Slot base, mainboard, production method of mainboard and electronic equipment

Abstract

The embodiment of the invention relates to the technical field of electronic equipment, and particularly provides a slot base, a mainboard, a production method of the mainboard and electronic equipment. The slot base comprises a base body, a first pin, a second pin and a solder ball. The base body is provided with a first face and a second face which are oppositely arranged in the first direction. The first pins penetrate through the base body in the first direction, the first ends of the first pins protrude out of the first face, and the second ends of the first pins protrude out of the second face. The second pins are arranged on the base body in a penetrating mode in the first direction, the first ends of the second pins protrude out of the first face, the length of the second pins is smaller than that of the first pins, and the second pins and the first pins are arranged at intervals. The solder ball is arranged on the second surface, and the solder ball is electrically connected with the second end of the second pin. According to the slot base provided by the embodiment of the invention, the problem of circuit board design difficulty caused by increased chip size and more pins of the slot base can be solved, and the number of outgoing line layers of the circuit board is reduced.

Description

Technical Field

[0001] Embodiments of the present application relate to the technical field of electronic devices, and in particular, to a socket base, a circuit board, a production method thereof, and an electronic device. Background Art

[0002] A socket base is a device used to connect chips or other electronic components. The socket base is usually disposed on the surface of a printed circuit board (PCB) and includes pins for electrically connecting to chips or other electronic components, so that the pins of the chips or other components are connected to the PCB through the pins to transmit voltage, signals, ground wires, etc.

[0003] For example, after the signals of a central processing unit (CPU) chip are connected to the PCB through a socket base, they are fanned out (Fanout) through the outgoing line layer of the PCB (such as the PCB metal layer) to be interconnected with signals of other chips, power supplies, etc. However, as the chip size continues to increase and the number of chip pins increases, the socket base requires more pins for connection and fixation, resulting in an increase in the number of pins of the socket base, making the design of the PCB more difficult. Summary of the Invention

[0004] Embodiments of the present application provide a socket base, a main board, a production method thereof, and an electronic device, which can solve the problem of the difficulty in circuit board design caused by the increase in chip size and the increase in the number of pins of the socket base.

[0005] To this end, the following technical solutions are adopted in the embodiments of the present application:

[0006] In a first aspect, an embodiment of the present application provides a socket base, including: a base body having a first surface and a second surface oppositely disposed in a first direction; a first pin penetrating the base body along the first direction, with a first end of the first pin protruding from the first surface and a second end of the first pin protruding from the second surface; a second pin penetrating the base body along the first direction, with a first end of the second pin protruding from the first surface, the length of the second pin being less than the length of the first pin, and the second pin being spaced apart from the first pin; and solder balls disposed on the second surface and electrically connected to the second ends of the second pins.

[0007] In this embodiment, by lengthening the length of the first pin in the socket base, the first pin can protrude from the second surface of the substrate base, so that it can further penetrate or embed into the circuit board connected to the socket base. The signal transmitted by the first pin can achieve signal interconnection without passing through the internal wiring or copper sheet of the circuit board, so as to solve the problem of circuit board design difficulty caused by the increase in chip size and the increase in the number of pins in the socket base.

[0008] As an achievable implementation, the first pin and the second pin are protruded from the first surface at the same height.

[0009] In this embodiment, the second end of the first pin is conveniently inserted into the circuit board connected to the socket base.

[0010] As an achievable implementation method, the first pin is used to transmit a low-impedance signal, and the second pin is used to transmit a high-impedance signal.

[0011] In this embodiment, the first pin is a low-impedance signal pin, that is, the signal transmitted through the first pin is a signal that does not require strict impedance consistency control, such as a power signal, a control signal, a low-speed data signal, a broadcast signal, a monitoring signal, etc. By lengthening the pins of signals that do not require strict impedance consistency control, such as power signals, the length of the first pin can penetrate the PCB board or be embedded in the PCB board, thereby realizing a signal flow connection from the far end of the power supply to the load. In this way, there is no need to transmit the power signal through the internal metal layer or routing of the PCB board, thereby reducing the number of power line layers on the PCB board.

[0012] In a second aspect, an embodiment of the present application provides a mainboard, comprising: a circuit board, the circuit board being provided with a via; a slot base, the slot base being provided on the circuit board; and an external connection carrier, the external connection carrier being provided on a side of the circuit board away from the slot base; wherein the slot base comprises: a first pin, the first end of the first pin being used for electrically connecting to an electronic device, the second end of the first pin being passed through the via and being electrically connected to the external connection carrier; a second pin, the first end of the second pin being used for electrically connecting to the electronic device, the second end of the second pin being electrically connected to the circuit board, and the length of the second pin being less than the length of the first pin.

[0013] In this embodiment, in a motherboard using the above-mentioned slot base, the first pin for transmitting a low-impedance signal, such as a power signal pin, is long enough to pass through a via hole of a circuit board and be electrically connected to an external connection carrier, thereby realizing a signal flow connection from a remote end to a load. Since the power pin no longer needs to be routed through the circuit board for conduction, the number of layers of the PCB design can be reduced, thereby reducing the complexity and difficulty of the PCB design.

