Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a body including a capacitance forming portion including first and second internal electrodes, a first cover portion disposed on an upper surface of the capacitance forming portion and including a first cover electrode, and a second cover portion disposed on a lower surface of the capacitance forming portion and including a second cover electrode; a second cover portion disposed on a lower surface of the capacitance forming portion and including a second cover electrode, the main body having first and second surfaces opposed to each other in the first direction, third and fourth surfaces opposed to each other in the second direction, and fifth and sixth surfaces opposed to each other in the third direction; a first external electrode; and a second external electrode. Wc1-Wi1gt is satisfied when the average size of the first internal electrode in the third direction, the average size of the second internal electrode in the third direction, the average size of the first cover electrode in the third direction, and the average size of the second cover electrode in the third direction are Wi1, Wi2, Wc1, and Wc2, respectively; the particle size is 80 [mu] m and Wc2-Wi2gt; 80 [mu] m.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0149417 filed in the Korean Intellectual Property Office on November 1, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors that are mounted on printed circuit boards of various types of electronic products such as image display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, and mobile phones and are used to charge or discharge the same.

[0004] Multilayer ceramic capacitors are used as components of various electronic devices due to their small size, ability to ensure high capacitance, and ease of mounting. As various electronic devices such as computers and mobile devices become smaller and their output power becomes higher, the demand for miniaturization of multilayer ceramic capacitors and realization of high capacitance in multilayer ceramic capacitors has been increasing.

[0005] When used in a state of being mounted on a board or the like, MLCCs may generate electromagnetic interference (EMI). When MLCCs emit EMI noise, the noise may cause other nearby electronic devices to have degraded performance or malfunction. For example, wireless communication devices or sensitive electronic devices may have signals interfered with by high-frequency noise generated by MLCCs, resulting in degraded communication quality or data loss.

[0006] Therefore, there is a need to develop MLCCs that can suppress the generation of EMI noise. Summary of the invention

[0007] An aspect of the present disclosure provides a multilayer electronic component having excellent reliability.

[0008] Another aspect of the present disclosure provides a multi-layer electronic assembly in which electromagnetic interference (EMI) is suppressed.

[0009] However, aspects of the present disclosure are not limited to those set forth herein and will be more readily understood in the course of describing specific example embodiments of the present disclosure.

[0010] According to one aspect of the present disclosure, a multilayer electronic component is provided, the multilayer electronic component comprising: a main body, comprising a capacitor forming portion, a first covering portion, and a second covering portion, the capacitor forming portion comprising a first internal electrode and a second internal electrode alternately arranged in a first direction, and a dielectric layer is interposed between the first internal electrode and the second internal electrode, the capacitor forming portion having an uppermost end in the first direction on which the first internal electrode is arranged and a lowermost end in the first direction on which the second internal electrode is arranged, the first covering portion being arranged on an upper surface of the capacitor forming portion in the first direction, the first covering portion comprising a first covering electrode, and the second covering portion being arranged on a lower surface of the capacitor forming portion in the first direction The second covering portion includes a second covering electrode on the lower surface in the direction, the main body has a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface, and a fifth surface and a sixth surface connected to the first surface to the fourth surface, the third surface and the fourth surface are opposite to each other in the second direction, and the fifth surface and the sixth surface are opposite to each other in the third direction; a first external electrode is arranged on the third surface, the first external electrode is connected to the first inner electrode and the first covering electrode; and a second external electrode is arranged on the fourth surface, the second external electrode is connected to the second inner electrode and the second covering electrode. When the average size of the first inner electrode in the third direction, the average size of the second inner electrode in the third direction, the average size of the first covering electrode in the third direction, and the average size of the second covering electrode in the third direction are Wi1, Wi2, Wc1, and Wc2, respectively, Wc1-Wi1>80μm and Wc2-Wi2>80μm are satisfied.

[0011] According to an example embodiment of the present disclosure, a covering electrode may be connected to an adjacent inner electrode through the same external electrode as the external electrode to which the adjacent inner electrode is connected, and a covering electrode having a width wider than that of the adjacent inner electrode may be disposed on the covering portion, thereby suppressing the occurrence of EMI.

[0012] However, various beneficial advantages and effects of the present disclosure are not limited to those set forth herein and will be more readily understood in the course of describing specific example embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 shows a schematic perspective view of a multi-layer electronic assembly according to an example embodiment of the present disclosure; Figure 2Shown along Figure 1 A schematic cross-sectional view taken along line II' of ; Figure 3 Shown along Figure 1 A schematic cross-sectional view taken along line II-II'; Figure 4 The sequence shown includes Figure 1 A plan view of a first cover electrode, a first inner electrode, a second inner electrode, and a second cover electrode in a multilayer electronic component; Figure 5 is a diagram of a multilayer electronic component according to a variation of the present disclosure, corresponding to Figure 2 ; Figure 6 is a diagram of a multilayer electronic component according to a variation of the present disclosure, corresponding to Figure 3 ; Figure 7 is a diagram of a multilayer electronic component according to another variation of the present disclosure, corresponding to Figure 2 ; Figure 8 is a diagram of a multilayer electronic component according to another variation of the present disclosure, corresponding to Figure 3 ; Fig. 9 A plan view sequentially showing a first cover electrode, a first inner electrode, a first and second edge electrodes, a second inner electrode, a first and second edge electrodes, and a second cover electrode included in a multilayer electronic component according to another modification of the present disclosure; and Fig.10 is a graph showing a change in magnetic field intensity according to frequency. DETAILED DESCRIPTION

[0014] Hereinafter, example embodiments of the present disclosure are described with reference to the accompanying drawings. However, the present disclosure may be illustrated in many different forms and should not be construed as being limited to the specific example embodiments set forth herein. In addition, example embodiments of the present disclosure are provided to more fully describe the present disclosure to those skilled in the art. Therefore, for clarity of description, the shapes and sizes of the elements in the accompanying drawings may be exaggerated, and the elements represented by the same reference numerals in the accompanying drawings may be the same elements.

