Circuit board assembly, manufacturing method thereof and electronic equipment

Abstract

The invention provides a circuit board assembly and a manufacturing method thereof and electronic equipment, and belongs to the technical field of electronic equipment, the circuit board assembly comprises a chip, the welding surface of the chip is provided with a first area and a second area, the first area is internally provided with a capacitor, and the first area is a heating area of the chip; the chip is welded to the circuit board through welding flux, the welding face faces the circuit board, the circuit board is provided with a filler hole, the filler hole is communicated with the side, close to the chip, of the circuit board and the side, away from the chip, of the circuit board, and the filler hole is opposite to the first area or the capacitor; the heat conduction material is located between the chip and the circuit board, the heat conduction material at least covers part of the first area and the capacitor, and the heat conduction material is filled between the welding flux; the bonding material is located between the chip and the circuit board, and the bonding material at least covers part of the second area.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a circuit board assembly, a manufacturing method thereof, and an electronic device. Background Art

[0002] In related technologies, such as Figure 1 and Figure 2 As shown, in order to protect the solder balls 130' of the chip 110', usually after the chip 110' is surface mounted on the circuit board 120', an underfill 150' is introduced to fix and protect the solder balls 130' to prevent the solder balls 130' from being subjected to excessive mechanical stress.

[0003] However, although the filling glue 150' can effectively reduce the mechanical stress of the solder balls 130' located in the edge area 116' of the chip 110', the mechanical stress of the solder balls 130' located in the middle area 114' of the chip 110' is usually relatively low and does not require the protection of the filling glue 150'. On the contrary, due to the large difference in thermal expansion coefficients between the filling glue 150' and the solder balls 130', the thermal expansion coefficients are improperly matched, and the filling glue 150' expands due to heat, pulling the circuit board 120' and the chip 110' up and down, thereby generating vertical thermal stress on the nearby solder balls 130', which will cause fatigue cracking of the solder balls 130' after multiple temperature cycles, resulting in the chip 110' and the circuit board 120' being desoldered. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a circuit board assembly, a manufacturing method thereof, and an electronic device, which can effectively solve the technical problem of solder fatigue cracking between a chip and a circuit board.

[0005] In a first aspect, an embodiment of the present application provides a circuit board assembly, including:

[0006] A chip, wherein the welding surface of the chip has a first area and a second area, the first area has a capacitor, and the first area is a heating area of ​​the chip;

[0007] A circuit board, the chip is soldered to the circuit board by solder, the soldering surface faces the circuit board, the circuit board has a filling hole, the filling hole conducts a side of the circuit board close to the chip and a side of the circuit board away from the chip, and the filling hole is opposite to the first area;

[0008] A heat-conducting material is located between the chip and the circuit board, the heat-conducting material at least covers a portion of the first area and the capacitor, and the heat-conducting material is filled between the solders;

[0009] The adhesive material is located between the chip and the circuit board, and the adhesive material at least covers a portion of the second area.

[0010] As a possible implementation manner, the number of the capacitor is at least one, the number of the filling hole is at least one, and the filling hole and the capacitor are opposite.

[0011] As a possible implementation manner, the opening area of ​​the filling hole at one end close to the chip is smaller than the opening area of ​​the filling hole at one end away from the chip.

[0012] As a possible implementation, a metal heat-conducting layer is provided on the hole wall of the filler hole.

[0013] As a possible implementation, a blocking piece is provided on the circuit board, and the blocking piece is used to block the filling hole.

[0014] As a possible implementation, a side of the circuit board close to the chip has an annular protrusion, the capacitor and the inner side of the annular protrusion face each other, and the annular protrusion is used to separate the thermal conductive material and the adhesive material.

[0015] As a possible implementation manner, the second area surrounds the first area, and the adhesive material surrounds the thermal conductive material.

[0016] As a possible implementation manner, the solder is a solder ball, there are multiple solder balls, and the thermal conductive material and the adhesive material are filled between adjacent solder balls.

[0017] As a possible implementation manner, the thermally conductive material is thermally conductive silicone grease; and the bonding material is adhesive.

