CPO micro-connector manufacturing system and method with high efficiency heat dissipation

Abstract

The present invention relates to the technical field of CPO microconnector manufacturing and provides a CPO microconnector manufacturing system and method with efficient heat dissipation. The system includes a structural design terminal, a material management terminal, a processing terminal, a product quality inspection terminal, and a feedback terminal. The structural design terminal is used by engineers to design and optimize the microchannels, metal wire distribution, and heat dissipation fin shape of the CPO microconnector, generating structural design information. The material management terminal is used to mix materials based on the structural design information and generate material information. The processing terminal is used to process the mixed materials based on the structural design information and material information to produce the corresponding CPO microconnector. The product quality inspection terminal is used to perform quality inspection on the produced CPO microconnector and generate quality inspection information. The feedback terminal is used to generate feedback information based on the quality inspection information and send the feedback information to the processing terminal. The feedback information is used to adjust and optimize processing parameters. The present invention has the effect of improving the manufacturing quality of CPO microconnectors.

Description

Technical Field

[0001] The present invention relates to the technical field of CPO micro-connector manufacturing, and in particular to a CPO micro-connector manufacturing system and method with high-efficiency heat dissipation. Background Art

[0002] With the rapid development of data centers and high-speed optical communication technologies, CPO (Co-Packaged Optics) microconnectors are playing an increasingly important role in high-density optoelectronic coupling and integration. These devices not only require high-speed data transmission performance, but also need to achieve effective heat dissipation management in a very small space. In the manufacturing process of traditional microconnectors, the thermal resistance is often high due to the limitations of the single structure and material selection, which in turn causes performance degradation, increased bit error rate, and even device damage after long-term operation. At the same time, under high-density integration, heat accumulation will have a negative impact on signal stability and accuracy. Therefore, there is an urgent need for a CPO microconnector manufacturing system with an efficient heat dissipation structure. The system needs to comprehensively consider the structural layout, material properties and heat dissipation path optimization during the design and processing process to achieve efficient heat dissipation and high reliability.

[0003] Numerous CPO microconnector manufacturing systems have been developed. After extensive research and reference, we discovered existing CPO microconnector manufacturing systems, such as those disclosed in publication numbers CN117348175A, CN118393664A, and CN117930445A. These CPO microconnector manufacturing systems generally include a modeling terminal, which performs modeling according to engineers' requirements, and a production terminal, which combines CPO packaging technology and modeling information to produce microconnectors. Because these CPO microconnector manufacturing systems have a relatively simple manufacturing process and lack modeling adjustments and output quality inspection, the quality of CPO microconnector manufacturing has declined. Summary of the Invention

[0004] The purpose of the present invention is to address the shortcomings of the above-mentioned CPO micro-connector manufacturing system and propose a CPO micro-connector manufacturing system and method with efficient heat dissipation.

[0005] The present invention adopts the following technical solutions:

[0006] The CPO micro-connector manufacturing system with high-efficiency heat dissipation includes a structural design terminal, a material management terminal, a processing terminal, a product quality inspection terminal, and a feedback terminal; the structural design terminal is used for engineers to design and optimize the microchannels, metal wire distribution, and heat dissipation fin shape of the CPO micro-connector and generate structural design information; the material management terminal is used to mix materials according to the structural design information and generate material information; the processing terminal is used to process the mixed materials according to the structural design information and material information to produce the corresponding CPO micro-connector; the product quality inspection terminal is used to perform quality inspection on the produced CPO micro-connectors and generate quality inspection information; the feedback terminal is used to generate feedback information based on the quality inspection information and send the feedback information to the processing terminal; the feedback information is used to adjust and optimize processing parameters;

[0007] The structural design terminal includes a CAD modeling module, a heat conduction simulation module, a design optimization module and a structural design information generation module; the CAD modeling module is used for engineers to perform three-dimensional modeling of the microchannels, metal wire distribution and heat dissipation fin shape of the CPO microconnector to generate a design model; the heat conduction simulation module is used to perform heat conduction simulation analysis on the design model to generate simulation analysis data; the design optimization module is used to optimize the design model based on the simulation analysis data; the structural design information generation module is used to generate structural design information based on the optimized design model and simulation analysis data.

