Semiconductor chip packaging method and semiconductor chip

Abstract

The invention discloses a packaging method of a semiconductor chip and the semiconductor chip, relates to the technical field of integrated circuit packaging, and can solve the problem of color change of a frame containing a copper element in the use process so as to improve the product quality of the packaged semiconductor chip. According to the specific scheme, the method comprises the steps that in the semiconductor chip packaging process, a plastic-packaged semiconductor chip is obtained, a first chip is obtained, and the first chip is packaged through a lead frame containing a copper element; sequentially carrying out post-curing treatment, tinning treatment, printing treatment and cutting treatment on the first chip to obtain a second chip; the second chip is subjected to water removal treatment, a third chip is obtained, and the water removal treatment is used for removing excessive water in the second chip; and after detecting the third chip, packaging to obtain a target semiconductor chip.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuit packaging, and in particular to a packaging method for a semiconductor chip and a semiconductor chip. Background Art

[0002] Semiconductor chip packaging refers to the process of using film technology and micro-processing technology to lay out, paste, fix and connect chips and other elements on a frame or substrate, lead out the wiring terminals and fix them through plastic insulating medium to form an overall three-dimensional structure. This concept is a narrow definition of packaging. In a broader sense, packaging refers to the packaging engineering, which connects and fixes the package body to the substrate, assembles it into a complete system or electronic equipment, and ensures the comprehensive performance of the entire system. Combining the previous two definitions constitutes a broad concept of packaging.

[0003] Lead frame is an important component used to carry chips, connect external circuits and provide mechanical support in semiconductor packaging. At present, in the process of semiconductor chip packaging, the commonly used lead frames are copper frames and nickel-palladium alloy frames. The preparation materials of these two frames contain copper elements, but the copper-containing frames will change color during use, which affects the stability and service life of the copper-containing frames, and further affects the product quality of the packaged semiconductor chips. Summary of the invention

[0004] The present application provides a semiconductor chip packaging method and a semiconductor chip, which can solve the problem of discoloration of a frame containing copper elements during use, thereby improving the product quality of the packaged semiconductor chip.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect of an embodiment of the present application, a method for packaging a semiconductor chip is provided, the method comprising:

[0007] In a semiconductor chip packaging process, a plastic-sealed semiconductor chip is obtained to obtain a first chip, wherein the first chip is packaged using a lead frame containing a copper element;

[0008] The first chip is subjected to post-curing treatment, tinning treatment, printing treatment and cutting treatment in sequence to obtain a second chip;

[0009] Performing a dehydration treatment on the second chip to obtain a third chip, wherein the dehydration treatment is used to remove excess water in the second chip;

[0010] After the third chip is tested, it is packaged to obtain the target semiconductor chip.

[0011] As a possible implementation manner, the step of performing a water removal process on the second chip to obtain a third chip includes:

[0012] The second chip is baked to obtain a third chip.

[0013] As a possible implementation, the baking temperature is 110-130° C., and the baking time is 7-9 hours.

[0014] As a possible implementation, the nitrogen flow rate in the baking process is 40 to 60 L / min.

[0015] As a possible implementation manner, before obtaining the plastic-sealed semiconductor chip, the method further includes:

[0016] Before using the lead frame, the lead frame is stored in a dry, sealed, and room temperature target environment.

[0017] As a possible implementation, after storing the lead frame in a dry, sealed, and room temperature target environment, the method further includes:

[0018] When the lead frame is used, after the lead frame is taken out from the target environment, the lead frame is cleaned to obtain a clean lead frame.

[0019] As a possible implementation manner, after the lead frame is cleaned to obtain a clean lead frame, the method further includes:

[0020] Performing surface protection treatment on the clean lead frame to obtain a target lead frame;

[0021] Wherein, the first chip is packaged using the target lead frame.

[0022] As a possible implementation manner, the cleaning process of the lead frame includes:

[0023] The lead frame is subjected to ultrasonic cleaning.

[0024] As a possible implementation manner, the surface protection treatment of the clean lead frame includes:

[0025] An antioxidant or a rust preventive is coated on the surface of the clean lead frame.

