Automatic locating point touch control method and device, electronic equipment and storage medium

Abstract

The invention provides an automatic locating point contact control method and device, electronic equipment and a storage medium, and the method comprises the steps: determining a to-be-detected welding spot region on a component and a reference welding spot region corresponding to the to-be-detected welding spot region; coordinates of the bottom center point of the to-be-detected welding spot area and the bottom center point of the reference welding spot area in the reference coordinate system are obtained; establishing a user coordinate system by taking the bottom center point of the to-be-detected welding spot area as an original point; determining a conversion matrix between the reference coordinate system and the user coordinate system according to the coordinate values of the bottom center point of the to-be-detected welding spot area and the bottom center point of the reference welding spot area in the reference coordinate system and the user coordinate system respectively; determining the coordinate of a point contact target point of the to-be-detected welding spot area in a user coordinate system; and determining the coordinate and the direction of the point contact target point in the reference coordinate system according to the transformation matrix and the coordinate of the point contact target point in the user coordinate system.

Description

Technical Field

[0001] The present disclosure relates to the field of robot touch control, and in particular to an automatic positioning touch control method, device, electronic device and storage medium. Background Art

[0002] In the automated testing of electrical signals on notebook motherboards, the current method of mapping drawings and physical objects for positioning can solve the problem of positioning accuracy within 0.5mm. However, in some test items, there are three-dimensional packaged components, and the components themselves will cover the contacts. Therefore, even if the positioning is accurate, the test cannot be performed stably.

[0003] In the prior art, a touch position calculation method based on the correction of the mapping positioning method can be used. The mapping positioning method is used to calculate the coordinates of the actual solder joints according to the solder joint coordinates on the drawing, and then a certain offset is set (offset to the two ends of the part) to try to touch the exposed metal contacts of the three-dimensional packaged components. However, since the metal contacts exposed on the upper surface of the three-dimensional packaged components themselves are very small (<0.2mm), the coordinates obtained by correcting the position have deviations, the touch stability is poor, and the actual touch success rate is only 60%, which seriously affects the success rate of the notebook motherboard automated test. Summary of the invention

[0004] The present disclosure provides a touch control method, device, electronic device and storage medium for automatic positioning, so as to at least solve the above technical problems existing in the prior art.

[0005] According to a first aspect of the present disclosure, there is provided a touch control method for automatic positioning, the method comprising:

[0006] Determine a solder joint area to be tested on a component and a reference solder joint area corresponding to the solder joint area to be tested, wherein the solder joint area to be tested and the reference solder joint area are respectively located at two ends of the component;

[0007] Obtaining the coordinates of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in a reference coordinate system;

[0008] A user coordinate system is established with the bottom center point of the solder joint area to be tested as the origin, wherein the X-axis, Y-axis and Z-axis of the user coordinate system are the length, width and height directions of the component respectively;

[0009] Determine a conversion matrix between the reference coordinate system and the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in the reference coordinate system and the user coordinate system respectively;

[0010] Determine the coordinates of the touch target point of the solder joint area to be tested in the user coordinate system;

[0011] The coordinates and direction of the touch target point in the reference coordinate system are determined according to the conversion matrix and the coordinates of the touch target point in the user coordinate system.

[0012] In one embodiment, the method further comprises:

[0013] After determining the coordinates and direction of the touch target point in the reference coordinate system, obtaining obstacle information around the component through a camera;

[0014] The robot arm performs touch according to the coordinates and direction of the touch target point in the reference coordinate system and the obstacle information.

[0015] In one embodiment, the method further comprises:

[0016] The length dimension and width dimension of the component, as well as the height dimension of the solder joint area to be tested and the width dimension parallel to the length direction of the component are obtained.

[0017] In one possible implementation manner, determining the coordinates of the touch target point of the solder joint area to be tested in the user coordinate system includes:

[0018] If the height dimension of the solder joint area to be tested is greater than the width dimension, the touch target point is the side center point of the solder joint area to be tested;

[0019] If the height dimension of the solder joint area to be tested is smaller than the width dimension, the touch target point is the center point of the upper surface of the solder joint area to be tested.