[0018] In a second aspect, an embodiment of the present application provides a method for manufacturing a circuit board assembly, which is used to manufacture the circuit board assembly as in the first aspect, comprising:

[0019] Mounting a chip on a circuit board having a filler hole;

[0020] Injecting thermal conductive material between the circuit board and the chip through the filler hole;

[0021] The bonding material is injected between the circuit board and the chip through the edge of the chip.

[0022] As a possible implementation manner, after injecting the heat-conducting material between the circuit board and the chip through the filling hole, the method further includes: sealing the filling hole with a sealing member.

[0023] As a possible implementation, before mounting the chip on the circuit board, the method further includes: determining the position of the capacitor of the chip; and providing a filling hole at a position corresponding to the circuit board and the capacitor.

[0024] In a third aspect, an embodiment of the present application provides an electronic device, including:

[0025] A circuit board assembly as provided in the first aspect embodiment; or

[0026] A circuit board assembly manufactured by the method for manufacturing a circuit board assembly provided by an embodiment of the second aspect.

[0027] In an embodiment of the present application, a circuit board assembly includes a chip, a circuit board, a thermally conductive material and an adhesive material, wherein the chip and the circuit board are soldered by solder, that is, the solder is located between the chip and the circuit board to realize communication between the circuit board and the chip, the welding surface of the chip has a first area and a second area, a capacitor is arranged in the first area, the first area is the heating area of ​​the chip, the thermally conductive material is filled between the chip and the circuit board, and covers at least part of the first area and the capacitor, the adhesive material is filled between the chip and the circuit board, and covers at least part of the second area, and thus the adhesive material can make the connection between the chip and the circuit board more reliable, and reduce the possibility of deformation of the chip due to mechanical stress, and the thermally conductive material can transfer the heat in the heating area to the circuit board in time during the operation of the chip, so as to realize rapid heat dissipation of the chip, and the thermally conductive material has a low thermal expansion coefficient, thereby reducing the stress pulling and fatigue cracking problems caused by the different thermal expansion coefficients of the adhesive material and the solder in the related technology.

[0028] As mentioned above, through the targeted filling of thermal conductive materials and adhesive materials, the mechanical stress and thermal stress risks of the chip can be suppressed, the reliability of communication between the chip and the circuit board can be effectively increased, and the service life of the circuit board assembly can be improved.

[0029] In addition, there is a filling hole on the circuit board, which connects the side of the circuit board close to the chip and the side of the circuit board far from the chip. Moreover, the filling hole is opposite to the first area or the capacitor, and thermal conductive material can be filled between the circuit board and the chip through the filling hole, thereby reducing the difficulty of filling the thermal conductive material and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0031] Figure 1 A cross-sectional view of a circuit board, a chip and solder balls in the related art is shown;

[0032] Figure 2 A schematic diagram of a chip in the related art is shown;

[0033] Figure 3 A cross-sectional view of a circuit board assembly provided by one embodiment of the present application is shown;

[0034] Figure 4 A schematic diagram of a circuit board, solder, thermal conductive material, adhesive material and capacitor in a circuit board assembly provided by an embodiment of the present application is shown;

[0035] Figure 5A schematic diagram of a circuit board assembly provided by one embodiment of the present application is shown;

[0036] Figure 6 Shown as Figure 5 A partial cross-sectional view of the circuit board assembly taken along the AA direction shown;

[0037] Figure 7 A partial cross-sectional view of a circuit board assembly provided by one embodiment of the present application is shown;

[0038] Figure 8 A partial cross-sectional view of a circuit board in a circuit board assembly provided by one embodiment of the present application is shown;

[0039] Fig. 9 A schematic diagram showing a circuit board and a metal heat-conducting layer in a circuit board assembly provided by an embodiment of the present application is shown;

[0040] Fig.10 A three-dimensional cross-sectional view of a circuit board assembly provided by an embodiment of the present application is shown;

[0041] Fig.11 A schematic diagram of a circuit board, solder, thermal conductive material, adhesive material, capacitor, and annular protrusion in a circuit board assembly provided by one embodiment of the present application is shown;

[0042] Fig.12 A partial cross-sectional view of a circuit board assembly provided by one embodiment of the present application is shown;

[0043] Fig.13 A schematic diagram showing a soldering surface and solder of a chip in a circuit board assembly provided by an embodiment of the present application is shown;

[0044] Fig.14 A flow chart of a method for manufacturing a circuit board assembly according to an embodiment of the present application is shown.