[0026] According to a second aspect of the embodiments of the present application, a semiconductor chip is provided. The semiconductor chip is packaged using the semiconductor chip packaging method according to the first aspect of the embodiments of the present application.

[0027] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0028] The semiconductor chip packaging method provided in the embodiment of the present application is to obtain a first chip by obtaining a plastic-sealed semiconductor chip during the semiconductor chip packaging process, wherein the first chip is packaged using a copper-containing frame; the first chip is subjected to post-curing treatment, tinning treatment, printing treatment and cutting treatment in sequence to obtain a second chip; the second chip is subjected to dehydration treatment to obtain a third chip, wherein the dehydration treatment is used to remove excess water in the second chip; the third chip is tested and packaged to obtain a target semiconductor chip. In the chip packaging process using a copper-containing frame, cutting water will be stored in the pins of the frame after cutting treatment, and CO2 protection is filled during the chip packaging process, which satisfies the reaction conditions of the copper-containing frame discoloration reaction, so that the copper-containing frame reaction produces basic copper carbonate or copper oxide. In the present application, the second chip is subjected to dehydration treatment after cutting treatment, so that the reaction environment produced by basic copper carbonate can be destroyed to prevent the copper-containing frame from discoloring and deteriorating. The stability and service life of the copper-containing frame can be improved, thereby improving the product quality of the packaged semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A product for improving the abnormal color change frame provided in the embodiment of the present application Figure 1 ;

[0030] Figure 2 A product for improving the abnormal color change frame provided in the embodiment of the present application Figure 2 ;

[0031] Figure 3 A flowchart of a semiconductor chip packaging method provided in an embodiment of the present application;

[0032] Figure 4 An improved normal frame product provided in the embodiment of the present application Figure 1 ;

[0033] Figure 5 An improved normal frame product provided in the embodiment of the present application Figure 2 . DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0036] Additionally, the use of “based on” or “according to” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” or “according to” one or more conditions or values ​​may, in practice, be based on additional conditions or beyond values.

[0037] Semiconductor chip packaging refers to the process of using film technology and micro-processing technology to lay out, paste, fix and connect chips and other elements on a frame or substrate, lead out the wiring terminals and fix them through plastic insulating medium to form an overall three-dimensional structure. This concept is a narrow definition of packaging. In a broader sense, packaging refers to the packaging engineering, which connects and fixes the package body to the substrate, assembles it into a complete system or electronic equipment, and ensures the comprehensive performance of the entire system. Combining the previous two definitions constitutes a broad concept of packaging.

[0038] Lead frame, or frame, is an important component used in semiconductor packaging to carry chips, connect external circuits and provide mechanical support. Currently, there are two types of lead frames in the packaging industry. Semiconductor copper frame is an important component used in semiconductor packaging to carry chips, connect external circuits and provide mechanical support. Good conductivity: Copper has excellent electrical conductivity, which helps to reduce resistance and loss in signal transmission. High thermal conductivity: It can effectively dissipate the heat generated by the chip when it is working, ensuring the stable operation of semiconductor devices. Mechanical strength: Provides sufficient mechanical support to protect the chip from external physical shock and pressure.

[0039] The semiconductor nickel-palladium alloy frame is a frame material with unique properties in the field of semiconductor packaging. The nickel-palladium alloy frame has the following advantages: Good corrosion resistance: It can remain stable under various environmental conditions and reduce the risk of frame corrosion. Excellent bonding performance: It has good bonding strength with other packaging materials and chips to ensure the reliability of packaging. Thermal fatigue resistance: In a working environment with frequent temperature changes, it can withstand the impact of thermal cycles and is not prone to fatigue cracks.

[0040] There are also some challenges with nickel-palladium alloy frames, such as: Relatively high cost: The preparation and processing costs of the alloy material may be higher than some traditional frame materials. Process complexity: During manufacturing and packaging, more complex processes and equipment may be required to handle nickel-palladium alloys.