[0014] As an implementable embodiment, in response to the absence of a filter capacitor on the circuit board, the second end of the first pin penetrates the circuit board.

[0015] In this embodiment, for a main board that does not require a filter capacitor on the circuit board, designing a through-hole for the second end of the first pin can reduce noise and interference, simplify the design and layout, and improve the reliability of the system, which helps to enhance the performance and stability of the circuit board.

[0016] As an implementable embodiment, the part of the second end of the first pin that penetrates the circuit board is fixed to the circuit board and / or the external connection carrier by dispensing glue.

[0017] In this embodiment, by dispensing glue to fix the part of the first pin passing through the through-hole, it can ensure that it is firmly attached to the circuit board, increasing the stability and reliability of the connection.

[0018] As an implementable embodiment, the part of the second end of the first pin that penetrates the circuit board has a bent portion, and the bent portion is welded to one side of the external connection carrier close to the circuit board or welded to one side of the external connection carrier facing away from the circuit board.

[0019] In this embodiment, by welding the bent portion to the external connection carrier, a firm electrical connection can be established, reducing the risk of connection loosening or breaking.

[0020] As an implementable embodiment, the dispensing glue is a heat-curing glue or a light-curing glue.

[0021] As an implementable embodiment, the heat-curing glue is selected from any one of epoxy resin glue, phenolic resin glue, polyimide glue, silicone rubber glue, or polyurethane glue.

[0022] As an implementable embodiment, the light-curing glue is selected from any one of UV epoxy resin light-curing glue, light-curing acrylate glue, light-curing polyurethane glue, or light-curing urea-formaldehyde resin glue.

[0023] In this embodiment, the heat-curing glue or the light-curing glue is an adhesive that can harden after contacting heat or light of a specific wavelength. They can provide strong physical fixing ability to ensure a stable connection between the first pin and the external connection carrier.

[0024] As an implementable embodiment, in response to the presence of a filter capacitor on the circuit board, the second end of the first pin is embedded in the through-hole of the circuit board.

[0025] In this embodiment, for the main board that requires filter capacitors on the circuit board, by embedding the second end of the first pin into the via hole and soldering it to the external connection carrier, the filter capacitor and the power line can be directly connected to reduce the noise and interference on the power line, provide a better filtering effect, and ensure the stability and reliability of the circuit. At the same time, the structure of embedding the first pin into the via hole can effectively layout the filter capacitor and other components on the circuit board, achieve a more compact circuit design, and improve the integration and layout flexibility of the circuit board.

[0026] As an implementable embodiment, the external connection carrier is any one of a flexible circuit board, a rigid circuit board, a copper strip, or a cable.

[0027] In this embodiment, by using external connection carriers such as flexible circuit boards, rigid circuit boards, copper strips, or cables, the most suitable wire form can be selected according to different design requirements. This solution has advantages in terms of space utilization, wiring flexibility, reliability, and production cost, thereby improving the reliability and stability of the circuit board design.

[0028] In a third aspect, an embodiment of the present application provides a production method for a main board, which is applied to the above-mentioned main board and includes: printing solder paste at a position on the circuit board for setting the slot base; placing the slot base at the position so that the second end of the first pin passes through the via hole of the circuit board and performing soldering; and soldering the external connection carrier to a side of the circuit board facing away from the slot base.

[0029] In this embodiment, by passing the first pin of the slot base through the via hole of the circuit board, the signal transmitted by the first pin can be conducted without routing on the circuit board, avoiding complex routing layouts on the circuit board, realizing the signal current connection from the remote end of the power supply to the load, reducing the number of design layers of the circuit board such as the PCB board, reducing the design difficulty of the PCB board, simplifying the manufacturing process, and reducing the production cost.

[0030] As an implementable embodiment, printing the solder paste at a position on the circuit board for setting the slot base includes: in response to the absence of filter capacitors on the circuit board, printing the solder paste at pads other than the via hole at the position. This is to facilitate the protrusion of the first pin through the via hole for soldering to the external connection carrier.

[0031] As an implementable embodiment, after placing the slot base at the position so that the second end of the first pin passes through the via hole of the circuit board and performing soldering, the production method further includes: dotting and fixing a portion of the second end of the first pin that penetrates the via hole; bending the dotted first pin to form a bent portion; and soldering the bent portion to the external connection carrier.

[0032] In this embodiment, the first pin in the socket base is lengthened, dispensed with glue, and bent, which plays a good role in fixing and soldering. Glue dispensing can fix the pins to prevent them from falling off or moving; bending the pins can increase the soldering area and improve the soldering firmness. This can ensure the stability and reliability of the connection between the power pins and the load.

[0033] As an implementable embodiment, placing the socket base at the position such that the second end of the first pin penetrates the via hole of the circuit board and performing soldering includes: the soldering is reflow soldering in a nitrogen environment or an air environment.

