powered on for performance testing, the liquid in the heating mechanism is continuously heated; at the same time, the cooling mechanism is responsible for rapidly cooling the evaporated liquid and guiding it to flow back to the heating mechanism to continue participating in the heating process. This cycle is repeated, which not only ensures that the heating mechanism can withstand the high temperature from the semiconductor heating disk for a long time without the dry pot phenomenon, but also effectively avoids the problem of dry burning of the semiconductor heating disk caused by overheating, thereby significantly extending the overall service life of the equipment; In addition, the present invention also specially sets up a set of efficient and convenient placement mechanisms, so that the semiconductor heating plate can be easily and accurately positioned at the specified position inside the device housing. With the help of multiple sets of carefully designed clamping components, it is not only ensured that the semiconductor heating plate is always in the center area of ​​the placement mechanism, but also ensured that the position of the liquid storage tank in the heating mechanism is exactly corresponding to the bottom after installation. In this way, the two can form the most intimate contact state, greatly increase the heat conduction area, promote the maximization of heat transfer efficiency, and further improve the working efficiency and stability of the entire system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a half-section structure schematic diagram of the present invention; Figure 3 It is a schematic diagram of the enlarged structure of the placement mechanism of the present invention when viewed from above; Figure 4 It is a half-sectioned enlarged structural schematic diagram of the placement mechanism of the present invention; Figure 5 It is a schematic diagram of the structure of the placement mechanism and the semiconductor heating plate of the present invention in a disassembled state; Figure 6 It is an enlarged structural schematic diagram of the heating mechanism of the present invention; Figure 7 It is a half-sectioned enlarged structural schematic diagram of a liquid storage tank in the heating mechanism of the present invention; Figure 8 It is a front enlarged structural schematic diagram of the cooling mechanism of the present invention; Fig. 9 It is a schematic diagram of the enlarged structure of the back side of the cooling mechanism of the present invention; Fig.10 It is a connection relationship diagram between the control panel of the present invention and various components.

[0018] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Device housing; 11. Partition; 12. Chamber 1; 13. Chamber 2; 14. Door 1; 15. Door 2; 16. Heat dissipation port; 17. Observation window; 2. Placement mechanism; 21. Placement platform; 22. Electric telescopic rod 1; 23. Guide rod 1; 24. Slide; 25. Sliding block; 26. Sliding rod; 27. Electric telescopic rod 2; 28. Clamping claw; 3. Heating mechanism; 31. Liquid storage tank; 32. Liquid level sensor; 33. Temperature sensor; 34. Liquid inlet; 35. Solenoid valve 1; 36. Evaporation pipe; 37. Reflux pipe; 38. Adjustment rod; 39. Guide rod 2; 4. Cooling mechanism; 41. Cooling box; 42. Connecting pipe 1; 43. Pump body; 44. Heat sink; 45. Connecting pipe 2; 46. Liquid injection port; 47. Liquid discharge port; 48. Solenoid valve 2; 49. Solenoid valve 3; 5. Semiconductor heating plate; 6. Control panel; 7. Buzzer. DETAILED DESCRIPTION

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0020] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0021] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The phrase "in a preferred embodiment" that appears in different places in this specification does not refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