[0008] Optionally, the material management terminal includes a material selection module and an inventory management module; the material selection module selects corresponding materials based on structural design information and generates material information; the inventory management module is used to manage and track material inventory, automatically allocate required materials based on material information, and transmit them to the processing terminal.

[0009] Optionally, the processing terminal includes a laser etching module, a metal deposition module and a micro-machining module; the laser etching module is used to etch the material according to the material information to form a micro channel and a heat dissipation structure; the metal deposition module is used to deposit a metal conductor layer and heat dissipation fins on the etched material; the micro-machining module is used to perform a micro-grinding processing step on the material after the deposition operation to improve the surface finish and dimensional accuracy of the micro-connector product.

[0010] Optionally, the product quality inspection terminal includes a dimension measurement module, a thermal performance testing module and a data analysis module; the dimension measurement module is used to measure the dimension parameters of the microconnector product; the thermal performance testing module is used to measure the thermal resistance and temperature distribution of the microconnector product; the data analysis module is used to perform evaluation based on the dimension parameters, thermal resistance and temperature distribution to generate quality inspection information.

[0011] Optionally, the feedback terminal includes a data processing module, a parameter adjustment module and a communication module; the data processing module organizes and analyzes quality inspection information; the parameter adjustment module is used to adjust and optimize the processing parameters of the processing terminal according to the analysis results; the communication module is used to generate feedback information based on the optimized processing parameters and transmit it to the processing terminal in real time.

[0012] Optionally, the design optimization module includes a thermal resistance optimization calculation submodule, an optimization algorithm execution submodule, a parameter sensitivity analysis submodule and an optimization result feedback submodule; the thermal resistance optimization calculation submodule is used to calculate the thermal resistance impact based on the parameter combination of the design model; the optimization algorithm execution submodule is used to implement the calculation and minimization process of the optimization objective function, and generate the parameter combination of the design model when the objective function is minimized; the optimization result feedback submodule is used to feed back the optimal design parameters obtained by optimization to the CAD modeling module.

[0013] Optionally, the data processing module includes an error data sorting submodule, a quality trend analysis submodule and an analysis result output submodule; the error data sorting submodule is used to sort the error data of the quality inspection information; the quality trend analysis submodule is used to analyze the quality trend of the current batch of products based on the error data sorting results; the analysis result output submodule is used to output the analysis results based on the error data and quality trends.

[0014] A method for manufacturing a CPO micro connector with high efficiency in heat dissipation is applied to the above-mentioned CPO micro connector manufacturing system with high efficiency in heat dissipation, and the method for manufacturing a CPO micro connector comprises:

[0015] S1, for engineers to design and optimize the microchannels, metal wire distribution and heat dissipation fin shape of the CPO microconnector and generate structural design information;

[0016] S2, allocate materials according to structural design information and generate material information;

[0017] S3, processing the prepared materials according to the structural design information and material information to produce the corresponding CPO micro connector;

[0018] S4, performing quality inspection on the produced CPO micro connectors and generating quality inspection information;

[0019] S5, generating feedback information based on the quality inspection information, and sending the feedback information to the processing terminal;

[0020] S6, adjust and optimize processing parameters.

[0021] The beneficial effects achieved by the present invention are:

[0022] 1. The setup of structural design terminals, material management terminals, processing terminals, product quality inspection terminals, and feedback terminals facilitates the automation and collaborative optimization of the entire process of CPO micro connectors, from design, material allocation, processing, quality inspection to feedback adjustment, thereby improving production efficiency and product quality, and thus enhancing the heat dissipation performance and production quality of CPO micro connectors.

