SiC power device

Abstract

The invention relates to the technical field of semiconductors, in particular to a SiC power device, which comprises a bionic jellyfish heat dissipation module, and is characterized in that the bionic jellyfish heat dissipation module comprises an umbrella heat dissipation piece fixedly arranged on the upper surface of a device body, and a plurality of mouth wrist heat dissipation strips which are integrally formed with the upper surface of the umbrella heat dissipation piece and abut against the inner wall of the top of a ceramic package; the heat-conducting silica gel suckers are fixedly adsorbed on the upper surface of the device body and are annularly arranged at intervals relative to the central axis of the umbrella heat dissipation piece, and the whisker heat dissipation strips are integrally formed with the upper surface of the umbrella heat dissipation piece and are connected with the heat-conducting silica gel suckers. According to the invention, through the bionic jellyfish heat dissipation module, the bionic jellyfish heat dissipation module realizes the function bionics of form bionics and adsorption and elastic buffering, realizes the balance of heat dissipation efficiency, structural stability and process feasibility, simplifies the assembly process, and is especially suitable for high-power-density SiC power device packaging scenes requiring strict heat management.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a SiC power device. Background Art

[0002] As a new generation of semiconductor devices, SiC power devices have high frequency, high voltage and high temperature working characteristics, which pose a severe challenge to traditional packaging technology. The currently widely used traditional packaging methods such as wire bonding and single-sided welding have long interconnection lines and complex multi-layer structures. The traditional packaging methods used in SiC power modules have large parasitic inductance parameters, which are difficult to match the fast switching characteristics of SiC devices. At the same time, the packaging reliability is greatly reduced under high temperature conditions. In order to give full play to the advantages of SiC devices, it is necessary to improve the existing packaging technology. Summary of the invention

[0003] The object of the present invention is to provide a SiC power device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a SiC power device, comprising a substrate and a device body, a ceramic package is fixedly provided on the upper surface of the substrate and located outside the device body, and the upper surface of the substrate abuts the lower surface of the device body, a bionic jellyfish heat dissipation module is provided in the ceramic package, and the bionic jellyfish heat dissipation module comprises an umbrella heat sink fixedly provided on the upper surface of the device body, a plurality of wrist heat dissipation strips integrally formed with the upper surface of the umbrella heat sink and abutting against the inner wall of the top of the ceramic package, a plurality of heat-conducting silicone suction cups fixedly adsorbed on the upper surface of the device body and arranged in a ring-shaped interval about the central axis of the umbrella heat sink, and a plurality of tentacle heat dissipation strips integrally formed with the upper surface of the umbrella heat sink and connected to the heat-conducting silicone suction cups.

[0005] Optionally, the umbrella heat sink is a hollow umbrella-shaped structure, a circular through hole is provided at the center of the upper surface of the umbrella heat sink, and a plurality of inverted conical holes which are larger at the top and smaller at the bottom are provided at the bottom of the umbrella heat sink. A single-component room-temperature curing thermal conductive silicone is fixed in the inverted conical holes, and the lower surface of the single-component room-temperature curing thermal conductive silicone is bonded to the upper surface of the device body.

[0006] Optionally, there are eight heat dissipation strips at the wrist part, including a first arc-shaped strip bent toward the central axis of the umbrella heat sink, a second arc-shaped strip integrally formed with the first arc-shaped strip and with the convex surface facing the central axis of the umbrella heat sink, a third arc-shaped strip integrally formed with the second arc-shaped strip and with the concave surface facing the central axis of the umbrella heat sink, and a pressure-bearing strip integrally formed with the third arc-shaped strip and extending toward the central axis of the umbrella heat sink; the upper surface of the pressure-bearing strip abuts against the inner wall of the top of the ceramic package.

[0007] Optionally, the upper surface of the pressure strip is a plane, a heat sink is fixedly provided through the top of the ceramic package, and the lower surface of the heat sink abuts against the upper surface of the pressure strip.