[0022] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0023] See also Figure 1 and Figure 2As shown, the present invention provides a semiconductor heating disk quality detection device and detection method, including: a device shell 1, the device shell 1 is divided into a chamber 12 and a chamber 2 13 by a partition 11, the chamber 1 12 is provided with a placement mechanism 2 for placing a semiconductor heating disk 5, a heating mechanism 3 is arranged above the placement mechanism 2, and a cooling mechanism 4 is arranged in the chamber 2 13; the outer ends of the chamber 1 12 and the chamber 2 13 are respectively provided with a door body 14 and a door body 2 15, and the door body 14 is installed with a control panel 6; the placement mechanism 2 includes There is a placement table 21 movably arranged in the chamber 12, and the semiconductor heating disk 5 is placed on the placement table 21; the heating mechanism 3 includes a liquid storage tank 31, and the cooling mechanism 4 includes a cooling tank 41, and the liquid storage tank 31 and the cooling tank 41 are connected through an evaporation tube 36; the semiconductor heating disk 5 and the control panel 6 are electrically connected through a wire; the control panel 6 is used to control the output of different currents to the semiconductor heating disk 5, so that the semiconductor heating disk 5 generates different powers, and the service life of the semiconductor heating disk 5 at different powers is detected; In this embodiment, when the semiconductor heating disk 5 is subjected to quality inspection, the semiconductor heating disk 5 to be inspected is first placed on the placement mechanism 2, and is sent into the device housing 1 through the placement mechanism 2, so that the semiconductor heating disk 5 is directly below the heating mechanism 3; then, the liquid storage tank 31 in the heating mechanism 3 is moved downward and contacts the semiconductor heating disk 5, and liquid is injected into the liquid storage tank 31; then, the current flowing into the semiconductor heating disk 5 is controlled by the control panel 6, so that the semiconductor heating disk 5 is powered on at the power required for the test, and the life of normal operation at the power is detected; the heat generated by the semiconductor heating disk 5 in normal operation heats the liquid in the heating mechanism 3, and the liquid in the heating mechanism 3 absorbs heat and evaporates, and enters the cooling mechanism 4 through the evaporation pipe 36 for cooling, thereby maintaining the pressure in the heating mechanism 3; In the present invention, the semiconductor heating disk 5 is placed in the device housing 1, and the magnitude of the current input to the semiconductor heating disk 5 is controlled by the control panel 6, so that the actual life that can be normally used under the actual power generated under the current can be detected, so as to detect the quality of the product, and by changing the magnitude of the current output to the semiconductor heating disk 5, the actual life that can be used under different powers can be detected, which is convenient for measuring the relationship between product life and power; In addition, when the current value input to the semiconductor heating disk 5 is controlled by the control panel 6, the input current value can be a fixed value, which can be the maximum current or minimum current that the semiconductor heating disk 5 can withstand, or it can be a certain value within the interval for detection. The input current value can also be a variable value, and the current value can change from large to small or from small to large, thereby making the test of the semiconductor heating disk 5 more comprehensive.

[0024] Among them, the control panel 6 includes a computing unit for information processing, a timing unit for timing the normal operation of the semiconductor heating disk 5, which can determine the service life of the semiconductor heating disk 5, and a voltage control unit for stepping down or stepping up the mains voltage, which facilitates the conversion of the mains voltage into a voltage value that can be normally used by the semiconductor heating disk 5, and other equipment units that meet the normal operation of the equipment, constituting a control device that can detect the semiconductor heating disk 5.

[0025] A heat dissipation port 16 is provided on the device housing 1 at a position corresponding to the second chamber 13, and an observation window 17 and a buzzer 7 are also provided on the door body 14; In this embodiment, the working condition of the device in the device housing 1 can be observed from the outside through the observation window 17 on the door body 14, and the buzzer 7 mainly serves as an alarm. When the semiconductor heating plate 5 is tested, when the semiconductor heating plate 5 reaches the maximum service life, a fault such as a short circuit may occur inside the semiconductor heating plate 5. The buzzer 7 can sound an alarm to remind the staff to perform testing and other operations; The device housing 1, door body 14 and door body 2 15 form a closed space, so that the semiconductor heating plate 5 can be tested in the closed space, which can ensure the safety of the test. In addition, the internal space of the device housing 1 is divided into chamber 1 12 and chamber 2 13 by partition 11, so that the heating mechanism 3 and the cooling mechanism 4 will not interfere with each other during operation.

[0026] See also Figure 3 and Figure 4 As shown, the lower end of the placement table 21 is connected to an electric telescopic rod 22, and guide rods 23 are connected on both sides of the placement table 21. The placement table 21 moves forward and backward along the guide rods 23. A plurality of clamping components are arranged on the inner side of the placement table 21. The clamping components include a slide groove 24, a slider 25 is arranged in the slide groove 24, a slider 26 is connected in the slider 25, an electric telescopic rod 27 is connected below the slider 25, and a clamping claw 28 for clamping the semiconductor heating plate 5 is installed on the upper end of the slider 25; In this embodiment, the control panel 6 controls the extension or contraction of the electric telescopic rod 22, which can drive the placement table 21 to extend or retract in the chamber 12 of the device housing 1. When the electric telescopic rod 22 is extended, the placement table 21 can be extended from the chamber 12, which is convenient for the staff to take and place the semiconductor heating plate 5 on the placement table 21. In addition, when the placement table 21 moves, it slides along the guide rod 23 to ensure the stability of the movement of the placement table 21. After the semiconductor heating plate 5 is placed on the placement table 21, it can be clamped and positioned by multiple groups of clamping components. When clamping the semiconductor heating plate 5, the electric telescopic rod 27 drives the slider 25 to move along the slide rod 26 in the slide groove 24 toward the side close to the semiconductor heating plate 5, thereby driving the clamping claw 28 to clamp the semiconductor heating plate 5.