[0023] 2. The material selection module and inventory management module in the material management terminal facilitate accurate selection and allocation of required materials based on structural design information, thereby ensuring the timeliness and accuracy of material supply, thereby stabilizing the production process, reducing material waste, and improving manufacturing efficiency.

[0024] 3. The laser etching module, metal deposition module, and micro-machining module in the processing terminal facilitate high-precision etching, metal deposition, and subsequent micro-grinding of materials, thereby ensuring that the microstructure and heat dissipation performance of the microconnector product meet the design requirements, thereby improving the product's heat dissipation efficiency and dimensional accuracy.

[0025] 4. The dimensional measurement module, thermal performance test module, and data analysis module in the product quality inspection terminal facilitate multi-dimensional dimensional and thermal performance testing of the produced CPO micro connectors, thereby accurately evaluating product quality and ensuring that the product meets design specifications, thereby improving product consistency and reliability.

[0026] 5. The setting of the data processing module, parameter adjustment module and communication module in the feedback terminal is conducive to the systematic organization and analysis of quality inspection information, and then the processing parameters are dynamically adjusted and optimized according to the analysis results, which is conducive to the realization of closed-loop control of the production process and the improvement of the adaptability and stability of the production process;

[0027] 6. The settings of the thermal resistance optimization calculation submodule, optimization algorithm execution submodule, parameter sensitivity analysis submodule, and optimization result feedback submodule in the design optimization module facilitate multi-parameter collaborative optimization calculation based on the influence of thermal resistance, thereby generating the parameter combination of the optimal design model, thereby effectively reducing the overall thermal resistance and improving the heat dissipation efficiency and performance of the CPO micro connector;

[0028] 7. Through the setting of the error data collation submodule, quality trend analysis submodule and analysis result output submodule in the data processing module, it is beneficial to systematically organize the error data in the quality inspection information and analyze the quality trend, and then accurately output the analysis results to ensure the scientificity and effectiveness of the feedback information, which is conducive to optimizing the production process parameters and improving product quality and production efficiency.

[0029] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 This is a schematic diagram of the structure of the design optimization module in the present invention;

[0032] Figure 3 Schematic diagram of the method flow of the experimental data fitting process in the present invention;

[0033] Figure 4 Schematic diagram of the structure of the data processing module in the present invention;

[0034] Figure 5 This is a schematic flow chart of the method for manufacturing a CPO micro connector with high heat dissipation in the present invention. DETAILED DESCRIPTION

[0035] The following is an explanation of the embodiments of the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0036] Embodiment 1: This embodiment provides a CPO micro-connector manufacturing system with high efficiency heat dissipation. Figure 1 As shown, the CPO micro-connector manufacturing system with efficient heat dissipation includes a structural design terminal, a material management terminal, a processing terminal, a product quality inspection terminal and a feedback terminal; the structural design terminal is used for engineers to design and optimize the microchannels, metal wire distribution and heat dissipation fin shape of the CPO micro-connector and generate structural design information; the material management terminal is used to mix materials according to the structural design information and generate material information; the processing terminal is used to process the mixed materials according to the structural design information and material information to produce the corresponding CPO micro-connector; the product quality inspection terminal is used to perform quality inspection on the output CPO micro-connector and generate quality inspection information; the feedback terminal is used to generate feedback information based on the quality inspection information and send the feedback information to the processing terminal; the feedback information is used to adjust and optimize the processing parameters;

[0037] The structural design terminal includes a CAD modeling module, a heat conduction simulation module, a design optimization module and a structural design information generation module; the CAD modeling module is used for engineers to perform three-dimensional modeling of the microchannels, metal wire distribution and heat dissipation fin shape of the CPO microconnector to generate a design model; the heat conduction simulation module is used to perform heat conduction simulation analysis on the design model to generate simulation analysis data; the design optimization module is used to optimize the design model based on the simulation analysis data; the structural design information generation module is used to generate structural design information based on the optimized design model and simulation analysis data.