[0045] Figure 1 and Figure 2 Reference numerals:

[0046] 110' chip, 114' middle area, 116' edge area, 120' circuit board, 130' solder balls, 150' filling glue;

[0047] Figures 3 to 13 Reference numerals:

[0048] 100 circuit board assembly, 110 chip, 112 welding surface, 114 first area, 116 second area, 118 capacitor, 120 circuit board, 122 filling hole, 124 metal heat conductive layer, 126 sealing member, 128 annular protrusion, 130 solder, 140 thermal conductive material, 150 adhesive material. DETAILED DESCRIPTION

[0049] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0050] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0051] In the description of the present application, it should be understood that the terms "upper", "inner", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0052] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0053] Combine the following Figures 3 to 14 A circuit board assembly 100 , a method for manufacturing the circuit board assembly, and an electronic device according to embodiments of the present application are described.

[0054] First, as Figure 3 , Figure 4 and Figure 5As shown, an embodiment of the present application provides a circuit board assembly 100, including: a chip 110, a welding surface 112 of the chip 110 having a first area 114 and a second area 116, a capacitor 118 in the first area 114, and the first area 114 is a heating area of ​​the chip; a circuit board 120, the chip 110 is soldered to the circuit board 120 by solder 130, and the welding surface 112 faces the circuit board 120; a thermal conductive material 140, located between the chip 110 and the circuit board 120, the thermal conductive material 140 at least covers a portion of the first area 114 and the capacitor 118, and the thermal conductive material 140 is filled between the solder 130; an adhesive material 150, located between the chip 110 and the circuit board 120, and the adhesive material 150 at least covers a portion of the second area 116.

[0055] It can be understood that the first area 114 is a functional area of ​​the chip, which integrates functional devices such as CPU and GPU and generates a lot of heat when working; the second area 116 surrounds the first area 114 and is a non-functional area of ​​the chip.

[0056] In the embodiment of the present application, the circuit board assembly 100 includes a chip 110, a circuit board 120, a thermally conductive material 140 and an adhesive material 150, wherein the chip 110 and the circuit board 120 are welded by solder 130, that is, the solder 130 is located between the chip 110 and the circuit board 120 to realize the communication between the circuit board 120 and the chip 110, the welding surface 112 of the chip 110 has a first area 114 and a second area 116, the first area 114 is provided with a capacitor 118, the thermally conductive material 140 is filled between the chip 110 and the circuit board 120, and covers at least a portion of the first area 114 and the capacitor 118, and the adhesive material 150 is filled. The bonding material 150 is filled between the chip 110 and the circuit board 120 and covers at least a portion of the second area 116. Thus, the bonding material 150 can make the connection between the chip 110 and the circuit board 120 more reliable and reduce the possibility of deformation of the chip 110 due to mechanical stress. The thermal conductive material 140 can transfer the heat in the capacitor 118 and the first area 114 to the circuit board 120 to achieve rapid heat dissipation of the chip 110, thereby reducing the possibility of cracking of the solder 130 due to thermal stress. In addition, since the thermal expansion coefficient of the thermal conductive material 140 is lower than that of the bonding material 150, the risk of tensile damage to the solder 130 due to improper matching of the thermal expansion coefficient with the solder 130 can be reduced.

[0057] As described above, through targeted filling of the thermal conductive material 140 and the adhesive material 150 , the risk of mechanical stress and thermal stress of the chip 110 can be suppressed, the reliability of communication between the chip 110 and the circuit board 120 can be effectively increased, and the service life of the circuit board assembly 100 can be improved.

[0058] Before cooling and solidification, the thermal conductive material 140 and the adhesive material 150 both have a certain fluidity, and the thermal conductive material 140 can be first introduced from the capacitor 118, so that the thermal conductive material 140 is filled into the solder gap of the first region. Then the adhesive material 150 is filled into the second region 116, and the first region 114 can block the adhesive material 150 from entering the first region 114, thereby ensuring the separation of the thermal conductive material 140 and the adhesive material 150, so that the adhesive material 150 will not invade the first region 114 and the capacitor 118, and the thermal conductive material 140 can also transfer the heat generated by the chip 110 and the thermal conductive element to the circuit board 120 more quickly, effectively reducing the junction temperature of the chip 110 and the temperature of the solder 130.