[0027] The extension length of the electric telescopic rod 27 corresponding to each clamping assembly is individually controlled by the control panel 6; In this embodiment, the telescopic length of the electric telescopic rod 27 corresponding to each group of clamping components is individually controlled by the control panel 6, so as to ensure that the distance between the clamping claws 28 on each group of clamping components and the semiconductor heating disk 5 is flexible, and each clamping claw 28 can be located at a different position according to the size and shape of the semiconductor heating disk 5, so that the semiconductor heating disk 5 can be clamped, and according to the shape of each semiconductor heating disk 5, when the clamping claw 28 is close to the semiconductor heating disk 5, the semiconductor heating disk 5 can be pushed, so that when the clamping claw 28 moves into place, the semiconductor heating disk 5 can also be in the center position, so that after entering the chamber 12, the contact area between the semiconductor heating disk 5 and the liquid storage tank 31 can be in the maximum state; The placement mechanism 2 can be used to facilitate the placement of the semiconductor heating disk 5 in the device housing 1, and through the push of multiple groups of clamping components, the semiconductor heating disk 5 can be located at the center position of the placement mechanism 2, and when in the device housing 1, the semiconductor heating disk 5 is located directly below the heating mechanism 3, so that the semiconductor heating disk 5 and the liquid storage tank 31 of the heating mechanism 3 can be fully in contact, thereby maximizing the heat conduction area between the two.

[0028] See also Figure 6 and Figure 7 As shown, the top of the liquid storage tank 31 is also provided with a liquid level sensor 32, a temperature sensor 33 and a liquid inlet 34, a solenoid valve 1 35 is installed on the liquid inlet 34, and a reflux pipe 37 is connected to the liquid inlet 34; the upper end of the liquid storage tank 31 is connected to an adjusting rod 38, and two guide rods 39 are provided on both sides of the adjusting rod 38, the lower end of the guide rod 39 is connected to the liquid storage tank 31, and the upper end of the guide rod 39 is connected to the device housing 1; In this embodiment, after the semiconductor heating disk 5 is put into the device housing 1, the liquid storage tank 31 can be driven to move downward and contact the semiconductor heating disk 5 by extending the adjusting rod 38. When the semiconductor heating disk 5 is powered on, the heat generated will heat the liquid in the liquid storage tank 31, and the liquid in the liquid storage tank 31 will enter the cooling tank 41 along the evaporation pipe 36 for cooling after being heated and vaporized. When the liquid storage tank 31 is heated, the liquid level in the liquid storage tank 31 is constantly monitored by the liquid level sensor 32, so that the liquid level in the liquid storage tank 31 is maintained at a suitable scale, and the temperature in the liquid storage tank 31 can be detected by the temperature sensor 33 to avoid temperature abnormalities. The up and down movement of the liquid storage tank 31 is driven by the control panel 6 controlling the extension and retraction of the adjusting rod 38. After the semiconductor heating disk 5 is sent into the device housing 1, the liquid storage tank 31 is driven to move down and contact with the semiconductor heating disk 5 by extending the adjusting rod 38. After the semiconductor heating disk 5 is detected and needs to be moved out of the device housing 1, the liquid storage tank 31 is first driven to move up and disengage from the semiconductor heating disk 5 by retracting the adjusting rod 38 to prevent the equipment from being scratched when the semiconductor heating disk 5 moves. In addition, when the liquid storage tank 31 moves up and down, it will drive the guide rod 2 39 to extend and retract up and down in the device housing 1, and the guide rod 2 39 is used to improve the stability of the liquid storage tank 31 when it moves up and down.