[0038] Optionally, the material management terminal includes a material selection module and an inventory management module; the material selection module selects corresponding materials based on structural design information and generates material information; the inventory management module is used to manage and track material inventory, automatically allocate required materials based on material information, and transmit them to the processing terminal.

[0039] Optionally, the processing terminal includes a laser etching module, a metal deposition module and a micro-machining module; the laser etching module is used to etch the material according to the material information to form a micro channel and a heat dissipation structure; the metal deposition module is used to deposit a metal conductor layer and heat dissipation fins on the etched material; the micro-machining module is used to perform a micro-grinding processing step on the material after the deposition operation to improve the surface finish and dimensional accuracy of the micro-connector product.

[0040] Optionally, the product quality inspection terminal includes a dimension measurement module, a thermal performance testing module and a data analysis module; the dimension measurement module is used to measure the dimension parameters of the microconnector product; the thermal performance testing module is used to measure the thermal resistance and temperature distribution of the microconnector product; the data analysis module is used to perform evaluation based on the dimension parameters, thermal resistance and temperature distribution to generate quality inspection information.

[0041] Optionally, the feedback terminal includes a data processing module, a parameter adjustment module and a communication module; the data processing module organizes and analyzes quality inspection information; the parameter adjustment module is used to adjust and optimize the processing parameters of the processing terminal according to the analysis results; the communication module is used to generate feedback information based on the optimized processing parameters and transmit it to the processing terminal in real time.

[0042] Optional, combined Figure 2As shown, the design optimization module includes a thermal resistance optimization calculation submodule, an optimization algorithm execution submodule, a parameter sensitivity analysis submodule and an optimization result feedback submodule; the thermal resistance optimization calculation submodule is used to calculate the thermal resistance influence according to the parameter combination of the design model; the optimization algorithm execution submodule is used to realize the calculation and minimization process of the optimization objective function based on the thermal resistance influence, and generate the parameter combination of the design model when the objective function is minimized; the optimization result feedback submodule is used to feed back the optimal design parameters obtained by optimization to the CAD modeling module.

[0043] When the thermal resistance optimization calculation submodule is working, the following formula is satisfied:

[0044]

[0045] L j (d,h,s)≈L j0 +α j,d (d-d0)+α j,h (h-h0)+α j,s (s-s0);

[0046] A j (d,h,s)≈A j0 +β j,d (d-d0)+β j,h (h-h0)+β j,s (s-s0);

[0047] Among them, R th,j (d, h, s) represents the thermal resistance of the jth heat conduction segment; d represents the etching depth of the microchannel of the CPO microconnector; h represents the thickness of the metal layer deposited in the microchannel; s represents the spacing between adjacent heat dissipation fins of the CPO microconnector; d0 represents the initial value of the etching depth in the initial parameters of the preliminary design model; h0 represents the initial value of the metal layer thickness in the initial parameters of the preliminary design model; s0 represents the initial value of the spacing between adjacent heat dissipation fins in the initial parameters of the preliminary design model; there are M heat conduction segments connected in series in the CPO microconnector; j = 1 to M; M represents the total number of heat conduction segments; R th,all (d, h, s) represents the total thermal resistance of the CPO micro connector; L j (d, h, s) represents the characteristic heat transfer length of the jth heat conduction segment; k j A represents the thermal conductivity of the jth heat conduction segment, which is a known constant and can be obtained by querying the material data sheet. j (d, h, s) represents the effective heat transfer cross-sectional area of ​​the jth heat conduction segment. L j0 represents the reference characteristic heat transfer length; A j0 Indicates the reference effective heat transfer area; L j0 and A j0is the data in the design model of the initial parameter state. j,d , α j,h and α j,s They represent the different sensitivity coefficients of the characteristic heat transfer length of the jth heat conduction segment, which are obtained by fitting the experimental data; β j,d , β j,h and β j,s They represent different sensitivity coefficients of the effective heat transfer cross-sectional area of ​​the jth heat conduction segment, obtained by fitting the experimental data; Figure 3 As shown, the experimental data fitting process is as follows:

[0048] A1, according to the initial parameters of the pre-determined design model, measure L j0 and A j0 ;

[0049] A2: Let d, h, and s of the design model change within a fixed range, and record L j (d,h,s) and A j The changes in (d, h, s) are approximated by linear regression to obtain the corresponding sensitivity coefficients.