[0059] The thermal conductive material 140 may be thermal conductive silicone grease, thermal conductive silica gel or thermal conductive potting glue, etc. The adhesive material 150 may be filling glue, die-bonding glue or epoxy glue, etc.

[0060] The chip 110 may be a system on chip (SoC), a central processing unit (CPU), a microprocessor, an application specific integrated circuit (ASIC), or a graphics processing unit (GPU), etc. Among them, the GPU and the CPU may be integrated in the SoC.

[0061] like Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 As shown, as a possible implementation, the circuit board 120 has a filling hole 122 , the filling hole 122 connects the side of the circuit board 120 close to the chip 110 and the side of the circuit board 120 away from the chip 110 , and the filling hole 122 is opposite to the first area 114 .

[0062] Specifically, the circuit board 120 has a filling hole 122, and the filling hole 122 connects the side of the circuit board 120 close to the chip 110 and the side of the circuit board 120 away from the chip 110, and the filling hole 122 is opposite to the first area 114 or the capacitor 118, so that the thermal conductive material 140 can be filled between the circuit board 120 and the chip 110 through the filling hole 122, thereby reducing the difficulty of filling the thermal conductive material 140 and improving production efficiency.

[0063] The present application arranges a filling hole 122 on the circuit board 120, and a thermal conductive material 140 can be injected into the space between the chip 110 and the circuit board 120 through the filling hole 122, so as to cover the first area 114 of the chip 110 and the capacitor 118, so that the thermal conductive material 140 can actively block the adhesive material 150 from flowing into the first area 114 of the chip 110 and the capacitor 118, thereby reducing the thermal stress on the solder 130 at the first area 114 of the chip 110 and the capacitor 118, thereby improving the thermal fatigue life of the solder 130 and ensuring the service life of the chip 110.

[0064] The cross section of the filling hole 122 may be circular, elliptical or polygonal, and the polygonal shape may be triangular, quadrilateral, pentagonal or hexagonal.

[0065] like Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 As shown, as a possible implementation, the number of the capacitor 118 is at least one, the number of the filling hole 122 is at least one, and the filling hole 122 and the capacitor 118 are opposite.

[0066] Specifically, there is at least one capacitor 118 and at least one filling hole 122 . The filling holes 122 and the capacitors 118 are arranged in a one-to-one correspondence, so that the thermal conductive material 140 filled in each filling hole 122 can cover a capacitor 118 , thereby improving the thermal conductivity effect on the capacitor 118 .

[0067] That is, a plurality of filling holes 122 are provided at positions relative to the capacitors 118 of the circuit board 120 and the chip 110, wherein one capacitor 118 corresponds to one filling hole 122. After the chip 110 is surface-mounted to the circuit board 120, a needle or a probe or other tool is used to pass through the filling hole 122, and the thermal conductive material 140 is filled between the circuit board 120 and the chip 110, so that the adhesive material 150 can be blocked, and the possibility of the adhesive material 150 flowing into the first area 114 of the chip 110 and the position of the capacitor 118 is reduced. For example: there are 7 capacitors 118 on the chip 110, and 7 filling holes 122 are provided on the circuit board 120, and the filling holes 122 and the capacitors 118 are opposite to each other. Of course, in other embodiments of the present application, the number of capacitors 118 and circuit boards 120 can be 1, 2, 3, 4, 5, 6, 8, 9 or 10, etc.

[0068] The longest distance between any two points on the cross section of the filling hole 122 is less than or equal to 1 mm, for example, 1 mm, 0.7 mm, 0.5 mm, 0.3 mm or 0.1 mm, etc. The cross section of the filling hole 122 can be circular, and the diameter of the cross section is less than or equal to 1 mm, for example, 1 mm, 0.7 mm, 0.5 mm, 0.3 mm or 0.1 mm, etc.

