A SiC power device

Abstract

The present invention relates to the field of semiconductor technology, and specifically to a SiC power device, which includes a bionic jellyfish heat dissipation module. The bionic jellyfish heat dissipation module includes an umbrella part heat dissipation member fixedly arranged on the upper surface of the device body, several oral arm part heat dissipation strips integrally formed with the upper surface of the umbrella part heat dissipation member and abutting against the inner wall of the top of the ceramic package, several heat-conducting silica gel suction cups fixedly adsorbed on the upper surface of the device body and arranged at annular intervals about the central axis of the umbrella part heat dissipation member, and several tentacle part heat dissipation strips integrally formed with the upper surface of the umbrella part heat dissipation member and connected to the heat-conducting silica gel suction cups. The present invention realizes morphological bionics and functional bionics of adsorption and elastic buffering through the bionic jellyfish heat dissipation module, achieves the balance of heat dissipation efficiency, structural stability and process feasibility, simplifies the assembly process, and is especially suitable for the packaging scenario of SiC power devices with high power density and strict thermal management.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and specifically to a SiC power device. Background Art

[0002] As a new generation of semiconductor devices, the working characteristics of high frequency, high voltage, and high temperature of SiC power devices pose severe challenges to traditional packaging technologies. The current widely used traditional packaging methods such as wire bonding and single-sided soldering have long interconnecting lines and complex multi-layer structures. For the traditional packaging methods applied to SiC power modules, the parasitic inductance parameters are relatively large, making it difficult to match the fast switching characteristics of SiC devices. At the same time, the packaging reliability is greatly reduced under high-temperature working conditions. To fully utilize the advantages of SiC devices, it is necessary to improve the existing packaging technology. Summary of the Invention

[0003] The purpose of the present invention is to provide a SiC power device to solve the problems raised in the above background art.

[0004] To achieve the above purpose, the present invention provides the following technical solution: A SiC power device includes a substrate and a device body. A ceramic package is fixedly arranged on the upper surface of the substrate and outside the device body, and the upper surface of the substrate is in contact with the lower surface of the device body. A biomimetic jellyfish heat dissipation module is arranged inside the ceramic package. The biomimetic jellyfish heat dissipation module includes an umbrella-shaped heat dissipation member fixedly arranged on the upper surface of the device body, several oral arm heat dissipation strips integrally formed on the upper surface of the umbrella-shaped heat dissipation member and in contact with the inner wall of the top of the ceramic package, several heat-conducting silica gel suction cups fixedly adsorbed on the upper surface of the device body and arranged at annular intervals about the central axis of the umbrella-shaped heat dissipation member, and several tentacle heat dissipation strips integrally formed on the upper surface of the umbrella-shaped heat dissipation member and connected to the heat-conducting silica gel suction cups.

[0005] Optionally, the umbrella-shaped heat dissipation member is a hollow umbrella-shaped structure. A circular through hole is opened at the center of the upper surface of the umbrella-shaped heat dissipation member, and several inverted conical holes with a large upper part and a small lower part are opened at the bottom of the umbrella-shaped heat dissipation member. A one-component room-temperature curing heat-conducting silica gel is fixedly arranged in the inverted conical holes, and the lower surface of the one-component room-temperature curing heat-conducting silica gel is bonded to the upper surface of the device body.

[0006] Optionally, there are eight oral arm heat dissipation strips. The oral arm heat dissipation strips include a first arc-shaped strip bent towards the central axis of the umbrella-shaped heat dissipation member, a second arc-shaped strip integrally formed with the first arc-shaped strip and with the convex surface facing the central axis of the umbrella-shaped heat dissipation member, a third arc-shaped strip integrally formed with the second arc-shaped strip and with the concave surface facing the central axis of the umbrella-shaped heat dissipation member, and a pressure-bearing strip integrally formed with the third arc-shaped strip and extending towards the central axis of the umbrella-shaped heat dissipation member; the upper surface of the pressure-bearing strip is in contact with the inner wall of the top of the ceramic package.

[0007] Optionally, the upper surface of the pressure-bearing strip is a flat surface, and a heat sink is fixedly penetrated through the top of the ceramic package. The lower surface of the heat sink abuts against the upper surface of the pressure-bearing strip.