[0034] As an implementable embodiment, before the step of dispensing glue to fix the part of the second end of the first pin penetrating the via hole, the production method further includes: making the second end of the first pin further penetrate the external connection carrier. In this embodiment, the second end of the first pin can penetrate the via hole of the circuit board and the external connection carrier, fix the first pin to the circuit board and / or the external connection carrier by dispensing glue, and then the first pin forms a bent portion and is soldered to the external connection carrier.

[0035] As an implementable embodiment, the way of soldering the bent portion to the external connection carrier is laser soldering.

[0036] In this embodiment, laser soldering has the characteristics of high efficiency, non-contact, and pollution-free, which can ensure the quality and reliability of the soldering connection. Through laser soldering technology, high-precision connection between the external connection carrier and the circuit board can be achieved.

[0037] As an implementable embodiment, printing solder paste at the position on the circuit board for setting the socket base includes: in response to the presence of a filter capacitor on the circuit board, printing solder paste at the via hole and the pad at the position.

[0038] In this embodiment, solder paste can be printed at the via hole to facilitate the construction of a metallized via hole, so that after the first pin is inserted into the via hole, it can be electrically connected to the filter capacitor on the circuit board through the metallized via hole.

[0039] Fourthly, an embodiment of the present application provides an electronic device, including: the main board as described above.

[0040] In this embodiment, the electronic device adopting the above main board technical solution has advantages such as high performance, reliability, high manufacturing efficiency, simplified design, and cost reduction, making the electronic device competitive in terms of performance and manufacturing and capable of meeting market demands. Description of the Drawings

[0041] Figure 1 It is an exploded view of the installation structure of the slot base and the electronic device provided by the embodiment of the present application;

[0042] Figure 2 It is a schematic structural diagram of a main board provided by the embodiment of the present application;

[0043] Figure 3 It shows a schematic structural diagram of another main board provided by the embodiment of the present application;

[0044] Figure 4 It shows a schematic structural diagram of yet another main board provided by the embodiment of the present application;

[0045] Figure 5 It shows a schematic structural diagram of still another main board provided by the embodiment of the present application;

[0046] Figure 6 It shows a schematic structural diagram of still another main board provided by the embodiment of the present application;

[0047] Figure 7 It shows a flowchart of a production method of a main board provided by the embodiment of the present application;

[0048] Figure 8 It shows a schematic diagram of the production process of a main board provided by the embodiment of the present application;

[0049] Figure 9 It shows a schematic diagram of the production process of another main board provided by the embodiment of the present application. Detailed implementation manners

[0050] For the convenience of understanding, first, the terms involved in the embodiments of the present application are explained.

[0051] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0052] In this application, unless otherwise clearly specified or limited, the terms "installed", "connected", "coupled", "fixed", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "exemplarily", "specific examples", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. In the description of this application, "a plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically limited.

[0054] Next, the technical solutions in the embodiments of this application will be described with reference to the accompanying drawings in the embodiments of this application.

[0055] In the related art, for the convenience of replacing chips, the CPU chips of server-class electronic device products are generally installed on the PCB board through a socket base. Specifically, the socket base is installed on the PCB board, and the pins of the chip are inserted into the pins of the socket base to achieve the electrical connection between the chip and the PCB board. In the traditional socket base, the lengths of the pins are the same, and they are generally fixed on the PCB board by soldering or crimping. After the signals of the CPU chip are connected to the PCB board through the socket base, they are fanned out and interconnected with the signals of other chips, power supplies, etc.

[0056] With the increase in the computing power of chips, the pins of the socket base are gradually developing towards high-density and multi-pin configurations to meet the chip computing power requirements. The number of pins on the socket base must be fan-out one by one on the PCB board, which makes the size of the chip and the number of pins larger and larger. However, when the chip size increases and the number of pins on the socket base increases, the pins of the socket base need to be correctly laid out and wired to avoid signal interference and errors. If the original number of PCB wiring layers remains unchanged, it will lead to an increase in the wire density on each layer, thus increasing the signal interference and power / ground wire congestion problems. If the number of PCB wiring layers is increased, in complex PCB board designs, more layers will also increase the manufacturing cost and technical difficulty, and at the same time, higher technical requirements and more complex process flows are required to ensure the electrical connection quality. That is to say, the increasingly larger chip size and the number of pins make the design and processing of the PCB board more and more difficult, especially when the number of wiring layers of the PCB board cannot be arbitrarily increased due to the fixed design thickness of the PCB board.

[0057] To solve the problem of the PCB board design difficulty caused by the increase in chip size and the increase in the number of pins on the socket base, and to reduce the number of PCB wiring layers. The embodiments of the present application provide a socket base, a main board, a production method thereof, and an electronic device. By lengthening the length of some signal pins of the socket base, for different application scenarios, the pins penetrate or embed into the PCB board, and then through an external connection structure (flexible board / rigid board / copper strip / cable, etc.), without passing through the PCB wiring or copper foil, the signal interconnection is realized.