[0008] Optionally, the heat sink is an aluminum sheet or a copper sheet, and the pressure strip is an aluminum sheet or a copper sheet with a surface coated with a graphene thermal conductive coating.

[0009] Optionally, a terminal is fixedly provided on the upper surface of the device body, the upper surface of the terminal is fixedly passed through the upper surface of the ceramic package, the bionic jellyfish heat dissipation module is arranged on the periphery of the terminal, and the upper surface of the heat sink is lower than the upper surface of the terminal.

[0010] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention realizes morphological bionics and functional bionics of adsorption and elastic buffering through a bionic jellyfish heat dissipation module, achieves a balance between heat dissipation efficiency, structural stability and process feasibility, simplifies the assembly process, and is particularly suitable for SiC power device packaging scenarios with high power density and strict thermal management requirements; 2. The present invention forms a three-dimensional heat dissipation network through the umbrella heat sink, the mouth and wrist heat sink, the tentacle heat sink and the thermal conductive silicone suction cup to expand the heat dissipation area and accelerate the transfer of heat from the device body to the ceramic package. The hollow design of the umbrella heat sink reduces weight while increasing convection heat dissipation space. The circular through holes and inverted tapered holes further optimize the heat flow path. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 for Figure 1 The enlarged structural diagram of the middle A part; Figure 3 It is a schematic diagram of the structure of the bionic jellyfish heat dissipation module in the present invention.

[0012] In the figure: 1. substrate; 2. device body; 3. ceramic package; 4. umbrella heat sink; 401. circular through hole; 402. inverted tapered hole; 5. wrist heat sink; 501. first arc strip; 502. second arc strip; 503. third arc strip; 504. pressure strip; 6. tentacle heat sink; 7. thermal conductive silicone suction cup; 8. heat sink; 9. terminal. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] Example: See Figures 1 to 3 The present invention provides a SiC power device, including a substrate 1 and a device body 2, wherein a ceramic package 3 is fixedly provided on the upper surface of the substrate 1 and outside the device body 2, wherein the upper surface of the substrate 1 abuts against the lower surface of the device body 2, and a terminal 9 is fixedly provided on the upper surface of the device body 2, and the upper surface of the terminal 9 is fixedly passed through the upper surface of the ceramic package 3.

[0015] A bionic jellyfish heat dissipation module is provided in the ceramic package 3. The bionic jellyfish heat dissipation module is provided at the periphery of the terminal 9. The bionic jellyfish heat dissipation module is provided around the terminal 9 to avoid interfering with the electrical connection, and is suitable for high-density power module packaging. The bionic jellyfish heat dissipation module includes an umbrella heat dissipation member 4 fixedly provided on the upper surface of the device body 2, a plurality of wrist heat dissipation strips 5 integrally formed with the upper surface of the umbrella heat dissipation member 4 and abutting against the inner wall of the top of the ceramic package 3, a plurality of heat-conducting silicone suction cups 7 fixedly adsorbed on the upper surface of the device body 2 and arranged in an annular interval about the central axis of the umbrella heat dissipation member 4, and a plurality of tentacle heat dissipation strips 6 integrally formed with the upper surface of the umbrella heat dissipation member 4 and connected to the heat-conducting silicone suction cups 7.

[0016] In addition to the above embodiments, the umbrella heat sink 4 in this embodiment is a hollow umbrella-shaped structure, a circular through hole 401 is provided at the center of the upper surface of the umbrella heat sink 4, a plurality of inverted conical holes 402 which are larger at the top and smaller at the bottom are provided at the bottom of the umbrella heat sink 4, a single-component room-temperature curing thermal conductive silicone is fixed in the inverted conical holes 402, and the lower surface of the single-component room-temperature curing thermal conductive silicone is bonded to the upper surface of the device body 2.