[0069] Of course, in other embodiments of the present application, some of the filling holes 122 may be opposite to the capacitor 118 , while other filling holes 122 may not be opposite to the capacitor 118 but only opposite to the first area 114 , thereby facilitating the filling of the thermal conductive material 140 .

[0070] like Figure 8 As shown, as a possible implementation, the area of ​​the opening L1 of the filling hole 122 at one end close to the chip 110 is smaller than the area of ​​the opening L2 of the filling hole 122 at one end away from the chip 110 .

[0071] Specifically, the area of ​​the opening L1 at the end of the filling hole 122 close to the chip 110 is smaller than the area of ​​the opening L2 at the end of the filling hole 122 away from the chip 110, thereby making it easier to fill the thermal conductive material 140 between the circuit board 120 and the chip 110 through the filling hole 122. In addition, the opening area of ​​the end of the filling hole 122 close to the chip 110 is smaller, and with the help of the surface tension of the thermal conductive material 140, the possibility of the thermal conductive material 140 flowing out through the filling hole 122 can be effectively reduced.

[0072] Among them, the area of ​​the opening L1 at one end of the filling hole 122 close to the chip 110 and the area of ​​the opening L2 at the end of the filling hole 122 away from the chip 110 can change gradually. The filling hole 122 can be a truncated cone or a truncated pyramid, etc., so as to facilitate the insertion of tools such as needles or probes.

[0073] The longest distance between two opening points of the filling hole 122 at one end close to the chip 110 is less than or equal to 1 mm.

[0074] like Figure 6 , Figure 7 and Fig. 9 As shown, as a possible implementation, the hole wall of the filling hole 122 is provided with a metal heat conductive layer 124 .

[0075] Specifically, the hole wall of the filling hole 122 has a metal heat-conducting layer 124 , thereby improving the ability of the heat-conducting material 140 to conduct heat outwards and improving the heat dissipation effect on the chip 110 and the solder 130 .

[0076] Among them, the hole wall of the filling hole 122 can be plated with a metal thermal conductive layer 124, and the metal thermal conductive layer 124 can be a metal thermal conductive layer, such as: an aluminum thermal conductive layer, a copper thermal conductive layer, a silver thermal conductive layer, a gold thermal conductive layer. Of course, in other embodiments of the present application, a graphite thermal conductive layer, etc. can be set on the hole wall of the filling hole 122.

[0077] like Fig. 9 As shown, the area of ​​the opening L3 at one end of the metal heat conducting layer 124 close to the chip 110 is smaller than the area of ​​the opening L4 at one end of the metal heat conducting layer 124 far from the chip 110 .

[0078] like Figure 7 and Fig.10 As shown, as a possible implementation, a blocking member 126 is provided on the circuit board 120 , and the blocking member 126 is used to block the filling hole 122 .

[0079] Specifically, a blocking member 126 is disposed on the circuit board 120 , and the blocking member 126 is used to block the filling hole 122 , thereby preventing the heat conductive material 140 from flowing out through the filling hole 122 .

[0080] The plugging member 126 may be glue, a plug or an anti-oxidation resin (green oil of the circuit board 120), etc. The plug may be a soft plug, which is elastic, thereby improving the connection strength between the plug and the circuit board 120. Of course, the plug may also be bonded to the circuit board 120. The plug may be a metal plug, a plastic plug, a rubber plug or a silicone plug, etc.

[0081] That is, after filling the thermally conductive material 140 , glue can be dispensed on the filling hole 122 , and the glue can be solidified to form a sealing member 126 , or after filling the thermally conductive material 140 , a plug can be inserted into the filling hole 122 , or after filling the thermally conductive material 140 , an anti-oxidation resin can be brushed on the circuit board 120 to seal the filling hole 122 .

[0082] like Fig.11 and Fig.12 As shown, as a possible implementation, the circuit board 120 has an annular protrusion 128 on one side close to the chip 110 , the capacitor 118 and the inner side of the annular protrusion 128 face each other, and the annular protrusion 128 is used to separate the thermal conductive material 140 and the adhesive material 150 .