[0058] It should be noted that in PCB design, the "PCB wiring layer" refers to the metal layer on the PCB board, that is, the signal layer, the power layer, and the ground layer, etc. Each metal layer contains wires and power / ground wires for signal transmission, power supply, and grounding. Usually, the more the number of PCB wiring layers, the more signal line traces and power / ground plane areas can be accommodated, thus providing a more complex and high-density circuit layout.

[0059] Next, a specific introduction to the electronic device provided by the embodiments of the present application will be given.

[0060] Exemplarily, an electronic device provided by the embodiments of the present application can be, but is not limited to, a server, a personal computer, a router, a switch, a supercomputer, an artificial intelligence (AI) device, etc. For the convenience of understanding, the following will take the electronic device as a server as an example for illustration, but it should be understood that this is not a limitation.

[0061] Figure 1 It is an exploded view of the installation structure of the socket base and the electronic device provided by the embodiments of the present application.Figure 2 This is a schematic structural diagram of a motherboard provided by an embodiment of the present application. As Figure 1 and Figure 2 shown, exemplarily, an electronic device includes a motherboard. The motherboard may include electronic components 1, a socket base 2, a circuit board 3, and an external connection carrier 4. The socket base 2 is disposed on the circuit board 3. The external connection carrier 4 is disposed on a side of the circuit board 3 facing away from the socket base 2.

[0062] The pins 21 on the socket base 2 are electrically connected to the circuit board 3 and the external connection carrier 4 respectively, so that the electronic components 1 on the circuit board 3 transmit signals through the socket base 2 mounted on the circuit board 3 and implement their corresponding functions.

[0063] It should be noted that the number of electronic components 1 may be multiple, and the multiple electronic components 1 are disposed on the circuit board to implement functions such as data exchange or processing of the electronic device. Exemplarily, the electronic component 1 may be, but is not limited to, a processor. Specifically, the processor may be, for example, a central processing unit (CPU), a graphic processing unit (GPU), a tensor processing unit (TPU), etc. In the case where the electronic device is a switch, the electronic component 1 may also be a switch chip. The embodiments of the present application do not limit the types of the electronic device and the electronic components.

[0064] It should be noted that the number of processors may be configured as one or more according to needs, and the number of memories may also be configured as one or more according to needs. The embodiments of the present application do not strictly limit the number, type, etc. of the processors and memories.

[0065] Referring to Figure 1 and Figure 2 , exemplarily, the socket base 2 may include pins 21, a base body 22, and solder balls 23. The pins 21 include a first pin 211 and a second pin 212. Among them, the base body 22 is the main part of the socket base 2, which may be made of plastic and is used to mount and support the first pin 211 and the second pin 212 to facilitate the installation of the electronic component 1 (such as a processor chip). It can be understood that, for clarity, the various parts in the drawings are not drawn to scale, and some features may be exaggerated or omitted to more clearly show and explain the present application. For example, Figure 2 the base body 22 in Figure 2 is only used as a schematic structure, Figure 2The ratios shown therein. In addition, the base body 22 has a first surface 221 and a second surface 222 that are oppositely arranged in the first direction. The first direction may be the extending direction of the pins of the socket base. Taking Figure 2 the socket base 2 in Figure 2 as an example, illustratively, the first direction is

[0066] the F1 direction in Figure 1 and Figure 2 . The first pin 211 and the second pin 212 are inserted through the base body 22 in the first direction. The first pin 211 and the second pin 212 are arranged at intervals. Specifically, the first pin 211 and the second pin 212 may be vertically inserted through the base body 22, for example. The first end and the second end of the first pin 211 protrude from the first surface 221 and the second surface 222 respectively. The first end of the second pin 212 protrudes from the first surface 221 of the base body 22. The length of the first pin 211 is greater than the length of the second pin 212. The heights of the first pin 211 and the second pin 212 protruding from the first surface 221 of the base body 22 are flush, so as to facilitate the electrical connection of the first ends of the first pin 211 and the second pin 212 to the electronic device 1. The solder balls 23 are arranged on the second surface 222 and can be soldered to the second surface 222, for example. The solder balls 23 can be electrically connected to the second end of the second pin 212. For example, the second end of the second pin 212 is soldered to the circuit board 3 and electrically connected to the circuit board 3. Solder balls are implanted under the second pin 212, and pads 32 with corresponding dimensions are processed at the positions of the circuit board 3 corresponding thereto. By heating the socket base 2 through an auxiliary device, the solder balls 23 are melted to achieve connection with the pads 32, and the signals are then fanned out to other areas of the surface layer and the inner layer through the traces on the surface layer of the PCB board to achieve interconnection. Illustratively, after the second pin 212 conducts the electronic device 1 and the circuit board 3, it is used to transmit the high-impedance signals of the electronic device 1. It should be noted that the high-impedance signals are signals with strict requirements for impedance consistency control, and can be, but are not limited to, high-speed data signals (such as high-speed differential signals (such as PCI Express, USB3.0, etc.) or high-speed serial communication signals (such as Ethernet, HDMI, etc.)), high-precision analog signals (such as audio signals or sensor signals), or high-sensitivity signals (such as optical sensors, temperature sensors, etc.).