[0041] Whether it is a copper frame or a nickel-palladium alloy frame, the preparation materials of these two frames include more or less copper elements, so these two frames can be called frames containing copper elements. In the chip products packaged with a frame containing copper elements, it was found during the inspection process that the pins of the copper-containing frame had different colors, and the defective rate of the chip products was about 5%. It was confirmed that the different colors of the pins affect the solderability. Through the detection of different colors of the pins, the Cu element was detected. This is mainly because during the packaging process, the edges of the pins of the frame are curled after cutting, and the curling height is about 15um. The copper at the tail of the curling is exposed, forming a water storage bay as a whole. The cutting water contains CO2, which slowly reacts with copper to produce basic copper carbonate and copper oxide. The specific reaction is as follows:

[0042] 2Cu+H2O+C O 2=Cu2(OH)2CO3

[0043]

[0044] The discoloration produces basic copper carbonate and copper oxide, which affects the stability and service life of the copper-containing frame, and further affects the product quality of the packaged semiconductor chip. Figure 1 and Figure 2 To improve the front discoloration frame abnormal product map.

[0045] In order to solve the above problems, the present invention provides a method for packaging a semiconductor chip. Figure 3 As shown, the method comprises the following steps:

[0046] Step 301: In a semiconductor chip packaging process, a plastic-sealed semiconductor chip is obtained to obtain a first chip, wherein the first chip is packaged using a lead frame containing copper elements.

[0047] Among them, the main functions of the plastic encapsulation process are: Protect the chip: prevent external dust, moisture, chemicals, etc. from damaging the chip, and provide a relatively stable and safe environment for the chip. Mechanical support: give the chip a certain mechanical strength and support, so that it is not easily damaged during subsequent use and operation. Electrical insulation: ensure good electrical insulation between the chip and the outside world to avoid problems such as short circuits. Heat dissipation assistance: some plastic encapsulation materials can help the chip dissipate heat and maintain the chip within a suitable operating temperature range. Easy to integrate: encapsulate the chip into a whole, which is convenient for integration and assembly with other components such as circuit boards. Improve reliability: Through effective plastic encapsulation, the service life of semiconductor devices can be extended and their reliability and stability can be improved.

[0048] Step 302: performing post-curing treatment, tinning treatment, printing treatment and cutting treatment on the first chip in sequence to obtain a second chip.

[0049] Among them, the main functions of post-curing treatment are: Promote cross-linking reaction: make the packaging material further cross-linked and cured, and improve the mechanical strength, stability and reliability of the package. Enhance performance: improve the various properties of the packaging material, such as hardness, temperature resistance, chemical corrosion resistance, etc. Reduce internal stress: help release the internal stress generated during the packaging process and reduce the potential impact of stress on device performance and reliability. Improve packaging integrity: ensure the tightness and integrity of the packaging structure and reduce possible gaps or defects.

[0050] The main functions of tinning are: Reduce contact resistance: Tin can form a good ohmic contact with semiconductor materials, reduce contact resistance, and improve current transmission efficiency. This is crucial to the performance of semiconductor devices, especially in high-frequency and high-power applications. Enhance conductivity: Tin itself has good conductivity. The formation of a tin layer on the surface of the semiconductor can increase the conductivity of the semiconductor and improve the electrical properties of the device. Prevent oxidation: Tin can form a protective film on the surface of the semiconductor to prevent the semiconductor material from being oxidized, thereby improving the reliability and stability of the device. Enhance corrosion resistance: The tin layer can improve the semiconductor's resistance to corrosive substances in the environment and extend the service life of the device. Good solderability: The tinned semiconductor surface is easier to weld with other metals, which is convenient for device assembly and packaging. This helps to improve production efficiency and product quality. Improve packaging bonding: During the packaging process, the tin layer can better combine with the packaging material to enhance the sealing and mechanical strength of the package.

[0051] The printing process can be: Printing circuit patterns on semiconductor wafers: It can accurately transfer complex circuit design patterns to the wafer surface, which is one of the key steps in manufacturing integrated circuits. Through high-precision printing, nanometer-level line width and spacing control can be achieved to ensure the performance and integration of the circuit. Printing electronic component identification: It is convenient to identify and track different semiconductor components, which is beneficial to production management and quality control.