[0050] When the optimization algorithm executes the submodules, the following formula is satisfied:

[0051]

[0052] Where F(d,h,s) represents the objective function; represents the first-order partial derivative of thermal resistance with respect to the d parameter; represents the first-order partial derivative of thermal resistance with respect to h parameter; represents the first-order partial derivative of thermal resistance with respect to the s-parameter; δ represents the thermal resistance weighting factor. The smaller the product's total volume, the larger the thermal resistance weighting factor. The specific value is set by engineers based on experience. γ1, γ2, and γ3 represent the depth weighting factor, thickness weighting factor, and spacing weighting factor, respectively. The greater the number of microchannels, the larger the depth and thickness weighting factors. The more heat sink fins, the larger the spacing weighting factor. The specific value is set by engineers based on experience. μ represents the weighting factor for the second-order partial derivative. The smaller the product's total volume, the larger the second-order partial derivative weighting factor. The specific value is set by engineers based on experience. r represents the second-order partial derivative. represents the second-order partial derivative of thermal resistance with respect to the d parameter; represents the second-order partial derivative of thermal resistance with respect to the h parameter; represents the second-order partial derivative of thermal resistance with respect to the s parameter. Gradient descent is used to find the parameter combination that minimizes F(d,h,s), thus completing the optimization of the design model.

[0053] As an example, the following is the program code for the implementation example of the above optimization process:

[0054]

[0055]

[0056]

[0057]

[0058]

[0059] Optional, combined Figure 4 As shown, the data processing module includes an error data sorting submodule, a quality trend analysis submodule and an analysis result output submodule; the error data sorting submodule is used to sort the error data of the quality inspection information; the quality trend analysis submodule is used to analyze the quality trend of the current batch of products based on the error data sorting results; the analysis result output submodule is used to output the analysis results based on the error data and quality trends.

[0060] The CPO micro connector manufacturing method with high efficiency heat dissipation is applied to the above-mentioned CPO micro connector manufacturing system with high efficiency heat dissipation, combined with Figure 5 As shown, the CPO micro connector manufacturing method includes:

[0061] S1, for engineers to design and optimize the microchannels, metal wire distribution and heat dissipation fin shape of the CPO microconnector and generate structural design information;

[0062] S2, allocate materials according to structural design information and generate material information;

[0063] S3, processing the prepared materials according to the structural design information and material information to produce the corresponding CPO micro connector;

[0064] S4, performing quality inspection on the produced CPO micro connectors and generating quality inspection information;

[0065] S5, generating feedback information based on the quality inspection information, and sending the feedback information to the processing terminal;

[0066] S6, adjust and optimize processing parameters.

[0067] In summary, through the setting of structural design terminal, material management terminal, processing terminal, product quality inspection terminal and feedback terminal, it is conducive to the automation and collaborative optimization of the entire process of CPO micro connector from design, material allocation, processing, quality inspection to feedback adjustment, thereby improving production efficiency and product quality; through the setting of material selection module and inventory management module in the material management terminal, it is conducive to the accurate selection and allocation of required materials according to structural design information, thereby ensuring the timeliness and accuracy of material supply; through the setting of laser etching module, metal deposition module and micro-machining module in the processing terminal, it is conducive to the high-precision etching, metal deposition and subsequent micro-grinding of materials, thereby ensuring that the microstructure and heat dissipation performance of the microconnector product meet the design requirements. design requirements; through the setting of the size measurement module, thermal performance test module and data analysis module in the product quality inspection terminal, it is beneficial to carry out multi-dimensional size and thermal performance testing of the produced CPO micro connectors, and then accurately evaluate the product quality to ensure that the product meets the design specifications; through the setting of the data processing module, parameter adjustment module and communication module in the feedback terminal, it is beneficial to systematically organize and analyze the quality inspection information, and then dynamically adjust and optimize the processing parameters according to the analysis results; through the setting of the thermal resistance optimization calculation submodule, optimization algorithm execution submodule, parameter sensitivity analysis submodule and optimization result feedback submodule in the design optimization module, it is beneficial to carry out multi-parameter collaborative optimization calculation based on the influence of thermal resistance, and then generate the parameter combination of the optimal design model.