[0015] In order to clearly illustrate the present disclosure, parts irrelevant to the description are omitted, and the size (e.g., thickness) is exaggerated to clearly indicate layers and regions, and similar parts having the same function within the same scope are represented by similar reference numerals throughout the specification. Throughout the specification, unless otherwise specifically stated, when an element "includes" or "comprises" another element, it means that the element may also include other elements, rather than excluding other elements.

[0016] In the drawings, a first direction may be defined as a stacking direction or a thickness T direction, a second direction may be defined as a length L direction, and a third direction may be defined as a width W direction.

[0017] Multilayer electronic components Figure 1 A schematic perspective view of a multilayer electronic assembly according to an example embodiment of the present disclosure is shown.

[0018] Figure 2 Shown along Figure 1 Schematic cross-sectional view taken along line II'.

[0019] Figure 3 Shown along Figure 1 Schematic cross-sectional view taken along line II-II'.

[0020] Figure 4 Sequentially shows the Figure 1 A plan view of a first cover electrode, a first inner electrode, a second inner electrode, and a second cover electrode in a multilayer electronic component.

[0021] In the following, reference will be made to Figures 1 to 4 The multilayer electronic component 100 according to an example embodiment of the present disclosure is described in detail. In addition, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") is described as an example of the multilayer electronic component, but the present disclosure is not limited thereto.

[0022] The multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include a body 110. The body 110 includes: a capacitor forming portion Ac including first and second internal electrodes 121 and 122 alternately arranged in a first direction, with a dielectric layer 111 interposed between the first and second internal electrodes 121 and 122, the capacitor forming portion Ac having an uppermost end in the first direction on which the first internal electrode 121 is arranged and a lowermost end in the first direction on which the second internal electrode 122 is arranged; a first covering portion 112 arranged on an upper surface of the capacitor forming portion Ac in the first direction, the first covering portion 112 including a first covering electrode 123; and a second covering portion 113 arranged on a lower surface of the capacitor forming portion Ac in the first direction, the second covering portion 113 including a second covering electrode 124. The body 110 has: a first surface 1 and a second surface 2, which are opposite to each other in a first direction; a third surface 3 and a fourth surface 4, which are connected to the first surface 1 and the second surface 2, and the third surface 3 and the fourth surface 4 are opposite to each other in the second direction; and a fifth surface 5 and a sixth surface 6, which are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4, and the fifth surface 5 and the sixth surface 6 are opposite to each other in a third direction. The multilayer electronic component 100 according to the exemplary embodiment of the present disclosure may also include: a first external electrode 131, which is disposed on the third surface 3, and the first external electrode 131 is connected to the first internal electrode 121 and the first covering electrode 123; and a second external electrode 132, which is disposed on the fourth surface 4, and the second external electrode 132 is connected to the second internal electrode 122 and the second covering electrode 124. When the average size of the first internal electrode 121 in the third direction, the average size of the second internal electrode 122 in the third direction, the average size of the first cover electrode 123 in the third direction, and the average size of the second cover electrode 124 in the third direction are Wi1, Wi2, Wc1, and Wc2, respectively, Wc1-Wi1>80μm and Wc2-Wi2>80μm may be satisfied.

[0023] When used in a state of being mounted on a board or the like, MLCCs may generate electromagnetic interference (EMI). When MLCCs emit EMI noise, the noise may cause other nearby electronic devices to have degraded performance or malfunction. For example, wireless communication devices or sensitive electronic devices may have signals interfered with by high-frequency noise generated by MLCCs, resulting in degraded communication quality or data loss.

[0024] According to an exemplary embodiment of the present disclosure, the covering electrodes 123 and 124 may be connected to the adjacent inner electrodes through the same outer electrodes as the outer electrodes to which the adjacent inner electrodes are connected, and the covering electrodes 123 and 124 having a width wider than the width of the adjacent inner electrodes may be respectively disposed in the covering portions 112 and 113, thereby suppressing the occurrence of EMI. Current may flow through the first inner electrodes 121 and the second inner electrodes 122 alternately disposed in the capacitance forming portion Ac. On the contrary, almost no current may flow through the covering electrodes 123 and 124 (connected to the adjacent inner electrodes and the same outer electrodes), so that the covering electrodes 123 and 124 may have a shielding effect. The covering electrodes 123 and 124 may shield the magnetic field radiated from both ends of each of the inner electrodes 121 and 122 in the width direction, thereby suppressing electromagnetic waves generated in the near field of the multilayer electronic component.

[0025] Hereinafter, respective components included in the multilayer electronic component 100 according to an example embodiment of the present disclosure will be described.

[0026] In the body 110 , dielectric layers 111 and internal electrodes 121 and 122 may be alternately stacked.

[0027] The specific shape of the body 110 is not limited. However, as shown, the body 110 may have a hexahedral shape or a shape similar thereto. During the sintering process, the ceramic powder particles included in the body 110 may shrink, so that the body 110 may not have a hexahedral shape having perfect straight lines, but may have a substantially hexahedral shape.

[0028] The main body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4, the third surface 3 and the fourth surface 4 opposite to each other in the second direction, and the fifth surface 5 and the sixth surface 6 opposite to each other in a third direction.

