Chip interface micro-channel water-cooling radiator
By designing divergent corner water-cooled heat dissipation structure and heat dissipation fins at the chip interface, the problem that microflower radiators cannot effectively utilize the main and secondary heat generation positions of the chip in the prior art is solved, and efficient chip heat dissipation and cost reduction are achieved.
Patent Information
- Application Number
- CN202510361070.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-26
- Publication Date
- 2025-05-06
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing microflow radiators cannot effectively utilize the primary and secondary heating positions of the chip in chip heat dissipation, resulting in low heat dissipation efficiency.
A chip interface microflower water-cooled radiator is designed, using a divergent corner water-cooled heat dissipation structure and heat dissipation fin plate. By changing the flow channel geometric distribution, the water flow velocity is controlled to ensure that the coolant diverges from the center of the chip to the surroundings and effectively dissipate heat.
It realizes efficient heat dissipation of the chip, especially in the distribution of heat in the center and edges of the chip, which significantly improves the heat dissipation efficiency and reduces the application cost.
Smart Images
Figure CN119943786A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of chip heat dissipation, and in particular to a chip interface micro-channel water-cooled radiator. Background Art
[0002] In recent years, as electronic products develop towards high integration, high power and miniaturization, the packaging density and power consumption of electronic products have gradually increased. At the same time, the heat flux density of the chip is also increasing. If this heat is not discharged in time and effectively, the chip temperature will rise sharply, exceeding the controllable temperature of the chip junction temperature, causing serious reliability problems for the microelectronic chip. Therefore, how to effectively remove this heat is particularly important. Microchannel heat dissipation is a liquid cooling method proposed for chip heat dissipation. Microchannel heat dissipation is to use photolithography, etching and precise cutting methods to process flow channels with a cross-sectional shape of only tens to hundreds of microns on very thin silicon wafers, metals, or other suitable substrates. When the fluid flows through these microchannels, it takes away the heat on the substrate. It uses microscale heat transfer to achieve the purpose of efficient cooling. At present, the structural design of the flow channel of the microchannel radiator on the market is mainly based on flat heat dissipation, but the heat source of the actual chip will have a main heat source position, and flat heat dissipation does not have a good grasp of the primary and secondary parts of heat dissipation. Therefore, it is very necessary to design a chip interface microchannel water-cooled radiator. Summary of the invention
[0003] In order to overcome the deficiencies of the prior art, an object of the present invention is to provide a chip interface microchannel water-cooled radiator.
[0004] To achieve the above object, the present invention provides the following solutions:
[0005] The present invention provides a chip interface micro-channel water-cooled radiator, comprising: a chip and a cover plate, wherein the cover plate is arranged on the back of the chip, and a lower plate body of the cover plate is provided with a heat dissipation structure;
[0006] The heat dissipation structure includes a water-cooled heat dissipation structure and a heat dissipation fin. The water-cooled heat dissipation structure is arranged on the lower plate body of the cover plate. The water-cooled heat dissipation structure is a divergent corner structure, and the water inlet of the water-cooled heat dissipation structure is arranged at a position corresponding to the center of the chip, and the water outlet is arranged around the water-cooled heat dissipation structure. The heat dissipation fin is arranged on the lower side of the water-cooled heat dissipation structure.
[0007] Preferably, the water-cooled heat dissipation structure includes a U-shaped structure, a cross-shaped structure and a connecting channel. The cross-shaped structure is arranged at the center of the lower plate body of the cover plate. The upper and lower short ends of the cross-shaped structure are respectively connected to the connecting channel. The left and right ends of the connecting channel are respectively connected to the bottom of a U-shaped structure, together forming the water-cooled heat dissipation structure. The water inlet is arranged at the center of the cross-shaped structure, and the water outlet is arranged at both ends of the U-shaped structure.
[0008] Preferably, the U-shaped structure, the cross-shaped structure and the connecting channel are prepared on the lower plate body of the cover plate by photolithography, etching or precision cutting.
[0009] Preferably, the cover plate is low temperature co-fired ceramic.
[0010] Preferably, a plurality of groups of the heat dissipation fins are evenly arranged inside the U-shaped structure, and the heat dissipation fins are in contact with the lower plate body of the cover plate and the inner side wall of the U-shaped structure.