[0020] In one possible implementation manner, determining the conversion matrix between the reference coordinate system and the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in the reference coordinate system and the user coordinate system respectively includes:

[0021] Determine a translation matrix between the reference coordinate system and the user coordinate system according to coordinate values ​​of the origin of the reference coordinate system in the reference coordinate system and the user coordinate system respectively;

[0022] Determine the basis vectors of the reference coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the reference coordinate system;

[0023] Determine the basis vectors of the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the user coordinate system;

[0024] Determine a rotation matrix between the reference coordinate system and the user coordinate system according to basis vectors of the reference coordinate system and the user coordinate system;

[0025] A transformation matrix between the reference coordinate system and the user coordinate system is determined according to the rotation matrix.

[0026] In one possible implementation, determining the translation matrix between the reference coordinate system and the user coordinate system according to the coordinate values ​​of the origin of the reference coordinate system in the reference coordinate system and the user coordinate system respectively includes:

[0027] The translation matrix is ​​determined according to the following formula:

[0028]

[0029]

[0030] Among them, O1 is the coordinate value of the origin of the reference coordinate system in the reference coordinate system, O2 is the coordinate value of the origin of the reference coordinate system in the user coordinate system, t x ,t y ,t z For vector The value of , T is the translation matrix.

[0031] In one possible implementation, determining the basis vectors of the reference coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the reference coordinate system includes:

[0032] The basis vectors of the reference coordinate system are determined according to the following formula:

[0033]

[0034]

[0035]

[0036] Wherein, M1 is the coordinate value of the bottom center point of the solder joint area to be tested in the reference coordinate system, N1 is the coordinate value of the bottom center point of the reference solder joint area in the reference coordinate system, and are the basis vectors of the reference coordinate system on the X-axis, Y-axis and Z-axis respectively;

[0037] The determining the basis vectors of the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the user coordinate system comprises:

[0038] The basis vectors of the user coordinate system are determined according to the following formula:

[0039]

[0040]

[0041]

[0042] Wherein, M2 is the coordinate value of the bottom center point of the solder joint area to be tested in the user coordinate system, and N2 is the coordinate value of the bottom center point of the reference solder joint area in the user coordinate system. and They are the basis vectors of the user coordinate system on the X-axis, Y-axis, and Z-axis respectively.

[0043] In one possible implementation, determining a rotation matrix between the reference coordinate system and the user coordinate system according to basis vectors of the reference coordinate system and the user coordinate system includes:

[0044] The rotation matrix is ​​determined according to the following formula:

[0045]

[0046] Where R is the rotation matrix between the reference coordinate system and the user coordinate system.

[0047] In one possible implementation, determining a transformation matrix between the reference coordinate system and the user coordinate system according to the rotation matrix includes:

[0048] The transformation matrix is ​​determined according to the following formula:

[0049]

[0050] Where A is the transformation matrix between the reference coordinate system and the user coordinate system.

[0051] According to a second aspect of the present disclosure, there is provided an automatic positioning touch control device, the device comprising:

[0052] A first determining unit is configured to determine a solder joint area to be tested on a component and a reference solder joint area corresponding to the solder joint area to be tested, wherein the solder joint area to be tested and the reference solder joint area are located at two ends of the component respectively;

[0053] A first acquisition unit is configured to acquire the coordinates of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in a reference coordinate system;

[0054] An establishing unit is configured to establish a user coordinate system with the bottom center point of the solder joint area to be tested as the origin, wherein the X-axis, Y-axis and Z-axis of the user coordinate system are respectively the length, width and height directions of the component;

[0055] A second determining unit is configured to determine a conversion matrix between the reference coordinate system and the user coordinate system according to coordinate values ​​of a bottom center point of the solder joint area to be tested and a bottom center point of the reference solder joint area in the reference coordinate system and the user coordinate system respectively;

[0056] A third determining unit is configured to determine the coordinates of the touch target point of the welding spot area to be tested in the user coordinate system;

[0057] The fourth determining unit is configured to determine the coordinates and direction of the touch target point in the reference coordinate system according to the transformation matrix and the coordinates of the touch target point in the user coordinate system.