[0067] It should be noted that via holes 31 are formed in the circuit board 3. The second end of the first pin 211 passes through the via hole 31 in the circuit board 3, so that the first pin 211 can be electrically connected to the external connection carrier 4 located at the bottom of the circuit board 3. It can be understood that the second end of the first pin 211 passing through the via hole 31 may include the second end of the first pin 211 penetrating through the circuit board 3 and protruding from the via hole 31, or the second end of the first pin 211 not penetrating through the circuit board 3 and being embedded in the via hole 31. Exemplarily, after the first pin 211 penetrates through the circuit board 3 and exits the via hole 31, the second end of the first pin 211 can be directly soldered to the external connection carrier 4. The part of the second end of the first pin 211 that penetrates through the circuit board 3 is fixed to the circuit board 3 and / or the external connection carrier 4 by dispensing 380. In another possible implementation, refer to Figure 3 , Figure 3 shows a schematic structural diagram of another main board provided in an embodiment of the present application. As shown in Figure 3 , in order to reinforce the first pin 211, the part of the second end of the first pin 211 that penetrates through the circuit board 3 is fixed to the circuit board 3 by dispensing 380. It can be understood that in another possible implementation, the dispensing 380 can also fix the part of the second end of the first pin 211 that penetrates through the circuit board 3 to the external connection carrier 4, as long as the reinforcement of the second end part of the first pin 211 can be achieved. The present application does not make strict restrictions here. Exemplarily, after the first pin 211 conducts the electronic device 1 and the external connection carrier 4, it is used to transmit the low-impedance signal of the electronic device 1. Based on the above description, it should be understood that in the present embodiment, the above-mentioned first pin 211 is used as a low-impedance signal pin to transmit signals with less strict requirements for impedance consistency control, which may be, but are not limited to, power signals, control signals (such as switch signals, register control signals, etc.), low-speed data signals (such as serial communication, sensor data, etc.), broadcast signals (such as clock signals, reset signals, etc.), monitoring signals (power monitoring signals, sensor monitoring signals), etc.

[0068] Continue to refer to Figure 1, Exemplarily, in order to protect the first pin 211 and the second pin 212, a protective cover 6 is provided on the base body. The protective cover 4 has a central window 61 for making way for the installation of the electronic device 1, and a cover plate (not shown in the figure) is covered on the central window to protect the first pin 211, the second pin 212 and the electronic device 1. One side of the protective cover 6 is pivotally connected to the base body 22 through a pivot portion 62, for example, such that the protective cover 6 is adapted to rotate between a latched position and an open position, so that the protective cover 6 can cover the base body 22 to avoid exposing the first pin 211 and the second pin 212. Among them, in the latched position, the protective cover 6 is latched and pressed against the base body 22 through a latching rod 5, for example, to prevent the protective cover 6 from opening or separating from the base body 22 during production, transportation, testing or assembly process or after assembly. In this implementation manner, the latching rod 5 is provided on the circuit board 3 and is adapted to be engaged and cooperate with a hook 311 on the circuit board 3, but the present application is not limited thereto. For example, the protective cover 1 and the base body 22 can be relatively fixed to each other by other fixing means, such as using screws, latches, etc.

[0069] It should be noted that the circuit board 3 serves to provide a connection channel for signal transmission between the electronic devices 1. It should be understood that the circuit board 3 can be prepared into a board structure with multiple wiring layers (such as the number of wiring layers is greater than ten layers). The specific number of wiring layers of the circuit board 3 can be selected according to the actual application needs of the circuit board 3, and the embodiments of the present application do not make strict restrictions on this. In addition, each wiring layer can be etched into a corresponding circuit pattern according to needs to have corresponding functions. For example, the wiring layer can be used as a ground layer to achieve isolation or ground protection. Or, the wiring layer can be used as a power supply layer to supply power to the electronic device 1. Or, the wiring layer can be used as a control layer to control control signals such as clock signal (CLK), chip select (CSB), etc. Or, the wiring layer can be used as a stripline layer to achieve the function of feeding the antenna radiation unit. Or, the wiring layer can be used as an antenna transition layer. In other words, in the circuit board 3, the functions and specific arrangement positions of the multiple wiring layers can be selected and arranged according to the application scenario, and the embodiments of the present application do not make strict restrictions.

[0070] Exemplarily, the circuit board 3 can be any one of a printed circuit board (PCB), a substrate-like printed circuit board (SLP), and a substrate (Sub). The following will take the circuit board as a PCB board as an example for illustration, but it should be understood that it is not limited thereto.