[0029] Since the inner electrodes 121 and 122 are not provided in the edge region, a step portion may be caused due to the thickness of the inner electrodes 121 and 122, such that the corners connecting the first surface 1 to the third to sixth surfaces 6 and / or the corners connecting the second surface 2 to the third to sixth surfaces 6 may contract toward the central portion of the main body 110 in the first direction based on the first surface 1 or the second surface 2. Or, due to the shrinkage behavior of the main body 110 during the sintering process, the corners connecting the first surface 1 to the third, fourth, fifth, and sixth surfaces 6 and / or the corners connecting the second surface 2 to the third, fourth, fifth, and sixth surfaces 6 may contract toward the central portion of the main body 110 in the first direction based on the first surface 1 or the second surface 2. Or, in order to prevent chipping defects, an additional process may be performed to round the corners connecting the corresponding surfaces of the main body 110 to each other. In the above cases, the corners connecting the first surface 1 to the third to sixth surfaces 6 and / or the corners connecting the second surface 2 to the third to sixth surfaces 6 may have a rounded shape.

[0030] The plurality of dielectric layers 111 included in the main body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that their boundaries may not be easily distinguishable without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not particularly limited and may be determined in consideration of the size of the multilayer electronic component. For example, the main body 110 may be formed by stacking 400 or more dielectric layers 111 on top of each other.

[0031] The dielectric layer 111 may be formed by the following method: preparing a ceramic slurry including ceramic powder particles, an organic solvent, and a binder, coating the ceramic slurry on a carrier film and drying it to prepare a green sheet, and then sintering the green sheet. The ceramic powder particles are not limited as long as sufficient capacitance can be obtained therewith, and may be, for example, barium titanate (BaTiO3)-based powder particles. For a more specific example, the ceramic powder particles may be barium titanate (BaTiO3)-based powder particles, CaZrO3-based paraelectric powder particles, etc. For a more specific example, the barium titanate (BaTiO3)-based powder particles may be BaTiO3, (Ba 1- x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1), and the CaZrO3-based paraelectric powder particles may be (Ca 1-x Sr x ) (Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0032] Therefore, the dielectric layer 111 may include at least one of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x ) (Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0033] The main body 110 may include: a capacitance forming portion Ac provided in the main body 110, the capacitance forming portion Ac having a capacitance by including a first inner electrode 121 and a second inner electrode 122 arranged to face each other and having the dielectric layer 111 interposed between the first inner electrode 121 and the second inner electrode 122; and covering portions 112 and 113 provided on the upper and lower portions in the first direction of the capacitance forming portion Ac, respectively.

[0034] The capacitance forming portion Ac may be a portion that contributes to forming the capacitance of the capacitor, and may be formed by alternately laminating a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 with the dielectric layer 111 interposed therebetween. In addition, the capacitance forming portion Ac may have a uppermost end in the first direction on which the first inner electrode 121 is provided, and a lowermost end in the first direction on which the second inner electrode 122 is provided.

[0035] The inner electrodes 121 and 122 may include the first inner electrode 121 and the second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged to face each other, with the dielectric layer 111 included in the main body 110 interposed therebetween, and may be respectively exposed to the third surface 3 and the fourth surface 4 of the main body 110.

[0036] The first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. The first external electrode 131 may be disposed on the third surface 3 of the body 110 to be connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the body 110 to be connected to the second internal electrode 122.

[0037] That is, the first internal electrode 121 may not be connected to the second external electrode 132 and may be connected to the first external electrode 131, and the second internal electrode 122 may not be connected to the first external electrode 131 and may be connected to the second external electrode 132. Therefore, the first internal electrode 121 may be spaced apart from the fourth surface 4 by a predetermined distance, and the second internal electrode 122 may be spaced apart from the third surface 3 by a predetermined distance. In addition, the first internal electrode 121 and the second internal electrode 122 may be disposed to be spaced apart from the fifth surface 5 and the sixth surface 6 of the body 110.

[0038] The conductive metal included in the internal electrodes 121 and 122 may be at least one of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present disclosure is not limited thereto.

[0039] The covering portions 112 and 113 may include a first covering portion 112 and a second covering portion 113, wherein the first covering portion 112 is disposed on an upper surface of the capacitor forming portion Ac in the first direction, the first covering portion 112 includes a first covering electrode 123, and the second covering portion 113 is disposed on a lower surface of the capacitor forming portion Ac in the first direction, the second covering portion 113 includes a second covering electrode 124.

[0040] The covering parts 112 and 113 may mainly serve to prevent the internal electrodes from being damaged due to physical stress or chemical stress.

[0041] The cover parts 112 and 113 may include cover electrodes 123 and 124, respectively, and may include the same material as that of the dielectric layer 111. That is, the cover parts 112 and 113 may include a ceramic material, and may include, for example, a barium titanate (BaTiO3)-based ceramic material.

[0042] The cover electrodes 123 and 124 may include a conductive metal, and the conductive metal included in the cover electrodes 123 and 124 may be at least one of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present disclosure is not limited thereto. In addition, the conductive metal included in the cover electrodes 123 and 124 may be the same as the conductive metal included in the inner electrodes 121 and 122, but the present disclosure is not limited thereto.

[0043] The average thickness td of the dielectric layer 111, the average thickness te of each of the internal electrodes 121 and 122, and the average thickness tce of each of the cover electrodes 123 and 124 are not particularly limited. The average thickness td of the dielectric layer 111 may be, for example, 0.1 μm to 100 μm. The average thickness te of each of the internal electrodes 121 and 122 may be, for example, 0.05 μm to 3.0 μm. The average thickness tce of each of the cover electrodes 123 and 124 may be 0.05 μm to 3.0 μm.

[0044] In addition, the average thickness td of the dielectric layer 111 and the average thickness te of each of the internal electrodes 121 and 122 may be arbitrarily set according to the desired properties or uses. For example, in order to achieve miniaturization and high capacitance, in the case of a high-voltage electronic component, the average thickness td of the dielectric layer 111 may be less than 2.8 μm, and the average thickness te of each of the internal electrodes 121 and 122 may be less than 1 μm. In addition, in order to achieve miniaturization and high capacitance, in the case of a small electronic component, the average thickness td of the dielectric layer 111 may be 0.4 μm or less, and the average thickness te of each of the internal electrodes 121 and 122 may be 0.4 μm or less.