[0083] Specifically, the circuit board 120 has an annular protrusion 128 on one side close to the chip 110 , and the capacitor 118 and the inner side of the annular protrusion 128 are opposite to each other. The annular protrusion 128 is used to separate the thermal conductive material 140 and the adhesive material 150 , that is, the thermal conductive material 140 is located on the inner side of the annular protrusion 128 , and the adhesive material 150 is located on the outer side of the annular protrusion 128 .

[0084] Among them, an annular protrusion 128 is set on the side of the circuit board 120 close to the chip 110, so that the annular protrusion 128 is used to separate the thermal conductive material 140 and the adhesive material 150, so that the adhesive material 150 stays in the second area 116, and the thermal conductive material 140 stays in the first area 114 and the capacitor 118, thereby ensuring the bonding force of the adhesive material 150 on the second area 116 and the circuit board 120, and ensuring the thermal conductive effect of the thermal conductive material 140 on the first area 114 and the circuit board 120.

[0085] The annular protrusion 128 may be a copper sheet for routing, or may be a protrusion structure soldered on the circuit board 120 via a solder pad.

[0086] Optionally, the annular protrusion 128 is located outside the first area 114, and a copper track is formed by using the wiring copper foil. After tinning, the thermal conductive material 140 and the adhesive material 150 can be isolated to reduce the possibility of mutual influence between the two.

[0087] Specifically, the production process of the circuit board assembly 100 provided in the present application can be: after the chip 110 is surface-mounted on the circuit board 120, a needle, a nozzle or a probe is used to pass through the filling hole 122 on the circuit board 120, and the thermal conductive material 140 is filled between the chip 110 and the circuit board 120. The viscosity of the thermal conductive material 140 is moderate and has a certain fluidity. Under the pressure of the needle, the nozzle or the probe, the thermal conductive material 140 can be filled between the first area 114 and the solder 130 facing the capacitor 118, and the filling amount of the thermal conductive material 140 is controlled so that the thermal conductive material 140 at least fills most of the first area 114.

[0088] After the thermal conductive material 140 is filled, since the viscosity of the thermal conductive material 140 is moderate, it has a strong adhesion to the hole wall of the filling hole 122, and the size of the hole wall of the filling hole 122 is small, it is easy to block the opening of the filling hole 122 and is not easy to flow out. At this time, the position corresponding to the second area 116 of the chip 110 is then filled with the adhesive material 150, and the conventional "L" edge dispensing method is adopted. Since the viscosity of the uncured adhesive material 150 is much smaller than that of the thermal conductive material 140, the capillary effect can be used to easily flow from the "L" side of the chip 110 into the solder 130 to fill the gap between the solders 130. At this time, the thermal conductive material 140 has been filled to effectively prevent the adhesive material 150 from flowing into the position corresponding to the first area 114 of the chip 110.

[0089] Finally, the filling hole 122 is sealed, that is, the sealing member 126 is set at the filling hole 122 to fill it. The filling hole 122 can be filled with glue, and the glue can be sealed after being left to solidify. Alternatively, a plug can be used to seal the filling hole 122 after pressing the plug to prevent the thermal conductive material 140 from flowing out due to external force.

[0090] like Fig.13 As shown in FIG. 1 , as a possible implementation, the second region 116 surrounds the first region 114. Fig.11 As shown, the adhesive material 150 surrounds the thermally conductive material 140 .

[0091] Specifically, the second region 116 surrounds the first region 114, and the adhesive material 150 surrounds the thermal conductive material 140. The solder 130 near the edge of the chip 110 is more susceptible to mechanical stress, while the solder 130 near the middle of the chip 110 is more susceptible to thermal stress. Therefore, the second region 116 surrounds the first region 114, and the adhesive material 150 surrounds the thermal conductive material 140, which can ensure that all solders 130 have better reliability and reduce the possibility of solder 130 breaking.

[0092] like Figure 4 and Figure 5 As shown, as a possible implementation, the solder 130 is a solder ball, the number of the solder balls is multiple, and the thermal conductive material 140 and the adhesive material 150 are filled between adjacent solder balls 130 .

[0093] Specifically, the solder 130 is a solder ball, and there are multiple solder balls. The thermal conductive material 140 and the adhesive material 150 are filled between adjacent solder balls, thereby reducing the impact of the thermal conductive material 140 and the adhesive material 150 on the solder 130 and ensuring the reliability of the solder 130.