[0071] The external connection carrier 4 can be any one of a flexible circuit board, a rigid circuit board, a copper bar, or a cable. Exemplarily, in this implementation, the external connection carrier 4 is a flexible circuit board, and a voltage regulator module (VRM) can be provided on the flexible circuit board, so that the electronic device 1 (such as a CPU chip) can obtain a stable and appropriate voltage through the first pin 211 to operate normally.

[0072] In this way, by lengthening the socket pins for signals with less strict impedance consistency control requirements such as power signals, the length of such pins can penetrate the PCB board or be embedded in the PCB board, and then be led out of the PCB board through the external connection carrier 4 to achieve the signal current connection from the remote power supply to the load. In this way, there is no need to transmit the power signal through the internal metal layer or traces of the PCB board, thereby reducing the number of power supply output layers on the PCB board and solving the problem of the increased difficulty of circuit board design caused by the increase in the chip size and the increase in the number of socket base pins.

[0073] Next, the following takes the low-impedance signal as the power signal as an example for illustration, but it should be understood that this is not a limitation.

[0074] Exemplarily, for the scenario where no filter capacitor is provided on the circuit board side, that is, the power signal does not require a filter capacitor on the PCB board side. For example, in a scenario where the high-frequency noise in the circuit working environment is relatively small, or the tolerance for high-frequency noise is relatively high, and at the same time the electronic device has low requirements for the stability of the power signal, the second end of the first pin can penetrate the circuit board. Refer to Figure 4 , Figure 4 shows a schematic structural diagram of another main board provided in the embodiment of the present application. As Figure 4 shown, exemplarily, the socket base 2 can include a first pin 430 and a second pin 440. In this implementation, the part of the first pin 430 passing through the via hole 450 is fixed on the circuit board 410 by dispensing 460 and then bent to form a bent portion 470, and the bent portion 470 is welded to the side of the external connection carrier 420 facing the PCB board 410. Thus, fixing the part of the first pin 430 passing through the via hole 450 to the external connection carrier 420 by dispensing 460 can provide a more firm and reliable physical connection. While the bent portion 470 can increase the welding area and reduce the size of the connection part, reducing the space occupied during layout, thereby realizing a more compact circuit board design.

[0075] Exemplarily, the dispensing 460 is a thermosetting adhesive or a photocuring adhesive. For example, the thermosetting adhesive is selected from any one of epoxy resin adhesives, phenolic resin adhesives, polyimide adhesives, silicone rubber adhesives, or polyurethane adhesives. The photocuring adhesive is selected from any one of UV epoxy resin photocuring adhesives, photocuring acrylate adhesives, photocuring polyurethane adhesives, or photocuring urea-formaldehyde resin adhesives.

[0076] For another possible implementation, see Figure 5 , Figure 5 shows a structural schematic diagram of another mainboard provided in the embodiment of the present application. As Figure 5 As shown in FIG. 1 , the socket base 2 may include a first pin 530 and a second pin 540. In this implementation, the portion of the first pin 530 that penetrates the through hole 550 is fixed to the external connection carrier 520 by dispensing glue 560, and then the first pin 530 penetrates the external connection carrier 520, and the portion of the first pin 530 that penetrates the external connection carrier 520 is bent to form a bending portion 570. In other words, the bending portion 570 is formed on the side of the external connection carrier 520 that is away from the PCB board 510, and then the bending portion 570 is welded to the external connection carrier 520. Thus, fixing the portion of the first pin 530 that penetrates the through hole 550 to the external connection carrier 520 by dispensing glue 560 can provide a more secure and reliable physical connection, and this connection method can reduce the risk of loosening and breaking, and increase the stability of the entire connection. The first pin 530 penetrates the outer connection carrier 520 and is bent to form a bent portion 570, which is then welded to establish a strong electrical connection. It can also effectively utilize the available space, reduce the size of the connection part, and reduce the space occupied during layout, thereby achieving a more compact circuit board design. Similarly, the types of the glue dispenser 560 and the outer connection carrier 520 are the same as described above and will not be repeated here.

[0077] Usually, in order to ensure the stability and reliability of power signal transmission, the power signal transmission line may need to be laid in different metal layers of the circuit board. When the current of the power signal is large, it may even be necessary to lay more copper wiring and even a more complex multi-layer output layer design. By allowing the first pin to directly penetrate the circuit board, the power signal can be directly led out to the external connection carrier outside the circuit board, avoiding the need to lay multiple layers of power lines inside the circuit board, thereby reducing the number of layers of power output lines on the circuit board.