[0052] In addition, it can help semiconductor R&D personnel quickly produce experimental semiconductor device prototypes for performance testing and design optimization. It shortens the R&D cycle and reduces R&D costs. It can be used to print new semiconductor materials, test their performance in different application scenarios, and provide support for semiconductor technology innovation. Semiconductor printing equipment is usually highly automated, enabling continuous and efficient production and reducing errors and uncertainties caused by manual operations. It ensures that each printed semiconductor device has a high degree of consistency and improves product quality and reliability.

[0053] The main effects of tin treatment include: tin can form good ohmic contact with semiconductor materials, reduce contact resistance, and improve current transmission efficiency. This is crucial to the performance of semiconductor devices, especially in high-frequency and high-power applications. Tin itself has good conductivity. Forming a tin layer on the surface of the semiconductor can increase the conductivity of the semiconductor and improve the electrical properties of the device. Tin can form a protective film on the surface of the semiconductor to prevent the semiconductor material from being oxidized, thereby improving the reliability and stability of the device. The tin layer can improve the semiconductor's resistance to corrosive substances in the environment and extend the service life of the device. The tinned semiconductor surface is easier to weld with other metals, which is convenient for device assembly and packaging. This helps to improve production efficiency and product quality. During the packaging process, the tin layer can better combine with the packaging material to enhance the sealing and mechanical strength of the package.

[0054] The main function of the cutting process is to accurately divide the raw materials or workpieces into the required parts according to the predetermined size, shape and accuracy requirements, and ensure that the cut parts meet the design requirements. Through precise cutting planning and operation, material waste can be minimized and production costs can be reduced. Raw materials are processed into specific shapes to meet the design requirements of various industrial products and parts. Provide regular and compliant workpieces for subsequent welding, assembly, surface treatment and other processes, which facilitates the smooth progress of subsequent processing. Automated or semi-automated cutting equipment can complete cutting tasks quickly and continuously, greatly improving production speed. It can handle various types of materials, such as metal, plastic, wood, stone, etc., and has a wide range of applicability. In large-scale production, it can ensure that each cut workpiece has similar quality and size, ensuring the quality stability of the product.

[0055] Step 303: perform a dehydration treatment on the second chip to obtain a third chip, wherein the dehydration treatment is used to remove excess water in the second chip.

[0056] Optionally, the process of performing a dehydration treatment on the second chip to obtain the third chip may be: performing a baking treatment on the second chip to obtain the third chip. The baking treatment temperature is 110 to 130° C., the baking time is 7 to 9 hours, and the nitrogen flow rate during the baking treatment is 40 to 60 L / min.

[0057] The main functions of baking treatment include: the cutting process may expose the semiconductor material to moisture in the air, baking can remove moisture and reduce the risk of subsequent oxidation. Oxidation will affect the performance and reliability of semiconductors. The presence of moisture may cause corrosion of semiconductors during subsequent processing and use, and baking can effectively avoid this situation. For semiconductor devices that need to be packaged, baking can make the surface after cutting drier and cleaner, enhance the bonding force with the packaging material, and ensure the sealing and stability of the package. It helps to fix the internal structure of the semiconductor and prevent problems such as delamination and cracking during subsequent processing or use. The cutting process will generate stress in the semiconductor material, and baking can release the stress inside the material to a certain extent, reduce the generation of cracks, and improve the mechanical strength of the semiconductor. The presence of stress may affect the electrical and optical properties of the semiconductor. Removing stress through baking can make the performance of the semiconductor more stable.

[0058] Step 304: After testing the third chip, package it to obtain the target semiconductor chip.

[0059] Among them, the detection process can quickly and effectively detect open circuit and short circuit defects in semiconductor devices. An open circuit means that there is a disconnected part in the circuit, which will cause the current to not flow normally; a short circuit means that a part of the circuit that should not be connected has an abnormal connection, which may cause excessive current, heat, or even damage the device. The Open / Short test can detect these problems in time to ensure product quality. Only semiconductor devices that have passed this test can work normally in actual applications and ensure that their performance meets the design requirements. For example, in an integrated circuit, if there is an open circuit or short circuit problem, it may cause abnormal chip function and fail to achieve the expected logical operation or signal processing function.