[0094] As a possible implementation, the thermal conductive material 140 is thermal conductive silicone grease; and the adhesive material 150 is adhesive.

[0095] Specifically, the thermal conductive material 140 is thermal conductive silicone grease, which has good thermal conductivity and has little effect on the solder 130 . The adhesive material 150 is adhesive, thereby improving the reliability between the chip 110 and the circuit board 120 .

[0096] The bonding material 150 may be a filling glue, a die-bonding glue or an epoxy glue.

[0097] In a second aspect, an embodiment of the present application provides a method for manufacturing a circuit board assembly. Fig.14 FIG. 1 is a flow chart showing a method for manufacturing a circuit board assembly according to an embodiment of the present application. Fig.14 As shown, the method includes:

[0098] Step 1402: Mount a chip on a circuit board, wherein the circuit board has a filling hole.

[0099] Specifically, the chip is surface mounted on a circuit board, and the circuit board is provided with a filling hole.

[0100] Step 1404: Inject thermal conductive material between the circuit board and the chip through the filler hole.

[0101] Specifically, a tool such as a needle or a probe is used to pass through the filling hole and fill the space between the circuit board and the chip with a thermal conductive material, thereby blocking the adhesive material and reducing the possibility of the adhesive material flowing into the first area of ​​the chip and the capacitor position.

[0102] Step 1406: Inject adhesive material between the circuit board and the chip through the edge of the chip.

[0103] Specifically, the conventional "L" side dispensing method can be used. Since the viscosity of the uncured adhesive material is much lower than that of the thermal conductive material, the capillary effect can easily flow from the "L" side of the chip into the solders to fill the gaps between the solders. At this time, the thermal conductive material has been filled to effectively prevent the adhesive material from flowing into the position corresponding to the first area of ​​the chip. Of course, other dispensing methods can also be used.

[0104] In the embodiment of the present application, by filling the thermal conductive material through the filling holes on the circuit board, the difficulty of filling the thermal conductive material can be reduced and the production efficiency can be improved.

[0105] Furthermore, the thermal conductive material is filled between the chip and the circuit board, and covers at least part of the first area and the capacitor, and the adhesive material is filled between the chip and the circuit board, and covers at least part of the second area, so that the adhesive material can make the connection between the chip and the circuit board more reliable, reduce the possibility of deformation of the chip due to mechanical stress, and the thermal conductive material can transfer the heat in the capacitor and the first area to the circuit board, realize rapid heat dissipation of the chip, reduce the degree of thermal expansion of the thermal conductive material and the solder near the thermal conductive material, thereby reducing the possibility of solder cracking due to thermal stress. In addition, the thermal conductive material has a certain viscosity and can flow, and its influence on the expansion of the solder is relatively low.

[0106] As mentioned above, through the targeted filling of thermal conductive materials and adhesive materials, the mechanical stress and thermal stress risks of the chip can be suppressed, the reliability of communication between the chip and the circuit board can be effectively increased, and the service life of the circuit board assembly can be improved.

[0107] As a possible implementation manner, after injecting the heat-conducting material between the circuit board and the chip through the filling hole, the method further includes: sealing the filling hole with a sealing member.

[0108] Specifically, after injecting the heat-conducting material between the circuit board and the chip through the filling hole, the method further includes: sealing the filling hole with a sealing member to prevent the heat-conducting material from flowing out through the filling hole.

[0109] As a possible implementation, before mounting the chip on the circuit board, the method further includes: determining the position of the capacitor of the chip; and providing a filling hole at a position on the circuit corresponding to the capacitor.

[0110] Specifically, before mounting the chip on the circuit board, it also includes: determining the position of the chip's capacitor, and setting filling holes on the circuit board according to the position of the capacitor, so that the thermal conductive material filled in each filling hole can cover a capacitor, thereby improving the thermal conductivity of the capacitor.

[0111] In a third aspect, an embodiment of the present application provides an electronic device, comprising: a circuit board assembly 100 as provided in the embodiment of the first aspect; or a circuit board assembly 100 manufactured by the manufacturing method of the circuit board assembly provided in the embodiment of the second aspect.