[0008] Optionally, the heat sink is an aluminum sheet or a copper sheet, and the pressure-bearing strip is an aluminum sheet or a copper sheet with a graphene heat-conducting coating on its surface.

[0009] Optionally, terminals are fixedly arranged on the upper surface of the device body. The upper surfaces of the terminals fixedly penetrate through the upper surface of the ceramic package. The bionic jellyfish heat dissipation module is arranged on the outer periphery of the terminals, and the upper surface of the heat sink is lower than the upper surface of the terminals.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1. The present invention realizes morphological bionics and functional bionics of adsorption and elastic buffering through the bionic jellyfish heat dissipation module, achieves the balance of heat dissipation efficiency, structural stability and process feasibility, simplifies the assembly process, and is particularly suitable for the packaging scenarios of SiC power devices with high power density and strict thermal management requirements;

[0012] 2. The present invention forms a three-dimensional heat dissipation network through the umbrella part heat dissipation member, the oral arm part heat dissipation strip, the tentacle part heat dissipation strip and the thermally conductive silica gel sucker, expands the heat dissipation area, accelerates the heat transfer from the device body to the ceramic package, and the hollow design of the umbrella part heat dissipation member reduces the weight while increasing the convective heat dissipation space. The circular through holes and the inverted conical holes further optimize the heat flow path. Description of the Drawings

[0013] Figure 1 is a structural schematic diagram of the present invention;

[0014] Figure 2 is Figure 1 an enlarged structural schematic diagram of part A in

[0015] Figure 3 is a structural schematic diagram of the bionic jellyfish heat dissipation module in the present invention.

[0016] In the figure: 1, substrate; 2, device body; 3, ceramic package; 4, umbrella part heat dissipation member; 401, circular through hole; 402, inverted conical hole; 5, oral arm part heat dissipation strip; 501, first arc strip; 502, second arc strip; 503, third arc strip; 504, pressure-bearing strip; 6, tentacle part heat dissipation strip; 7, thermally conductive silica gel sucker; 8, heat sink; 9, terminal. Detailed Embodiments

[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0018] Embodiment: Please refer to Figures 1 to 3 , the present invention provides a SiC power device, including a substrate 1 and a device body 2. A ceramic package 3 is fixedly arranged on the upper surface of the substrate 1 and outside the device body 2. Among them, the upper surface of the substrate 1 abuts against the lower surface of the device body 2, and a terminal 9 is fixedly arranged on the upper surface of the device body 2. The upper surface of the terminal 9 fixedly penetrates through the upper surface of the ceramic package 3.

[0019] A bionic jellyfish heat dissipation module is arranged in the ceramic package 3. The bionic jellyfish heat dissipation module is arranged on the outer periphery of the terminal 9 and surrounds the terminal 9, avoiding interfering with the electrical connection and being suitable for high-density power module packaging. The bionic jellyfish heat dissipation module includes an umbrella-shaped heat dissipation part 4 fixedly arranged on the upper surface of the device body 2, several oral arm heat dissipation strips 5 integrally formed with the upper surface of the umbrella-shaped heat dissipation part 4 and abutting against the inner wall of the top of the ceramic package 3, several heat-conducting silica gel suction cups 7 fixedly adsorbed on the upper surface of the device body 2 and arranged at annular intervals about the central axis of the umbrella-shaped heat dissipation part 4, and several tentacle heat dissipation strips 6 integrally formed with the upper surface of the umbrella-shaped heat dissipation part 4 and connected to the heat-conducting silica gel suction cups 7.

[0020] Based on the above embodiment, in this embodiment, the umbrella-shaped heat dissipation part 4 is a hollow umbrella-shaped structure. A circular through hole 401 is opened at the center of the upper surface of the umbrella-shaped heat dissipation part 4, and several inverted conical holes 402 with a large upper part and a small lower part are opened at the bottom of the umbrella-shaped heat dissipation part 4. A one-component room-temperature curing heat-conducting silica gel is fixedly arranged in the inverted conical holes 402, and the lower surface of the one-component room-temperature curing heat-conducting silica gel is bonded to the upper surface of the device body 2.