[0078] Figure 6 shows a structural schematic diagram of another mainboard provided in the embodiment of the present application. Figure 6 ​​, Exemplarily, the socket base 2 may include a first pin 630 and a second pin 640. In the implementation shown in the figure, a filter capacitor 660 is provided on the circuit board 610. That is to say, a filter capacitor 660 is required on the PCB side for the power signal. For example, there are high-frequency noises in the circuit working environment, and these noises need to be effectively suppressed during the transmission of the power signal. At the same time, if the electronic device 1 has a high requirement for the stability of the power signal, the first pin 630 is embedded in the via 650 and welded and conducted with the external connection carrier 620. That is to say, if a filter capacitor 660 is required on the PCB side for the power signal, a hole can be drilled and copper-plated on the PCB side to form a metallized via 650. The pin is lengthened but does not penetrate the PCB board. The first pin 630 is welded to the metallized via 650 with a copper ring. The pins of the filter capacitor 660 and the metallized via 650 are interconnected through the PCB metal layer traces to realize the connection between the filter capacitor 660 and the first pin 630. It can be understood that in this solution, the metallized via 650 is an electrical connection structure formed by electroplating metallic copper on the inner wall of the via 650. The electrical connection structure can also be a metal column. It can be understood that Figure 6 The position of the filter capacitor 660 in

[0079] is only for illustrative purposes. The embodiments of the present application do not limit its position and setting method.

[0080] Based on the above description, the production method of the main board using the above-mentioned various socket bases 2 will be exemplified below. It should be understood that this is not limiting. The socket base 2 can be any of the socket bases in the foregoing implementations.

[0081] Exemplarily, Figure 7 shows a flowchart of a production method of a main board provided in an embodiment of the present application. As Figure 7As shown, a production method of a main board for producing a main board adopting the above-mentioned multiple socket bases 2 includes: S710. Print solder paste at the position on the circuit board where the socket base is to be set.

[0082] Specifically, S710 includes two cases:

[0083] Figure 8 The figure shows a schematic diagram of the production process of a main board provided in an embodiment of the present application. Refer to Figure 8 Step a in the figure. In one case, no filter capacitor is provided on the circuit board 810. In response to the absence of a filter capacitor on the circuit board, print solder paste 830 at the pads 820 other than the vias 840 at the position for setting the socket base 2.

[0084] Figure 9 The figure shows a schematic diagram of the production process of another main board provided in an embodiment of the present application. Refer to Figure 9 Step a in the figure. In another case, a filter capacitor 990 is provided on the circuit board 910. In response to the presence of the filter capacitor 990 on the circuit board 910, print solder paste 930 at the vias 940 and pads 920 at the position for setting the socket base 2.

[0085] In this step, the printing stencil is designed according to the PCB pads 820 and 920. The printing stencil is a template for surface mount technology (SMT), which is a special mold for SMT. Its main function is to cooperate with the squeegee on the solder paste printer and the pre-grooved or perforated holes on the printing stencil to print an accurate amount of solder paste at the accurate positions on the circuit boards 810 and 910.

[0086] S720. Place the socket base at its installation position so that the second end of the first pin penetrates through the via of the circuit board and perform soldering.

[0087] Exemplarily, refer to Figure 8 b in the figure and Figure 9 b in the figure. Set two local optical points 860 and 960 in the extension direction of the diagonal of the positions 850 and 950 corresponding to the installation of the socket base 2 on the circuit boards 810 and 910. After using a pick-and-place machine to pick up the socket base 2, complete the precise alignment of the socket base 2 through the local optical points 860 and 960, and then place the socket base 2 at the specified positions 850 and 950 (with an error of ±35μm) to complete the device placement. That is to say, the pin insertion hole error is ±0.035mm.

[0088] Exemplarily, put the circuit boards 810 and 910 with the socket base 2 placed thereon into a reflow oven (not shown in the figure) to complete reflow soldering. Among them, the reflow environment can be a nitrogen environment or an atmospheric environment.

[0089] In one case, referring to Figure 8 c in, in response to no filter capacitor being provided on the circuit board 810, the first pin 870 of the slot penetrates through the via 840 and protrudes from the bottom surface of the circuit board 810. The second pin 880 is surface-mounted to the surface mount device (SMD) pad 820 in a normal SMT manner. To ensure the strength of the first pin 870 after passing through the via 840, glue is applied to fix the part of the first pin 870 passing through the via 840 after reflow soldering; the glue application method can be manual or automatic, and the type of glue 890 can be thermosetting glue or light-curing glue. Continuing to refer to Figure 8 d1 and d2 in, d1 shows the welding structure of the first pin 870 after being bent and welded to the surface pad (not shown in the figure) of the external connection carrier (flexible printed circuit board) 811, and d2 shows the structure of the first pin 870 passing through the external connection carrier (flexible printed circuit board) 811 and then being bent for welding. d1 and d2 are schematic diagrams of the structure of the bent part 871 being formed by bending the first pin 870 after glue application fixation to increase the welding area. It should be noted that the glue 890 can fix the first pin 870 on the circuit board 810 or on the external connection carrier 811 to facilitate processing and production. In addition, the bent part 871 is formed by a bending tool (such as a bending machine).

[0090] In another case, referring to Figure 9 c in, c shows that the welding of the slot base 2 is completed by reflow, and the first pin 970 does not penetrate through the bottom surface of the circuit board 910. In response to the filter capacitor 990 being provided on the circuit board 910, the first pin 970 is embedded in the via 940 without protruding from the bottom surface of the circuit board 910. The via 940 is welded to the first pin 970 by the through-hole reflow method, and at the same time, the via 940 is electrically connected to the filter capacitor 990. The second pin 980 is surface-mounted to the SMD pad 920 in a normal SMT manner.