[0017] The present invention forms a three-dimensional heat dissipation network through the umbrella heat sink 4, the mouth wrist heat sink 5, the tentacle heat sink 6 and the thermal conductive silicone suction cup 7, which expands the heat dissipation area and accelerates the heat transfer from the device body 2 to the ceramic package 3. The hollow design of the umbrella heat sink 4 reduces the weight while increasing the convection heat dissipation space. The circular through hole 401 and the inverted tapered hole 402 further optimize the heat flow path.

[0018] The present invention can preliminarily fix the umbrella heat sink 4 through the adsorption force provided by the thermally conductive silicone suction cup 7, and at the same time assist in improving the uniformity of heat conduction on the upper surface of the device body 2. After the thermally conductive silicone suction cup 7 is adsorbed on the upper surface of the device body 2, a single-component room temperature curing thermally conductive silicone is poured into the inverted tapered hole 402. The single-component room temperature curing thermally conductive silicone provides an anchor point for fixing the umbrella heat sink 4 on the upper surface of the device body 2, thereby further fixing the umbrella heat sink 4. Generally, through the adsorption force provided by the thermally conductive silicone suction cup 7, most of the lower surface of the umbrella heat sink 4 fits with the upper surface of the device body 2. Therefore, by filling the gap between the umbrella heat sink 4 and the device body 2 with part of the single-component room temperature curing thermally conductive silicone flowing out of the inverted tapered hole 402, the interface contact between the umbrella heat sink 4 and the device body 2 can be enhanced, the thermal resistance can be reduced, and the thermal conductivity efficiency can be improved.

[0019] In addition to the above-mentioned embodiment, eight wrist heat dissipation strips 5 are provided in this embodiment, and the wrist heat dissipation strips 5 include a first arc strip 501 bent toward the central axis direction of the umbrella heat sink 4, a second arc strip 502 integrally formed with the first arc strip 501 and with the convex surface facing the central axis of the umbrella heat sink 4, a third arc strip 503 integrally formed with the second arc strip 502 and with the concave surface facing the central axis of the umbrella heat sink 4, and a pressure strip 504 integrally formed with the third arc strip 503 and extending toward the central axis direction of the umbrella heat sink 4; the upper surface of the pressure strip 504 abuts against the inner wall of the top of the ceramic package 3.

[0020] The heat sink 5 at the wrist part has an overall wavy structure, has a certain elasticity and can be compressed. In the process of the ceramic package 3 and the substrate 1 jointly clamping the device body 2, the heat sink 5 at the wrist part can be compressed to provide a downward extrusion force for the umbrella part heat sink 4, so that the umbrella part heat sink 4 can fit the device body 2 evenly. The elastic deformation ability of the heat sink 5 at the wrist part adapts to the mechanical stress in the packaging process, avoids poor contact due to assembly tolerance, and improves long-term reliability.

[0021] In addition to the above-mentioned embodiment, the upper surface of the pressure strip 504 in this embodiment is a plane, and a heat sink 8 is fixedly provided on the top of the ceramic package 3, and the lower surface of the heat sink 8 abuts against the upper surface of the pressure strip 504, and the upper surface of the heat sink 8 is lower than the upper surface of the terminal 9. The heat sink 8 provides a path for the bionic jellyfish heat dissipation module to dissipate heat to the outside of the ceramic package 3. The pressure strip 504 is in direct contact with the top inner wall of the ceramic package 3 to disperse stress and prevent the heat dissipation structure from shifting due to vibration or thermal expansion and contraction. The heat sink 8 is an aluminum sheet or a copper sheet, and the pressure strip 504 is an aluminum sheet or a copper sheet coated with a graphene thermal conductive coating on the surface. The graphene thermal conductive coating has good ductility and can be compressed and deformed with the wrist heat dissipation strip 5 without detaching.

[0022] The heat dissipation strip 5 at the mouth and wrist extends vertically to the top of the ceramic package 3, quickly conducts the heat upward to the outside of the ceramic package 3 to dissipate, forming a longitudinal heat dissipation dominant, and the heat dissipation strip 6 at the tentacle part connects the umbrella part heat sink 4 and the thermal conductive silicone suction cup 7 horizontally, covering the edge area of ​​the upper surface of the device body 2, forming a lateral heat dissipation dominant. The heat dissipation strip 5 at the mouth and wrist part and the heat dissipation strip 6 at the tentacle part form a three-dimensional heat flow path of "vertical rapid conduction + lateral uniform diffusion" to avoid the occurrence of local hot spots.