[0045] The average thickness td of the dielectric layer 111 and the average thickness te of each of the internal electrodes 121 and 122 may refer to the size of the dielectric layer 111 in the first direction and the size of each of the internal electrodes 121 and 122 in the first direction, respectively. For example, the average thickness td of the dielectric layer 111 and the average thickness te of each of the internal electrodes 121 and 122 may be measured by scanning a cross section of the body 110 in the first direction and the second direction at a magnification of 10000 using an SEM. More specifically, the average thickness td of the dielectric layer 111 may be measured by measuring the thickness of one dielectric layer 111 at a plurality of points of the dielectric layer 111 (for example, thirty points equally spaced from each other in the second direction) and calculating the average value of the thickness. In addition, the average thickness te of each of the internal electrodes 121 and 122 can be measured by measuring the thickness of each of the internal electrodes 121 and 122 at a plurality of points (e.g., thirty points equally spaced from each other in the second direction) of each of the internal electrodes 121 and 122 and calculating the average value of the thickness. Thirty points equally spaced from each other can be specified in the capacitance forming portion Ac. In addition, when such an average value measurement is performed on ten dielectric layers 111 and ten internal electrodes 121 and 122, the average thickness td of the dielectric layer 111 and the average thickness te of each of the internal electrodes 121 and 122 can be further generalized. In addition, the average thickness tce of each of the cover electrodes 123 and 124 can be measured in the same manner as the average thickness td of the dielectric layer 111 and the average thickness te of each of the internal electrodes 121 and 122.

[0046] When the average size of the first inner electrode 121 in the third direction, the average size of the second inner electrode 122 in the third direction, the average size of the first cover electrode 123 in the third direction, and the average size of the second cover electrode 124 in the third direction are Wi1, Wi2, Wc1, and Wc2, respectively, Wc1-Wi1>80μm and Wc2-Wi2>80μm may be satisfied, thereby exhibiting a significant EMI suppression effect. When Wc1-Wi1 is 80μm or less or Wc2-Wi2 is 80μm or less, the effect of suppressing EMI caused by the cover electrode may be insufficient. More preferably, Wc1-Wi1≥90μm and Wc2-Wi2≥90μm may be satisfied, and even more preferably, Wc1-Wi1≥160μm and Wc2-Wi2≥160μm may be satisfied.

[0047] Here, the average size of the first internal electrode 121, the average size of the second internal electrode 122, the average size of the first cover electrode 123, and the average size of the second cover electrode 124 in the third direction may respectively refer to the average width of the first internal electrode 121, the average width of the second internal electrode 122, the average width of the first cover electrode 123, and the average width of the second cover electrode 124. Here, the width may refer to the size in the third direction.

[0048] Wi1, Wi2, Wc1, and Wc2 may be measured when polishing the body 110 in the first direction. Specifically, after polishing the body 110 until the first cover electrode 123 is exposed, the width of the first cover electrode 123 may be measured at five points equally spaced from each other in the second direction, and the average value of the width may be Wc1. Wi1, Wi2, and Wc2 may also be measured in the same manner.

[0049] In example embodiments, in the first direction, the entire portion of the first internal electrode 121 may overlap the first cover electrode 123, and the entire portion of the second internal electrode 122 may overlap the second cover electrode 124. The internal electrodes 121 and 122 may be completely covered by the cover electrodes 123 and 124 in the first direction.

[0050] In this case, in the first direction, the first cover electrode 123 may be disposed to partially overlap the first internal electrode 121 , and the second cover electrode 124 may be disposed to partially overlap the second internal electrode 122 .

[0051] In addition, the central portion of the first internal electrode 121 in the third direction may be stacked to substantially correspond to the central portion of the first cover electrode 123 in the third direction, and the central portion of the second internal electrode 122 in the third direction may be stacked to substantially correspond to the central portion of the second cover electrode 124 in the third direction. Figure 3 , the sizes in the third direction of the areas of the first cover electrode 123 that do not overlap with the first inner electrode 121 at both sides in the third direction, b1 and b2, may be greater than zero and may be set to be substantially equal to each other. Therefore, the effect of suppressing EMI generation may be maximized by the cover electrodes 123 and 124.

[0052] In one or more aspects, the terms "about," "substantially," and "approximately" may provide industry-accepted tolerances for their corresponding terms and / or relativity between items, such as tolerances from one percent to ten percent less than the actual value stated, as well as other suitable tolerances.

[0053] In example embodiments, when the average size of the first inner electrode 121 in the second direction, the average size of the second inner electrode 122 in the second direction, the average size of the first cover electrode 123 in the second direction, and the average size of the second cover electrode 124 in the second direction are Li1, Li2, Lc1, and Lc2, respectively, Li1≤Lc1 and Li2≤Lc2 may be satisfied. In the case of Li1>Lc1 or Li2>Lc2, the effect of suppressing the generation of EMI may not be sufficient.

[0054] Here, the average size of the first internal electrode 121 in the second direction, the average size of the second internal electrode 122 in the second direction, the average size of the first cover electrode 123 in the second direction, and the average size of the second cover electrode 124 in the second direction may respectively refer to the average length of the first internal electrode 121, the average length of the second internal electrode 122, the average length of the first cover electrode 123, and the average length of the second cover electrode 124. Here, the length may refer to the size in the second direction.

[0055] Li1, Li2, Lc1, Lc2 may also be measured in the same manner as Wi1, Wi2, Wc1, and Wc2 described above. Specifically, after polishing the main body 110 until the first cover electrode 123 is exposed, the length of the first cover electrode 123 may be measured at five points equally spaced from each other in the third direction, and the average value of the length may be Lc1. Li1, Li2, and Lc2 may also be measured in the same manner.