[0021] The present invention forms a three-dimensional heat dissipation network through the umbrella-shaped heat dissipation part 4, the oral arm heat dissipation strips 5, the tentacle heat dissipation strips 6 and the heat-conducting silica gel suction cups 7, expands the heat dissipation area, and accelerates the transfer of heat from the device body 2 to the ceramic package 3. The hollow design of the umbrella-shaped heat dissipation part 4 reduces the weight and increases the convective heat dissipation space at the same time. The circular through hole 401 and the inverted conical holes 402 further optimize the heat flow path.

[0022] The adsorption force provided by the thermally conductive silica gel suction cup 7 in the present invention can initially fix the umbrella-shaped heat dissipation component 4, and at the same time assist in improving the thermal conduction uniformity of the upper surface of the device body 2. After the thermally conductive silica gel suction cup 7 adsorbs on the upper surface of the device body 2, a one-component room-temperature curing thermally conductive silica gel is poured into the inverted conical hole 402. The one-component room-temperature curing thermally conductive silica gel provides an anchor point for fixing the umbrella-shaped heat dissipation component 4 on the upper surface of the device body 2, realizing further fixation of the umbrella-shaped heat dissipation component 4. Generally, due to the adsorption force provided by the thermally conductive silica gel suction cup 7, most of the lower surface of the umbrella-shaped heat dissipation component 4 is in contact with the upper surface of the device body 2. Therefore, by filling the gap between the umbrella-shaped heat dissipation component 4 and the device body 2 with a part of the one-component room-temperature curing thermally conductive silica gel flowing out of the inverted conical hole 402, the interface contact between the umbrella-shaped heat dissipation component 4 and the device body 2 can be enhanced, the thermal resistance can be reduced, and the thermal conduction efficiency can be improved.

[0023] Based on the above embodiments, in this embodiment, there are eight oral and wrist heat dissipation strips 5. The oral and wrist heat dissipation strips 5 include a first arc-shaped strip 501 bent towards the central axis of the umbrella-shaped heat dissipation component 4, a second arc-shaped strip 502 integrally formed with the first arc-shaped strip 501 and with the convex surface facing the central axis of the umbrella-shaped heat dissipation component 4, a third arc-shaped strip 503 integrally formed with the second arc-shaped strip 502 and with the concave surface facing the central axis of the umbrella-shaped heat dissipation component 4, and a bearing strip 504 integrally formed with the third arc-shaped strip 503 and extending towards the central axis of the umbrella-shaped heat dissipation component 4; the upper surface of the bearing strip 504 abuts against the inner wall of the top of the ceramic package 3.

[0024] The oral and wrist heat dissipation strips 5 are in a wavy structure as a whole, have a certain elasticity and can be compressed. During the process of the ceramic package 3 and the substrate 1 jointly clamping the device body 2, the oral and wrist heat dissipation strips 5 can be compressed, providing a downward extrusion force for the umbrella-shaped heat dissipation component 4, so that the umbrella-shaped heat dissipation component 4 can be evenly attached to the device body 2. The elastic deformation ability of the oral and wrist heat dissipation strips 5 adapts to the mechanical stress during the packaging process, avoiding the improvement of poor contact caused by assembly tolerance and enhancing long-term reliability.

[0025] Based on the above embodiments, in this embodiment, the upper surface of the bearing strip 504 is a plane. A heat sink 8 is fixedly penetrated through the top of the ceramic package 3. The lower surface of the heat sink 8 abuts against the upper surface of the bearing strip 504, and the upper surface of the heat sink 8 is lower than the upper surface of the terminal 9. The heat sink 8 provides a path for the bionic jellyfish heat dissipation module to dissipate heat to the outside of the ceramic package 3. The bearing strip 504 is in direct contact with the inner wall of the top of the ceramic package 3, dispersing stress and preventing the heat dissipation structure from shifting due to vibration or thermal expansion and contraction. The heat sink 8 is an aluminum sheet or a copper sheet, and the bearing strip 504 is an aluminum sheet or a copper sheet with a graphene thermal conductive coating on its surface. The graphene thermal conductive coating has good ductility and can not break away with the compression deformation of the oral and wrist heat dissipation strips 5.