[0058] According to a third aspect of the present disclosure, there is provided an electronic device, including:

[0059] at least one processor; and

[0060] a memory communicatively connected to the at least one processor; wherein,

[0061] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method described in the present disclosure.

[0062] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to cause the computer to execute the method described in the present disclosure.

[0063] The automatic positioning touch control method, device, electronic device and storage medium disclosed in the present invention first determine the conversion matrix of the reference coordinate system and the user coordinate system through the coordinate values ​​of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in the reference coordinate system and the user coordinate system respectively, and then determine the coordinates and direction of the touch coordinate point in the reference coordinate system according to the coordinate value of the touch target point in the user coordinate system and the conversion matrix. According to the coordinates and direction, the robot arm can be controlled to perform touch testing, thereby solving the problem of unstable touch of three-dimensional packaged components and improving the stability and accuracy of automated execution of all electrical signal tests on the notebook computer motherboard.

[0064] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0066] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0067] Figure 1 A flow chart of a touch control method for automatic positioning provided by an embodiment of the present disclosure;

[0068] Figure 2 It is a schematic diagram of the structure of components;

[0069] Figure 3 A three-dimensional modeling diagram of components provided in an embodiment of the present disclosure;

[0070] Figure 4 A schematic diagram of the structure of an automatic positioning touch control device provided in an embodiment of the present disclosure;

[0071] Figure 5 A schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0072] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0073] The present disclosure provides a touch control method for automatic positioning. Figure 1 A flowchart of the touch control method for automatic positioning provided by an embodiment of the present disclosure, such as Figure 1 As shown, the method comprises the following steps:

[0074] Step 101, determining a solder joint area to be tested and a reference solder joint area corresponding to the solder joint area to be tested on a component, wherein the solder joint area to be tested and the reference solder joint area are located at two ends of the component respectively.

[0075] Figure 2It is a schematic diagram of the structure of components.

[0076] like Figure 2 As shown, the component 10 has a solder joint area at both ends along the length direction, one end of which is the solder joint area 11 to be tested, and the other end is the reference solder joint area 12. In actual operation, the solder joint area is the solder joint on the component 10, and the touch is to perform a touch test on the solder joint.

[0077] In one embodiment, the method further includes: obtaining the length dimension and width dimension of the component, and the height dimension of the solder joint area to be tested and the width dimension parallel to the length direction of the component.

[0078] Specifically, the packaging parameters of the components corresponding to the measuring point can be obtained through a PLM (Product Lifecycle Management) system.

[0079] like Figure 2 As shown in the figure, the length dimension of the component is L, the width dimension is W, the height dimension of the solder joint area to be tested is t, the width dimension of the upper surface is a, and the width dimension of the bottom surface is b. Depending on the component model, the size will also be different. For example, for the 0201 model component, the range of L is 0.55-0.65mm, the range of W is 0.25-0.35mm, the range of t is 0.18-0.28mm, the range of a is 0.05-0.15mm, and the range of b is 0.1-0.2mm.

[0080] Step 102, obtaining the coordinates of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in a reference coordinate system.

[0081] Figure 3 A three-dimensional modeling diagram of components provided in an embodiment of the present disclosure.

[0082] In the disclosed embodiment, the origin O of the reference coordinate system is a point on the actual laptop motherboard, for example, it can be the lower left point of the computer motherboard plane, the X-axis and Y-axis of the reference coordinate system can be two adjacent sides of the computer motherboard plane, and the Z-axis can be a direction perpendicular to the computer motherboard plane. However, the reference coordinate system is not limited thereto, and the X-axis, Y-axis, and Z-axis can also be other directions.

[0083] Specifically, the mapping positioning method can be used to obtain the coordinates of the bottom center point M of the solder joint area 11 to be tested and the bottom center point N of the reference solder joint area 12 in the reference coordinate system. In the reference coordinate system, the coordinates of the bottom center point M of the solder joint area 11 to be tested are expressed as M1, the coordinates of the bottom center point N of the reference solder joint area 12 are expressed as N1, and the coordinates of the origin O of the reference coordinate system are expressed as O1.

[0084] Step 103, establishing a user coordinate system with the bottom center point of the solder joint area to be tested as the origin, wherein the X-axis, Y-axis and Z-axis of the user coordinate system are the length, width and height directions of the component respectively.