[0060] In addition, by conducting Open / Short testing as early as possible in the semiconductor production process, problems can be discovered before the subsequent processing steps, avoiding wasting more time and resources on defective products. This allows timely adjustment of production processes and improves production efficiency. This test can usually be performed using automated testing equipment, which can quickly and accurately test a large number of semiconductor devices, greatly improving the speed and efficiency of testing on the production line.

[0061] For semiconductor devices used in various electronic systems, Open / Short testing can ensure their reliability in the system. If a semiconductor device with an open circuit or short circuit problem is installed in a system, it may cause the entire system to fail or even cause safety problems. This test can effectively prevent this from happening. Semiconductor devices that have undergone rigorous Open / Short testing can operate stably in the system, reduce system downtime and maintenance time caused by device failures, and improve system stability and availability.

[0062] The semiconductor chip packaging method provided in the embodiment of the present application comprises the following steps: obtaining a plastic-sealed semiconductor chip during the semiconductor chip packaging process to obtain a first chip, wherein the first chip is packaged using a copper-containing frame; performing post-curing treatment, tinning treatment, printing treatment and cutting treatment on the first chip in sequence to obtain a second chip; performing a dehydration treatment on the second chip to obtain a third chip, wherein the dehydration treatment is used to remove excess water from the second chip; and performing testing on the third chip before packaging to obtain a target semiconductor chip. In the chip packaging process using a copper-containing frame, cutting water will be stored on the pins of the frame after the cutting process, and in addition, CO2 protection is provided during the chip packaging process, which satisfies the reaction conditions of the copper-containing frame discoloration reaction, so that the copper-containing frame reacts to produce basic copper carbonate or copper oxide. In the present application, by performing a dehydration treatment on the second chip after the cutting process, the reaction environment produced by basic copper carbonate can be destroyed, thereby preventing the copper-containing frame from discoloring and deteriorating. The stability and service life of the copper-containing frame can be improved, thereby improving the product quality of the packaged semiconductor chip. Figure 4 and Figure 5 This is the improved normal frame product picture.

[0063] Optionally, dehydrating the second chip to obtain the third chip includes: baking the second chip to obtain the third chip.

[0064] The baking temperature is 110-130° C., the baking time is 7-9 hours, and the nitrogen flow rate is 40-60 L / min during the baking.

[0065] Optionally, before obtaining the plastic-sealed semiconductor chip, the method further comprises: before using the frame containing copper elements, storing the lead frame in a dry, sealed and room temperature target environment.

[0066] By ensuring that the PPF frames are stored in a dry, clean, sealed environment, moisture-proof bags or sealed containers can be used. Control the temperature and humidity of the storage environment to avoid excessive temperature and humidity that accelerates oxidation. And regularly check the storage environment to ensure that no contaminants enter.

[0067] Optionally, after storing the lead frame in a dry, sealed and room temperature target environment, the method further comprises: when using the lead frame, after taking the lead frame out of the target environment, cleaning the lead frame to obtain a clean lead frame.

[0068] Specifically, the cleaning process for the lead frame includes: performing ultrasonic cleaning process on the lead frame.

[0069] In addition, after the lead frame is cleaned to obtain a clean lead frame, the method further includes: performing surface protection treatment on the clean lead frame to obtain a target lead frame; wherein the first chip is packaged using the target lead frame.

[0070] Specifically, the surface protection treatment of the clean lead frame includes: coating an antioxidant or a rust inhibitor on the surface of the clean lead frame.

[0071] That is to say, when using a frame containing copper elements, the frame containing copper elements should be strictly cleaned to remove surface oil, impurities, etc. You can use appropriate cleaning agents and cleaning methods, such as ultrasonic cleaning, etc. Perform surface protection treatment on the frame, such as coating antioxidants, rust inhibitors, etc., to reduce the possibility of oxidation and contamination.

[0072] In addition, the packaging process parameters can also be adjusted to ensure that the temperature, time, etc. are within the appropriate range to avoid adverse effects on the frame caused by excessively high temperatures and excessively long times. Optimize the welding process to reduce thermal stress, such as using appropriate welding temperature, welding time, and welding method. Strengthen quality control during the process, regularly check the status of the frame, and promptly detect and deal with discoloration problems. Also choose PPF frame materials with reliable quality and good stability.