[0026] The oral-armed heat dissipation strip 5 extends vertically to the top of the ceramic package 3, quickly conducting heat upward and dissipating it outside the ceramic package 3 to form a dominant longitudinal heat dissipation. The tentacle heat dissipation strip 6 is horizontally connected to the umbrella heat dissipation component 4 and the thermally conductive silicone suction cup 7, covering the edge area of the upper surface of the device body 2 to form a dominant transverse heat dissipation. The oral-armed heat dissipation strip 5 and the tentacle heat dissipation strip 6 form a three-dimensional heat flow path of "longitudinal rapid export + transverse uniform diffusion" to avoid local hot spots.

[0027] Through the bionic jellyfish heat dissipation module, the present invention realizes morphological bionics (the covering structure of the umbrella heat dissipation component 4, the oral-armed structure of the oral-armed heat dissipation strip 5, and the tentacle structure of the tentacle heat dissipation strip 6) and functional bionics of adsorption and elastic buffering, achieving a balance among heat dissipation efficiency, structural stability, and process feasibility, simplifying the assembly process, and being particularly suitable for the packaging scenarios of SiC power devices with high power density and strict thermal management requirements.

[0028] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A SiC power device, comprising a substrate (1) and a device body (2), wherein a ceramic package (3) is fixedly provided on the upper surface of the substrate (1) and outside the device body (2), and the upper surface of the substrate (1) is in contact with the lower surface of the device body (2), characterized in that: The ceramic package (3) is provided with a bionic jellyfish heat dissipation module, which comprises an umbrella heat dissipation element (4) fixedly arranged on the upper surface of the device body (2), a plurality of wrist heat dissipation strips (5) integrally formed with the upper surface of the umbrella heat dissipation element (4) and abutting against the inner wall of the top of the ceramic package (3), a plurality of heat-conducting silicone suction cups (7) fixedly adsorbed on the upper surface of the device body (2) and arranged in an annular manner with respect to the central axis of the umbrella heat dissipation element (4), and a plurality of tentacle heat dissipation strips (6) integrally formed with the upper surface of the umbrella heat dissipation element (4) and connected to the heat-conducting silicone suction cups (7).

2. A SiC power device according to claim 1, characterized in that: The umbrella heat sink (4) is a hollow umbrella-shaped structure, a circular through hole (401) is provided at the center of the upper surface of the umbrella heat sink (4), a plurality of inverted conical holes (402) with a larger top and a smaller bottom are provided at the bottom of the umbrella heat sink (4), a single-component room temperature curing thermal conductive silicone is fixed in the inverted conical holes (402), and the lower surface of the single-component room temperature curing thermal conductive silicone is bonded to the upper surface of the device body (2).

3. A SiC power device according to claim 1, characterized in that: The wrist heat dissipation strips (5) are provided with eight, and the wrist heat dissipation strips (5) include a first arc strip (501) bent toward the central axis of the umbrella heat dissipation element (4), a second arc strip (502) integrally formed with the first arc strip (501) and with the convex surface facing the central axis of the umbrella heat dissipation element (4), a third arc strip (503) integrally formed with the second arc strip (502) and with the concave surface facing the central axis of the umbrella heat dissipation element (4), and a pressure strip (504) integrally formed with the third arc strip (503) and extending toward the central axis of the umbrella heat dissipation element (4); the upper surface of the pressure strip (504) abuts against the inner wall of the top of the ceramic package (3).

4. A SiC power device according to claim 3, characterized in that: The upper surface of the pressure strip (504) is a plane, a heat sink (8) is fixedly provided through the top of the ceramic package (3), and the lower surface of the heat sink (8) abuts against the upper surface of the pressure strip (504).

5. A SiC power device according to claim 4, characterized in that: The heat sink (8) is an aluminum sheet or a copper sheet, and the pressure-bearing strip (504) is an aluminum sheet or a copper sheet with a surface coated with a graphene thermal conductive coating.

6. A SiC power device according to claim 4, characterized in that: A terminal (9) is fixedly provided on the upper surface of the device body (2), the upper surface of the terminal (9) is fixedly passed through the upper surface of the ceramic package (3), the bionic jellyfish heat dissipation module is arranged on the periphery of the terminal (9), and the upper surface of the heat sink (8) is lower than the upper surface of the terminal (9).

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