[0068] Embodiment 2: This embodiment includes all the contents of embodiment 1, and provides a CPO micro-connector manufacturing system with efficient heat dissipation. When the error data sorting submodule is working, it satisfies the following formula:

[0069]

[0070] Among them, E dim Indicates dimensional accuracy error; d meas Indicates the average measured value of etching depth in sampled products; h meas Indicates the average measured value of the metal layer depth in the sampled products; s meas Indicates the average measured value of the heat sink fin spacing in the sampled products; d end 、h end and s end They represent the etching depth, metal layer depth, and heat sink fin spacing after the design model optimization is completed;

[0071]

[0072] Among them, E th Indicates thermal resistance performance error; R th,meas Indicates the average measured thermal resistance among the sampled products; Indicates the expected thermal resistance of the product after the design model is optimized.

[0073]

[0074] Among them, E temp Indicates temperature uniformity error; w i represents the temperature difference weight of the i-th test point; N represents the total number of test points of the sampled product; T i,meas represents the temperature of the i-th test point; T i * Indicates the expected design temperature after the design model corresponding to the product is optimized.

[0075] When the quality trend analysis submodule is working, the following formula is satisfied:

[0076] Q=λ dim E dim +λ th E th +λ temp E temp ;

[0077] Where Q represents the quality trend assessment index; λ dim Indicates the dimensional error coefficient; λ th Represents the thermal resistance error coefficient; λ temp represents the temperature error coefficient; λ dim ,λ th and λ temp Generally, they are 0.3, 0.4 and 0.3 respectively. ref When Q>q ref When , it indicates that the quality trend is toward unqualified; q ref Indicates the quality assessment threshold.

[0078] As an example, the following is the program code for the implementation of the quality trend assessment process:

[0079]

[0080]

[0081]

[0082]

[0083]

[0084] To sum up, the setting of the error data collation submodule, quality trend analysis submodule and analysis result output submodule in the data processing module is conducive to the systematic collation of error data in the quality inspection information and quality trend analysis, and then accurately output the analysis results, ensuring the scientificity and effectiveness of the feedback information, which is conducive to optimizing the production process parameters and improving product quality and production efficiency.

[0085] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the scope of protection of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the scope of protection of the present invention. In addition, the elements therein can be updated as technology develops.

Claims

1. CPO micro connector manufacturing system with high efficiency heat dissipation, characterized by: It includes a structural design terminal, a material management terminal, a processing terminal, a product quality inspection terminal, and a feedback terminal; the structural design terminal is used for engineers to design and optimize the microchannels, metal wire distribution, and heat dissipation fin shape of the CPO microconnector, and generate structural design information; The material management terminal is used to allocate materials according to structural design information and generate material information; The processing terminal is used to process the prepared materials according to the structural design information and material information to produce the corresponding CPO micro connector; The product quality inspection terminal is used to perform quality inspection on the produced CPO micro connectors and generate quality inspection information; the feedback terminal is used to generate feedback information based on the quality inspection information and send the feedback information to the processing terminal; the feedback information is used to adjust and optimize processing parameters; The structural design terminal includes a CAD modeling module, a heat conduction simulation module, a design optimization module, and a structural design information generation module; the CAD modeling module is used for engineers to perform three-dimensional modeling of the microchannels, metal wire distribution, and heat dissipation fin shape of the CPO microconnector to generate a design model; the heat conduction simulation module is used to perform heat conduction simulation analysis on the design model to generate simulation analysis data; The design optimization module is used to optimize the design model by simulating and analyzing data; The structural design information generating module is used to generate structural design information according to the optimized design model and simulation analysis data.