[0056] The thickness of each of the covering parts 112 and 113 is not particularly limited. For example, the thicknesses tc1 and tc2 of the covering parts 112 and 113 may each be 100 μm to 700 μm.

[0057] The average thicknesses tc1 and tc2 of the covering portions 112 and 113 may refer to dimensions in the first direction and may be values ​​obtained by averaging dimensions of the covering portions 112 and 113 in the first direction measured at five points equally spaced apart at the upper and lower portions of the capacitance forming portion Ac, respectively.

[0058] In addition, edge portions 114 and 115 may be respectively provided on side surfaces of the capacitance forming portion Ac in the third direction.

[0059] The edge portions 114 and 115 may include a first edge portion 114 disposed on one side surface of the capacitance forming portion Ac in the third direction and a second edge portion 115 disposed on the other side surface of the capacitance forming portion Ac in the third direction. That is, the edge portions 114 and 115 may be located at the end surfaces of the body 110 in the third direction, respectively.

[0060] like Figure 3 As shown in , the edge portions 114 and 115 may refer to regions between both ends of the first and second internal electrodes 121 and 122 in the third direction and an end surface of the body 110 in the third direction with respect to a cross section cut in a width-thickness (WT) direction of the body 110 .

[0061] The edge portions 114 and 115 may mainly serve to prevent the inner electrodes from being damaged due to physical stress or chemical stress.

[0062] The edge portions 114 and 115 may be formed by forming internal electrodes by coating a conductive paste on portions of the ceramic green sheet except for portions where the edge portions are to be formed.

[0063] The width of each of the edge portions 114 and 115 is not limited. For example, the average width of each of the edge portions 114 and 115 may be 200 μm to 800 μm.

[0064] The average width Wm1 of the edge portion 114 may be: the average size in the third direction of the area where the internal electrodes 121 and 122 are spaced apart from the fifth surface 5 in the third direction, the average width Wm2 of the edge portion 115 may be: the average size in the third direction of the area where the internal electrodes 121 and 122 are spaced apart from the sixth surface 6 in the third direction, and the average width of each of the edge portions 114 and 115 may be: the average value of the size of each of the edge portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitor forming portion Ac.

[0065] Therefore, in example embodiments, average widths Wm1 and Wm2 of regions of the internal electrodes 121 and 122 spaced apart from the fifth and sixth surfaces 5 and 6 , respectively, in the third direction may each be 200 μm to 800 μm.

[0066] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110 , respectively, and may include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122 .

[0067] Reference Figure 1 , the external electrodes 131 and 132 may be disposed to cover both end surfaces of the edge portions 114 and 115 in the second direction, respectively.

[0068] In the present example embodiment, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but the number and shape of the external electrodes 131 and 132 may be changed according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0069] The external electrodes 131 and 132 may be formed using any material having conductivity such as metal, etc., and a specific material may be determined in consideration of electrical characteristics, structural stability, etc. In addition, the external electrodes 131 and 132 may have a multi-layered structure.

[0070] For example, the external electrode 131 may include an electrode layer 131a disposed on the body 110 and a plating layer 131b formed on the electrode layer 131a; the external electrode 132 may include an electrode layer 132a disposed on the body 110 and a plating layer 132b formed on the electrode layer 132a.

[0071] For a more specific example of the electrode layers 131 a and 132 a , each of the electrode layers 131 a and 132 a may be a sintered electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and resin.

[0072] In addition, each of the electrode layers 131a and 132a may have a form in which a sintered electrode and a resin-based electrode are sequentially formed on the body 110. In addition, each of the electrode layers 131a and 132a may be formed by transferring a sheet including a conductive metal onto the body 110, or transferring a sheet including a conductive metal onto a sintered electrode.

[0073] A material having excellent conductivity may be used as the conductive metal included in the electrode layers 131a and 132a, but the material is not limited. For example, the conductive metal may be at least one of nickel (Ni), copper (Cu), and an alloy thereof.

[0074] Each of the plating layers 131b and 132b can be used to improve mounting performance. The type of each of the plating layers 131b and 132b is not limited, and may be a single plating layer including at least one of Ni, Sn, Pd, and their alloys, and may be a plurality of plating layers including at least one of Ni, Sn, Pd, and their alloys.

[0075] For a more specific example, each of the plating layers 131b and 132b may be a Ni plating layer or a Sn plating layer, and the plating layer 131b may have a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer 131a, and may have a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed on the electrode layer 131a; the plating layer 132b may have a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer 132a, and may have a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed on the electrode layer 132a. In addition, each of the plating layers 131b and 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0076] There is no limitation on the size of the multilayer electronic component 100. For example, the length L of the multilayer electronic component 100 may be 1.9 mm to 6.1 mm, the thickness T of the multilayer electronic component 100 may be 0.4 mm to 3.5 mm, and the width W of the multilayer electronic component 100 may be 1.15 mm to 5.40 mm.

[0077] Here, the length L of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the second direction, the thickness T of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the first direction, and the width W of the multilayer electronic component 100 may refer to the maximum dimension of the multilayer electronic component 100 in the third direction.

[0078] Hereinafter, a multilayer electronic component 100 ′ according to a modification of the present disclosure and a multilayer electronic component 100 ″ according to another modification of the present disclosure will be described, and duplicate descriptions will be omitted.

[0079] Figure 5 is a diagram of a multilayer electronic component according to a variation of the present disclosure, and Figure 2 correspond. Figure 6 is a diagram of a multilayer electronic component according to a variation of the present disclosure, and Figure 3 correspond.

[0080] Referring to a multilayer electronic component 100 ′ according to a variation of the present disclosure, Figure 5 and Figure 6In example embodiments, the first cover portion 112' may include a plurality of first cover electrodes 123, and the second cover portion 113' may include a plurality of second cover electrodes 124. Therefore, the EMI suppression effect may be further improved.