[0085] like Figure 3 As shown, the origin of the user coordinate system is the bottom center point M of the solder joint area 11 to be tested.

[0086] Step 104 , determining a conversion matrix between the reference coordinate system and the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in the reference coordinate system and the user coordinate system respectively.

[0087] Specifically, the coordinate values ​​of the bottom center point M of the solder joint area 11 to be tested and the bottom center point N of the reference solder joint area 12 in the user coordinate system can be calculated through geometric relationships. In the user coordinate system, the coordinates of the bottom center point M of the solder joint area 11 to be tested are expressed as M2, the coordinates of the bottom center point N of the reference solder joint area 12 are expressed as N2, and the coordinates of the origin O of the reference coordinate system are expressed as O2.

[0088] In one embodiment, according to the coordinate values ​​of the bottom center point M of the solder joint area 11 to be tested and the bottom center point N of the reference solder joint area 12 in the reference coordinate system and the user coordinate system respectively, a conversion matrix between the reference coordinate system and the user coordinate system is determined, including:

[0089] Determine the translation matrix between the reference coordinate system and the user coordinate system according to the coordinate values ​​of the origin O of the reference coordinate system in the reference coordinate system and the user coordinate system respectively;

[0090] Determine the basis vectors of the reference coordinate system according to the coordinate values ​​of the bottom center point M of the solder joint area 11 to be tested, the bottom center point N of the reference solder joint area 12 and the origin O of the reference coordinate system in the reference coordinate system;

[0091] Determine the basis vectors of the user coordinate system according to the coordinate values ​​of the bottom center point M of the solder joint area 11 to be tested, the bottom center point N of the reference solder joint area 12 and the origin O of the reference coordinate system in the user coordinate system;

[0092] Determine the rotation matrix between the reference coordinate system and the user coordinate system according to the basis vectors of the reference coordinate system and the user coordinate system;

[0093] Based on the rotation matrix, determine the transformation matrix between the reference coordinate system and the user coordinate system.

[0094] Specifically, the translation matrix is ​​first determined according to the following formula:

[0095]

[0096]

[0097] Among them, O1 is the coordinate value of the origin O of the reference coordinate system in the reference coordinate system, O2 is the coordinate value of the origin O of the reference coordinate system in the user coordinate system, t x ,t y ,t z For vector The value of , T is the translation matrix.

[0098] Next, determine the basis vectors of the reference coordinate system according to the following formula:

[0099]

[0100]

[0101]

[0102] Wherein, M1 is the coordinate value of the bottom center point M of the solder joint area 11 to be tested in the reference coordinate system, and N1 is the coordinate value of the bottom center point N of the reference solder joint area 12 in the reference coordinate system. and are the basis vectors of the reference coordinate system on the X-axis, Y-axis and Z-axis respectively;

[0103] Next, determine the basis vectors of the user coordinate system according to the following formula:

[0104]

[0105]

[0106]

[0107] Wherein, M2 is the coordinate value of the bottom center point M of the solder joint area 11 to be tested in the user coordinate system, and N2 is the coordinate value of the bottom center point N of the reference solder joint area 12 in the user coordinate system. and They are the basis vectors of the user coordinate system on the X-axis, Y-axis, and Z-axis respectively.

[0108] Next, determine the rotation matrix according to the following formula:

[0109]

[0110] Where R is the rotation matrix between the reference coordinate system and the user coordinate system.

[0111] Next, determine the transformation matrix according to the following formula:

[0112]

[0113] Where A is the transformation matrix between the reference coordinate system and the user coordinate system.

[0114] Step 105, determining the coordinates of the touch target point in the solder joint area to be tested in the user coordinate system.

[0115] In one embodiment, determining the coordinates of the touch target point Q of the solder joint area 11 to be tested in the user coordinate system includes:

[0116] If the height dimension t of the solder joint area 11 to be tested is greater than the width dimension a, the touch target point Q is the center point of the side surface of the solder joint area 11 to be tested;

[0117] If the height dimension t of the solder joint area 11 to be tested is smaller than the width dimension a, the touch target point Q is the center point of the upper surface of the solder joint area 11 to be tested.