[0023] The present invention realizes morphological bionics (the covering structure of the umbrella heat sink 4, the mouth and wrist structure of the mouth and wrist heat sink 5, and the tentacle structure of the tentacle heat sink 6) and functional bionics of adsorption and elastic buffering through a bionic jellyfish heat dissipation module, thereby achieving a balance among heat dissipation efficiency, structural stability and process feasibility, simplifying the assembly process, and being particularly suitable for SiC power device packaging scenarios with high power density and strict thermal management requirements.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A SiC power device, comprising a substrate (1) and a device body (2), wherein a ceramic package (3) is fixedly provided on the upper surface of the substrate (1) and outside the device body (2), and the upper surface of the substrate (1) is in contact with the lower surface of the device body (2), characterized in that: The ceramic package (3) is provided with a bionic jellyfish heat dissipation module, which comprises an umbrella heat dissipation element (4) fixedly arranged on the upper surface of the device body (2), a plurality of wrist heat dissipation strips (5) integrally formed with the upper surface of the umbrella heat dissipation element (4) and abutting against the inner wall of the top of the ceramic package (3), a plurality of heat-conducting silicone suction cups (7) fixedly adsorbed on the upper surface of the device body (2) and arranged in an annular manner with respect to the central axis of the umbrella heat dissipation element (4), and a plurality of tentacle heat dissipation strips (6) integrally formed with the upper surface of the umbrella heat dissipation element (4) and connected to the heat-conducting silicone suction cups (7).

2. A SiC power device according to claim 1, characterized in that: The umbrella heat sink (4) is a hollow umbrella-shaped structure, a circular through hole (401) is provided at the center of the upper surface of the umbrella heat sink (4), a plurality of inverted conical holes (402) with a larger top and a smaller bottom are provided at the bottom of the umbrella heat sink (4), a single-component room temperature curing thermal conductive silicone is fixed in the inverted conical holes (402), and the lower surface of the single-component room temperature curing thermal conductive silicone is bonded to the upper surface of the device body (2).

3. A SiC power device according to claim 1, characterized in that: The wrist heat dissipation strips (5) are provided with eight, and the wrist heat dissipation strips (5) include a first arc strip (501) bent toward the central axis of the umbrella heat dissipation element (4), a second arc strip (502) integrally formed with the first arc strip (501) and with the convex surface facing the central axis of the umbrella heat dissipation element (4), a third arc strip (503) integrally formed with the second arc strip (502) and with the concave surface facing the central axis of the umbrella heat dissipation element (4), and a pressure strip (504) integrally formed with the third arc strip (503) and extending toward the central axis of the umbrella heat dissipation element (4); the upper surface of the pressure strip (504) abuts against the inner wall of the top of the ceramic package (3).

4. A SiC power device according to claim 3, characterized in that: The upper surface of the pressure strip (504) is a plane, a heat sink (8) is fixedly provided through the top of the ceramic package (3), and the lower surface of the heat sink (8) abuts against the upper surface of the pressure strip (504).

5. A SiC power device according to claim 4, characterized in that: The heat sink (8) is an aluminum sheet or a copper sheet, and the pressure-bearing strip (504) is an aluminum sheet or a copper sheet with a surface coated with a graphene thermal conductive coating.

6. A SiC power device according to claim 4, characterized in that: A terminal (9) is fixedly provided on the upper surface of the device body (2), the upper surface of the terminal (9) is fixedly passed through the upper surface of the ceramic package (3), the bionic jellyfish heat dissipation module is arranged on the periphery of the terminal (9), and the upper surface of the heat sink (8) is lower than the upper surface of the terminal (9).

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