[0011] According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:
[0012] The present invention provides a chip interface microfluidic water cooling radiator, comprising a chip and a cover plate, wherein the cover plate is arranged on the back of the chip, and the lower plate body of the cover plate is provided with a heat dissipation structure; the heat dissipation structure comprises a water cooling heat dissipation structure and a heat dissipation fin, and the lower plate body of the cover plate is provided with the water cooling heat dissipation structure, the water cooling heat dissipation structure is a divergent corner structure, and the water inlet of the water cooling heat dissipation structure is arranged at a position corresponding to the center of the chip, and the water outlet is arranged around the water cooling heat dissipation structure; the heat dissipation fin is arranged on the lower side of the water cooling heat dissipation structure. The present invention controls the water flow velocity by changing the geometric distribution of the flow channel, accelerates the heat dissipation speed of the central chip heat source, and can perform good heat dissipation on the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0014] Figure 1 This is a schematic diagram of the water cooling structure;
[0015] Figure 2 This is a first-person perspective schematic diagram of the overall structure of the chip interface microchannel water-cooling radiator;
[0016] Figure 3 This is a bottom view of the overall structure of the chip interface microchannel water-cooling radiator;
[0017] Figure 4 It is a three-dimensional diagram of the overall structure of the chip interface microchannel water-cooling radiator;
[0018] Figure 5 Schematic diagram of water flow in water cooling structure.
[0019] Figure numerals: 1. water-cooling heat dissipation structure; 101. U-shaped structure; 102. connecting channel; 103. cross-shaped structure; 2. heat dissipation fins; 3. cover plate; 4. chip. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0021] The purpose of the present invention is to provide a chip interface micro-channel water-cooled radiator, which controls the water flow speed by changing the geometric distribution of the flow channel, accelerates the heat dissipation speed of the central chip heat source, and can effectively dissipate the heat of the chip.
[0022] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.
[0023] like Figure 1-Figure 5 As shown, the present invention provides a chip interface microfluidic water cooling radiator. First, the XYZ axis of the chip interface microfluidic water cooling radiator is defined, which is convenient for description in combination with the accompanying drawings. The center position of the chip is vertically defined as the Y axis, the long side of the chip is defined as the Z axis, and the short side of the chip is defined as the X axis. Figure 1-Figure 5 , a detailed description of the chip interface micro-channel water cooling radiator is given;
[0024] The chip interface microchannel water cooling radiator comprises: a chip 4, a cover plate 3, such as Figure 2 As shown, the cover plate 3 is disposed on the back of the chip 4, and the lower plate body of the cover plate 3 is provided with a heat dissipation structure;
[0025] The heat dissipation structure includes a water-cooled heat dissipation structure 1 and a heat dissipation fin 2. The lower plate body of the cover plate 3 is provided with the water-cooled heat dissipation structure 1. The water-cooled heat dissipation structure 1 is a divergent corner structure, and the water inlet of the water-cooled heat dissipation structure 1 is arranged at a position corresponding to the center of the chip 4, and the water outlet is arranged around the water-cooled heat dissipation structure 1. The cooling water diverges from the center of the heat source to the surroundings, and also flows from the high-temperature area to the low-temperature area. The shear heat generated by the friction between the molecules and the outer wall of the fluid during the filling process makes the molecules with high heat faster, and the peripheral temperature is often higher than the center in the cross section. When turning a corner, the inner molecules have to overcome a higher friction force, and the inner side contacts the chip heat source first, so that The flow rate on the inside is higher than that on the outside, and the water is changed faster on the inside. With the advantage of the same liquid inlet, the coolant can be automatically distributed according to the heat source heat distribution to concentrate the heat dissipation, which effectively solves the problem of central heat generation and edge heat accumulation of the chip 4; the heat dissipation fins 2 are arranged on the lower side of the water-cooled heat dissipation structure 1, and the heat dissipation fins 2 are dispersed under the flow channel groove, which can increase the heat transfer area and the number of vertical heat transfer layers, which makes the present invention adaptable to most heat sink air-cooling devices on the market. By designing the volume of the heat dissipation fins 2 of this product, the heat dissipation equipment on the market can be directly exchanged and disassembled with equal volume, which greatly reduces the application cost without affecting the diversified application scenarios of this product.
[0026] The cover plate 3 can be made of silicon wafer, metal, low temperature co-fired ceramic (LTCC) or other suitable cover plates, and can be processed into a flow channel with a cross-sectional shape of only tens to hundreds of microns by photolithography, etching and precision cutting methods. The vertical direction is the inlet and outlet of the microchannel cooling water, wherein the water inlet is located directly below the chip heat source, and the flow channel width is relatively wide, and the water outlet is located around the chip, and the flow channel width is relatively narrow.
[0027] like Figure 1 As shown, the water-cooling heat dissipation structure 1 includes a U-shaped structure 101, a cross-shaped structure 103 and a connecting channel 102. The cross-shaped structure 101 is arranged at the center of the lower plate body of the cover plate 3. The upper and lower short ends of the cross-shaped structure 103 are respectively connected to the connecting channel 102. The left and right ends of the connecting channel 102 are respectively connected to the bottom of a U-shaped structure 101, and together they constitute the water-cooling heat dissipation structure 1. Figure 5 As shown, the water inlet is arranged at the center of the cross-shaped structure 103 , and the water outlet is arranged at both ends of the U-shaped structure 101 .
[0028] The cover plate 3 is low temperature co-fired ceramic, and the U-shaped structure 101, the cross-shaped structure 103 and the connecting channel 102 are prepared on the lower plate of the cover plate 3 by photolithography, etching (such as deep reactive ion etching method) or precision cutting.