[0118] When performing a touch test, it is best to select a surface with a larger area for the touch test. Therefore, if the height dimension t of the solder joint area 11 to be tested is greater than the width dimension a, the area of ​​the side surface is greater than the area of ​​the upper surface, so the touch target point Q selects the center point of the side surface. If the height dimension t of the solder joint area 11 to be tested is less than the width dimension a, the area of ​​the upper surface is greater than the area of ​​the side surface, so the touch target point Q selects the center point of the upper surface. In the disclosed embodiment, the height dimension t is set to be greater than the width dimension a, so the center point of the side surface is selected as the touch target point Q.

[0119] In the embodiment of the present disclosure, the coordinate value of the touch coordinate point Q in the user coordinate system is expressed as Q2 (a, 0, t / 2).

[0120] Step 106 , determining the coordinates and direction of the touch target point in the reference coordinate system according to the transformation matrix and the coordinates of the touch target point in the user coordinate system.

[0121] Specifically, the coordinate value of the touch target point Q in the reference coordinate system is first determined according to the following formula:

[0122] Q1=A -1 Q2

[0123] Wherein, Q1 is the coordinate value of the touch coordinate point Q in the reference coordinate system.

[0124] Next, the touch direction is determined according to the acquired coordinate value Q1 of the touch coordinate point Q in the reference coordinate system and the coordinate value M1 of the bottom center point M of the solder joint area 11 to be tested in the reference coordinate system. Specifically, the touch direction can be determined according to the following formula:

[0125]

[0126] Next, after determining the coordinates and direction of the touch target point Q in the reference coordinate system, the obstacle information around the component 11 is acquired through the camera;

[0127] The robot arm touches according to the coordinates and direction of the touch target point Q in the reference coordinate system and the obstacle information.

[0128] Specifically, a 3D camera may be used to obtain obstacle information around components.

[0129] The disclosed embodiment also provides a touch control device for automatic positioning. Figure 4 A schematic diagram of the structure of the touch control device for automatic positioning provided by the embodiment of the present disclosure, such as Figure 4 As shown, the device comprises:

[0130] The first determining unit 401 is configured to determine a solder joint area to be tested and a reference solder joint area corresponding to the solder joint area to be tested on the component, wherein the solder joint area to be tested and the reference solder joint area are located at two ends of the component respectively;

[0131] A first acquisition unit 402 is configured to acquire the coordinates of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in a reference coordinate system;

[0132] An establishing unit 403 is configured to establish a user coordinate system with the bottom center point of the solder joint area to be tested as the origin, wherein the X-axis, Y-axis and Z-axis of the user coordinate system are respectively the length, width and height directions of the component;

[0133] The second determining unit 404 is configured to determine a conversion matrix between the reference coordinate system and the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in the reference coordinate system and the user coordinate system respectively;

[0134] The third determining unit 405 is configured to determine the coordinates of the touch target point in the solder joint area to be tested in the user coordinate system;

[0135] The fourth determining unit 406 is configured to determine the coordinates and direction of the touch target point in the reference coordinate system according to the transformation matrix and the coordinates of the touch target point in the user coordinate system.

[0136] In one embodiment, the device further includes: a second acquisition unit 407 configured to acquire the length dimension and width dimension of the component, and the height dimension of the solder joint area to be tested and the width dimension parallel to the length direction of the component.

[0137] In one embodiment, the device further includes: a third acquisition unit 408, configured to acquire obstacle information around the component through a camera after determining the coordinates and direction of the touch target point in the reference coordinate system;

[0138] The touch unit 409 is configured as a robotic arm to perform touch according to the coordinates and direction of the touch target point in the reference coordinate system and the obstacle information.

[0139] In one embodiment, the third determination unit 405 is specifically configured such that if the height dimension of the solder joint area to be tested is greater than the width dimension, the touch target point is the side center point of the solder joint area to be tested; if the height dimension of the solder joint area to be tested is less than the width dimension, the touch target point is the upper surface center point of the solder joint area to be tested.