[0073] The present application also provides a semiconductor chip, and the semiconductor power device is prepared by using a semiconductor chip packaging method provided in the present application. The semiconductor chip packaging method includes:

[0074] In a semiconductor chip packaging process, a plastic-sealed semiconductor chip is obtained to obtain a first chip, wherein the first chip is packaged using a lead frame containing a copper element;

[0075] The first chip is subjected to post-curing treatment, tinning treatment, printing treatment and cutting treatment in sequence to obtain a second chip;

[0076] Performing a dehydration treatment on the second chip to obtain a third chip, wherein the dehydration treatment is used to remove excess water in the second chip;

[0077] After the third chip is tested, it is packaged to obtain the target semiconductor chip.

[0078] In one embodiment, the step of performing a water removal process on the second chip to obtain a third chip includes:

[0079] The second chip is baked to obtain a third chip.

[0080] As a possible implementation, the baking temperature is 110-130° C., and the baking time is 7-9 hours.

[0081] In one embodiment, the nitrogen flow rate during the baking process is 40-60 L / min.

[0082] In one embodiment, before obtaining the plastic-sealed semiconductor chip, the method further includes:

[0083] Before using the lead frame, the lead frame is stored in a dry, sealed, and room temperature target environment.

[0084] In one embodiment, after storing the lead frame in a dry, sealed, and room temperature target environment, the method further comprises:

[0085] When the lead frame is used, after the lead frame is taken out from the target environment, the lead frame is cleaned to obtain a clean lead frame.

[0086] In one embodiment, after the lead frame is cleaned to obtain a clean lead frame, the method further comprises:

[0087] Performing surface protection treatment on the clean lead frame to obtain a target lead frame;

[0088] Wherein, the first chip is packaged using the target lead frame.

[0089] In one embodiment, the cleaning process of the lead frame includes:

[0090] The lead frame is subjected to ultrasonic cleaning.

[0091] In one embodiment, the surface protection treatment of the clean lead frame includes:

[0092] An antioxidant or a rust preventive is coated on the surface of the clean lead frame.

[0093] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A method for packaging a semiconductor chip, characterized in that: The method comprises: In a semiconductor chip packaging process, a plastic-sealed semiconductor chip is obtained to obtain a first chip, wherein the first chip is packaged using a lead frame containing a copper element; The first chip is subjected to post-curing treatment, tinning treatment, printing treatment and cutting treatment in sequence to obtain a second chip; Performing a dehydration treatment on the second chip to obtain a third chip, wherein the dehydration treatment is used to remove excess water in the second chip; After the third chip is tested, it is packaged to obtain the target semiconductor chip.

2. The method according to claim 1, characterized in that The step of performing a dehydration treatment on the second chip to obtain a third chip comprises: The second chip is baked to obtain a third chip.

3. The method according to claim 2, characterized in that The baking temperature is 110-130° C., and the baking time is 7-9 hours.

4. The method according to claim 3, characterized in that The nitrogen flow rate during the baking process is 40 to 60 L / min.

5. The method according to claim 1, characterized in that Before obtaining the plastic-sealed semiconductor chip, the method further includes: Before using the lead frame, the lead frame is stored in a dry, sealed, and room temperature target environment.

6. The method according to claim 5, characterized in that After storing the lead frame in a dry, sealed, and room temperature target environment, the method further comprises: When the lead frame is used, after the lead frame is taken out from the target environment, the lead frame is cleaned to obtain a clean lead frame.

7. The method according to claim 6, characterized in that After the lead frame is cleaned to obtain a clean lead frame, the method further comprises: Performing surface protection treatment on the clean lead frame to obtain a target lead frame; Wherein, the first chip is packaged using the target lead frame.

8. The method according to claim 6, characterized in that The cleaning process of the lead frame comprises: The lead frame is subjected to ultrasonic cleaning.

9. The method according to claim 7, characterized in that: The surface protection treatment of the clean lead frame comprises: An antioxidant or a rust preventive is coated on the surface of the clean lead frame.

10. A semiconductor chip, characterized in that: The semiconductor chip is packaged by the semiconductor chip packaging method according to any one of claims 1 to 9.

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