[0081] In this case, the plurality of first cover electrodes 123 may be disposed alternately with the dielectric layer in the first direction, and the plurality of second cover electrodes 124 may be disposed alternately with the dielectric layer in the first direction.

[0082] When the covering parts 112' and 113' include a plurality of covering electrodes 123 and 124, respectively, there is no limit to the number of covering electrodes 123 and 124. As the number of covering electrodes 123 and 124 increases, the EMI suppression effect can be further improved. For example, the first covering part 112' may include two to six first covering electrodes 123, and the second covering part 113' may include two to six second covering electrodes 124.

[0083] Figure 7 is a diagram of a multilayer electronic component according to another variation of the present disclosure, and Figure 2 correspond. Figure 8 is a diagram of a multilayer electronic component according to another variation of the present disclosure, and Figure 3 correspond. Fig. 9 A plan view sequentially illustrates a first cover electrode, a first inner electrode, first and second edge electrodes, a second inner electrode, first and second edge electrodes, and a second cover electrode included in a multilayer electronic component according to another modification of the present disclosure. Figure 8 A cross-sectional view taken from a position of the body close to the first external electrode in the second direction in the first direction and the third direction is shown.

[0084] Referring to a multilayer electronic component 100 ″ according to another modification of the present disclosure, Figures 7 to 9 The body 110'' may include edge portions 114'' and 115'' disposed on both surfaces of the capacitance forming portion Ac in the third direction, and the edge portions 114'' and 115'' may include a first edge electrode 125 connected to the first external electrode 131, and a second edge electrode 126 spaced apart from the first edge electrode 125 in the second direction, and the second edge electrode 126 is connected to the second external electrode 132.

[0085] Since the edge portions 114 ″ and 115 ″ include the first edge electrode 125 and the second edge electrode 126 , the EMI suppression effect may be further improved.

[0086] The edge portions 114 ″ and 115 ″ may include a first edge portion 114 ″ and a second edge portion 115 ″ respectively disposed on one surface and the other surface of the capacitance forming portion Ac in the third direction.

[0087] The first edge portion 114 ″ may include a first-first edge electrode 125 - 1 connected to the first external electrode 131 , and a second-first edge electrode 126 - 1 spaced apart from the first-first edge electrode 125 - 1 in the second direction and connected to the second external electrode 132 .

[0088] The second edge portion 115 ″ may include a first-second edge electrode 125 - 2 connected to the first external electrode 131 , and a second-second edge electrode 126 - 2 spaced apart from the first-second edge electrode 125 - 2 in the second direction and connected to the second external electrode 132 .

[0089] In one embodiment, the overall size including the average size Ws1 of the first-first edge electrode 125-1 in the third direction, the average size Wi1 of the first inner electrode 121 in the third direction, the average size Ws1' of the first-second edge electrode 125-2 in the third direction, the average size Gs1 of the space between the first-first edge electrode 125-1 and the first inner electrode 121 in the third direction, and the average size Gs1' of the space between the first-second edge electrode 125-2 and the first inner electrode 121 in the third direction may be substantially equal to the average size Wc1 of the first covering electrode 123 in the third direction.

[0090] like Fig. 9 As shown in, in example embodiments, the first edge electrode 125 and the second edge electrode 126 may be disposed substantially coplanar with the first inner electrode 121 or the second inner electrode 122, but the present disclosure is not limited thereto, and the edge electrodes 125 and 126 may be printed on a dielectric sheet separated from the first inner electrode 121 and the second inner electrode 122, and may be disposed on a different plane from the first inner electrode 121 and the second inner electrode 122.

[0091] The edge electrodes 125 and 126 may include a conductive metal, and the conductive metal included in the edge electrodes 125 and 126 may be at least one of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present disclosure is not limited thereto. In addition, the conductive metal included in the edge electrodes 125 and 126 may be the same as the conductive metal included in the cover electrodes 123 and 124 and / or the inner electrodes 121 and 122, but the present disclosure is not limited thereto.

[0092] Hereinafter, the case where the first edge electrode 125 and the second edge electrode 126 are disposed substantially coplanar with the first internal electrode 121 will be mainly described. However, the description can also be applied in a similar manner to the case where the first edge electrode 125 and the second edge electrode 126 are disposed substantially coplanar with the second internal electrode 122.

[0093] In example embodiments, when the average size of the first inner electrode 121 in the third direction is Wi1, the average size of the first edge electrode 125 in the third direction is Ws1, and the average size of the space between the first edge electrode 125 and the first inner electrode 121 in the third direction is Gs1, 0.01≤Ws1 / Wi1≤0.50 and 1μm≤Gs1 may be satisfied. When Ws1 / Wi1 is less than 0.01, the EMI suppression effect may be insufficient. When Ws1 / Wi1 is greater than 0.50, the capacitance per unit volume may be reduced. In addition, when Gs1 is less than 1μm, the distance between the edge electrode and the inner electrode may be too narrow, so that current may flow directly between the edge electrode and the inner electrode.

[0094] In addition, the average size of the first internal electrode 121 in the third direction is Wi1, the average size of the second edge electrode 126 in the third direction is Ws2, and the average size of the space between the second edge electrode 126 and the first internal electrode 121 in the third direction is Gs2, which can satisfy 0.01≤Ws2 / Wi1≤0.50 and 1μm≤Gs2.