[0140] In one embodiment, the second determining unit 404 includes:

[0141] A first sub-determining unit is configured to determine a translation matrix between the reference coordinate system and the user coordinate system according to coordinate values ​​of the origin of the reference coordinate system in the reference coordinate system and the user coordinate system respectively;

[0142] A second sub-determining unit is configured to determine a basis vector of the reference coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the reference coordinate system;

[0143] A third sub-determining unit is configured to determine a basis vector of the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the user coordinate system;

[0144] a fourth sub-determining unit, configured to determine a rotation matrix between the reference coordinate system and the user coordinate system according to basis vectors of the reference coordinate system and the user coordinate system;

[0145] The fifth sub-determination unit is configured to determine a transformation matrix between the reference coordinate system and the user coordinate system according to the rotation matrix.

[0146] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device and a readable storage medium.

[0147] Figure 5A schematic block diagram of an example electronic device 500 that can be used to implement an embodiment of the present disclosure is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present disclosure described and / or required herein.

[0148] like Figure 5 As shown, the device 500 includes a computing unit 501, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 502 or a computer program loaded from a storage unit 508 into a random access memory (RAM) 503. In the RAM 503, various programs and data required for the operation of the device 500 can also be stored. The computing unit 501, the ROM 502, and the RAM 503 are connected to each other via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0149] A number of components in the device 500 are connected to the I / O interface 505, including: an input unit 506, such as a keyboard, a mouse, etc.; an output unit 507, such as various types of displays, speakers, etc.; a storage unit 508, such as a disk, an optical disk, etc.; and a communication unit 509, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 509 allows the device 500 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0150] The computing unit 501 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 501 performs the various methods and processes described above, such as the touch control method for automatic positioning. For example, in some embodiments, the touch control method for automatic positioning may be implemented as a computer software program, which is tangibly included in a machine-readable medium, such as a storage unit 508. In some embodiments, part or all of the computer program may be loaded and / or installed on the device 500 via the ROM 502 and / or the communication unit 509. When the computer program is loaded into the RAM 503 and executed by the computing unit 501, one or more steps of the touch control method for automatic positioning described above may be performed. Alternatively, in other embodiments, the computing unit 501 may be configured to execute the automatic positioning touch control method in any other appropriate manner (for example, by means of firmware).

[0151] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0152] The program code for implementing the method of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0153] In the context of the present disclosure, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0154] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0155] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0156] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship with each other. The server may be a cloud server, a server of a distributed system, or a server combined with a blockchain.

[0157] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this disclosure can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0158] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0159] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A touch control method for automatic positioning, characterized in that: The method comprises: Determine a solder joint area to be tested on a component and a reference solder joint area corresponding to the solder joint area to be tested, wherein the solder joint area to be tested and the reference solder joint area are respectively located at two ends of the component; Obtaining the coordinates of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in a reference coordinate system; A user coordinate system is established with the bottom center point of the solder joint area to be tested as the origin, wherein the X-axis, Y-axis and Z-axis of the user coordinate system are the length, width and height directions of the component respectively; Determine a conversion matrix between the reference coordinate system and the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in the reference coordinate system and the user coordinate system respectively; Determine the coordinates of the touch target point of the solder joint area to be tested in the user coordinate system; The coordinates and direction of the touch target point in the reference coordinate system are determined according to the conversion matrix and the coordinates of the touch target point in the user coordinate system.

2. The method according to claim 1, characterized in that The method further comprises: After determining the coordinates and direction of the touch target point in the reference coordinate system, obtaining obstacle information around the component through a camera; The robot arm performs touch according to the coordinates and direction of the touch target point in the reference coordinate system and the obstacle information.

3. The method according to claim 1, characterized in that The method further comprises: The length dimension and width dimension of the component, as well as the height dimension of the solder joint area to be tested and the width dimension parallel to the length direction of the component are obtained.

4. The method according to claim 3, characterized in that The step of determining the coordinates of the touch target point of the solder joint area to be tested in the user coordinate system includes: If the height dimension of the solder joint area to be tested is greater than the width dimension, the touch target point is the side center point of the solder joint area to be tested; If the height dimension of the solder joint area to be tested is smaller than the width dimension, the touch target point is the center point of the upper surface of the solder joint area to be tested.