[0091] S730, weld the external connection carrier to the side of the circuit board facing away from the slot base.

[0092] Exemplarily, the circuit boards 810 and 910 and the external connection carriers 811 and 911 are fixed by a tooling, and a laser welding device is used to complete the laser welding of the external connection carriers 811 and 911 to the first pins 870 and 970.

[0093] Accordingly, the power pin (the first pin 770) of the slot base 2 is lengthened to penetrate through the circuit board 810, and the wire conduction is carried out without passing through the circuit board 810, avoiding complex wire routing layouts on the circuit board 810 such as the PCB board, realizing the signal current connection from the remote power supply to the load, reducing the number of design layers of the PCB board, lowering the design difficulty of the PCB board, simplifying the manufacturing process, and reducing the production cost. At the same time, the lengthened power pin of the slot base 2 is dot-glued and bent, playing a good role in fixing and soldering.

[0094] The power pin of the slot base 2 is lengthened but does not penetrate through the PCB board, and is subjected to reflow soldering with the PCB board, only used for connecting with the filter capacitor 990 on the PCB board (without the need for a large amount of copper skin space for power current), reducing the overall number of layers of the PCB board.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application. Those of ordinary skill in the art should understand that although the present application has been described in detail with reference to the foregoing embodiments, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions in the various embodiments of the present application.

Claims

1. A slot base, characterized in that: include: The base body has a first surface and a second surface which are arranged opposite to each other in a first direction; A first pin, wherein the first pin is inserted into the base body along the first direction, a first end of the first pin protrudes from the first surface, and a second end of the first pin protrudes from the second surface; a second pin, the second pin being arranged in the base body along the first direction, the first end of the second pin protruding from the first surface, the length of the second pin being smaller than the length of the first pin, and the second pin being arranged at an interval from the first pin; and A solder ball is disposed on the second surface and is electrically connected to the second end of the second pin.

2. A motherboard, characterized in that: include: A circuit board, wherein the circuit board is provided with vias; A slot base, wherein the slot base is arranged on the circuit board; and An external connection carrier, the external connection carrier being arranged on a side of the circuit board away from the slot base; Wherein, the slot base comprises: A first pin, wherein a first end of the first pin is used for electrically connecting to an electronic device, and a second end of the first pin is passed through the via hole and electrically connected to the external connection carrier; A second pin, wherein a first end of the second pin is used to electrically connect to the electronic device, a second end of the second pin is electrically connected to the circuit board, and a length of the second pin is smaller than a length of the first pin.

3. The mainboard according to claim 2, characterized in that: In response to the fact that no filtering capacitor is provided on the circuit board, the second end of the first pin penetrates the circuit board.

4. The mainboard according to claim 3, characterized in that: The portion of the second end of the first pin that penetrates the circuit board is fixed to the circuit board and / or the external connection carrier by dispensing glue.

5. The mainboard according to any one of claims 3 to 4, characterized in that: The portion of the second end of the first pin that penetrates the circuit board has a bent portion, and the bent portion is welded to a side of the external connection carrier close to the circuit board or to a side of the external connection carrier away from the circuit board.

6. The mainboard according to claim 2, characterized in that: In response to a filter capacitor being provided on the circuit board, the second end of the first pin is embedded in the via hole of the circuit board.

7. The mainboard according to any one of claims 2 to 6, characterized in that: The external connection carrier is any one of a flexible circuit board, a rigid circuit board, a copper bar or a cable.

8. A method for producing a motherboard, applied to the motherboard according to any one of claims 2 to 7, characterized in that: include: Printing solder paste at locations on the circuit board where the socket base is to be set; Placing the slot base at the position so that the second end of the first pin passes through the via hole of the circuit board, and performing soldering; and The external connection carrier is welded to a side of the circuit board facing away from the socket base.

9. The method for producing a motherboard according to claim 8, characterized in that: The method of printing solder paste at a position on a circuit board for setting a slot base comprises: In response to the fact that no filter capacitor is provided on the circuit board, solder paste is printed on the pads at the position except for the via hole.

10. The method for producing a motherboard according to claim 9, characterized in that: After placing the slot base at the position so that the second end of the first pin passes through the via hole of the circuit board and performing soldering, the production method further includes: Fixing the portion of the second end of the first pin that penetrates the via hole by glue dispensing; Bend the first pin after dispensing glue to form a bent portion; and The bent portion is welded to the external connection carrier.

11. The method for producing a motherboard according to claim 8, characterized in that: The method of printing solder paste at a position on a circuit board for setting a slot base comprises: In response to a filter capacitor being provided on the circuit board, solder paste is printed at the via hole and the pad at the position.

12. An electronic device, characterized in that: include: A mainboard as described in claims 2-7.

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