[0095] In an example embodiment, the average size of the body 110 ″ in the second direction is Lb, the average size of the first edge electrode 125 in the second direction is Ls1, and the average size of the second edge electrode 126 in the second direction is Ls2, which may satisfy 0.01≤Ls1 / Lb≤0.50 and 0.01≤Ls2 / Lb≤0.50. When Ls1 / Lb is less than 0.01, the EMI suppression effect may be insufficient. When Ls1 / Lb is greater than 0.50, it may be difficult to maintain a distance from the second edge electrode 126. When Ls2 / Lb is less than 0.01, the EMI suppression effect may be insufficient. When Ls2 / Lb is greater than 0.50, it may be difficult to maintain a distance from the first edge electrode 125.

[0096] In addition, when the average size of the space between the first edge electrode 125 and the second edge electrode 126 in the second direction is Gs3, 1 μm ≤ Gs3 ​​may be satisfied. When Gs3 is less than 1 μm, the distance between the first edge electrode 125 and the second edge electrode 126 may be too narrow, so that current may flow directly between the first edge electrode 125 and the second edge electrode 126.

[0097] Wi1, Ws1, Gs1, Ws2, Gs2, Ls1, Ls2, and Gs3 may be measured after the body 110 ″ is polished until the first internal electrode 121 is exposed. Wi1, Ws1, Gs1, Ws2, and Gs2 may be average values ​​of sizes (widths) of corresponding elements in the third direction measured at five points equally spaced in the second direction, and Ls1, Ls2, and Gs3 may be average values ​​of sizes (lengths) of corresponding elements in the second direction measured at five points equally spaced in the third direction. Lb may be an average value of sizes (lengths) of the body 110 ″ in the second direction measured at five points equally spaced in the third direction.

[0098] In example embodiments, in the first direction, an entire portion of the first edge electrode 125 may overlap the first cover electrode 123 , and an entire portion of the second edge electrode 126 may overlap the second cover electrode 124 .

[0099] exist Figure 7 and Figure 8 , it is shown that the first covering portion 112 ″ includes two first covering electrodes 123, and the second covering portion 113 ″ includes two second covering electrodes 124, but the present disclosure is not limited thereto. The first covering portion 112 ″ may include one first covering electrode 123 or three or more first covering electrodes 123, and the second covering portion 113 ″ may also include one second covering electrode 124 or three or more second covering electrodes 124.

[0100] (Test example) A sample sheet of a multilayer electronic component was manufactured having a length L of 3200 μm, a width W of 1600 μm, and a thickness T of 1600 μm. Each of the widths Wi1 and Wi2 of the internal electrodes was 1250 μm, and each of the lengths Li1 and Li2 of the internal electrodes was 2975 μm.

[0101] In order to verify the EMI suppression effect of the covering electrodes 123 and 124, in test No. 1, no covering electrode was formed, and in tests No. 2 to No. 6, a covering electrode having Figures 1 to 4 In Test No. 2 to Test No. 6, when manufacturing the sample sheets, the width Wc1 of the first cover electrode and the width Wc2 of the second cover electrode were changed to satisfy Wc1-Wi1 and Wc2-Wi2 shown in Table 1 below.

[0102] The maximum magnetic field intensity was measured at a point 1 mm away from the upper surface of the sample piece using an EMI scanner, and the maximum value of the magnetic field intensity within the range of 68 MHz to 140 MHz was the maximum magnetic field intensity.

[0103] EMI reduction rate is measured based on the maximum magnetic field strength of Test No. 1.

[0104] [Table 1]

[0105] Referring to Test No. 2 and Test No. 3, it can be seen that even when the covering electrode is provided, the EMI reduction rate is low when Wc1-Wi1 and Wc2-Wi2 are 80 μm or less.

[0106] On the contrary, referring to the tests No. 4 to No. 6 where Wc1-Wi1 and Wc2-Wi2 are greater than 80 μm, it can be seen that the EMI reduction rate is significantly increased.

[0107] In addition, in order to verify the EMI suppression effect according to the number of stacked covering electrodes, the number of stacked covering electrodes was increased when manufacturing the sample sheets. When manufacturing the sample sheets of test No. 7 to test No. 11, based on test No. 6 in Table 1, the number of the first covering electrode and the second covering electrode included in test No. 6 was increased to obtain the sample sheets of test No. 7 to test No. 11.

[0108] [Table 2]

[0109] Referring to Table 2 above, it can be seen that the EMI reduction rate increases as the number of covered electrodes increases.

[0110] In addition, in order to verify the shielding effect caused by adding the edge electrodes, a sample sheet (test No. 13) was prepared in which the edge electrodes were arranged at the side surfaces of all the first inner electrodes and the second inner electrodes, as shown in FIG. Figure 7 and Figure 8 In this case, the covering electrode of Test No. 13 was formed in the same manner as the covering electrode of Test No. 11.

[0111] In addition, in order to verify the shielding effect when only the edge electrode is provided without the covering electrode, a sample sheet (Test No. 14) without forming the covering electrode was prepared. The sample sheet (Test No. 14) was identical in structure to the sample sheet of Test No. 13 except that the covering electrode was not formed.

[0112] The magnetic field strength that varies according to the frequency can be measured in the case where neither the cover electrode nor the edge electrode exists (test No. 1), in the case where only the cover electrode exists (test No. 11), in the case where both the cover electrode and the edge electrode exist (test No. 13), and in the case where only the edge electrode exists (test No. 14). The measured magnetic field strength is Fig.10 Shown in.

[0113] Reference Fig.10, it can be seen that the EMI reduction rate is the highest when both the cover electrode and the edge electrode are present (test No. 13). When only the edge electrode is present (test No. 14), the EMI reduction rate is lower than the EMI reduction rate when only the cover electrode is present (test No. 11). Therefore, it can be seen that the EMI suppression effect is further increased by the cover electrode.

[0114] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

[0115] In addition, the term "exemplary embodiment" does not refer to the same exemplary embodiment, but is provided to describe different unique features of various exemplary embodiments. However, the exemplary embodiments set forth above may also be implemented as a feature combination with another exemplary embodiment. For example, even when content described with respect to an exemplary embodiment is not described in another exemplary embodiment, the content may be understood as a description related to another exemplary embodiment, unless there is an opposite or contradictory description in another exemplary embodiment.