[0029] See also Figure 8 and Fig. 9 As shown, one side of the cooling box 41 is connected to the water inlet of the pump body 43 by means of a connecting pipe 1 42, and the other end of the return pipe 37 is connected to the water outlet of the pump body 43. A heat sink 44 is provided on the side edge of the cooling box 41, and air forms convection in the chamber 2 13 through the heat dissipation port 16; In this embodiment, the liquid in the liquid storage tank 31 is heated and evaporated and enters the cooling tank 41 through the evaporation pipe 36 for cooling, and the liquid in the liquid storage tank 31 will gradually decrease. If the liquid is not added to the liquid storage tank 31, the long-term evaporation of the liquid will cause the liquid storage tank 31 to dry out, thereby affecting the normal operation of the equipment. Therefore, when the liquid level sensor 32 monitors that the liquid storage tank 31 reaches the lowest scale, it will send a signal to the control panel 6, and the pump body 43 will be started through the control panel 6, and the solenoid valve 1 35 will be opened, so that the pump body 43 is connected with the liquid storage tank 31 through the liquid inlet 34, and the liquid in the cooling tank 41 is pumped out through the connecting pipe 1 42 through the pump body 43, and injected into the liquid storage tank 31 through the reflux pipe 37, so as to achieve the purpose of replenishing the liquid in the liquid storage tank 31; In the present invention, a circulation system is formed by the heating mechanism 3 and the cooling mechanism 4, so that when the semiconductor heating disk 5 is powered on for detection, the liquid in the heating mechanism 3 is continuously heated, and then the evaporated liquid is cooled by the cooling mechanism 4 and can flow back to the heating mechanism 3 for circulation heating, thereby satisfying that the heating mechanism 3 can be heated by the semiconductor heating disk 5 for a long time without the phenomenon of dry pot, and avoiding the semiconductor heating disk 5 from being dry-burned and affecting the normal service life; In addition, a heat sink 44 is provided on the outside of the cooling box 41 to increase the contact area with the air, thereby increasing the heat dissipation effect of the cooling box 41, so that the liquid entering the cooling box 41 along the evaporating tube 36 can be quickly and completely liquefied, and the setting of the heat dissipation port 16 allows convection between the outside air and the air in the chamber 2 13, thereby utilizing the flow of air to more quickly reduce the temperature of the cooling box 41.

[0030] A second connecting pipe 45 is also connected to the lower side of the cooling box 41. A liquid injection port 46 and a liquid discharge port 47 are respectively provided at the distal end of the second connecting pipe 45. A second solenoid valve 48 and a third solenoid valve 49 are respectively provided on the liquid injection port 46 and the liquid discharge port 47. In this embodiment, liquid can be added to or discharged from the cooling box 41 by utilizing the filling port 46 and the discharge port 47 provided on the connecting pipe 45, thereby ensuring that the liquid flow in the heating mechanism 3 and the cooling mechanism 4 is in a normal state. When any of the filling port 46 and the discharge port 47 needs to be opened, the opening or closing can be controlled by the control panel 6.

[0031] The working principle of the present invention is as follows: when the semiconductor heating disk 5 is subjected to quality inspection, the semiconductor heating disk 5 to be inspected is first placed on the placement mechanism 2, and is sent into the device housing 1 through the placement mechanism 2, so that the semiconductor heating disk 5 is directly below the heating mechanism 3; then, the liquid storage tank 31 in the heating mechanism 3 is manipulated to move downward and contact with the semiconductor heating disk 5, and liquid is injected into the liquid storage tank 31; then, the current flowing into the semiconductor heating disk 5 is controlled by using the control panel 6, so that the semiconductor heating disk 5 is powered on and works at the power required for the test, and the life of normal operation at this power is detected; the heat generated by the semiconductor heating disk 5 in normal operation heats the liquid in the heating mechanism 3, and the liquid in the heating mechanism 3 absorbs heat and evaporates, and enters the cooling mechanism 4 through the evaporation tube 36 for cooling, thereby maintaining the pressure in the heating mechanism 3.

[0032] The above is only a preferred embodiment of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art unless otherwise specified and limited.