2. The CPO micro-connector manufacturing system with high heat dissipation efficiency according to claim 1, characterized in that: The material management terminal includes a material selection module and an inventory management module; The material selection module selects corresponding materials according to the structural design information and generates material information; The inventory management module is used to manage and track material inventory, automatically allocate required materials based on material information, and transmit them to the processing terminal.

3. The CPO micro-connector manufacturing system with high heat dissipation efficiency as claimed in claim 2, characterized in that: The processing terminal includes a laser etching module, a metal deposition module and a micro-machining module; the laser etching module is used to etch the material according to the material information to form a micro channel and a heat dissipation structure; the metal deposition module is used to deposit a metal conductor layer and heat dissipation fins on the etched material; the micro-machining module is used to perform a micro-grinding processing step on the material after the deposition operation to improve the surface finish and dimensional accuracy of the micro-connector product.

4. The CPO micro-connector manufacturing system with high heat dissipation efficiency as claimed in claim 3, characterized in that: The product quality inspection terminal includes a dimension measurement module, a thermal performance testing module and a data analysis module; the dimension measurement module is used to measure the dimension parameters of the microconnector product; the thermal performance testing module is used to measure the thermal resistance and temperature distribution of the microconnector product; the data analysis module is used to evaluate based on the dimension parameters, thermal resistance and temperature distribution to generate quality inspection information.

5. The CPO micro-connector manufacturing system with high heat dissipation efficiency as claimed in claim 4, characterized in that: The feedback terminal includes a data processing module, a parameter adjustment module and a communication module; the data processing module organizes and analyzes quality inspection information; the parameter adjustment module is used to adjust and optimize the processing parameters of the processing terminal according to the analysis results; the communication module is used to generate feedback information based on the optimized processing parameters and transmit it to the processing terminal in real time.

6. The CPO micro-connector manufacturing system with high heat dissipation efficiency as claimed in claim 5, characterized in that: The design optimization module includes a thermal resistance optimization calculation submodule, an optimization algorithm execution submodule, a parameter sensitivity analysis submodule, and an optimization result feedback submodule; the thermal resistance optimization calculation submodule is used to calculate the thermal resistance impact according to the parameter combination of the design model; The optimization algorithm execution submodule is used to realize the calculation and minimization process of the optimization objective function based on the influence of thermal resistance, and generate the parameter combination of the design model when the objective function is minimized; the optimization result feedback submodule is used to feed back the optimal design parameters obtained by optimization to the CAD modeling module.

7. The CPO micro-connector manufacturing system with high heat dissipation efficiency according to claim 6, characterized in that: The data processing module includes an error data sorting submodule, a quality trend analysis submodule and an analysis result output submodule; the error data sorting submodule is used to sort the error data of the quality inspection information; The quality trend analysis submodule is used to analyze the quality trend of the current batch of products based on the error data collation results; The analysis result output submodule is used to output analysis results based on error data and quality trends.

8. A method for manufacturing a CPO micro connector with high efficiency heat dissipation, applied to the CPO micro connector manufacturing system with high efficiency heat dissipation as claimed in claim 7, characterized in that: The CPO micro connector manufacturing method comprises: S1, for engineers to design and optimize the microchannels, metal wire distribution and heat dissipation fin shape of the CPO microconnector and generate structural design information; S2, allocate materials according to structural design information and generate material information; S3, processing the prepared materials according to the structural design information and material information to produce the corresponding CPO micro connector; S4, performing quality inspection on the produced CPO micro connectors and generating quality inspection information; S5, generating feedback information based on the quality inspection information, and sending the feedback information to the processing terminal; S6, adjust and optimize processing parameters.

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