5. The method according to claim 1, characterized in that: The step of determining a conversion matrix between the reference coordinate system and the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in the reference coordinate system and the user coordinate system respectively includes: Determine a translation matrix between the reference coordinate system and the user coordinate system according to coordinate values ​​of the origin of the reference coordinate system in the reference coordinate system and the user coordinate system respectively; Determine the basis vectors of the reference coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the reference coordinate system; Determine the basis vectors of the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the user coordinate system; Determine a rotation matrix between the reference coordinate system and the user coordinate system according to basis vectors of the reference coordinate system and the user coordinate system; A transformation matrix between the reference coordinate system and the user coordinate system is determined according to the rotation matrix.

6. The method according to claim 5, characterized in that The determining of the translation matrix between the reference coordinate system and the user coordinate system according to the coordinate values ​​of the origin of the reference coordinate system in the reference coordinate system and the user coordinate system respectively comprises: The translation matrix is ​​determined according to the following formula: Among them, O1 is the coordinate value of the origin of the reference coordinate system in the reference coordinate system, O2 is the coordinate value of the origin of the reference coordinate system in the user coordinate system, t x ,t y ,t z For vector The value of , T is the translation matrix.

7. The method according to claim 5, characterized in that Determining the basis vectors of the reference coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the reference coordinate system, including: The basis vectors of the reference coordinate system are determined according to the following formula: Wherein, M1 is the coordinate value of the bottom center point of the solder joint area to be tested in the reference coordinate system, N1 is the coordinate value of the bottom center point of the reference solder joint area in the reference coordinate system, and are the basis vectors of the reference coordinate system on the X-axis, Y-axis and Z-axis respectively; The determining the basis vectors of the user coordinate system according to the coordinate values ​​of the bottom center point of the solder joint area to be tested, the bottom center point of the reference solder joint area, and the origin of the reference coordinate system in the user coordinate system comprises: The basis vectors of the user coordinate system are determined according to the following formula: Wherein, M2 is the coordinate value of the bottom center point of the solder joint area to be tested in the user coordinate system, and N2 is the coordinate value of the bottom center point of the reference solder joint area in the user coordinate system. and They are the basis vectors of the user coordinate system on the X-axis, Y-axis, and Z-axis respectively.

8. The method according to claim 7, characterized in that The step of determining a rotation matrix between the reference coordinate system and the user coordinate system according to basis vectors of the reference coordinate system and the user coordinate system comprises: The rotation matrix is ​​determined according to the following formula: Where R is the rotation matrix between the reference coordinate system and the user coordinate system.

9. The method according to claim 8, characterized in that The step of determining a transformation matrix between the reference coordinate system and the user coordinate system according to the rotation matrix includes: The transformation matrix is ​​determined according to the following formula: Where A is the transformation matrix between the reference coordinate system and the user coordinate system.

10. An automatic positioning touch control device, characterized in that: The device comprises: A first determining unit is configured to determine a solder joint area to be tested on a component and a reference solder joint area corresponding to the solder joint area to be tested, wherein the solder joint area to be tested and the reference solder joint area are located at two ends of the component respectively; A first acquisition unit is configured to acquire the coordinates of the bottom center point of the solder joint area to be tested and the bottom center point of the reference solder joint area in a reference coordinate system; An establishing unit is configured to establish a user coordinate system with the bottom center point of the solder joint area to be tested as the origin, wherein the X-axis, Y-axis and Z-axis of the user coordinate system are respectively the length, width and height directions of the component; A second determining unit is configured to determine a conversion matrix between the reference coordinate system and the user coordinate system according to coordinate values ​​of a bottom center point of the solder joint area to be tested and a bottom center point of the reference solder joint area in the reference coordinate system and the user coordinate system respectively; A third determining unit is configured to determine the coordinates of the touch target point of the welding spot area to be tested in the user coordinate system; The fourth determining unit is configured to determine the coordinates and direction of the touch target point in the reference coordinate system according to the transformation matrix and the coordinates of the touch target point in the user coordinate system.

11. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 9.

12. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: The computer instructions are used to make a computer execute the method according to any one of claims 1-9.

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