Claims

1. A semiconductor heating plate quality detection device, characterized in that: include: A device housing (1), wherein the device housing (1) is divided into a chamber 1 (12) and a chamber 2 (13) by a partition (11), wherein a placement mechanism (2) for placing a semiconductor heating plate (5) is provided in the chamber 1 (12), a heating mechanism (3) is provided above the placement mechanism (2), and a cooling mechanism (4) is provided in the chamber 2 (13); The outer ends of the chamber one (12) and the chamber two (13) are respectively provided with a door body one (14) and a door body two (15), and a control panel (6) is installed on the door body one (14); The placement mechanism (2) comprises a placement table (21) movably arranged in the chamber 1 (12), and the semiconductor heating plate (5) is placed on the placement table (21); The heating mechanism (3) includes a liquid storage tank (31), and the cooling mechanism (4) includes a cooling tank (41), and the liquid storage tank (31) and the cooling tank (41) are connected via an evaporation pipe (36); The semiconductor heating plate (5) and the control panel (6) are electrically connected via a wire; The control panel (6) is used to control the output of different currents to the semiconductor heating disk (5), so that the semiconductor heating disk (5) generates different powers, and the service life of the semiconductor heating disk (5) at different powers is detected.

2. A semiconductor heating plate quality detection device according to claim 1, characterized in that: A heat dissipation port (16) is provided on the device housing (1) at a position corresponding to the second chamber (13), and an observation window (17) and a buzzer (7) are also provided on the first door (14).

3. A semiconductor heating plate quality detection device according to claim 1, characterized in that: The lower end of the placement table (21) is connected to an electric telescopic rod (22), and guide rods (23) are connected to both sides of the placement table (21). The placement table (21) is moved forward and backward along the guide rods (23). A plurality of clamping components are arranged on the inner side of the placement table (21), and the clamping components include a slide groove (24), a slider (25) is arranged in the slide groove (24), a slider (26) is connected in the slider (25), an electric telescopic rod (27) is connected below the slider (25), and a clamping claw (28) for clamping the semiconductor heating plate (5) is installed at the upper end of the slider (25).

4. A semiconductor heating plate quality detection device according to claim 3, characterized in that: The extension and retraction length of the electric telescopic rod 2 (27) corresponding to each set of clamping components is individually controlled via the control panel (6).

5. A semiconductor heating plate quality detection device according to claim 1, characterized in that: A liquid level sensor (32), a temperature sensor (33) and a liquid inlet (34) are also provided at the top of the liquid storage tank (31), and a solenoid valve (35) is installed on the liquid inlet (34). A reflux pipe (37) is connected to the liquid inlet (34).

6. A semiconductor heating plate quality detection device according to claim 1, characterized in that: The upper end of the liquid storage tank (31) is connected to an adjusting rod (38), and two guide rods (39) are provided on both sides of the adjusting rod (38), the lower end of the second guide rod (39) is connected to the liquid storage tank (31), and the upper end of the second guide rod (39) is connected to the device housing (1).

7. A semiconductor heating plate quality detection device according to claim 5, characterized in that: One side of the cooling box (41) is connected to the water inlet of the pump body (43) by means of a connecting pipe (42), and the other end of the return pipe (37) is connected to the water outlet of the pump body (43).

8. A semiconductor heating plate quality detection device according to claim 2, characterized in that: The side edge of the cooling box (41) is provided with a heat sink (44), and air forms convection in the second chamber (13) through the heat dissipation opening (16).

9. A semiconductor heating plate quality detection device according to claim 1, characterized in that: A second connecting pipe (45) is also connected below the cooling box (41), and a liquid injection port (46) and a liquid discharge port (47) are respectively provided at the far end of the second connecting pipe (45), and a second solenoid valve (48) and a third solenoid valve (49) are respectively provided on the liquid injection port (46) and the liquid discharge port (47).

10. A semiconductor heating plate quality detection method, applied to the semiconductor heating plate quality detection device according to any one of claims 1 to 9, characterized in that: S1, placing the semiconductor heating disk (5) to be tested on the placement mechanism (2), and sending it into the device housing (1) through the placement mechanism (2), so that the semiconductor heating disk (5) is directly below the heating mechanism (3); S2, controlling the liquid storage tank (31) in the heating mechanism (3) to move downward and contact the semiconductor heating plate (5), and injecting liquid into the liquid storage tank (31); S3, using the control panel (6) to control the current flowing into the semiconductor heating disk (5), so that the semiconductor heating disk (5) is powered on and operates at the power required for the test, and the life of the semiconductor heating disk (5) is detected when it normally operates at the power; S4. The heat generated by the semiconductor heating plate (5) during normal operation heats the liquid in the heating mechanism (3). The liquid in the heating mechanism (3) absorbs heat and evaporates, and enters the cooling mechanism (4) through the evaporation pipe (36) to be cooled, thereby maintaining the pressure in the heating mechanism (3).

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