[0116] The terms used herein are only used to describe specific example embodiments and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, a singular form may also include a plural form.

Claims

1. A multilayer electronic component comprising: a main body, comprising a capacitor forming part, a first covering part and a second covering part, the capacitor forming part comprising a first inner electrode and a second inner electrode alternately arranged in a first direction, and a dielectric layer interposed between the first inner electrode and the second inner electrode, the capacitor forming part having an uppermost end in the first direction on which the first inner electrode is arranged and a lowermost end in the first direction on which the second inner electrode is arranged, the first covering part being arranged on an upper surface of the capacitor forming part in the first direction, the first covering part comprising a first covering electrode, the second covering part being arranged on a lower surface of the capacitor forming part in the first direction, the second covering part comprising a second covering electrode, the main body having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface, and a fifth surface and a sixth surface connected to the first surface to the fourth surface, the third surface and the fourth surface opposite to each other in the second direction, and the fifth surface and the sixth surface opposite to each other in the third direction; a first outer electrode disposed on the third surface, the first outer electrode being connected to the first inner electrode and the first covering electrode; as well as a second outer electrode disposed on the fourth surface, the second outer electrode being connected to the second inner electrode and the second covering electrode, Among them, when the average size of the first inner electrode in the third direction, the average size of the second inner electrode in the third direction, the average size of the first covering electrode in the third direction and the average size of the second covering electrode in the third direction are Wi1, Wi2, Wc1 and Wc2 respectively, Wc1-Wi1>80μm and Wc2-Wi2>80μm are satisfied.

2. The multilayer electronic component according to claim 1, wherein In the first direction, an entire portion of the first internal electrode overlaps the first cover electrode, and an entire portion of the second internal electrode overlaps the second cover electrode.

3. The multilayer electronic component according to claim 1, wherein: When the average size of the first inner electrode in the second direction, the average size of the second inner electrode in the second direction, the average size of the first covering electrode in the second direction and the average size of the second covering electrode in the second direction are Li1, Li2, Lc1 and Lc2 respectively, Li1≤Lc1 and Li2≤Lc2 are satisfied.

4. The multilayer electronic component according to claim 1, wherein: The first covering portion includes a plurality of first covering electrodes, and the second covering portion includes a plurality of second covering electrodes.

5. The multilayer electronic component according to claim 4, wherein: The plurality of first cover electrodes in the first cover portion include two to six first cover electrodes, and the plurality of second cover electrodes in the second cover portion include two to six second cover electrodes.

6. The multilayer electronic component according to claim 1, wherein: The main body includes an edge portion provided on a side surface of the capacitance forming portion in the third direction, and The edge portion includes a first edge electrode connected to the first external electrode and a second edge electrode spaced apart from the first edge electrode in the second direction and connected to the second external electrode.

7. The multilayer electronic component according to claim 6, wherein: The first edge electrode and the second edge electrode are disposed substantially coplanar with the first inner electrode or the second inner electrode.

8. The multilayer electronic component according to claim 6, wherein: In the first direction, an entire portion of the first edge electrode overlaps the first cover electrode, and an entire portion of the second edge electrode overlaps the second cover electrode.

9. The multilayer electronic component according to claim 6, wherein: The edge portion includes a first edge portion and a second edge portion respectively provided on one side surface and the other side surface of the capacitance forming portion in the third direction, The first edge portion includes a first-first edge electrode connected to the first external electrode, and a second-first edge electrode spaced apart from the first-first edge electrode in the second direction, the second-first edge electrode being connected to the second external electrode, and The second edge portion includes first-second edge electrodes connected to the first external electrode, and second-second edge electrodes spaced apart from the first-second edge electrodes in the second direction, the second-second edge electrodes being connected to the second external electrode.

10. The multilayer electronic component according to claim 9, wherein The overall size including the average size of the first-first edge electrode in the third direction, the average size of the first inner electrode in the third direction, the average size of the first-second edge electrode in the third direction, the average size of the space between the first-first edge electrode and the first inner electrode in the third direction, and the average size of the space between the first-second edge electrode and the first inner electrode in the third direction is basically equal to Wc1.

11. The multilayer electronic component according to claim 6, wherein: The first edge electrode and the second edge electrode are arranged substantially coplanar with the first inner electrode, and When an average size of the first edge electrode in the third direction is Ws1 and an average size of a space between the first edge electrode and the first internal electrode in the third direction is Gs1, 0.01≤Ws1 / Wi1≤0.50 and 1 μm≤Gs1 are satisfied.

12. The multilayer electronic component according to claim 11, wherein When an average size of the second edge electrode in the third direction is Ws2 and an average size of a space between the second edge electrode and the first internal electrode in the third direction is Gs2, 0.01≤Ws2 / Wi1≤0.50 and 1 μm≤Gs2 are satisfied.

13. The multilayer electronic component according to claim 6, wherein: When the average size of the body in the second direction is Lb, the average size of the first edge electrode in the second direction is Ls1, and the average size of the second edge electrode in the second direction is Ls2, 0.01≤Ls1 / Lb≤0.50 and 0.01≤Ls2 / Lb≤0.50 are satisfied.

14. The multilayer electronic component according to claim 6, wherein: When the average size of the space between the first edge electrode and the second edge electrode in the second direction is Gs3, 1 μm≦Gs3 is satisfied.

15. The multilayer electronic component according to claim 1, wherein When the sizes of regions of the first cover electrode not overlapping the first internal electrode 121 at both sides in the third direction are b1 and b2 respectively, b1>0 and b2>0 are satisfied and b1 and b2 are substantially equal to each other.

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