Ball grid array (BGA) module packaging structure with high heat dissipation and assembling method thereof

Abstract

The invention relates to a BGA module packaging structure with high heat dissipation and an assembling method thereof, and is characterized in that the structure comprises a radio frequency chip 1, a heat dissipation body 2, a BGA packaging tube shell 3, a solder ball 4, a substrate 5 and a cover plate 6, the radio frequency chip 1 is welded on the upper surface of the heat dissipation body 2, a heat dissipation sheet is embedded in the BGA packaging tube shell 3, and the solder ball 4 is welded on the lower surface of the heat dissipation body 2. The BGA packaging tube shell 3 and the heat dissipation body 2 are installed on the substrate 5 through the solder balls 4, and the cover plate 6 is arranged on the top of the BGA packaging tube shell 3. The high-power radio frequency chip has the advantages that heat generated by the high-power radio frequency chip is directly transmitted to the surface of the substrate through the metal material, the high heat dissipation capacity is achieved, only a common micro-assembly technology is used, implementation is easier, and adverse effects on the radio frequency performance of the chip cannot be caused.

Description

Technical Field

[0001] The present invention is a BGA module packaging structure with high heat dissipation and its assembly method, belonging to the technical field of semiconductor chip packaging. Background Art

[0002] BGA modules are widely used in high-density packaging, with advantages such as simple process flow and low cost. However, due to their inherently low heat dissipation capacity, they are not well-suited for high-power chip packaging. In response to the high heat dissipation requirements of high-power chips, various solutions have been successively disclosed in the prior art: The patent with publication number TW595808U enhances heat dissipation by means of chip flip-chip, but this brings a sharp increase in assembly difficulty and cost; the patent with publication number TW454277B enhances heat dissipation by embedding heat sinks in the substrate, but due to the presence of the lower substrate with poor heat conduction, its heat dissipation capacity improvement is limited; the patent with publication number CN113013154B uses a through-hole structure to conduct the heat generated by the power chip, but due to the limited heat conduction capacity of the through-hole itself, its heat dissipation capacity improvement is also limited; the patent with publication number TW200636954A enhances heat dissipation by adding a heat dissipation layer on the chip surface, but the presence of the surface heat dissipation layer will have an adverse impact on the chip radio frequency performance and does not have universality; the patent with publication number CN109904139B highly depends on power chips with heat dissipation structures on both sides, relying on the improvement of the previous process of the chips, and is not compatible with the most widely used chip design and manufacturing system in the current industry, and also does not have universality. Summary of the Invention

[0003] The present invention provides a BGA module packaging structure with high heat dissipation and its assembly method. The purpose is to provide a high heat dissipation BGA module packaging method suitable for high-power radio frequency chips, with the technical advantages of not deteriorating the electrical performance of the chips, greatly improving the heat dissipation capacity, and being easy to assemble, aiming at the problems existing in the prior art.

[0004] The technical solution of the present invention: A BGA module packaging structure with high heat dissipation, whose structure includes a radio frequency chip 1, a heat dissipation body 2, a BGA packaging shell 3, solder balls 4, a substrate 5, and a cover plate 6. Among them, the radio frequency chip 1 is welded on the upper surface of the heat dissipation body 2, the heat sink is embedded in the BGA packaging shell 3, the BGA packaging shell 3 and the heat dissipation body 2 are installed on the substrate 5 through the solder balls 4, and the cover plate 6 is arranged on the top of the BGA packaging shell 3.

[0005] The BGA packaging shell 3 is in a "U" shape or a "-" shape.

[0006] There are multiple openings in one packaging shell 3 to install multiple heat dissipation blocks The heat sink 2 is embedded in the package shell by soldering, and the pins of the radio frequency chip are led out to the BGA package shell by surface gold wire bonding.

[0007] The heat sink 2 is in a "T" shape.