[0029] like Figure 3 and Figure 4As shown, a plurality of groups of heat dissipation fins 2 are evenly arranged outside the U-shaped structure 101 , and the heat dissipation fins 2 are in contact with the lower plate body of the cover plate 3 and the inner side wall of the U-shaped structure 101 .
[0030] The present invention provides two embodiments;
[0031] Example 1: Assuming that the heat source of the chip is located in the middle of the chip, the heat source of the chip is a circular hot spot with a size of about 500 μm. After the ceramic substrate, the copper plating layer, and the circuit board layer are bonded, a drilling process is performed to produce a water inlet and a water outlet for the vertical microchannel cooling water, wherein the water inlet is located in the middle of the chip with a hole diameter of 500 μm, and the water outlet is located around the chip with a hole diameter of 50 μm;
[0032] The microchannel layer is made of low temperature co-fired ceramic (LTCC). The top view of the microchannel layer is shown in the figure. Figure 1 As shown, a microchannel flipped by a chip heat source is etched by deep reactive ion etching (DRIE), wherein each microchannel has a width of 50 μm and a straight groove shape;
[0033] Place the microchannel side of the LTCC downward and align it with the ceramic substrate with water inlet and outlet holes. After the cooling water flows in from the water inlet, it can be dispersed around the chip through the microchannel layer and flow out from the water outlet. The heat of the chip is transferred to the coolant in the channel. The heat dissipation fins also accelerate the heat transfer to ensure the stable operation of the chip.
[0034] The above-mentioned microchannel heat dissipation structure can change the shape of the microchannel into a straight groove, a polygon, a cylinder, etc. or splice the shapes of channels with different cross sections;
[0035] The above-mentioned microchannel heat dissipation structure can increase or decrease the width of the water inlet of the microchannel according to parameters such as the size of the heat source and the number of microchannels.
[0036] Example 2: Assuming that the heat source of the chip is located in the middle of the chip, the chip heat source is a long strip with a size of about 500μm*3000μm. After the ceramic substrate, the copper plating layer, and the circuit board layer are bonded, a drilling process is performed to produce a water inlet and a water outlet for the vertical microchannel cooling water. Among them, the number of water inlets is 3, and the water inlet position is set along the long direction of the heat source strip (that is, the above-mentioned cross-shaped structure), with an interval of 500μm and a hole diameter of 500μm. The water outlet is located around the chip with a hole diameter of 50μm;
[0037] The microchannel layer is made of low temperature co-fired ceramic (LTCC). The top view of the microchannel layer is shown in the attached figure. Figure 3As shown, the deep reactive ion etching (DRIE) method is used to etch out the chip flip microchannels, where each microchannel is 50μm wide and has a straight groove shape. Suitable heat sink fins are added to the original heat sink fin requirements. Under the microfluidic pump, the fluid enters the flow channel to take away the heat, and the heat sink fins under the groove take away part of the heat and are still compatible with the original fan cooling system. It only needs to be designed and replaced to increase the original heat dissipation efficiency.
[0038] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0039] The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the method and core idea of the present invention. At the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.
Claims
1. A chip interface microchannel water-cooled radiator, characterized in that: include: A chip and a cover plate, wherein the cover plate is arranged on the back of the chip, and a heat dissipation structure is arranged on the lower plate body of the cover plate; The heat dissipation structure includes a water-cooled heat dissipation structure and a heat dissipation fin. The water-cooled heat dissipation structure is arranged on the lower plate body of the cover plate. The water-cooled heat dissipation structure is a divergent corner structure, and the water inlet of the water-cooled heat dissipation structure is arranged at a position corresponding to the center of the chip, and the water outlet is arranged around the water-cooled heat dissipation structure. The heat dissipation fin is arranged on the lower side of the water-cooled heat dissipation structure.
2. The heat sink according to claim 1, characterized in that: The water-cooled heat dissipation structure includes a U-shaped structure, a cross-shaped structure and a connecting channel. The cross-shaped structure is arranged at the center of the lower plate body of the cover plate. The upper and lower short ends of the cross-shaped structure are respectively connected to the connecting channel. The left and right ends of the connecting channel are respectively connected to the bottom of a U-shaped structure, together forming the water-cooled heat dissipation structure. The water inlet is arranged at the center of the cross-shaped structure, and the water outlet is arranged at both ends of the U-shaped structure.
3. The heat sink according to claim 2, characterized in that: The U-shaped structure, the cross-shaped structure and the connecting channel are prepared on the lower plate body of the cover plate by photolithography, etching or precision cutting.
4. The heat sink according to claim 3, characterized in that: The cover plate is low temperature co-fired ceramic.
5. The heat sink according to claim 2, characterized in that: A plurality of groups of heat dissipation fins are evenly arranged inside the U-shaped structure, and the heat dissipation fins are in contact with the lower plate body of the cover plate and the inner side wall of the U-shaped structure.