[0112] In the embodiments of the present application, since the electronic device includes the circuit board assembly 100 as provided in the first aspect embodiment; or the circuit board assembly 100 manufactured by the manufacturing method of the circuit board assembly provided in the second aspect embodiment, the electronic device has the circuit board assembly 100 as provided in the first aspect embodiment; or the circuit board assembly 100 manufactured by the manufacturing method of the circuit board assembly provided in the second aspect embodiment, all the beneficial effects of the circuit board assembly 100 are no longer stated one by one here.

[0113] The present application performs structural design on the chip 110 or the circuit board 120, and actively prevents the adhesive material 150 from flowing into the first area 114 of the chip 110 during the circuit board assembly 100, thereby reducing the thermal stress on the solder 130 in the first area 114, and at the same time, accelerates the heat dissipation of the chip 110, reduces the temperature of the solder 130, thereby increasing the thermal fatigue life of the solder 130 and reducing the failure rate and maintenance cost of the electronic equipment.

[0114] The electronic device may be a terminal or other device other than the electronic device. For example, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, a music player, a private network communication terminal device (such as a walkie-talkie), a mobile Internet device (Mobile Internet Device, MID), an augmented reality / virtual reality / mixed reality device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc., and the embodiments of the present application do not specifically limit this.

[0115] In the description of this specification, the description with reference to the terms "one embodiment" or "specific embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0116] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: A chip, wherein the welding surface of the chip has a first area and a second area, the first area has a capacitor, and the first area is a heating area of ​​the chip; A circuit board, the chip is soldered to the circuit board by solder, the soldering surface faces the circuit board, the circuit board has a filling hole, the filling hole conducts a side of the circuit board close to the chip and a side of the circuit board away from the chip, and the filling hole is opposite to the first area; A heat-conducting material is located between the chip and the circuit board, the heat-conducting material at least covers a portion of the first area and the capacitor, and the heat-conducting material is filled between the solders; The adhesive material is located between the chip and the circuit board, and the adhesive material at least covers a portion of the second area.

2. The circuit board assembly according to claim 1, characterized in that: The number of the capacitor is at least one, the number of the filling hole is at least one, and the filling hole is opposite to the capacitor.

3. The circuit board assembly according to claim 1, characterized in that: The opening area of ​​the filling hole at one end close to the chip is smaller than the opening area of ​​the filling hole at one end away from the chip.

4. The circuit board assembly according to claim 1, characterized in that: The hole walls of the filler holes are provided with a metal heat-conducting layer.

5. The circuit board assembly according to claim 1, characterized in that: A blocking piece is arranged on the circuit board, and the blocking piece is used to block the filling hole.

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The circuit board has an annular protrusion on one side close to the chip, the capacitor is opposite to the inner side of the annular protrusion, and the annular protrusion is used to separate the heat conductive material and the bonding material.

7. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The second area surrounds the first area, and the adhesive material surrounds the thermal conductive material.

8. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The solder is a solder ball, the number of the solder balls is multiple, and the thermal conductive material and the bonding material are filled between adjacent solder balls.

9. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The heat-conducting material is heat-conducting silicone grease; The bonding material is viscose.

10. A method for manufacturing a circuit board assembly, characterized in that: For manufacturing a circuit board assembly as claimed in any one of claims 1 to 9, comprising: Mounting a chip on a circuit board, wherein the circuit board has a filling hole; injecting heat-conducting material between the circuit board and the chip through the filling hole; An adhesive material is injected between the circuit board and the chip through the edge of the chip.

11. The method for manufacturing a circuit board assembly according to claim 10, characterized in that: After injecting the heat-conducting material between the circuit board and the chip through the filling hole, the method further comprises: The filling hole is blocked by a blocking piece.

12. The method for manufacturing a circuit board assembly according to claim 10 or 11, characterized in that: Before mounting the chip on the circuit board, it also includes: Determining the location of the capacitor of the chip; The filling holes are arranged at positions corresponding to the circuit board and the capacitor.

13. An electronic device, characterized in that: include: A circuit board assembly as claimed in any one of claims 1 to 9; or a circuit board assembly manufactured by the method for manufacturing a circuit board assembly as claimed in any one of claims 10 to 12.

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