[0008] The solder balls are controllably collapsed solder balls. When the BGA package tube shell 3 and the heat sink 2 are mounted on the substrate 5 via the solder balls 4, the height of the BGA package tube shell after reflow mounting is controlled via the controllably collapsed solder balls, so as to ensure that after reflow soldering, the solder ball surface of the BGA package tube shell and the lower surface of the heat sink are tightly bonded to the mounting surface of the substrate at the same time. The BGA package tube shell 3 is soldered to the substrate via the solder balls, and the lower surface of the heat sink 2 is mounted on the substrate using solder of the same component as the solder balls.

[0009] It also includes a fixture, which is in the shape of a "concave" character, and has a groove in the middle corresponding to the shape of the bottom of the "T"-shaped heat sink 2 protruding from the BGA packaging tube shell 3.

[0010] The heat sink is made of metal, non-metal or composite material such as oxygen-free copper Cu, copper-molybdenum-copper CMC, copper-molybdenum-copper-copper CPC, aluminum nitride ceramic AlN, silicon carbide ceramic SiC, diamond, copper-based diamond, etc., with a processing accuracy that can be controlled within ±50μm and a thermal conductivity greater than 200W / (K·m).

[0011] The assembly method of the BGA module packaging structure with high heat dissipation comprises the following steps: 1) The RF chip 1 is soldered to the upper surface of the heat sink 2 by soldering, and the heat sink 2 is embedded in the BGA package tube shell 3 by soldering; 2) Assemble the assembled RF chip 1, heat sink 2, and BGA package tube shell 3 into the fixture for wire bonding and capping; 3) Reflow soldering the heat sink 2 and the BGA package shell 3 on the substrate 5, and controlling the height of the BGA package shell after reflow installation by controllable collapsed solder balls to ensure that after reflow soldering, the solder ball surface of the BGA package shell and the lower surface of the heat sink are tightly combined with the substrate mounting surface at the same time.

[0012] Beneficial effects of the present invention: 1) The heat generated by the high-power RF chip in the present invention is directly transferred to the surface of the substrate through the material with high thermal conductivity, which has a stronger heat dissipation ability.

[0013] 2) The present invention only uses common micro-assembly process, which is easier to implement and will not adversely affect the RF performance of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Attached Figure 1 It is a schematic diagram of a BGA module packaging method with high heat dissipation.

[0015] Attached Figure 2 It is a structural diagram of the tooling fixture adapted to the subsequent assembly process of this module.

[0016] Attached Figure 3 It is a schematic diagram of the substrate structure of the carrier structure.

[0017] Attached Figure 4 It is a schematic diagram of a packaging structure in which multiple heat sinks are installed.

[0018] In the figure, 1 is the RF chip, 2 is the heat sink, 3 is the BGA package shell, 4 is the solder ball, 5 is the substrate, 6 is the cover, 7 is the bonding wire, and 8 is the tooling fixture. DETAILED DESCRIPTION

[0019] The technical solution of the present invention is further described below in conjunction with the accompanying drawings As attached Figure 1 As shown, a BGA module packaging structure with high heat dissipation includes a BGA packaging tube shell with a special structure, a high-precision heat sink, a high-power heat dissipation chip, solder, a controllable collapse solder ball, gold wire and other electronic components that may be used; A metal material with high processing precision is used as a heat sink. The high-precision heat sink is made of a metal material that matches the chip, has high thermal conductivity and is easy to process, and is used to transfer the heat generated by the high-power radio frequency chip when it is working.

[0020] A high-power RF chip with a large heat dissipation requirement is mounted on the upper surface of the heat sink using solder with high thermal conductivity; The heat sink is embedded into the package shell by using the special structure of the BGA package shell and connected with solder. The pins of the high-power RF chip are led out to the BGA package shell by surface gold wire bonding to realize the electrical signal interconnection between the high-power RF chip and the BGA package shell. The BGA package shell is mounted on the substrate using controllable collapsing solder balls, and the lower surface of the heat sink is mounted on the substrate using solder of the same composition as the solder balls, to achieve mechanical connection and electrical signal interconnection between the BGA module and the substrate. The height of the BGA package shell after reflow installation is controlled by controllable collapsing solder balls to ensure that after reflow soldering, the solder ball surface of the BGA package shell and the lower surface of the heat sink are tightly combined with the mounting surface of the substrate at the same time.

[0021] The BGA package shell cover is arranged on the top of the BGA package shell to provide protection for the entire module.

[0022] As attached Figure 2As shown, firstly, the high-power RF chip 1, the high-precision heat sink 2 and the BGA package shell 3 are assembled with solder according to the positional relationship in the figure, and then the assembled module is assembled into the tooling fixture shown for wire bonding and capping, and finally the BGA ball is planted and the entire module is assembled to the substrate.

[0023] As attached Figure 4 As shown, the same package shell 3 has multiple openings for mounting multiple heat sinks.

Claims

1. A BGA module packaging structure with high heat dissipation, characterized in that the structure comprises a radio frequency chip (1), a heat sink (2), a BGA packaging tube shell (3), solder balls (4), and a substrate (5), wherein: The radio frequency chip (1) is soldered on the upper surface of the heat sink (2), the heat sink is embedded in the BGA package housing (3), and the BGA package housing (3) and the heat sink (2) are mounted on the substrate (5) through solder balls (4).

2. The BGA module packaging structure with high heat dissipation according to claim 1 is characterized in that The BGA package housing is in a "U" shape or a "-" shape, and the heat sink is in a "T" shape.

3. The BGA module packaging structure with high heat dissipation according to claim 1 is characterized in that The heat sink is soldered and embedded in the package housing through solder, and the pins of the radio frequency chip are led out into the BGA package housing by means of surface gold wire bonding.

4. The BGA module packaging structure with high heat dissipation according to claim 1 is characterized in that It further includes a cover plate (6), and the cover plate (6) is arranged on the top of the BGA package housing (3).

5. The BGA module packaging structure with high heat dissipation according to claim 1 is characterized in that The solder balls are controlled collapse solder balls. When the BGA package housing and the heat sink are mounted on the substrate through the solder balls, the height after the BGA package housing is reflow-mounted is controlled by the controlled collapse solder balls to ensure that after reflow soldering, the solder surface of the BGA package housing and the lower surface of the heat sink are simultaneously and tightly combined with the mounting surface of the substrate.

6. The BGA module packaging structure with high heat dissipation according to claim 1 is characterized in that The BGA package housing is soldered to the substrate through solder balls, and the lower surface of the heat sink is mounted on the substrate by using solder of the same composition as the solder balls.

7. The BGA module packaging structure with high heat dissipation according to claim 1 is characterized in that It further includes a tooling fixture, and the tooling fixture is in a "concave" shape, and a groove corresponding to the shape of the part of the bottom of the "T"-shaped heat sink protruding from the BGA package housing is provided in the middle.

8. The BGA module packaging structure with high heat dissipation according to claim 1 is characterized in that The heat sink is made of a metal material with a processing accuracy that can be controlled within ±50 μm and a thermal conductivity greater than 200 W / (K·m).

9. The BGA module packaging structure with high heat dissipation according to claim 1 is characterized in that A plurality of openings are provided in the package housing, and a plurality of heat dissipation blocks are embedded therein.

10. The method for assembling the BGA module packaging structure with high heat dissipation as claimed in claim 1, characterized in that It includes the following steps: 1) The radio frequency chip is soldered on the upper surface of the heat sink through solder, and the heat sink is soldered and embedded in the BGA package housing 3 through solder; 2) Assemble the assembled radio frequency chip, heat sink, and BGA package housing into the tooling fixture for wire bonding and capping; 3) Reflow solder the heat sink and the BGA package housing on the substrate, and control the height after the BGA package housing is reflow-mounted by the controlled collapse solder balls to ensure that after reflow soldering, the solder surface of the BGA package housing and the lower surface of the heat sink are simultaneously and tightly combined with the mounting surface of the substrate.

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